TWI722812B - Blood pressure measurement module - Google Patents

Blood pressure measurement module Download PDF

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TWI722812B
TWI722812B TW109106975A TW109106975A TWI722812B TW I722812 B TWI722812 B TW I722812B TW 109106975 A TW109106975 A TW 109106975A TW 109106975 A TW109106975 A TW 109106975A TW I722812 B TWI722812 B TW I722812B
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Taiwan
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gas
blood pressure
hole
chamber
measurement module
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TW109106975A
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Chinese (zh)
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TW202118444A (en
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莫皓然
林景松
楊文陽
韓永隆
黃啟峰
蔡長諺
李偉銘
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研能科技股份有限公司
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Priority to US17/034,346 priority Critical patent/US11666234B2/en
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Publication of TWI722812B publication Critical patent/TWI722812B/en
Publication of TW202118444A publication Critical patent/TW202118444A/en

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Abstract

A blood pressure measurement module is disclosed and comprises a base, a valve plate, a cover, a miniature pump, a driving circuit board and a pressure sensor. The valve plate is disposed between the base and the cover. The miniature pump is located inside the base. The pressure sensor is disposed on the driving circuit board. An inlet channel of the cover and the pressure sensor are both in communication with an airbag. The miniature pump is driven to pump the airbag, so that the airbag is inflated to press the skin of the user, and the pressure sensor monitors the variety of pressure inside the airbag, thereby to detect the blood pressure of the user.

Description

血壓量測模組Blood pressure measurement module

本案關於一種血壓量測模組,尤指一種極薄型,用以與穿戴式電子裝置或行動裝置結合的血壓量測模組。 This case relates to a blood pressure measurement module, especially an ultra-thin blood pressure measurement module used in combination with wearable electronic devices or mobile devices.

近年來對於個人身體保健的意識逐漸抬頭,因此衍生出希望能夠常態性的對自身的身體狀況進行檢測,但目前對於檢測身體狀況的儀器大多為固定式,幾乎都要去固定的醫療服務站或是醫院,即便有家庭用的檢測儀器,但體積偏大,攜帶不易,於目前講求快速的社會,已經難以符合使用者的需求。 In recent years, the awareness of personal health care has gradually risen. Therefore, it is hoped that the physical condition of oneself can be detected on a regular basis. However, most of the instruments for detecting physical condition are fixed, and almost all people have to go to a fixed medical service station or It is a hospital. Even if it has home-use testing equipment, it is too large and difficult to carry. In the current society that requires fast speed, it is difficult to meet the needs of users.

其中,最能反應身體狀況的非血壓莫屬,每個人的身體中的血管就如同道路般遍佈全身,血壓就如同路況般,能夠了解血液的輸送狀態,因此,身體若發生任何狀況,血壓最清楚。 Among them, the blood pressure that best reflects the physical condition is none other than blood pressure. Everyone’s blood vessels spread all over the body like a road, and blood pressure is like a road. It is able to understand the state of blood transport. Therefore, if any condition occurs in the body, the blood pressure is the most important. clear.

有鑑於此,如何提供一種能夠隨時且精確測量血壓的裝置,並且能夠與穿戴式裝置或是可攜式電子裝置結合,讓使用者能夠隨時隨地、迅速地確認血壓狀況,實乃目前需要解決之問題。 In view of this, how to provide a device that can accurately measure blood pressure at any time, and can be combined with wearable devices or portable electronic devices, so that users can quickly confirm the blood pressure status anytime, anywhere, is the current need to solve problem.

本案之主要目的係提供一種血壓量測模組,用以與可攜式電子裝置或是穿戴式電子裝置結合,方便使用者攜帶,能夠不受時間、地點等限制即可完成血壓量測。 The main purpose of this case is to provide a blood pressure measurement module to be combined with a portable electronic device or a wearable electronic device, which is convenient for users to carry, and can complete blood pressure measurement without time and location restrictions.

本案之一廣義實施態樣為一種血壓量測模組,包括:一基座,具有一閥門承載區、一容置槽區、一進氣孔及一穿置孔,其中該閥門承載區及該容置槽區分別設在不同表面,以及該進氣孔及該穿置孔連通該容置槽區,而該閥門承載區上設有一第一凹置腔,且該第一凹置腔內貫穿設置複數個第一通孔及突伸設置一第一凸出結構,以及該容置槽區內凹設一集氣腔室,連通該些第一通孔;一閥門片,設置承載於該閥門承載區之上,並設有一閥孔,且對應到該第一凸出結構之位置;一頂蓋,設有一進氣通道及一排氣孔,彼此隔開設置,且頂蓋具有一組配表面,封蓋該閥門片,以及在組配表面對應到該進氣通道處凹置一進氣腔室,與該進氣通道連通,以及在組配表面對應到該排氣孔處凹置一排氣腔室,與該排氣孔連通,且該進氣腔室與該排氣腔室之間設有一連通通道連通,以及在該排氣腔內突出設置一第二凸出結構,且該排氣孔位於該第二凸出結構之中心位置,促使該閥門片與該第二凸出結構常態抵頂形成一預力作用,且封閉該排氣孔,又該進氣通道與血壓測量之一氣囊連接;一微型泵,設置於該容置槽區內,而封蓋該集氣腔室;一驅動電路板,封蓋該容置槽區上,提供該微型泵之驅動訊號而控制該微型泵之驅動運作;以及一壓力感測器,設置於該驅動電路板上電性連接,並對應穿置於該基座之該穿置孔,經過該頂蓋與該氣曩連接做氣體壓力偵測;其中,該微型泵受該驅動電路板控制驅動運作,形成一氣體傳輸,讓該基座外部氣體由該進氣孔導入至該容置槽區內,並經過該微型泵持續導入該集氣腔室集中,且氣體得以推動該閥門片之該閥孔與該第一凸出結構脫離抵觸,此時氣體並能經過該閥孔而持續導入該頂蓋之該進氣通道中,聚集至該氣囊中,使該氣 囊充氣膨脹且壓迫使用者的皮膚,透過該壓力感測器檢測使用者的血壓。 A broad implementation aspect of this case is a blood pressure measurement module, including: a base with a valve bearing area, a accommodating groove area, an air inlet and a through hole, wherein the valve bearing area and the The accommodating groove areas are respectively provided on different surfaces, and the air inlet hole and the penetration hole communicate with the accommodating groove area, and the valve bearing area is provided with a first recessed cavity, and the first recessed cavity penetrates A plurality of first through holes are provided and a first protruding structure is arranged protrudingly, and a gas collecting chamber is recessed in the containing groove area to communicate with the first through holes; a valve plate is provided and carried on the valve Above the load-bearing area, there is a valve hole corresponding to the position of the first protruding structure; a top cover is provided with an air inlet channel and an exhaust hole, which are spaced apart from each other, and the top cover has a set of configuration Surface, cover the valve plate, and recess an intake chamber on the assembly surface corresponding to the intake passage, communicate with the intake passage, and recess on the assembly surface corresponding to the exhaust hole. The exhaust chamber is in communication with the exhaust hole, a communication passage is provided between the intake chamber and the exhaust chamber, and a second protruding structure is protrudingly provided in the exhaust chamber, and The vent hole is located at the center of the second protruding structure, so that the valve plate and the second protruding structure normally abut against each other to form a pre-force action, and the vent hole is closed, and the air inlet channel and blood pressure measurement An airbag connection; a micro pump arranged in the accommodating groove area to cover the air collection chamber; a driving circuit board to cover the accommodating groove area to provide the driving signal of the micro pump for control The driving operation of the micro pump; and a pressure sensor, which is arranged on the driving circuit board and electrically connected, and correspondingly penetrates the through hole of the base, and connects with the gas through the top cover to make gas Pressure detection; wherein, the micro pump is controlled and driven by the drive circuit board to form a gas transmission, allowing the outside air of the base to be introduced into the accommodating tank area from the air inlet hole, and continue to be introduced through the micro pump The gas collection chamber is concentrated, and the gas can push the valve hole of the valve plate to disengage from the first protruding structure. At this time, the gas can pass through the valve hole and be continuously introduced into the air inlet channel of the top cover, Gather into the airbag, make the air The bladder inflates and compresses the user's skin, and the user's blood pressure is detected through the pressure sensor.

1:基座 1: pedestal

11:閥門承載區 11: Valve bearing area

11a:第一凹置腔 11a: The first recessed cavity

11b:第一通孔 11b: first through hole

11c:第一凸出結構 11c: The first protruding structure

11d:凸柱 11d: convex column

11e:第二凹置腔 11e: The second recessed cavity

11f:第二通孔 11f: second through hole

12:容置槽區 12: Housing tank area

12a:集氣腔室 12a: Gas collecting chamber

13:進氣孔 13: Air intake

14:穿置孔 14: Piercing holes

15:第一表面 15: first surface

16:第二表面 16: second surface

2:閥門片 2: Valve piece

21:閥孔 21: Valve hole

22:定位穿孔 22: Positioning perforation

3:頂蓋 3: top cover

31:進氣通道 31: intake channel

31a:進氣腔室 31a: intake chamber

32:排氣孔 32: Vent

32a:排氣腔室 32a: exhaust chamber

32b:第二凸出結構 32b: The second protruding structure

33:組配表面 33: assembly surface

34:連通通道 34: Connecting channel

35:定位孔 35: positioning hole

36:共用通道 36: shared channel

36a:連接端 36a: connecting end

4:微型泵 4: Micro pump

41:進氣板 41: intake plate

411:通氣孔 411: Vent

412:匯流排槽 412: Busbar Slot

413:匯流腔室 413: Confluence Chamber

42:共振片 42: Resonance film

421:中空孔 421: Hollow Hole

422:可動部 422: movable part

423:固定部 423: fixed part

43:壓電致動器 43: Piezo Actuator

431:懸浮板 431: Suspended Board

432:外框 432: Outer Frame

433:支架 433: Bracket

434:壓電元件 434: Piezoelectric element

435:空隙 435: gap

436:凸部 436: Convex

44:第一絕緣片 44: The first insulating sheet

45:導電片 45: conductive sheet

46:第二絕緣片 46: second insulating sheet

47:腔室空間 47: Chamber space

4a:微機電泵浦 4a: MEMS pump

41a:第一基板 41a: First substrate

411a:流入孔 411a: Inflow hole

412a:基板第一表面 412a: The first surface of the substrate

413a:基板第二表面 413a: The second surface of the substrate

42a:第一氧化層 42a: first oxide layer

421a:匯流通道 421a: Confluence channel

422a:匯流腔室 422a: Confluence chamber

43a:第二基板 43a: second substrate

431a:矽晶片層 431a: Silicon wafer layer

4311a:致動部 4311a: Actuation Department

4312a:外周部 4312a: Peripheral

4313a:連接部 4313a: connecting part

4314a:流體通道 4314a: fluid channel

432a:第二氧化層 432a: second oxide layer

4321a:振動腔室 4321a: Vibration chamber

433a:矽材層 433a: Silicon layer

4331a:穿孔 4331a: perforation

4332a:振動部 4332a: Vibration Department

4333a:固定部 4333a: Fixed part

4334a:第三表面 4334a: third surface

4335a:第四表面 4335a: fourth surface

44a:壓電組件 44a: Piezoelectric component

441a:下電極層 441a: Lower electrode layer

442a:壓電層 442a: Piezo layer

443a:絕緣層 443a: insulating layer

444a:上電極層 444a: upper electrode layer

5:驅動電路板 5: Drive circuit board

6:壓力感測器 6: Pressure sensor

7:微處理器 7: Microprocessor

8:通訊器 8: Communicator

9:外部裝置 9: External device

10:氣囊 10: Airbag

10a:氣囊導管 10a: Balloon catheter

第1圖為本案血壓量測模組立體示意圖。 Figure 1 is a three-dimensional schematic diagram of the blood pressure measurement module of the present case.

第2A圖為本案血壓量測模組分解示意圖。 Figure 2A is an exploded schematic diagram of the blood pressure measurement module of this case.

第2B圖為本案血壓量測模組其另一角度分解示意圖。 Figure 2B is an exploded schematic diagram of the blood pressure measurement module of the present invention from another perspective.

第3圖為本案血壓量測模組壓力感測器設置於驅動電路板示意圖。 Figure 3 is a schematic diagram of the pressure sensor of the blood pressure measurement module set on the drive circuit board in this case.

第4圖為本案血壓量測模組閥門片設置於基座示意圖。 Figure 4 is a schematic diagram of the valve plate of the blood pressure measurement module set on the base of this case.

第5圖為本案血壓量測模組連接氣囊之示意圖。 Figure 5 is a schematic diagram of the blood pressure measurement module connected to the airbag in this case.

第6A圖為本案氣體偵測模組之微型泵分解示意圖。 Figure 6A is an exploded schematic diagram of the micro pump of the gas detection module in this case.

第6B圖為本案氣體偵測模組之微型泵另一角度的分解示意圖。 Figure 6B is an exploded schematic view of the micro pump of the gas detection module of the present invention from another angle.

第7A圖為本案氣體偵測模組之微型泵的剖面示意圖。 Figure 7A is a schematic cross-sectional view of the micro pump of the gas detection module of the present invention.

第7B圖為本案氣體偵測模組另一實施例的剖面示意圖。 Figure 7B is a schematic cross-sectional view of another embodiment of the gas detection module of the present invention.

第7C圖至第7E圖為微型泵的作動示意圖。 Figures 7C to 7E are schematic diagrams of the operation of the micro pump.

第SA圖為微機電泵浦的剖面示意圖。 Figure SA is a schematic cross-sectional view of the MEMS pump.

第8B圖為微機電泵浦的分解示意圖。 Figure 8B is an exploded schematic diagram of the MEMS pump.

第9A圖至第9C圖為微機電泵浦的作動示意圖。 Figures 9A to 9C are schematic diagrams of the action of the MEMS pump.

第10圖為本案血壓量測模組俯視示意圖。 Figure 10 is a schematic top view of the blood pressure measurement module of this case.

第11圖為第10圖之AA剖面線之剖面示意圖。 Figure 11 is a schematic cross-sectional view taken along the line AA in Figure 10.

第12圖為第10圖之BB剖面線之剖面示意圖。 Figure 12 is a schematic cross-sectional view taken along the line BB of Figure 10.

第13圖為第10圖之CC剖面線之剖面示意圖。 Figure 13 is a schematic cross-sectional view of the CC section line of Figure 10.

第14A圖及第14B圖為本案血壓量測模組的進氣示意圖。 Figures 14A and 14B are schematic diagrams of the air intake of the blood pressure measurement module of the present case.

第15圖為血壓量測模組的洩氣示意圖。 Figure 15 is a schematic diagram of the deflation of the blood pressure measurement module.

第16圖為血壓量測模組另一實施例示意圖。 Figure 16 is a schematic diagram of another embodiment of the blood pressure measurement module.

第17A圖為血壓量測模組另一實施例之頂蓋示意圖。 Figure 17A is a schematic diagram of the top cover of another embodiment of the blood pressure measurement module.

第17B圖為血壓量測模組另一實施例之頂蓋另一角度示意圖。 Fig. 17B is a schematic diagram of another angle of the top cover of another embodiment of the blood pressure measurement module.

第18圖為血壓量測模組另一實施例之剖面示意圖。 Figure 18 is a schematic cross-sectional view of another embodiment of the blood pressure measurement module.

第19圖為血壓量測模組另一實施例的進氣示意圖。 Figure 19 is a schematic diagram of the air intake of another embodiment of the blood pressure measurement module.

第20圖為血壓量測模組另一實施例的洩氣示意圖。 Figure 20 is a schematic diagram of another embodiment of the blood pressure measurement module for deflation.

第21圖為血壓量測模組連接外部裝置示意圖。 Figure 21 is a schematic diagram of the blood pressure measurement module connected to an external device.

體現本案特徵與優點的一些典型實施例將在後段的說明中詳細敘述。應理解的是本案能夠在不同的態樣上具有各種的變化,其皆不脫離本案的範圍,且其中的說明及圖示在本質上當作說明之用,而非用以限制本案。 Some typical embodiments embodying the features and advantages of this case will be described in detail in the following description. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of the case, and the descriptions and diagrams therein are essentially for illustrative purposes, rather than limiting the case.

請參閱第1A圖至第2B圖所示,本案提供一種血壓量測模組,包含一基座1、一閥門片2、一頂蓋3、一微型泵4、一驅動電路板5及一壓力感測器6。 Please refer to Figures 1A to 2B. This case provides a blood pressure measurement module, including a base 1, a valve plate 2, a top cover 3, a micro pump 4, a driving circuit board 5 and a pressure Sensor 6.

基座1包含有一閥門承載區11、一容置槽區12、一進氣孔13、一穿置孔14、一第一表面15及一第二表面16,第一表面15與第二表面16分別為相對的二表面,閥門承載區11位於第一表面15,容置槽區12位於第二表面16,進氣孔13及穿置孔14分別自第一表面15貫穿至第二表面16且連通於容置槽區12,其中,第一閥門承載區11具有一第一凹置腔11a、複數個第一通孔11b、一第一凸出結構11c及複數個凸柱11d,第一凹置腔11a自閥門承載區11凹陷形成,於第一凹置腔11a中心突伸設置第一凸出結構11c,該些第一通孔11b圍繞第一凸出結構11c且貫穿至容置槽區12,凸柱11d則是分別鄰設於閥門承載區11的角落,此外,容置槽區12凹設一集氣腔室12a,集氣腔室12a與該些第一通孔11b相連通。 The base 1 includes a valve bearing area 11, a receiving groove area 12, an air inlet 13, a through hole 14, a first surface 15 and a second surface 16, the first surface 15 and the second surface 16 They are two opposite surfaces, the valve bearing area 11 is located on the first surface 15, the containing groove area 12 is located on the second surface 16, the air inlet 13 and the penetration hole 14 respectively penetrate from the first surface 15 to the second surface 16 and Connected to the accommodating groove area 12, wherein the first valve bearing area 11 has a first recessed cavity 11a, a plurality of first through holes 11b, a first protruding structure 11c, and a plurality of protruding pillars 11d. The cavity 11a is formed recessed from the valve bearing area 11, and a first protruding structure 11c is protrudingly provided in the center of the first recessed cavity 11a, and the first through holes 11b surround the first protruding structure 11c and penetrate to the accommodating groove area 12. The protruding posts 11d are respectively adjacent to the corners of the valve bearing area 11. In addition, the receiving groove area 12 is recessed with a gas collecting chamber 12a, and the gas collecting chamber 12a is communicated with the first through holes 11b.

此外,閥門承載區11更包含一第二凹置腔11e,第二凹置腔11e與第一凹置腔11a間隔設置,且第二凹置腔11e貫穿至少一第二通孔11f,使第二凹置腔11e通過第二通孔11f與集氣腔室12a相連通,增加集氣腔室12a與閥門承載區11的通道,以加速集氣腔室12a內的氣體至閥門承載區11的速度。 In addition, the valve bearing area 11 further includes a second recessed cavity 11e, the second recessed cavity 11e is spaced apart from the first recessed cavity 11a, and the second recessed cavity 11e penetrates at least one second through hole 11f, so that the second recessed cavity 11e is spaced apart from the first recessed cavity 11a. The two recessed cavities 11e are connected to the gas collecting chamber 12a through the second through hole 11f, and the passage between the gas collecting chamber 12a and the valve bearing area 11 is increased to accelerate the gas in the gas collecting chamber 12a to the valve bearing area 11 speed.

請參閱第2A圖及第4圖,閥門片2設置於閥門承載區11,閥門片2具有一閥孔21及複數個定位穿孔22,閥孔21與閥門承載區11的第一凸出結構11c垂直對應,該些定位穿孔22則分別與該些凸柱11d對應且套設於該些凸柱11d。 Please refer to Figures 2A and 4, the valve plate 2 is arranged in the valve bearing area 11, the valve plate 2 has a valve hole 21 and a plurality of positioning perforations 22, the valve hole 21 and the first protruding structure 11c of the valve bearing area 11 Corresponding vertically, the positioning holes 22 respectively correspond to the protrusions 11d and are sleeved on the protrusions 11d.

如第17A圖及第17B圖所示,頂蓋3具有一進氣通道31、一排氣孔32、一組配表面33、一連通通道34及複數個定位孔35,進氣通道31與排氣孔32間隔設置,組配表面33封蓋於閥門片2,且組配表面33於進氣通道31周緣凹置與進氣通道31相連通之一進氣腔室31a、於排氣孔32周緣凹置與排氣孔32相通之排氣腔室32a、及進氣腔室31a與排氣腔室32a之間凹設連通通道34,使進氣腔室31a與排氣腔室32a連通。此外,於排氣腔室32a及排氣孔32邊緣處突出設置一第二凸出結構32b;請參閱第12圖,閥門片2承載於閥門承載區11上,並夾置於基座1與頂蓋3之間定位不偏移,此時,排氣孔32位於第二凸出結構32b的中心位置,第二凸出結構32b將頂抵閥門片2並封閉排氣孔32,於常態下形成一預力作用。 As shown in Figures 17A and 17B, the top cover 3 has an intake passage 31, an exhaust hole 32, a set of matching surfaces 33, a communication passage 34 and a plurality of positioning holes 35, the intake passage 31 and the row The air holes 32 are arranged at intervals, the assembling surface 33 is covered on the valve plate 2, and the assembling surface 33 is recessed on the periphery of the air inlet passage 31, an air inlet chamber 31a communicating with the air inlet passage 31, and an air inlet chamber 31a in the air outlet 32 The exhaust chamber 32a communicating with the exhaust hole 32 is recessed on the periphery, and a communicating passage 34 is recessed between the intake chamber 31a and the exhaust chamber 32a to connect the intake chamber 31a and the exhaust chamber 32a. In addition, a second protruding structure 32b is protrudingly provided at the edge of the exhaust chamber 32a and the exhaust hole 32; please refer to Figure 12, the valve plate 2 is carried on the valve carrying area 11 and sandwiched between the base 1 and The positioning between the top covers 3 is not offset. At this time, the vent hole 32 is located at the center of the second protruding structure 32b. The second protruding structure 32b will press against the valve plate 2 and close the vent hole 32. Under normal conditions, Form a pre-force effect.

請參閱第2A圖、第2B圖及第11圖所示,該些定位孔35分別位於組配表面33的四個角落並分別與閥門承載區11的該些凸柱11d對應,並供該些凸柱11d套置其中。 Please refer to Fig. 2A, Fig. 2B and Fig. 11, the positioning holes 35 are respectively located at the four corners of the assembly surface 33 and correspond to the protruding posts 11d of the valve bearing area 11, and are provided for The convex post 11d is sleeved therein.

請參閱第2B圖及第5圖,頂蓋3亦包含有一共用通道36,共用通道36與進氣通道31連通並構成一體,共用通道36的一端延伸至壓力感測器6並 且封蓋壓力感測器6(如第13圖所示),另一端則為連接端36a(如第10圖所示),用以氣囊10連接,促使壓力感測器6透過共用通道36連通氣囊10做氣體壓力偵測,以進一步做血壓測量。 Please refer to Figures 2B and 5, the top cover 3 also includes a common channel 36, the common channel 36 communicates with the air inlet channel 31 and is integrated, and one end of the common channel 36 extends to the pressure sensor 6 and And the pressure sensor 6 is covered (as shown in Figure 13), and the other end is a connecting end 36a (as shown in Figure 10), which is connected to the airbag 10 to promote the pressure sensor 6 to communicate through the common channel 36 The airbag 10 performs gas pressure detection for further blood pressure measurement.

請繼續參閱第2B圖,微型泵4設置於容置槽區12內,且封蓋集氣腔室12a,而驅動電路板5封蓋容置槽區12上,驅動電路板5電性連接微型泵4,以提供微型泵4驅動訊號以控制微型泵4的驅動及運作。此外,壓力感測器6電性連接於驅動電路板5上,且對應穿置於基座1的穿置孔14,壓力感測器6之一端穿伸經過頂蓋3,且與該氣囊10連接(如第5圖所示)。 Please continue to refer to FIG. 2B. The micro pump 4 is disposed in the accommodating groove area 12 and covers the gas collecting chamber 12a, and the driving circuit board 5 covers the accommodating groove area 12, and the driving circuit board 5 is electrically connected to the micro The pump 4 provides a driving signal of the micro pump 4 to control the driving and operation of the micro pump 4. In addition, the pressure sensor 6 is electrically connected to the driving circuit board 5, and correspondingly penetrates the through hole 14 of the base 1, and one end of the pressure sensor 6 penetrates through the top cover 3 and is connected to the airbag 10 Connect (as shown in Figure 5).

請參閱第6A圖及第6B圖,微型泵4包含有包括一進氣板41、一共振片42、一壓電致動器43、一第一絕緣片44、一導電片45及第二絕緣片46等結構,其中壓電致動器43對應於共振片42而設置,並使進氣板41、共振片42、壓電致動器43、第一絕緣片44、導電片45及第二絕緣片46等依序堆疊設置。 Please refer to FIGS. 6A and 6B. The micro pump 4 includes an air inlet plate 41, a resonance sheet 42, a piezoelectric actuator 43, a first insulating sheet 44, a conductive sheet 45, and a second insulating sheet. The structure of the sheet 46 and the like, in which the piezoelectric actuator 43 is arranged corresponding to the resonant sheet 42, and the intake plate 41, the resonant sheet 42, the piezoelectric actuator 43, the first insulating sheet 44, the conductive sheet 45 and the second The insulating sheet 46 and the like are stacked in sequence.

進氣板41具有至少一通氣孔411、至少一匯流排槽412及一匯流腔室413,於本實施例中,通氣孔411之數量以4個為較佳,但不以此為限。通氣孔411係貫穿進氣板41,用以供氣體順應大氣壓力之作用而自通氣孔411流入微型泵4內。進氣板41上具有至少一匯流排槽412,其數量與位置與進氣板41另一表面之通氣孔411對應設置,本實施例之通氣孔411其數量為4個,與其對應之匯流排槽412其數量亦為4個;匯流腔室413位於進氣板41的中心處,前述之4個匯流排槽412的一端連通於對應之通氣孔411,其另一端則連通於進氣板41的中心處之匯流腔室413,藉此可將自通氣孔411進入匯流排槽412之氣體引導並匯流集中至匯流腔室413。於本實施例中,進氣板41具有一體成型的通氣孔411、匯流排槽412及匯流腔室413。 The air inlet plate 41 has at least one vent hole 411, at least one busbar groove 412, and a confluence chamber 413. In this embodiment, the number of vent holes 411 is preferably four, but is not limited thereto. The vent hole 411 penetrates the air inlet plate 41 to allow gas to flow into the micropump 4 from the vent hole 411 under the action of atmospheric pressure. The air inlet plate 41 has at least one busbar groove 412, the number and position of which correspond to the air holes 411 on the other surface of the air inlet plate 41. The number of air holes 411 in this embodiment is 4, which corresponds to the busbar The number of grooves 412 is also four; the confluence chamber 413 is located at the center of the air inlet plate 41, one end of the aforementioned four busbar grooves 412 is connected to the corresponding vent hole 411, and the other end is connected to the air inlet plate 41 The confluence chamber 413 at the center of the vent hole 411 can guide the gas entering the confluence groove 412 from the vent 411 and converge and concentrate to the confluence chamber 413. In this embodiment, the air intake plate 41 has a vent hole 411, a bus bar groove 412 and a bus chamber 413 that are integrally formed.

於一些實施例中,進氣板41之材質可為不鏽鋼材質所構成,但不以此為限。於另一些實施例中,匯流腔室413之深度與匯流排槽412之深度相同,但不以此為限。 In some embodiments, the material of the air intake plate 41 can be made of stainless steel, but it is not limited to this. In other embodiments, the depth of the bus chamber 413 is the same as the depth of the bus groove 412, but it is not limited thereto.

共振片42係由一可撓性材質所構成,但不以此為限,且於共振片42上具有一中空孔421,係對應於進氣板41之匯流腔室413而設置,供氣體通過。於另一些實施例中,共振片42係可由一銅材質所構成,但不以此為限。 The resonant plate 42 is made of a flexible material, but not limited to this, and there is a hollow hole 421 on the resonant plate 42 corresponding to the confluence chamber 413 of the inlet plate 41 and is provided for the gas to pass through . In other embodiments, the resonant sheet 42 may be made of a copper material, but it is not limited to this.

壓電致動器43係由一懸浮板431、一外框432、至少一支架433以及一壓電元件434所共同組裝而成;懸浮板431為一正方形型態,並可彎曲振動,外框432環繞懸浮板431設置,至少一支架433連接於懸浮板431與外框432之間,提供彈性支撐的效果,壓電元件434亦為正方形型態,貼附於懸浮板431的一表面,用以施加電壓產生形變以驅動懸浮板431彎曲振動,且壓電元件434的邊長小於或等於懸浮板431的邊長;其中,懸浮板431、外框432及支架433之間具有複數個空隙435,空隙435供氣體通過;此外,壓電致動器43更包含一凸部436,凸部436設置於懸浮板431的另一表面,並與壓電元件434相對設置於懸浮板431的兩表面。 The piezoelectric actuator 43 is assembled by a suspension plate 431, an outer frame 432, at least one bracket 433, and a piezoelectric element 434; the suspension plate 431 has a square shape and can be bent and vibrated. 432 is arranged around the suspension plate 431. At least one bracket 433 is connected between the suspension plate 431 and the outer frame 432 to provide elastic support. The piezoelectric element 434 is also in a square shape and is attached to a surface of the suspension plate 431. Deformation is generated by an applied voltage to drive the suspension plate 431 to bend and vibrate, and the side length of the piezoelectric element 434 is less than or equal to the side length of the suspension plate 431; wherein there are a plurality of gaps 435 between the suspension plate 431, the outer frame 432 and the bracket 433 , The gap 435 is for air to pass through; in addition, the piezoelectric actuator 43 further includes a protrusion 436, which is disposed on the other surface of the suspension plate 431, and is disposed on both surfaces of the suspension plate 431 opposite to the piezoelectric element 434 .

如第7A圖所示,進氣板41、共振片42、壓電致動器43、第一絕緣片44、導電片45、第二絕緣片46依序推疊設置,壓電致動器43的懸浮板431其厚度小於外框432的厚度,當共振片42堆疊於壓電致動器43時,壓電致動器43的懸浮板431、外框432與共振片42之間可形成一腔室空間47。 As shown in Figure 7A, the air intake plate 41, the resonant sheet 42, the piezoelectric actuator 43, the first insulating sheet 44, the conductive sheet 45, and the second insulating sheet 46 are stacked in sequence, and the piezoelectric actuator 43 The thickness of the floating plate 431 is less than the thickness of the outer frame 432. When the resonant sheet 42 is stacked on the piezoelectric actuator 43, a gap can be formed between the floating plate 431, the outer frame 432, and the resonant sheet 42 of the piezoelectric actuator 43. Chamber space 47.

請再參閱第7B圖,第7B圖為微型泵4的另一實施例,其元件與前一實施例(第6A圖)相同,故不加以贅述,其差異在於,於未作動時,其壓電致動器43的懸浮板431以沖壓方式以遠離共振片42的方向延伸,並未與 外框432位於同一水平,其延伸距離可由支架433所調整,且支架433與懸浮板431之間呈現非平行,使得壓電致動器43呈凸出狀。 Please refer to Figure 7B again. Figure 7B shows another embodiment of the micropump 4. Its components are the same as those of the previous embodiment (Figure 6A). The suspension plate 431 of the electric actuator 43 extends in a direction away from the resonant plate 42 in a stamping manner, and is not connected The outer frame 432 is located at the same level, and its extension distance can be adjusted by the bracket 433, and the bracket 433 and the suspension plate 431 are non-parallel, so that the piezoelectric actuator 43 is convex.

為了瞭解上述微型泵4提供氣體傳輸之輸出作動方式,請繼續參閱第7C圖至第7E圖所示,請先參閱第7C圖,壓電致動器43的壓電元件434被施加驅動電壓後產生形變帶動懸浮板431向上位移,此時腔室空間47的容積提升,於腔室空間47內形成了負壓,便汲取匯流腔室413內的氣體進入腔室空間47內,同時共振片42受到共振原理的影響被同步向上帶動,連帶增加了匯流腔室413的容積,且因匯流腔室413內的氣體進入腔室空間47的關係,造成匯流腔室413內同樣為負壓狀態,進而通過通氣孔411及匯流排槽412來吸取氣體進入匯流腔室413內。請再參閱第7D圖,壓電元件434帶動懸浮板431向下位移,壓縮腔室空間47,同樣的,共振片42被懸浮板431因共振而向下位移,同步推擠腔室空間47內的氣體往下通過空隙435向上輸送,將氣體由微型泵4排出。最後請參閱第7E圖,當懸浮板431回復原位時,共振片42仍因慣性而向下位移,此時的共振片42將使壓縮腔室空間47內的氣體向空隙435移動,並且提升匯流腔室413內的容積,讓氣體能夠持續地通過通氣孔411、匯流排槽412來匯聚於匯流腔室413內,透過不斷地重複上述第7C圖至第7E圖所示之微型泵提供氣體傳輸作動步驟,使微型泵能夠使氣體連續自通氣孔411進入進氣板41及共振片42所構成流道產生壓力梯度,再由空隙435向上輸送,使氣體高速流動,達到微型泵4傳輸氣體的效果。 In order to understand the above-mentioned micropump 4 to provide gas transmission output operation mode, please continue to refer to Figure 7C to Figure 7E, please refer to Figure 7C first, after the piezoelectric element 434 of the piezoelectric actuator 43 is applied with a driving voltage The deformation causes the suspension plate 431 to move upwards. At this time, the volume of the chamber space 47 increases, and a negative pressure is formed in the chamber space 47. The gas in the confluence chamber 413 is drawn into the chamber space 47, and the resonance plate 42 Affected by the resonance principle, it is simultaneously driven upwards, which increases the volume of the confluence chamber 413, and because the gas in the confluence chamber 413 enters the chamber space 47, the confluence chamber 413 is also in a negative pressure state. The gas is sucked into the confluence chamber 413 through the vent hole 411 and the bus bar groove 412. Please refer to Fig. 7D again. The piezoelectric element 434 drives the suspension plate 431 to move downward, compressing the chamber space 47. Similarly, the resonant plate 42 is displaced downward by the suspension plate 431 due to resonance, and simultaneously pushes into the chamber space 47. The gas is transported downward through the gap 435 and upward, and the gas is discharged by the micro pump 4. Finally, please refer to Figure 7E. When the suspension plate 431 returns to its original position, the resonance plate 42 is still displaced downward due to inertia. At this time, the resonance plate 42 will cause the gas in the compression chamber space 47 to move to the gap 435 and lift. The volume in the confluence chamber 413 allows the gas to continuously pass through the vent 411 and the confluence groove 412 to converge in the confluence chamber 413, and the gas can be supplied by continuously repeating the micro pumps shown in Figures 7C to 7E above The transmission actuation step enables the micropump to continuously enter the gas from the vent 411 into the flow path formed by the inlet plate 41 and the resonance plate 42 to generate a pressure gradient, and then transport it upward through the gap 435, so that the gas flows at a high speed to reach the micropump 4 for gas transmission. Effect.

本案的微型泵4的另一實施例可為一微機電泵浦4a,請參閱第8A圖及第8B圖,微機電泵浦4a包含有一第一基板41a、一第一氧化層42a、一第二基板43a以及一壓電組件44a。本實施例的微機電泵浦4a是透過半導體 製程中的磊晶、沉積、微影及蝕刻等製程一體成型製出,理應無法拆解,為了詳述其內部結構,特以第8B圖所示之分解圖詳述之。 Another embodiment of the micropump 4 in this case can be a microelectromechanical pump 4a. Please refer to FIGS. 8A and 8B. The microelectromechanical pump 4a includes a first substrate 41a, a first oxide layer 42a, and a first substrate 41a. Two substrates 43a and a piezoelectric component 44a. The MEMS pump 4a of this embodiment is through semiconductor The epitaxy, deposition, lithography, and etching processes in the process are integrally formed, which should not be disassembled. In order to detail the internal structure, the exploded view shown in Figure 8B is used to describe it in detail.

第一基板41a為一矽晶片(Si wafer),其厚度介於150至400微米(μm)之間,第一基板41a具有複數個流入孔411a、一基板第一表面412a最後如一基板第二表面413a,於本實施例中,該些流入孔411a的數量為4個,但不以此為限,且每個流入孔411a皆由第二表面413a貫穿至基板第一表面412a,而流入孔411a為了提升流入效果,將流入孔411a自第二表面413a至基板第一表面412a呈現漸縮的錐形。 The first substrate 41a is a silicon wafer (Si wafer) with a thickness ranging from 150 to 400 microns (μm). The first substrate 41a has a plurality of inflow holes 411a, and a first surface 412a of a substrate is finally a second surface of a substrate. 413a. In this embodiment, the number of the inflow holes 411a is four, but it is not limited to this, and each inflow hole 411a penetrates from the second surface 413a to the first surface 412a of the substrate, and the inflow hole 411a In order to improve the inflow effect, the inflow hole 411a is tapered from the second surface 413a to the first surface 412a of the substrate.

第一氧化層42a為一二氧化矽(SiO2)薄膜,其厚度介於10至20微米(μm)之間,第一氧化層42a疊設於第一基板41a的基板第一表面412a上,第一氧化層42a具有複數個匯流通道421a以及一匯流腔室422a,匯流通道421a與第一基板41a的流入孔411a其數量及位置相互對應。於本實施例中,匯流通道421a的數量同樣為4個,4個匯流通道421a的一端分別連通至第一基板41a的4個流入孔411a,而4個匯流通道421a的另一端則連通於匯流腔室422a,讓氣體分別由流入孔411a進入之後,通過其對應相連之匯流通道421a後匯聚至匯流腔室422a內。 The first oxide layer 42a is a silicon dioxide (SiO2) film with a thickness between 10 and 20 microns (μm). The first oxide layer 42a is laminated on the first surface 412a of the first substrate 41a. The oxide layer 42a has a plurality of bus channels 421a and a bus chamber 422a, and the number and positions of the bus channels 421a and the inflow holes 411a of the first substrate 41a correspond to each other. In this embodiment, the number of the confluence channels 421a is also four. One ends of the four confluence channels 421a are respectively connected to the four inflow holes 411a of the first substrate 41a, and the other ends of the four confluence channels 421a are connected to the confluence. In the chamber 422a, after allowing the gas to enter through the inflow holes 411a, the gas flows through the corresponding confluence channel 421a and then converges into the confluence chamber 422a.

第二基板43a為一絕緣層上覆矽之矽晶片(SOI wafer),包含有:一矽晶片層431a、一第二氧化層432a以及一矽材層433a。矽晶片層431a的厚度介於10至20微米(μm)之間,具有一致動部4311a、一外周部4312a、複數個連接部4313a以及複數個流體通道4314a,致動部4311a呈圓形。外周部4312a呈中空環狀,環繞於致動部4311a的外圍。複數個連接部4313a分別位於致動部4311a與外周部4312a之間,並且連接兩者,提供彈性支撐的功能。複數個流體通道4314a環繞形成於致動部2311a的外圍,且分別位於複數個連接部4313a之間。 The second substrate 43a is a silicon-on-insulating silicon wafer (SOI wafer), which includes a silicon wafer layer 431a, a second oxide layer 432a, and a silicon material layer 433a. The thickness of the silicon wafer layer 431a is between 10 and 20 microns (μm), and has an actuating portion 4311a, an outer peripheral portion 4312a, a plurality of connecting portions 4313a, and a plurality of fluid channels 4314a. The actuating portion 4311a is circular. The outer peripheral portion 4312a has a hollow ring shape and surrounds the periphery of the actuating portion 4311a. A plurality of connecting portions 4313a are respectively located between the actuating portion 4311a and the outer peripheral portion 4312a, and connect the two to provide the function of elastic support. A plurality of fluid channels 4314a are formed around the periphery of the actuating portion 2311a, and are respectively located between the plurality of connecting portions 4313a.

第二氧化層432a為一氧化矽層其厚度介於0.5至2微米(μm)之間,形成於矽晶片層431a上,呈中空環狀,並與矽晶片層431a定義一振動腔室4321a。矽材層433a呈圓形,位於第二氧化層432a且結合至第一氧化層42a,矽材層433a為二氧化矽(SiO2)薄膜,厚度介於2至5微米(μm)之間,具有一穿孔4331a、一振動部4332a、一固定部4333a、一第三表面4334a及一第四表面4335a。穿孔4331a形成於矽材層433a的中心,振動部4332a位於穿孔4331a的周邊區域,且垂直對應於振動腔室4321a,固定部4333a則為矽材層433a的周緣區域,由固定部4333a固定於第二氧化層432a,第三表面4334a與第二氧化層432a接合,第四表面4335a與第一氧化層42a接合;壓電組件44a疊設於矽晶片層431a的致動部4311a。 The second oxide layer 432a is a silicon oxide layer with a thickness ranging from 0.5 to 2 micrometers (μm). It is formed on the silicon wafer layer 431a in a hollow ring shape and defines a vibration chamber 4321a with the silicon wafer layer 431a. The silicon material layer 433a has a circular shape and is located on the second oxide layer 432a and is bonded to the first oxide layer 42a. The silicon material layer 433a is a silicon dioxide (SiO2) film with a thickness between 2 and 5 microns (μm). A through hole 4331a, a vibrating portion 4332a, a fixing portion 4333a, a third surface 4334a, and a fourth surface 4335a. The through hole 4331a is formed in the center of the silicon material layer 433a, the vibrating part 4332a is located in the peripheral area of the through hole 4331a, and corresponds to the vibration chamber 4321a perpendicularly, and the fixing part 4333a is the peripheral area of the silicon material layer 433a and is fixed to the second part by the fixing part 4333a. The second oxide layer 432a, the third surface 4334a and the second oxide layer 432a are joined, and the fourth surface 4335a is joined to the first oxide layer 42a; the piezoelectric element 44a is stacked on the actuating portion 4311a of the silicon wafer layer 431a.

壓電組件44a呈圓形,包含有下電極層441a、壓電層442a、絕緣層443a及上電極層444a,下電極層441a疊置於矽晶片層431a的致動部4311a,而壓電層442a疊置於下電極層441a,兩者透過其接觸的區域做電性連接,此外,壓電層442a的寬度小於下電極層441a的寬度,使得壓電層442a無法完全遮蔽住下電極層441a,在於壓電層442a的部分區域以及下電極層441a未被壓電層442a所遮蔽的區域上疊置絕緣層443a,最後在於絕緣層443a以及未被絕緣層443a遮蔽的壓電層442a的區域上疊置上電極層444a,讓上電極層444a得以與壓電層442a接觸來電性連接,同時利用絕緣層443a阻隔於上電極層444a及下電極層441a之間,避免兩者直接接觸造成短路。 The piezoelectric element 44a has a circular shape and includes a lower electrode layer 441a, a piezoelectric layer 442a, an insulating layer 443a, and an upper electrode layer 444a. The lower electrode layer 441a is stacked on the actuating portion 4311a of the silicon wafer layer 431a, and the piezoelectric layer 442a is stacked on the lower electrode layer 441a, and the two are electrically connected through the contact area. In addition, the width of the piezoelectric layer 442a is smaller than the width of the lower electrode layer 441a, so that the piezoelectric layer 442a cannot completely cover the lower electrode layer 441a The insulating layer 443a is stacked on a partial area of the piezoelectric layer 442a and the area of the lower electrode layer 441a that is not shielded by the piezoelectric layer 442a, and finally the insulating layer 443a and the area of the piezoelectric layer 442a that is not shielded by the insulating layer 443a The upper electrode layer 444a is stacked on top to allow the upper electrode layer 444a to contact the piezoelectric layer 442a for electrical connection. At the same time, the insulating layer 443a is used to block the upper electrode layer 444a and the lower electrode layer 441a to avoid direct contact between the two and cause short circuits. .

請參考第9A至第9C圖,第9A至9C圖為微機電泵浦4a其作動示意圖。請先參考第9A圖,當壓電組件44a的下電極層441a及上電極層444a接收驅動電路板5所傳遞之驅動電壓及驅動訊號(未圖示)後,將其傳導至壓電層442a,壓電層442a接受驅動電壓及驅動訊號後,因逆壓電效應的影 響開始產生形變,會帶動矽晶片層431a的致動部4311a開始位移,當壓電組件44a帶動致動部4311a向上位移拉開與第二氧化層432a之間的距離,此時,第二氧化層432a的振動腔室4321a的容積將提升,讓振動腔室4321a內形成負壓,用於將第一氧化層42a的匯流腔室422a內的氣體通過穿孔4331a吸入其中。請繼續參閱第9B圖,當致動部4311a受到壓電組件44a的牽引向上位移時,矽材層433a的振動部4332a會因共振原理的影響向上位移,當振動部4332a向上位移時,會壓縮振動腔室4321a的空間並且推動振動腔室4321a內的氣體往矽晶片層431a的流體通道4314a移動,讓氣體能夠通過流體通道4314a向上排出,在振動部4332a向上位移來壓縮振動腔室4321a的同時,匯流腔室422a的容積因振動部4332a位移而提升,其內部形成負壓,將吸取微機電泵浦4a外的氣體由流入孔411a進入其中。最後如第9C圖所示,壓電組件44a帶動矽晶片層431a的致動部4311a向下位移時,將振動腔室4321a的氣體往流體通道4314a推動,並將氣體排出,而矽材層433a的振動部4332a亦受致動部4311a的帶動向下位移,同步壓縮匯流腔室422a的氣體通過穿孔4331a向振動腔室4321a移動,後續再將壓電組件44a帶動致動部4311a向上位移時,其振動腔室4321a的容積會大幅提升,進而有較高的汲取力將氣體吸入振動腔室4321a,再重複以上的動作,以至於透過壓電組件44a持續帶動致動部4311a上下位移且來連動振動部4332a上下位移,透過改變微機電泵浦4a的內部壓力,使其不斷地汲取及排出氣體,藉此以完成微機電泵浦4a的動作。 Please refer to Figures 9A to 9C. Figures 9A to 9C are schematic diagrams of the operation of the microelectromechanical pump 4a. Please refer to FIG. 9A first, when the lower electrode layer 441a and the upper electrode layer 444a of the piezoelectric element 44a receive the driving voltage and the driving signal (not shown) transmitted by the driving circuit board 5, they will be transmitted to the piezoelectric layer 442a After the piezoelectric layer 442a receives the driving voltage and the driving signal, due to the influence of the inverse piezoelectric effect When the sound begins to deform, it will drive the actuating portion 4311a of the silicon wafer layer 431a to start to move. When the piezoelectric element 44a drives the actuating portion 4311a to move upwards to open the distance between the second oxide layer 432a and the second oxide layer 432a. The volume of the vibrating chamber 4321a of the layer 432a will increase, so that a negative pressure is formed in the vibrating chamber 4321a for sucking the gas in the confluence chamber 422a of the first oxide layer 42a through the perforation 4331a. Please continue to refer to Figure 9B. When the actuating portion 4311a is pulled upward by the piezoelectric element 44a, the vibrating portion 4332a of the silicon material layer 433a will move upward due to the principle of resonance. When the vibrating portion 4332a moves upward, it will compress The space of the vibration chamber 4321a and push the gas in the vibration chamber 4321a to move to the fluid channel 4314a of the silicon wafer layer 431a, so that the gas can be discharged upward through the fluid channel 4314a, and the vibration part 4332a moves upward to compress the vibration chamber 4321a. , The volume of the confluence chamber 422a is increased due to the displacement of the vibrating part 4332a, and a negative pressure is formed inside the confluence chamber 422a, which sucks the gas outside the microelectromechanical pump 4a into it through the inflow hole 411a. Finally, as shown in Figure 9C, when the piezoelectric element 44a drives the actuating portion 4311a of the silicon wafer layer 431a to move downward, it pushes the gas in the vibrating chamber 4321a to the fluid channel 4314a and discharges the gas, and the silicon material layer 433a The vibrating portion 4332a is also driven by the actuating portion 4311a to move downward, and the gas in the synchronous compression confluence chamber 422a moves to the vibrating chamber 4321a through the perforation 4331a, and then the piezoelectric component 44a drives the actuating portion 4311a to move upward, The volume of the vibrating chamber 4321a will be greatly increased, and there will be a higher suction force to suck gas into the vibrating chamber 4321a, and then repeat the above actions, so that the piezoelectric component 44a continuously drives the actuating portion 4311a to move up and down and move in conjunction The vibrating part 4332a moves up and down, and by changing the internal pressure of the MEMS pump 4a, it continuously draws and discharges gas, thereby completing the action of the MEMS pump 4a.

請參閱第14A圖所示,微型泵4開始作動,氣體由微型泵4的通氣孔411開始進入,並將氣體持續導送至集氣腔室12a,請參閱第14B圖,氣體持續輸送到集氣腔室12a後,氣體便由第一通孔11b進入第一凹置腔 11a,同時也通過第二通孔11f進入第二凹置腔11e,而進入第一凹置腔11a與第二凹置腔11e的氣體會將閥門片2向上推動,並使其向頂蓋3靠近,此時,閥門片2將頂抵於排氣腔室32a的第二凸出結構32b,且同時封閉排氣孔32,同時閥門片2脫離第一凹置腔11a的第一凸出結構11c,將第二凹置腔11e、第一凹置腔11a的氣體得以通過閥孔21進入進氣腔室31a,而氣體進入進氣腔室31a後,導入進氣通道31,最後匯聚至氣囊10(如第5圖所示)內。於本實施例中,氣體進入進氣通道31後,先通過共用通道36,再進入位於連接端36a的氣囊10,開始對氣囊10充氣使其膨脹,使氣囊10能夠緊貼於測量者,再透過壓力感測器6檢測氣囊10的壓力變化,進行血壓測量的動作。 Please refer to Figure 14A, the micropump 4 starts to operate, the gas starts to enter from the vent 411 of the micropump 4, and the gas is continuously guided to the gas collection chamber 12a. Please refer to Figure 14B, the gas is continuously delivered to the collection chamber 12a. After the gas chamber 12a, the gas enters the first recessed cavity through the first through hole 11b 11a, it also enters the second recessed cavity 11e through the second through hole 11f, and the gas entering the first recessed cavity 11a and the second recessed cavity 11e will push the valve plate 2 upward and move it toward the top cover 3. Approaching, at this time, the valve plate 2 will abut against the second protruding structure 32b of the exhaust chamber 32a, and at the same time, the exhaust hole 32 will be closed, and at the same time the valve plate 2 will be separated from the first protruding structure of the first recessed cavity 11a 11c, the gas in the second recessed cavity 11e and the first recessed cavity 11a can enter the intake chamber 31a through the valve hole 21, and after the gas enters the intake chamber 31a, it is introduced into the intake passage 31, and finally converges to the airbag 10 (as shown in Figure 5). In this embodiment, after the gas enters the intake passage 31, it first passes through the common passage 36, and then enters the airbag 10 at the connecting end 36a, and then starts to inflate and expand the airbag 10 so that the airbag 10 can be close to the subject. The pressure change of the airbag 10 is detected by the pressure sensor 6 to perform blood pressure measurement.

如第15圖所示,血壓測量完畢後,微型泵4停止運作,故氣囊10內的氣壓高於進氣腔室31a的氣壓,氣體開始自氣囊10通過進氣通道31導送至進氣腔室31a,氣體輸送至進氣腔室31a的同時,推動閥門片2向下移動,並使閥孔21被第一凸出結構11c封閉,氣體將通過連通通道34,由進氣腔室31a向排氣腔室32a流動,此外,氣體將閥門片2向下推動時,閥門片2脫離第二凸出結構32b,並被推移靠近掉入第二凹置腔11e內,將排氣腔室32a與排氣孔32連通,氣體進入排氣腔室32a後,得以由排氣孔32排出,釋放氣囊10內的氣體,俾完成該氣囊10之快速洩壓作業。 As shown in Figure 15, after the blood pressure measurement is completed, the micro pump 4 stops operating, so the air pressure in the airbag 10 is higher than the air pressure in the intake chamber 31a, and the air starts to be guided from the airbag 10 to the intake chamber through the intake passage 31 In the chamber 31a, when the gas is delivered to the intake chamber 31a, the valve plate 2 is pushed down, and the valve hole 21 is closed by the first protruding structure 11c. The gas will pass through the communication channel 34 and flow from the intake chamber 31a to The exhaust chamber 32a flows. In addition, when the gas pushes the valve plate 2 downwards, the valve plate 2 separates from the second protruding structure 32b, and is pushed close to fall into the second recessed cavity 11e, and the exhaust chamber 32a It is connected to the exhaust hole 32. After the gas enters the exhaust chamber 32a, it can be discharged from the exhaust hole 32 to release the gas in the airbag 10 to complete the rapid pressure relief operation of the airbag 10.

請參閱第16圖,第16圖係本案血壓量測模組的另一實施方式,本實施方式與前一實施方式大部分元件皆相同,因此不再贅述,差異在於頂蓋3,本實施方式的頂蓋3未設有共用通道36;接著請參閱第18圖,未設有共用通道36的情況下,本實施例的氣囊10具有一氣囊導管10a,氣囊導管10a與氣囊10相連通,並且在連接至頂蓋3的進氣通道31並且罩蓋壓力感測器6,微型泵4開始作動,氣體並開始進入進氣通道31(如第 19圖所示),氣體通過進氣通道31後,經由氣囊導管10a進入氣囊10,使氣囊10開始充氣、膨脹,壓迫使用者的皮膚,並透過壓力感測器6由氣囊導管10a確認氣囊10內的氣壓變化,來檢測使用者的血壓,檢測結束後,微型泵4停止運作,氣體便會由氣囊導管10a導回至進氣通道31,最後由排氣孔32排出(如第20圖所示),達到快速洩氣、洩壓的功效。 Please refer to Figure 16. Figure 16 is another embodiment of the blood pressure measurement module in this case. Most of the components in this embodiment are the same as those in the previous embodiment, so it will not be repeated here. The difference lies in the top cover 3. This embodiment The top cover 3 is not provided with a common channel 36; then refer to Figure 18, in the case where the common channel 36 is not provided, the balloon 10 of this embodiment has a balloon catheter 10a, and the balloon catheter 10a communicates with the balloon 10, and Connected to the intake passage 31 of the top cover 3 and cover the pressure sensor 6, the micro pump 4 starts to act, and the gas begins to enter the intake passage 31 (as in the first 19), after the gas passes through the intake passage 31, it enters the balloon 10 through the balloon catheter 10a, causing the balloon 10 to inflate and expand, compress the user’s skin, and confirm the balloon 10 by the balloon catheter 10a through the pressure sensor 6 The internal air pressure changes to detect the user’s blood pressure. After the detection is over, the micropump 4 stops operating, and the gas is guided back to the intake passage 31 from the balloon catheter 10a, and finally discharged from the exhaust hole 32 (as shown in Figure 20). Show), to achieve the effect of rapid deflation and pressure relief.

最後請再參閱第1圖,本案的血壓量測模組的長度介於4mm至30mm之間,寬度介於2mm至16mm之間,高度介於1mm至8mm之間,使血壓量測模組得以與可攜式電子裝置結合。此外,血壓量測模組為了與智慧型手錶結合,其長度可介於24mm至30mm之間、寬度可介於14mm至16mm之間,厚度可介於6mm至8mm之間。 Finally, please refer to Figure 1. The length of the blood pressure measurement module in this case is between 4mm and 30mm, the width is between 2mm and 16mm, and the height is between 1mm and 8mm, so that the blood pressure measurement module can be Combine with portable electronic devices. In addition, in order to integrate the blood pressure measurement module with a smart watch, its length can be between 24mm and 30mm, the width can be between 14mm and 16mm, and the thickness can be between 6mm and 8mm.

如第21圖所示,血壓量測模組可更包含一微處理器7及一通訊器8,設置於該驅動電路板5上,該微處理器7用以接收該壓力感測器6所量測信號予以運算轉換成一資訊數據,並將該資料數據經過該通訊器通訊傳輸至一外部裝置9予以儲存處理應用,其中該通訊傳輸為一有線傳輸及一無線傳輸之至少其中之一,外部裝置係為一雲端系統、一可攜式裝置、一電腦系統等至少其中之一。 As shown in Fig. 21, the blood pressure measurement module may further include a microprocessor 7 and a communicator 8, which are disposed on the driving circuit board 5. The microprocessor 7 is used to receive the pressure sensor 6 The measurement signal is calculated and converted into information data, and the data data is communicated through the communicator and transmitted to an external device 9 for storage and processing application. The communication transmission is at least one of a wired transmission and a wireless transmission. The device is at least one of a cloud system, a portable device, and a computer system.

綜上所述,本案所提供之血壓量測模組座經由基座、閥門片及頂蓋的設置,能夠達到對氣囊快速排氣與快速進氣的效果,並且透過微型泵大幅縮小泵浦的體積,使血壓量測模組能夠設置於智慧型手表等穿戴式裝置上,極具產業利用性及進步性。 To sum up, the blood pressure measurement module seat provided in this case can achieve the effect of rapid exhaust and rapid air intake of the airbag through the base, valve plate and top cover, and the micro-pump can greatly reduce the pumping capacity. The volume allows the blood pressure measurement module to be installed on wearable devices such as smart watches, which is highly industrially usable and progressive.

1:基座 1: pedestal

3:頂蓋 3: top cover

5:驅動電路板 5: Drive circuit board

Claims (18)

一種血壓量測模組,包括: 一基座,具有一閥門承載區、一容置槽區、一進氣孔及一穿置孔,其中該閥門承載區及該容置槽區分別設在不同表面,以及該進氣孔及該穿置孔連通該容置槽區,而該閥門承載區上設有一第一凹置腔,且該第一凹置腔內貫穿設置複數個第一通孔及突伸設置一第一凸出結構,以及該容置槽區內凹設一集氣腔室,連通該些第一通孔; 一閥門片,設置承載於該閥門承載區之上,並設有一閥孔,且對應到該第一凸出結構之位置; 一頂蓋,設有一進氣通道及一排氣孔,彼此隔開設置,且該頂蓋具有一組配表面,封蓋該閥門片,以及該組配表面對應到該進氣通道處凹置一進氣腔室,與該進氣通道連通,以及該組配表面對應到該排氣孔處凹置一排氣腔室,與該排氣孔連通,且該進氣腔室與該排氣腔室之間設有一連通通道,以及在該排氣腔室內突出設置一第二凸出結構,且該排氣孔位於該第二凸出結構之中心位置,促使該閥門片與該第二凸出結構常態抵頂形成一預力作用,且封閉該排氣孔,又該進氣通道連接血壓測量之一氣囊; 一微型泵,設置於該容置槽區內,而封蓋該集氣腔室; 一驅動電路板,封蓋該容置槽區上,提供該微型泵之驅動訊號而控制該微型泵之驅動運作;以及 一壓力感測器,設置於該驅動電路板上電性連接,並對應穿置於該基座之該穿置孔,經過該頂蓋與該氣囊連接; 其中,該微型泵受該驅動電路板控制驅動運作,形成一氣體傳輸,讓該基座外部氣體由該進氣孔導入至該容置槽區內,並經過該微型泵持續導入該集氣腔室集中,且氣體得以推動該閥門片之該閥孔與該第一凸出結構脫離抵觸,此時氣體並能經過該閥孔而持續導入該頂蓋之該進氣通道中,聚集至該氣囊中,使該氣囊充氣膨脹且壓迫使用者的皮膚,透過該壓力感測器檢測使用者的血壓。 A blood pressure measurement module includes: A base has a valve bearing area, an accommodating groove area, an air inlet and a through hole, wherein the valve bearing area and the accommodating groove area are respectively provided on different surfaces, and the air inlet and the The through hole communicates with the accommodating groove area, and the valve bearing area is provided with a first recessed cavity, and a plurality of first through holes and a protruding first protruding structure are provided in the first recessed cavity , And a gas collecting chamber is recessed in the accommodating groove area to communicate with the first through holes; A valve plate is arranged and carried on the valve bearing area and is provided with a valve hole corresponding to the position of the first protruding structure; A top cover is provided with an intake passage and an exhaust hole, which are separated from each other, and the top cover has a set of matching surfaces to cover the valve plate, and the matching surface corresponds to the recess at the intake passage An intake chamber communicates with the intake passage, and the assembly surface corresponds to the exhaust hole where an exhaust chamber is recessed, communicates with the exhaust hole, and the intake chamber and the exhaust A communication passage is provided between the chambers, and a second protruding structure is protrudingly provided in the exhaust chamber, and the exhaust hole is located at the center of the second protruding structure to promote the valve plate and the second protruding structure. The protruding structure normally pushes against the top to form a pre-force effect, and closes the exhaust hole, and the air intake channel is connected to an airbag for blood pressure measurement; A micro pump is arranged in the accommodating groove area to cover the gas collection chamber; A driving circuit board, covering the accommodating groove area, providing the driving signal of the micro pump to control the driving operation of the micro pump; and A pressure sensor arranged on the driving circuit board for electrical connection, corresponding to the penetration hole of the base, and connected to the airbag through the top cover; Wherein, the micro pump is driven and operated under the control of the driving circuit board to form a gas transmission, allowing the outside air of the base to be introduced into the accommodating groove area from the air inlet, and continuously introduced into the gas collecting cavity through the micro pump The chamber is concentrated, and the gas can push the valve hole of the valve plate to disengage from the first protruding structure. At this time, the gas can pass through the valve hole and be continuously introduced into the air inlet channel of the top cover, and is collected into the airbag In the process, the airbag is inflated and compressed and the user's skin is compressed, and the user's blood pressure is detected through the pressure sensor. 如請求項1所述之血壓量測模組,其中該基座之該閥門承載區上更包含有複數個凸柱,而該閥門片對應複數個該凸柱位置各設有一定位穿孔,供以對應套置於該閥門承載區之該凸柱上,讓該閥門片承載於該閥門承載區之上定位不偏移,確保該閥孔對應到該第一凸出結構之位置。The blood pressure measurement module according to claim 1, wherein the valve bearing area of the base further includes a plurality of protrusions, and the valve plate is provided with a positioning hole corresponding to the positions of the plurality of protrusions, for The corresponding sleeve is placed on the protruding column of the valve bearing area, so that the valve plate is supported on the valve bearing area and positioned without deviation, ensuring that the valve hole corresponds to the position of the first protruding structure. 如請求項2所述之血壓量測模組,其中該頂蓋之該組配表面上更對應複數個該凸柱位置各設有一定位孔,供以對應套置於該閥門承載區之該凸柱上,讓該閥門片承載於該閥門承載區之上,並夾置於該基座與該頂蓋之間定位不偏移。The blood pressure measurement module according to claim 2, wherein the assembly surface of the top cover is further provided with a positioning hole corresponding to a plurality of the protruding post positions, for corresponding to the protruding hole placed in the valve bearing area On the column, the valve sheet is carried on the valve bearing area, and is clamped between the base and the top cover to be positioned without deviation. 如請求項1所述之血壓量測模組,其中該基座之該閥門承載區上更包含有一第二凹置腔,且該第二凹置腔內貫穿有至少一第二通孔,供與該集氣腔室連通,以加速該集氣腔室聚集氣體導入經過該閥孔,再持續導入該頂蓋之該進氣通道中而聚集至該氣囊中。The blood pressure measurement module according to claim 1, wherein the valve bearing area of the base further includes a second recessed cavity, and at least one second through hole penetrates through the second recessed cavity for It is connected with the gas collection chamber to accelerate the introduction of the gas collected in the gas collection chamber through the valve hole, and then continue to be introduced into the air inlet passage of the top cover to be collected in the airbag. 如請求項4所述之血壓量測模組,當該微型泵停止驅動運作時,該氣囊內聚集氣體之氣體壓力大於該集氣腔室集中之氣體壓力,該氣囊內聚集氣體得由該進氣通道導出,並推動該閥門片之該閥孔與該第一凸出結構保持抵觸,封閉該閥孔,而氣體經過該連通通道而導入至該排氣腔室,同時導入氣體推動該閥門片與該第二凸出結構脫離抵觸,打開該排氣孔,促使該氣囊內聚集氣體由該排氣孔排出於該頂蓋外,俾完成該氣囊之快速洩壓作業。For the blood pressure measurement module described in claim 4, when the micropump stops its driving operation, the gas pressure of the gas collected in the airbag is greater than the gas pressure of the gas collection chamber, and the gas collected in the airbag can be controlled by the inlet The air passage is led out, and pushes the valve hole of the valve plate to keep in conflict with the first protruding structure, and closes the valve hole, and the gas is introduced into the exhaust chamber through the communication passage, and at the same time the gas is introduced to push the valve plate It disengages from the second protruding structure, opens the vent hole, and promotes the gas accumulated in the airbag to be discharged from the top cover through the vent hole, so as to complete the rapid pressure relief operation of the airbag. 如請求項5所述之血壓量測模組,其中實施該氣囊之快速洩壓作業時,該閥門片得以被推移靠近掉入該第二凹置腔內,促使該閥門片與該第二凸出結構脫離後的間距加大,並打開該排氣孔。The blood pressure measurement module according to claim 5, wherein when the rapid pressure relief operation of the airbag is carried out, the valve plate can be pushed close to fall into the second recessed cavity, thereby urging the valve plate and the second convex cavity After the structure is separated, the distance is increased, and the vent hole is opened. 如請求項1所述之血壓量測模組,其中該頂蓋上設有一共用通道,供與該進氣通道連通構成一體,且該共用通道並延伸封蓋該壓力感測器,而該共用通道具有一連接端,供與該氣囊連接,促使該壓力感測器透過該共用通道連通該氣囊做氣體壓力偵測。The blood pressure measurement module according to claim 1, wherein a common channel is provided on the top cover for communicating with the air inlet channel to form an integral body, and the common channel extends and covers the pressure sensor, and the common channel The channel has a connecting end for connecting with the airbag, and urges the pressure sensor to communicate with the airbag through the common channel for gas pressure detection. 如請求項1所述之血壓量測模組,其中更包含一微處理器及一通訊器,設置於該驅動電路板上,該微處理器用以接收該壓力感測器所量測信號予以運算轉換成一資訊數據,並將該資料數據經過該通訊器通訊傳輸至一外部裝置予以儲存、處理及應用。The blood pressure measurement module according to claim 1, which further includes a microprocessor and a communicator, arranged on the driving circuit board, and the microprocessor is used for receiving the signal measured by the pressure sensor for calculation It is converted into information data, and the data data is communicated through the communicator and transmitted to an external device for storage, processing and application. 如請求項8所述之血壓量測模組,其中該通訊傳輸為一有線傳輸及一無線傳輸之至少其中之一。The blood pressure measurement module according to claim 8, wherein the communication transmission is at least one of a wired transmission and a wireless transmission. 如請求項8所述之血壓量測模組,其中該外部裝置係為一雲端系統、一可攜式裝置、一電腦系統等至少其中之一。The blood pressure measurement module according to claim 8, wherein the external device is at least one of a cloud system, a portable device, and a computer system. 如請求項1所述之血壓量測模組,其中該微型泵包含有: 一進氣板,具有至少一通氣孔、對應該通氣孔位置之至少一匯流排槽以及一匯流腔室,該通氣孔用以導入氣體,該匯流排槽用以引導自該通氣孔導入之氣體至該匯流腔室; 一共振片,具有一中空孔,該中空孔對應該匯流腔室的位置,且周圍為一可動部;以及 一壓電致動器,與該共振片在位置上相對應設置; 其中,該進氣板、該共振片以及該壓電致動器係依序堆疊設置,且該共振片與該壓電致動器之間形成一腔室空間,用以使該壓電致動器受驅動時,使氣體由該進氣板之該通氣孔導入,經該匯流排槽匯集至該匯流腔室,再通過該共振片之該中空孔,使得該壓電致動器與該共振片之該可動部產生共振以傳輸氣體。 The blood pressure measurement module according to claim 1, wherein the micro pump includes: An air inlet plate having at least one vent hole, at least one busbar groove corresponding to the position of the vent hole, and a bus chamber, the vent hole is used for introducing gas, and the busbar groove is used for guiding the gas introduced from the vent hole to The confluence chamber; A resonance plate having a hollow hole corresponding to the position of the confluence chamber and a movable part around it; and A piezoelectric actuator, which is arranged corresponding to the position of the resonant sheet; Wherein, the air inlet plate, the resonant sheet, and the piezoelectric actuator are stacked in sequence, and a cavity space is formed between the resonant sheet and the piezoelectric actuator for the piezoelectric actuator When the actuator is driven, the gas is introduced from the vent hole of the inlet plate, collected into the confluence chamber through the bus bar groove, and then passed through the hollow hole of the resonance plate, so that the piezoelectric actuator resonates with the The movable part of the sheet resonates to transmit gas. 如請求項11所述之血壓量測模組,其中,該壓電致動器包括: 一懸浮板,具有一正方形型態,並且可彎曲振動; 一外框,環繞設置於該懸浮板之外側; 至少一支架,連接於該懸浮板與該外框之間,以提供彈性支撐;以及 一壓電元件,具有一邊長,該邊長係小於或等於該懸浮板之一邊長,且該壓電元件貼附於該懸浮板之一表面上,用以接受電壓以驅動該懸浮板彎曲振動。 The blood pressure measurement module according to claim 11, wherein the piezoelectric actuator includes: A suspended board, with a square shape, and can be flexurally vibrated; An outer frame arranged around the outer side of the suspension board; At least one bracket is connected between the suspension board and the outer frame to provide elastic support; and A piezoelectric element has a side length that is less than or equal to the side length of the suspension plate, and the piezoelectric element is attached to a surface of the suspension plate to receive a voltage to drive the suspension plate to flexurally vibrate . 如請求項11所述之血壓量測模組,其中該壓電致動器包含有: 一懸浮板,具有一正方形型態,並且可彎曲振動; 一外框,環繞設置於該懸浮板之外側; 至少一支架,連接於該懸浮板與該外框之間,以彈性支撐該懸浮板,並使該懸浮板之一表面與該外框之一表面形成為非共平面結構,且使該懸浮板之一表面與該共振板保持一腔室空間;以及 一壓電元件具有一邊長,該邊長小於或等於該懸浮板之一懸浮板邊長,且該壓電元件貼附於該懸浮板之一表面上,用以施加電壓以驅動該懸浮板彎曲振動。 The blood pressure measurement module according to claim 11, wherein the piezoelectric actuator includes: A suspended board, with a square shape, and can be flexurally vibrated; An outer frame arranged around the outer side of the suspension board; At least one bracket is connected between the suspension board and the outer frame to elastically support the suspension board, and make a surface of the suspension board and a surface of the outer frame form a non-coplanar structure, and make the suspension board A surface maintains a cavity space with the resonance plate; and A piezoelectric element has a side length that is less than or equal to the side length of a suspension plate of the suspension plate, and the piezoelectric element is attached to a surface of the suspension plate for applying a voltage to drive the suspension plate to bend vibration. 如請求項11所述之血壓量測模組,其中該微型泵進一步包括一第一絕緣片、一導電片以及一第二絕緣片,其中該進氣板、該共振片、該壓電致動器、該第一絕緣片、該導電片及該第二絕緣片係依序堆疊設置。The blood pressure measurement module according to claim 11, wherein the micro pump further includes a first insulating sheet, a conductive sheet, and a second insulating sheet, wherein the air inlet plate, the resonance sheet, and the piezoelectric actuator The device, the first insulating sheet, the conductive sheet and the second insulating sheet are stacked in sequence. 如請求項1所述之血壓量測模組,其中該微型泵為一微機電泵浦,包含有: 一第一基板,具有複數個流入孔,該些流入孔呈錐形; 一第一氧化層,疊設該第一基板,該第一氧化層具有複數個匯流通道以及一匯流腔室,該些匯流通道連通於該匯流腔室及該些流入孔之間; 一第二基板,結合至該第一基板,包含: 一矽晶片層,具有: 一致動部,呈圓形; 一外周部,呈中空環狀,環繞於該致動部的外圍; 複數個連接部,分別連接於該致動部與該外周部之間;以及 複數個流體通道,環繞於該致動部的外圍,且分別位於該些連接部之間; 一第二氧化層,形成於該矽晶片層上,呈中空環狀,並與該矽晶片層定義一振動腔室;以及 一矽材層,呈圓形,位於該第二氧化層且結合至該第一氧化層,具有: 一穿孔,形成於該矽材層的中心; 一振動部,位於該穿孔的周邊區域; 一固定部,位於該矽材層的周緣區域;以及 一壓電組件,呈圓形,疊設於該矽晶片層的該致動部。 The blood pressure measurement module according to claim 1, wherein the micro pump is a micro-electromechanical pump, including: A first substrate having a plurality of inflow holes, the inflow holes are tapered; A first oxide layer on which the first substrate is stacked; the first oxide layer has a plurality of confluence channels and a confluence chamber, and the confluence channels are connected between the confluence chamber and the inflow holes; A second substrate, coupled to the first substrate, includes: A silicon wafer layer with: The actuating part is round; A peripheral part, in a hollow ring shape, surrounding the periphery of the actuating part; A plurality of connecting parts are respectively connected between the actuating part and the outer peripheral part; and A plurality of fluid channels surround the periphery of the actuating portion and are located between the connecting portions; A second oxide layer formed on the silicon wafer layer, in a hollow ring shape, and defining a vibration chamber with the silicon wafer layer; and A silicon material layer, in a circular shape, located on the second oxide layer and bonded to the first oxide layer, has: A through hole formed in the center of the silicon material layer; A vibrating part located in the peripheral area of the perforation; A fixing part located in the peripheral area of the silicon material layer; and A piezoelectric component is circular and is stacked on the actuating part of the silicon wafer layer. 如請求項15所述之血壓量測模組,其中該壓電組件包含有: 一下電極層; 一壓電層,疊置於該下電極層; 一絕緣層,鋪設於該壓電層之部分表面及該下電極層之部分表面;以及 一上電極層,疊置於該絕緣層及該壓電層未設有該絕緣層之其餘表面,用以與該壓電層電性連接。 The blood pressure measurement module according to claim 15, wherein the piezoelectric component includes: Lower electrode layer A piezoelectric layer stacked on the bottom electrode layer; An insulating layer laid on part of the surface of the piezoelectric layer and part of the surface of the lower electrode layer; and An upper electrode layer is stacked on the insulating layer and the remaining surface of the piezoelectric layer without the insulating layer for electrical connection with the piezoelectric layer. 如請求項1所述之血壓量測模組,其長度介於4mm至30mm之間,寬度介於2mm至16mm之間,高度介於1mm至8mm之間。The blood pressure measurement module described in claim 1 has a length between 4mm and 30mm, a width between 2mm and 16mm, and a height between 1mm and 8mm. 如請求項17所述之血壓量測模組,其長度介於24mm至30mm之間、寬度介於14mm至16mm之間,高度介於6mm至8mm之間。The blood pressure measurement module according to claim 17 has a length between 24 mm and 30 mm, a width between 14 mm and 16 mm, and a height between 6 mm and 8 mm.
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