CN112648548B - Laser lighting device - Google Patents
Laser lighting device Download PDFInfo
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- CN112648548B CN112648548B CN202011550185.5A CN202011550185A CN112648548B CN 112648548 B CN112648548 B CN 112648548B CN 202011550185 A CN202011550185 A CN 202011550185A CN 112648548 B CN112648548 B CN 112648548B
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- heat dissipation
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- lighting device
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 91
- 239000000463 material Substances 0.000 claims abstract description 52
- 239000012809 cooling fluid Substances 0.000 claims description 29
- 239000012530 fluid Substances 0.000 claims description 14
- 238000005286 illumination Methods 0.000 claims description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 239000013307 optical fiber Substances 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 5
- 238000010791 quenching Methods 0.000 abstract description 6
- 230000000171 quenching effect Effects 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 abstract 3
- 230000000694 effects Effects 0.000 description 10
- 230000000903 blocking effect Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a laser lighting device, comprising: a fluorescent material layer, a laser light source and a heat dissipation structure; wherein the laser light source is used for emitting laser to the fluorescent material layer; the heat radiation structure comprises a heat conduction unit and a heat radiation unit, wherein the heat conduction unit is used for conducting heat to the fluorescent material layer, and the heat radiation unit is used for radiating heat to the heat conduction unit. The laser lighting device provided by the invention can at least partially solve the problem of thermal quenching of the fluorescent material layer caused by poor heat dissipation in the prior art.
Description
Technical Field
The invention belongs to the technical field of laser illumination, and mainly relates to a laser illumination device.
Background
At present, the laser illumination white light source is obtained by the following modes: exciting a yellow fluorescent material by a blue laser and exciting a multicolor fluorescent material by an ultraviolet laser to form white light; because of the characteristics of higher light efficiency, environmental protection, small volume and the like, the light-emitting diode is widely applied to various fields.
However, the luminous power of such a light source is limited to a low level. Because the laser beam emitted by the laser has good directivity, the focused light spot can reach the diameter of a few microns at the minimum when working under high power density, heat can be rapidly accumulated when the laser beam is directly irradiated on the surface of the fluorescent powder, and the fluorescent powder can be rapidly attenuated or even quenched by adopting a fluorescent material and a traditional packaging process, so that the laser light source system can generate phenomena of light attenuation and unstable light color and finally influence the practicability of high-power laser illumination. And secondly, due to the characteristics of small laser light spots and concentrated light beams, the laser power density at the receiving surface of the fluorescent material is high, and when light passes through the fluorescent powder layer, part of light energy is converted into heat due to quantum efficiency loss, stokes displacement loss and absorption loss. The organic binder may further cause an increase in phosphor temperature due to its relatively low thermal conductivity. Above a certain temperature, the quantum efficiency of the fluorescent material starts to drop rapidly. The decrease in quantum efficiency will result in a further increase in the heat generated in the phosphor layer, a further increase in temperature, and a further decrease in reaction to the quantum efficiency. This thermal runaway effect is known as phosphor thermal quenching and is therefore difficult to meet the demands of high power laser applications.
At present, aiming at the problem of laser illumination heat dissipation, most schemes are to conduct heat dissipation treatment on a laser light source module, the heat dissipation effect is not ideal, the expected heat dissipation effect cannot be achieved, and the problem of thermal quenching of a fluorescent material layer due to poor heat dissipation is easy to occur.
Disclosure of Invention
First, the technical problem to be solved
In view of the foregoing, the present invention is directed to a laser lighting device, which can at least partially solve the problem of thermal quenching of a fluorescent material layer caused by poor heat dissipation in the prior art.
(II) technical scheme
A laser illumination device, comprising: a fluorescent material layer; a laser light source for emitting laser light to the fluorescent material layer; the heat dissipation structure comprises a heat conduction unit and a heat dissipation unit; the heat conduction unit is used for conducting heat to the fluorescent material layer; the heat dissipation unit is used for dissipating heat of the heat conduction unit.
Optionally, the fluorescent material layer comprises a light emitting area and a heat dissipating area; the heat conduction unit comprises a first heat exchange surface, a second heat exchange surface, a combining surface and a laser channel, wherein the laser channel penetrates through the heat conduction unit, and two ends of the laser channel extend to the first heat exchange surface and the second heat exchange surface respectively; the heat dissipation unit comprises a cooling fluid and a fluid carrier for containing the cooling fluid; the heat conduction unit absorbs heat of the heat dissipation area through the first heat exchange surface; the heat conducting unit is fixedly connected to the fluid loading body through the bonding surface; the laser channel is communicated with the light-emitting area; the heat dissipation unit exchanges heat with the second heat exchange surface through the cooling fluid.
Optionally, the heat conducting unit is made of a heat conducting material.
Optionally, air bubbles are provided in the cooling fluid.
Optionally, the first heat exchange surface is in direct contact with the heat dissipation area; or the first heat exchange surface and the heat dissipation area are fixedly connected together through heat conduction silica gel.
Optionally, the fluid carrier comprises: a heat dissipation inner cylinder, a heat dissipation outer cylinder and a plugging plate; the second heat exchange surface, the outer wall of the heat dissipation inner cylinder, the inner wall of the heat dissipation outer cylinder and the upper surface of the plugging plate are enclosed to form a closed accommodating cavity, and the accommodating cavity is used for accommodating the cooling fluid.
Optionally, the heat dissipation inner barrel is communicated with the laser channel.
Optionally, a total reflection optical layer is arranged on the inner wall of the heat dissipation inner cylinder.
Optionally, the heat dissipation inner cylinder and the heat dissipation outer cylinder are made of heat conducting materials.
Optionally, the laser lighting device further comprises: the coupling optical fiber is communicated to the heat dissipation inner cylinder of the laser lighting device; the support component comprises a support base and a protective cover arranged on the support base, wherein the support base is used for mounting and supporting the laser light source and the heat dissipation structure, and the protective cover is positioned on one side where the fluorescent material layer is positioned.
(III) beneficial effects
Compared with the prior art adopting a mode of radiating the laser light source module, the laser lighting device provided by the embodiment of the invention has the advantages that the radiating effect is better and the radiating speed is faster because the radiating is directly carried out on the fluorescent material layer; in addition, the laser lighting device provided by the embodiment of the invention dissipates heat in a mode of combining the heat conduction unit and the heat dissipation unit, specifically, the heat conduction unit conducts heat to the fluorescent material layer of the laser lighting device, and the heat dissipation unit further dissipates heat conducted to the heat conduction unit, so that the heat dissipation area is increased, the heat can be rapidly dissipated, the problem that the fluorescent material can not dissipate heat in time due to continuous induction excitation can be solved, the problem of thermal quenching of the fluorescent material layer due to poor heat dissipation is further solved, the heat dissipation effect of the laser lighting device is improved, and the service life of the fluorescent material is prolonged; and this laser lighting device, simple structure easily dismantles and changes, and the practicality is better.
Drawings
Fig. 1 is a schematic view of a laser lighting device according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a heat dissipating structure according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view of the heat dissipating structure shown in FIG. 2;
FIG. 4 is a schematic diagram of a structure of a phosphor layer according to an embodiment of the present invention;
fig. 5 is a schematic structural view of a heat conduction unit according to an embodiment of the present invention.
Reference numerals illustrate:
110. a fluorescent material layer; 111. a light emitting region; 112. a heat dissipation area; 120. coupling an optical fiber; 130. a laser light source; 200. a heat dissipation structure; 210. a heat conduction unit; 211. a first heat exchange surface; 212. a laser channel; 213. a second heat exchange surface; 214. a bonding surface; 220. a cooling fluid; 221. air bubbles; 230. a fluid carrier; 231. a heat dissipation inner cylinder; 232. a heat dissipation outer cylinder; 233. a plugging plate; 300. a support member; 310. a support base; 320. and a protective cover.
Detailed Description
The present invention will be further described in detail below with reference to specific embodiments and with reference to the accompanying drawings, in order to make the objects, technical solutions and advantages of the present invention more apparent.
Fig. 1 is a schematic view of a laser lighting device according to an embodiment of the present invention. As shown in fig. 1, the laser lighting device includes: a layer of phosphor material 110, a laser light source 130, and a heat dissipating structure 200. Wherein, the laser light source 130 is used for emitting laser to the fluorescent material layer 110; the heat dissipation structure 200 is used for dissipating heat of the fluorescent material layer 110.
Fig. 2 is a schematic structural diagram of a heat dissipation structure 200 according to an embodiment of the present invention; fig. 3 is a cross-sectional view of the heat dissipation structure 200 shown in fig. 2. As shown in fig. 2 and 3, the heat dissipation structure 200 includes a heat conduction unit 210 and a heat dissipation unit; the heat conducting unit 210 is used for conducting heat to the fluorescent material layer 110, and the heat dissipating unit is used for dissipating heat to the heat conducting unit 210.
Compared with the prior art adopting a mode of radiating the laser light source module, the laser lighting device provided by the embodiment of the invention has the advantages that the radiating effect is better and the radiating speed is faster because the laser lighting device directly radiates the fluorescent material layer 110 because the laser lighting device comprises the radiating structure 200 which can directly radiate the fluorescent material layer 110; in addition, the laser lighting device provided by the embodiment of the invention dissipates heat in a mode of combining the heat conduction unit 210 with the heat dissipation unit, specifically, the heat conduction unit 210 conducts heat to the fluorescent material layer 110 of the laser lighting device, and the heat dissipation unit further dissipates heat conducted to the heat conduction unit 210, so that the heat dissipation area is increased, the heat can be rapidly dissipated, the problem that the fluorescent material can not dissipate heat in time due to continuous induction excitation can be solved, the problem of thermal quenching of the fluorescent material layer 110 due to poor heat dissipation is further solved, the heat dissipation effect of the laser lighting device is improved, and the service life of the fluorescent material is prolonged; and this laser lighting device, simple structure easily dismantles and changes, and the practicality is better.
FIG. 4 is a schematic structural view of a fluorescent material layer 110 according to an embodiment of the present invention, as an alternative embodiment, as shown in FIG. 4, the fluorescent material layer 110 includes a light emitting region 111 and a heat dissipating region 112, where the light emitting region 111 is used for emitting light after being excited by laser light; the heat dissipation structure 200 dissipates heat from the heat dissipation area 112, so as to achieve the purpose of cooling the fluorescent material layer 110.
Fig. 5 is a schematic structural view of the heat conductive unit 210 according to an embodiment of the present invention. As shown in fig. 5, the heat conduction unit 210 includes a first heat exchange surface 211, a laser channel 212, a second heat exchange surface 213, and a bonding surface 214. The laser channel 212 penetrates the heat conducting unit 210, and two ends of the laser channel 212 extend to the first heat exchange surface 211 and the second heat exchange surface 213 respectively; the laser channel 212 is provided such that laser light emitted from the laser light source 130 can be emitted to the fluorescent material layer 110 through the laser channel 212. Optionally, the fluorescent material layer 110 is in a circular sheet structure, the heat conducting unit 210 adopts an annular plate structure, a central hole of the annular plate structure is a laser channel 212, the first heat exchange surface 211 and the second heat exchange surface 213 are respectively an upper annular end surface and a lower annular end surface of the annular plate structure, and the bonding surface 214 is a cylindrical surface of the annular plate structure.
As an alternative embodiment, the heat conductive unit 210 is made of a heat conductive material, and may be selected from materials having good heat conductivity including, but not limited to, aluminum, copper, etc., to ensure good heat conductive effect.
As shown in fig. 2 and 3, the heat dissipating unit includes a cooling fluid 220 and a fluid carrier 230 for containing the cooling fluid 220.
As an alternative embodiment, the fluid carrier 230 includes: a heat dissipation inner cylinder 231, a heat dissipation outer cylinder 232, and a blocking plate 233; the second heat exchange surface 213, the outer wall of the heat dissipation inner cylinder 231, the inner wall of the heat dissipation outer cylinder 232, and the upper surface of the plugging plate 233 enclose to form a closed accommodating cavity, and the accommodating cavity is used for accommodating the cooling fluid 220. The heat dissipation inner cylinder 231 is communicated with the laser channel 212, specifically, the upper end of the heat dissipation inner cylinder 231 is nested and fixedly connected in the laser channel 212, so that the laser emitted by the laser source 130 can be emitted to the fluorescent material layer 110 through the heat dissipation inner cylinder 231 and the laser channel 212. Alternatively, the upper end of the heat dissipation inner cylinder 231 may be directly fastened, nested and fixedly connected to the laser channel 212, or the upper end of the heat dissipation inner cylinder 231 and the inner wall of the laser channel 212 are bonded together by heat-conducting silica gel. The heat conducting unit 210 is fixedly connected to the fluid carrier 230 through the bonding surface 214, specifically, the upper end of the heat dissipating outer cylinder 232 is fixedly connected to the bonding surface 214 of the heat conducting unit 210, alternatively, the upper end of the heat dissipating outer cylinder 232 may be tightly nested outside the heat conducting unit 210, or the upper end of the heat dissipating outer cylinder 232 is bonded to the bonding surface 214 of the heat conducting unit 210 through heat conducting silica gel. Alternatively, the blocking plate 233 has an annular plate-like structure, and the inner rim of the blocking plate 233 is welded or bonded to the lower rim of the heat dissipation inner cylinder 231, and the outer rim of the blocking plate 233 is welded or bonded to the lower rim of the heat dissipation outer cylinder 232.
The heat conduction unit 210 absorbs heat of the heat dissipation area 112 through the first heat exchange surface 211; as an alternative embodiment, the first heat exchanging surface 211 is in direct contact with the heat dissipating area 112; or the first heat exchange surface 211 and the heat dissipation area 112 are fixedly connected together through heat conducting silica gel. The light emitting region 111 of the fluorescent material layer 110 is not coated with heat conductive silica gel, so that the laser is prevented from being incident to excite the fluorescent material layer 110. After the heat conducting unit 210 absorbs the heat of the heat dissipating area 112, the heat needs to be dissipated by the heat dissipating unit, specifically, the heat dissipating unit 210 dissipates the heat through heat exchange between the cooling fluid 220 in the heat dissipating unit and the second heat exchanging surface 213 of the heat conducting unit 210.
As an alternative embodiment, the heat dissipation inner cylinder 231 and the heat dissipation outer cylinder 232 are made of a heat conducting material, optionally a metal material, or optionally a material with good heat conductivity including but not limited to aluminum, copper, etc., so that the heat dissipation inner cylinder 231 and the heat dissipation outer cylinder 232 are guaranteed to have good heat conducting effect, and heat of the cooling fluid 220 is further conveniently and timely dissipated.
As an alternative embodiment, the cooling fluid 220 is water with a boiling point of 100 ℃ as the heat dissipation working medium.
As an alternative embodiment, air bubbles 221 are provided within the cooling fluid 220. The air bubble 221 may be a bladder formed of silicone or plastic, the volume of which may be determined by the specific operating temperature of the working medium. The air bubbles 221 are used to continuously fill the receiving cavity inside the fluid-filled body 230 with the cooling fluid 220 in the case of temperature change, and as the temperature increases, the volume of the cooling fluid 220 expands due to heat, and as the compressibility of air is smaller than that of the cooling fluid 220, the air bubbles 221 are compressed to absorb the volume expansion amount of the cooling fluid 220, and as the temperature decreases, the volume of the cooling fluid 220 is relatively reduced, and as the expansion coefficient of air is larger than that of the cooling fluid 220, the air bubbles 221 expand to compensate for the volume reduction amount of the cooling fluid 220. It can be seen that the provision of the air bubbles 221 can effectively alleviate the problem that the cooling fluid 220 becomes smaller in volume and cannot fill the accommodating chamber in the case of a decrease in temperature, and the problem that the cooling fluid 220 damages the fluid carrier 230 due to its volume expansion pressing the chamber walls of the fluid carrier 230 in the case of an increase in temperature. Since the cooling fluid 220 continuously fills the accommodating cavity inside the fluid carrier 230, the cooling fluid 220 can be ensured to be in stable contact with the second heat exchange surface 213 of the heat conducting unit 210, and the heat dissipation effect on the heat conducting unit 210 can be ensured.
As an alternative embodiment, the laser lighting device further includes a coupling optical fiber 120, where the coupling optical fiber 120 is connected to the heat dissipation inner cylinder 231 of the laser lighting device, and is used to directionally transmit the laser light emitted by the laser light source 130 to the heat dissipation inner cylinder 231, and then the laser light passes through the heat dissipation inner cylinder 231 and the laser channel 212 of the heat conduction unit 210, and is directed to the light emitting region 111 of the fluorescent material layer 110.
According to the embodiment of the invention, the laser light source 130, the fluorescent material layer 110 and the heat dissipation structure 200 are arranged separately by arranging the coupling optical fiber 120, each functional structure module is arranged in a partitioning manner, so that the independent maintenance is facilitated, the volume of each functional structure module can be smaller, and the assembly is facilitated.
As an alternative embodiment, the inner wall of the heat dissipating inner cylinder 231 is provided with a total reflection optical layer. Since the laser needs to pass through the heat dissipation inner cylinder 231 during the transmission process, in order to prevent the optical loss generated when the laser is transmitted in the heat dissipation inner cylinder 231, a total reflection optical layer is evaporated on the inner wall of the heat dissipation inner cylinder 231.
As an alternative embodiment, the laser lighting device further includes a support member 300, where the support member 300 includes a support base 310 and a protection cover 320 mounted on the support base 310, and the support base 310 is used for mounting and supporting the laser light source 130 and the heat dissipation structure 200, and the protection cover 320 is made of a light-transmitting material and is located on a side of the fluorescent material layer 110, so as to protect the fluorescent material layer 110 and other components of the laser lighting device from damage.
The foregoing description of the embodiments has been provided for the purpose of illustrating the general principles of the invention, and is not meant to limit the invention thereto, but to limit the invention thereto, and any modifications, equivalents, improvements and equivalents thereof may be made without departing from the spirit and principles of the invention.
Claims (6)
1. A laser lighting device, comprising:
a layer of phosphor material (110);
a laser light source (130) for emitting laser light to the fluorescent material layer (110);
a heat dissipation structure (200) comprising a heat conduction unit (210) and a heat dissipation unit; the heat conduction unit (210) is used for conducting heat to the fluorescent material layer (110); the heat dissipation unit is used for dissipating heat of the heat conduction unit (210);
wherein the fluorescent material layer (110) comprises a light emitting region (111) and a heat dissipating region (112);
the heat conduction unit (210) comprises a first heat exchange surface (211), a second heat exchange surface (213), a combining surface (214) and a laser channel (212), wherein the laser channel (212) penetrates through the heat conduction unit (210), and two ends of the laser channel (212) respectively extend to the first heat exchange surface (211) and the second heat exchange surface (213);
the heat dissipation unit comprises a cooling fluid (220), and a fluid carrier (230) for containing the cooling fluid (220);
wherein the heat conducting unit (210) absorbs heat of the heat dissipation area (112) through the first heat exchange surface (211); the heat conducting unit (210) is fixedly connected to the fluid loading body (230) through the bonding surface (214); the laser channel (212) is communicated to the light emitting region (111); the heat radiating unit exchanges heat with the second heat exchanging surface (213) through the cooling fluid (220);
an air bubble (221) is arranged in the cooling fluid (220);
the fluid carrier (230) comprises: a heat dissipation inner cylinder (231), a heat dissipation outer cylinder (232) and a plugging plate (233); the second heat exchange surface (213), the outer wall of the heat dissipation inner cylinder (231), the inner wall of the heat dissipation outer cylinder (232) and the upper surface of the plugging plate (233) are enclosed to form a closed accommodating cavity, and the accommodating cavity is used for accommodating the cooling fluid (220);
the heat dissipation inner cylinder (231) is communicated with the laser channel (212);
the laser lighting device further includes: and the coupling optical fiber (120) is communicated with the heat dissipation inner cylinder (231) of the laser lighting device.
2. The laser lighting device of claim 1, wherein:
the heat conducting unit (210) is made of a heat conducting material.
3. The laser lighting device of claim 1, wherein:
-said first heat exchange surface (211) is in direct contact with said heat dissipation zone (112); or (b)
The first heat exchange surface (211) and the heat dissipation area (112) are fixedly connected together through heat conduction silica gel.
4. The laser lighting device of claim 1, wherein:
the inner wall of the heat dissipation inner cylinder (231) is provided with a total reflection optical layer.
5. The laser lighting device of claim 1, wherein:
the heat dissipation inner cylinder (231) and the heat dissipation outer cylinder (232) are made of heat conducting materials.
6. The laser light illumination device as recited in claim 1, further comprising:
the support member (300) comprises a support base (310) and a protective cover (320) arranged on the support base (310), wherein the support base (310) is used for mounting and supporting the laser light source (130) and the heat dissipation structure (200), and the protective cover (320) is positioned on one side where the fluorescent material layer (110) is located.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011550185.5A CN112648548B (en) | 2020-12-24 | 2020-12-24 | Laser lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011550185.5A CN112648548B (en) | 2020-12-24 | 2020-12-24 | Laser lighting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112648548A CN112648548A (en) | 2021-04-13 |
| CN112648548B true CN112648548B (en) | 2023-12-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011550185.5A Active CN112648548B (en) | 2020-12-24 | 2020-12-24 | Laser lighting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112648548B (en) |
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| JP2015032599A (en) * | 2013-07-31 | 2015-02-16 | 株式会社小糸製作所 | Light-emitting device having semiconductor light source |
| CN108180403A (en) * | 2018-02-12 | 2018-06-19 | 中国人民大学 | A kind of liquid cold laser light-emitting device and preparation method thereof |
| CN207539658U (en) * | 2017-11-24 | 2018-06-26 | 青岛市光电工程技术研究院 | Solid state light source and system |
| CN108286662A (en) * | 2017-09-06 | 2018-07-17 | 绵阳聚强极风科技有限公司 | A kind of high efficiency and heat radiation fluorescence excitation device |
| CN109429533A (en) * | 2016-03-18 | 2019-03-05 | 株式会社小糸制作所 | Fluorescent member and light emitting module |
| CN109937326A (en) * | 2016-11-17 | 2019-06-25 | 三菱电机株式会社 | Light emitting device, electronic equipment, lighting device and headlight for automobile |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9389492B2 (en) * | 2014-07-28 | 2016-07-12 | Christie Digital Systems Usa, Inc. | Rotationally static light emitting material with rotating optics |
-
2020
- 2020-12-24 CN CN202011550185.5A patent/CN112648548B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015032599A (en) * | 2013-07-31 | 2015-02-16 | 株式会社小糸製作所 | Light-emitting device having semiconductor light source |
| CN109429533A (en) * | 2016-03-18 | 2019-03-05 | 株式会社小糸制作所 | Fluorescent member and light emitting module |
| CN109937326A (en) * | 2016-11-17 | 2019-06-25 | 三菱电机株式会社 | Light emitting device, electronic equipment, lighting device and headlight for automobile |
| CN108286662A (en) * | 2017-09-06 | 2018-07-17 | 绵阳聚强极风科技有限公司 | A kind of high efficiency and heat radiation fluorescence excitation device |
| CN207539658U (en) * | 2017-11-24 | 2018-06-26 | 青岛市光电工程技术研究院 | Solid state light source and system |
| CN108180403A (en) * | 2018-02-12 | 2018-06-19 | 中国人民大学 | A kind of liquid cold laser light-emitting device and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN112648548A (en) | 2021-04-13 |
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