TWI722812B - Blood pressure measurement module - Google Patents
Blood pressure measurement module Download PDFInfo
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- TWI722812B TWI722812B TW109106975A TW109106975A TWI722812B TW I722812 B TWI722812 B TW I722812B TW 109106975 A TW109106975 A TW 109106975A TW 109106975 A TW109106975 A TW 109106975A TW I722812 B TWI722812 B TW I722812B
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Abstract
Description
本案關於一種血壓量測模組,尤指一種極薄型,用以與穿戴式電子裝置或行動裝置結合的血壓量測模組。 This case relates to a blood pressure measurement module, especially an ultra-thin blood pressure measurement module used in combination with wearable electronic devices or mobile devices.
近年來對於個人身體保健的意識逐漸抬頭,因此衍生出希望能夠常態性的對自身的身體狀況進行檢測,但目前對於檢測身體狀況的儀器大多為固定式,幾乎都要去固定的醫療服務站或是醫院,即便有家庭用的檢測儀器,但體積偏大,攜帶不易,於目前講求快速的社會,已經難以符合使用者的需求。 In recent years, the awareness of personal health care has gradually risen. Therefore, it is hoped that the physical condition of oneself can be detected on a regular basis. However, most of the instruments for detecting physical condition are fixed, and almost all people have to go to a fixed medical service station or It is a hospital. Even if it has home-use testing equipment, it is too large and difficult to carry. In the current society that requires fast speed, it is difficult to meet the needs of users.
其中,最能反應身體狀況的非血壓莫屬,每個人的身體中的血管就如同道路般遍佈全身,血壓就如同路況般,能夠了解血液的輸送狀態,因此,身體若發生任何狀況,血壓最清楚。 Among them, the blood pressure that best reflects the physical condition is none other than blood pressure. Everyone’s blood vessels spread all over the body like a road, and blood pressure is like a road. It is able to understand the state of blood transport. Therefore, if any condition occurs in the body, the blood pressure is the most important. clear.
有鑑於此,如何提供一種能夠隨時且精確測量血壓的裝置,並且能夠與穿戴式裝置或是可攜式電子裝置結合,讓使用者能夠隨時隨地、迅速地確認血壓狀況,實乃目前需要解決之問題。 In view of this, how to provide a device that can accurately measure blood pressure at any time, and can be combined with wearable devices or portable electronic devices, so that users can quickly confirm the blood pressure status anytime, anywhere, is the current need to solve problem.
本案之主要目的係提供一種血壓量測模組,用以與可攜式電子裝置或是穿戴式電子裝置結合,方便使用者攜帶,能夠不受時間、地點等限制即可完成血壓量測。 The main purpose of this case is to provide a blood pressure measurement module to be combined with a portable electronic device or a wearable electronic device, which is convenient for users to carry, and can complete blood pressure measurement without time and location restrictions.
本案之一廣義實施態樣為一種血壓量測模組,包括:一基座,具有一閥門承載區、一容置槽區、一進氣孔及一穿置孔,其中該閥門承載區及該容置槽區分別設在不同表面,以及該進氣孔及該穿置孔連通該容置槽區,而該閥門承載區上設有一第一凹置腔,且該第一凹置腔內貫穿設置複數個第一通孔及突伸設置一第一凸出結構,以及該容置槽區內凹設一集氣腔室,連通該些第一通孔;一閥門片,設置承載於該閥門承載區之上,並設有一閥孔,且對應到該第一凸出結構之位置;一頂蓋,設有一進氣通道及一排氣孔,彼此隔開設置,且頂蓋具有一組配表面,封蓋該閥門片,以及在組配表面對應到該進氣通道處凹置一進氣腔室,與該進氣通道連通,以及在組配表面對應到該排氣孔處凹置一排氣腔室,與該排氣孔連通,且該進氣腔室與該排氣腔室之間設有一連通通道連通,以及在該排氣腔內突出設置一第二凸出結構,且該排氣孔位於該第二凸出結構之中心位置,促使該閥門片與該第二凸出結構常態抵頂形成一預力作用,且封閉該排氣孔,又該進氣通道與血壓測量之一氣囊連接;一微型泵,設置於該容置槽區內,而封蓋該集氣腔室;一驅動電路板,封蓋該容置槽區上,提供該微型泵之驅動訊號而控制該微型泵之驅動運作;以及一壓力感測器,設置於該驅動電路板上電性連接,並對應穿置於該基座之該穿置孔,經過該頂蓋與該氣曩連接做氣體壓力偵測;其中,該微型泵受該驅動電路板控制驅動運作,形成一氣體傳輸,讓該基座外部氣體由該進氣孔導入至該容置槽區內,並經過該微型泵持續導入該集氣腔室集中,且氣體得以推動該閥門片之該閥孔與該第一凸出結構脫離抵觸,此時氣體並能經過該閥孔而持續導入該頂蓋之該進氣通道中,聚集至該氣囊中,使該氣 囊充氣膨脹且壓迫使用者的皮膚,透過該壓力感測器檢測使用者的血壓。 A broad implementation aspect of this case is a blood pressure measurement module, including: a base with a valve bearing area, a accommodating groove area, an air inlet and a through hole, wherein the valve bearing area and the The accommodating groove areas are respectively provided on different surfaces, and the air inlet hole and the penetration hole communicate with the accommodating groove area, and the valve bearing area is provided with a first recessed cavity, and the first recessed cavity penetrates A plurality of first through holes are provided and a first protruding structure is arranged protrudingly, and a gas collecting chamber is recessed in the containing groove area to communicate with the first through holes; a valve plate is provided and carried on the valve Above the load-bearing area, there is a valve hole corresponding to the position of the first protruding structure; a top cover is provided with an air inlet channel and an exhaust hole, which are spaced apart from each other, and the top cover has a set of configuration Surface, cover the valve plate, and recess an intake chamber on the assembly surface corresponding to the intake passage, communicate with the intake passage, and recess on the assembly surface corresponding to the exhaust hole. The exhaust chamber is in communication with the exhaust hole, a communication passage is provided between the intake chamber and the exhaust chamber, and a second protruding structure is protrudingly provided in the exhaust chamber, and The vent hole is located at the center of the second protruding structure, so that the valve plate and the second protruding structure normally abut against each other to form a pre-force action, and the vent hole is closed, and the air inlet channel and blood pressure measurement An airbag connection; a micro pump arranged in the accommodating groove area to cover the air collection chamber; a driving circuit board to cover the accommodating groove area to provide the driving signal of the micro pump for control The driving operation of the micro pump; and a pressure sensor, which is arranged on the driving circuit board and electrically connected, and correspondingly penetrates the through hole of the base, and connects with the gas through the top cover to make gas Pressure detection; wherein, the micro pump is controlled and driven by the drive circuit board to form a gas transmission, allowing the outside air of the base to be introduced into the accommodating tank area from the air inlet hole, and continue to be introduced through the micro pump The gas collection chamber is concentrated, and the gas can push the valve hole of the valve plate to disengage from the first protruding structure. At this time, the gas can pass through the valve hole and be continuously introduced into the air inlet channel of the top cover, Gather into the airbag, make the air The bladder inflates and compresses the user's skin, and the user's blood pressure is detected through the pressure sensor.
1:基座 1: pedestal
11:閥門承載區 11: Valve bearing area
11a:第一凹置腔 11a: The first recessed cavity
11b:第一通孔 11b: first through hole
11c:第一凸出結構 11c: The first protruding structure
11d:凸柱 11d: convex column
11e:第二凹置腔 11e: The second recessed cavity
11f:第二通孔 11f: second through hole
12:容置槽區 12: Housing tank area
12a:集氣腔室 12a: Gas collecting chamber
13:進氣孔 13: Air intake
14:穿置孔 14: Piercing holes
15:第一表面 15: first surface
16:第二表面 16: second surface
2:閥門片 2: Valve piece
21:閥孔 21: Valve hole
22:定位穿孔 22: Positioning perforation
3:頂蓋 3: top cover
31:進氣通道 31: intake channel
31a:進氣腔室 31a: intake chamber
32:排氣孔 32: Vent
32a:排氣腔室 32a: exhaust chamber
32b:第二凸出結構 32b: The second protruding structure
33:組配表面 33: assembly surface
34:連通通道 34: Connecting channel
35:定位孔 35: positioning hole
36:共用通道 36: shared channel
36a:連接端 36a: connecting end
4:微型泵 4: Micro pump
41:進氣板 41: intake plate
411:通氣孔 411: Vent
412:匯流排槽 412: Busbar Slot
413:匯流腔室 413: Confluence Chamber
42:共振片 42: Resonance film
421:中空孔 421: Hollow Hole
422:可動部 422: movable part
423:固定部 423: fixed part
43:壓電致動器 43: Piezo Actuator
431:懸浮板 431: Suspended Board
432:外框 432: Outer Frame
433:支架 433: Bracket
434:壓電元件 434: Piezoelectric element
435:空隙 435: gap
436:凸部 436: Convex
44:第一絕緣片 44: The first insulating sheet
45:導電片 45: conductive sheet
46:第二絕緣片 46: second insulating sheet
47:腔室空間 47: Chamber space
4a:微機電泵浦 4a: MEMS pump
41a:第一基板 41a: First substrate
411a:流入孔 411a: Inflow hole
412a:基板第一表面 412a: The first surface of the substrate
413a:基板第二表面 413a: The second surface of the substrate
42a:第一氧化層 42a: first oxide layer
421a:匯流通道 421a: Confluence channel
422a:匯流腔室 422a: Confluence chamber
43a:第二基板 43a: second substrate
431a:矽晶片層 431a: Silicon wafer layer
4311a:致動部 4311a: Actuation Department
4312a:外周部 4312a: Peripheral
4313a:連接部 4313a: connecting part
4314a:流體通道 4314a: fluid channel
432a:第二氧化層 432a: second oxide layer
4321a:振動腔室 4321a: Vibration chamber
433a:矽材層 433a: Silicon layer
4331a:穿孔 4331a: perforation
4332a:振動部 4332a: Vibration Department
4333a:固定部 4333a: Fixed part
4334a:第三表面 4334a: third surface
4335a:第四表面 4335a: fourth surface
44a:壓電組件 44a: Piezoelectric component
441a:下電極層 441a: Lower electrode layer
442a:壓電層 442a: Piezo layer
443a:絕緣層 443a: insulating layer
444a:上電極層 444a: upper electrode layer
5:驅動電路板 5: Drive circuit board
6:壓力感測器 6: Pressure sensor
7:微處理器 7: Microprocessor
8:通訊器 8: Communicator
9:外部裝置 9: External device
10:氣囊 10: Airbag
10a:氣囊導管 10a: Balloon catheter
第1圖為本案血壓量測模組立體示意圖。 Figure 1 is a three-dimensional schematic diagram of the blood pressure measurement module of the present case.
第2A圖為本案血壓量測模組分解示意圖。 Figure 2A is an exploded schematic diagram of the blood pressure measurement module of this case.
第2B圖為本案血壓量測模組其另一角度分解示意圖。 Figure 2B is an exploded schematic diagram of the blood pressure measurement module of the present invention from another perspective.
第3圖為本案血壓量測模組壓力感測器設置於驅動電路板示意圖。 Figure 3 is a schematic diagram of the pressure sensor of the blood pressure measurement module set on the drive circuit board in this case.
第4圖為本案血壓量測模組閥門片設置於基座示意圖。 Figure 4 is a schematic diagram of the valve plate of the blood pressure measurement module set on the base of this case.
第5圖為本案血壓量測模組連接氣囊之示意圖。 Figure 5 is a schematic diagram of the blood pressure measurement module connected to the airbag in this case.
第6A圖為本案氣體偵測模組之微型泵分解示意圖。 Figure 6A is an exploded schematic diagram of the micro pump of the gas detection module in this case.
第6B圖為本案氣體偵測模組之微型泵另一角度的分解示意圖。 Figure 6B is an exploded schematic view of the micro pump of the gas detection module of the present invention from another angle.
第7A圖為本案氣體偵測模組之微型泵的剖面示意圖。 Figure 7A is a schematic cross-sectional view of the micro pump of the gas detection module of the present invention.
第7B圖為本案氣體偵測模組另一實施例的剖面示意圖。 Figure 7B is a schematic cross-sectional view of another embodiment of the gas detection module of the present invention.
第7C圖至第7E圖為微型泵的作動示意圖。 Figures 7C to 7E are schematic diagrams of the operation of the micro pump.
第SA圖為微機電泵浦的剖面示意圖。 Figure SA is a schematic cross-sectional view of the MEMS pump.
第8B圖為微機電泵浦的分解示意圖。 Figure 8B is an exploded schematic diagram of the MEMS pump.
第9A圖至第9C圖為微機電泵浦的作動示意圖。 Figures 9A to 9C are schematic diagrams of the action of the MEMS pump.
第10圖為本案血壓量測模組俯視示意圖。 Figure 10 is a schematic top view of the blood pressure measurement module of this case.
第11圖為第10圖之AA剖面線之剖面示意圖。 Figure 11 is a schematic cross-sectional view taken along the line AA in Figure 10.
第12圖為第10圖之BB剖面線之剖面示意圖。 Figure 12 is a schematic cross-sectional view taken along the line BB of Figure 10.
第13圖為第10圖之CC剖面線之剖面示意圖。 Figure 13 is a schematic cross-sectional view of the CC section line of Figure 10.
第14A圖及第14B圖為本案血壓量測模組的進氣示意圖。 Figures 14A and 14B are schematic diagrams of the air intake of the blood pressure measurement module of the present case.
第15圖為血壓量測模組的洩氣示意圖。 Figure 15 is a schematic diagram of the deflation of the blood pressure measurement module.
第16圖為血壓量測模組另一實施例示意圖。 Figure 16 is a schematic diagram of another embodiment of the blood pressure measurement module.
第17A圖為血壓量測模組另一實施例之頂蓋示意圖。 Figure 17A is a schematic diagram of the top cover of another embodiment of the blood pressure measurement module.
第17B圖為血壓量測模組另一實施例之頂蓋另一角度示意圖。 Fig. 17B is a schematic diagram of another angle of the top cover of another embodiment of the blood pressure measurement module.
第18圖為血壓量測模組另一實施例之剖面示意圖。 Figure 18 is a schematic cross-sectional view of another embodiment of the blood pressure measurement module.
第19圖為血壓量測模組另一實施例的進氣示意圖。 Figure 19 is a schematic diagram of the air intake of another embodiment of the blood pressure measurement module.
第20圖為血壓量測模組另一實施例的洩氣示意圖。 Figure 20 is a schematic diagram of another embodiment of the blood pressure measurement module for deflation.
第21圖為血壓量測模組連接外部裝置示意圖。 Figure 21 is a schematic diagram of the blood pressure measurement module connected to an external device.
體現本案特徵與優點的一些典型實施例將在後段的說明中詳細敘述。應理解的是本案能夠在不同的態樣上具有各種的變化,其皆不脫離本案的範圍,且其中的說明及圖示在本質上當作說明之用,而非用以限制本案。 Some typical embodiments embodying the features and advantages of this case will be described in detail in the following description. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of the case, and the descriptions and diagrams therein are essentially for illustrative purposes, rather than limiting the case.
請參閱第1A圖至第2B圖所示,本案提供一種血壓量測模組,包含一基座1、一閥門片2、一頂蓋3、一微型泵4、一驅動電路板5及一壓力感測器6。
Please refer to Figures 1A to 2B. This case provides a blood pressure measurement module, including a
基座1包含有一閥門承載區11、一容置槽區12、一進氣孔13、一穿置孔14、一第一表面15及一第二表面16,第一表面15與第二表面16分別為相對的二表面,閥門承載區11位於第一表面15,容置槽區12位於第二表面16,進氣孔13及穿置孔14分別自第一表面15貫穿至第二表面16且連通於容置槽區12,其中,第一閥門承載區11具有一第一凹置腔11a、複數個第一通孔11b、一第一凸出結構11c及複數個凸柱11d,第一凹置腔11a自閥門承載區11凹陷形成,於第一凹置腔11a中心突伸設置第一凸出結構11c,該些第一通孔11b圍繞第一凸出結構11c且貫穿至容置槽區12,凸柱11d則是分別鄰設於閥門承載區11的角落,此外,容置槽區12凹設一集氣腔室12a,集氣腔室12a與該些第一通孔11b相連通。
The
此外,閥門承載區11更包含一第二凹置腔11e,第二凹置腔11e與第一凹置腔11a間隔設置,且第二凹置腔11e貫穿至少一第二通孔11f,使第二凹置腔11e通過第二通孔11f與集氣腔室12a相連通,增加集氣腔室12a與閥門承載區11的通道,以加速集氣腔室12a內的氣體至閥門承載區11的速度。
In addition, the
請參閱第2A圖及第4圖,閥門片2設置於閥門承載區11,閥門片2具有一閥孔21及複數個定位穿孔22,閥孔21與閥門承載區11的第一凸出結構11c垂直對應,該些定位穿孔22則分別與該些凸柱11d對應且套設於該些凸柱11d。
Please refer to Figures 2A and 4, the
如第17A圖及第17B圖所示,頂蓋3具有一進氣通道31、一排氣孔32、一組配表面33、一連通通道34及複數個定位孔35,進氣通道31與排氣孔32間隔設置,組配表面33封蓋於閥門片2,且組配表面33於進氣通道31周緣凹置與進氣通道31相連通之一進氣腔室31a、於排氣孔32周緣凹置與排氣孔32相通之排氣腔室32a、及進氣腔室31a與排氣腔室32a之間凹設連通通道34,使進氣腔室31a與排氣腔室32a連通。此外,於排氣腔室32a及排氣孔32邊緣處突出設置一第二凸出結構32b;請參閱第12圖,閥門片2承載於閥門承載區11上,並夾置於基座1與頂蓋3之間定位不偏移,此時,排氣孔32位於第二凸出結構32b的中心位置,第二凸出結構32b將頂抵閥門片2並封閉排氣孔32,於常態下形成一預力作用。
As shown in Figures 17A and 17B, the
請參閱第2A圖、第2B圖及第11圖所示,該些定位孔35分別位於組配表面33的四個角落並分別與閥門承載區11的該些凸柱11d對應,並供該些凸柱11d套置其中。
Please refer to Fig. 2A, Fig. 2B and Fig. 11, the positioning holes 35 are respectively located at the four corners of the
請參閱第2B圖及第5圖,頂蓋3亦包含有一共用通道36,共用通道36與進氣通道31連通並構成一體,共用通道36的一端延伸至壓力感測器6並
且封蓋壓力感測器6(如第13圖所示),另一端則為連接端36a(如第10圖所示),用以氣囊10連接,促使壓力感測器6透過共用通道36連通氣囊10做氣體壓力偵測,以進一步做血壓測量。
Please refer to Figures 2B and 5, the
請繼續參閱第2B圖,微型泵4設置於容置槽區12內,且封蓋集氣腔室12a,而驅動電路板5封蓋容置槽區12上,驅動電路板5電性連接微型泵4,以提供微型泵4驅動訊號以控制微型泵4的驅動及運作。此外,壓力感測器6電性連接於驅動電路板5上,且對應穿置於基座1的穿置孔14,壓力感測器6之一端穿伸經過頂蓋3,且與該氣囊10連接(如第5圖所示)。
Please continue to refer to FIG. 2B. The
請參閱第6A圖及第6B圖,微型泵4包含有包括一進氣板41、一共振片42、一壓電致動器43、一第一絕緣片44、一導電片45及第二絕緣片46等結構,其中壓電致動器43對應於共振片42而設置,並使進氣板41、共振片42、壓電致動器43、第一絕緣片44、導電片45及第二絕緣片46等依序堆疊設置。
Please refer to FIGS. 6A and 6B. The
進氣板41具有至少一通氣孔411、至少一匯流排槽412及一匯流腔室413,於本實施例中,通氣孔411之數量以4個為較佳,但不以此為限。通氣孔411係貫穿進氣板41,用以供氣體順應大氣壓力之作用而自通氣孔411流入微型泵4內。進氣板41上具有至少一匯流排槽412,其數量與位置與進氣板41另一表面之通氣孔411對應設置,本實施例之通氣孔411其數量為4個,與其對應之匯流排槽412其數量亦為4個;匯流腔室413位於進氣板41的中心處,前述之4個匯流排槽412的一端連通於對應之通氣孔411,其另一端則連通於進氣板41的中心處之匯流腔室413,藉此可將自通氣孔411進入匯流排槽412之氣體引導並匯流集中至匯流腔室413。於本實施例中,進氣板41具有一體成型的通氣孔411、匯流排槽412及匯流腔室413。
The
於一些實施例中,進氣板41之材質可為不鏽鋼材質所構成,但不以此為限。於另一些實施例中,匯流腔室413之深度與匯流排槽412之深度相同,但不以此為限。
In some embodiments, the material of the
共振片42係由一可撓性材質所構成,但不以此為限,且於共振片42上具有一中空孔421,係對應於進氣板41之匯流腔室413而設置,供氣體通過。於另一些實施例中,共振片42係可由一銅材質所構成,但不以此為限。
The
壓電致動器43係由一懸浮板431、一外框432、至少一支架433以及一壓電元件434所共同組裝而成;懸浮板431為一正方形型態,並可彎曲振動,外框432環繞懸浮板431設置,至少一支架433連接於懸浮板431與外框432之間,提供彈性支撐的效果,壓電元件434亦為正方形型態,貼附於懸浮板431的一表面,用以施加電壓產生形變以驅動懸浮板431彎曲振動,且壓電元件434的邊長小於或等於懸浮板431的邊長;其中,懸浮板431、外框432及支架433之間具有複數個空隙435,空隙435供氣體通過;此外,壓電致動器43更包含一凸部436,凸部436設置於懸浮板431的另一表面,並與壓電元件434相對設置於懸浮板431的兩表面。
The
如第7A圖所示,進氣板41、共振片42、壓電致動器43、第一絕緣片44、導電片45、第二絕緣片46依序推疊設置,壓電致動器43的懸浮板431其厚度小於外框432的厚度,當共振片42堆疊於壓電致動器43時,壓電致動器43的懸浮板431、外框432與共振片42之間可形成一腔室空間47。
As shown in Figure 7A, the
請再參閱第7B圖,第7B圖為微型泵4的另一實施例,其元件與前一實施例(第6A圖)相同,故不加以贅述,其差異在於,於未作動時,其壓電致動器43的懸浮板431以沖壓方式以遠離共振片42的方向延伸,並未與
外框432位於同一水平,其延伸距離可由支架433所調整,且支架433與懸浮板431之間呈現非平行,使得壓電致動器43呈凸出狀。
Please refer to Figure 7B again. Figure 7B shows another embodiment of the
為了瞭解上述微型泵4提供氣體傳輸之輸出作動方式,請繼續參閱第7C圖至第7E圖所示,請先參閱第7C圖,壓電致動器43的壓電元件434被施加驅動電壓後產生形變帶動懸浮板431向上位移,此時腔室空間47的容積提升,於腔室空間47內形成了負壓,便汲取匯流腔室413內的氣體進入腔室空間47內,同時共振片42受到共振原理的影響被同步向上帶動,連帶增加了匯流腔室413的容積,且因匯流腔室413內的氣體進入腔室空間47的關係,造成匯流腔室413內同樣為負壓狀態,進而通過通氣孔411及匯流排槽412來吸取氣體進入匯流腔室413內。請再參閱第7D圖,壓電元件434帶動懸浮板431向下位移,壓縮腔室空間47,同樣的,共振片42被懸浮板431因共振而向下位移,同步推擠腔室空間47內的氣體往下通過空隙435向上輸送,將氣體由微型泵4排出。最後請參閱第7E圖,當懸浮板431回復原位時,共振片42仍因慣性而向下位移,此時的共振片42將使壓縮腔室空間47內的氣體向空隙435移動,並且提升匯流腔室413內的容積,讓氣體能夠持續地通過通氣孔411、匯流排槽412來匯聚於匯流腔室413內,透過不斷地重複上述第7C圖至第7E圖所示之微型泵提供氣體傳輸作動步驟,使微型泵能夠使氣體連續自通氣孔411進入進氣板41及共振片42所構成流道產生壓力梯度,再由空隙435向上輸送,使氣體高速流動,達到微型泵4傳輸氣體的效果。
In order to understand the above-mentioned
本案的微型泵4的另一實施例可為一微機電泵浦4a,請參閱第8A圖及第8B圖,微機電泵浦4a包含有一第一基板41a、一第一氧化層42a、一第二基板43a以及一壓電組件44a。本實施例的微機電泵浦4a是透過半導體
製程中的磊晶、沉積、微影及蝕刻等製程一體成型製出,理應無法拆解,為了詳述其內部結構,特以第8B圖所示之分解圖詳述之。
Another embodiment of the
第一基板41a為一矽晶片(Si wafer),其厚度介於150至400微米(μm)之間,第一基板41a具有複數個流入孔411a、一基板第一表面412a最後如一基板第二表面413a,於本實施例中,該些流入孔411a的數量為4個,但不以此為限,且每個流入孔411a皆由第二表面413a貫穿至基板第一表面412a,而流入孔411a為了提升流入效果,將流入孔411a自第二表面413a至基板第一表面412a呈現漸縮的錐形。
The
第一氧化層42a為一二氧化矽(SiO2)薄膜,其厚度介於10至20微米(μm)之間,第一氧化層42a疊設於第一基板41a的基板第一表面412a上,第一氧化層42a具有複數個匯流通道421a以及一匯流腔室422a,匯流通道421a與第一基板41a的流入孔411a其數量及位置相互對應。於本實施例中,匯流通道421a的數量同樣為4個,4個匯流通道421a的一端分別連通至第一基板41a的4個流入孔411a,而4個匯流通道421a的另一端則連通於匯流腔室422a,讓氣體分別由流入孔411a進入之後,通過其對應相連之匯流通道421a後匯聚至匯流腔室422a內。
The
第二基板43a為一絕緣層上覆矽之矽晶片(SOI wafer),包含有:一矽晶片層431a、一第二氧化層432a以及一矽材層433a。矽晶片層431a的厚度介於10至20微米(μm)之間,具有一致動部4311a、一外周部4312a、複數個連接部4313a以及複數個流體通道4314a,致動部4311a呈圓形。外周部4312a呈中空環狀,環繞於致動部4311a的外圍。複數個連接部4313a分別位於致動部4311a與外周部4312a之間,並且連接兩者,提供彈性支撐的功能。複數個流體通道4314a環繞形成於致動部2311a的外圍,且分別位於複數個連接部4313a之間。
The
第二氧化層432a為一氧化矽層其厚度介於0.5至2微米(μm)之間,形成於矽晶片層431a上,呈中空環狀,並與矽晶片層431a定義一振動腔室4321a。矽材層433a呈圓形,位於第二氧化層432a且結合至第一氧化層42a,矽材層433a為二氧化矽(SiO2)薄膜,厚度介於2至5微米(μm)之間,具有一穿孔4331a、一振動部4332a、一固定部4333a、一第三表面4334a及一第四表面4335a。穿孔4331a形成於矽材層433a的中心,振動部4332a位於穿孔4331a的周邊區域,且垂直對應於振動腔室4321a,固定部4333a則為矽材層433a的周緣區域,由固定部4333a固定於第二氧化層432a,第三表面4334a與第二氧化層432a接合,第四表面4335a與第一氧化層42a接合;壓電組件44a疊設於矽晶片層431a的致動部4311a。
The
壓電組件44a呈圓形,包含有下電極層441a、壓電層442a、絕緣層443a及上電極層444a,下電極層441a疊置於矽晶片層431a的致動部4311a,而壓電層442a疊置於下電極層441a,兩者透過其接觸的區域做電性連接,此外,壓電層442a的寬度小於下電極層441a的寬度,使得壓電層442a無法完全遮蔽住下電極層441a,在於壓電層442a的部分區域以及下電極層441a未被壓電層442a所遮蔽的區域上疊置絕緣層443a,最後在於絕緣層443a以及未被絕緣層443a遮蔽的壓電層442a的區域上疊置上電極層444a,讓上電極層444a得以與壓電層442a接觸來電性連接,同時利用絕緣層443a阻隔於上電極層444a及下電極層441a之間,避免兩者直接接觸造成短路。
The
請參考第9A至第9C圖,第9A至9C圖為微機電泵浦4a其作動示意圖。請先參考第9A圖,當壓電組件44a的下電極層441a及上電極層444a接收驅動電路板5所傳遞之驅動電壓及驅動訊號(未圖示)後,將其傳導至壓電層442a,壓電層442a接受驅動電壓及驅動訊號後,因逆壓電效應的影
響開始產生形變,會帶動矽晶片層431a的致動部4311a開始位移,當壓電組件44a帶動致動部4311a向上位移拉開與第二氧化層432a之間的距離,此時,第二氧化層432a的振動腔室4321a的容積將提升,讓振動腔室4321a內形成負壓,用於將第一氧化層42a的匯流腔室422a內的氣體通過穿孔4331a吸入其中。請繼續參閱第9B圖,當致動部4311a受到壓電組件44a的牽引向上位移時,矽材層433a的振動部4332a會因共振原理的影響向上位移,當振動部4332a向上位移時,會壓縮振動腔室4321a的空間並且推動振動腔室4321a內的氣體往矽晶片層431a的流體通道4314a移動,讓氣體能夠通過流體通道4314a向上排出,在振動部4332a向上位移來壓縮振動腔室4321a的同時,匯流腔室422a的容積因振動部4332a位移而提升,其內部形成負壓,將吸取微機電泵浦4a外的氣體由流入孔411a進入其中。最後如第9C圖所示,壓電組件44a帶動矽晶片層431a的致動部4311a向下位移時,將振動腔室4321a的氣體往流體通道4314a推動,並將氣體排出,而矽材層433a的振動部4332a亦受致動部4311a的帶動向下位移,同步壓縮匯流腔室422a的氣體通過穿孔4331a向振動腔室4321a移動,後續再將壓電組件44a帶動致動部4311a向上位移時,其振動腔室4321a的容積會大幅提升,進而有較高的汲取力將氣體吸入振動腔室4321a,再重複以上的動作,以至於透過壓電組件44a持續帶動致動部4311a上下位移且來連動振動部4332a上下位移,透過改變微機電泵浦4a的內部壓力,使其不斷地汲取及排出氣體,藉此以完成微機電泵浦4a的動作。
Please refer to Figures 9A to 9C. Figures 9A to 9C are schematic diagrams of the operation of the
請參閱第14A圖所示,微型泵4開始作動,氣體由微型泵4的通氣孔411開始進入,並將氣體持續導送至集氣腔室12a,請參閱第14B圖,氣體持續輸送到集氣腔室12a後,氣體便由第一通孔11b進入第一凹置腔
11a,同時也通過第二通孔11f進入第二凹置腔11e,而進入第一凹置腔11a與第二凹置腔11e的氣體會將閥門片2向上推動,並使其向頂蓋3靠近,此時,閥門片2將頂抵於排氣腔室32a的第二凸出結構32b,且同時封閉排氣孔32,同時閥門片2脫離第一凹置腔11a的第一凸出結構11c,將第二凹置腔11e、第一凹置腔11a的氣體得以通過閥孔21進入進氣腔室31a,而氣體進入進氣腔室31a後,導入進氣通道31,最後匯聚至氣囊10(如第5圖所示)內。於本實施例中,氣體進入進氣通道31後,先通過共用通道36,再進入位於連接端36a的氣囊10,開始對氣囊10充氣使其膨脹,使氣囊10能夠緊貼於測量者,再透過壓力感測器6檢測氣囊10的壓力變化,進行血壓測量的動作。
Please refer to Figure 14A, the
如第15圖所示,血壓測量完畢後,微型泵4停止運作,故氣囊10內的氣壓高於進氣腔室31a的氣壓,氣體開始自氣囊10通過進氣通道31導送至進氣腔室31a,氣體輸送至進氣腔室31a的同時,推動閥門片2向下移動,並使閥孔21被第一凸出結構11c封閉,氣體將通過連通通道34,由進氣腔室31a向排氣腔室32a流動,此外,氣體將閥門片2向下推動時,閥門片2脫離第二凸出結構32b,並被推移靠近掉入第二凹置腔11e內,將排氣腔室32a與排氣孔32連通,氣體進入排氣腔室32a後,得以由排氣孔32排出,釋放氣囊10內的氣體,俾完成該氣囊10之快速洩壓作業。
As shown in Figure 15, after the blood pressure measurement is completed, the
請參閱第16圖,第16圖係本案血壓量測模組的另一實施方式,本實施方式與前一實施方式大部分元件皆相同,因此不再贅述,差異在於頂蓋3,本實施方式的頂蓋3未設有共用通道36;接著請參閱第18圖,未設有共用通道36的情況下,本實施例的氣囊10具有一氣囊導管10a,氣囊導管10a與氣囊10相連通,並且在連接至頂蓋3的進氣通道31並且罩蓋壓力感測器6,微型泵4開始作動,氣體並開始進入進氣通道31(如第
19圖所示),氣體通過進氣通道31後,經由氣囊導管10a進入氣囊10,使氣囊10開始充氣、膨脹,壓迫使用者的皮膚,並透過壓力感測器6由氣囊導管10a確認氣囊10內的氣壓變化,來檢測使用者的血壓,檢測結束後,微型泵4停止運作,氣體便會由氣囊導管10a導回至進氣通道31,最後由排氣孔32排出(如第20圖所示),達到快速洩氣、洩壓的功效。
Please refer to Figure 16. Figure 16 is another embodiment of the blood pressure measurement module in this case. Most of the components in this embodiment are the same as those in the previous embodiment, so it will not be repeated here. The difference lies in the
最後請再參閱第1圖,本案的血壓量測模組的長度介於4mm至30mm之間,寬度介於2mm至16mm之間,高度介於1mm至8mm之間,使血壓量測模組得以與可攜式電子裝置結合。此外,血壓量測模組為了與智慧型手錶結合,其長度可介於24mm至30mm之間、寬度可介於14mm至16mm之間,厚度可介於6mm至8mm之間。 Finally, please refer to Figure 1. The length of the blood pressure measurement module in this case is between 4mm and 30mm, the width is between 2mm and 16mm, and the height is between 1mm and 8mm, so that the blood pressure measurement module can be Combine with portable electronic devices. In addition, in order to integrate the blood pressure measurement module with a smart watch, its length can be between 24mm and 30mm, the width can be between 14mm and 16mm, and the thickness can be between 6mm and 8mm.
如第21圖所示,血壓量測模組可更包含一微處理器7及一通訊器8,設置於該驅動電路板5上,該微處理器7用以接收該壓力感測器6所量測信號予以運算轉換成一資訊數據,並將該資料數據經過該通訊器通訊傳輸至一外部裝置9予以儲存處理應用,其中該通訊傳輸為一有線傳輸及一無線傳輸之至少其中之一,外部裝置係為一雲端系統、一可攜式裝置、一電腦系統等至少其中之一。
As shown in Fig. 21, the blood pressure measurement module may further include a
綜上所述,本案所提供之血壓量測模組座經由基座、閥門片及頂蓋的設置,能夠達到對氣囊快速排氣與快速進氣的效果,並且透過微型泵大幅縮小泵浦的體積,使血壓量測模組能夠設置於智慧型手表等穿戴式裝置上,極具產業利用性及進步性。 To sum up, the blood pressure measurement module seat provided in this case can achieve the effect of rapid exhaust and rapid air intake of the airbag through the base, valve plate and top cover, and the micro-pump can greatly reduce the pumping capacity. The volume allows the blood pressure measurement module to be installed on wearable devices such as smart watches, which is highly industrially usable and progressive.
1:基座 1: pedestal
3:頂蓋 3: top cover
5:驅動電路板 5: Drive circuit board
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US17/034,346 US11666234B2 (en) | 2019-10-31 | 2020-09-28 | Blood pressure measurement module |
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TW108139584 | 2019-10-31 | ||
TW108139584 | 2019-10-31 |
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TWI722812B true TWI722812B (en) | 2021-03-21 |
TW202118444A TW202118444A (en) | 2021-05-16 |
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TW109106975A TWI722812B (en) | 2019-10-31 | 2020-03-03 | Blood pressure measurement module |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI810920B (en) * | 2021-05-06 | 2023-08-01 | 日商村田製作所股份有限公司 | Valves and Fluid Control Devices |
Citations (4)
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TWM532530U (en) * | 2016-06-24 | 2016-11-21 | Microjet Technology Co Ltd | Miniature fluid control device |
WO2017136772A1 (en) * | 2016-02-03 | 2017-08-10 | Angilytics Inc. | Non-invasive and non-occlusive blood pressure monitoring devices and methods |
TWM574151U (en) * | 2018-09-17 | 2019-02-11 | 研能科技股份有限公司 | Micro-electromechanical pump |
TWM580949U (en) * | 2018-06-08 | 2019-07-21 | 研能科技股份有限公司 | Wearable device |
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2020
- 2020-03-03 TW TW109106975A patent/TWI722812B/en active
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WO2017136772A1 (en) * | 2016-02-03 | 2017-08-10 | Angilytics Inc. | Non-invasive and non-occlusive blood pressure monitoring devices and methods |
TWM532530U (en) * | 2016-06-24 | 2016-11-21 | Microjet Technology Co Ltd | Miniature fluid control device |
TWM580949U (en) * | 2018-06-08 | 2019-07-21 | 研能科技股份有限公司 | Wearable device |
TWM574151U (en) * | 2018-09-17 | 2019-02-11 | 研能科技股份有限公司 | Micro-electromechanical pump |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI810920B (en) * | 2021-05-06 | 2023-08-01 | 日商村田製作所股份有限公司 | Valves and Fluid Control Devices |
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