CN112640588A

CN112640588A - FPC (flexible printed circuit), conductive combination structure and touch sensor for improving aggregation of conductive particles

Info

Publication number: CN112640588A
Application number: CN201880095906.2A
Authority: CN
Inventors: 陈林海
Original assignee: Shenzhen Royole Technologies Co Ltd
Current assignee: Shenzhen Royole Technologies Co Ltd
Priority date: 2018-12-28
Filing date: 2018-12-28
Publication date: 2021-04-09
Also published as: WO2020133260A1

Abstract

The application provides an FPC, a conductive bonding structure and a touch sensor for improving conductive particle aggregation. The conductive bonding structure and the touch sensor include the FPC for improving the aggregation of conductive particles. The FPC comprises a first base layer (111), a second base layer (113) and a first conductive layer (114) clamped between the first base layer (111) and the second base layer (113); the first conducting layer (114) comprises a plurality of first pins (115) which are arranged at intervals, the end parts of the first pins (115) are exposed out of the first base layer (111), a groove (112) is formed in the edge of the first base layer (111), the groove (112) is located between every two adjacent first pins (115), and the groove (112) is used for increasing the path of the conductive particles (05) in a stacking mode. The edge of the first base layer (111) is provided with the groove (112), so that the path of the accumulated conductive particles (05) can be increased, and the risk of short circuit of two adjacent first pins (115) is reduced.

Description

FPC (flexible printed circuit), conductive combination structure and touch sensor for improving aggregation of conductive particles

Technical Field

The application relates to the technical field of conductive bonding, in particular to an FPC (flexible printed circuit), a conductive bonding structure and a touch sensor for improving aggregation of conductive particles.

Background

In the conventional touch device, an FPC (Flexible Printed Circuit) is bonded to a connection substrate by an ACF (Anisotropic Conductive Film). Wherein the ACF includes conductive particles. During the preparation process, the ACF is in a liquid state after being heated, and the ACF flows to the periphery during the process of pressing the FPC.

In the ACF, conductive particles are easily accumulated between adjacent pins during flowing, which easily causes short-circuiting of the adjacent pins. Moreover, as the frame of the touch device is designed to be narrower and narrower, gaps between the pins in the frame are smaller and smaller, and the possibility of short circuit of adjacent pins caused by the aggregation of conductive particles is further improved.

Disclosure of Invention

In a first aspect, an FPC for improving conductive particle aggregation is provided in embodiments of the present application, the FPC including a first base layer, a second base layer, and a first conductive layer sandwiched between the first base layer and the second base layer; the first conducting layer comprises a plurality of first pins arranged at intervals, the end parts of the first pins are exposed out of the first base layer, grooves are formed in the edges of the first base layer and located between every two adjacent first pins, and the grooves are used for increasing paths of conductive particle accumulation.

According to the FPC for improving the aggregation of the conductive particles, the groove is formed in the edge of the first base layer and between two adjacent first pins, when the FPC is combined with an anisotropic conductive material, the conductive particles are accumulated along the wall surface of the groove, so that the accumulated path of the conductive particles between two adjacent first pins at the edge of the first base layer is increased, and the risk that the two adjacent first pins are short-circuited due to the mutual conduction of the conductive particles is reduced.

With reference to the first aspect, in a first implementation manner of the first aspect, a width of an opening of the groove is equal to a distance between two adjacent first pins. In this way, the length of the wall surface of the recess is made as large as possible, i.e., the path of the conductive particle deposition is further increased.

With reference to the first aspect, in a second implementation manner of the first aspect, the number of the grooves is multiple, and the multiple grooves are arranged between two adjacent first pins side by side. Thus, the plurality of grooves arranged side by side can further increase the wall surface of the groove, i.e., further increase the path of the conductive particle deposition.

With reference to the first aspect, in a third implementation manner of the first aspect, the cross-sectional shape of the groove is a polygon or an arc. In this way, it is ensured that the recess has a longer wall surface.

With reference to the first aspect, the present application provides, in a fourth implementation form of the first aspect, a convex portion for increasing a path of conductive particle accumulation is provided on an inner surface of the groove. In this way, the convex portion is provided on the inner surface of the groove, and the contour of the convex portion serves as the wall surface of the groove, so that the wall surface length of the groove, that is, the path of the conductive particle deposition can be increased.

With reference to the fourth implementation manner of the first aspect, in a fifth implementation manner of the first aspect, the cross-sectional shape of the convex portion is a triangle, a trapezoid, or an arc. In this way, a longer profile length of the projection is ensured.

With reference to the fourth implementation manner of the first aspect, in a sixth implementation manner of the first aspect, the number of the convex portions is multiple, and the multiple convex portions are arranged at intervals. In this way, the profile length of the projection is further increased, that is, the path of the conductive particle deposition is further increased.

With reference to the fourth implementation manner of the first aspect, in a seventh implementation manner of the first aspect, the cross-sectional shape of the groove is a triangle, and the two opposite side walls in the groove are both provided with the protruding portions.

With reference to the fourth implementation manner of the first aspect, in an eighth implementation manner of the first aspect, the cross-sectional shape of the groove is a trapezoid, and the two opposite side walls in the groove are both provided with the protruding portions.

In a second aspect, the present application provides a conductive bonding structure for improving aggregation of conductive particles, the conductive bonding structure including an FPC for improving aggregation of conductive particles, a connection matrix for improving aggregation of conductive particles, and an anisotropic conductive material, wherein the anisotropic conductive material includes a resin and conductive particles embedded in the resin; the FPC comprises a first base layer, a second base layer and a first conducting layer clamped between the first base layer and the second base layer, wherein the first conducting layer comprises a plurality of first pins arranged at intervals, the end parts of the first pins are exposed out of the first base layer, and the end parts of the first pins are electrically connected with the connecting base body through the anisotropic conductive material; the edge of the first base layer is provided with a groove, the groove is located between two adjacent first pins, and the groove is used for increasing the path of the conductive particle accumulation.

In the conductive combination structure for improving the aggregation of the conductive particles, the groove is formed in the edge of the first base layer and between two adjacent first pins, and the conductive particles in the anisotropic conductive material are accumulated along the wall surface of the groove, so that the accumulation path of the conductive particles between two adjacent first pins at the edge of the first base layer is increased, and the risk of short circuit of two adjacent first pins caused by mutual conduction of the conductive particles is reduced.

With reference to the second aspect, in a first implementation manner of the second aspect, the connection base includes a substrate, an insulating layer, and a second conductive layer sandwiched between the substrate and the insulating layer, where the second conductive layer includes a plurality of second pins arranged at intervals, and an end of each of the second pins is exposed from the insulating layer; the anisotropic conductive material is clamped between the end parts of the first pin and the second pin, and the end parts of the first pin and the second pin are in one-to-one correspondence.

With reference to the first implementation manner of the second aspect, in the second implementation manner of the second aspect, the connection substrate further includes a flow guiding block, the flow guiding block is located between two adjacent second pins and located at or near a position where the second pins are to be bound, and the flow guiding block is used for dredging the conductive particles. The conductive particles are stacked along the outline of the flow guide block, the stacking path is longer, and the risk that the conductive particles are mutually conducted to cause short circuit of two adjacent second pins is reduced.

With reference to the second implementation manner of the second aspect, in a third implementation manner of the second aspect, the number of the flow guide blocks is multiple, and the flow guide blocks are arranged between two adjacent second pins side by side. In this way, the plurality of flow guide blocks arranged side by side can further increase the profile length of the flow guide blocks, namely further increase the path of the conductive particle accumulation.

With reference to the second implementation manner of the second aspect, in a fourth implementation manner of the second aspect, the cross-sectional shape of the flow guide block is a polygon, an ellipse, or a circle. Thus, the guide block is ensured to have a longer contour length.

With reference to the second implementation manner of the second aspect, in a fifth implementation manner of the second aspect, the cross-sectional shape of the flow guide block is a triangle.

With reference to the fifth implementation manner of the second aspect, in a sixth implementation manner of the second aspect, the width of the triangle gradually increases along a direction away from the position to be bound. Thus, the conductive particles are stacked along both sides of the triangle, and the path of stacking is long.

With reference to the second implementation manner of the second aspect, in a seventh implementation manner of the second aspect, the cross-sectional shape of the flow guiding block is a trapezoid.

With reference to the seventh implementation manner of the second aspect, in an eighth implementation manner of the second aspect, the width of the trapezoid gradually increases in a direction away from the position to be bound. Thus, the conductive particles are stacked along the two waists and one short side of the trapezoid, and the path of the stacking is long.

In a third aspect, an embodiment of the present application provides a touch sensor, where the touch sensor includes the FPC provided in the first aspect.

In a fourth aspect, a touch sensor is provided in an embodiment of the present application, where the touch sensor includes the conductive bonding structure provided in the second aspect.

In the touch sensor provided in the third and fourth aspects, a path of conductive particle accumulation between two adjacent first pins at the edge of the first base layer is increased, and a risk of short circuit between two adjacent first pins due to mutual conduction of conductive particles is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a schematic structural diagram of a conventional conductive bonding structure.

Fig. 2 is a schematic diagram illustrating that conductive particles are gathered at the edge of the FPC in fig. 1 to cause a short circuit of the corresponding pin.

Fig. 3 is a schematic diagram illustrating the conductive particles of fig. 1 gathering at the edge of the connection substrate to cause a short circuit of the corresponding pin.

Fig. 4 is a schematic view of a conductive bonding structure for improving aggregation of conductive particles according to an embodiment of the present disclosure.

Fig. 5 is a top view of the FPC of fig. 4 to improve the aggregation of conductive particles.

Fig. 6 is a schematic view of the working principle of a groove having a triangular cross-sectional shape.

Fig. 7 is a schematic view of a groove having a trapezoidal cross-sectional shape.

Fig. 8 is a schematic view of a groove having a semicircular arc-shaped cross section.

FIG. 9 is a schematic view of a plurality of grooves side by side.

Fig. 10 is a schematic view of providing a protrusion on the inner surface of a groove.

Fig. 11 is a top view of the connection matrix of fig. 4 with improved conductive particle aggregation.

Fig. 12 is a schematic view of the operation principle of the flow guide block with a triangular cross section.

Fig. 13 is a schematic view of a flow guide block having a trapezoidal cross-sectional shape.

Fig. 14 is a schematic view of a flow guide block having an elliptical cross-sectional shape.

Fig. 15 is a schematic view of a flow guide block having a rectangular cross-sectional shape.

Fig. 16 is a schematic view of a plurality of flow deflectors arranged side by side.

Icon: 01-a conductive bonding structure; 02-FPC; 03-connecting the substrate; 04-ACF; 05-conductive particles; 06-pin; 100-conductive bonding structures that improve the aggregation of conductive particles; 110 — FPC to improve conductive particle aggregation; 111-a first base layer; 112-a groove; 113-a second base layer; 114-a first conductive layer; 115 — a first pin; 116-a convex portion; 120-a connection matrix to improve the aggregation of the conductive particles; 121-a substrate; 122-an insulating layer; 123-a second conductive layer; 124-second pin; 125-flow guiding blocks; 130-anisotropic conductive material.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it is to be understood that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like are used in an orientation or positional relationship as indicated in the drawings, or as would be ordinarily understood by those skilled in the art, simply for convenience in describing and simplifying the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be in any way limiting of the present application.

Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

In the description of the present application, it is further noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Referring to fig. 1, a conventional conductive bonding structure 01 includes an FPC02, a connection substrate 03, and an ACF04 adhered between the FPC02 and the connection substrate 03. In the preparation process, the ACF04 is in a liquid state after being heated, during the process of pressing the FPC02, the ACF04 will flow around, and the conductive particles 05 in the ACF04 are easily gathered at the binding positions of the FPC02, where the binding positions are located at the edge of the FPC02 (shown in a region a in fig. 1) or at the edge of the connection substrate 03 (shown in a region B in fig. 1), and may be gathered at the edge of the FPC02 and the edge of the connection substrate 03 at the same time.

Referring to fig. 2, at the bonding position of the pins 06 of the FPC02, too many conductive particles 05 are accumulated between two adjacent pins 06, and the conductive particles 05 are conducted with each other, so that two adjacent pins 06 are shorted, and the conductive bonding structure 01 fails.

Referring to fig. 3, at the edge of the connection substrate 03, too many conductive particles 05 are stacked between two adjacent pins 06, and the conductive particles 05 are conducted with each other, so that the two adjacent pins 06 are shorted, and the conductive bonding structure 01 is disabled.

The embodiment of the application provides a conductive bonding structure for improving aggregation of conductive particles, and in the conductive bonding structure, a structure for increasing a conductive particle accumulation path is arranged in an area where the conductive particles are easily aggregated, so that the conductive particles are prevented from being conducted with each other between two adjacent pins, and short circuit of the two adjacent pins is avoided.

Referring to fig. 4, the conductive bonding structure 100 for improving conductive particle aggregation according to the embodiment of the present disclosure includes an FPC for improving conductive particle aggregation, a connection substrate 120 for improving conductive particle aggregation, and an anisotropic conductive material 130, wherein the anisotropic conductive material 130 is adhered between the FPC and the connection substrate 120.

The Anisotropic conductive material 130 may be ACF or ACA/ACP (Anisotropic conductive adhesive/paste). The anisotropic conductive material 130 includes a resin and conductive particles 05 embedded in the resin.

The FPC includes a first base layer 111, a second base layer 113, and a first conductive layer 114 sandwiched between the first base layer 111 and the second base layer 113; the connection base 120 includes a substrate 121, an insulating layer 122, and a second conductive layer 123 sandwiched between the substrate 121 and the insulating layer 122; the first conductive layer 114 and the second conductive layer 123 are electrically connected by an anisotropic conductive material 130.

Alternatively, the first base layer 111 and the second base layer 113 may be made of PI (Polyimide), and may also be made of an electromagnetic shielding material.

Structure of FPC as shown in fig. 5, the first conductive layer 114 includes a plurality of first pins 115, and the first pins 115 are disposed on the second base layer 113 at regular intervals. The first base layer 111 covers the first leads 115 and exposes ends of the first leads 115. An anisotropic conductive material 130 is sandwiched between the end of the first lead 115 and the connection base 120.

During pressing of the FPC, the conductive particles 05 in the anisotropic conductive material 130 will flow toward the edge of the first base layer 111, and the arrows in fig. 6 indicate the flow direction of the conductive particles 05. A groove 112 is formed at the edge of the first base layer 111 and between two adjacent first leads 115. The walls of the recess 112 will be used to deposit conductive particles 05. In this way, the length of the path between two adjacent first pins 115 for the conductive particles 05 to be stacked is greater than the distance between two adjacent first pins 115, thereby reducing the risk of short circuit between two adjacent first pins 115 caused by conduction of the conductive particles 05.

The width of the opening of the groove 112 is at most equal to the distance between two adjacent first leads 115. In this way, the wall surface of the groove 112 can be made as long as possible, and the path for depositing the conductive particles 05 between two adjacent first leads 115 can be made as long as possible. The minimum value of the width of the opening of the groove 112 is not limited as long as the path for accumulating the conductive particles 05 between the adjacent two first leads 115 can be increased.

The depth of the groove 112 is not particularly limited, and the depth of the groove 112 may be as large as possible as permitted to increase the length of the wall surface of the groove 112 as much as possible.

Alternatively, referring to fig. 6, the cross-sectional shape of the groove 112 is a triangle, and the vertex of the triangle is located at the innermost portion of the first base layer 111. If two adjacent first pins 115 are short-circuited due to aggregation of the conductive particles 05, the path of the conductive particles 05 accumulated includes the gap between the groove 112 and the two first pins 115, and at least part of the profile length of the groove 112. At least part of the contour length of the groove 112 is greater than the width of the opening of the groove 112 and less than or equal to the length of the wall surface of the groove 112, and the length of the wall surface of the groove 112 is the sum of two side lengths of a triangle. Therefore, the groove 112 increases the path of the conductive particles 05, and reduces the risk of short circuit between two adjacent first leads 115.

Alternatively, the cross-sectional shape of the groove 112 may be selected from other shapes, such as trapezoidal (as shown in FIG. 7) or semi-circular arc (as shown in FIG. 8). It is contemplated that the cross-sectional shape of the groove 112 may also be other polygonal or arcuate shapes.

The number of the grooves 112 between two adjacent first pins 115 is not limited to one, and may be a plurality of grooves 112, and the plurality of grooves 112 are arranged side by side between two adjacent first pins 115. Referring to fig. 9, two grooves 112 with a triangular cross-section are disposed between two adjacent first leads 115.

It is contemplated that the number of the grooves 112 between two adjacent first leads 115 is not limited to one or two, and may be more, such as three, four or five. The cross-sectional shape of the groove 112 between two adjacent first leads 115 is not limited to a triangle, and may be other shapes, such as a plurality of trapezoids arranged side by side, or a plurality of grooves 112 with different cross-sectional shapes arranged side by side.

Alternatively, referring to fig. 10, a protrusion 116 is disposed on the inner surface of the groove 112, and the length of the wall surface of the groove 112 can be increased by the profile length of the protrusion 116, so as to increase the path of the conductive particles 05 accumulated.

The cross-sectional shape of the groove 112 is selected to be trapezoidal, and two opposite side walls in the groove 112 are provided with protrusions 116. The cross-sectional shape of the protrusion 116 is selected to be triangular. It is contemplated that the cross-sectional shape of the groove 112 may alternatively be triangular, with the same projections 116 being provided on opposite sidewalls within the groove 112.

It is contemplated that the cross-sectional shape of the projections 116 is not limited to a triangle, but may be other polygonal shapes, such as a trapezoid; it may also be arcuate, for example semi-arcuate.

It is contemplated that the number of projections 116 provided in each recess 112 is not limited to one or two, and may be more, such as three, four, or five, etc. The spacing of the plurality of projections 116 may further increase the length of the wall of the recess 112.

The structure of the connection base 120 is shown in fig. 11 and 4, the second conductive layer 123 includes a plurality of second pins 124, and the second pins 124 are disposed on the substrate 121 at regular intervals. The insulating layer 122 covers the second leads 124 and exposes the ends of the second leads 124. The anisotropic conductive material 130 is bonded between the end of the first lead 115 and the end of the second lead 124, and the ends of the first lead 115 and the second lead 124 correspond one to one.

The connection base 120 further includes a flow guiding block 125, and the flow guiding block 125 is disposed between two adjacent second leads 124 and is located at or near a position where the second leads 124 are to be bonded. The location where the second lead 124 is to be bonded may be adjacent to an edge of the insulating layer 122 and may be spaced a distance from the edge of the insulating layer 122. The current guiding block 125 may be integrated with the insulating layer 122, or may be spaced from the edge of the insulating layer 122 by a distance smaller than the diameter of one conductive particle 05. The insulating layer 122 can prevent the second leads 124 from being oxidized and corroded, and can also prevent the second leads 124 from being short-circuited due to silver migration caused by electrification in a high-temperature and high-humidity environment.

Referring to fig. 12, during the pressing of the FPC, the conductive particles 05 flow to the current guide blocks 125. The arrows in fig. 12 indicate the direction of overflow of the conductive particles 05. The flow guide block 125 dredges the conductive particles 05, so that the conductive particles 05 are stacked along the profile of the flow guide block 125, and thus, the length of a path between two adjacent second pins 124, on which the conductive particles 05 can be stacked, is greater than the distance between two adjacent second pins 124, thereby reducing the risk of short circuit between two adjacent second pins 124 due to mutual conduction of the conductive particles 05.

Optionally, the cross-sectional shape of the deflector block 125 is triangular, the width of the triangle increasing gradually in a direction away from the location to be bound, that is, one vertex of the triangle facing away from the edge of the insulating layer 122. Thus, the conductive particles 05 will be packed along the two sides of the triangle facing away from the edge of the insulating layer 122. If two adjacent second pins 124 are short-circuited due to aggregation of the conductive particles 05, the path of the conductive particles 05 stacked includes a gap between the triangle and the two second pins 124, a partial profile length of the triangle (the partial profile length of the triangle refers to at least a partial length of two sides of the triangle), and the stacked path must cross a vertex of the triangle. Therefore, the triangular flow guiding block 125 increases the path of the conductive particles 05, and reduces the risk of short circuit between two adjacent second pins 124.

Further, the cross-sectional shape of the current guiding block 125 is an isosceles triangle, the vertex angle of the isosceles triangle deviates from the edge of the insulating layer 122, and the two waists of the isosceles triangle are as long as possible, so that the path of the conductive particles 05 stacked is as long as possible.

Optionally, referring to fig. 13, the cross-sectional shape of the flow guiding block 125 is a trapezoid, and the width of the trapezoid gradually increases in a direction away from the position to be bound, that is, the short side of the trapezoid faces away from the edge of the insulating layer 122. Thus, the conductive particles 05 will be stacked along the two waists and one short side of the trapezoid. If two adjacent second pins 124 are short-circuited due to aggregation of the conductive particles 05, the path of the conductive particles 05 stacked includes a gap between the trapezoid and the two second pins 124, and a partial profile length of the trapezoid (the partial profile length of the trapezoid refers to a sum of at least a partial length of two sides of the trapezoid and a length of a short side). Therefore, the trapezoidal flow guiding block 125 increases the path of the conductive particles 05, and reduces the risk of short circuit between two adjacent second pins 124.

Further, the cross-sectional shape of the current guiding block 125 is an isosceles trapezoid, the short side of the isosceles trapezoid is away from the edge of the insulating layer 122, and the two waists and the short side of the isosceles triangle are as long as possible, so that the path of the conductive particles 05 stacked is as long as possible.

It is contemplated that the cross-sectional shape of the deflector block 125 may be selected from other polygonal shapes, or elliptical or circular shapes. Please refer to fig. 14, which is a schematic diagram of the flow guiding block 125 with an elliptical cross-sectional shape. Fig. 15 is a schematic view of the flow guide block 125 with a rectangular cross section.

The number of the flow guide blocks 125 between two adjacent second leads 124 is not limited to one, and may be a plurality of flow guide blocks 125, and the plurality of flow guide blocks 125 are arranged side by side between two adjacent second leads 124. Referring to fig. 16, two flow guiding blocks 125 with a triangular cross-section are disposed between two adjacent second leads 124. Two adjacent bottom corners of the two triangles are connected into a whole, and the top corners of the two triangles are deviated from the edge of the insulating layer 122. If two adjacent second pins 124 are short-circuited due to aggregation of the conductive particles 05, the path of the conductive particles 05 stacked includes a gap between two triangles and two second pins 124, a partial contour length of two triangles (the partial contour length of two triangles means at least a partial length of four sides of two triangles), and the stacked path must cross two corners of two triangles.

It is contemplated that the number of flow guiding blocks 125 between two adjacent second leads 124 is not limited to one or two, and may be more, for example, three, four, or five. The cross-sectional shape of the flow guide block 125 between two adjacent second leads 124 is not limited to a triangle, and may be other shapes, such as a plurality of trapezoids arranged side by side, or a plurality of flow guide blocks 125 with different cross-sectional shapes arranged side by side.

In the preparation process of the connection substrate 120, the flow guide blocks 125 and the insulation layer 122 are made of the same material, and the flow guide blocks 125 and the insulation layer 122 are simultaneously formed through a single coating process. Thus, compared with the existing preparation process of the connection substrate 120, the connection substrate 120 in this embodiment does not add any processing step, and is convenient to prepare.

The embodiment also provides a touch sensor, which may include the connection substrate 120 for improving the aggregation of the conductive particles, so as to reduce the risk of short circuit caused by aggregation of the conductive particles 05 between two adjacent first pins 115.

The present embodiment also provides a touch sensor, which may include the FPC for improving the aggregation of the conductive particles, so as to reduce the risk of short circuit caused by the aggregation of the conductive particles 05 on the two adjacent second pins 124 at the edge of the first base layer 111.

The present embodiment also provides a touch sensor, which may include the conductive bonding structure 100 for improving aggregation of conductive particles, that is, the touch sensor may include the FPC for improving aggregation of conductive particles and the connection substrate 120 for improving aggregation of conductive particles, so as to reduce the risk of short circuit caused by aggregation of conductive particles 05 in two adjacent first pins 115, and at the same time, reduce the risk of short circuit caused by aggregation of conductive particles 05 in two adjacent second pins 124 at the edge of the first base layer 111. The FPC for improving the aggregation of the conductive particles, the connection substrate 120 for improving the aggregation of the conductive particles, the conductive bonding structure 100 for improving the aggregation of the conductive particles, and the touch sensor provided by the embodiment of the application can reduce the risk of short circuit between two adjacent pins in each of the FPC, the connection substrate, and the touch sensor, and improve the utilization rate and reliability of products.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

An FPC for improving conductive particle aggregation is characterized by comprising a first base layer (111), a second base layer (113) and a first conductive layer (114) clamped between the first base layer (111) and the second base layer (113);

the first conductive layer (114) comprises a plurality of first pins (115) arranged at intervals, the end parts of the first pins (115) are exposed out of the first base layer (111), a groove (112) is formed in the edge of the first base layer (111), the groove (112) is located between every two adjacent first pins (115), and the groove (112) is used for increasing the path of the conductive particles (05) in a stacking mode.
The FPC for improving conductive particle aggregation according to claim 1, wherein a width of an opening of the groove (112) is equal to a pitch between two adjacent first pins (115).
The FPC for improving conductive particle aggregation according to claim 1, wherein the number of the grooves (112) is multiple, and the multiple grooves (112) are arranged side by side between two adjacent first pins (115).
The FPC for improving the aggregation of conductive particles as recited in claim 1, wherein the cross-sectional shape of the groove (112) is a polygon or an arc.
The FPC for improving conductive particle aggregation according to claim 1, wherein a convex portion (116) is disposed on an inner surface of the groove (112), and the convex portion (116) is used for increasing a path of accumulation of conductive particles (05).
The FPC for improving conductive particle aggregation according to claim 5, wherein a cross-sectional shape of the convex portion (116) is a triangle or a trapezoid or an arc.
The FPC for improving conductive particle aggregation according to claim 5, wherein the number of the convex portions (116) is plural, and the plural convex portions (116) are provided at intervals.
The FPC for improving conductive particle aggregation according to claim 5, wherein a cross-sectional shape of the groove (112) is a triangle, and the protrusions (116) are disposed on two opposite sidewalls in the groove (112).
The FPC for improving conductive particle aggregation according to claim 5, wherein the cross-sectional shape of the groove (112) is a trapezoid, and the protrusions (116) are disposed on two opposite sidewalls in the groove (112).
A conductive bonding structure for improving aggregation of conductive particles, comprising an FPC for improving aggregation of conductive particles, a connection matrix (120) for improving aggregation of conductive particles, and an anisotropic conductive material (130), wherein the anisotropic conductive material (130) comprises a resin and conductive particles (05) embedded in the resin;

the FPC comprises a first base layer (111), a second base layer (113) and a first conductive layer (114) clamped between the first base layer (111) and the second base layer (113), wherein the first conductive layer (114) comprises a plurality of first pins (115) arranged at intervals, the first base layer (111) exposes the ends of the first pins (115), and the ends of the first pins (115) are electrically connected with the connecting base body (120) through the anisotropic conductive material (130);

the edge of the first base layer (111) is provided with a groove (112), the groove (112) is located between two adjacent first pins (115), and the groove (112) is used for increasing the path of the conductive particles (05) in a stacking mode.
The conductive bonding structure for improving conductive particle aggregation according to claim 10, wherein the connection base (120) comprises a substrate (121), an insulating layer (122), and a second conductive layer (123) sandwiched between the substrate (121) and the insulating layer (122), the second conductive layer (123) comprises a plurality of second pins (124) arranged at intervals, and the insulating layer (122) exposes ends of the second pins (124);

the anisotropic conductive material (130) is clamped between the end of the first pin (115) and the end of the second pin (124), and the ends of the first pin (115) and the second pin (124) are in one-to-one correspondence.
The conductive bonding structure for improving conductive particle aggregation according to claim 11, wherein the connection substrate (120) further comprises a flow guiding block (125), the flow guiding block (125) is located between two adjacent second pins (124) and at or near the position where the first pin (115) is to be bonded, and the flow guiding block (125) is used for dredging the conductive particles (05).
The conductive bonding structure for improving the aggregation of conductive particles as claimed in claim 12, wherein the number of the flow guiding blocks (125) is plural, and the plural flow guiding blocks (125) are arranged side by side between two adjacent second leads (124).
The conductive bonding structure for improving the aggregation of conductive particles as claimed in claim 12, wherein the cross-sectional shape of the current-guiding block (125) is a polygon or an ellipse or a circle.
The conductive bonding structure for improving the aggregation of conductive particles as claimed in claim 12, wherein the cross-sectional shape of the current-guiding block (125) is a triangle.
The conductive bonding structure for improving aggregation of conductive particles as claimed in claim 15, wherein the width of the triangle is gradually increased in a direction away from the location to be bound.
The conductive bonding structure for improving the aggregation of conductive particles as claimed in claim 12, wherein the cross-sectional shape of the current-guiding block (125) is a trapezoid.
The conductive bonding structure for improving conductive particle aggregation according to claim 17, wherein the width of the trapezoid gradually increases in a direction away from the location to be bound.
A touch sensor, characterized in that the touch sensor comprises the FPC of any one of claims 1 to 9.
A touch sensor comprising the conductive bonding structure of any one of claims 10 to 18.