CN113043681A - Magnetic material and preparation method and application thereof - Google Patents

Magnetic material and preparation method and application thereof Download PDF

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Publication number
CN113043681A
CN113043681A CN201911373549.4A CN201911373549A CN113043681A CN 113043681 A CN113043681 A CN 113043681A CN 201911373549 A CN201911373549 A CN 201911373549A CN 113043681 A CN113043681 A CN 113043681A
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resin
resin composition
layer
metal foil
magnetic material
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柴颂刚
刘潜发
殷卫峰
张江陵
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Shengyi Technology Co Ltd
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Shengyi Technology Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2007/00—Flat articles, e.g. films or sheets
    • B29L2007/002—Panels; Plates; Sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products
    • B29L2009/003—Layered products comprising a metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products
    • B29L2009/005—Layered products coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/208—Magnetic, paramagnetic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention provides a magnetic material and a preparation method and application thereof, wherein the structure of the magnetic material sequentially comprises a first metal foil layer, a first resin composition layer, a resin film layer, a second resin composition layer and a second metal foil layer, the first resin composition layer and the second resin composition layer contain magnetic fillers, and the composite elastic rate Er of the resin film layer in the thickness direction is less than 6 GPa. The magnetic material of the invention has high magnetic conductivity and high resistivity, and can be used for printed circuit boards.

Description

Magnetic material and preparation method and application thereof
Technical Field
The invention belongs to the technical field of laminated plates, and relates to a magnetic material, and a preparation method and application thereof.
Background
With the development of micro-processing technology such as micro-electronics and micro-mechanics, in the trend of high-density mounting technology as background, capacitors, integrated circuits, circuit modules, antenna radio frequency modules and the like are continuously developing towards miniaturization. Miniaturization, built-in, multi-band and intellectualization are the development trend of small antennas of mobile terminals. The magnetic dielectric plate can be used as an embedded inductor, and can also reduce the size of electronic products and optimize the performance of the electronic products, so that the magnetic dielectric plate is generally used for reducing the size of the antenna at present.
In the art, a magnetic copper clad laminate with high electrical resistivity and high magnetic permeability is desired.
Disclosure of Invention
The invention aims to provide a magnetic material and a preparation method and application thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, the invention provides a magnetic material, the structure of which sequentially comprises a first metal foil layer, a first resin composition layer, a resin film layer, a second resin composition layer and a second metal foil layer, wherein the first resin composition layer and the second resin composition layer contain magnetic fillers, and the composite elastic rate Er of the resin film layer in the thickness direction is less than 6 GPa.
In the magnetic material, the magnetic filler is contained in the first resin composition layer and the second resin composition layer, and the composite elastic modulus Er in the thickness direction of the resin film layer is less than 6Gpa, so that the whole magnetic material has high magnetic permeability and high specific resistance and can be used for printed circuit boards.
In the present invention, the composite elastic modulus Er in the thickness direction of the resin film layer is less than 6Gpa, and may be, for example, 5.8Gpa, 5.5Gpa, 5.3Gpa, 5.0Gpa, 4.8Gpa, 4.5Gpa, 4.3Gpa, 4.0Gpa, 3.8Gpa, 3.5Gpa, 3.2Gpa, 3.0Gpa, 2.8Gpa, 2.5Gpa, 2.2Gpa, 2.0Gpa, 1.8Gpa, 1.6Gpa, 1.4Gpa, 1.2Gpa, 1.0Gpa, or the like. In the present invention, if the composite elastic modulus Er in the thickness direction of the resin film layer is too large, the magnetic material will be brittle and the sheet resistivity will be low.
Preferably, the resin in the resin film layer is selected from any one of epoxy resin, cyanate ester resin, polyphenylene oxide resin, polybutadiene resin, styrene-butadiene resin, PTFE (polytetrafluoroethylene) resin, phenolic resin, acrylate resin, polyimide resin, liquid crystal resin, bismaleimide-triazine resin, bismaleimide resin, benzoxazine resin, phenoxy resin or nitrile rubber (such as hydroxyl-terminated nitrile rubber) or a mixture of at least two of the above. The resin film layer does not contain magnetic filler, otherwise, the insulativity is reduced by adding the magnetic filler.
Preferably, the thickness of the resin film layer is 0.5 to 50 microns, such as 0.5 microns, 0.8 microns, 1 micron, 5 microns, 8 microns, 10 microns, 15 microns, 20 microns, 25 microns, 30 microns, 35 microns, 40 microns, 45 microns or 50 microns. The resin film layer is too thick, and the magnetic conductivity of the magnetic material is too low; the resin film layer is too thin, and the insulation property of the magnetic material is not obviously improved.
Preferably, the magnetic filler is any one of nickel zinc ferrite, manganese zinc ferrite and cobalt ferrite or a mixture of at least two of the nickel zinc ferrite, the manganese zinc ferrite and the cobalt ferrite. The magnetic filler has high magnetic conductivity and low magnetic loss, and is suitable for use in magnetic materials.
Preferably, the resins in the first resin composition layer and the second resin composition layer are independently selected from any one or a combination of at least two of epoxy resin, polyimide, polyamide, polyamideimide, polyphenylene oxide, cyanate ester, polyolefin, liquid crystal polymer or syndiotactic polystyrene. Preferably, the polyamide is one or a combination of at least two of polyethylene terephthalate, polyethylene naphthalate, polyvinylcarbazole, polyphenylene sulfide, polyamide, aromatic polyamide, polyamideimide, polyether sulfone, polyether nitrile, polyether ether ketone, and polyimide.
Preferably, the amount of the magnetic filler added in the first resin composition layer and the second resin composition layer is independently 20 to 80 wt%, such as 20 wt%, 23 wt%, 25 wt%, 28 wt%, 30 wt%, 35 wt%, 40 wt%, 45 wt%, 50 wt%, 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt%, or 80 wt%. If the addition amount is too low, the magnetic dielectric of the magnetic material is low; when the amount is too high, the mechanical strength of the magnetic material deteriorates.
Preferably, the first and second resin composition layers independently have a thickness of 1-200 microns, such as 3 microns, 5 microns, 8 microns, 10 microns, 20 microns, 40 microns, 50 microns, 80 microns, 100 microns, 120 microns, 150 microns, 180 microns, or 200 microns.
Preferably, the metal foil in the first metal foil layer and the second metal foil layer is any one of copper, brass, aluminum, nickel, or an alloy or composite metal foil of these metals.
Preferably, the first and second metal foil layers independently have a thickness of 12-150 microns, such as 12 microns, 15 microns, 20 microns, 25 microns, 30 microns, 35 microns, 40 microns, 50 microns, 60 microns, 70 microns, 80 microns, 90 microns, 100 microns, 110 microns, 120 microns, 130 microns, 140 microns, or 150 microns.
In another aspect, the present invention provides a method for preparing a magnetic material as described above, comprising the steps of:
(1) respectively coating the resin composition glue solution on the first metal foil layer and the second metal foil layer, and baking the first metal foil layer and the second metal foil layer in an oven to volatilize the solvent until the semi-solidification stage;
(2) and laminating the first metal foil layer coated with the resin composition glue solution, the resin film and the second metal foil layer coated with the resin composition glue solution together, contacting one side coated with the resin composition glue solution with the resin film, and performing hot-pressing curing to obtain the magnetic material.
In the present invention, the resin composition glue solution in step (1) is obtained by dissolving or dispersing a resin composition containing a magnetic filler in a solvent.
Preferably, the solvent is any one or a mixture of at least two of methanol, ethanol, acetone, butanone, cyclohexanone, ethylene glycol monobutyl ether, dibutyl ether, methyl acetate, ethyl acetate or ethyl acetate.
Preferably, the resin composition dope of step (1) has a solid content of 50 to 80 wt%, for example, 50 wt%, 53 wt%, 55 wt%, 58 wt%, 60 wt%, 63 wt%, 65 wt%, 68 wt%, 70 wt%, 73 wt%, 75 wt%, 78 wt% or 80 wt%.
Preferably, the temperature of the hot press curing in the step (2) is 150-.
In another aspect, the present invention provides a printed circuit board comprising a magnetic material as described above.
Compared with the prior art, the invention has the following beneficial effects:
in the magnetic material, the first resin composition layer and the second resin composition layer contain the magnetic filler, and the composite elastic modulus Er in the thickness direction of the resin film layer is less than 6Gpa, so that the whole magnetic material has high magnetic permeability and high resistivity, and can be used for printed circuit boards.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
The composite modulus of elasticity of the resin film of the present invention was measured by nanoindentation. In the nanoindentation method, a resin film as a measurement target was fixed to a stage, and continuous rigidity measurement was performed 5 times. Then, the measurement data thereof was analyzed, and assuming that the poisson ratio was 0.3, the composite elastic modulus of the resin film was obtained. In this measurement, an apparatus designated as Nano introducer XP manufactured by MTM Systems was used, and a triangular pyramidal Indenter Berkovich was used as an Indenter.
The materials used in the following examples and comparative examples are specifically as follows:
epoxy resin: DOW530A80
Polyphenylene ether resin: sabioc SA 9000;
brominated epoxy resin: taiwan Changchun BEB531A 80P;
phenoxy resin: new day iron YP-50EK 35;
o-cresol novolac resin: KOLON KCE-F2118;
the preparation process of the magnetic filler comprises the following steps: the preparation method comprises the steps of physically and dry mixing zinc oxide, iron oxide, nickel oxide, magnesium oxide and other substances in a certain proportion for 1h according to a required proportion, then presintering for 3-5 h at 800-1100 ℃, carrying out wet ball milling on the presintering material in a ball mill for crushing, controlling the particle size of crushed particles through selection of zirconium beads, ball milling rotation speed and ball milling time, and drying the ball-milled particles to obtain nickel-zinc ferrite magnetic powder, namely the nickel-zinc ferrite magnetic filler.
The following magnetic fillers were prepared according to the above method:
nickel zinc ferrite magnetic filler C-1: magnetic permeability of 1000
Nickel zinc ferrite magnetic filler C-2: magnetic permeability of 300
Nickel zinc ferrite magnetic filler C-3: the permeability was 5.
The magnetic filler in the present invention may be a commercially available magnetic powder.
Example 1
20g of brominated epoxy resin, 10g of phenoxy resin and 25g of polyphenylene ether resin SA9000 are dissolved in a solvent ethylene glycol monomethyl ether; then adding 50g of magnetic filler, wherein the type of the magnetic filler is C-1, the magnetic conductivity is 1000; mixing at room temperature to obtain resin glue solution. And coating the obtained resin glue solution on a copper foil, baking for 5 minutes in an oven at 155 ℃ to be cured into a semi-cured B stage so as to obtain the coated copper foil (RCC), wherein the thickness of a glue layer of the RCC is 10 microns. Then, a polyimide film with the thickness of 3 microns and the composite elastic rate Er of 5.1GPa is placed between the two gluing RCCs, the polyimide film is in contact with the glue layers on the two gluing RCCs, and is laminated and cured at 190 ℃ in a press to obtain a cured product, and then the performances such as the magnetic permeability, the resistivity and the like are measured, and the specific proportion and the performance test result are shown in Table 1.
Example 2
Dissolving 27g of epoxy resin, 45g of brominated epoxy resin and 25g of phenoxy resin in a solvent ethylene glycol monomethyl ether; then adding magnetic filler, wherein the type of the magnetic filler is C-2, the magnetic conductivity is 300, and the addition amount is 200 g; mixing at room temperature to obtain resin glue solution. The obtained resin glue solution is coated on a copper foil, and then is baked in an oven at 155 ℃ for 5 minutes to be cured into a B stage, so that a coated copper foil (RCC) is obtained, wherein the glue layer thickness of the RCC is 20 microns. Then, a polyimide film with the thickness of 12 microns and the composite elastic rate Er of 3.3GPa is placed between the two gluing RCCs, the polyimide film is in contact with the glue layers on the two gluing RCCs, and is laminated and cured at 190 ℃ in a press to obtain a cured product, and then the performances such as magnetic permeability, resistivity and the like are measured, and the specific proportion and the performance test result are shown in Table 1.
Example 3
Dissolving 27g of epoxy resin, 45g of brominated epoxy resin and 28g of phenoxy resin in a solvent ethylene glycol monomethyl ether; then adding 500g of magnetic filler, wherein the type of the magnetic filler is C-3, the magnetic conductivity is 5; mixing at room temperature to obtain a glue solution. And coating the obtained glue solution on a copper foil, baking in an oven at 155 ℃ for 5 minutes, and curing to obtain a B-stage glued copper foil (RCC) with the glue layer thickness of 20 microns. And then, a PTFE film with the thickness of 24 microns and the composite elastic rate Er of 1.6GPa is placed between the two gluing RCCs, the PTFE film is contacted with the glue layers on the two gluing RCCs, and is laminated and cured at 190 ℃ in a press to obtain a cured product, and then the properties such as magnetic permeability, resistivity and the like are measured, and the specific proportion and the performance test result are shown in Table 1.
Example 4
Dissolving 27g of epoxy resin, 45g of brominated epoxy resin and 28g of phenoxy resin in a solvent ethylene glycol monomethyl ether; then adding 300g of magnetic filler, wherein the type of the magnetic filler is C-3, the magnetic conductivity is 5; mixing at room temperature to obtain resin glue solution. The obtained resin glue solution is coated on a copper foil, and then is baked in an oven at 155 ℃ for 5 minutes to be cured into a B stage, so that a coated copper foil (RCC) is obtained, wherein the glue layer thickness of the RCC is 20 microns. Next, a PTFE film 30 μm thick and having a composite elastic modulus Er of 2.8GPa in the thickness direction was placed between the two coated RCCs, the PTFE film was in contact with the adhesive layers on the two coated RCCs, and was laminated and cured at 190 ℃ in a press to obtain a cured product, and the properties such as the magnetic permeability and the resistivity were measured, and the specific mixture ratio and the performance test results are shown in table 1.
Comparative example 1
20g of brominated epoxy resin, 10g of phenoxy resin and 25g of polyphenylene ether resin SA9000 are dissolved in a solvent ethylene glycol monomethyl ether; then adding 50g of magnetic filler, wherein the type of the magnetic filler is C-1, the magnetic conductivity is 1000; mixing at room temperature to obtain a glue solution. The obtained glue solution is coated on a copper foil, and then is baked in an oven at 155 ℃ for 5 minutes to be cured into a B stage, so that a glued copper foil (RCC) is obtained, wherein the glue layer thickness of the RCC is 10 microns. Next, a polyimide film 12 μm thick with a composite elastic modulus Er of 7.1GPa in the thickness direction was placed between the coated RCCs, the PS film was in contact with the two adhesive layers on the coated RCCs, and was laminated and cured at 190 ℃ in a press to obtain a cured product, and the properties such as the measurement, magnetic permeability, and resistivity were shown in table 1.
Comparative example 2
Dissolving 27g of epoxy resin, 45g of brominated epoxy resin and 28g of phenoxy resin in a solvent ethylene glycol monomethyl ether; then adding magnetic filler, wherein the type of the magnetic filler is C-2, the magnetic conductivity is 300, and the addition amount is 500 g; mixing at room temperature to obtain resin glue solution. The obtained resin glue solution is coated on a copper foil, and then is baked in an oven at 155 ℃ for 5 minutes to be cured into a B stage, so that a coated copper foil (RCC) is obtained, wherein the glue layer thickness of the RCC is 20 microns. Then, two RCC glue layers are laminated in a contact mode and then are laminated and cured at 190 ℃ in a press machine to obtain a cured product, then the properties such as magnetic permeability and resistivity are measured, and the specific proportion and the performance test result are shown in table 1 (the volume resistivity value in table 1 is 1.30E +12 and represents 1.30 multiplied by 1012And so on).
The performance test method comprises the following steps:
(1) relative magnetic permeability: according to the method of IEC 60404-6, the relative permeability of the material is tested by using A16454 and N1500 which are German technology at the frequency of 0.3 GHz-20 GHz.
(2) Volume resistivity: the test is carried out according to the national standard GB/T4722-2017.
TABLE 1
Figure BDA0002340327280000081
It can be seen from the above examples and comparative examples that the copper-clad plates prepared in examples 1 to 4 have good comprehensive properties such as magnetic permeability, volume resistivity, etc. The composite elastic rate Er of the resin film used in the comparative example 1 is 7.1GPa, and compared with the example 1, the prepared copper-clad plate has low resistivity, which is mainly caused by the large composite elastic rate and the large brittleness of the resin film, so that the plate has low resistivity; compared with the embodiment 3, the copper-clad plate prepared by the comparative example 2 without using the resin film has small electromagnetic conductivity and lacks the resin film insulating layer, and finally the plate resistivity is small.
The applicant states that the present invention is illustrated by the above examples to the magnetic material of the present invention and the preparation method and use thereof, but the present invention is not limited to the above examples, i.e. it does not mean that the present invention must be implemented by the above examples. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.

Claims (10)

1. The magnetic material is characterized in that the structure of the magnetic material sequentially comprises a first metal foil layer, a first resin composition layer, a resin film layer, a second resin composition layer and a second metal foil layer, wherein the first resin composition layer and the second resin composition layer contain magnetic fillers, and the composite elastic rate Er of the resin film layer in the thickness direction is less than 6 GPa.
2. The magnetic material according to claim 1, wherein the resin in the resin film layer is selected from any one of epoxy resin, cyanate resin, polyphenylene ether resin, polybutadiene resin, styrene-butadiene resin, PTFE resin, phenol resin, acrylate resin, polyimide resin, liquid crystal resin, bismaleimide-triazine resin, bismaleimide resin, benzoxazine resin, phenoxy resin or nitrile rubber, or a mixture of at least two of the above resins.
3. The magnetic material according to claim 1 or 2, wherein the thickness of the resin film layer is 0.5 to 50 μm.
4. The magnetic material according to any of claims 1 to 3, wherein the magnetic filler is any one of nickel zinc ferrite, manganese zinc ferrite, cobalt ferrite or a mixture of at least two thereof.
5. The magnetic material according to any one of claims 1 to 4, wherein the resins in the first resin composition layer and the second resin composition layer are independently selected from any one or a combination of at least two of epoxy resin, polyimide, polyamide, polyamideimide, polyphenylene oxide, cyanate ester, polyolefin, liquid crystal polymer, or syndiotactic polystyrene; preferably, the polyamide is one or a combination of at least two of polyethylene terephthalate, polyethylene naphthalate, polyvinylcarbazole, polyphenylene sulfide, polyamide, aromatic polyamide, polyamideimide, polyether sulfone, polyether nitrile, polyether ether ketone, and polyimide.
6. The magnetic material according to any one of claims 1 to 5, wherein the amount of the magnetic filler added in the first resin composition layer and the second resin composition layer is independently 20 to 80 wt%.
Preferably, the first resin composition layer and the second resin composition layer independently have a thickness of 1 to 200 micrometers.
7. The magnetic material according to any one of claims 1 to 6, wherein the metal foil of the first and second metal foil layers is any one of copper, brass, aluminum, nickel, or an alloy or composite metal foil of these metals;
preferably, the first and second metal foil layers independently have a thickness of 12-150 microns.
8. A method for the preparation of a magnetic material according to any of claims 1 to 7, characterized in that it comprises the following steps:
(1) respectively coating the resin composition glue solution on the first metal foil layer and the second metal foil layer, and baking the first metal foil layer and the second metal foil layer in an oven to volatilize the solvent until the semi-solidification stage;
(2) and laminating the first metal foil layer coated with the resin composition glue solution, the resin film and the second metal foil layer coated with the resin composition glue solution together, contacting one side coated with the resin composition glue solution with the resin film, and performing hot-pressing curing to obtain the magnetic material.
9. The preparation method according to claim 8, wherein the resin composition glue solution of step (1) is obtained by dissolving or dispersing a resin composition containing a magnetic filler in a solvent;
preferably, the solvent is any one or a mixture of at least two of methanol, ethanol, acetone, butanone, cyclohexanone, ethylene glycol monobutyl ether, dibutyl ether, methyl acetate, ethyl acetate or ethyl acetate;
preferably, the solid content of the resin composition glue solution in the step (1) is 50-80 wt%;
preferably, the temperature of the hot-pressing curing in the step (2) is 150-400 ℃.
10. A printed circuit board, characterized in that the printed circuit board comprises a magnetic material according to any one of claims 1-7.
CN201911373549.4A 2019-12-27 2019-12-27 Magnetic material and preparation method and application thereof Pending CN113043681A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060062976A1 (en) * 2004-09-23 2006-03-23 Samsung Electro-Mechanics Co., Ltd. Printed circuit board material for embedded passive devices
CN103358631A (en) * 2013-07-19 2013-10-23 广东生益科技股份有限公司 Dielectric layer for embedded capacitance material, embedded capacitance material, preparation method and use of embedded capacitance material
CN106031316A (en) * 2014-02-21 2016-10-12 三井金属矿业株式会社 Copper-clad laminate for forming integrated capacitor layer, multilayer printed wiring board, and production method for multilayer printed wiring board
CN106928650A (en) * 2015-12-30 2017-07-07 广东生益科技股份有限公司 A kind of PAEK composite containing filler, sheet material and the circuit substrate containing it
CN109553955A (en) * 2018-11-12 2019-04-02 陕西生益科技有限公司 A kind of magnetic dielectric resin composition and its application

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060062976A1 (en) * 2004-09-23 2006-03-23 Samsung Electro-Mechanics Co., Ltd. Printed circuit board material for embedded passive devices
CN103358631A (en) * 2013-07-19 2013-10-23 广东生益科技股份有限公司 Dielectric layer for embedded capacitance material, embedded capacitance material, preparation method and use of embedded capacitance material
CN106031316A (en) * 2014-02-21 2016-10-12 三井金属矿业株式会社 Copper-clad laminate for forming integrated capacitor layer, multilayer printed wiring board, and production method for multilayer printed wiring board
CN106928650A (en) * 2015-12-30 2017-07-07 广东生益科技股份有限公司 A kind of PAEK composite containing filler, sheet material and the circuit substrate containing it
CN109553955A (en) * 2018-11-12 2019-04-02 陕西生益科技有限公司 A kind of magnetic dielectric resin composition and its application

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