CN218658379U - Chemical mechanical polishing system - Google Patents

Abstract

The utility model discloses a chemical mechanical polishing system, which comprises a preposed unit; a polishing unit; the cleaning unit is arranged between the prepositive unit and the polishing unit; the cleaning unit comprises a first cleaning unit and a second cleaning unit, and the first cleaning unit and the second cleaning unit are symmetrically arranged relative to the transverse center line of the cleaning unit; the first cleaning unit and the second cleaning unit comprise a post-processing module, a front transmission manipulator and a rear transmission manipulator, and the post-processing module is vertically stacked to form a stacked module; the first cleaning unit and the second cleaning unit are respectively provided with a pair of stacked modules, wherein a connecting line of one stacked module and the front transmission manipulator is parallel to a connecting line of the other stacked module and the rear transmission manipulator.

Description

Chemical mechanical polishing system

Technical Field

The utility model belongs to the technical field of CMP, particularly, relate to a chemical mechanical polishing system.

Background

The chip is a carrier of an integrated circuit, and the chip manufacturing relates to the process flows of integrated circuit design, wafer manufacturing, wafer processing, electrical property measurement, packaging test and the like. Wherein, the chemical mechanical polishing belongs to one of five core processes in the wafer manufacturing process.

Chemical Mechanical Polishing (CMP) is a globally planarized ultra-precise surface processing technique. Chemical mechanical polishing is accomplished in a CMP system, which generally includes a pre-stage unit, a polishing unit, and a cleaning unit.

In order to simplify wafer transmission of the CMP system and improve wafer transmission efficiency, the wafer transmission mechanism is usually arranged across a plurality of functional units, for example, the wafer transmission mechanism is arranged across the cleaning unit and the polishing unit; such an arrangement can improve the operation efficiency, but also reduces the independence of each functional unit, which affects the flexibility of the operation of the CMP system. If one of the functional units fails, the entire CMP system is rendered inoperable.

SUMMERY OF THE UTILITY MODEL

An embodiment of the utility model provides a chemical mechanical polishing system aims at solving one of the technical problem that exists among the prior art at least.

An embodiment of the utility model provides a chemical mechanical polishing system, include:

a front unit;

a polishing unit;

the cleaning unit is arranged between the prepositive unit and the polishing unit;

the cleaning unit comprises a first cleaning unit and a second cleaning unit, and the first cleaning unit and the second cleaning unit are symmetrically arranged relative to the transverse center line of the cleaning unit; the first cleaning unit and the second cleaning unit comprise a post-processing module, a front transmission manipulator and a rear transmission manipulator, and the post-processing module is vertically stacked to form a stacked module; the first cleaning unit and the second cleaning unit are respectively provided with a pair of stacked modules, wherein a connecting line of one stacked module and the front transmission manipulator is parallel to a connecting line of the other stacked module and the rear transmission manipulator.

In some embodiments, the stacked modules are staggered along the lateral and longitudinal directions of the wash unit.

In some embodiments, the stacking module adjacent to the front unit is configured with a buffer device disposed between vertically stacked post-processing modules to buffer wafers transferred by the front transfer robot and/or the rear transfer robot.

In some embodiments, the lamination module adjacent to the front unit is a front-end lamination module, and the lamination module adjacent to the polishing unit is a rear-end lamination module; the front transmission manipulator is adjacent to the front unit, and the rear transmission manipulator is adjacent to the polishing unit; and the connecting line of the front transmission manipulator and the front end stacking module is parallel to the width direction of the cleaning unit.

In some embodiments, the front end unit transfers the wafer to be processed to the buffer device, and the rear end transfer robot picks up the wafer from the buffer device and transfers the wafer to the polishing unit.

In some embodiments, the line connecting the back transfer robot to the front-end laminated module is perpendicular to the line connecting the back transfer robot to the back-end laminated module.

In some embodiments, the stacked module includes at least a pair of aftertreatment modules arranged in a vertical stack.

In some embodiments, the post-processing modules include a brush module, a pre-clean module, and a dry module that process the wafer surface in a horizontal manner.

In some embodiments, the brushing module is disposed adjacent to the polishing unit, which is located at an upper portion and/or a lower portion of the lamination module.

In some embodiments, the pre-wash module is disposed adjacent to a pre-cell, which is located at a lower portion of the lamination module.

In some embodiments, the drying module is disposed adjacent to a front unit, which is located at an upper portion of the stacking module.

In some embodiments, the front transfer robot is disposed at a side portion of the cleaning unit frame, the rear transfer robot is disposed at a middle portion of the cleaning unit frame, and the front transfer robot and the rear transfer robot are vertically movable to transfer the wafer between the post-processing modules.

In some embodiments, the post-processing module is configured with a housing having access ports configured on at least two sides of the housing, the front and rear transport robots capable of accessing wafers through the access ports.

In some embodiments, the access opening corresponds to the location of the front and rear transfer robots, which are capable of transferring wafers between stacked modules.

The beneficial effects of the utility model include:

a. the stacking module horizontally adjacent to the front unit is provided with a buffer device so as to connect the transmission sheet between the front unit and the polishing unit and improve the transmission efficiency of the wafer entering the polishing unit;

b. the stacking modules are arranged in a staggered mode along the transverse direction and the longitudinal direction of the cleaning unit so as to reduce the length size of the cleaning unit, control the length of the CMP system and reduce the space occupation of the CMP system to a Fab factory;

c. the first cleaning unit and the second cleaning unit are symmetrically arranged along the transverse center line of the polishing unit and operate independently; and moreover, the post-processing modules in each stacked module run independently, so that the fault tolerance of the cleaning unit is effectively improved, and the running stability of the CMP system is improved.

Drawings

The advantages of the present invention will become more apparent and more readily appreciated from the detailed description given herein below, taken in conjunction with the accompanying drawings, which are given by way of illustration only, and which do not limit the scope of the invention, and in which:

FIG. 1 is a schematic view of a chemical mechanical polishing system provided by an embodiment of the present invention;

fig. 2 is a schematic view of a cleaning unit according to an embodiment of the present invention;

fig. 3 is a schematic diagram of a first front-end stacked module according to an embodiment of the present invention;

fig. 4 is a schematic view of a rear transport robot according to an embodiment of the present invention;

fig. 5 is a schematic view of a brushing module according to an embodiment of the present invention;

fig. 6 is a schematic diagram of a pre-cleaning module according to an embodiment of the present invention;

fig. 7 is a schematic diagram of a drying module according to an embodiment of the present invention;

fig. 8 is a transmission line diagram of a wafer in the chemical mechanical polishing system shown in fig. 1.

Detailed Description

The technical solution of the present invention will be described in detail with reference to the following embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention and are provided to illustrate the concepts of the present invention; the description is intended to be illustrative and exemplary in nature, and is not to be construed as limiting the embodiments of the invention or the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification thereof, and these technical solutions include technical solutions which make any obvious replacement or modification of the embodiments described herein.

The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of the respective portions and the mutual relationships thereof. It should be understood that the drawings are not necessarily to scale, the same reference numerals being used to identify the same elements in the drawings in order to clearly illustrate the structure of the various elements of the embodiments of the invention.

In the present invention, "Chemical Mechanical Polishing (CMP)" is also referred to as "Chemical Mechanical Planarization (CMP)", and wafers (Wafer, W) are also referred to as substrates (Substrate), and their meanings and practical effects are equivalent.

FIG. 1 is a schematic diagram of a chemical mechanical polishing system according to an embodiment of the present invention, a chemical mechanical polishing system comprising:

the Front-End unit 1 is also called an EFEM (equivalent Front End Module) and is used for storing wafers to be polished and polished wafers;

the polishing unit 3 is used for chemically and mechanically polishing the wafer so as to complete the material removal of the surface of the wafer;

and the cleaning unit 2 is arranged between the front unit 1 and the polishing unit 3 to remove particles remained on the surface of the wafer in the polishing process and ensure that the cleanliness of the surface of the wafer meets the process requirement.

In fig. 1, the Front unit 1 includes four Front Opening FOUPs 1a, which are called FOUPs (Front Opening Unified Pod) for storing wafers. A front robot 1b is disposed at one side of the front opening type foup 1a, and the front robot 1b is used for wafer transfer between the front opening type foup 1a and the cleaning unit 2.

In the embodiment shown in fig. 1, the wash unit 2 comprises a first wash unit 2A and a second wash unit 2B, wherein the first wash unit 2A and the second wash unit 2B are arranged symmetrically with respect to a transverse centre line CL of the wash unit 2. The transverse center line CL is disposed along the length direction of the cleaning unit 2, i.e., a connection line between the width midpoints of the cleaning units 2. In the utility model, the horizontal direction of the cleaning unit 2 refers to the length direction of the cleaning unit 2; the longitudinal direction of the cleaning unit 2 refers to the width direction of the cleaning unit 2; the first cleaning unit 2A and the second cleaning unit 2B are disposed substantially symmetrically with respect to the lateral center line CL.

Further, the first cleaning unit 2A and the second cleaning unit 2B include a plurality of post-treatment modules 20 shown in fig. 3, a front transfer robot 23 and a rear transfer robot 24 shown in fig. 2. Wherein the post-processing modules 20 are stacked in a vertical direction to form a stacked module; the front transfer robot 23 and the rear transfer robot 24 are disposed adjacent to the stacked modules to facilitate wafer transfer.

In the embodiment shown in fig. 1, the front transfer robot 23 is horizontally adjacent to the front unit 1, the rear transfer robot 24 is horizontally adjacent to the polishing unit 3, and the front transfer robot 23 and the rear transfer robot 24 are mainly responsible for wafer transfer inside the stacked modules and between the stacked modules.

It should be noted that the first cleaning unit 2A and the second cleaning unit 2B of the present invention are substantially similar in structure. For convenience of description, the part name in the first cleaning unit 2A starts with "first" and the part number ends with "a"; accordingly, the part names in the second cleaning unit 2B start with "second" and the part numbers end with "B". The following description focuses on the composition and the approximate connection relationship of the first cleaning unit 2A.

In fig. 1, the first cleaning unit 2A includes two lamination modules, i.e., a first front lamination module 21A and a first rear lamination module 22A, and a first front transfer robot 23A and a first rear transfer robot 24A are provided at the side of the lamination modules. The first front-end stacking module 21A is horizontally disposed adjacent to the front unit 1, and the first rear-end stacking module 22A is horizontally disposed adjacent to the polishing unit 3.

Fig. 2 is a schematic view of a cleaning unit 2 according to an embodiment of the present invention, in the first cleaning unit 2A, a connection line between the first front-end laminated module 21A and the front transfer robot 23 is parallel to a connection line between the first rear-end laminated module 22A and the rear transfer robot 24. Meanwhile, the line connecting the first rear-end laminated module 22A and the front transfer robot 23 is also parallel to the line connecting the first front-end laminated module 21A and the rear transfer robot 24. That is, the first front-end stacking module 21A and the first rear-end stacking module 22A are disposed in a staggered manner in the transverse direction and the longitudinal direction of the cleaning unit 2, and a line connecting positions of the front-end transfer robot 23, the rear-end transfer robot 24, the first front-end stacking module 21A, and the first rear-end stacking module 22A forms a parallelogram. By the arrangement, the length and the size of the cleaning unit 2 are effectively controlled, the length and the size of the CMP system are reduced, and the space occupation of the CMP system on a Fab factory is reduced.

In the embodiment shown in fig. 2, both the front transfer robot 23 and the rear transfer robot 24 are capable of transferring wafers within and between stacked modules. In the wafer post-processing process, the work amount of wafer transmission can be uniformly distributed to the front transmission manipulator 23 and the rear transmission manipulator 24, so that the work amount of a single transmission manipulator can be controlled, and the condition that the service life of the single transmission manipulator is shortened due to overlarge work amount is avoided.

Further, the first front end laminated module 21A and the first rear end laminated module 22A are staggered in the lateral direction and the longitudinal direction of the cleaning unit 2. By the arrangement, the maintenance space of the cleaning unit 2 is increased, and the operation convenience of the CMP system is improved.

In fig. 1, a first front-end stacking module 21A and a second front-end stacking module 21B provided adjacent to the front unit 1 are provided near the lateral center line CL shown in fig. 1 so that a maintenance work space is formed between the stacking modules and the outer side surface of the cleaning unit 2; accordingly, the stacked module adjacent to the polishing unit 3 is disposed near the outer side surface of the cleaning unit 2, and an operator can stand outside the CMP system to inspect and maintain the failed aftertreatment module.

In the embodiment shown in fig. 1, the first cleaning unit 2A and the second cleaning unit 2B operate independently without interfering with each other, which is beneficial to ensure stable operation of wafer cleaning. The stacked modules are staggered in the transverse direction of the cleaning unit 2, and the post-treatment modules 20 in the stacked modules are arranged in the vertical direction instead of being spread in parallel in the transverse direction and/or the longitudinal direction of the cleaning unit 2, which is beneficial to reducing the volume of the cleaning unit 2 and further controlling the overall volume of the CMP system.

In the embodiment shown in fig. 2, the first cleaning unit 2A and the second cleaning unit 2B further include a buffer device 25, and the buffer device 25 is disposed in the stacked module adjacent to the front unit 1. The front end robot 1b shown in fig. 1 transfers the wafer to be polished from the front opening foup 1a to the buffer device 25, and the rear end transfer robot 24 transfers the wafer to the polishing unit 3.

In fig. 2, the post-processing modules 20 are vertically stacked, and the buffer device 25 is disposed between the post-processing modules 20 corresponding to the adjacent front unit 1. With this arrangement, the occupation of the horizontal and vertical spaces of the wash unit 2 by the buffer device 25 can be reduced, which is advantageous for reducing the volume of the wash unit 2. In addition, the buffer device 25 is located at the same horizontal position as the post-processing modules 20 located at the upper and lower sides thereof, and the outer dimensions of the buffer device 25 are smaller than or equal to the lateral and longitudinal dimensions of the post-processing modules 20, so that the gripping range of the rear transfer robot 24 can be reduced, the manufacturing cost of the transfer robot can be reduced, and the manufacturing cost of the cleaning unit 2 can be controlled.

Fig. 3 is a schematic diagram of the first front-end stacked module 21A, the post-processing modules 20 are vertically stacked, and the buffer device 25 is disposed between the vertically stacked post-processing modules 20. It should be noted that the vertical distance H between the aftertreatment modules 20 refers to the distance between the bottom surface of the upper aftertreatment module 20 and the top surface of the lower aftertreatment module 20. It can be understood that the vertical distance H needs to be matched with the wafer transmission manipulator, based on the fact that the front manipulator 1b smoothly places the wafer and the rear transmission manipulator 24 smoothly grabs the wafer; in some embodiments, the vertical spacing of the aftertreatment modules 20 is 50-200mm.

In fig. 3, the buffer device 25 includes a buffer main body portion 25a and a plurality of claw portions 25b, the claw portions 25b are disposed above the buffer main body portion 25a, and the number of the claw portions 25b is plural, so as to stably support the wafer W placed in the buffer device 25.

In the stacked module shown in fig. 3, the number of the post-processing modules 20 is one pair. It will be appreciated that the aftertreatment module 20 may be in other numbers, such as one piece, three pieces, etc., which may be determined in combination taking into account the height of the aftertreatment module 20 and the cleaning unit 2.

In the embodiment shown in fig. 2, the first front transfer robot 23A includes a front slide rail 23C, the front slide rail 23C is disposed in a vertical direction, and the gripping claws of the first front transfer robot 23A and the driving devices thereof can be moved in the length direction of the front slide rail 23C to transfer wafers between the vertically stacked post-processing modules 20. In the embodiment shown in fig. 1, the front transfer robot 23 includes a first front transfer robot 23A and a second front transfer robot 23B, which are disposed adjacent to the outer sides of the racks of the wash unit 2, respectively.

Further, the first front transport robot 23A is provided with a rotary joint, and the end of the rotary joint is provided with a clamping jaw for taking and placing wafers. And, the rotary joint of the first front transport robot 23A is disposed upside down. Specifically, the driving device of the first front transfer robot 23A is located above the revolute joint.

The main purposes of the inverted arrangement of the revolute joint are: the height of the laminated module is controlled, and the space occupation of the cleaning unit 2 is reduced. Specifically, if the driving means of the first front transfer robot 23A is located below the revolute joint, the lowest position at which the first front transfer robot 23A moves downward is limited by the height of the driving means itself. It will be appreciated that the drive means of the first front transfer robot 23A cannot interfere with the frame of the wash unit 2 during operation. If the rotary joint of the transmission manipulator is arranged upside down, namely the driving device is positioned above the rotary joint, the technical problem can be solved. The second front transfer robot 23B shown in fig. 1 is similar in structure to the first front transfer robot 23A, and will not be described in detail here.

Fig. 4 is a schematic diagram of the rear transmission manipulator 24 provided in an embodiment of the present invention, the rear transmission manipulator 24 includes a rear slide rail 24C, the rear slide rail 24C is arranged along a vertical direction, the first rear transmission manipulator 24A and the second rear transmission manipulator 24B are distributed and arranged on two sides of the rear slide rail 24C, and both can move along a length direction of the rear slide rail 24C independently from each other to transmit the wafer between the vertically stacked post-processing modules 20. The rotary joint fitted to the rear transfer robot 24 is also disposed upside down, and the structure functions similarly to the first front transfer robot 23A shown in fig. 2 to control the height of the stacked modules and reduce the space occupation of the cleaning unit 2 in the vertical direction.

As an embodiment of the present invention, the post-processing module 20 includes a brushing module 20A, a pre-cleaning module 20B and a drying module 20C to complete the cleaning and drying of the wafer.

Fig. 5 is a schematic view of a brush module 20A according to an embodiment of the present invention, in which the brush module 20A includes a housing, a wafer W is horizontally supported and rotated by a driving roller, and a cleaning brush located on an upper side or a lower side of the wafer W can roll around an axis by a driving motor, not shown; the interior of the housing is also provided with a cleaning solution spray assembly that sprays chemical solution toward the surface of the wafer to remove residue from the surface of the wafer using the cleaning brush. It should be noted that the wafer in the brushing module 20A needs to be horizontally disposed; therefore, it is necessary to open an access for taking and placing the wafer on the side surface of the housing so that the front transport robot 23 and the rear transport robot 24 can take and place the wafer through the access on the side surface.

Fig. 6 is a schematic view of a pre-cleaning module 20B according to an embodiment of the present invention, in which a carrier is disposed in the pre-cleaning module 20B, and a plurality of clamping jaws are disposed on the upper portion of the carrier to horizontally clamp a wafer W; the pre-cleaning module 20B further includes a not-shown rotation driving device for rotating the carrier and the wafer W thereon.

Further, the pre-cleaning module 20B further includes a dual fluid pipe and a brush head, the dual fluid pipe sprays cleaning liquid, N2 and/or deionized water toward the wafer W to remove smaller particles on the surface of the wafer, so as to implement fine cleaning of the wafer; the brush-washing head is arranged above the wafer through the swing arm, and the swing arm can swing around a fixed point to drive the brush-washing head to move on the surface of the wafer so as to clean micro particles on the surface of the wafer. It should be noted that the pre-cleaning module 20B further includes a casing, not shown, to ensure that the wafer is pre-cleaned in the relatively sealed casing.

Fig. 7 is a schematic diagram of a drying module 20C according to an embodiment of the present invention, in which the drying module 20C includes a wafer clamping mechanism and a drying mechanism, both of which are disposed in a housing; the wafer clamping mechanism horizontally clamps a wafer to be dried, the drying mechanism is located on the upper side of the wafer to be dried, and the drying mechanism can peel off a water film on the surface of the wafer based on the Marangoni effect to dry the wafer; the drying module 20C further includes an external shield to control the centrifugal splashing range of the particles during the wafer drying process, so as to improve the wafer drying effect.

In the embodiment shown in fig. 1, the drying module 20C in the stacked module is disposed horizontally adjacent to the front unit 1. After the wafer is dried, the front-end robot 1b directly transfers the wafer to the front-open wafer transfer box 1a, so as to reduce the pollution in the wafer transfer process and ensure the processing quality of the wafer.

Further, the drying module 20C is located at an upper portion of the lamination module. Since the drying module 20C is configured with a Fan Filter Unit (FFU), the drying module 20C is ensured to obtain clean circulating air. The fan filter unit is generally disposed on the top of the housing, and the drying module 20C is particularly disposed on the upper portion of the stacking module in order to avoid the conflict between the fan filter unit and the installation position of the buffer device 25, considering that the buffer device 25 needs to be disposed in the stacking module adjacent to the front unit 1.

In the embodiment shown in fig. 2, the brushing module 20A is disposed adjacent to the polishing unit 3 and located at the lower portion and/or the upper portion of the corresponding stacked module to clean the particles on the surface of the wafer by horizontal brushing, so as to perform rough cleaning on the surface of the wafer to remove the larger particles on the surface of the wafer. In fig. 2, the brushing module 20A is disposed adjacent to the polishing unit 3 and located at the lower portion of the stacked module, and the post-processing module corresponding to the upper portion of the stacked module adjacent to the polishing unit 3 is a pre-cleaning module 20B, so as to implement fine cleaning of the wafer surface by using a two-fluid and local brushing manner, and remove fine particles on the wafer surface.

The drying module 20C shown in fig. 7 is disposed adjacent to the front unit 1 and above the corresponding stacking module to peel off the water film on the surface of the wafer as a whole, thereby drying the surface of the wafer. The drying module 20C is thus provided to provide an installation space for the fan filter unit to be disposed.

In the embodiment shown in fig. 2, the first front-end laminated module 21A, the first rear-end laminated module 22A, the second front-end laminated module 21B, and the second rear-end laminated module 22B are provided with vertically laminated housings. At least two sides of the housing are provided with access openings to facilitate the access of wafers by the front transport robot 23 and the rear transport robot 24 through the access openings.

In fig. 2, the inlet and the outlet correspond to the positions of the front transfer robot 23 and the rear transfer robot 24, the front transfer robot 23 can transfer the wafer between the first front-end stacking module 21A and the first rear-end stacking module 22A, and the rear transfer robot 24 can also transfer the wafer between the first front-end stacking module 21A and the first rear-end stacking module 22A, so as to effectively improve the flexibility of wafer transfer.

Fig. 8 is a diagram of a transfer route of a wafer in the CMP system shown in fig. 1, in order to clearly illustrate the transfer path of the wafer, the first cleaning unit 2A is used to illustrate the transfer process of the wafer from the front unit 1 to the polishing unit 3, and a specific transfer route is indicated by a dotted line with an arrow; the transfer of the wafer from the polishing unit 3 to the cleaning unit 2 and the front unit 1 is described using the second cleaning unit 2B, and the specific transfer route is indicated by a dotted line with an arrow.

The transfer of the wafer from the front unit 1 to the polishing unit 3 is briefly described as follows:

first, the front end robot 1b transfers the wafer to be polished to the buffer device 25 (shown in fig. 3) in the first front end stacking module 21A to complete the transfer in step (1); next, the first rear transfer robot 24A holds the wafer in the buffer device 25 and transfers it to the polishing unit 3 to complete the transfer of step (2). The wafer can be transmitted from the front unit 1 to the polishing unit 3 through two transmission steps in total, and the transmission efficiency of the wafer is effectively improved.

The following describes the process of transferring the wafer from the polishing unit 3 to the cleaning unit 2 and the pre-stage unit 1: first, the polished wafer is transferred from the second rear transfer robot 24B to the second rear lamination module 22B to complete the transfer of step (3); then, the second rear transfer robot 24B or the second front transfer robot 23B transfers the wafer from the second rear lamination module 22B to the second front lamination module 21B to complete the transfer in step (4); then, after the second front-end stacking module 21B finishes drying the wafer, the front-end robot 1B transfers the wafer finished with drying to the front-open foup 1a to finish the transfer of step (5).

It should be noted that the polished wafer can also be directly transferred to the second front-end stacking module 21B by the second rear transfer robot 24B; during the wafer post-processing, the wafer can be transferred between the second front-end lamination module 21B and the second back-end lamination module 22B, so as to ensure the processing efficiency of the CMP system.

As an embodiment of the present invention, if a plurality of post-processing modules in the first cleaning unit 2A of the cleaning unit 2 fails, the first cleaning unit 2A cannot work normally; the wafer being processed may be transferred to the first front-end lamination module 21A in the first cleaning unit 2A first and then to the second front-end lamination module 21B in the second cleaning unit 2B by the front robot 1B in the front unit 1, so that the wafer may be transferred inside the lamination modules and/or between the lamination modules of the second cleaning unit 2B by the front transfer robot 23 and/or the rear transfer robot 24 to complete the cleaning and drying of the wafer.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (14)

1. A chemical mechanical polishing system, comprising:

a front unit;

a polishing unit;

the cleaning unit is arranged between the prepositive unit and the polishing unit;

the cleaning unit comprises a first cleaning unit and a second cleaning unit, and the first cleaning unit and the second cleaning unit are symmetrically arranged relative to the transverse center line of the cleaning unit; the first cleaning unit and the second cleaning unit comprise a post-processing module, a front transmission manipulator and a rear transmission manipulator, and the post-processing module is vertically stacked to form a stacked module; the first cleaning unit and the second cleaning unit are respectively provided with a pair of stacked modules, wherein a connecting line of one stacked module and the front transmission manipulator is parallel to a connecting line of the other stacked module and the rear transmission manipulator.

2. The chemical mechanical polishing system of claim 1, wherein the stacked modules are staggered along a lateral direction and a longitudinal direction of the cleaning unit.

3. The chemical mechanical polishing system of claim 1, wherein a buffer device is disposed adjacent to the stacked modules of the front unit, the buffer device being disposed between the vertically stacked post-processing modules to buffer wafers transferred by the front transfer robot and/or the rear transfer robot.

4. The chemical mechanical polishing system of claim 3, wherein the stack module adjacent to the front end unit is a front end stack module, and the stack module adjacent to the polishing unit is a back end stack module; the front transmission manipulator is adjacent to the front unit, and the rear transmission manipulator is adjacent to the polishing unit; and the connecting line of the front transmission manipulator and the front end stacking module is parallel to the width direction of the cleaning unit.

5. The chemical mechanical polishing system of claim 4, wherein the front end unit transfers wafers to be processed to the buffer device, and the rear transfer robot grasps wafers from the buffer device and transfers them to the polishing unit.

6. The chemical mechanical polishing system of claim 4, wherein a line connecting the backside transfer robot to the front end lamination module is perpendicular to a line connecting the backside transfer robot to the back end lamination module.

7. The chemical mechanical polishing system of claim 1, wherein the stack module comprises at least one pair of post-treatment modules stacked in a vertical direction.

8. The chemical mechanical polishing system of claim 7, wherein the post-processing module comprises a brush module, a pre-clean module, and a dry module that process the wafer surface in a horizontal manner.

9. The chemical mechanical polishing system of claim 8, wherein the brush module is disposed adjacent to the polishing unit at an upper portion and/or a lower portion of the stack module.

10. The chemical mechanical polishing system of claim 8, wherein the pre-clean module is disposed adjacent to the pre-cell, which is located at a lower portion of the stack module.

11. The chemical mechanical polishing system of claim 8, wherein the drying module is disposed adjacent to the front unit, which is located at an upper portion of the laminated module.

12. The chemical mechanical polishing system of claim 1, wherein the front transfer robot is disposed at a side portion of the cleaning unit frame, the rear transfer robot is disposed at a middle portion of the cleaning unit frame, and the front transfer robot and the rear transfer robot are vertically movable to transfer the wafer between the post-processing modules.

13. The chemical mechanical polishing system of claim 8, wherein the post-processing module is configured with a housing having an access opening configured on at least two sides of the housing, the front and rear transport robots capable of accessing wafers through the access opening.

14. The chemical mechanical polishing system of claim 13, wherein the access opening corresponds to a location where the front and rear transfer robots are disposed, the front and rear transfer robots being capable of transferring wafers between the stacked modules.

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