TWM647657U - System for wafer wet processing and cleaning - Google Patents

Abstract

A system for wafer wet processing and cleaning includes a first turning device, a transfer device, a plurality of wet processing tanks, a second turning device, a moisturizing device, and at least one single wafer processing device. The first turning device is configured to turn a wafer cassette by 90 degrees along a first direction. The transfer device is configured to receive and move the wafer transfer. A plurality of process liquids are respectively arranged in the plurality of wet processing tanks. The transfer device can selectively move the wafer cassette to the second turning device. The moisturizing device is configured to provide a moisturizing liquid to the second turning device. The wafer in the wafer cassette after turned by the second turning device is placed on the single wafer processing device.

Description

Wafer wet processing and cleaning system

This invention relates to a wafer wet processing and cleaning system and method.

In the current field of three-dimensional integrated circuit (3D-IC) packaging technology, there are stacked chips (Chip on Wafer) on the wafer surface, thus forming a wafer surface with a complex structure.

Although the multi-tank body of the conventional wet bench is used to perform the etching and cleaning process on general wafers, the purpose of etching and cleaning with high productivity can be successfully achieved. However, when cleaning the surface of a wafer with a special complex structure, such as the above-mentioned 3D-IC wafer 40, as shown in Figure 1, residues 42 are easily left between the surface structures 41. Residue 42 may be uncleaned wafer particles or undried cleaning liquid, etc.

When etching and cleaning the 3D-IC wafer 40, it will go through multiple processes. In the final deionized water cleaning (DI Rinse) and drying (Dry) process, a Quick Dump Rinse (QDR) tank is used to clean wafers with complex structures in batches, and isopropyl alcohol ( isopropanol, IPA) tank batch drying of wafers with complex cleaning structures may still not meet the requirements for effective cleaning and drying of these wafers. For example, the generation of deionized water may not completely remove wafer particles, or the wafer may not be dried, resulting in residual water marks.

In this case, simply cleaning with conventional equipment will not be able to meet the cleanliness requirements. Therefore, there is a need for a wafer wet processing and cleaning system and method to solve the above-mentioned conventional problems.

Based on the above objectives, the present invention provides a wafer wet processing and cleaning system, which includes a first turning device, a transmission device, a plurality of wet processing tanks, a second turning device, a moisturizing device and at least one single wafer processing device. The first flipping device can be used to flip the crystal-carrying cassette 90 degrees along the first direction. The transfer device can be used to receive and move the crystal-carrying cassette. A plurality of process liquids can be respectively placed in a plurality of wet processing tanks, and the transfer device immerses at least one wafer carried by the wafer-carrying cassette into the plurality of wet processing tanks in sequence. The transfer device can selectively move the crystal-carrying cassette to the second flipping device, and the second flipping device flips the crystal-carrying cassette 90 degrees in a second direction opposite to the first direction. The moisturizing device can be disposed on the second flipping device to provide a moisturizing liquid to the second flipping device. The wafer in the wafer loading cassette flipped by the second flipping device is placed in the single wafer processing device.

Preferably, the transmission device includes a carrying mechanism, a translation mechanism and a lifting mechanism. The carrying mechanism is used to receive and carry the crystal-carrying cassette. The translation mechanism is connected with the carrying mechanism and used to drive the carrying mechanism to move in a horizontal direction. The lifting mechanism is connected to the translation mechanism and used to drive the carrying mechanism to move in a vertical direction.

Preferably, the wafer wet processing and cleaning system of the present invention further includes a first horizontal transfer device. The first horizontal transfer device takes the wafers in a horizontal state from the wafer loading and unloading area of the wafer wet processing and cleaning system. Round crystal-carrying cassette.

Preferably, the wafer wet processing and cleaning system of the present invention further includes a second horizontal transfer device. After the second flip device flips the wafer-carrying cassette 90 degrees in the second direction, the second horizontal transfer device transfers the wafer from the wafer Take the wafer in a horizontal state from the loading and unloading area to the single wafer processing device.

Preferably, the single wafer processing device includes a rotating stage and a liquid supply device. A rotating stage can be used to place the wafer. A liquid supply device is disposed above the rotating table and is used for applying at least one processing liquid to the wafer.

Preferably, the treatment liquid contains deionized water or etching liquid.

Preferably, the plurality of process liquids include one or more of etching liquid, desiccant, and deionized water.

Preferably, different process liquids are respectively disposed in different wet processing tanks.

Preferably, the wafer wet processing and cleaning system of the present invention further includes at least one drying tank, and the wafer-carrying cassette can be selectively transported to the drying tank by a conveying device.

Based on the above purpose, this invention provides a wafer wet processing and cleaning method, which includes the following steps:

Take at least one wafer to the wafer loading cassette provided on the first flipping device;

Use the first flipping device to flip the crystal-carrying cassette 90 degrees along the first direction;

A transfer device is used to receive and move the crystal-carrying cassette to a plurality of wet processing tanks, and a plurality of process liquids are respectively arranged in the plurality of wet processing tanks;

A transfer device is used to immerse the wafers carried in the wafer-carrying cassette into the plurality of wet processing tanks in sequence;

The transfer device can be used to selectively move the crystal-carrying cassette to the second turning device;

The second flipping device is used to flip the crystal-carrying cassette 90 degrees in a second direction opposite to the first direction.

Utilize a moisturizing device provided on the second flipping device to provide a moisturizing liquid to the second flipping device, so that the wafer remains in a moist state; and

The wafer in the wafer loading cassette flipped by the second flipping device is placed in the single wafer processing device.

Preferably, the wafer wet processing and cleaning method of the present invention further includes: applying at least one processing liquid to the wafer with a liquid supply device of a single wafer processing device; and rotating the wafer with a rotating table of the single wafer processing device. round.

Preferably, the wafer wet processing and cleaning method of the present invention further includes: providing at least one drying tank; and using a conveying device to transport the wafer-carrying cassette to the drying tank or the second flipping device.

This creation provides a wafer wet processing and cleaning system and method, which can prevent the deionized water from failing to completely clean and remove wafer particles, or the wafer being not dried, resulting in water marks remaining. In this creation, the wet bench equipment, single wafer processing device, and wafer loading cassette flipping device are integrated with each other. Therefore, after the wafers undergo batch immersion etching or tank cleaning processes, the advantages of the single-wafer processing device can be used for subsequent processing, such as spraying deionized water to clean the wafer surface, high-speed rotation and drying of the wafers, etc. Therefore, the above-mentioned problem that the use of QDR tank cleaning and the use of IPA tank drying cannot effectively clean and dry complex structure wafers is solved.

In order to help the examiner understand the technical characteristics, content and advantages of this invention and the effects it can achieve, this invention is described in detail below with the accompanying drawings in the form of expressions of embodiments, and the diagrams used therein are as follows. The subject matter is only for illustration and auxiliary explanation, and may not represent the true proportions and precise configuration of this creation after its implementation. Therefore, the proportion and configuration relationship of the attached drawings should not be interpreted to limit the scope of rights in the actual implementation of this creation. Let’s explain first.

The following will describe embodiments of the present invention with reference to relevant drawings. To facilitate understanding, the same components in the following embodiments are labeled with the same symbols.

As shown in FIGS. 2 and 3 , the wafer wet processing and cleaning system 10 may include a first flipping device 101 , a conveying device 102 , a plurality of wet processing tanks 103 , a second flipping device 104 , and at least one single wafer processing device. 106. The first horizontal transfer device 107 and the wafer loading and unloading area 109.

To further explain, in the present disclosure, in one embodiment, the first horizontal transfer device 107 can first move from the wafer loading/unloading area (Load/Unload Port) 109 to the front opening wafer transfer box (Front Opening Unified Pod, FOUP). The wafer 30 is picked up and transferred to the first flipping device 101 . After the wafer 30 is placed in the first flipping device 101, as shown in FIG. 4A and FIG. 4B, the first flipping device 101 will flip the wafer loading cassette 20 to turn the wafer 30 from a horizontal direction to a vertical direction.

At this time, as shown in FIGS. 5 and 6 , the transfer device 102 will take out the wafer cassette 20 containing the wafer 30 , transfer the wafer cassette 20 to the wet processing tank 103 , and immerse the wafer 30 in the wet process. in the processing tank 103. Then, according to the process settings, such as the sequence and time of immersing the wafer cassette in the wet processing tank 103 with different process liquids, continuous processes such as batch immersion etching and cleaning of the wafer 30 are performed.

To further explain, as shown in FIG. 3 , the first horizontal conveying device 107 may include a first telescopic arm 1071 and a first receiving portion 1072 . The first receiving part 1072 has elements that can attract or clamp the wafer 30 , such as clamping claws, suction cups, air extraction holes, etc., to clamp or attract the wafer 30 . In one embodiment, the first horizontal transfer device 107 takes the wafer 30 in a horizontal state from the wafer loading and unloading area 109 of the wafer 30 wet processing and cleaning system 10 to the wafer loading cassette 20 .

In an embodiment, as shown in FIG. 4A and FIG. 4B , in an embodiment, the first flip device 101 may include a base 1011, a support frame 1012, a flip frame 1013, a flip power unit 1014, and a limiting member 1015. The limiting power unit 1016 and the driving element 1017, and the first flipping device 101 can be used to flip the crystal-carrying cassette 20 90 degrees in the first direction (eg, clockwise direction).

In a preferred embodiment, the flipping frame 1013 is rotatably disposed on two supporting frames 1012, and the flipping power unit 1014 is disposed on one of the supporting frames 1012 and is connected to the flipping frame 1013 and used to rotate the flipping frame 1013. Make the flip frame 1013 vertical or horizontal. The flip power unit 1014 may be a motor, such as a stepper motor, a servo motor, etc. The motor has a rotatable rotating shaft, which is fixed to the flipping frame 1013 to drive the flipping frame 1013 to rotate.

In addition, the limiting members 1015 can be respectively pivoted on two opposite sides of the crystal-carrying cassette 20 and used to pivot to the limiting position or the release position. The limiting member 1015 can be close to the center of the crystal-carrying cassette 20 in the limiting position. When the limiting member 1015 pivots to the limiting position, the distance between the two limiting members 1015 will be smaller than the crystal-carrying cassette 20 . 20 width. When the two limiting members 1015 pivot to the release position, the distance between the two limiting members 1015 will be equal to or greater than the width of the crystal-carrying cassette 20 . The width usually refers to the width of the widest part of the crystal-carrying cassette 20 .

To further explain, in a preferred embodiment, as shown in FIGS. 4A and 4B , each limiting member 1015 may include a limiting crossbar, and the wafer 30 may be placed in the wafer cassette slot of the wafer cassette 20 201 in. The length of the limiting crossbar can be equal to or greater than the total length of all the wafers 30 in the cassette slots 201 along the side-by-side direction, thereby ensuring that the limiting crossbar can simultaneously abut the edges of all wafers 30 in the wafer cassette 20 to secure them. The position of wafer 30.

To further explain, the driving element 1017 can be connected to the limiting power unit 1016 so as to be driven by the limiting power unit 1016 to pivot the corresponding limiting member 1015 from the limiting position to the release position, or used for limiting power. The driving of the unit 1016 causes the corresponding limiting member 1015 to pivot from the release position to the limiting position.

In one embodiment, the transfer device 102 may include a carrying mechanism 1021, a translation mechanism 1022, and a lifting mechanism 1023, and is used to receive and carry the wafer-carrying cassette 20. To further explain, the translation mechanism 1022 is connected to the carrying mechanism 1021 to drive the carrying mechanism 1021 to move in the horizontal direction, and the lifting mechanism 1023 is connected to the translation mechanism 1022 to drive the carrying mechanism 1021 to move in a vertical direction to receive and receive the Move the crystal-carrying cassette 20.

As shown in FIGS. 5 and 6 , the carrying mechanism 1021 can be driven to the receiving position by the translation mechanism 1022 and the lifting mechanism 1023 to prepare to receive the crystal-carrying cassette 20 that has been flipped by the first flipping device 101 . At this time, the wafers 30 in the wafer loading cassette 20 are in a vertical state, so that each wafer 30 in the wafer loading cassette 20 can be evenly soaked by the process solution in the wet processing tank 103 .

In one embodiment, the translation mechanism 1022 and the lifting mechanism 1023 may include one or more of stepper motors, servo motors, gears, linear slide rails, pneumatic cylinders, and hydraulic cylinders; in addition, the carrying mechanism 1021 may include hooks, One or more of the joining elements such as a suction cup, a magnetic device, a tenon, etc., so that the carrying mechanism 1021 can take out the crystal-carrying cassette 20 from the first flipping device 101 and perform subsequent processes.

To further explain, a plurality of process liquids are respectively disposed in a plurality of wet processing tanks 103, and the transfer device 102 carries at least one wafer 30 carried by the wafer cassette 20, for example, any number from one to twenty-five wafers. The wafer 30 is sequentially immersed in a plurality of wet processing tanks 103 . In one embodiment, the plurality of process liquids may include one or more of etching liquid, desiccant, and deionized water, and the number of wet processing tanks 103 may be set according to requirements.

In one embodiment, different process liquids such as etching liquid, deionized water, and desiccant can be respectively disposed in different wet processing tanks 103. For example, the etching liquid is disposed in the first wet processing tank 103, and the deionized water is disposed in the first wet processing tank 103. In the second wet processing tank 103, the desiccant is provided in the third wet processing tank 103, and the wafer 30 can be immersed in the first to third wet processing tanks 103 in sequence.

It is further explained that the etching solution can be a sulfuric acid solution, a hydrochloric acid solution, a hydrofluoric acid solution, an ammonia solution, an ammonia hydroxide solution, a silicon dioxide etching solution or other cleaning chemicals. If two or more etching solutions are selected, the etching solution is not limited to Only the above three wet processing tanks 103 are used. For example, there may be two wet processing tanks 103 containing different etching liquids and one wet processing tank 103 containing deionized water and desiccant respectively. In addition, the desiccant can be isopropanol (IPA), but is not limited to this.

In addition, in one embodiment, the wafer wet processing and cleaning system 10 may further include a drying tank 110 . Therefore, for some wafers 30 that are suitable for being soaked in desiccant, they can also be dried in the drying tank 110 after being soaked in deionized water. The drying tank 110 can dry the wafers 30 in batches through various dry methods such as heating and applying dry air. Therefore, in this embodiment, the wafer-carrying cassette 20 can be selectively transported by the transport device 102 to the drying tank 110 according to the type of the wafer 30 .

In one embodiment, in addition to cleaning a whole batch of wafers 30 as described above, the above method cannot be used for wafers 30 with complex structures or wafers 30 that are not suitable for batch drying methods such as IPA. Meet the needs of washing or drying. Therefore, the wafer 30 can be immersed in ionized water according to needs, and then the transfer device 102 can selectively move the wafer cassette 20 to the second flipping device 104 . Then, the second flipping device 104 flips the wafer loading cassette 20 90 degrees in a second direction opposite to the first direction (eg, counterclockwise direction). At this time, the wafer 30 is in a horizontal state.

It is worth mentioning that, as shown in FIG. 7 , in order to prevent the wafer 30 from drying out during subsequent cleaning, causing water marks or other situations that are difficult to clean later, the wafer wet processing and cleaning system 10 may also include a moisturizing device. 105. The moisturizing device 105 can be disposed on the second flipping device 104 to provide a moisturizing liquid, such as deionized water, to the second flipping device 104 . Therefore, in one embodiment, the moisturizing device 105 can make the second flipping device 104 contain deionized water to soak the wafer 30 to prevent the wafer 30 from drying and leaving water marks that are difficult to remove. In one embodiment, the moisturizing device 105 may include one or more of a water supply pipe, a spray unit, and a water mist generating unit.

In one embodiment, the wafer wet processing and cleaning system 10 may further include a drainage device 111 to drain the deionized water provided by the moisturizing device 105 . The drainage device 111 may include one or more of a drainage hole and a water pumping unit. For example, when there is no need for deionized water in the second flipping device 104, the drainage device 111 can drain the deionized water so that the wafer 30 in the wafer loading cassette 20 can proceed to the next process.

In addition, the drainage device 111 may also include a drying unit to dry the second turning device 104 according to process requirements or settings. For example, if the wafers 30 do not need to be transferred to the single wafer processing device 106 for subsequent cleaning processing, and have been cleaned and dried, they can be transferred to the dry second flipping device 104 or transferred to The first flipping device 101 flips the wafer to transfer it to the wafer loading and unloading area 109 .

For the above-mentioned wafer 30 with a complex structure, for the subsequent cleaning and drying process, after the wafer 30 in the wafer cassette 20 is turned over by the second flipping device 104, the wafer 30 in the wafer cassette 20 can be placed on a single wafer. Processing device 106. In one embodiment, the wafer wet processing and cleaning system 10 may further include a second horizontal transfer device 108 . After the second flipping device 104 flips the wafer loading cassette 20 90 degrees along the second direction, the second horizontal conveying device 108 takes the horizontal wafer 30 from the wafer loading and unloading area 109 to the single wafer processing device 106 .

To further explain, as shown in FIG. 3 , in one embodiment, the first horizontal conveying device 107 and the second horizontal conveying device 108 may be a dual finger (Dual Finger) robotic arm. In addition, the first horizontal conveying device 107 and the second horizontal conveying device 108 can be integrated into the same device to save space, but are not limited to this. For example, in other embodiments, the first horizontal conveying device 107 and the second horizontal conveying device 108 can also be provided separately, so that the first horizontal conveying device 107 is independent of the second horizontal conveying device 108 .

As shown in FIG. 6 , the second horizontal conveying device 108 may include a second telescopic arm 1081 and a second receiving portion 1082 . The second receiving part 1082 has elements that can attract or clamp the wafer 30 , such as clamping claws, suction cups, air extraction holes, etc., to clamp or attract the wafer 30 . In one embodiment, the second horizontal transfer device 108 takes the wafer 30 in a horizontal state from the wafer loading cassette 20 of the second flipping device 104 of the wafer 30 wet processing and cleaning system 10 to single wafer processing. Device 106. But it is not limited to this. Under appropriate configuration, for example, when the cleanliness and dryness of the first horizontal transfer device 107 are ensured, the first horizontal transfer device 107 can also take the wafer 30 in a horizontal state to a single unit. wafer processing device 106, and the second horizontal transfer device 108 is omitted.

In one embodiment, when taking out the wafer 30 from the second flipping device 104, the operation process may be as follows. First, the second flipping device 104 and the first flipping device 101 have substantially the same structure and components. Please refer to the relevant FIG. 4A, FIG. 4B and the above description, and will not be repeated here. After the crystal-carrying cassette 20 is turned over, the crystal-carrying cassette 20 is turned from a vertical state to a horizontal state, and then the limiting power unit 1014 (pneumatic cylinder) is used to push the driving element 1017 (pushing element) against the crystal-carrying cassette. The limiting members 1015 on both sides of 20 are then moved away from the wafer 30. At this time, the limiting member 1015 returns to the release position so that the wafer 30 is no longer restrained. Then, the second horizontal transfer device 108 is used to take out the wafer 30 in the wafer loading cassette 20 and transfer the wafer 30 in a horizontal state to the single wafer processing device 106 .

In one embodiment, as shown in FIG. 8 , the single wafer processing device 106 may include a rotating stage 1061, a liquid supply device 1062, and a rotating shaft 1063. The rotating stage 1061 is used to place the wafer 30 , and the liquid supply device 1062 is disposed above the rotating stage 1061 and is used to apply at least one processing liquid to the wafer 30 . In one embodiment, the processing liquid may include deionized water, etching liquid or other chemicals to further clean the wafer 30 or perform other processes.

After cleaning is completed, the rotating shaft 1063 can be used to drive the rotating stage 1061 so that the wafer 30 placed on the rotating stage 1061 rotates at a high speed. The wafer 30 after high-speed spinning can be transferred to the wafer loading and unloading area 109 by a horizontal single-wafer robot, such as the first horizontal transfer device 107, the second horizontal transfer device 108, or other similar transfer devices.

To sum up, the wafer wet processing and cleaning method of this invention may include the following steps:

Take at least one wafer 30 to the wafer loading cassette 20 provided in the first flipping device 101, for example, use the first horizontal transfer device 107 to take the wafer 30 from the wafer loading and unloading area 109 of the wet processing and cleaning system 10 The wafer 30 in a horizontal state is moved to the wafer loading cassette 20;

Use the first flipping device 101 to flip the crystal-carrying cassette 20 90 degrees along the first direction;

The transfer device 102 is used to receive and move the wafer-carrying cassette 20 to the top of the wet processing tank 103. A plurality of process liquids are respectively arranged in the plurality of wet processing tanks 103. In addition, different process liquids are respectively arranged in different wet processing tanks 103. ;

The transfer device 102 is used to immerse the wafers 30 carried in the wafer-carrying cassette 20 into a plurality of wet processing tanks 103 in sequence;

The transfer device 102 can be used to selectively move the crystal-carrying cassette 20 to the second turning device 104;

Use the second flipping device 104 to flip the crystal-carrying cassette 20 90 degrees in a second direction opposite to the first direction;

Utilize the moisturizing device 105 provided on the second flipping device 104 to provide moisturizing liquid to the second flipping device 104, so that the wafer 30 is kept in a moist state; and

The wafer 30 in the wafer loading cassette 20 flipped by the second flipping device 104 is placed in the single wafer processing device 106 .

After the single wafer processing device 106 has cleaned the wafer 30, the rotating shaft 1063 can be used to drive the rotating stage 1061, so that the wafer 30 placed on the rotating stage 1061 rotates at a high speed. The wafer 30 after high-speed spinning can be transferred to the wafer loading and unloading area 109 by a horizontal single-wafer robot, such as the first horizontal transfer device 107, the second horizontal transfer device 108, or other similar transfer devices.

To further explain, the wafer wet processing and cleaning system 10 of the present invention can process wafers 30 with various cleaning requirements. For example, for wafers 30 suitable for batch processing, these wafers 30 can only be soaked in the wet processing tank 103, and depending on the situation, whether to be transferred to the drying tank 110 or to use the desiccant in the wet processing tank 103. Drying is carried out. After the drying is completed, the first flipping device 101 or the second flipping device 104 can flip the wafer back to the horizontal state in the dry state and transfer it to the wafer loading and unloading area 109 for subsequent processes.

For wafers 30 with complex surface structures, such as wafers for three-dimensional integrated circuit (3D-IC) packaging, the single wafer processing device 106 is suitable for subsequent cleaning and drying. In other words, , the transfer device 102 can transfer the wafer loading cassette 20 loaded with the wafer 30 to an appropriate location for processing at an appropriate time according to the required process of the wafer 30 .

In this case, since the wet bench equipment (including the transfer device 102, the wet processing tank 103, etc.), the single wafer processing device 106, and the wafer-carrying cassette turning device are integrated with each other, it is necessary to The wafers processed by the single wafer processing device 106 can be processed and cleaned in the wafer wet processing and cleaning 10, which can increase the manufacturing efficiency of the product.

In addition, this creation provides a wafer wet processing and cleaning system and method, which can prevent the deionized water from failing to completely clean and remove wafer particles, or the wafer is not dry, resulting in water marks remaining. Therefore, after the wafers undergo batch immersion etching or tank cleaning processes, the advantages of the single-wafer processing device can be used for subsequent processing, such as spraying deionized water to clean the wafer surface, high-speed rotation and drying of the wafers, etc. Therefore, the problem that the wafers with complex structures cannot be effectively cleaned and dried using the Quick Dump Rinse (QDR) tank and the IPA tank drying is solved.

The above is only illustrative and not restrictive. Any equivalent modifications or changes that do not depart from the spirit and scope of this creation shall be included in the appended patent application scope.

10: Wafer wet processing and cleaning system 101:First flipping device 1011:Pedestal 1012: Support frame 1013: Flip rack 1014: Flip power unit 1015:Limiting member 1016:Limit power unit 1017: Drive components 102:Transmission device 1021: Carrying mechanism 1022: Translation mechanism 1023:Lifting mechanism 103: Wet treatment tank 104: Second flipping device 105:Moisturizing device 106:Single wafer processing equipment 1061: Rotary table 1062:Liquid supply device 1063:Shaft 107: First horizontal conveyor 1071:First telescopic arm 1072:The first undertaking department 108: Second horizontal conveyor 1081:Second telescopic arm 1082:Second Undertaking Department 109: Wafer entry and exit area 110:Drying tank 111: Drainage device 20:Crystal cassette 201:Crystal cassette slot 30:wafer 40:3D-IC wafer 41:Surface structure 42:Residue

Figure 1 is a schematic diagram of a 3D-IC wafer after cleaning in the conventional technology.

FIG. 2 is a schematic diagram of a wafer wet processing and cleaning system according to an embodiment of the present invention.

Figure 3 is a schematic diagram of a horizontal conveying device according to an embodiment of the present invention.

Figure 4A is a first schematic diagram of a flipping device according to an embodiment of the invention.

Figure 4B is a second schematic diagram of a flipping device according to an embodiment of the present invention.

Figure 5 is a schematic diagram of a transmission device according to an embodiment of the present invention.

FIG. 6 is a schematic diagram of the implementation of a wafer wet processing and cleaning system according to an embodiment of the present invention.

Figure 7 is a second schematic diagram of a flipping device according to an embodiment of the present invention.

FIG. 8 is a schematic diagram of a single wafer processing apparatus according to an embodiment of the present invention.

10: Wafer wet processing and cleaning system

101:First flipping device

102:Transmission device

103: Wet treatment tank

104: Second flipping device

106:Single wafer processing equipment

107: First horizontal conveyor

108: Second horizontal conveyor

109: Wafer entry and exit area

Claims (10)

A wafer wet processing and cleaning system, including: A first flipping device used to flip a crystal-carrying cassette 90 degrees along a first direction; a transmission device for receiving and moving the crystal-carrying cassette; A plurality of wet processing tanks, a plurality of process liquids are respectively provided in the plurality of wet processing tanks, and the transfer device immerses at least one wafer carried by the wafer carrying cassette into the plurality of wet processing tanks in sequence; A second flipping device, wherein the transfer device can selectively move the crystal-carrying cassette to the second flipping device, and the second flipping device moves the crystal-carrying cassette in a second direction opposite to the first direction. The box is turned 90 degrees; A moisturizing device is provided on the second flipping device to provide a moisturizing liquid to the second flipping device; and At least one single wafer processing device, wherein the wafer in the wafer loading cassette flipped by the second flipping device is placed in the single wafer processing device. The wafer wet processing and cleaning system as described in claim 1, wherein the transfer device includes: a carrying mechanism for receiving and carrying the crystal-carrying cassette; A translation mechanism is connected to the carrying mechanism and used to drive the carrying mechanism to move in a horizontal direction; and A lifting mechanism is connected to the translation mechanism and used to drive the carrying mechanism to move in a vertical direction. The wafer wet processing and cleaning system as claimed in claim 1 further includes a first horizontal transfer device, which is taken from a wafer entry and exit area of the wafer wet processing and cleaning system. The wafer in a horizontal state is placed in the wafer loading cassette. The wafer wet processing and cleaning system as described in claim 3 further includes a second horizontal conveying device. After the second flipping device flips the wafer-carrying cassette 90 degrees along the second direction, the second The horizontal transfer device takes the wafer in the horizontal state from the wafer loading cassette to the single wafer processing device. The wafer wet processing and cleaning system as described in claim 1, wherein the single wafer processing device includes: a rotating stage for placing the wafer; and A liquid supply device is disposed above the rotating stage and is used to apply at least one processing liquid to the wafer. The wafer wet processing and cleaning system of claim 5, wherein the processing liquid includes deionized water or etching liquid. The wafer wet processing and cleaning system of claim 1, wherein the plurality of process liquids include one or more of etching liquid, desiccant, and deionized water. The wafer wet processing and cleaning system as claimed in claim 7, wherein different process liquids are respectively disposed in different wet processing tanks. The wafer wet processing and cleaning system of claim 1 further includes at least one drying tank, and the wafer-carrying cassette can be selectively transferred to the drying tank by the transfer device. A wafer wet processing and cleaning system, including: A first flipping device used to flip a crystal-carrying cassette 90 degrees along a first direction; a transmission device for receiving and moving the crystal-carrying cassette; A plurality of wet processing tanks, a plurality of process liquids are respectively arranged in the plurality of wet processing tanks, and the transfer device immerses at least one wafer carried by the wafer carrying cassette into the plurality of wet processing tanks in sequence; A second flipping device, wherein the transfer device can selectively move the crystal-carrying cassette to the second flipping device, and the second flipping device moves the crystal-carrying cassette in a second direction opposite to the first direction. The box is turned 90 degrees; and At least one single wafer processing device, wherein the wafer in the wafer loading cassette flipped by the second flipping device is placed in the single wafer processing device.