CN112658991B - 抛光液供给装置 - Google Patents
抛光液供给装置 Download PDFInfo
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- CN112658991B CN112658991B CN202011489844.9A CN202011489844A CN112658991B CN 112658991 B CN112658991 B CN 112658991B CN 202011489844 A CN202011489844 A CN 202011489844A CN 112658991 B CN112658991 B CN 112658991B
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
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CN202011489844.9A CN112658991B (zh) | 2020-12-16 | 2020-12-16 | 抛光液供给装置 |
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CN202011489844.9A CN112658991B (zh) | 2020-12-16 | 2020-12-16 | 抛光液供给装置 |
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CN112658991A CN112658991A (zh) | 2021-04-16 |
CN112658991B true CN112658991B (zh) | 2022-12-13 |
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Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0849040A3 (en) * | 1996-12-19 | 2000-03-01 | Texas Instruments Incorporated | Method of polishing |
JP3426149B2 (ja) * | 1998-12-25 | 2003-07-14 | 富士通株式会社 | 半導体製造における研磨廃液再利用方法及び再利用装置 |
JP3748731B2 (ja) * | 1999-03-26 | 2006-02-22 | 株式会社荏原製作所 | 砥液供給装置 |
JP3789296B2 (ja) * | 2000-11-17 | 2006-06-21 | リオン株式会社 | 研磨液の製造装置 |
JP4243154B2 (ja) * | 2003-08-07 | 2009-03-25 | パナソニック株式会社 | スラリー供給方法 |
JP2006000753A (ja) * | 2004-06-17 | 2006-01-05 | Taiyo Nippon Sanso Corp | 洗浄材製造方法、洗浄材製造装置及び洗浄システム |
CN201077028Y (zh) * | 2007-06-29 | 2008-06-25 | 中芯国际集成电路制造(上海)有限公司 | 一种改进型化学机械研磨液容器 |
JP4715880B2 (ja) * | 2007-07-30 | 2011-07-06 | 剛 加藤 | 平面研磨装置 |
JP5802609B2 (ja) * | 2011-09-07 | 2015-10-28 | ジー・フォースジャパン株式会社 | クーラント再生方法 |
JP5803601B2 (ja) * | 2011-11-18 | 2015-11-04 | 信越半導体株式会社 | 研磨スラリーの供給方法及び供給装置、並びに研磨装置 |
CN103725256A (zh) * | 2013-12-31 | 2014-04-16 | 上海集成电路研发中心有限公司 | 用于cmp的研磨颗粒体系及抛光液 |
CN204563966U (zh) * | 2015-04-01 | 2015-08-19 | 麦斯克电子材料有限公司 | 一种抛光液配制系统 |
CN111633563B (zh) * | 2020-06-15 | 2021-09-14 | 衢州学院 | 抛光介质制备装置和方法、机械化学抛光设备和方法 |
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Effective date of registration: 20220620 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. |
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Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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