CN112649561A

CN112649561A - Gas detection module

Info

Publication number: CN112649561A
Application number: CN201911082130.3A
Authority: CN
Inventors: 莫皓然; 林景松; 杨文阳; 韩永隆; 黄启峰; 郭俊毅; 谢锦文
Original assignee: Microjet Technology Co Ltd
Current assignee: Microjet Technology Co Ltd
Priority date: 2019-10-09
Filing date: 2019-11-07
Publication date: 2021-04-13
Anticipated expiration: 2039-11-07
Also published as: CN112649561B

Abstract

A gas detection module is characterized in that a gas inlet concave surface and a gas outlet concave surface are formed on the side wall surface of a base, a gas inlet groove area and a gas outlet groove area are formed on the surface of the base, the gas inlet concave surface is communicated with the gas inlet groove area, the gas outlet concave surface is communicated with the gas outlet groove area, and the gas inlet groove area and the gas outlet groove area are sealed by films, so that the effects of side gas inlet and side gas outlet are achieved.

Description

Gas detection module

Technical Field

The present disclosure relates to a gas detection module, and more particularly, to a gas detection module that is very thin and is used for being combined with a portable electronic device or a mobile device.

Background

In recent years, demands for living environments have been increased, and before going out, in addition to confirmation of weather information, importance has been attached to the quality of air, but the current air quality information is dependent on a monitoring station, but only air quality information in a large area can be provided, and detailed air quality information in a small range cannot be provided.

Accordingly, what is needed is a gas detection module that can be combined with a portable electronic device that is necessary for people to obtain air quality information only by using the portable electronic device.

Disclosure of Invention

The main objective of the present disclosure is to provide a gas detection module, which comprises a base, a micro pump, a driving circuit board and a gas sensor to form a module, so that the module can be easily embedded in a mobile device or a portable electronic device for implementation.

One broad aspect of the present disclosure is a gas detection module, comprising: a base, comprising: a first surface; a second surface opposite to the first surface; a plurality of side wall surfaces longitudinally extending from the first surface side to the second surface side, wherein one side wall surface is recessed with an air inlet concave surface and an air outlet concave surface, and the air inlet concave surface and the air outlet concave surface are arranged at intervals; the accommodating space is formed by an inner area space which is recessed in the side wall surface from the second surface to the first surface, and is divided into a micropump bearing area, a detection area and an air guide passage area, the micropump bearing area is communicated with the air guide passage area through an air vent gap, and the detection area is communicated with the air guide passage area through a communication opening; an air inlet groove area formed by sinking from the first surface, provided with an air inlet through hole communicated with the air guide passage area and a ventilation groove communicated with the air inlet concave surface of the side wall surface; the air outlet groove area is formed by sinking from the first surface, is provided with an air outlet through hole, is communicated with the micro pump bearing area and is provided with an air outlet groove communicated with the air outlet concave surface of the side wall surface; a micro pump accommodated in the micro pump bearing area and sealing the air outlet through hole; the driving circuit board is attached to the second surface of the base through the sealing cover so as to form the micro-pump bearing area, the detection area and the air guide passage area of the accommodating space and form an air guide path in which air enters from the air inlet through hole of the air inlet groove area and is discharged from the air outlet through hole of the air outlet groove area; the gas sensor is electrically connected with the driving circuit board and correspondingly accommodated in the detection area so as to detect the passing gas; and a film, attached to and covering the air inlet groove area and the air outlet groove area, so that air can be admitted from the air inlet concave surface of the side wall surface, enter the air inlet groove area through the ventilating groove, enter the air guide path through the air inlet through hole, be discharged from the air outlet through hole of the air outlet groove area, and be communicated with the air outlet concave surface of the side wall surface through the air outlet groove to form side exhaust; the base, the micropump, the driving circuit board, the gas sensor and the film are of a module structure made of a micro material, the module structure is provided with a length, a width and a height, the micropump drives and accelerates to guide external gas to enter the gas guide channel area from the side face of the gas inlet concave surface, the side face of the gas inlet concave surface forms side air inlet, the gas sensor in the detection area detects the gas, the guided gas is guided by the micropump and then is discharged from the gas outlet through hole of the gas outlet groove area, and the gas outlet groove is communicated with the gas outlet concave surface of the side wall face to form side air outlet.

Drawings

Fig. 1A is an external view of the gas detection module of the present invention.

Fig. 1B is an exploded view of the position of the cover of the film of the gas detection module on the base.

Fig. 1C is an exploded view of relevant components of the gas detection module of the present disclosure.

Fig. 2 is a schematic view of the gas detection module assembled and combined with a micro pump on a base.

Fig. 3 is a schematic cross-sectional view of a gas path of the gas detection module according to the present invention.

Fig. 4 is a schematic cross-sectional view of another gas path of the gas detection module according to the present invention.

Fig. 5A is an exploded view of the micro pump of the gas detection module of the present disclosure.

Fig. 5B is a schematic view of the micropump of the gas detection module according to another aspect of the present invention.

Fig. 6A is a schematic cross-sectional view of a micropump of the gas detection module of the present disclosure.

Fig. 6B is a schematic cross-sectional view of another embodiment of a micropump of the gas detection module of the present disclosure.

Fig. 6C to 6E are schematic operation diagrams of the micro pump of fig. 6A.

Fig. 7A is a schematic cross-sectional view of a microelectromechanical pump.

Fig. 7B is an exploded view of the mems pump.

Fig. 8A to 8C are schematic views illustrating the operation of the mems pump.

FIG. 9 is a schematic view of the gas detection module embedded in the mobile device.

Fig. 10 is a schematic cross-sectional view of the gas detection module assembly disposed in the portable electronic device.

Description of the reference numerals

1: base seat

11: first surface

12: second surface

13: side wall surface

13 a: concave air inlet

13 b: air outlet concave surface

14: containing space

14 a: micropump carrier region

14 b: detection zone

14 c: air guide passage area

14 d: ventilation gap

14 e: communicating opening

15: inlet channel zone

15 a: air inlet through hole

15 b: air inlet groove

16: air outlet groove area

16 a: air outlet through hole

16 b: air outlet groove

2: micro pump

21: air inlet plate

211: air intake

212: bus bar groove

213: confluence chamber

22: resonance sheet

221: hollow hole

23: piezoelectric actuator

231: suspension plate

232: outer frame

233: support frame

234: piezoelectric element

235: voids

236: convex part

24: first insulating sheet

25: conductive sheet

26: second insulating sheet

27: chamber space

2 a: MEMS pump

21 a: first substrate

211 a: inflow hole

212 a: first surface

213 a: second surface

22 a: first oxide layer

221 a: confluence channel

222 a: confluence chamber

23 a: second substrate

231 a: silicon wafer layer

2311 a: actuating part

2312 a: outer peripheral portion

2313 a: connecting part

2314 a: fluid channel

232 a: second oxide layer

2321 a: vibration chamber

233 a: silicon layer

2331 a: perforation

2332 a: vibrating part

2333 a: fixing part

2334 a: third surface

2335 a: the fourth surface

24 a: piezoelectric component

241 a: lower electrode layer

242 a: piezoelectric layer

243 a: insulating layer

244 a: upper electrode layer

3: driving circuit board

4: gas sensor

5: film(s)

6: portable electronic device

7: mobile device

7 a: inlet inlet

7 b: air outlet

L: length of

W: width of

H: thickness of

Detailed Description

Some exemplary embodiments that embody the features and advantages of this disclosure will be described in detail in the description that follows. It will be understood that the present disclosure is capable of various modifications without departing from the scope of the disclosure, and that the description and drawings are to be regarded as illustrative in nature, and not as restrictive.

Referring to fig. 1A to 1C, a gas detection module is provided, which includes a base 1, a micro pump 2, a driving circuit board 3, a gas sensor 4 and a film 5; the base 1, the micropump 2, the driving circuit board 3, the gas sensor 4 and the film 5 are made of a module structure made of a micro material, and the module structure has a length, a width and a height, wherein the length, the width and the height of the module structure are between 1 centimeter (mm) and 999 centimeter (mm), or between 1 micrometer (μm) and 999 micrometer (μm), or between 1 nanometer (nm) and 999 nanometer (nm), but not limited thereto. In this embodiment, the length of the module structure is between 1 micron and 999 microns, the width is between 1 micron and 999 microns, and the height is between 1 micron and 999 microns, or the length of the module structure is between 1 nanometer and 999 nanometers, the width is between 1 nanometer and 999 nanometers, and the height is between 1 nanometer and 999 nanometers.

The base 1 includes a first surface 11, a second surface 12, four-way side wall surfaces 13, a receiving space 14, an air inlet groove area 15 and an air outlet groove area 16, the first surface 11 and the second surface 12 are two opposite surfaces, the four-way side wall surfaces 13 are formed by longitudinally extending the side edge of the first surface 11 to the side edge of the second surface 12, one of the four-way side wall surfaces 13 is recessed with an air inlet concave surface 13a and an air outlet concave surface 13b toward the side wall surface 13, and the air inlet concave surfaces 13a and the air outlet concave surfaces 13b are arranged at intervals; the accommodation space 14 is formed by an inner area space recessed in the side wall 13 from the second surface 12 toward the first surface 11, the accommodation space 14 is partitioned into a micro-pump bearing area 14a, a detection area 14b and an air guide passage area 14c, the micro-pump bearing area 14a and the air guide passage area 14c are communicated with each other through a ventilation gap 14d, and the detection area 14b and the air guide passage area 14c are communicated with each other through a communication opening 14 e.

The air inlet groove area 15 is recessed from the first surface 11 and includes an air inlet through hole 15a and an air inlet groove 15b, the air inlet through hole 15a is connected to the air guide passage area 14c, and the air inlet groove 15b is connected between the air inlet through hole 15a and the air inlet concave surface 13a, so that the air inlet through hole 15a and the air inlet concave surface 13a are communicated with each other.

The air outlet groove region 16 is formed by recessing the first surface 11 and includes an air outlet through hole 16a and an air outlet groove 16b, the air outlet through hole 16a is connected to the micro pump bearing region 14a, the air outlet groove 16b is connected between the air outlet through hole 16a and the air outlet concave surface 13b, and the air outlet through hole 16a and the air outlet concave surface 13b are mutually communicated.

Referring to fig. 1C and fig. 2, the micro pump 2 is accommodated in the micro pump carrying region 14a of the accommodating space 14 and covers the air outlet hole 16a, in addition, the micro pump 2 is electrically connected to the driving circuit board 3, the operation of the micro pump 2 is controlled by the driving signal provided by the driving circuit board 3, and the driving signal (not shown) of the micro pump 2 is provided by the driving circuit board 3.

As shown in fig. 1C, the driving circuit board 3 is covered and attached to the second surface 12 of the base 1 to form a micro-pump carrying area 14a, a detection area 14b and an air guiding path area 14C of the accommodating space 14, so that air can be discharged from the air inlet hole 15a of the air inlet groove area 15 and then from the air outlet hole 16a of the air outlet groove area 16.

The gas sensor 4 is positioned on the driving circuit board 3 and electrically connected to the driving circuit board 3, and when the driving circuit board 3 is attached to the second surface 12 of the base 1, the gas sensor 4 is correspondingly accommodated in the detection area 14b of the accommodating space 14, and detects gas information in the detection area 14 b.

The film 5 is attached to the first surface of the base 1, and covers the air inlet groove area 15 and the air outlet groove area 16, so that air can be introduced from the side surface of the air inlet concave surface 13a of the side wall surface, and is communicated with the air inlet groove area 15 through the air inlet groove 15b, enters the air guide path through the air inlet through hole 15a, is discharged from the air outlet through hole 16a of the air outlet groove area 16, and is communicated with the air outlet concave surface 13b of the side wall surface 13 through the air outlet groove 16b to form side exhaust.

As can be seen from the above description, the micropump 2 is driven to accelerate the transportation of the gas outside the gas detection module, the side wall surface 13 forms side inlet gas, the side inlet gas is then transported to the gas guiding passage area 14c, the gas sensor 4 located in the detection area 14b detects gas information, the transported gas is transported by the micropump 2, and the gas can be discharged from the gas outlet through hole 16a of the gas outlet groove area 16 and is communicated with the gas outlet concave surface 13b of the side wall surface 13 through the gas outlet groove 16b to form side outlet gas; the gas sensor 4 is a volatile organic compound sensor, but not limited thereto. Certainly, the film 5 is not attached to the first surface of the base 1, so that the gas can directly enter the gas guide path from the gas inlet through hole 15a and then be discharged from the gas outlet through hole 16a of the gas outlet groove area 16 to form vertical plane gas inlet and gas outlet.

Referring to fig. 3 and 4, the driving circuit board 3 provides a driving signal to control the operation of the micro pump 2, the micro pump 2 starts to suck the gas in the micro pump bearing region 14a and discharges the gas from the gas outlet hole 16a, at this time, the micro pump bearing region 14a is in a negative pressure state, so that the gas in the gas guide passage region 14c communicated with the gas inlet hole 14d through the gas outlet hole 14d enters the micro pump bearing region 14a through the gas outlet hole 14d, and starts to suck the gas from the gas inlet hole 15a of the gas inlet groove region 15 into the gas guide passage region 14c, and the gas entering the gas guide passage region 14c enters the micro pump bearing region 14a, and a part of the gas enters the detection region 14b through the communication hole 14e, so that the gas sensor 4 located in the detection region 14b can detect the gas information.

Referring to fig. 5A and 5B, the micro-pump 2 includes a gas inlet plate 21, a resonance plate 22, a piezoelectric actuator 23, a first insulation plate 24, a conductive plate 25, and a second insulation plate 26, wherein the piezoelectric actuator 23 is disposed corresponding to the resonance plate 22, and the gas inlet plate 21, the resonance plate 22, the piezoelectric actuator 23, the first insulation plate 24, the conductive plate 25, and the second insulation plate 26 are sequentially stacked.

As shown in fig. 5A, 5B and 6C, the intake plate 21 has at least one intake hole 211, at least one bus slot 212 and a bus chamber 213, and in the embodiment, the number of the intake holes 211 is preferably 4, but not limited thereto. The air inlet hole 211 penetrates through the air inlet plate 21, and is used for allowing air to flow into the micro pump 2 from the air inlet hole 211 under the action of atmospheric pressure. The intake plate 21 has at least one bus bar slot 212, the number and position of which are corresponding to the intake holes 211 on the other surface of the intake plate 21, the number of the intake holes 211 in this embodiment is 4, and the number of the corresponding bus bar slot 212 is also 4; the collecting chamber 213 is located at the center of the air intake plate 21, one end of the 4 bus slots 212 is connected to the corresponding air intake holes 211, and the other end is connected to the collecting chamber 213 at the center of the air intake plate 21, so that the air entering the bus slots 212 from the air intake holes 211 can be guided and collected to the collecting chamber 213. In the present embodiment, the air inlet plate 21 has an air inlet hole 211, a bus bar groove 212 and a bus bar chamber 213 which are integrally formed. In some embodiments, the material of the air inlet plate 21 may be stainless steel, but not limited thereto. In other embodiments, the depth of the bus chamber 213 is the same as the depth of the bus groove 212, but not limited thereto.

The resonator plate 22 is made of a flexible material, but not limited thereto, and the resonator plate 22 has a hollow hole 221 corresponding to the collecting chamber 213 of the inlet plate 21 for the gas to pass through. In other embodiments, the resonator plate 22 may be made of a copper material, but not limited thereto.

The piezoelectric actuator 23 is assembled by a suspension plate 231, an outer frame 232, at least one support 233 and a piezoelectric element 234; the suspension plate 231 is square and can be bent and vibrated, the outer frame 232 is arranged around the suspension plate 231, the at least one bracket 233 is connected between the suspension plate 231 and the outer frame 232 to provide an elastic supporting effect, the piezoelectric element 234 is also square and is attached to one surface of the suspension plate 231 and used for applying voltage to generate deformation to drive the suspension plate 231 to be bent and vibrated, and the side length of the piezoelectric element 234 is less than or equal to that of the suspension plate 231; a plurality of gaps 235 are formed among the suspension plate 231, the outer frame 232 and the bracket 233, and the gaps 235 allow gas to pass through; in addition, the piezoelectric actuator 23 further includes a protrusion 236, and the protrusion 236 is disposed on the other surface of the suspension plate 231 and is disposed on both surfaces of the suspension plate 231 opposite to the piezoelectric element 234.

As shown in fig. 6A, the intake plate 21, the resonator plate 22, the piezoelectric actuator 23, the first insulating plate 24, the conductive plate 25, and the second insulating plate 26 are sequentially stacked, and the suspension plate 231 of the piezoelectric actuator 23 has a thickness smaller than that of the outer frame 232, so that when the resonator plate 22 is stacked on the piezoelectric actuator 23, a chamber space 27 is formed between the suspension plate 231 of the piezoelectric actuator 23, the outer frame 232, and the resonator plate 22.

Referring to fig. 6B again, the components of another embodiment of the micro pump 2 are the same as those of the previous embodiment (fig. 6A), and therefore are not described again, but the difference is that the suspension plate 231 of the piezoelectric actuator 23 is formed by stamping to extend in a direction away from the resonator plate 22, and is not located at the same level as the outer frame 232; after the air intake plate 21, the resonator plate 22, the piezoelectric actuator 23, the first insulating plate 24, the conducting plate 25, and the second insulating plate 26 are sequentially stacked and combined, wherein a cavity space is formed between a surface of the suspension plate 231 and the resonator plate 22, and the cavity space will affect the transmission effect of the micro-pump 2, so it is very important to maintain a fixed cavity space for providing stable transmission efficiency for the micro-pump 2, so the micro-pump 2 forms the suspension plate 231 by stamping to be recessed, so that a surface of the suspension plate 231 and a surface of the outer frame 232 are not coplanar, that is, a surface of the suspension plate 231 and a surface of the outer frame 232 are not coplanar, thereby forming a drop difference, and a surface of the suspension plate 231 is far away from a surface of the outer frame 232, so that the suspension plate 231 of the piezoelectric actuator 23 is recessed to form a space to form an adjustable cavity space with the resonator plate 22, and the suspension plate 231 of the piezoelectric actuator 23 is directly formed to be recessed to form a cavity space structure In this way, the required chamber pitch can be achieved by adjusting the forming recess distance of the suspension plate 231 of the piezoelectric actuator 23, thereby effectively simplifying the structural design for adjusting the chamber pitch, and also achieving the advantages of simplifying the manufacturing process and shortening the manufacturing time.

In order to understand the output actuation manner of the micro pump 2 for providing gas transmission, please refer to fig. 6C to 6E, please refer to fig. 6C first, the piezoelectric element 234 of the piezoelectric actuator 23 is deformed to drive the suspension plate 231 to move upward after being applied with the driving voltage, at this time, the volume of the chamber space 27 is increased, a negative pressure is formed in the chamber space 27, so as to draw the gas in the confluence chamber 213 into the chamber space 27, and the resonance plate 22 is synchronously driven upward under the influence of the resonance principle, so as to increase the volume of the confluence chamber 213, and the gas in the confluence chamber 213 is also in a negative pressure state due to the relationship that the gas in the confluence chamber 213 enters the chamber space 27, and further, the gas is drawn into the confluence chamber 213 through the gas inlet 211 and the confluence groove 212; referring to fig. 6D again, the piezoelectric element 234 drives the suspension plate 231 to displace downward to compress the chamber space 27, and similarly, the resonator plate 22 is displaced downward by the suspension plate 231 due to resonance, so as to synchronously push the gas in the chamber space 27 to be delivered downward through the gap 235 and upward, and discharge the gas from the micro pump 2; finally, referring to fig. 6E, when the suspension plate 231 is restored, the resonator plate 22 still moves downward due to inertia, and at this time, the resonator plate 22 moves the gas in the compression chamber space 27 toward the gap 235, and increases the volume in the confluence chamber 213, so that the gas can continuously flow through the gas inlet holes 211 and the confluence groove 212 to be converged in the confluence chamber 213, and by continuously repeating the gas transmission operation steps provided by the micro-pump shown in fig. 6C to 6E, the micro-pump can enable the gas to continuously enter the gas inlet plate 21 and the resonator plate 22 from the gas inlet holes 211 to form a flow channel to generate a pressure gradient, and then the gas is upwards transmitted through the gap 235, so that the gas flows at a high speed, and the effect of the micro-pump 2 for transmitting the gas is achieved.

Another embodiment of the micro-pump 2 can be a micro-electromechanical pump 2a, referring to fig. 7A and 7B, the micro-electromechanical pump 2a includes a first substrate 21a, a first oxide layer 22a, a second substrate 23a and a piezoelectric element 24 a; it should be noted that the mems pump 2a of the present embodiment is formed by epitaxy, deposition, photolithography, etching, etc. in a semiconductor process, and should not be disassembled, so as to describe its internal structure, it is specifically described in an exploded view.

The first substrate 21a is a silicon wafer (Si wafer) with a thickness of 150 to 400 micrometers (μm), the first substrate 21a has a plurality of inflow holes 211a, a first surface 212a and a second surface 213a, and in the embodiment, the number of the inflow holes 211a is 4, but not limited thereto, and each of the inflow holes 211a penetrates from the second surface 213a to the first surface 212a, and the inflow holes 211a form a tapered shape from the second surface 213a to the first surface 212a to enhance the inflow effect.

The first oxide layer 22a is a silicon dioxide (SiO2) thin film with a thickness of 10 to 20 micrometers (μm), the first oxide layer 22a is stacked on the first surface 212a of the first substrate 21a, the first oxide layer 22a has a plurality of bus channels 221a and a bus chamber 222a, and the number and positions of the bus channels 221a and the inflow holes 211a of the first substrate 21a correspond to each other. In this embodiment, the number of the bus channels 221a is also 4, one end of each of the 4 bus channels 222a is connected to the 4 inflow holes 211a of the first substrate 21a, and the other end of each of the 4 bus channels 221a is connected to the bus chamber 222a, so that the gas enters from the inflow holes 211a, and then is collected into the bus chamber 222a through the corresponding bus channel 221 a.

The second oxide layer 232a is a silicon oxide layer with a thickness of 0.5 to 2 micrometers (μm), is formed on the silicon wafer layer 231a, has a hollow ring shape, and defines a vibration chamber 2321a with the silicon wafer layer 231 a. The silicon layer 233a is circular, is located on the second oxide layer 232a and is bonded to the first oxide layer 22a, and the silicon layer 233a is a silicon dioxide (SiO2) thin film with a thickness of 2-5 micrometers (μm), and has a through hole 2331a, a vibrating portion 2332a, a fixing portion 2333a, a third surface 2334a and a fourth surface 2335 a. A through hole 2331a is formed in the center of the silicon layer 233a, the vibrating portion 2332a is located in the peripheral region of the through hole 2331a and vertically corresponds to the vibrating chamber 2321a, the fixing portion 2333a is the peripheral region of the silicon layer 233a and is fixed to the second oxide layer 232a by the fixing portion 2333a, the third surface 2334a is joined to the second oxide layer 232a, and the fourth surface 2335a is joined to the first oxide layer 22 a; the piezoelectric element 24a is stacked on the actuating portion 2311a of the silicon wafer layer 231 a.

The piezoelectric element 24a includes a lower electrode layer 241a, a piezoelectric layer 242a, an insulating layer 243a and an upper electrode layer 244a, the lower electrode layer 241a is stacked on the actuating portion 2311a of the silicon wafer layer 231a, the piezoelectric layer 242a is stacked on the lower electrode layer 241a, the two are electrically connected through the contact area, furthermore, the width of the piezoelectric layer 242a is smaller than the width of the lower electrode layer 241a, so that the piezoelectric layer 242a cannot completely shield the lower electrode layer 241a, the insulating layer 243a is stacked on the partial area of the piezoelectric layer 242a and the area of the lower electrode layer 241a not shielded by the piezoelectric layer 242a, finally, the upper electrode layer 244a is stacked on the insulating layer 243a and the area of the piezoelectric layer 242a not shielded by the insulating layer 243a, so that the upper electrode layer 244a can be electrically connected with the piezoelectric layer 242a, and the insulating layer 243a is used to block between the upper electrode layer 244a and the lower, avoid the direct contact between the two to cause short circuit.

Referring to fig. 8A to 8C, fig. 8A to 8C are schematic operation diagrams of the mems pump 2 a. Referring to fig. 8A, after the lower electrode layer 241a and the upper electrode layer 244a of the piezoelectric element 24a receive the driving voltage and the driving signal (not shown) transmitted by the driving circuit board 3, the driving voltage and the driving signal are transmitted to the piezoelectric layer 242a, and the piezoelectric layer 242a starts to deform under the influence of the inverse piezoelectric effect, so as to drive the actuating portion 2311a of the silicon wafer layer 231a to start to move, and when the piezoelectric element 24a drives the actuating portion 2311a to move upward to pull open the distance between the actuating portion and the second oxide layer 232a, at this time, the volume of the vibration chamber 2321a of the second oxide layer 232a is increased, so that a negative pressure is formed in the vibration chamber 2321a, and the gas in the collecting chamber 222a of the first oxide layer 22a is sucked into the first oxide layer through the through hole 2331 a. Referring to fig. 8B, when the actuator 2311a is pulled by the piezoelectric element 24a to move upward, the vibrating portion 2332a of the silicon material layer 233a moves upward due to the resonance principle, when the vibrating portion 2332a moves upward, the space of the vibration chamber 2321a is compressed and the gas in the vibration chamber 2321a is pushed to move toward the fluid channel 2314a of the silicon wafer layer 231a, so that the gas can be discharged upward through the fluid channel 2314a, while the vibrating portion 2332a moves upward to compress the vibration chamber 2321a, the volume of the bus chamber 222a is lifted due to the displacement of the vibrating portion 2332a, a negative pressure is formed inside, the gas outside the micro-electromechanical pump 2a is sucked into the vibration chamber 2321a through the inlet hole 211a, and finally, as shown in fig. 8C, when the piezoelectric element 24a drives the actuator 2311a of the silicon wafer layer 231a to move downward, the gas in the vibration chamber 2321a is pushed to the fluid channel 2314a, the gas is exhausted, the vibrating portion 2332a of the silicon material layer 233a is also driven by the actuating portion 2311a to move downward, the gas in the compressing and converging chamber 222a is synchronously moved to the vibrating chamber 2321a through the through hole 2331a, and then the piezoelectric element 24a drives the actuating portion 2311a to move upward, the volume of the vibrating chamber 2321a is greatly increased, so that the gas is sucked into the vibrating chamber 2321a with high sucking force, and the above actions are repeated, so that the piezoelectric element 24a continuously drives the actuating portion 2311a to move up and down and drives the vibrating portion 2332a to move up and down, and the internal pressure of the micro-electromechanical pump 2a is changed to continuously suck and exhaust the gas, thereby completing the action of the micro-electromechanical pump 2 a.

Finally, referring to fig. 1A and 9, the gas path of the gas detection module of the present disclosure is designed to be a side gas inlet and a side gas outlet, so that the gas detection module can be embedded in a mobile device 7 for application, and the overall structure of the gas detection module can be designed to be thin, the preferred length L of the gas detection module can be 20mm to 30mm, the preferred width W of the gas detection module can be 10mm to 20mm, and the preferred thickness H of the gas detection module can be 1mm to 6mm, and the gas detection module is matched with the mobile device 7 to be used, and forms a side gas inlet and a side gas outlet corresponding to the gas inlet 7a and the gas outlet 7b on the sidewall of the mobile device 7, so that the gas detection module of the present disclosure can be easily embedded in the mobile device 7 for application, wherein the mobile device 7 can be a smart phone, a smart watch, and the like; in addition, referring to fig. 10, when the preferred length of the gas detection module of the present application is 20mm to 30mm, the preferred width is 10mm to 20mm, and the preferred thickness is 1mm to 6mm, the gas detection module can also be assembled in the portable electronic device 6, and the portable electronic device 6 can be a mobile power supply, an air quality detection device, an air cleaner, and the like.

In summary, the gas detection module provided by the present disclosure forms an air inlet concave surface and an air outlet concave surface through the side wall surface of the base, forms an air inlet groove region and an air outlet groove region on the surface of the base, communicates the air inlet concave surface with the air outlet groove region, and seals the air inlet groove region and the air outlet groove region with a film, so as to achieve the effects of side air inlet and side air outlet, and further transmit gas by a micro pump.

Claims

1. A gas detection module, comprising:

a base, comprising:

a first surface;

a second surface opposite to the first surface;

a plurality of side wall surfaces longitudinally extending from the first surface side to the second surface side, wherein one side wall surface is recessed with an air inlet concave surface and an air outlet concave surface, and the air inlet concave surface and the air outlet concave surface are arranged at intervals;

the accommodating space is formed by an inner area space which is recessed in the side wall surface from the second surface to the first surface, and is divided into a micropump bearing area, a detection area and an air guide passage area, the micropump bearing area is communicated with the air guide passage area through a ventilation notch, and the detection area is communicated with the air guide passage area through a communication opening;

an air inlet groove area formed by sinking from the first surface, provided with an air inlet through hole communicated with the air guide passage area and a ventilation groove communicated with the air inlet concave surface of the side wall surface; and

an air outlet groove area formed by sinking from the first surface, provided with an air outlet through hole communicated with the micro pump bearing area and an air outlet groove communicated with the air outlet concave surface of the side wall surface;

a micro pump accommodated in the micro pump bearing area and sealing the air outlet through hole;

the driving circuit board is attached to the second surface of the base through the sealing cover so as to form the micro-pump bearing area, the detection area and the air guide passage area of the accommodating space and form an air guide path in which air can enter from the air inlet through hole of the air inlet groove area and then is discharged from the air outlet through hole of the air outlet groove area;

the gas sensor is electrically connected with the driving circuit board and correspondingly accommodated in the detection area so as to detect the passing gas; and

a film attached to the air inlet groove area and the air outlet groove area to lead the air to be led in from the air inlet concave surface of the side wall surface, and then the air enters the air inlet groove area through the air vent groove, then the air enters the air guide path through the air inlet through hole, and then the air is discharged from the air outlet through hole of the air outlet groove area, and the air is communicated with the air outlet concave surface of the side wall surface through the air outlet groove to form side exhaust;

the base, the micropump, the driving circuit board, the gas sensor and the film are of a module structure made of micro materials, the module structure is provided with a length, a width and a height, the micropump drives and accelerates to guide external gas to enter the gas guide channel area from the side face through the gas inlet concave surface of the side wall surface, the gas sensor in the detection area detects the gas, the guided gas is guided and conveyed through the micropump and then discharged through the gas outlet through hole of the gas outlet groove area, and the gas outlet groove is communicated with the gas outlet concave surface of the side wall surface to form side exhaust.

2. The gas detection module of claim 1, wherein the module structure has a volume of between 1 micron and 999 microns in length, between 1 micron and 999 microns in width, and between 1 micron and 999 microns in height.

3. The gas detection module of claim 1, wherein the module structure has a volume with a length of 1 nm to 999 nm, a width of 1 nm to 999 nm, and a height of 1 nm to 999 nm.

4. The gas detection module of claim 1, wherein the gas detection module has a length of between 2mm and 30mm, a width of between 2mm and 20mm, and a thickness of between 1mm and 6 mm.

5. The gas detection module of claim 1, wherein the gas sensor is a volatile organic compound sensor.

6. The gas detection module of claim 1, wherein the micropump comprises:

the air inlet plate is provided with at least one air inlet hole, at least one bus bar groove corresponding to the position of the air inlet hole and a confluence chamber, the air inlet hole is used for introducing air, and the bus bar groove is used for guiding the air introduced from the air inlet hole to the confluence chamber;

a resonance sheet having a central hole corresponding to the position of the confluence chamber and a movable part around the central hole; and

a piezoelectric actuator, which is arranged corresponding to the resonance sheet in position;

the air inlet plate, the resonance sheet and the piezoelectric actuator are sequentially stacked, and a cavity space is formed between the resonance sheet and the piezoelectric actuator, so that when the piezoelectric actuator is driven, the gas is led in from the air inlet hole of the air inlet plate, is collected to the collection cavity through the collection groove, and then is resonated with the movable part of the resonance sheet through the central hole of the resonance sheet to transmit the gas.

7. The gas detection module of claim 6, wherein the piezoelectric actuator comprises:

a suspension plate having a square shape and capable of bending and vibrating;

an outer frame surrounding the suspension plate;

at least one bracket connected between the suspension plate and the outer frame to provide elastic support; and

the piezoelectric element is attached to one surface of the suspension plate and used for receiving voltage to drive the suspension plate to vibrate in a bending mode.

8. The gas detection module of claim 6, wherein the piezoelectric actuator comprises:

a suspension plate having a convex portion;

an outer frame surrounding the suspension plate;

at least one support connected between the suspension plate and the outer frame to provide elastic support for the suspension plate; and

the piezoelectric element is attached to one surface of the suspension plate and used for applying voltage to drive the suspension plate to vibrate in a bending way;

the at least one support is formed between the suspension plate and the outer frame, a surface of the suspension plate and a surface of the outer frame form a non-coplanar structure, and a cavity space is kept between the surface of the suspension plate and the resonator plate.

9. The gas detection module of claim 6, wherein the micropump further comprises a first insulating sheet, a conductive sheet, and a second insulating sheet, wherein the gas inlet plate, the resonator plate, the piezoelectric actuator, the first insulating sheet, the conductive sheet, and the second insulating sheet are sequentially stacked.

10. The gas detection module of claim 1, wherein the gas detection module has a length of between 20mm and 30mm, a width of between 10mm and 20mm, and a thickness of between 1mm and 6 mm.

11. The gas detection module of claim 1, wherein the micropump is a microelectromechanical pump comprising:

a first substrate having a plurality of inflow holes, the plurality of inflow holes being tapered;

the first oxide layer is stacked on the first substrate and provided with a plurality of confluence chambers and a confluence chamber, and the confluence chambers are communicated between the confluence chambers and the plurality of inflow holes;

a second substrate bonded to the first substrate, comprising:

a silicon wafer layer having:

an actuating portion, which is circular;

an outer peripheral portion, which is in a hollow ring shape and surrounds the periphery of the actuating portion;

a plurality of connecting portions respectively connected between the actuating portion and the outer circumferential portion; and

a plurality of fluid channels surrounding the periphery of the actuating part and respectively positioned among the connecting parts;

the second oxidation layer is formed on the silicon crystal layer, is in a hollow ring shape, and defines a vibration chamber with the silicon crystal layer;

a circular silicon layer on the second oxide layer and bonded to the first oxide layer, comprising:

a through hole formed in the center of the silicon material layer;

a vibrating part located in the peripheral area of the through hole; and

a fixing part located at the peripheral region of the silicon material layer; and

and the piezoelectric component is circular and is stacked on the actuating part of the silicon wafer layer.

12. The gas detection module of claim 11, wherein the piezoelectric element comprises:

a lower electrode layer;

a piezoelectric layer stacked on the lower electrode layer;

an insulating layer, which is laid on partial surface of the piezoelectric layer and partial surface of the lower electrode layer; and

and the upper electrode layer is superposed on the insulating layer and the rest surface of the piezoelectric layer, which is not provided with the insulating layer, and is electrically connected with the piezoelectric layer.