CN112648548B - Laser lighting device - Google Patents

Abstract

The invention discloses a laser lighting device, comprising: a fluorescent material layer, a laser light source and a heat dissipation structure; wherein the laser light source is used for emitting laser to the fluorescent material layer; the heat radiation structure comprises a heat conduction unit and a heat radiation unit, wherein the heat conduction unit is used for conducting heat to the fluorescent material layer, and the heat radiation unit is used for radiating heat to the heat conduction unit. The laser lighting device provided by the invention can at least partially solve the problem of thermal quenching of the fluorescent material layer caused by poor heat dissipation in the prior art.

Description

Laser lighting device

Technical field

The invention belongs to the technical field of laser lighting and mainly relates to a laser lighting device.

Background technique

At present, the ways to obtain white light sources for laser lighting include: using blue lasers to excite yellow fluorescent materials and using ultraviolet lasers to excite multi-color fluorescent materials to form white light; because of its high light efficiency, environmental protection, small size and other characteristics, it is widely used in many applications. in the field.

However, the luminous power of this light source is limited to a low level. Since the laser beam emitted by the laser has good directivity, the focused spot can reach a minimum diameter of several microns when working at high power density. When directly irradiated on the surface of the phosphor, it will quickly accumulate heat. Using fluorescent materials and traditional Poor packaging process will cause the phosphor to rapidly attenuate or even be quenched, causing the laser light source system to suffer from light attenuation and unstable light color, which will ultimately affect the practical application of high-power laser lighting. Secondly, due to the characteristics of small laser spot and concentrated beam, the laser power density at the receiving surface of the fluorescent material is very high. When the light passes through the phosphor layer, part of the light energy is lost due to quantum efficiency loss, Stokes shift loss and absorption loss. will be converted into heat. Due to the relatively low thermal conductivity of the organic binder, it may further cause an increase in the phosphor temperature. Above a certain temperature, the quantum efficiency of fluorescent materials begins to decline rapidly. The decrease in quantum efficiency will cause the heat generated in the phosphor layer to further increase and the temperature to further increase, which will in turn result in a further decrease in quantum efficiency. This thermal runaway effect is called phosphor thermal quenching, making it difficult to meet the needs of high-power laser applications.

At present, for the problem of heat dissipation in laser lighting, most solutions are to dissipate the heat of the laser light source module. The heat dissipation effect is not ideal and cannot achieve the expected heat dissipation effect. It is easy to cause thermal quenching of the fluorescent material layer due to poor heat dissipation. question.

Contents of the invention

(1) Technical problems to be solved

In view of this, the present invention aims to provide a laser lighting device, which can at least partially solve the problem of thermal quenching of the fluorescent material layer due to poor heat dissipation in the prior art.

(2) Technical solutions

A laser lighting device, including: a fluorescent material layer; a laser light source for emitting laser light to the fluorescent material layer; a heat dissipation structure including a heat conduction unit and a heat dissipation unit; the heat conduction unit is used to conduct heat to the fluorescent material layer ; The heat dissipation unit is used to dissipate heat from the heat conduction unit.

Optionally, the fluorescent material layer includes a light emitting area and a heat dissipation area; the thermal conductive unit includes a first heat exchange surface, a second heat exchange surface, a bonding surface, and a laser channel, wherein the laser channel passes through the a heat conduction unit, and both ends of the laser channel extend to the first heat exchange surface and the second heat exchange surface respectively; the heat dissipation unit includes a cooling fluid, and a fluid device for containing the cooling fluid Carrier; wherein, the heat conduction unit absorbs the heat of the heat dissipation area through the first heat exchange surface; the heat conduction unit is fixed on the fluid carrier through the bonding surface; the laser channel is connected to the The light-emitting area; the heat dissipation unit exchanges heat with the second heat exchange surface through the cooling fluid.

Optionally, the thermal conductive unit is made of thermal conductive material.

Optionally, the cooling fluid is provided with air bubbles.

Optionally, the first heat exchange surface and the heat dissipation area are in direct contact; or the first heat exchange surface and the heat dissipation area are fixed together through thermally conductive silicone.

Optionally, the fluid carrying body includes: a heat dissipation inner cylinder, a heat dissipation outer cylinder and a blocking plate; wherein the second heat exchange surface, the outer wall of the heat dissipation inner cylinder, the inner wall of the heat dissipation outer cylinder and the The upper surface of the blocking plate is enclosed to form a sealed accommodation cavity, and the accommodation cavity is used to accommodate the cooling fluid.

Optionally, the heat dissipation inner cylinder is connected with the laser channel.

Optionally, the inner wall of the heat dissipation inner cylinder is provided with a total reflection optical layer.

Optionally, the heat dissipation inner cylinder and the heat dissipation outer cylinder are made of thermally conductive materials.

Optionally, the laser lighting device further includes: a coupling optical fiber connected to the heat dissipation inner cylinder of the laser lighting device; a support member including a support base and a protective cover installed on the support base, wherein the support base Used to install and support the laser light source and the heat dissipation structure, the protective cover is located on the side where the fluorescent material layer is located.

(3) Beneficial effects

The laser lighting device provided by the embodiment of the present invention includes a heat dissipation structure that can directly dissipate heat to the fluorescent material layer. Compared with the method of dissipating heat to the laser light source module in the prior art, since the fluorescent material layer is directly used to dissipate heat, To dissipate heat, the heat dissipation effect is better and the heat dissipation rate is faster; in addition, the laser lighting device provided by the embodiment of the present invention dissipates heat through a combination of a heat conduction unit and a heat dissipation unit. Specifically, the heat conduction unit illuminates the laser The fluorescent material layer of the device conducts heat, and the heat transferred to the heat conduction unit is further dissipated through the heat dissipation unit, thereby increasing the heat dissipation area and quickly dissipating the heat, which can solve the problem of the fluorescent material being continuously induced and excited and unable to dissipate heat in time. , thereby solving the problem of thermal quenching of the fluorescent material layer due to poor heat dissipation, improving the heat dissipation effect of the laser lighting device and extending the service life of the fluorescent material; and the laser lighting device has a simple structure, is easy to disassemble and replace, and is practical better.

Description of drawings

Figure 1 is a schematic structural diagram of a laser lighting device according to an embodiment of the present invention;

Figure 2 is a schematic structural diagram of a heat dissipation structure according to an embodiment of the present invention;

Figure 3 is a cross-sectional view of the heat dissipation structure shown in Figure 2;

Figure 4 is a schematic structural diagram of a fluorescent material layer according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a thermal conductive unit according to an embodiment of the present invention.

Explanation of reference symbols:

110. Fluorescent material layer; 111. Luminous area; 112. Heat dissipation area; 120. Coupling optical fiber; 130. Laser light source; 200. Heat dissipation structure; 210. Thermal conductive unit; 211. First heat exchange surface; 212. Laser channel; 213 , Second heat exchange surface; 214, joint surface; 220, cooling fluid; 221, air bubble; 230, fluid carrier; 231, heat dissipation inner cylinder; 232, heat dissipation outer cylinder; 233, blocking plate; 300, support member ; 310. Support base; 320. Protective cover.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

Figure 1 is a schematic structural diagram of a laser lighting device according to an embodiment of the present invention. As shown in FIG. 1 , the laser lighting device includes: a fluorescent material layer 110 , a laser light source 130 and a heat dissipation structure 200 . Among them, the laser light source 130 is used to emit laser to the fluorescent material layer 110; the heat dissipation structure 200 is used to dissipate heat of the fluorescent material layer 110.

FIG. 2 is a schematic structural diagram of the heat dissipation structure 200 according to an embodiment of the present invention; FIG. 3 is a cross-sectional view of the heat dissipation structure 200 shown in FIG. 2 . As shown in Figures 2 and 3, the heat dissipation structure 200 includes a heat conduction unit 210 and a heat dissipation unit; the heat conduction unit 210 is used to conduct heat to the fluorescent material layer 110, and the heat dissipation unit is used to dissipate heat from the heat conduction unit 210.

The laser lighting device provided by the embodiment of the present invention includes a heat dissipation structure 200 that can directly dissipate heat to the fluorescent material layer 110. Compared with the method of dissipating heat of the laser light source module in the prior art, the laser lighting device directly dissipates the fluorescent material layer 110. The material layer 110 dissipates heat, and its heat dissipation effect is better and the heat dissipation rate is faster; in addition, the laser lighting device provided by the embodiment of the present invention dissipates heat through the combination of the heat conduction unit 210 and the heat dissipation unit, specifically, through the heat conduction unit 210 The unit 210 conducts heat to the fluorescent material layer 110 of the laser lighting device, and further dissipates the heat conducted to the heat conduction unit 210 through the heat dissipation unit, thereby increasing the heat dissipation area and quickly dissipating the heat, which can solve the problem of continuous induction of fluorescent materials. It solves the problem of heat dissipation due to poor heat dissipation of the fluorescent material layer 110, thereby improving the heat dissipation effect of the laser lighting device and extending the service life of the fluorescent material; and the laser lighting device has a simple structure , easy to disassemble and replace, and has good practicality.

Figure 4 is a schematic structural diagram of the fluorescent material layer 110 according to an embodiment of the present invention. As an optional embodiment, as shown in Figure 4, the fluorescent material layer 110 includes a light-emitting area 111 and a heat dissipation area 112, where the light-emitting area 111 It is used to emit light after being excited by laser; the heat dissipation area 112 is dissipated through the heat dissipation structure 200, thereby achieving the purpose of cooling the fluorescent material layer 110.

FIG. 5 is a schematic structural diagram of the thermal conduction unit 210 according to an embodiment of the present invention. As shown in FIG. 5 , the heat conduction unit 210 includes a first heat exchange surface 211 , a laser channel 212 , a second heat exchange surface 213 , and a bonding surface 214 . The laser channel 212 penetrates the heat conduction unit 210, and the two ends of the laser channel 212 extend to the first heat exchange surface 211 and the second heat exchange surface 213 respectively; the laser channel 212 is provided so that the laser emitted by the laser light source 130 can pass through the laser channel 212 Emitted to the fluorescent material layer 110. Optionally, the fluorescent material layer 110 has a circular sheet structure, and the heat conduction unit 210 adopts an annular plate structure. The central hole of the annular plate structure is the laser channel 212, and the first heat exchange surface 211 and the second heat exchange surface are 213 are respectively the upper and lower annular end surfaces of the annular plate-like structure, and the joint surface 214 is the cylindrical surface of the annular plate-like structure.

As an optional embodiment, the thermal conductive unit 210 is made of thermal conductive material, which may include but is not limited to aluminum, copper and other materials with good thermal conductivity to ensure good thermal conductivity.

As shown in FIGS. 2 and 3 , the heat dissipation unit includes a cooling fluid 220 and a fluid carrier 230 for containing the cooling fluid 220 .

As an optional embodiment, the fluid loading body 230 includes: a heat dissipation inner cylinder 231, a heat dissipation outer cylinder 232 and a blocking plate 233; wherein, the second heat exchange surface 213, the outer wall of the heat dissipation inner cylinder 231, the heat dissipation outer cylinder 232 The inner wall and the upper surface of the blocking plate 233 form a closed receiving cavity, which is used to accommodate the cooling fluid 220 . Among them, the heat dissipation inner cylinder 231 is connected with the laser channel 212. Specifically, the upper end of the heat dissipation inner cylinder 231 is nested and fixed in the laser channel 212, so that the laser emitted by the laser light source 130 can pass through the heat dissipation inner cylinder 231 and the laser channel 212 before being emitted. to the fluorescent material layer 110. Alternatively, the upper end of the heat dissipation inner cylinder 231 can be directly fastened and nested in the laser channel 212, or the upper end of the heat dissipation inner cylinder 231 can be bonded to the inner wall of the laser channel 212 through thermally conductive silicone. The heat conduction unit 210 is fixed on the fluid carrier 230 through the coupling surface 214. Specifically, the upper end of the heat dissipation outer cylinder 232 is fixed with the coupling surface 214 of the heat conduction unit 210. Optionally, the upper end of the heat dissipation outer cylinder 232 can be fastened. Nested outside the thermal conduction unit 210, or bonded together with the upper end of the heat dissipation outer cylinder 232 and the bonding surface 214 of the thermal conduction unit 210 through thermal conductive silicone. Optionally, the blocking plate 233 adopts an annular plate structure, the inner ring edge of the blocking plate 233 is welded or bonded to the lower edge of the heat dissipation inner cylinder 231, and the outer ring edge of the blocking plate 233 is connected to the heat dissipation outer cylinder 232. The lower edges are welded or glued together.

The heat conduction unit 210 absorbs heat from the heat dissipation area 112 through the first heat exchange surface 211; as an optional embodiment, the first heat exchange surface 211 and the heat dissipation area 112 are in direct contact; or the first heat exchange surface 211 and the heat dissipation area 112 are in direct contact. Fastened together by thermally conductive silicone. Among them, the light-emitting area 111 of the fluorescent material layer 110 is not coated with thermal conductive silicone to avoid affecting the laser incident excitation of the fluorescent material layer 110. After the heat transfer unit 210 absorbs the heat in the heat dissipation area 112, it needs to dissipate the heat through the heat dissipation unit. Specifically, the cooling fluid 220 in the heat dissipation unit exchanges heat with the second heat exchange surface 213 of the heat transfer unit 210 to achieve this. The purpose of dissipating heat from the thermal conduction unit 210.

As an optional embodiment, the heat dissipation inner cylinder 231 and the heat dissipation outer cylinder 232 are made of thermally conductive materials, which can be metal materials, or materials with good thermal conductivity including but not limited to aluminum, copper, etc., to ensure that the heat dissipation inner cylinder The cylinder 231 and the outer heat dissipation cylinder 232 have good heat conduction effect, which facilitates dissipating the heat of the cooling fluid 220 in a timely manner.

As an optional embodiment, the cooling fluid 220 is water with a boiling point of 100° C. as the working medium for heat dissipation.

As an optional embodiment, air bubbles 221 are provided in the cooling fluid 220 . The air bubble 221 can be an air bag formed of silica gel or plastic, and its volume can be determined by the specific working temperature of the working medium. The function of the air bubble 221 is to continuously fill the accommodation cavity inside the fluid carrier 230 with the cooling fluid 220 when the temperature changes. As the temperature increases, the volume of the cooling fluid 220 expands due to heat. Since the compressibility of air is smaller than that of the cooling fluid, 220 is compressible, so the air bubble 221 is compressed to absorb the volume expansion of the cooling fluid 220. When the temperature decreases, the volume of the cooling fluid 220 decreases relatively because the expansion coefficient of air is greater than the expansion coefficient of the cooling fluid 220. The bubble 221 expands to compensate for the volume reduction of the cooling fluid 220. It can be seen that the provision of air bubbles 221 can effectively alleviate the problem that the cooling fluid 220 becomes smaller in volume and cannot fill the containing cavity when the temperature decreases. Also, when the temperature of the cooling fluid 220 increases, the volume expansion of the cooling fluid 220 presses the fluid carrier 230 The cavity wall causes damage to the fluid carrier 230 . Since the cooling fluid 220 continues to fill the accommodation cavity inside the fluid carrier 230 , stable contact between the cooling fluid 220 and the second heat exchange surface 213 of the heat transfer unit 210 is ensured, ensuring the heat dissipation effect of the heat transfer unit 210 .

As an optional embodiment, the laser lighting device also includes a coupling optical fiber 120. The coupling optical fiber 120 is connected to the heat dissipation inner cylinder 231 of the laser lighting device and is used to directionally transmit the laser light emitted by the laser light source 130 to the heat dissipation inner cylinder 231. After that, the laser passes through the heat dissipation inner cylinder 231 and the laser channel 212 of the heat conduction unit 210, and is emitted to the light-emitting area 111 of the fluorescent material layer 110.

The embodiment of the present invention separates the laser light source 130 from the fluorescent material layer 110 and the heat dissipation structure 200 by arranging the coupling optical fiber 120, and sets each functional structural module in a partitioned manner to facilitate independent maintenance, and the volume of each functional structural module can be Smaller size for easy assembly.

As an optional embodiment, the inner wall of the heat dissipation inner cylinder 231 is provided with a total reflection optical layer. Since the laser needs to pass through the inner heat dissipation cylinder 231 during transmission, in order to prevent optical loss when the laser is transmitted within the heat dissipation inner cylinder 231, a total reflection optical layer is evaporated on the inner wall of the heat dissipation inner cylinder 231.

As an optional embodiment, the laser lighting device further includes a support member 300. The support member 300 includes a support base 310 and a protective cover 320 installed on the support base 310. The support base 310 is used to install and support the laser light source 130. and the heat dissipation structure 200. The protective cover 320 is made of light-transmitting material and is located on the side of the fluorescent material layer 110 to protect the fluorescent material layer 110 and other components of the laser lighting device from damage.

The specific embodiments described above further describe the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above are only specific embodiments of the present invention and are not intended to limit the present invention. Within the spirit and principles of the present invention, any modifications, equivalent substitutions, improvements, etc. shall be included in the protection scope of the present invention.

Claims (6)

1. A laser lighting device, characterized in that it includes: fluorescent material layer (110); Laser light source (130), used to emit laser light to the fluorescent material layer (110); The heat dissipation structure (200) includes a heat conduction unit (210) and a heat dissipation unit; the heat conduction unit (210) is used to conduct heat to the fluorescent material layer (110); the heat dissipation unit is used to conduct heat to the heat conduction unit (210). ) to dissipate heat; Wherein, the fluorescent material layer (110) includes a light emitting area (111) and a heat dissipation area (112); The heat conduction unit (210) includes a first heat exchange surface (211), a second heat exchange surface (213), a bonding surface (214), and a laser channel (212), wherein the laser channel (212) passes through all The heat conduction unit (210), and the two ends of the laser channel (212) extend to the first heat exchange surface (211) and the second heat exchange surface (213) respectively; The heat dissipation unit includes a cooling fluid (220) and a fluid carrier (230) used to accommodate the cooling fluid (220); Among them, the heat conduction unit (210) absorbs the heat of the heat dissipation area (112) through the first heat exchange surface (211); the heat conduction unit (210) is fixed on the heat dissipation area (112) through the bonding surface (214). On the fluid carrier (230); the laser channel (212) is connected to the light-emitting area (111); the heat dissipation unit conducts operation through the cooling fluid (220) and the second heat exchange surface (213). heat exchange; The cooling fluid (220) is provided with air bubbles (221); The fluid carrying body (230) includes: a heat dissipation inner cylinder (231), a heat dissipation outer cylinder (232) and a blocking plate (233); wherein the second heat exchange surface (213), the heat dissipation inner cylinder (233) The outer wall of 231), the inner wall of the heat dissipation outer cylinder (232) and the upper surface of the blocking plate (233) form a closed accommodation cavity, and the accommodation cavity is used to accommodate the cooling fluid (220) ; The heat dissipation inner cylinder (231) is connected with the laser channel (212); The laser lighting device also includes: a coupling optical fiber (120) connected to the heat dissipation inner barrel (231) of the laser lighting device. 2. The laser lighting device according to claim 1, characterized in that: The thermal conductive unit (210) is made of thermal conductive material. 3. The laser lighting device according to claim 1, characterized in that: The first heat exchange surface (211) and the heat dissipation area (112) are in direct contact; or The first heat exchange surface (211) and the heat dissipation area (112) are fixed together through thermally conductive silicone. 4. The laser lighting device according to claim 1, characterized in that: The inner wall of the heat dissipation inner cylinder (231) is provided with a total reflection optical layer. 5. The laser lighting device according to claim 1, characterized in that: The heat dissipation inner cylinder (231) and the heat dissipation outer cylinder (232) are made of thermally conductive materials. 6. The laser lighting device according to claim 1, further comprising: The support member (300) includes a support base (310) and a protective cover (320) installed on the support base (310), wherein the support base (310) is used to install and support the laser light source (130) And the heat dissipation structure (200), the protective cover (320) is located on the side where the fluorescent material layer (110) is located.