CN112639599A

CN112639599A - Connection substrate for improving aggregation of conductive particles, conductive combination structure and touch sensor

Info

Publication number: CN112639599A
Application number: CN201880095892.4A
Authority: CN
Inventors: 陈林海
Original assignee: Shenzhen Royole Technologies Co Ltd
Current assignee: Shenzhen Royole Technologies Co Ltd
Priority date: 2018-12-28
Filing date: 2018-12-28
Publication date: 2021-04-09
Also published as: WO2020133262A1

Abstract

The application provides a connection substrate, a conductive bonding structure and a touch sensor for improving aggregation of conductive particles. The conductive combination structure and the touch sensor comprise a connection base body, wherein the connection base body comprises a flow guide block (115), a base material (111), an insulating layer (112) and a first conductive layer (113) clamped between the base material (111) and the insulating layer (112); the first conducting layer (113) comprises a plurality of first pins (114) which are arranged at intervals, the insulating layer (112) exposes the end parts of the first pins (114), the flow guide blocks (115) are arranged between two adjacent first pins (114) and are located at or close to the positions to be bound of the first pins (114), and the flow guide blocks (115) are used for dredging conducting particles (05) and reducing the risk of short circuit of two adjacent first pins (114).

Description

Connection substrate for improving aggregation of conductive particles, conductive combination structure and touch sensor

Technical Field

The application relates to the technical field of conductive bonding, in particular to a connection substrate, a conductive bonding structure and a touch sensor for improving aggregation of conductive particles.

Background

In the conventional touch device, an FPC (Flexible Printed Circuit) is bonded to a connection substrate by an ACF (Anisotropic Conductive Film). Wherein the ACF includes conductive particles. During the preparation process, the ACF is in a liquid state after being heated, and the ACF flows to the periphery during the process of pressing the FPC.

In the ACF, conductive particles are easily accumulated between adjacent pins during flowing, which easily causes short-circuiting of the adjacent pins. Moreover, as the frame of the touch device is designed to be narrower and narrower, gaps between the pins in the frame are smaller and smaller, and the possibility of short circuit of adjacent pins caused by the aggregation of conductive particles is further improved.

Disclosure of Invention

In a first aspect, an embodiment of the present application provides a connection substrate for improving aggregation of conductive particles, where the connection substrate includes a current-guiding block, a substrate, an insulating layer, and a first conductive layer sandwiched between the substrate and the insulating layer; the first conducting layer comprises a plurality of first pins arranged at intervals, the insulating layer exposes out of the end parts of the first pins, the flow guide block is arranged between every two adjacent first pins and is located at or close to the position to be bound of the first pins, and the flow guide block is used for dredging conducting particles.

According to the connection substrate for improving the aggregation of the conductive particles, the flow guide block is arranged between two adjacent first pins and at or close to the position where the first pins are to be bound, when the connection substrate is used for being combined with an anisotropic conductive material, the flow guide block conducts the conductive particles, so that the conductive particles are accumulated along the outline of the flow guide block, the path of the accumulation of the conductive particles between two adjacent first pins is increased, and the risk that the conductive particles are mutually conducted to cause short circuit of two adjacent first pins is reduced.

With reference to the first aspect, in a first implementation manner of the first aspect, the number of the flow guide blocks is multiple, and the multiple flow guide blocks are arranged between two adjacent first pins side by side. In this way, the plurality of flow guide blocks arranged side by side can further increase the profile length of the flow guide blocks, namely further increase the path of the conductive particle accumulation.

With reference to the first aspect, in a second implementation manner of the first aspect, the cross-sectional shape of the flow guiding block is a polygon, an ellipse, or a circle. Thus, the guide block is ensured to have a longer contour length.

With reference to the first aspect, in a third implementation manner of the first aspect, the cross-sectional shape of the flow guide block is a triangle.

With reference to the third implementation manner of the first aspect, in a fourth implementation manner of the first aspect, the width of the triangle is gradually increased along a direction away from the to-be-bound position. Thus, the conductive particles are stacked along both sides of the triangle, and the path of stacking is long.

With reference to the first aspect, in a fifth implementation manner of the first aspect, the cross-sectional shape of the flow guide block is a trapezoid.

With reference to the fifth implementation manner of the first aspect, in a sixth implementation manner of the first aspect, the width of the trapezoid gradually increases along a direction away from the to-be-bound position. Thus, the conductive particles are stacked along the two waist and short sides of the trapezoid, and the path of the stacking is long.

In a second aspect, the present application provides a conductive bonding structure for improving aggregation of conductive particles, the conductive bonding structure including an FPC for improving aggregation of conductive particles, a connection matrix for improving aggregation of conductive particles, and an anisotropic conductive material, wherein the anisotropic conductive material includes a resin and conductive particles embedded in the resin; the connecting base body comprises a flow guide block, a base material, an insulating layer and a first conducting layer clamped between the base material and the insulating layer, the first conducting layer comprises a plurality of first pins arranged at intervals, the insulating layer exposes the end parts of the first pins, and the end parts of the first pins are electrically connected with the FPC through anisotropic conducting materials; the flow guide block is arranged between two adjacent first pins and is located at or close to the position to be bound of the first pins, and the flow guide block is used for dredging the conductive particles.

The conductive combination structure for improving the aggregation of the conductive particles, provided in the second aspect, is characterized in that a flow guide block is arranged between two adjacent first pins and at or near the position to be bound of the first pins, and the flow guide block is used for dredging the conductive particles, so that the conductive particles are accumulated along the outline of the flow guide block, the accumulated path is longer, and the risk of short circuit of the two adjacent first pins caused by mutual conduction of the conductive particles is reduced.

With reference to the second aspect, in a first implementation manner of the second aspect, the FPC includes a first base layer, a second base layer, and a second conductive layer sandwiched between the first base layer and the second base layer; the second conducting layer comprises a plurality of second pins arranged at intervals, the end parts of the second pins are exposed out of the first base layer, the anisotropic conducting material is clamped between the end parts of the first pins and the end parts of the second pins, and the end parts of the first pins correspond to the end parts of the second pins one to one.

With reference to the first implementation manner of the second aspect, in a second implementation manner of the second aspect, the edge of the first base layer is provided with a groove, the groove is located between two adjacent second pins, and the groove is used for increasing a path along which conductive particles are stacked. The edge of the first base layer and the position between the two adjacent second pins are provided with the groove, and the conductive particles are accumulated along the wall surface of the groove, so that the accumulated path of the conductive particles between the two adjacent second pins at the edge of the first base layer is increased, and the risk that the conductive particles are mutually conducted to cause short circuit of the two adjacent second pins is reduced.

With reference to the second implementation manner of the second aspect, in a third implementation manner of the second aspect, the width of the opening of the groove is equal to the distance between two adjacent second pins. In this way, the length of the wall surface of the recess is made as large as possible, i.e., the path of the conductive particle deposition is further increased.

With reference to the third implementation manner of the second aspect, in a fourth implementation manner of the second aspect, the number of the grooves is multiple, and the multiple grooves are arranged between two adjacent second pins side by side. Thus, the plurality of grooves arranged side by side can further increase the wall surface of the groove, i.e., further increase the path of the conductive particle deposition.

With reference to the second implementation manner of the second aspect, in a fifth implementation manner of the second aspect, the cross-sectional shape of the groove is a polygon or an arc. In this way, it is ensured that the recess has a longer wall surface.

With reference to the second implementation manner of the second aspect, in a sixth implementation manner of the second aspect, the application is provided with a convex portion on an inner surface of the groove, and the convex portion is used for increasing a path of the conductive particle accumulation. In this way, the convex portion is provided on the inner surface of the groove, and the contour of the convex portion serves as the wall surface of the groove, so that the wall surface length of the groove, that is, the path of the conductive particle deposition can be increased.

With reference to the sixth implementation manner of the second aspect, in a seventh implementation manner of the second aspect, the cross-sectional shape of the convex portion is a triangle, a trapezoid, or an arc. In this way, a longer profile length of the projection is ensured.

With reference to the sixth implementation manner of the second aspect, in the eighth implementation manner of the second aspect, the number of the convex portions is multiple, and the multiple convex portions are arranged at intervals. In this way, the profile length of the projection is further increased, that is, the path of the conductive particle deposition is further increased.

With reference to the sixth implementation manner of the second aspect, in a ninth implementation manner of the second aspect, the cross-sectional shape of the groove is triangular, and two opposite side walls in the groove are both provided with a convex portion.

With reference to the sixth implementation manner of the second aspect, in a tenth implementation manner of the second aspect, the cross-sectional shape of the groove is a trapezoid, and two opposite sidewalls in the groove are both provided with a convex portion.

In a third aspect, an embodiment of the present application provides a touch sensor, where the touch sensor includes the connection substrate provided in the first aspect.

In a fourth aspect, an embodiment of the present application provides a touch sensor, where the touch sensor includes the conductive bonding structure provided in the second aspect.

In the touch sensor provided in the third and fourth aspects, a path along which conductive particles are stacked between two adjacent first pins is increased, and a risk that the conductive particles are conducted with each other to cause a short circuit between the two adjacent first pins is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a schematic structural diagram of a conventional conductive bonding structure.

Fig. 2 is a schematic diagram illustrating that conductive particles are gathered at the binding position of the FPC in fig. 1 to cause a short circuit of the corresponding pin.

Fig. 3 is a schematic diagram illustrating the conductive particles of fig. 1 gathering at the edge of the connection substrate to cause a short circuit of the corresponding pin.

Fig. 4 is a schematic view of a conductive bonding structure for improving aggregation of conductive particles according to an embodiment of the present disclosure.

Fig. 5 is a top view of the connection matrix of fig. 4 to improve conductive particle aggregation.

Fig. 6 is a schematic view of the operation principle of the flow guide block with a triangular cross section.

Fig. 7 is a schematic view of a flow guide block with a trapezoidal cross-sectional shape.

Fig. 8 is a schematic view of a flow guide block with an elliptical cross-sectional shape.

Fig. 9 is a schematic view of a flow guide block having a rectangular cross-sectional shape.

Fig. 10 is a schematic view of a plurality of flow deflectors arranged side by side.

Fig. 11 is a top view of the FPC of fig. 4 to improve the aggregation of conductive particles.

Fig. 12 is a schematic view of the working principle of a groove having a triangular cross-sectional shape.

Fig. 13 is a schematic view of a groove having a trapezoidal cross-sectional shape.

Fig. 14 is a schematic view of a groove having a semicircular arc-shaped cross section.

FIG. 15 is a schematic view of a plurality of grooves side by side.

Fig. 16 is a schematic view of providing a protrusion on the inner surface of a groove.

Icon: 01-a conductive bonding structure; 02-FPC; 03-connecting the substrate; 04-ACF; 05-conductive particles; 06-pin; 100-conductive bonding structures that improve the aggregation of conductive particles; 110-a connection matrix to improve the aggregation of the conductive particles; 111-a substrate; 112-an insulating layer; 113-a first conductive layer; 114-a first pin; 115-a flow guide block; 120-FPC to improve conductive particle aggregation; 121-a first base layer; 122-a groove; 123-a second base layer; 124-a second conductive layer; 125-a second pin; 126-a convex portion; 130-anisotropic conductive material.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it is to be understood that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like are used in an orientation or positional relationship as indicated in the drawings, or as would be ordinarily understood by those skilled in the art, simply for convenience in describing and simplifying the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be in any way limiting of the present application.

Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

In the description of the present application, it is further noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Referring to fig. 1, a conventional conductive bonding structure 01 includes an FPC02, a connection substrate 03, and an ACF04 adhered between the FPC02 and the connection substrate 03. In the preparation process, the ACF04 is in a liquid state after being heated, during the process of pressing the FPC02, the ACF04 will flow around, and the conductive particles 05 in the ACF04 are easily gathered at the binding positions of the FPC02, where the binding positions are located at the edge of the FPC02 (shown in a region a in fig. 1) and also easily gathered at the edge of the connection substrate 03 (shown in a region B in fig. 1), and possibly both the edge of the FPC02 and the edge of the connection substrate 03.

Referring to fig. 2, at the bonding position of the pins 06 of the FPC02, too many conductive particles 05 are accumulated between two adjacent pins 06, and the conductive particles 05 are conducted with each other, so that two adjacent pins 06 are shorted, and the conductive bonding structure 01 fails.

Referring to fig. 3, at the edge of the connection substrate 03, too many conductive particles 05 are stacked between two adjacent pins 06, and the conductive particles 05 are conducted with each other, so that the two adjacent pins 06 are shorted, and the conductive bonding structure 01 is disabled.

The embodiment of the application provides a conductive bonding structure for improving aggregation of conductive particles, and in the conductive bonding structure, a structure for increasing a conductive particle accumulation path is arranged in an area where the conductive particles are easily aggregated, so that the conductive particles are prevented from being conducted with each other between two adjacent pins, and short circuit of the two adjacent pins is avoided.

Referring to fig. 4, the conductive bonding structure 100 for improving conductive particle aggregation according to the embodiment of the present disclosure includes an FPC for improving conductive particle aggregation, a connection substrate 110 for improving conductive particle aggregation, and an anisotropic conductive material 130, wherein the anisotropic conductive material 130 is adhered between the FPC and the connection substrate 110.

The Anisotropic conductive material 130 may be ACF or ACA/ACP (Anisotropic conductive adhesive/paste). The anisotropic conductive material 130 includes a resin and conductive particles 05 embedded in the resin.

The connection base 110 includes a substrate 111, an insulating layer 112, and a first conductive layer 113 sandwiched between the substrate 111 and the insulating layer 112; the FPC includes a first base layer 121, a second base layer 123, and a second conductive layer 124 sandwiched between the first base layer 121 and the second base layer 123; the first conductive layer 113 and the second conductive layer 124 are electrically connected by an anisotropic conductive material 130.

Alternatively, the first base layer 121 and the second base layer 123 may be made of PI (Polyimide), and may also be made of an electromagnetic shielding material.

As shown in fig. 5, the connection base 110 has a structure in which the first conductive layer 113 includes a plurality of first leads 114, and the first leads 114 are disposed on the substrate 111 at regular intervals. The insulating layer 112 covers the first leads 114 and exposes the ends of the first leads 114. The connection base 110 further includes a flow guiding block 115, and the flow guiding block 115 is located between two adjacent first leads 114 and at or near a position where the first leads 114 are to be bonded. The position where the first pin 114 is to be bonded may be adjacent to the edge of the insulating layer 112, and may be spaced apart from the edge of the insulating layer 112 by a certain distance. The current guiding block 115 may be integrated with the insulating layer 112, or may be spaced from the edge of the insulating layer 112 by a distance smaller than the diameter of one conductive particle 05. The insulating layer 112 can prevent the first leads 114 from being oxidized and corroded, and can also prevent the first leads 114 from being short-circuited due to silver migration caused by electrification in a high-temperature and high-humidity environment.

Referring to fig. 6, during the pressing of the FPC, the conductive particles 05 flow to the current guide block 115. The arrows in fig. 6 indicate the direction of overflow of the conductive particles 05. The flow guide block 115 is used for dredging the conductive particles 05, so that the conductive particles 05 are stacked along the outline of the flow guide block 115, and thus the length of a path for stacking the conductive particles 05 between two adjacent first pins 114 is larger than the distance between the two adjacent first pins 114, and the risk of short circuit of the two adjacent first pins 114 caused by mutual conduction of the conductive particles 05 is reduced.

Optionally, the cross-sectional shape of the deflector block 115 is triangular, the width of the triangle increasing gradually in a direction away from the location to be bound, i.e. one vertex of the triangle facing away from the edge of the insulating layer 112. Thus, the conductive particles 05 will be packed along the two sides of the triangle facing away from the edge of the insulating layer 112. If two adjacent first pins 114 are short-circuited due to aggregation of the conductive particles 05, the path of the conductive particles 05 stacked includes a gap between the triangle and the two first pins 114, a partial contour length of the triangle (the partial contour length of the triangle refers to at least a partial length of two sides of the triangle), and the stacked path must cross a vertex of the triangle. Therefore, the triangular flow guiding block 115 increases the path of the accumulated conductive particles 05, and reduces the risk of short circuit between two adjacent first pins 114.

Further, the cross-sectional shape of the current guiding block 115 is an isosceles triangle, the vertex angle of the isosceles triangle deviates from the edge of the insulating layer 112, and the two waists of the isosceles triangle are as long as possible, so that the path of the conductive particles 05 stacked is as long as possible.

Optionally, referring to fig. 7, the cross-sectional shape of the flow guiding block 115 is a trapezoid, and the width of the trapezoid gradually increases in a direction away from the position to be bound, that is, the short side of the trapezoid faces away from the edge of the insulating layer 112. In this way, the conductive particles 05 will be stacked along the two waists and short sides of the trapezoid. If two adjacent first pins 114 are short-circuited due to aggregation of the conductive particles 05, the path of the conductive particles 05 stacked includes a gap between the trapezoid and the two first pins 114, and a partial profile length of the trapezoid (the partial profile length of the trapezoid refers to a sum of at least a partial length of two sides of the trapezoid and a length of a short side). Therefore, the trapezoidal flow guiding block 115 increases the path of the accumulated conductive particles 05, and reduces the risk of short circuit between two adjacent first pins 114.

Further, the cross-sectional shape of the current guiding block 115 is an isosceles trapezoid, the short side of the isosceles trapezoid is away from the edge of the insulating layer 112, and the two waists and the short side of the isosceles triangle are as long as possible, so that the path of the conductive particles 05 stacked is as long as possible.

It is contemplated that many alternatives are possible for the cross-sectional shape of the deflector block 115, such as other polygonal shapes or oval or circular shapes. Fig. 8 is a schematic view of the flow guide block 115 with an elliptical cross-section. Fig. 9 is a schematic view of the flow guide block 115 with a rectangular cross section.

The number of the flow guide blocks 115 between two adjacent first leads 114 is not limited to one, and may be a plurality of flow guide blocks 115, and the plurality of flow guide blocks 115 are arranged between two adjacent first leads 114 side by side. Referring to fig. 10, two flow guiding blocks 115 with a triangular cross-section are disposed between two adjacent first leads 114. Two adjacent bottom corners of the two triangles are connected into a whole, and the top corners of the two triangles are away from the edge of the insulating layer 112. If two adjacent first pins 114 are short-circuited due to aggregation of the conductive particles 05, the path of the conductive particles 05 stacked includes a gap between two triangles and two first pins 114, a partial contour length of two triangles (the partial contour length of two triangles means at least a partial length of four sides of two triangles), and the stacked path must cross two corners of two triangles.

It is contemplated that the number of the flow guiding blocks 115 between two adjacent first leads 114 is not limited to one or two, and may be more, for example, three, four, or five. The cross-sectional shape of the flow guide block 115 between two adjacent first leads 114 is not limited to a triangle, and may also be other shapes, such as a plurality of trapezoids arranged side by side, or a plurality of flow guide blocks 115 with different cross-sectional shapes arranged side by side.

In the preparation process of the connection substrate 110, the flow guide blocks 115 and the insulation layer 112 are made of the same material, and the flow guide blocks 115 and the insulation layer 112 are simultaneously formed through one coating process. Thus, compared with the existing preparation process of the connection substrate 110, the connection substrate 110 in this embodiment does not add any processing step, and is convenient to prepare.

Referring to fig. 11, the second conductive layer 124 includes a plurality of second leads 125, and the second leads 125 are disposed on the second base layer 123 at regular intervals. The first base layer 121 covers the second leads 125 and exposes the ends of the second leads 125. The anisotropic conductive material 130 is sandwiched between the end portions of the first leads 114 and the end portions of the second leads 125, and the end portions of the first leads 114 correspond to the end portions of the second leads 125 one by one.

During pressing of the FPC, the conductive particles 05 in the anisotropic conductive material 130 will flow toward the edge of the first base layer 121, and the arrows in fig. 12 indicate the flow direction of the conductive particles 05. A groove 122 is formed on the edge of the first base layer 121 and between two adjacent second pins 125. The walls of the recess 122 will be used to deposit conductive particles 05. In this way, the length of the path between two adjacent second pins 125 for the conductive particles 05 to be deposited is greater than the distance between two adjacent second pins 125, thereby reducing the risk of short circuit between two adjacent second pins 125 caused by conduction of the conductive particles 05.

The width of the opening of the groove 122 is equal to the distance between two adjacent second pins 125. In this way, the wall surface of the recess 122 can be made as long as possible, and the path for depositing the conductive particles 05 between the two adjacent second leads 125 is made as long as possible. The minimum value of the width of the opening of the groove 122 is not limited as long as the path for accumulating the conductive particles 05 between the adjacent two second pins 125 can be increased.

The depth of the groove 122 is not particularly limited, and the depth of the groove 122 may be as large as possible as permitted to increase the length of the wall surface of the groove 122 as much as possible.

Alternatively, referring to fig. 12, the cross-sectional shape of the groove 122 is a triangle, and the vertex of the triangle is located at the innermost portion of the first base layer 121. If two adjacent second pins 125 are short-circuited due to the aggregation of the conductive particles 05, the path of the conductive particles 05 accumulated includes the gap between the groove 122 and the two second pins 125, and at least part of the profile length of the groove 122. At least part of the contour length of the groove 122 is greater than the width of the opening of the groove 122 and less than or equal to the length of the wall surface of the groove 122, and the length of the wall surface of the groove 122 is the sum of two side lengths of a triangle. Therefore, the grooves 122 increase the path of the conductive particles 05, and reduce the risk of short circuit between two adjacent second leads 125.

Alternatively, the cross-sectional shape of the groove 122 may be selected from other shapes, such as trapezoidal (as shown in fig. 13) or semi-circular arc (as shown in fig. 14). It is contemplated that the cross-sectional shape of the groove 122 may also be other polygonal or arcuate shapes.

The number of the grooves 122 between two adjacent second pins 125 is not limited to one, and may be a plurality of grooves 122, and the plurality of grooves 122 are arranged side by side between two adjacent second pins 125. Referring to fig. 15, two grooves 122 with a triangular cross-section are disposed between two adjacent second leads 125.

It is contemplated that the number of the grooves 122 between two adjacent second pins 125 is not limited to one or two, and may be more, such as three, four or five. The cross-sectional shape of the groove 122 between two adjacent second pins 125 is not limited to a triangle, and may be other shapes, such as a plurality of trapezoids arranged side by side, or a plurality of grooves 122 with different cross-sectional shapes arranged side by side.

Alternatively, referring to fig. 16, a protrusion 126 is disposed on an inner surface of the groove 122, and the length of the wall surface of the groove 122 can be increased by using the profile length of the protrusion 126, so as to increase the path of the conductive particles 05 accumulated.

The cross-sectional shape of the groove 122 is selected to be trapezoidal, and two opposite side walls in the groove 122 are provided with protrusions 126. The cross-sectional shape of the protrusion 126 is selected to be triangular. It is contemplated that the cross-sectional shape of the recess 122 may alternatively be triangular, with protrusions 126 also being provided on opposite sidewalls within the recess 122.

It is contemplated that the cross-sectional shape of the projections 126 is not limited to a triangle, but may be other polygonal shapes, such as a trapezoid; it may also be arcuate, for example semi-arcuate.

It is contemplated that the number of projections 126 provided in each recess 122 is not limited to one or two, and may be more, such as three, four, or five, etc. The plurality of projections 126 are spaced apart to further increase the length of the wall surface of the recess 122.

The present embodiment also provides a touch sensor, which may include the FPC for improving the aggregation of the conductive particles, so as to reduce the risk of short circuit caused by the aggregation of the conductive particles 05 on two adjacent first pins 114 at the edge of the first base layer 121.

The present embodiment also provides a touch sensor, which may include the connection substrate 110 for improving the aggregation of the conductive particles, so as to reduce the risk of short circuit caused by aggregation of the conductive particles 05 between two adjacent second pins 125.

The present embodiment also provides a touch sensor, which may include the conductive bonding structure 100 for improving aggregation of conductive particles, that is, the touch sensor may include the FPC for improving aggregation of conductive particles and the connection substrate 110 for improving aggregation of conductive particles, so as to reduce the risk of short circuit caused by aggregation of conductive particles 05 on two adjacent first pins 114 at the edge of the first base layer 121, and at the same time, reduce the risk of short circuit caused by aggregation of conductive particles 05 on two adjacent second pins 125.

The FPC for improving conductive particle aggregation, the connection substrate 110 for improving conductive particle aggregation, the conductive bonding structure 100 for improving conductive particle aggregation, and the touch sensor provided in the embodiment of the present application can both reduce the risk of short circuit between two adjacent pins inside each other, and improve the utilization rate and reliability of a product.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

A connection matrix for improving aggregation of conductive particles, wherein the connection matrix comprises a current guiding block (115), a base material (111), an insulating layer (112), and a first conductive layer (113) sandwiched between the base material (111) and the insulating layer (112);

the first conducting layer (113) comprises a plurality of first pins (114) which are arranged at intervals, the insulating layer (112) exposes the end parts of the first pins (114), the flow guide block (115) is arranged between two adjacent first pins (114) and is located at or close to the position to be bound of the first pins (114), and the flow guide block (115) is used for dredging conducting particles (05).
The connection matrix for improving conductive particle aggregation according to claim 1, wherein the number of the flow guiding blocks (115) is plural, and the plural flow guiding blocks (115) are arranged side by side between two adjacent first pins (114).
The connection matrix of claim 1, wherein the cross-sectional shape of the flow-guiding block (115) is polygonal or elliptical or circular.
The connection matrix of claim 1, wherein the cross-sectional shape of the current-guiding block (115) is triangular.
The connection matrix of claim 4, wherein the width of the triangle increases in a direction away from the location to be bound.
The connection matrix of claim 1, wherein the cross-sectional shape of the flow-guiding block (115) is trapezoidal.
The connection matrix of claim 6, wherein the width of the trapezoid gradually increases in a direction away from the location to be bound.
A conductive bonding structure for improving aggregation of conductive particles, comprising an FPC for improving aggregation of conductive particles, a connection matrix for improving aggregation of conductive particles, and an anisotropic conductive material (130), wherein the anisotropic conductive material (130) comprises a resin and conductive particles (05) embedded in the resin;

the connection base comprises a flow guide block (115), a base material (111), an insulating layer (112) and a first conductive layer (113) clamped between the base material (111) and the insulating layer (112), the first conductive layer (113) comprises a plurality of first pins (114) arranged at intervals, the insulating layer (112) exposes the end parts of the first pins (114), and the end parts of the first pins (114) are electrically connected with the FPC through the anisotropic conductive material (130);

the flow guide block (115) is arranged between two adjacent first pins (114) and is located at or close to the position to be bound of the first pins (114), and the flow guide block (115) is used for dredging the conductive particles (05).
The conductive bonding structure for improving conductive particle aggregation according to claim 8, wherein the FPC comprises a first base layer (121), a second base layer (123), and a second conductive layer (124) sandwiched between the first base layer (121) and the second base layer (123);

the second conductive layer (124) comprises a plurality of second pins (125) which are arranged at intervals, the first base layer (121) exposes the end parts of the second pins (125), the anisotropic conductive material (130) is clamped between the end parts of the first pins (114) and the second pins (125), and the end parts of the first pins (114) correspond to the end parts of the second pins (125) in a one-to-one mode.
The conductive bonding structure for improving the aggregation of the conductive particles as claimed in claim 9, wherein the edge of the first base layer (121) is formed with a groove (122), the groove (122) is located between two adjacent second pins (125), and the groove (122) is used for increasing the path of the conductive particles (05) stacked.
The conductive bonding structure for improving the aggregation of conductive particles as claimed in claim 10, wherein the width of the opening of the groove (122) is equal to the distance between two adjacent second pins (125).
The conductive bonding structure for improving conductive particle aggregation according to claim 10, wherein the number of the grooves (122) is plural, and the plural grooves (122) are arranged side by side between two adjacent second pins (125).
The conductive bonding structure for improving the aggregation of conductive particles as set forth in claim 10, wherein the cross-sectional shape of the groove (122) is a polygon or an arc.
The conductive bonding structure for improving aggregation of conductive particles as claimed in claim 10, wherein a protrusion (126) is disposed on an inner surface of the groove (122), and the protrusion (126) is used to increase a path of accumulation of the conductive particles (05).
The conductive bonding structure for improving aggregation of conductive particles as claimed in claim 14, wherein the cross-sectional shape of the protrusion (126) is triangular or trapezoidal or arc-shaped.
The conductive bonding structure for improving aggregation of conductive particles as claimed in claim 14, wherein the number of the convex portions (126) is plural, and the plural convex portions (126) are provided at intervals.
The conductive bonding structure for improving conductive particle aggregation according to claim 14, wherein the cross-sectional shape of the groove (122) is a triangle, and the protrusions (126) are disposed on two opposite sidewalls in the groove (122).
The conductive bonding structure for improving conductive particle aggregation according to claim 14, wherein the cross-sectional shape of the groove (122) is a trapezoid, and the protrusions (126) are disposed on two opposite sidewalls in the groove (122).
A touch sensor comprising the connection substrate according to any one of claims 1 to 7.
A touch sensor comprising the conductive bonding structure of any one of claims 8 to 18.