CN112662127A - Magnetic dielectric resin composition, laminated board containing same and printed circuit board containing laminated board - Google Patents
Magnetic dielectric resin composition, laminated board containing same and printed circuit board containing laminated board Download PDFInfo
- Publication number
- CN112662127A CN112662127A CN202011431389.7A CN202011431389A CN112662127A CN 112662127 A CN112662127 A CN 112662127A CN 202011431389 A CN202011431389 A CN 202011431389A CN 112662127 A CN112662127 A CN 112662127A
- Authority
- CN
- China
- Prior art keywords
- magnetic filler
- resin composition
- resin
- magneto
- spinel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000011342 resin composition Substances 0.000 title claims abstract description 45
- 239000012762 magnetic filler Substances 0.000 claims abstract description 84
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 31
- 229910052596 spinel Inorganic materials 0.000 claims abstract description 19
- 239000011029 spinel Substances 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- -1 polytetrafluoroethylene Polymers 0.000 claims description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 claims description 7
- 229920000459 Nitrile rubber Polymers 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910052749 magnesium Inorganic materials 0.000 claims description 6
- 239000011777 magnesium Substances 0.000 claims description 6
- 239000013034 phenoxy resin Substances 0.000 claims description 6
- 229920006287 phenoxy resin Polymers 0.000 claims description 6
- 239000012779 reinforcing material Substances 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 238000000498 ball milling Methods 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 4
- 229910015900 BF3 Inorganic materials 0.000 claims description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910002113 barium titanate Inorganic materials 0.000 claims description 4
- 229910052791 calcium Inorganic materials 0.000 claims description 4
- 239000011575 calcium Substances 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000003431 cross linking reagent Substances 0.000 claims description 4
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000003999 initiator Substances 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 239000011572 manganese Substances 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- 229910001289 Manganese-zinc ferrite Inorganic materials 0.000 claims description 3
- 229910001053 Nickel-zinc ferrite Inorganic materials 0.000 claims description 3
- 229910001308 Zinc ferrite Inorganic materials 0.000 claims description 3
- PGTXKIZLOWULDJ-UHFFFAOYSA-N [Mg].[Zn] Chemical compound [Mg].[Zn] PGTXKIZLOWULDJ-UHFFFAOYSA-N 0.000 claims description 3
- JIYIUPFAJUGHNL-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] JIYIUPFAJUGHNL-UHFFFAOYSA-N 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229920001955 polyphenylene ether Polymers 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- CMSBLKQHGOOWBO-UHFFFAOYSA-N 1,1,3-trimethyl-5-(2-methylpentan-2-ylperoxy)cyclohexane Chemical compound CCCC(C)(C)OOC1CC(C)CC(C)(C)C1 CMSBLKQHGOOWBO-UHFFFAOYSA-N 0.000 claims description 2
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 2
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 claims description 2
- RCDLELXZNBHNBN-UHFFFAOYSA-N 2,3,4-tripentylphenol Chemical compound CCCCCC1=CC=C(O)C(CCCCC)=C1CCCCC RCDLELXZNBHNBN-UHFFFAOYSA-N 0.000 claims description 2
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims description 2
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 claims description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 2
- LEHNQGSPRXHYRT-UHFFFAOYSA-N 2-dodecyl-1h-imidazole Chemical compound CCCCCCCCCCCCC1=NC=CN1 LEHNQGSPRXHYRT-UHFFFAOYSA-N 0.000 claims description 2
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 claims description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 2
- FUOZJYASZOSONT-UHFFFAOYSA-N 2-propan-2-yl-1h-imidazole Chemical compound CC(C)C1=NC=CN1 FUOZJYASZOSONT-UHFFFAOYSA-N 0.000 claims description 2
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 claims description 2
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims description 2
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 claims description 2
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 claims description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- PBFMRGSHDMCVHH-UHFFFAOYSA-N C(C)(C)(C)OOC1=CC(=CC=C1)C(C)(C)C1=CC=CC=C1 Chemical compound C(C)(C)(C)OOC1=CC(=CC=C1)C(C)(C)C1=CC=CC=C1 PBFMRGSHDMCVHH-UHFFFAOYSA-N 0.000 claims description 2
- 239000004641 Diallyl-phthalate Substances 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- 239000005062 Polybutadiene Substances 0.000 claims description 2
- 239000002174 Styrene-butadiene Substances 0.000 claims description 2
- OUPYOLABCAXGHH-UHFFFAOYSA-N [Ba].[Rb] Chemical compound [Ba].[Rb] OUPYOLABCAXGHH-UHFFFAOYSA-N 0.000 claims description 2
- WOIHABYNKOEWFG-UHFFFAOYSA-N [Sr].[Ba] Chemical compound [Sr].[Ba] WOIHABYNKOEWFG-UHFFFAOYSA-N 0.000 claims description 2
- VNSWULZVUKFJHK-UHFFFAOYSA-N [Sr].[Bi] Chemical compound [Sr].[Bi] VNSWULZVUKFJHK-UHFFFAOYSA-N 0.000 claims description 2
- WVEIBSXNFJMONP-UHFFFAOYSA-N [Ta].[K] Chemical compound [Ta].[K] WVEIBSXNFJMONP-UHFFFAOYSA-N 0.000 claims description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 2
- FWGZLZNGAVBRPW-UHFFFAOYSA-N alumane;strontium Chemical compound [AlH3].[Sr] FWGZLZNGAVBRPW-UHFFFAOYSA-N 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 229910052788 barium Inorganic materials 0.000 claims description 2
- IQONKZQQCCPWMS-UHFFFAOYSA-N barium lanthanum Chemical compound [Ba].[La] IQONKZQQCCPWMS-UHFFFAOYSA-N 0.000 claims description 2
- DUPIXUINLCPYLU-UHFFFAOYSA-N barium lead Chemical compound [Ba].[Pb] DUPIXUINLCPYLU-UHFFFAOYSA-N 0.000 claims description 2
- IJBYNGRZBZDSDK-UHFFFAOYSA-N barium magnesium Chemical compound [Mg].[Ba] IJBYNGRZBZDSDK-UHFFFAOYSA-N 0.000 claims description 2
- 229910052454 barium strontium titanate Inorganic materials 0.000 claims description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 2
- XBYNNYGGLWJASC-UHFFFAOYSA-N barium titanium Chemical compound [Ti].[Ba] XBYNNYGGLWJASC-UHFFFAOYSA-N 0.000 claims description 2
- 229910021523 barium zirconate Inorganic materials 0.000 claims description 2
- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical compound [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 claims description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims description 2
- 229910002115 bismuth titanate Inorganic materials 0.000 claims description 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 2
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 claims description 2
- JXDXDSKXFRTAPA-UHFFFAOYSA-N calcium;barium(2+);oxygen(2-);titanium(4+) Chemical compound [O-2].[Ca+2].[Ti+4].[Ba+2] JXDXDSKXFRTAPA-UHFFFAOYSA-N 0.000 claims description 2
- 239000004643 cyanate ester Substances 0.000 claims description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 150000002460 imidazoles Chemical class 0.000 claims description 2
- 238000005470 impregnation Methods 0.000 claims description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 claims description 2
- PSVBHJWAIYBPRO-UHFFFAOYSA-N lithium;niobium(5+);oxygen(2-) Chemical compound [Li+].[O-2].[O-2].[O-2].[Nb+5] PSVBHJWAIYBPRO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- ZBSCCQXBYNSKPV-UHFFFAOYSA-N oxolead;oxomagnesium;2,4,5-trioxa-1$l^{5},3$l^{5}-diniobabicyclo[1.1.1]pentane 1,3-dioxide Chemical compound [Mg]=O.[Pb]=O.[Pb]=O.[Pb]=O.O1[Nb]2(=O)O[Nb]1(=O)O2 ZBSCCQXBYNSKPV-UHFFFAOYSA-N 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 229920000582 polyisocyanurate Polymers 0.000 claims description 2
- 239000011495 polyisocyanurate Substances 0.000 claims description 2
- 235000013824 polyphenols Nutrition 0.000 claims description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 2
- UKDIAJWKFXFVFG-UHFFFAOYSA-N potassium;oxido(dioxo)niobium Chemical compound [K+].[O-][Nb](=O)=O UKDIAJWKFXFVFG-UHFFFAOYSA-N 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- 229910052712 strontium Inorganic materials 0.000 claims description 2
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 2
- 239000011115 styrene butadiene Substances 0.000 claims description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 2
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 claims description 2
- BRHAUGJKIFZHDU-UHFFFAOYSA-N tert-butyl octanoate Chemical compound CCCCCCCC(=O)OC(C)(C)C BRHAUGJKIFZHDU-UHFFFAOYSA-N 0.000 claims description 2
- ZMANZCXQSJIPKH-UHFFFAOYSA-O triethylammonium ion Chemical compound CC[NH+](CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-O 0.000 claims description 2
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims 1
- 239000003829 resin cement Substances 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 239000004408 titanium dioxide Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 4
- 230000002195 synergetic effect Effects 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 20
- 230000035699 permeability Effects 0.000 description 19
- 239000000945 filler Substances 0.000 description 10
- 238000002360 preparation method Methods 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QMQVIEKDJWQHKY-UHFFFAOYSA-N C1(=CC=CC=C1)O.CN(C)CN Chemical compound C1(=CC=CC=C1)O.CN(C)CN QMQVIEKDJWQHKY-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- 229910003962 NiZn Inorganic materials 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- RWRDLPDLKQPQOW-UHFFFAOYSA-N tetrahydropyrrole Substances C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Abstract
The present invention provides a magneto-dielectric resin composition, a laminate including the same, and a printed circuit board thereof, the magneto-dielectric resin composition including a resin, a spinel-type magnetic filler and a planar hexagonal magnetic filler; the total amount of the spinel type magnetic filler and the planar hexagonal magnetic filler accounts for 20 wt% -90 wt% of the magnetic dielectric resin composition. Through the matching and synergistic effect of the spinel type magnetic filler and the planar hexagonal magnetic filler, the magnetic dielectric resin composition has high cut-off frequency, low dielectric loss tangent and low magnetic loss tangent, and meets the performance requirements of the magnetic dielectric substrate.
Description
Technical Field
The invention belongs to the technical field of laminated boards, and relates to a magnetic dielectric resin composition, a laminated board containing the magnetic dielectric resin composition and a printed circuit board containing the magnetic dielectric resin composition.
Background
With the development of micro-processing technology such as microelectronics and micromachine, in the trend against high-density mounting technology, driving capacitors, integrated circuits, circuit modules, antenna rf modules, and the like are continuously developed toward miniaturization. As a key component in radar and modern wireless communication systems, antenna size reduction has attracted considerable attention as a bottleneck to miniaturization. One way to reduce the size of the antenna is to use high dielectric materials, and high dielectric constant plates are disclosed in CN103101252A and CN103351578A, which can reduce the size of the antenna, but this method will reduce the gain of the antenna and the overall performance of the antenna.
Another way to reduce the size of the antenna is to use a magneto-dielectric material as the substrate, as shown in equation 1, (ε)rμr)1/2The higher the dielectric constant and the higher the permeability, the higher the miniaturization factor, and the more advantageous the miniaturization. In thatThe situation that the dielectric constant cannot be changed and the magnetic permeability is improved can effectively reduce the size of the antenna, and simultaneously maintain or improve the gain and the bandwidth of the antenna.
λ＝c/f(εrμr)1/2 (1)
Spinel ferrites have high magnetic permeability values, for example, NiZn and MnZn ferrites, but these spinel ferrites have low cutoff frequencies, and are difficult to use at 300MHz or higher. The planar hexaferrite has a high cutoff frequency, such as Co2Z hexaferrite, but has a low permeability, making it difficult to reduce the size of the antenna to a large extent.
The magnetic dielectric plate can be used as an embedded inductor, and can also reduce the size of electronic products and optimize the performance of the electronic products, so that the magnetic dielectric plate is generally used for reducing the size of the antenna at present. US20190264005A discloses a polytetrafluoro + Co2The technical scheme of Z has low magnetic conductivity and high cost. CN109553955A discloses a magneto-dielectric resin composition, but the influence of frequency on the magnetic properties of the material was not studied. CN1246500 discloses a magnetic dielectric resin composition, but the magnetic loss of the prepared plate is high at 300 MHZ.
Therefore, in the art, it is desired to develop a magneto-dielectric material having low cost, high cut-off frequency and low magnetic loss.
Disclosure of Invention
In view of the disadvantages of the prior art, an object of the present invention is to provide a magneto-dielectric resin composition, a laminate including the same, and a printed circuit board thereof. The invention solves the problems of high cost, low cut-off frequency, high dielectric loss tangent and high magnetic loss tangent of the existing magnetic dielectric resin material.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, the present invention provides a magneto-dielectric resin composition comprising a resin, a spinel-type magnetic filler and a planar hexagonal magnetic filler; the total amount of the spinel type magnetic filler and the planar hexagonal magnetic filler accounts for 20 wt% -90 wt% of the magnetic dielectric resin composition.
In the invention, the spinel type magnetic filler and the planar hexagonal magnetic filler are matched and have synergistic effect, so that the magnetic dielectric resin composition has high cut-off frequency, low dielectric loss tangent and low magnetic loss tangent.
In the present invention, the total amount of the spinel-type magnetic filler and the planar hexagonal magnetic filler is 20 wt% to 90 wt%, for example, 20 wt%, 25 wt%, 30 wt%, 35 wt%, 40 wt%, 45 wt%, 50 wt%, 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt%, 80 wt%, 85 wt%, or 90 wt%, etc., based on the weight of the magneto-dielectric resin composition.
Preferably, the spinel-type magnetic filler includes Fe, Zn and M1 elements, and M1 is at least one selected from Ni, Mg, Mn.
Preferably, the spinel-type magnetic filler further includes an M2 element, and the M2 element is at least one selected from V, Cu, Mo, Cr, Sn, W, Bi, Hf, Nb, Ca, Zr, Al, Ti, Ba, Ta, or La.
Preferably, the spinel magnetic filler is obtained by sintering and ball-milling iron oxide, zinc oxide, an oxide of M1 and optionally an oxide of M2.
In the invention, the oxide of M1 is selected from at least one of nickel oxide, manganese oxide and magnesium oxide, and the oxide of M2 is selected from at least one of VO, copper oxide, MoO, CrO, SnO, WO, BiO, HfO, NbO, CaO, ZrO, AlO, TiO, BaO, TaO and LaO.
Preferably, the planar hexagonal magnetic filler comprises Ba, Sr, M3, M4 and Fe elements, M3 is selected from at least one of Co, Ni, Cu, Mg, Mn and Zn, and M4 is selected from at least one of V, Mo, Cr, Sn, W, Bi, Hf, Nb, Ca, Zr, Al, Ti, Ba, Ta or La.
Preferably, the particle sizes of the spinel-type magnetic filler and the planar hexagonal magnetic filler are independently 0.1 μm to 30 μm, such as 0.1 μm, 2 μm, 5 μm, 8 μm, 10 μm, 13 μm, 16 μm, 19 μm, 22 μm, 25 μm, 28 μm, 30 μm.
Preferably, the spinel-type magnetic filler is any one of nickel zinc ferrite, manganese zinc ferrite, magnesium zinc ferrite, or a mixture of at least two thereof.
In the present invention, the total amount of the spinel-type magnetic filler and the planar hexagonal magnetic filler is 20 to 90 wt%, for example, 20 wt%, 30 wt%, 40 wt%, 50 wt%, 60 wt%, 70 wt%, 80 wt%, or 90 wt%, based on the weight of the magneto-dielectric resin composition.
Preferably, the spinel-type magnetic filler accounts for 20 to 80 wt%, such as 20, 30, 40, 50, 60, 70 or 80 wt%, of the total weight of the spinel-type magnetic filler and the planar hexagonal magnetic filler.
Preferably, the resin is selected from any one of epoxy resin, cyanate ester resin, polyphenylene oxide resin, polybutadiene resin, styrene-butadiene resin, bismaleimide-triazine resin, bismaleimide resin, polytetrafluoroethylene resin, polyimide resin, phenolic resin, acrylic resin, liquid crystal resin, benzoxazine resin, phenoxy resin, nitrile rubber, carboxyl-terminated nitrile rubber or hydroxyl-terminated nitrile rubber or a mixture of at least two of the above.
Preferably, the weight percentage of the resin in the magneto-dielectric resin composition is 10 wt% to 80 wt%, such as 10 wt%, 15 wt%, 20 wt%, 30 wt%, 40 wt%, 50 wt%, 60 wt%, 70 wt% or 80 wt%.
Preferably, the magneto-dielectric resin composition further includes a non-magnetic filler and an accelerator.
Preferably, the non-magnetic filler is selected from any one or a mixture of at least two of silica, titania, barium titanate, strontium titanate, magnesium titanate, calcium titanate, barium strontium titanate, barium calcium titanate, lead zirconate titanate, lanthanum barium titanate, barium zirconate titanate, hafnium dioxide, lead magnesium niobate, barium magnesium niobate, lithium niobate, potassium niobate, strontium aluminum tantalate, potassium tantalum niobate, strontium barium niobate, barium lead niobate, barium titanium niobate, strontium bismuth tantalate, bismuth titanate, barium rubidium titanate, copper titanate, or lead titanate-lead magnesium niobate.
Preferably, the accelerator is any one or a mixture of at least two of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 1-benzyl-2-methylimidazole, 2-heptadecylimidazole, 2-isopropylimidazole, 2-phenyl-4-methylimidazole, 2-dodecylimidazole or 1-cyanoethyl-2-methylimidazole.
Preferably, the magneto-dielectric resin composition further includes an initiator.
Preferably, the initiator is selected from any one of or a mixture of at least two of a, a' -di (tert-butylperoxy-m-cumyl) benzene, dicumyl peroxide, tert-butylperoxy-cumyl, 1-bis (tert-hexylperoxy) -3,3, 5-trimethylcyclohexane, 2, 5-dimethyl-2, 5-di (tert-butylperoxy) hex-3-yne, tert-butyl octanoate, tert-butyl peroxybenzoate, triethylammonium and salts thereof, quaternary ammonium salt compounds, 2,4, 6-tris (dimethylaminomethylamine) phenol, benzyldimethylamine, imidazoles, tripentylphenol acid amines, monophenol polyphenol compounds, boron trifluoride, complexes of boron trifluoride organics, and triphenyl phosphate.
Preferably, the magneto-dielectric resin composition further comprises a cross-linking agent;
preferably, the crosslinking agent is selected from any one of triallyl isocyanurate, triallyl polyisocyanurate, triallyl cyanurate, trimethacrylic acid, diallyl phthalate, divinylbenzene or multifunctional acrylates or a mixture of at least two thereof.
In another aspect, the invention provides a resin glue solution, wherein the resin glue solution contains the magnetic-dielectric resin composition and a solvent.
Preferably, the solvent is any one or a combination of at least two of ethers, ketones, aromatic hydrocarbons, esters or nitrogen-containing solvents.
Preferably, the solvent is selected from ethers such as methanol, ethanol, butanol, ethyl cellosolve, butyl cellosolve, ethylene glycol methyl ether, diethylene glycol ethyl ether, diethylene glycol butyl ether, and the like, or any one or a combination of at least two of acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, toluene, xylene, mesitylene, ethoxyethyl acetate, ethyl acetate, N-dimethylformamide, N-dimethylacetamide, or N-methyl-2-pyrrolidine.
In another aspect, the present invention provides a prepreg comprising a reinforcing material and the above-described magneto-dielectric resin composition attached thereto by impregnation and drying.
Preferably, the reinforcing material comprises glass fibre cloth.
In another aspect, the present invention provides a metal-clad laminate comprising at least one prepreg as described above and a metal foil clad on one or both sides of the stacked prepreg.
In another aspect, the present invention provides a printed circuit board comprising at least one prepreg as described above or at least one metal-foil-clad laminate as described above.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the spinel type magnetic filler and the planar hexagonal magnetic filler are matched and have a synergistic effect, so that the magnetic dielectric resin composition has high cut-off frequency, low dielectric loss tangent and low magnetic loss tangent, and the performance requirements of the magnetic dielectric substrate are met.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
The materials used in the following examples and comparative examples are specifically as follows:
polyphenylene ether resin: sabioc SA 9000;
brominated epoxy resin: taiwan Changchun BEB531A 80P;
phenoxy resin: new day iron YP-50EK 35;
o-cresol novolac resin: KOLON KCE-F2118;
2-MI: basf (germany) 2 MI;
the components of the magnetic filler used in the following examples and comparative examples of the present invention and the properties thereof are shown in tables 1 and 2; in table 1, the content of each component is a molar percentage.
The preparation method of the magnetic filler comprises the following steps:
weighing the raw material components according to the molar ratio according to the formula shown in Table 1, mixing for 1h by a physical dry method to prepare an annular blank, and sintering for 4h at 1300 ℃; the sintered product obtained was an annular sample (inner diameter 3.04mm, outer diameter 6.96mm, thickness 3 mm); carrying out wet ball milling on the sintered product in a ball mill, and crushing at the rotating speed of 3000 r/min for 1-5 h, wherein the particle size of zirconium beads is 1-10 mm; drying after ball milling to obtain a magnetic filler; the preparation of different particle sizes is realized by controlling the ball milling time.
In table 1, the methods for measuring the permeability and the temperature drift coefficient are as follows:
(1) sample preparation: mixing the raw material components by a physical dry method to prepare an annular blank, sintering the annular blank at 1300 ℃ for 4 hours to obtain an annular sample (the inner diameter is 3.04mm, the outer diameter is 6.96mm and the thickness is 3mm), and testing the magnetic permeability and the temperature drift coefficient of the sintered product;
(2) and (3) testing magnetic permeability and cut-off frequency: an impedance analyzer is adopted to test the magnetic permeability of the material at 0.1-1 GHz, and the test instrument is a German technology E5071C network analyzer + N1500 test system;
core-shell magnetic fillers of different cut-off frequencies are shown in table 1 (where the magnetic permeability is the relative magnetic permeability).
TABLE 1 spinel magnetic Filler
TABLE 2 planar hexagonal magnetic Filler
Example 1
Dissolving 25g of brominated epoxy resin B, 15g of phenoxy resin C and 40g of polyphenylene ether resin SA9000 in a solvent ethylene glycol monomethyl ether; then adding a magnetic filler, wherein the type of the hexagonal magnetic filler is C-40, the magnetic conductivity of the magnetic filler is 40, the particle size is 0.1 mu m, and the addition amount is 4g, the type of the spinel type magnetic filler is C-300, the magnetic conductivity of the magnetic filler is 300, the particle size is 0.1 mu m, and the addition amount is 16 g; mixing at room temperature to obtain a glue solution.
And (3) impregnating the glue solution with a reinforcing material, baking in an oven at 155 ℃ for 5 minutes, and curing to obtain a reinforcing material prepreg. The prepared prepreg is placed between copper foils, laminated and cured in a press at 210 ℃ to obtain a copper-clad plate, and then the properties such as dielectric constant, magnetic permeability, resistivity and the like are measured, wherein specific property test results are shown in table 2.
Example 2
This example differs from example 1 in that: the preparation raw materials comprise: 4g of epoxy resin A, 5g of brominated epoxy resin B and 1g of phenoxy resin C, wherein the type of the hexagonal magnetic filler is C-30, the magnetic permeability of the magnetic filler is 30, the particle size is 10 mu m, and the addition amount is 81g, the type of the spinel type magnetic filler is C-150, the magnetic permeability of the magnetic filler is 150, the particle size is 10 mu m, and the addition amount is 9 g.
The magnetic dielectric resin composition prepared in the embodiment is used for preparing a copper-clad plate, and the performance of the prepared copper-clad plate is shown in table 2.
Example 3
This example differs from example 1 in that: the preparation raw materials comprise: 20g of epoxy resin A, 25g of brominated epoxy resin B and 5g of phenoxy resin C, wherein the type of the hexagonal magnetic filler is C-20, the magnetic permeability of the magnetic filler is 20, the particle size is 30 mu m, and the addition amount is 25g, the type of the spinel type magnetic filler is C-75, the magnetic permeability of the magnetic filler is 75, the particle size is 30 mu m, and the addition amount is 25 g.
The magnetic dielectric resin composition prepared in the embodiment is used for preparing a copper-clad plate, and the performance of the prepared copper-clad plate is shown in table 2.
Example 4
This example differs from example 1 in that: the preparation raw materials comprise: also included is 10g of silica powder.
The magnetic dielectric resin composition prepared in the embodiment is used for preparing a copper-clad plate, and the performance of the prepared copper-clad plate is shown in table 2.
Comparative example 1
Provided is a copper clad laminate, which is different from example 3 in that 2g of a hexagonal magnetic filler and 8g of a spinel magnetic filler are added, the total amount being 10 wt% based on the resin composition.
Comparative example 2
Provided is a copper clad laminate, which is different from example 2 in that 85.5g of a hexagonal magnetic filler and 9.5g of a spinel magnetic filler are added, the total amount being 95 wt% based on the weight of the resin composition. The filler has poor dispersibility and high viscosity, and the qualified copper-clad plate cannot be prepared.
Comparative example 3
A copper clad laminate was provided, which was different from example 1 in that the hexagonal magnetic filler was added in an amount of 2g in an amount of 10 wt% based on the total filler.
Comparative example 4
Provided is a copper clad laminate, which is different from example 2 in that 85.5g of a hexagonal magnetic filler was added in an amount of 95 wt% based on the total filler.
Comparative example 5
Provided is a copper clad laminate, which is different from example 1 in that the particle diameter of the magnetic filler is 0.05. mu.m. The filler has poor dispersibility and high viscosity, and the qualified copper-clad plate cannot be prepared.
Comparative example 6
This comparative example is different from example 1 only in that the magnetic filler includes only the spinel-type magnetic filler, not the planar hexagonal magnetic filler, and the spinel-type magnetic filler is added in an amount of 20 g.
Comparative example 7
This comparative example is different from example 1 only in that the magnetic filler includes only the planar hexagonal magnetic filler, not the spinel-type magnetic filler, and the planar hexagonal magnetic filler is added in an amount of 20 g.
Comparative example 8
A copper clad laminate, which is different from example 2 in that the hexagonal filler was replaced with C-150, was provided.
TABLE 2
The magnetic permeability and the magnetic loss tangent of the plates in the above examples and comparative examples were measured by an air coaxial transmission line method;
a maximum frequency (MHz) for a magnetic loss tangent of less than 0.05 refers to a frequency before the cutoff frequency of the sheet material.
It can be seen from the above examples and comparative examples that the copper-clad plates prepared in examples 1 to 4 have good comprehensive properties such as magnetic permeability, dielectric loss, bending strength, and the like.
The total amount of the hexagonal magnetic filler and the spinel magnetic filler in the comparative example 1 accounts for less than 20 wt% of the resin composition, and compared with the example 1, the magnetic conductivity of the prepared copper-clad plate is only 1.6, and the dielectric loss is large and reaches 0.0052;
in the comparative example 3, the hexagonal magnetic filler accounts for less than 20 wt% of the total filler, compared with the example 1, the prepared copper-clad plate has the magnetic loss tangent of less than 0.05, the corresponding maximum frequency (MHz) is low, only 195MHz is needed, and the dielectric loss of the plate is large and reaches 0.0050;
in the comparative example 4, the hexagonal magnetic filler accounts for more than 90 wt% of the total filler, and compared with the example 2, the prepared copper-clad plate has low magnetic conductivity of only 1.5;
in comparative example 6, in which only the spinel filler was used, the maximum frequency (MHz) was low, having a magnetic loss tangent of less than 0.05, and only 130MHz, as compared with example 1;
in comparative example 7, in which only the planar hexagonal filler was used, magnetic permeability was low, only 1.3, corresponding to a magnetic loss tangent of less than 0.05, as compared with example 1;
in comparative example 8, in which the planar hexagonal filler was replaced with C-130, the maximum frequency (MHz) was low, only 50MHz, with a magnetic loss tangent less than 0.05, as compared with example 2;
from the above results, the copper-clad plate prepared from the resin composition has excellent comprehensive properties such as high use frequency, high magnetic permeability, low dielectric loss and the like, and can meet the performance requirements of the magneto-dielectric substrate.
The applicant states that the present invention is illustrated by the above-described examples of the magneto-dielectric resin composition of the present invention, which includes a resin, the laminate including the same, and the printed circuit board thereof, but the present invention is not limited to the above-described examples, i.e., it does not mean that the present invention must be implemented depending on the above-described examples. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. A magneto-dielectric resin composition, characterized in that the magneto-dielectric resin composition comprises a resin, a spinel-type magnetic filler and a planar hexagonal magnetic filler; the total amount of the spinel type magnetic filler and the planar hexagonal magnetic filler accounts for 20 wt% -90 wt% of the magnetic dielectric resin composition.
2. The magneto-dielectric resin composition according to claim 1, wherein the spinel-type magnetic filler comprises Fe, Zn and M1 elements, M1 is at least one selected from Ni, Mg, Mn;
preferably, the spinel-type magnetic filler further comprises an M2 element, the M2 element being selected from at least one of V, Cu, Mo, Cr, Sn, W, Bi, Hf, Nb, Ca, Zr, Al, Ti, Ba, Ta, or La;
preferably, the spinel magnetic filler is obtained by sintering and ball-milling iron oxide, zinc oxide, an oxide of M1 and optionally an oxide of M2.
3. The magneto-dielectric resin composition of claim 1 or 2, wherein the planar hexagonal magnetic filler comprises Ba, Sr, M3, M4, and Fe elements, M3 is selected from at least one of Co, Ni, Cu, Mg, Mn, and Zn, and M4 is selected from at least one of V, Mo, Cr, Sn, W, Bi, Hf, Nb, Ca, Zr, Al, Ti, Ba, Ta, or La.
4. The magneto-dielectric resin composition according to any one of claims 1 to 3, wherein the spinel-type magnetic filler and the planar hexagonal magnetic filler have a particle size of 0.1 μm to 30 μm independently;
preferably, the spinel type magnetic filler is any one of nickel zinc ferrite, manganese zinc ferrite and magnesium zinc ferrite or a mixture of at least two of the nickel zinc ferrite, the manganese zinc ferrite and the magnesium zinc ferrite;
preferably, the spinel-type magnetic filler accounts for 20-80 wt% of the total weight of the spinel-type magnetic filler and the planar hexagonal magnetic filler.
5. The magneto-dielectric resin composition according to any one of claims 1 to 4, wherein the resin is selected from any one of epoxy resin, cyanate ester resin, polyphenylene ether resin, polybutadiene resin, styrene-butadiene resin, bismaleimide-triazine resin, bismaleimide resin, polytetrafluoroethylene resin, polyimide resin, phenol resin, acrylic resin, liquid crystal resin, benzoxazine resin, phenoxy resin, nitrile rubber, carboxyl-terminated nitrile rubber or hydroxyl-terminated nitrile rubber, or a mixture of at least two thereof;
preferably, the weight percentage of the resin in the magnetic-dielectric resin composition is 10-80 wt%.
6. The magneto-dielectric resin composition according to any one of claims 1 to 5, further comprising a non-magnetic filler and an accelerator;
preferably, the non-magnetic filler is selected from any one or a mixture of at least two of silicon dioxide, titanium dioxide, barium titanate, strontium titanate, magnesium titanate, calcium titanate, barium strontium titanate, barium calcium titanate, lead zirconate titanate, lanthanum barium titanate, barium zirconate titanate, hafnium dioxide, lead magnesium niobate, barium magnesium niobate, lithium niobate, potassium niobate, strontium aluminum tantalate, potassium tantalum niobate, strontium barium niobate, barium lead niobate, barium titanium niobate, strontium bismuth tantalate, bismuth titanate, barium rubidium titanate, copper titanate, or lead titanate-lead magnesium niobate;
preferably, the accelerator is any one or a mixture of at least two of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 1-benzyl-2-methylimidazole, 2-heptadecylimidazole, 2-isopropylimidazole, 2-phenyl-4-methylimidazole, 2-dodecylimidazole or 1-cyanoethyl-2-methylimidazole;
preferably, the magneto-dielectric resin composition further comprises an initiator;
preferably, the initiator is selected from any one or a mixture of at least two of a, a' -di (tert-butylperoxy-m-cumyl) benzene, dicumyl peroxide, tert-butylperoxy-cumyl, 1-bis (tert-hexylperoxy) -3,3, 5-trimethylcyclohexane, 2, 5-dimethyl-2, 5-di (tert-butylperoxy) hex-3-yne, tert-butyl octanoate, tert-butyl peroxybenzoate, triethylammonium and salts thereof, quaternary ammonium salt compounds, 2,4, 6-tris (dimethylaminomethyl) phenol, benzyldimethylamine, imidazoles, tripentylphenol acid amines, monophenol polyphenol compounds, boron trifluoride, complexes of boron trifluoride organic compounds, and triphenyl phosphate;
preferably, the magneto-dielectric resin composition further comprises a cross-linking agent;
preferably, the crosslinking agent is selected from any one of triallyl isocyanurate, triallyl polyisocyanurate, triallyl cyanurate, trimethacrylic acid, diallyl phthalate, divinylbenzene or multifunctional acrylates or a mixture of at least two thereof.
7. A resin cement comprising the magneto-dielectric resin composition according to any one of claims 1 to 6 and a solvent.
8. A prepreg comprising a reinforcing material and the magneto-dielectric resin composition according to any one of claims 1 to 6 attached thereto by impregnation drying;
preferably, the reinforcing material comprises glass fibre cloth.
9. A metal-clad laminate comprising at least one prepreg according to claim 8 and a metal foil clad to one or both sides of the laminated prepreg.
10. A printed circuit board comprising at least one prepreg according to claim 8 or at least one metal-foil-clad laminate according to claim 9.
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