CN112648548B - Laser lighting device - Google Patents

Laser lighting device Download PDF

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Publication number
CN112648548B
CN112648548B CN202011550185.5A CN202011550185A CN112648548B CN 112648548 B CN112648548 B CN 112648548B CN 202011550185 A CN202011550185 A CN 202011550185A CN 112648548 B CN112648548 B CN 112648548B
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heat
heat dissipation
laser
lighting device
fluorescent material
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CN112648548A (en
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张韵
叶蕾
刘喆
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Institute of Semiconductors of CAS
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/56Cooling arrangements using liquid coolants
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/22Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/28Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30Elements containing photoluminescent material distinct from or spaced from the light source

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

The invention discloses a laser lighting device, comprising: a fluorescent material layer, a laser light source and a heat dissipation structure; wherein the laser light source is used for emitting laser to the fluorescent material layer; the heat radiation structure comprises a heat conduction unit and a heat radiation unit, wherein the heat conduction unit is used for conducting heat to the fluorescent material layer, and the heat radiation unit is used for radiating heat to the heat conduction unit. The laser lighting device provided by the invention can at least partially solve the problem of thermal quenching of the fluorescent material layer caused by poor heat dissipation in the prior art.

Description

激光照明装置Laser lighting device

技术领域Technical field

本发明属于激光照明技术领域,主要涉及一种激光照明装置。The invention belongs to the technical field of laser lighting and mainly relates to a laser lighting device.

背景技术Background technique

目前,激光照明白光光源的获得方式有:采用蓝光激光器激发黄色荧光材料和采用紫外激光器激发多色荧光材料形成白光;因为其具有较高的光效、环保、体积小等特性,广泛应用于诸多领域中。At present, the ways to obtain white light sources for laser lighting include: using blue lasers to excite yellow fluorescent materials and using ultraviolet lasers to excite multi-color fluorescent materials to form white light; because of its high light efficiency, environmental protection, small size and other characteristics, it is widely used in many applications. in the field.

然而,这种光源的发光功率被限制在一个较低的水平。由于激光器发出的激光光束具有很好的方向性,在大功率密度下工作时聚焦的光斑最低可达到几个微米的直径,直接照射到荧光粉表面上时会迅速聚集热量,采用荧光材料以及传统的封装工艺,将会导致荧光粉迅速衰减甚至淬灭,使激光器光源系统会产生光衰、光色不稳定现象并最终影响大功率激光照明的实用化。其次由于激光光斑小、光束集中的特点,荧光材料的接收面处的激光功率密度很高,当光通过荧光粉层时,由于量子效率损失,斯托克斯位移损失和吸收损失,部分光能将转换为热量。由于有机粘合剂的相对较低的热导率,它可能进一步导致磷光体温度升高。当高于一定温度时,荧光材料的量子效率开始迅速下降。量子效率的降低将会导致荧光体层中产生的热量进一步增加,温度进一步升高,反作用于量子效率进一步降低。这种热失控效应被称为荧光粉热淬灭,因此难以满足大功率激光应用的需求。However, the luminous power of this light source is limited to a low level. Since the laser beam emitted by the laser has good directivity, the focused spot can reach a minimum diameter of several microns when working at high power density. When directly irradiated on the surface of the phosphor, it will quickly accumulate heat. Using fluorescent materials and traditional Poor packaging process will cause the phosphor to rapidly attenuate or even be quenched, causing the laser light source system to suffer from light attenuation and unstable light color, which will ultimately affect the practical application of high-power laser lighting. Secondly, due to the characteristics of small laser spot and concentrated beam, the laser power density at the receiving surface of the fluorescent material is very high. When the light passes through the phosphor layer, part of the light energy is lost due to quantum efficiency loss, Stokes shift loss and absorption loss. will be converted into heat. Due to the relatively low thermal conductivity of the organic binder, it may further cause an increase in the phosphor temperature. Above a certain temperature, the quantum efficiency of fluorescent materials begins to decline rapidly. The decrease in quantum efficiency will cause the heat generated in the phosphor layer to further increase and the temperature to further increase, which will in turn result in a further decrease in quantum efficiency. This thermal runaway effect is called phosphor thermal quenching, making it difficult to meet the needs of high-power laser applications.

目前,针对激光照明散热问题,大多数的方案都是对激光光源模组进行散热处理,散热效果不理想,达不到预期散热效果,很容易出现荧光材料层由于散热不良导致的热淬灭的问题。At present, for the problem of heat dissipation in laser lighting, most solutions are to dissipate the heat of the laser light source module. The heat dissipation effect is not ideal and cannot achieve the expected heat dissipation effect. It is easy to cause thermal quenching of the fluorescent material layer due to poor heat dissipation. question.

发明内容Contents of the invention

(一)要解决的技术问题(1) Technical problems to be solved

有鉴于此,本发明旨在提供一种激光照明装置,本发明可以至少部分解决现有技术中荧光材料层由于散热不良导致的热淬灭的问题。In view of this, the present invention aims to provide a laser lighting device, which can at least partially solve the problem of thermal quenching of the fluorescent material layer due to poor heat dissipation in the prior art.

(二)技术方案(2) Technical solutions

一种激光照明装置,包括:荧光材料层;激光光源,用于向所述荧光材料层发射激光;散热结构,包括导热单元和散热单元;所述导热单元用于对所述荧光材料层进行导热;所述散热单元用于对所述导热单元进行散热。A laser lighting device, including: a fluorescent material layer; a laser light source for emitting laser light to the fluorescent material layer; a heat dissipation structure including a heat conduction unit and a heat dissipation unit; the heat conduction unit is used to conduct heat to the fluorescent material layer ; The heat dissipation unit is used to dissipate heat from the heat conduction unit.

可选地,所述荧光材料层,包括发光区和散热区;所述导热单元,包括第一换热面、第二换热面、结合面、以及激光通道,其中所述激光通道贯通所述导热单元,且所述激光通道的两端分别延伸至所述第一换热面和所述第二换热面;所述散热单元,包括冷却流体、以及用于容纳所述冷却流体的流体装载体;其中,所述导热单元通过所述第一换热面吸收所述散热区的热量;所述导热单元通过所述结合面固接在所述流体装载体上;所述激光通道连通至所述发光区;所述散热单元通过所述冷却流体与所述第二换热面进行换热。Optionally, the fluorescent material layer includes a light emitting area and a heat dissipation area; the thermal conductive unit includes a first heat exchange surface, a second heat exchange surface, a bonding surface, and a laser channel, wherein the laser channel passes through the a heat conduction unit, and both ends of the laser channel extend to the first heat exchange surface and the second heat exchange surface respectively; the heat dissipation unit includes a cooling fluid, and a fluid device for containing the cooling fluid Carrier; wherein, the heat conduction unit absorbs the heat of the heat dissipation area through the first heat exchange surface; the heat conduction unit is fixed on the fluid carrier through the bonding surface; the laser channel is connected to the The light-emitting area; the heat dissipation unit exchanges heat with the second heat exchange surface through the cooling fluid.

可选地,所述导热单元采用导热材料制成。Optionally, the thermal conductive unit is made of thermal conductive material.

可选地,所述冷却流体内设有空气泡。Optionally, the cooling fluid is provided with air bubbles.

可选地,所述第一换热面和所述散热区直接接触;或所述第一换热面和所述散热区通过导热硅胶固接在一起。Optionally, the first heat exchange surface and the heat dissipation area are in direct contact; or the first heat exchange surface and the heat dissipation area are fixed together through thermally conductive silicone.

可选地,所述流体装载体包括:散热内筒、散热外筒和封堵板;其中,所述第二换热面、所述散热内筒的外壁、所述散热外筒的内壁和所述封堵板的上表面,围合形成密闭的容纳腔,所述容纳腔用于容纳所述冷却流体。Optionally, the fluid carrying body includes: a heat dissipation inner cylinder, a heat dissipation outer cylinder and a blocking plate; wherein the second heat exchange surface, the outer wall of the heat dissipation inner cylinder, the inner wall of the heat dissipation outer cylinder and the The upper surface of the blocking plate is enclosed to form a sealed accommodation cavity, and the accommodation cavity is used to accommodate the cooling fluid.

可选地,所述散热内筒与所述激光通道连通。Optionally, the heat dissipation inner cylinder is connected with the laser channel.

可选地,所述散热内筒的内壁设有全反射光学层。Optionally, the inner wall of the heat dissipation inner cylinder is provided with a total reflection optical layer.

可选地,所述散热内筒和所述散热外筒采用导热材料。Optionally, the heat dissipation inner cylinder and the heat dissipation outer cylinder are made of thermally conductive materials.

可选地,该激光照明装置还包括:耦合光纤,连通至所述激光照明装置的散热内筒;支撑构件,包括支撑底座和安装在所述支撑底座上的保护罩,其中,所述支撑底座用于安装支撑所述激光光源和所述散热结构,所述保护罩位于所述荧光材料层所在一侧。Optionally, the laser lighting device further includes: a coupling optical fiber connected to the heat dissipation inner cylinder of the laser lighting device; a support member including a support base and a protective cover installed on the support base, wherein the support base Used to install and support the laser light source and the heat dissipation structure, the protective cover is located on the side where the fluorescent material layer is located.

(三)有益效果(3) Beneficial effects

本发明实施例提供的激光照明装置,包括有一个可以直接对荧光材料层进行散热的散热结构,与现有技术中采用对激光光源模组进行散热的方式相比,由于采用直接对荧光材料层进行散热,其散热效果更好,散热速率更快;此外,本发明实施例提供的激光照明激光照明装置,通过导热单元与散热单元相结合的方式进行散热,具体地,通过导热单元对激光照明装置的荧光材料层进行导热,通过散热单元进一步对传导至导热单元的热量进行散热,进而增大了散热面积,可以快速将热量散发出去,可以解决荧光材料在持续诱导激发而不能及时散热的问题,进而解决荧光材料层由于散热不良导致的热淬灭的问题,提升改善了激光照明装置的散热效果和延长荧光材料的使用寿命;且该激光照明装置,结构简单,易于拆卸和更换,实用性较好。The laser lighting device provided by the embodiment of the present invention includes a heat dissipation structure that can directly dissipate heat to the fluorescent material layer. Compared with the method of dissipating heat to the laser light source module in the prior art, since the fluorescent material layer is directly used to dissipate heat, To dissipate heat, the heat dissipation effect is better and the heat dissipation rate is faster; in addition, the laser lighting device provided by the embodiment of the present invention dissipates heat through a combination of a heat conduction unit and a heat dissipation unit. Specifically, the heat conduction unit illuminates the laser The fluorescent material layer of the device conducts heat, and the heat transferred to the heat conduction unit is further dissipated through the heat dissipation unit, thereby increasing the heat dissipation area and quickly dissipating the heat, which can solve the problem of the fluorescent material being continuously induced and excited and unable to dissipate heat in time. , thereby solving the problem of thermal quenching of the fluorescent material layer due to poor heat dissipation, improving the heat dissipation effect of the laser lighting device and extending the service life of the fluorescent material; and the laser lighting device has a simple structure, is easy to disassemble and replace, and is practical better.

附图说明Description of drawings

图1是本发明实施例示出的激光照明装置的结构示意图;Figure 1 is a schematic structural diagram of a laser lighting device according to an embodiment of the present invention;

图2是本发明实施例示出的散热结构的结构示意图;Figure 2 is a schematic structural diagram of a heat dissipation structure according to an embodiment of the present invention;

图3是图2所示的散热结构的剖视图;Figure 3 is a cross-sectional view of the heat dissipation structure shown in Figure 2;

图4是本发明实施例示出的荧光材料层的结构示意图;Figure 4 is a schematic structural diagram of a fluorescent material layer according to an embodiment of the present invention;

图5是本发明实施例示出的导热单元的结构示意图。FIG. 5 is a schematic structural diagram of a thermal conductive unit according to an embodiment of the present invention.

附图标记说明:Explanation of reference symbols:

110、荧光材料层;111、发光区;112、散热区;120、耦合光纤;130、激光光源;200、散热结构;210、导热单元;211、第一换热面;212、激光通道;213、第二换热面;214、结合面;220、冷却流体;221、空气泡;230、流体装载体;231、散热内筒;232、散热外筒;233、封堵板;300、支撑构件;310、支撑底座;320、保护罩。110. Fluorescent material layer; 111. Luminous area; 112. Heat dissipation area; 120. Coupling optical fiber; 130. Laser light source; 200. Heat dissipation structure; 210. Thermal conductive unit; 211. First heat exchange surface; 212. Laser channel; 213 , Second heat exchange surface; 214, joint surface; 220, cooling fluid; 221, air bubble; 230, fluid carrier; 231, heat dissipation inner cylinder; 232, heat dissipation outer cylinder; 233, blocking plate; 300, support member ; 310. Support base; 320. Protective cover.

具体实施方式Detailed ways

为使本发明的目的、技术方案和优点更加清楚明白,以下结合具体实施例,并参照附图,对本发明作进一步的详细说明。In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

图1是本发明实施例示出的激光照明装置的结构示意图。如图1所示,该激光照明装置,包括:荧光材料层110、激光光源130和散热结构200。其中,激光光源130,用于向荧光材料层110发射激光;散热结构200,用于对荧光材料层110进行散热。Figure 1 is a schematic structural diagram of a laser lighting device according to an embodiment of the present invention. As shown in FIG. 1 , the laser lighting device includes: a fluorescent material layer 110 , a laser light source 130 and a heat dissipation structure 200 . Among them, the laser light source 130 is used to emit laser to the fluorescent material layer 110; the heat dissipation structure 200 is used to dissipate heat of the fluorescent material layer 110.

图2是本发明实施例示出的散热结构200的结构示意图;图3是图2所示的散热结构200的剖视图。如图2、图3所示,散热结构200,包括导热单元210和散热单元;其中,导热单元210用于对荧光材料层110进行导热,散热单元用于对导热单元210进行散热。FIG. 2 is a schematic structural diagram of the heat dissipation structure 200 according to an embodiment of the present invention; FIG. 3 is a cross-sectional view of the heat dissipation structure 200 shown in FIG. 2 . As shown in Figures 2 and 3, the heat dissipation structure 200 includes a heat conduction unit 210 and a heat dissipation unit; the heat conduction unit 210 is used to conduct heat to the fluorescent material layer 110, and the heat dissipation unit is used to dissipate heat from the heat conduction unit 210.

本发明实施例提供的激光照明装置,由于包括有可以直接对荧光材料层110进行散热的散热结构200,与现有技术中采用对激光光源模组进行散热的方式相比,由于采用直接对荧光材料层110进行散热,其散热效果更好,散热速率更快;此外,本发明实施例提供的激光照明激光照明装置,通过导热单元210与散热单元相结合的方式进行散热,具体地,通过导热单元210对激光照明装置的荧光材料层110进行导热,通过散热单元进一步对传导至导热单元210的热量进行散热,进而增大了散热面积,可以快速将热量散发出去,可以解决荧光材料在持续诱导激发而不能及时散热的问题,进而解决荧光材料层110由于散热不良导致的热淬灭的问题,提升改善了激光照明装置的散热效果和延长荧光材料的使用寿命;且该激光照明装置,结构简单,易于拆卸和更换,实用性较好。The laser lighting device provided by the embodiment of the present invention includes a heat dissipation structure 200 that can directly dissipate heat to the fluorescent material layer 110. Compared with the method of dissipating heat of the laser light source module in the prior art, the laser lighting device directly dissipates the fluorescent material layer 110. The material layer 110 dissipates heat, and its heat dissipation effect is better and the heat dissipation rate is faster; in addition, the laser lighting device provided by the embodiment of the present invention dissipates heat through the combination of the heat conduction unit 210 and the heat dissipation unit, specifically, through the heat conduction unit 210 The unit 210 conducts heat to the fluorescent material layer 110 of the laser lighting device, and further dissipates the heat conducted to the heat conduction unit 210 through the heat dissipation unit, thereby increasing the heat dissipation area and quickly dissipating the heat, which can solve the problem of continuous induction of fluorescent materials. It solves the problem of heat dissipation due to poor heat dissipation of the fluorescent material layer 110, thereby improving the heat dissipation effect of the laser lighting device and extending the service life of the fluorescent material; and the laser lighting device has a simple structure , easy to disassemble and replace, and has good practicality.

图4是本发明实施例示出的荧光材料层110的结构示意图,作为一种可选的实施例,如图4所示,荧光材料层110,包括发光区111和散热区112,其中发光区111用于受激光激发后发光;通过散热结构200对散热区112进行散热,进而达到对荧光材料层110降温的目的。Figure 4 is a schematic structural diagram of the fluorescent material layer 110 according to an embodiment of the present invention. As an optional embodiment, as shown in Figure 4, the fluorescent material layer 110 includes a light-emitting area 111 and a heat dissipation area 112, where the light-emitting area 111 It is used to emit light after being excited by laser; the heat dissipation area 112 is dissipated through the heat dissipation structure 200, thereby achieving the purpose of cooling the fluorescent material layer 110.

图5是本发明实施例示出的导热单元210的结构示意图。如图5所示,导热单元210,包括第一换热面211、激光通道212、第二换热面213、结合面214。其中激光通道212贯通导热单元210,且激光通道212的两端分别延伸至第一换热面211和第二换热面213;设置激光通道212,使得激光光源130发射的激光能够通过激光通道212发射至荧光材料层110。可选地,荧光材料层110为圆形片状结构,导热单元210采用环形板状结构,该环形板状结构的中心孔即为激光通道212,第一换热面211、第二换热面213分别为该环形板状结构的上下两个环端面,结合面214为该环形板状结构的柱面。FIG. 5 is a schematic structural diagram of the thermal conduction unit 210 according to an embodiment of the present invention. As shown in FIG. 5 , the heat conduction unit 210 includes a first heat exchange surface 211 , a laser channel 212 , a second heat exchange surface 213 , and a bonding surface 214 . The laser channel 212 penetrates the heat conduction unit 210, and the two ends of the laser channel 212 extend to the first heat exchange surface 211 and the second heat exchange surface 213 respectively; the laser channel 212 is provided so that the laser emitted by the laser light source 130 can pass through the laser channel 212 Emitted to the fluorescent material layer 110. Optionally, the fluorescent material layer 110 has a circular sheet structure, and the heat conduction unit 210 adopts an annular plate structure. The central hole of the annular plate structure is the laser channel 212, and the first heat exchange surface 211 and the second heat exchange surface are 213 are respectively the upper and lower annular end surfaces of the annular plate-like structure, and the joint surface 214 is the cylindrical surface of the annular plate-like structure.

作为一种可选的实施例,导热单元210采用导热材料制成,可选为包括但不限于铝、铜等具有良好导热率的材料,以保证良好的导热效果。As an optional embodiment, the thermal conductive unit 210 is made of thermal conductive material, which may include but is not limited to aluminum, copper and other materials with good thermal conductivity to ensure good thermal conductivity.

如图2、图3所示,散热单元,包括冷却流体220、以及用于容纳冷却流体220的流体装载体230。As shown in FIGS. 2 and 3 , the heat dissipation unit includes a cooling fluid 220 and a fluid carrier 230 for containing the cooling fluid 220 .

作为一种可选的实施例,流体装载体230包括:散热内筒231、散热外筒232和封堵板233;其中,第二换热面213、散热内筒231的外壁、散热外筒232的内壁和封堵板233的上表面,围合形成密闭的容纳腔,容纳腔用于容纳冷却流体220。其中,散热内筒231与激光通道212连通,具体地,散热内筒231的上端嵌套固接在激光通道212内,使得激光光源130发射的激光能够通过散热内筒231和激光通道212后发射至荧光材料层110。可选地,散热内筒231的上端可以直接紧固嵌套固接在激光通道212,或者通过导热硅胶将散热内筒231的上端与激光通道212内壁粘合在一起。导热单元210通过结合面214固接在流体装载体230上,具体地,散热外筒232的上端与导热单元210结合面214固接在一起,可选地,散热外筒232的上端可以紧固嵌套在导热单元210外,或者通过导热硅胶将散热外筒232的上端与导热单元210的结合面214粘合在一起。可选地,封堵板233采用环形板状结构,封堵板233的内环缘与散热内筒231的下缘焊接或粘接在一起,封堵板233的外环缘与散热外筒232的下缘焊接或粘接在一起。As an optional embodiment, the fluid loading body 230 includes: a heat dissipation inner cylinder 231, a heat dissipation outer cylinder 232 and a blocking plate 233; wherein, the second heat exchange surface 213, the outer wall of the heat dissipation inner cylinder 231, the heat dissipation outer cylinder 232 The inner wall and the upper surface of the blocking plate 233 form a closed receiving cavity, which is used to accommodate the cooling fluid 220 . Among them, the heat dissipation inner cylinder 231 is connected with the laser channel 212. Specifically, the upper end of the heat dissipation inner cylinder 231 is nested and fixed in the laser channel 212, so that the laser emitted by the laser light source 130 can pass through the heat dissipation inner cylinder 231 and the laser channel 212 before being emitted. to the fluorescent material layer 110. Alternatively, the upper end of the heat dissipation inner cylinder 231 can be directly fastened and nested in the laser channel 212, or the upper end of the heat dissipation inner cylinder 231 can be bonded to the inner wall of the laser channel 212 through thermally conductive silicone. The heat conduction unit 210 is fixed on the fluid carrier 230 through the coupling surface 214. Specifically, the upper end of the heat dissipation outer cylinder 232 is fixed with the coupling surface 214 of the heat conduction unit 210. Optionally, the upper end of the heat dissipation outer cylinder 232 can be fastened. Nested outside the thermal conduction unit 210, or bonded together with the upper end of the heat dissipation outer cylinder 232 and the bonding surface 214 of the thermal conduction unit 210 through thermal conductive silicone. Optionally, the blocking plate 233 adopts an annular plate structure, the inner ring edge of the blocking plate 233 is welded or bonded to the lower edge of the heat dissipation inner cylinder 231, and the outer ring edge of the blocking plate 233 is connected to the heat dissipation outer cylinder 232. The lower edges are welded or glued together.

导热单元210通过第一换热面211吸收散热区112的热量;作为一种可选的实施例,第一换热面211和散热区112直接接触;或第一换热面211和散热区112通过导热硅胶固接在一起。其中,荧光材料层110的发光区111部分不涂抹导热硅胶,避免影响激光入射激发荧光材料层110。导热单元210吸收散热区112的热量后,需要通过散热单元对其散热将热量散发出去,具体地,通过散热单元中的冷却流体220与导热单元210的第二换热面213进行换热,实现对导热单元210散热的目的。The heat conduction unit 210 absorbs heat from the heat dissipation area 112 through the first heat exchange surface 211; as an optional embodiment, the first heat exchange surface 211 and the heat dissipation area 112 are in direct contact; or the first heat exchange surface 211 and the heat dissipation area 112 are in direct contact. Fastened together by thermally conductive silicone. Among them, the light-emitting area 111 of the fluorescent material layer 110 is not coated with thermal conductive silicone to avoid affecting the laser incident excitation of the fluorescent material layer 110. After the heat transfer unit 210 absorbs the heat in the heat dissipation area 112, it needs to dissipate the heat through the heat dissipation unit. Specifically, the cooling fluid 220 in the heat dissipation unit exchanges heat with the second heat exchange surface 213 of the heat transfer unit 210 to achieve this. The purpose of dissipating heat from the thermal conduction unit 210.

作为一种可选的实施例,散热内筒231和散热外筒232采用导热材料,可选为金属材料,或可选为包括但不限于铝、铜等具有良好导热率的材料,保证散热内筒231和散热外筒232具有良好的导热效果,便于进一步及时将冷却流体220的热量散发出去。As an optional embodiment, the heat dissipation inner cylinder 231 and the heat dissipation outer cylinder 232 are made of thermally conductive materials, which can be metal materials, or materials with good thermal conductivity including but not limited to aluminum, copper, etc., to ensure that the heat dissipation inner cylinder The cylinder 231 and the outer heat dissipation cylinder 232 have good heat conduction effect, which facilitates dissipating the heat of the cooling fluid 220 in a timely manner.

作为一种可选的实施例,冷却流体220选取沸点为100℃的水,以此作为散热的工作介质。As an optional embodiment, the cooling fluid 220 is water with a boiling point of 100° C. as the working medium for heat dissipation.

作为一种可选的实施例,冷却流体220内设有空气泡221。空气泡221可以采用由硅胶或塑料形成的气囊,其体积可由工作介质的具体工作温度确定。空气泡221的作用在于使冷却流体220在温度变化的情况下持续充满流体装载体230内部的容纳腔,随着温度的升高,冷却流体220体积受热膨胀,由于空气的可压缩性小于冷却流体220的可压缩性,因此空气泡221受压缩,以吸收冷却流体220的体积膨胀量,当温度降低时,冷却流体220体积相对减小,因空气的膨胀系数大于冷却流体220的膨胀系数,空气泡221膨胀,弥补冷却流体220的体积缩小量。可见设置空气泡221,可以有效缓解冷却流体220在温度降低的情况下体积变小无法充满容纳腔的问题,以及冷却流体220在温度升高的情况下,由于其体积膨胀压迫流体装载体230的腔壁造成流体装载体230损坏的问题。由于冷却流体220持续充满流体装载体230内部的容纳腔,因此可保证冷却流体220与导热单元210的第二换热面213稳定接触,保证对导热单元210的散热效果。As an optional embodiment, air bubbles 221 are provided in the cooling fluid 220 . The air bubble 221 can be an air bag formed of silica gel or plastic, and its volume can be determined by the specific working temperature of the working medium. The function of the air bubble 221 is to continuously fill the accommodation cavity inside the fluid carrier 230 with the cooling fluid 220 when the temperature changes. As the temperature increases, the volume of the cooling fluid 220 expands due to heat. Since the compressibility of air is smaller than that of the cooling fluid, 220 is compressible, so the air bubble 221 is compressed to absorb the volume expansion of the cooling fluid 220. When the temperature decreases, the volume of the cooling fluid 220 decreases relatively because the expansion coefficient of air is greater than the expansion coefficient of the cooling fluid 220. The bubble 221 expands to compensate for the volume reduction of the cooling fluid 220. It can be seen that the provision of air bubbles 221 can effectively alleviate the problem that the cooling fluid 220 becomes smaller in volume and cannot fill the containing cavity when the temperature decreases. Also, when the temperature of the cooling fluid 220 increases, the volume expansion of the cooling fluid 220 presses the fluid carrier 230 The cavity wall causes damage to the fluid carrier 230 . Since the cooling fluid 220 continues to fill the accommodation cavity inside the fluid carrier 230 , stable contact between the cooling fluid 220 and the second heat exchange surface 213 of the heat transfer unit 210 is ensured, ensuring the heat dissipation effect of the heat transfer unit 210 .

作为一种可选的实施例,该激光照明装置还包括耦合光纤120,耦合光纤120连通至激光照明装置的散热内筒231,用于将激光光源130发射的激光定向传输至散热内筒231,之后,激光穿过散热内筒231和导热单元210的激光通道212,射向荧光材料层110的发光区111。As an optional embodiment, the laser lighting device also includes a coupling optical fiber 120. The coupling optical fiber 120 is connected to the heat dissipation inner cylinder 231 of the laser lighting device and is used to directionally transmit the laser light emitted by the laser light source 130 to the heat dissipation inner cylinder 231. After that, the laser passes through the heat dissipation inner cylinder 231 and the laser channel 212 of the heat conduction unit 210, and is emitted to the light-emitting area 111 of the fluorescent material layer 110.

本发明实施例通过设置耦合光纤120,将激光光源130与荧光材料层110、以及散热结构200分离设置,分区化设置每个功能结构模块,便于单独维修,且每个功能结构模块体积可以做到较小尺寸,便于装配。The embodiment of the present invention separates the laser light source 130 from the fluorescent material layer 110 and the heat dissipation structure 200 by arranging the coupling optical fiber 120, and sets each functional structural module in a partitioned manner to facilitate independent maintenance, and the volume of each functional structural module can be Smaller size for easy assembly.

作为一种可选的实施例,散热内筒231的内壁设有全反射光学层。因激光在传输过程中需要穿过散热内筒231,为防止激光在散热内筒231内传输时产生光学损耗,在散热内筒231的内壁蒸镀全反射光学层。As an optional embodiment, the inner wall of the heat dissipation inner cylinder 231 is provided with a total reflection optical layer. Since the laser needs to pass through the inner heat dissipation cylinder 231 during transmission, in order to prevent optical loss when the laser is transmitted within the heat dissipation inner cylinder 231, a total reflection optical layer is evaporated on the inner wall of the heat dissipation inner cylinder 231.

作为一种可选的实施例,该激光照明装置还包括支撑构件300,支撑构件300包括支撑底座310和安装在支撑底座310上的保护罩320,其中,支撑底座310用于安装支撑激光光源130和散热结构200,保护罩320采用透光材料,且位于荧光材料层110所在一侧,用于保护荧光材料层110以及激光照明装置的其他部件不受损坏。As an optional embodiment, the laser lighting device further includes a support member 300. The support member 300 includes a support base 310 and a protective cover 320 installed on the support base 310. The support base 310 is used to install and support the laser light source 130. and the heat dissipation structure 200. The protective cover 320 is made of light-transmitting material and is located on the side of the fluorescent material layer 110 to protect the fluorescent material layer 110 and other components of the laser lighting device from damage.

以上所述的具体实施例,对本发明的目的、技术方案和有益效果进行了进一步详细说明,应理解的是,以上所述仅为本发明的具体实施例而已,并不用于限制本发明,凡在本发明的精神和原则之内,所做的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。The specific embodiments described above further describe the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above are only specific embodiments of the present invention and are not intended to limit the present invention. Within the spirit and principles of the present invention, any modifications, equivalent substitutions, improvements, etc. shall be included in the protection scope of the present invention.

Claims (6)

1.一种激光照明装置,其特征在于,包括:1. A laser lighting device, characterized in that it includes: 荧光材料层(110);fluorescent material layer (110); 激光光源(130),用于向所述荧光材料层(110)发射激光;Laser light source (130), used to emit laser light to the fluorescent material layer (110); 散热结构(200),包括导热单元(210)和散热单元;所述导热单元(210)用于对所述荧光材料层(110)进行导热;所述散热单元用于对所述导热单元(210)进行散热;The heat dissipation structure (200) includes a heat conduction unit (210) and a heat dissipation unit; the heat conduction unit (210) is used to conduct heat to the fluorescent material layer (110); the heat dissipation unit is used to conduct heat to the heat conduction unit (210). ) to dissipate heat; 其中,所述荧光材料层(110),包括发光区(111)和散热区(112);Wherein, the fluorescent material layer (110) includes a light emitting area (111) and a heat dissipation area (112); 所述导热单元(210),包括第一换热面(211)、第二换热面(213)、结合面(214)、以及激光通道(212),其中所述激光通道(212)贯通所述导热单元(210),且所述激光通道(212)的两端分别延伸至所述第一换热面(211)和所述第二换热面(213);The heat conduction unit (210) includes a first heat exchange surface (211), a second heat exchange surface (213), a bonding surface (214), and a laser channel (212), wherein the laser channel (212) passes through all The heat conduction unit (210), and the two ends of the laser channel (212) extend to the first heat exchange surface (211) and the second heat exchange surface (213) respectively; 所述散热单元,包括冷却流体(220)、以及用于容纳所述冷却流体(220)的流体装载体(230);The heat dissipation unit includes a cooling fluid (220) and a fluid carrier (230) used to accommodate the cooling fluid (220); 其中,所述导热单元(210)通过所述第一换热面(211)吸收所述散热区(112)的热量;所述导热单元(210)通过所述结合面(214)固接在所述流体装载体(230)上;所述激光通道(212)连通至所述发光区(111);所述散热单元通过所述冷却流体(220)与所述第二换热面(213)进行换热;Among them, the heat conduction unit (210) absorbs the heat of the heat dissipation area (112) through the first heat exchange surface (211); the heat conduction unit (210) is fixed on the heat dissipation area (112) through the bonding surface (214). On the fluid carrier (230); the laser channel (212) is connected to the light-emitting area (111); the heat dissipation unit conducts operation through the cooling fluid (220) and the second heat exchange surface (213). heat exchange; 所述冷却流体(220)内设有空气泡(221);The cooling fluid (220) is provided with air bubbles (221); 所述流体装载体(230)包括:散热内筒(231)、散热外筒(232)和封堵板(233);其中,所述第二换热面(213)、所述散热内筒(231)的外壁、所述散热外筒(232)的内壁和所述封堵板(233)的上表面,围合形成密闭的容纳腔,所述容纳腔用于容纳所述冷却流体(220);The fluid carrying body (230) includes: a heat dissipation inner cylinder (231), a heat dissipation outer cylinder (232) and a blocking plate (233); wherein the second heat exchange surface (213), the heat dissipation inner cylinder (233) The outer wall of 231), the inner wall of the heat dissipation outer cylinder (232) and the upper surface of the blocking plate (233) form a closed accommodation cavity, and the accommodation cavity is used to accommodate the cooling fluid (220) ; 所述散热内筒(231)与所述激光通道(212)连通;The heat dissipation inner cylinder (231) is connected with the laser channel (212); 所述激光照明装置还包括:耦合光纤(120),连通至所述激光照明装置的散热内筒(231)。The laser lighting device also includes: a coupling optical fiber (120) connected to the heat dissipation inner barrel (231) of the laser lighting device. 2.根据权利要求1所述的激光照明装置,其特征在于:2. The laser lighting device according to claim 1, characterized in that: 所述导热单元(210)采用导热材料制成。The thermal conductive unit (210) is made of thermal conductive material. 3.根据权利要求1所述的激光照明装置,其特征在于:3. The laser lighting device according to claim 1, characterized in that: 所述第一换热面(211)和所述散热区(112)直接接触;或The first heat exchange surface (211) and the heat dissipation area (112) are in direct contact; or 所述第一换热面(211)和所述散热区(112)通过导热硅胶固接在一起。The first heat exchange surface (211) and the heat dissipation area (112) are fixed together through thermally conductive silicone. 4.根据权利要求1所述的激光照明装置,其特征在于:4. The laser lighting device according to claim 1, characterized in that: 所述散热内筒(231)的内壁设有全反射光学层。The inner wall of the heat dissipation inner cylinder (231) is provided with a total reflection optical layer. 5.根据权利要求1所述的激光照明装置,其特征在于:5. The laser lighting device according to claim 1, characterized in that: 所述散热内筒(231)和所述散热外筒(232)采用导热材料。The heat dissipation inner cylinder (231) and the heat dissipation outer cylinder (232) are made of thermally conductive materials. 6.根据权利要求1所述的激光照明装置,其特征在于,还包括:6. The laser lighting device according to claim 1, further comprising: 支撑构件(300),包括支撑底座(310)和安装在所述支撑底座(310)上的保护罩(320),其中,所述支撑底座(310)用于安装支撑所述激光光源(130)和所述散热结构(200),所述保护罩(320)位于所述荧光材料层(110)所在一侧。The support member (300) includes a support base (310) and a protective cover (320) installed on the support base (310), wherein the support base (310) is used to install and support the laser light source (130) And the heat dissipation structure (200), the protective cover (320) is located on the side where the fluorescent material layer (110) is located.
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