CN112635374A - Carrying method for cleaning wafer after CMP - Google Patents
Carrying method for cleaning wafer after CMP Download PDFInfo
- Publication number
- CN112635374A CN112635374A CN202011446726.XA CN202011446726A CN112635374A CN 112635374 A CN112635374 A CN 112635374A CN 202011446726 A CN202011446726 A CN 202011446726A CN 112635374 A CN112635374 A CN 112635374A
- Authority
- CN
- China
- Prior art keywords
- wafer
- cleaning
- unit
- cleaning unit
- cmp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 134
- 238000000034 method Methods 0.000 title claims abstract description 35
- 235000012431 wafers Nutrition 0.000 claims abstract description 206
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 239000003814 drug Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 5
- 230000002378 acidificating effect Effects 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 3
- 230000003020 moisturizing effect Effects 0.000 claims description 2
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000003929 acidic solution Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to a carrying method for cleaning a wafer after CMP, which comprises the following steps: step S01, the interface unit receives the wafer after CMP; step S02, the double manipulators convey the first wafer in the transfer unit to the first cleaning unit for first cleaning; step S03, the double manipulators transport the first wafer to the second cleaning unit for second cleaning; step S04, the double manipulators convey the second wafer in the transfer unit to the first cleaning unit for first cleaning; step S05, the second wafer is moisturized and waits after being cleaned in the first cleaning unit, and enters the second cleaning unit before the first wafer is cleaned for the second time; step S06, the positions of the first wafer and the second wafer are exchanged by the double manipulators, the second wafer is cleaned in the second cleaning unit, and the first wafer is sent into a wafer box of the loading platform; and S07, repeating the steps S02-S06, and sequentially placing the wafers into the wafer box.
Description
Technical Field
The invention belongs to the related technical field of wafer cleaning, and particularly relates to a conveying method for cleaning a wafer after CMP.
Background
Cleaning of a wafer is a very important step in the production process of a semiconductor device, and whether the cleaning is clean directly affects the performance and yield of the device, so that the wafer needs to be cleaned for many times in the preparation process of the semiconductor device. In the conventional semiconductor manufacturing process, a planarization process is generally performed by using a Chemical Mechanical Polishing (CMP) method, however, a lot of residues (residues) are generated during the CMP process, thereby forming defects (defects), so that the wafer (wafer) needs to be cleaned after the CMP process to reduce the defects.
The existing cleaning method generally places a wafer after CMP on a carrier platform by directly utilizing a manipulator, and then sequentially conveys the wafer to each cleaning mechanism for direct cleaning by utilizing the manipulator, so that the wafer can be cleaned, but after long-time actual processing, the cleaning mode of conveying the wafer is low in conveying efficiency and long in conveying time, the cleaning capacity cannot meet high requirements, and further development of the wafer is severely restricted.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a conveying method for cleaning a wafer after CMP, which can improve the cleaning speed of the wafer after CMP and meet the requirement of wafer capacity.
In order to achieve the purpose, the invention adopts the technical scheme that: a carrying method for cleaning a wafer after CMP comprises the following steps:
step S01, the cross-connecting unit receives the wafer after CMP and performs pre-cleaning;
step S02, the double manipulators convey the first wafer in the transfer unit to the first cleaning unit for first cleaning; wherein the first cleaning time is 110-130 seconds;
step S03, the double manipulators convey the first wafer after the first cleaning to a second cleaning unit for second cleaning; wherein the time for the second cleaning is 170-190 seconds;
step S04, returning the double manipulators to the transfer unit, and conveying the second wafer in the transfer unit to the first cleaning unit for first cleaning;
step S05, after the second wafer is cleaned in the first cleaning unit, moisturizing and waiting, and then the second wafer enters a second cleaning unit before the first wafer is cleaned for the second time;
step S06, after the positions of a first wafer and a second wafer are exchanged by the two manipulators, the second wafer is cleaned in a second cleaning unit, and the first wafer is sent into a wafer box of the loading table through the two manipulators;
and S07, repeating the steps S02-S06 in sequence, putting the wafers into the wafer boxes of the loading platform in sequence, and taking the wafer boxes by a subsequent manipulator when the number of the wafers meets the requirement.
Furthermore, a temporary storage unit is arranged between the second cleaning unit and the loading platform and used for temporarily storing cleaned wafers which cannot be placed on the loading platform.
Further, in step S01, the pre-cleaning is to immerse the CMP wafer in ozone water with two pieces as a group, and then perform ultrasonic cleaning to ensure that the wafer is in a wet state.
Further, the cleaning process of the first cleaning unit is as follows: when the brush rotates, the wafer is brushed by pure water and alkaline liquid medicine in sequence.
Further, the cleaning process of the second cleaning unit is as follows: and the nozzle sprays ozone and acidic liquid medicine to the wafer in sequence, and finally the wafer is dried by spin.
Furthermore, two clamping jaws which are arranged up and down are arranged on the two manipulators and are respectively used for clamping wafers in a wet state and a dry state.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
according to the carrying method for wafer CMP post-cleaning, provided by the scheme of the invention, the wafer is clamped by the double manipulators, so that the next wafer can be moved to the cleaning position of the previous wafer before the previous wafer is cleaned, the positions of the two wafers are exchanged, and then the previous wafer is conveyed to a subsequent station, so that the carrying time of the wafer can be effectively reduced, the productivity is improved, the cleaning efficiency is improved, and the requirement for wafer batch cleaning is met.
Drawings
The technical scheme of the invention is further explained by combining the accompanying drawings as follows:
fig. 1 is a schematic diagram illustrating a state in which the dual robot transfers the first wafer after the first cleaning to the second cleaning unit in step S03 according to an embodiment;
fig. 2 is a schematic diagram illustrating a state where the double robot transfers the second wafer to the first cleaning unit in step S04 according to the embodiment;
fig. 3 is a schematic diagram illustrating a state where the double robot transfers the second wafer 10 after the first cleaning to the second cleaning unit in step S05 according to the embodiment;
FIG. 4 is a schematic view of a carrying process of the carrying method according to the second embodiment;
wherein: 1. a handover unit; 2. a first cleaning unit; 3. a second cleaning unit; 4. two manipulators; 5. a temporary storage unit; 6. a loading unit; 10. a first wafer; 20. a second wafer.
Detailed Description
In order to make the content of the present invention more comprehensible, the following description is further described with reference to the accompanying drawings, and it goes without saying that the present invention is not limited to the specific embodiments, and general alternatives known to those skilled in the art are also included in the scope of the present invention.
Example one
Referring to fig. 1, the method for transporting a wafer after CMP according to an embodiment of the present invention includes a transfer unit 1, a first cleaning unit 2, a second cleaning unit 3, a dual robot 4, and a loading table 6.
Specifically, the cross-connecting unit 1 mainly has a cross-connecting function with a wafer after CMP in a previous process, receives the wafer after CMP, and pre-cleans the wafer; the pre-cleaning operation process comprises the steps of soaking the wafer in ozone water and cleaning the wafer through ultrasonic waves, wherein the wafer is soaked in the ozone water in a group of two wafers, and meanwhile, the wafer can be ensured to be in a wet state.
Wherein, the cleaning process of the first cleaning unit is as follows: when the brush rotates, the wafer is scrubbed by pure water and alkaline liquid medicine in sequence; the cleaning process of the second cleaning unit is as follows: and the nozzle sprays ozone and acidic liquid medicine to the wafer in sequence, and finally the wafer is dried by spin.
The double mechanical arm 4 comprises two clamping jaws which are arranged up and down, the clamping jaw which is positioned above is used for clamping a wafer in a dry state, the clamping jaw which is positioned below is used for clamping a wafer in a wet state, the double mechanical arm 4 is used for carrying the wafer among the transfer unit 1, the first cleaning unit 2, the second cleaning unit 3 and the loading platform 6, and only the wafer cleaned by the second cleaning unit 3 needs to be clamped by the clamping jaw which is used for clamping the wafer in the dry state.
The loading platform 6 is located at the rear end of the second cleaning unit, and a wafer cassette is arranged on the loading platform 6 and used for placing cleaned wafers, in this embodiment, 23 wafers can be placed in one wafer cassette, and when 23 wafers are taken away by a manipulator in a subsequent process.
The embodiment discloses a carrying method for cleaning a wafer after CMP.
Referring to fig. 1, in step S01, the wafer after CMP is received by the interface unit, and the wafer is immersed in ozone water in a group of two wafers and cleaned by ultrasonic waves to ensure that the wafer is in a wet state.
In step S02, the double robot transfers the first wafer 10 in the transfer unit to the first cleaning unit, and cleans the brush with pure water and alkaline chemical for 110 seconds.
Step S03, the double manipulators transport the first wafer 10 after the first cleaning to the second cleaning unit, and spin-dry the wafer after the nozzle is matched with the ozone and the acidic solution, which takes 170 seconds.
Referring to FIG. 2:
in step S04, the robot returns to the transfer unit, and transfers the second wafer 20 in the transfer unit to the first cleaning unit to perform the first cleaning for 110 seconds, and the first wafer 10 is cleaned in the second cleaning unit at this time.
Please refer to fig. 3: in step S05, since the time for cleaning the first wafer 10 in the second cleaning unit is longer than the time for cleaning the second wafer 20 in the second cleaning unit, after the second wafer 20 is cleaned in the first cleaning unit, the second wafer 20 is kept moisture in the first cleaning unit, and then the second wafer 20 enters the second cleaning unit before the first wafer 10 is cleaned for the second time.
Step S06, after the positions of the first wafer and the second wafer are exchanged, the two manipulators pick up the first wafer 10 in the second cleaning unit by the clamping jaws in the dry state, and then pick up the second wafer 20 in the second cleaning unit by the clamping jaws in the wet state, and the first wafer 10 is sent into the wafer box of the loading platform.
And S07, repeating the steps S02-S06 in sequence, putting the cleaned wafers into the wafer boxes of the loading table in sequence, and taking the wafer boxes filled with 23 wafers away by a subsequent manipulator when the number of the wafers in the wafer boxes reaches 23.
Example two
The invention discloses a carrying method for cleaning a plurality of wafers after CMP, which comprises the following steps:
in step S01, the interface unit receives the CMP wafer and moisturizes the wafer.
In step S02, the double robot transfers the first wafer 10 in the transfer unit to the first cleaning unit, and cleans the brush with pure water and alkaline chemical for 130 seconds.
Step S03, the double manipulators transport the first wafer 10 after the first cleaning to the second cleaning unit, and spin-dry the wafer after the nozzle is matched with the ozone and the acidic solution, which takes 190 seconds.
In step S04, the robot returns to the transfer unit, and transfers the second wafer 20 in the transfer unit to the first cleaning unit to perform the first cleaning for 130 seconds, and the first wafer 10 is cleaned in the second cleaning unit at this time.
Step S05, after the second wafer 20 is cleaned in the first cleaning unit, the second wafer 20 is kept moist in the first cleaning unit, and then the second wafer 20 enters the second cleaning unit before the first wafer 10 is cleaned for the second time.
Step S06, after the positions of the first wafer 10 and the second wafer 20 are exchanged, the two manipulators pick up the first wafer 10 in the second cleaning unit by the gripping jaws in the dry state, and then pick up the second wafer 20 in the second cleaning unit by the gripping jaws in the wet state, and the first wafer 10 is sent to the cassette of the loading platform.
And S07, repeating the steps S02-S06 in sequence, putting the cleaned wafers into the wafer boxes of the loading table in sequence, and taking the wafer boxes filled with 21 wafers away by a subsequent manipulator when the number of the wafers in the wafer boxes reaches 21.
EXAMPLE III
Referring to fig. 4, the difference between the first embodiment and the second embodiment is that a temporary storage unit 5 is further installed between the loading platform and the second cleaning unit for storing the wafers that cannot be cleaned by the second cleaning unit 4.
The invention discloses a carrying method for cleaning a plurality of wafers after CMP, which comprises the following steps:
in step S01, the interface unit receives the CMP wafer and moisturizes the wafer.
In step S02, the double robot transfers the first wafer in the transfer unit to the first cleaning unit, and cleans the brush with pure water and alkaline chemical for 120 seconds.
And step S03, the double manipulators convey the first wafer after the first cleaning to a second cleaning unit, spray-clean the first wafer by matching the nozzles with ozone and acidic liquid medicine, and spin-dry the first wafer, wherein the process needs 180 seconds.
In step S04, the double robot returns to the transfer unit, and transfers the second wafer in the transfer unit to the first cleaning unit to perform the first cleaning for 120 seconds, and the first wafer is cleaned in the second cleaning unit at this time.
Step S05, after the second wafer is cleaned in the first cleaning unit, continuing to moisturize in the first cleaning unit, and then the second wafer enters the second cleaning unit before the first wafer is cleaned for the second time.
Step S06, after the positions of the first wafer and the second wafer are exchanged, the clamping jaws in the dry state are used to take out the first wafer in the second cleaning unit, then the clamping jaws in the wet state are used to place the second wafer in the second cleaning unit for cleaning, and the first wafer is sent into the wafer box of the loading platform.
And S07, repeating the steps S02-S06 in sequence, putting the cleaned wafers into the wafer boxes of the loading table in sequence, and taking the wafer boxes filled with 25 wafers away by a subsequent manipulator when the number of the wafers in the wafer boxes reaches 25.
Step S08, when the wafer can not be placed into the wafer cassette after the cleaning, the wafer is temporarily stored in the temporary storage unit for moisture preservation, so as to be subsequently transferred to the loading platform.
According to the carrying method for wafer CMP post-cleaning, the double manipulators are adopted for clamping the wafer, so that the next wafer can be moved to the cleaning position of the previous wafer before the previous wafer is cleaned, the positions of the two wafers are exchanged, and the previous wafer is sent to the subsequent station, so that the carrying time of the wafer can be effectively reduced, the productivity is improved, the cleaning efficiency is improved, and the requirement for wafer batch cleaning is met.
The above is only a specific application example of the present invention, and the protection scope of the present invention is not limited in any way. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.
Claims (6)
1. A carrying method for cleaning a wafer after CMP is characterized by comprising the following steps:
step S01, the cross-connecting unit receives the wafer after CMP and performs pre-cleaning;
step S02, the double manipulators convey the first wafer in the transfer unit to the first cleaning unit for first cleaning; wherein the first cleaning time is 110-130 seconds;
step S03, the double manipulators convey the first wafer after the first cleaning to a second cleaning unit for second cleaning; wherein the time for the second cleaning is 170-190 seconds;
step S04, returning the double manipulators to the transfer unit, and conveying the second wafer in the transfer unit to the first cleaning unit for first cleaning;
step S05, after the second wafer is cleaned in the first cleaning unit, moisturizing and waiting, and then the second wafer enters a second cleaning unit before the first wafer is cleaned for the second time;
step S06, after the positions of a first wafer and a second wafer are exchanged by the two manipulators, the second wafer is cleaned in a second cleaning unit, and the first wafer is sent into a wafer box of the loading table through the two manipulators;
and S07, repeating the steps S02-S06 in sequence, putting the wafers into the wafer boxes of the loading platform in sequence, and taking the wafer boxes by a subsequent manipulator when the number of the wafers meets the requirement.
2. A method for handling a wafer after CMP according to claim 1, wherein: and a temporary storage unit is also arranged between the second cleaning unit and the loading platform and used for temporarily storing the cleaned wafer which cannot be placed on the loading platform.
3. A method for handling a wafer after CMP according to claim 1, wherein: in step S01, the pre-cleaning is to immerse the CMP wafer in ozone water with two pieces as a group, and then perform ultrasonic cleaning to ensure that the wafer is in a wet state.
4. A method for handling a wafer after CMP according to claim 1, wherein: the cleaning process of the first cleaning unit is as follows: when the brush rotates, the wafer is brushed by pure water and alkaline liquid medicine in sequence.
5. A method for handling a wafer after CMP according to claim 1, wherein: the cleaning process of the second cleaning unit is as follows: and the nozzle sprays ozone and acidic liquid medicine to the wafer in sequence, and finally the wafer is dried by spin.
6. A method for handling a wafer after CMP according to claim 1, wherein: and the two mechanical arms are provided with two clamping jaws which are arranged up and down and are respectively used for clamping wafers in a wet state and a dry state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011446726.XA CN112635374A (en) | 2020-12-09 | 2020-12-09 | Carrying method for cleaning wafer after CMP |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011446726.XA CN112635374A (en) | 2020-12-09 | 2020-12-09 | Carrying method for cleaning wafer after CMP |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112635374A true CN112635374A (en) | 2021-04-09 |
Family
ID=75310157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011446726.XA Pending CN112635374A (en) | 2020-12-09 | 2020-12-09 | Carrying method for cleaning wafer after CMP |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112635374A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115172221A (en) * | 2022-07-26 | 2022-10-11 | 北京烁科精微电子装备有限公司 | Control method and device for moisturizing function of wafer cleaning device and storage medium |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999017342A1 (en) * | 1997-09-29 | 1999-04-08 | Applied Materials, Inc. | Method and apparatus for polishing and cleaning semiconductor wafers |
| CN105810618A (en) * | 2016-05-31 | 2016-07-27 | 北京七星华创电子股份有限公司 | System and method for improving wafer transmission efficiency |
| CN109148341A (en) * | 2018-10-16 | 2019-01-04 | 杭州众硅电子科技有限公司 | A kind of CMP wafer cleaning equipment |
-
2020
- 2020-12-09 CN CN202011446726.XA patent/CN112635374A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999017342A1 (en) * | 1997-09-29 | 1999-04-08 | Applied Materials, Inc. | Method and apparatus for polishing and cleaning semiconductor wafers |
| CN105810618A (en) * | 2016-05-31 | 2016-07-27 | 北京七星华创电子股份有限公司 | System and method for improving wafer transmission efficiency |
| CN109148341A (en) * | 2018-10-16 | 2019-01-04 | 杭州众硅电子科技有限公司 | A kind of CMP wafer cleaning equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115172221A (en) * | 2022-07-26 | 2022-10-11 | 北京烁科精微电子装备有限公司 | Control method and device for moisturizing function of wafer cleaning device and storage medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11495475B2 (en) | Method of cleaning a substrate | |
| CN110815035B (en) | Chemical mechanical planarization equipment combining grinding and single-wafer cleaning module | |
| US11908720B2 (en) | CMP wafer cleaning equipment, wafer transfer robot and wafer flipping method | |
| JP2011519166A5 (en) | ||
| TW200307334A (en) | Integrated system for processing semiconductor wafers | |
| CN112635374A (en) | Carrying method for cleaning wafer after CMP | |
| KR102238879B1 (en) | Substrate processing apparatus and substrate transporting method | |
| US20090061739A1 (en) | Polishing apparatus and method for polishing semiconductor wafers using load-unload stations | |
| JP4030654B2 (en) | Substrate transfer device | |
| JP3797822B2 (en) | Polishing device | |
| TWI810835B (en) | Drying system with integrated substrate alignment stage | |
| JP2002520132A (en) | Method and apparatus for cleaning a substrate | |
| CN212517146U (en) | Efficient chip double-side scrubbing machine | |
| CN110517975B (en) | post-CMP cleaning device and cleaning method thereof | |
| JP4413882B2 (en) | Polishing device | |
| CN210586006U (en) | Cleaning equipment for battery cell | |
| JP3766177B2 (en) | Substrate processing apparatus and substrate cleaning apparatus | |
| CN218658378U (en) | Chemical mechanical polishing system | |
| CN220753373U (en) | Wafer wet processing and cleaning system | |
| JP7262594B2 (en) | Coating and developing equipment | |
| CN221583211U (en) | Wafer processing equipment | |
| CN221596381U (en) | Synchronous cleaning equipment for wafer back and wafer box | |
| CN218658379U (en) | Chemical mechanical polishing system | |
| US8377219B2 (en) | Method for cleaning a semiconductor wafer composed of silicon directly after a process of polishing of the semiconductor wafer | |
| TWM647657U (en) | System for wafer wet processing and cleaning |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220817 Address after: Room 101, building 4, northwest Suzhou nano City, 99 Jinjihu Avenue, Suzhou Industrial Park, 215000, Jiangsu Province Applicant after: RUOMINGXIN SEMICONDUCTOR TECHNOLOGY (SUZHOU) Co.,Ltd. Applicant after: Rumingxin equipment (Suzhou) Co.,Ltd. Address before: Room 101, building 4, northwest Suzhou nano City, 99 Jinjihu Avenue, Suzhou Industrial Park, 215000, Jiangsu Province Applicant before: RUOMINGXIN SEMICONDUCTOR TECHNOLOGY (SUZHOU) Co.,Ltd. |