CN112629124A - System and method for regulating and controlling temperature of mechanical rheological polishing liquid - Google Patents
System and method for regulating and controlling temperature of mechanical rheological polishing liquid Download PDFInfo
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- CN112629124A CN112629124A CN202011469499.2A CN202011469499A CN112629124A CN 112629124 A CN112629124 A CN 112629124A CN 202011469499 A CN202011469499 A CN 202011469499A CN 112629124 A CN112629124 A CN 112629124A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/005—Mounting of control devices
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- General Engineering & Computer Science (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The system for regulating and controlling the temperature of the mechanical rheological polishing liquid comprises a polishing groove, wherein the polishing groove at least comprises a groove bottom and a groove outer ring; the inside of the groove bottom is hollow to form a fluid cavity A, and the inside of the outer ring of the groove is hollow to form a fluid cavity B; the circulating water outlet A and the circulating water outlet B are communicated with an inlet of the circulating temperature adjusting device through pipelines, and correspondingly, the circulating water inlet A and the circulating water inlet B are communicated with an outlet of the circulating temperature adjusting device through pipelines, so that a circulating loop is formed; the circulating loop is provided with a liquid heat exchange medium, and the circulating temperature adjusting device can make the liquid heat exchange medium in the circulating loop circularly flow and exchange heat with an external heat exchange medium when flowing through the circulating temperature adjusting device. The system can regulate and control the temperature of the polishing solution in the polishing tank in the polishing process, so that the temperature of the polishing solution is maintained within the range meeting the process requirements. Correspondingly, the application also provides a method for regulating and controlling the temperature of the mechanical rheological polishing liquid.
Description
Technical Field
The application relates to a mechanical rheological polishing technology, in particular to a mechanical rheological polishing liquid temperature regulating and controlling system and method capable of controlling the temperature of polishing liquid during mechanical rheological polishing processing.
Background
Polishing is always an important technical means for achieving smooth surface, good integrity and even no damage of a workpiece in the field of ultra-precision machining. The mechanical rheological polishing is an ultra-precision processing technology suitable for polishing and processing complex curved surfaces. When the mechanical rheological polishing processing is adopted, the contact part of the mechanical rheological polishing liquid (non-Newtonian fluid) and a workpiece generates a shear thickening effect due to the shearing force, the viscosity of the polishing liquid in the contact area is increased, the holding force for abrasive particles is increased, and the abrasive particles with the polishing effect in the polishing liquid generate a cutting effect or a chemical mechanical effect on the surface of the workpiece to remove the surface material of the workpiece, so that the polishing of the surface of the workpiece is realized.
However, in the process of mechanical rheological polishing, as the polishing process continues, the temperature of the polishing solution gradually increases due to the relative movement between the polishing solution and the workpiece, and the shear thickening performance of the polishing solution decreases as the temperature of the polishing solution increases, so that the polishing efficiency becomes lower and the polishing effect becomes worse. At present, no good cooling technology exists for the problem of temperature rise of the polishing liquid, and the temperature of the polishing liquid can not rise to the temperature which affects the shear thickening performance by adjusting the polishing time of a single polishing. In addition, when the mechanical polishing process is performed by using the mechanical rheological polishing technology, the polishing solution needs to be kept within a specific temperature range to exert better chemical activity and obtain better efficiency, but no suitable technology is available at present to control the temperature of the polishing solution in the polishing process.
Disclosure of Invention
Aiming at the defects of the prior art, the application provides a system for regulating and controlling the temperature of the polishing liquid in a polishing tank in the polishing process, so that the temperature of the polishing liquid is kept in a range meeting the process requirements. Correspondingly, the application also provides a method for regulating and controlling the temperature of the mechanical rheological polishing liquid.
For the regulation and control system, the following technical scheme is provided in the application:
the system for regulating and controlling the temperature of the mechanical rheological polishing liquid comprises a polishing groove, wherein the polishing groove at least comprises a groove bottom and a groove outer ring; the interior of the tank bottom is hollow to form a fluid cavity A, a separation strip A is arranged in the fluid cavity A, and a circulating water inlet A and a circulating water outlet A which are communicated with the outside are respectively arranged on two sides of the separation strip A; the inner part of the groove outer ring is hollow to form a B fluid cavity, a B separation strip is arranged in the B fluid cavity, and a B circulating water inlet and a B circulating water outlet which are communicated with the outside are respectively arranged on two sides of the B separation strip; the circulating water outlet A and the circulating water outlet B are communicated with an inlet of the circulating temperature adjusting device through pipelines, and correspondingly, the circulating water inlet A and the circulating water inlet B are communicated with an outlet of the circulating temperature adjusting device through pipelines, so that a circulating loop is formed; the circulating loop is provided with a liquid heat exchange medium, and the circulating temperature adjusting device can make the liquid heat exchange medium in the circulating loop circularly flow and exchange heat with an external heat exchange medium when flowing through the circulating temperature adjusting device.
Therefore, during polishing, the liquid heat exchange medium can circularly flow under the action of the circulating temperature adjusting device, the temperature of the liquid heat exchange medium is maintained within a certain range by carrying out heat exchange with an external heat exchange medium when the liquid heat exchange medium flows through the circulating temperature adjusting device, and when the temperature difference exists between the polishing liquid in the polishing tank and the liquid heat exchange medium in the polishing tank, the polishing liquid and the liquid heat exchange medium carry out heat exchange, so that the temperature of the polishing liquid is maintained within a process requirement range.
As optimization, in the system for regulating and controlling the temperature of the rheopectic polishing solution, a group of external drainage strips a and a group of internal drainage strips a are arranged in the fluid cavity a along the circumferential direction; the outer end of the A outer drainage strip is abutted against the outer side wall of the A fluid cavity, and a gap is reserved between the inner end of the A outer drainage strip and the inner side wall of the A fluid cavity; the inner end of the inner drainage strip A is abutted against the inner side wall of the fluid cavity A, and a gap is reserved between the outer end of the inner drainage strip A and the outer side wall of the fluid cavity A; the A outer drainage strips and the A inner drainage strips are alternately arranged to form an A snake-shaped flow passage. Therefore, the liquid heat exchange medium flows in the A fluid cavity along the A snake-shaped flow channel formed by the A outer drainage strip and the A inner drainage strip, the flow path is long, and the heat exchange efficiency is high.
As optimization, in the system for regulating and controlling the temperature of the rheo-polishing liquid, a group of upper drainage strips B and a group of lower drainage strips B are arranged in the fluid cavity B along the circumferential direction; the upper end of the upper drainage strip B is abutted against the upper side wall of the fluid cavity B, and a gap is reserved between the lower end of the upper drainage strip B and the lower side wall of the fluid cavity B; the lower end of the lower drainage strip B is abutted against the lower side wall of the fluid cavity B, and a gap is reserved between the upper end of the lower drainage strip B and the upper side wall of the fluid cavity B; and the upper drainage strips B and the lower drainage strips B are alternately arranged to form a snake-shaped flow passage B. In a similar way, by adopting the design, the liquid heat exchange medium flows along the B snakelike flow channel formed by the B upper drainage strip and the B lower drainage strip in the B fluid cavity, the flow path is long, and the heat exchange efficiency is high.
Preferably, in the system for regulating and controlling a temperature of a rheologically-polished liquid, the polishing tank further includes a tank inner ring disposed inside the tank outer ring. Furthermore, the inner part of the groove inner ring is hollow to form a C fluid cavity, a C separation strip is arranged in the C fluid cavity, and a C circulating water inlet and a C circulating water outlet which are communicated with the outside are respectively arranged on two sides of the C separation strip; and the circulating water inlet C and the circulating water outlet C are respectively communicated with the outlet and the inlet of the circulating temperature adjusting device through pipelines. Therefore, the heat exchange efficiency between the liquid heat exchange medium and the polishing liquid can be improved by the heat exchange between the liquid heat exchange medium flowing through the inner ring of the groove and the polishing liquid. Furthermore, a group of C upper drainage strips and a group of C lower drainage strips are correspondingly arranged in the fluid cavity C along the circumferential direction; the upper end of the upper drainage strip C is abutted against the upper side wall of the fluid cavity C, and a gap is reserved between the lower end of the upper drainage strip C and the lower side wall of the fluid cavity C; the lower end of the lower drainage strip C is abutted against the lower side wall of the fluid cavity C, and a gap is reserved between the upper end of the lower drainage strip C and the upper side wall of the fluid cavity C; and the C upper drainage strips and the C lower drainage strips are alternately arranged to form a C snake-shaped flow channel. Therefore, the liquid heat exchange medium flows in the C fluid cavity along the C snake-shaped flow channel formed by the C upper drainage strip and the C lower drainage strip, the flow path is long, and the heat exchange efficiency is high.
Preferably, in the aforementioned system for regulating the temperature of the rheo-rheological polishing liquid, the circulating temperature regulating device includes a pump, and a heat exchanging device connected to the pump. The circulating temperature adjusting device adopts the structure, is easy to implement and is beneficial to popularization. Furthermore, a pipeline connected with the inlet of the circulating temperature adjusting device is provided with a temperature sensor, and the temperature sensor is electrically connected with the pump through a temperature feedback control element. Therefore, the rotating speed of the pump can be controlled according to the temperature value detected by the temperature sensor, the flow of the liquid heat exchange medium is regulated, and the pump is operated at a lower rotating speed when the temperature of the liquid heat exchange medium flowing out of the polishing groove is within a set range, so that the energy consumption is reduced; when the temperature of the liquid heat exchange medium flowing out of the polishing groove exceeds a certain set value, the pump is controlled to operate at a high rotating speed, the flow of the liquid heat exchange medium is accelerated, and therefore the heat exchange with the polishing liquid is accelerated.
Preferably, in the system for regulating the temperature of the rheo-polishing liquid, the outer surface of the polishing tank is covered with a heat insulating material. The external surface of the polishing groove is covered by the heat insulation material, so that heat exchange between the heat exchange medium and the air around the polishing groove is prevented, and the heat insulation effect on the liquid heat exchange medium is realized, so that the heat exchange efficiency between the liquid heat exchange medium and the polishing solution is higher.
For the regulation and control method, the application provides the following technical scheme:
the method adopts the system for regulating and controlling the temperature of the mechanical rheological polishing liquid to cool the temperature of the mechanical rheological polishing liquid in the polishing process; during polishing, the pump works to enable the liquid heat exchange medium to circularly flow in the circulating loop, when the liquid heat exchange medium flowing to the inside of the polishing tank and the rheologic polishing solution in the polishing tank have temperature difference, the liquid heat exchange medium and the rheologic polishing solution exchange heat to enable the rheologic polishing solution to be cooled, and when the liquid heat exchange medium after exchanging heat with the rheologic polishing solution flows through the heat exchange device, the heat absorbed by the rheologic polishing solution is dissipated in the heat exchange device through heat exchange with the external heat exchange medium; the dynamic rheological polishing liquid in the polishing tank is maintained in a temperature range meeting the technological requirements by continuously operating the circulating temperature adjusting device.
By using the regulation and control method, the liquid heat exchange medium circularly flows under the action of the circulating temperature regulation device during polishing, and maintains the temperature through heat exchange with an external heat exchange medium when flowing through the circulating temperature regulation device, and when the temperature difference exists between the polishing solution in the polishing tank and the liquid heat exchange medium in the polishing tank, the polishing solution and the liquid heat exchange medium exchange heat, so that the temperature of the polishing solution is maintained within the process requirement range.
In summary, compared with the prior art, according to the above scheme of the application, the fluid cavity with the specific structure is arranged in the polishing tank, the inlet and the outlet of the fluid cavity are respectively connected with the outlet and the inlet of the circulation temperature adjusting device through pipelines, so as to form a circulation loop, the circulation temperature adjusting device enables the liquid heat exchange medium in the circulation loop to circularly flow in the circulation loop, and heat exchange is carried out to maintain the temperature when the liquid heat exchange medium flows through the circulation temperature adjusting device, when the temperature difference exists between the polishing liquid in the polishing tank and the liquid heat exchange medium in the fluid cavity in the polishing tank, heat exchange is carried out with the liquid heat exchange medium, so that the temperature of the polishing liquid is prevented from exceeding the process requirement range, the temperature control of the polishing liquid in the polishing process is realized.
Description of the drawings:
FIG. 1 is a schematic diagram of the configuration of a system for modulating the temperature of a rheo-polishing fluid according to the present application;
FIG. 2 is a perspective view of a polishing receptacle in an embodiment of the present application;
FIG. 3 is a perspective view of the polishing receptacle of FIG. 2 from another perspective;
FIG. 4 is a side projection view of a polishing receptacle in an embodiment of the present application;
FIG. 5 is a bottom view of a polishing receptacle in an embodiment of the present application;
FIG. 6 is a sectional view of the polishing receptacle of FIG. 5 taken along the line A;
FIG. 7 is a sectional view of the polishing receptacle of FIG. 5 taken along line B;
FIG. 8 is a perspective view (with the outer layer removed) of the internal structure of a polishing receptacle in an example of the present application;
FIG. 9 is a perspective view of another perspective of the internal structure of the polishing receptacle of FIG. 8;
fig. 10 is a perspective view of another perspective of the internal structure of the polishing receptacle of fig. 8.
In the drawings, the reference numbers: 1-polishing groove, 101-groove bottom, 1011-A fluid cavity, 1012-A division strip, 1013-A circulating water inlet, 1014-A circulating water outlet, 1015-A external drainage strip, 1016-A internal drainage strip, 102-groove external ring, 1021-B fluid cavity, 1022-B division strip, 1023-B circulating water inlet, 1024-B circulating water outlet, 1025-B upper drainage strip, 1026-B lower drainage strip, 103-groove external ring, 1031-C fluid cavity, 1032-C division strip, 1033-C circulating water inlet, 1034-C circulating water outlet, 1035-C upper drainage strip and 1036-C lower drainage strip; 2-a pump; 3-heat exchange means; 4-a temperature sensor; 5-temperature feedback control element.
Detailed Description
The invention according to the present application will be further described with reference to the drawings and the detailed description (examples), but the invention is not limited thereto.
Example 1 (see fig. 1-10):
the system for regulating and controlling the temperature of the rheologically-polished liquid comprises a polishing tank 1, wherein the polishing tank 1 comprises a tank bottom 101 and a tank outer ring 102; the interior of the tank bottom 101 is hollow to form an A fluid cavity 1011, an A separating strip 1012 is arranged in the A fluid cavity 1011, and a circulating water inlet 1013 and a circulating water outlet 1014 which are communicated with the outside are respectively arranged on two sides of the A separating strip 1012; the inside of the groove outer ring 102 is hollow to form a B fluid cavity 1021, a B separation strip 1022 is arranged in the B fluid cavity 1021, and a B circulating water inlet 1023 and a B circulating water outlet 1024 which are communicated with the outside are respectively arranged on two sides of the B separation strip 1022; the circulating water outlet A1014 and the circulating water outlet B1024 are communicated with the inlet of the circulating temperature adjusting device through pipelines, and correspondingly, the circulating water inlet A1013 and the circulating water inlet B1023 are communicated with the outlet of the circulating temperature adjusting device through pipelines, so that a circulating loop is formed; the circulating loop is provided with a liquid heat exchange medium, and the circulating temperature adjusting device can make the liquid heat exchange medium in the circulating loop circularly flow and exchange heat with an external heat exchange medium when flowing through the circulating temperature adjusting device.
In this embodiment, a group of a external drainage strips 1015 and a group of a internal drainage strips 1016 are correspondingly arranged in the a fluid cavity 1011 along the circumferential direction; the outer end of the A outer drainage strip 1015 abuts against the outer side wall of the A fluid cavity 1011, and a gap is reserved between the inner end of the A outer drainage strip and the inner side wall of the A fluid cavity 1011; the inner end of the A inner drainage strip 1016 abuts against the inner side wall of the A fluid cavity 1011, and a gap is reserved between the outer end of the A inner drainage strip and the outer side wall of the A fluid cavity 1011; the A outer drainage strips 1015 and the A inner drainage strips 1016 are alternately arranged to form an A serpentine flow channel.
In this embodiment, a group of B upper drainage strips 1025 and a group of B lower drainage strips 1026 are correspondingly arranged in the B fluid cavity 1021 along the circumferential direction; the upper end of the B upper drainage strip 1025 abuts against the upper side wall of the B fluid cavity 1021, and a gap is reserved between the lower end of the B upper drainage strip 1025 and the lower side wall of the B fluid cavity 1021; the lower end of the B lower drainage strip 1026 is abutted against the lower side wall of the B fluid cavity 1021, and a gap is reserved between the upper end of the B lower drainage strip and the upper side wall of the B fluid cavity 1021; the B upper drainage strips 1025 and the B lower drainage strips 1026 are alternately arranged to form a B snake-shaped flow passage.
In this embodiment, the polishing groove 1 further includes a groove inner ring 103 disposed inside the groove outer ring 102. The inner part of the groove inner ring 103 is hollow to form a C fluid chamber 1031, a C separating strip 1032 is arranged in the C fluid chamber 1031, and a C circulating water inlet 1033 and a C circulating water outlet 1034 which are communicated with the outside are respectively arranged on two sides of the C separating strip 1032; the C circulating water inlet 1033 and the C circulating water outlet 1034 are respectively communicated with an outlet and an inlet of the circulating temperature adjusting device through pipelines. A group of C upper drainage strips 1035 and a group of C lower drainage strips 1036 are correspondingly arranged in the C fluid cavity 1031 along the circumferential direction; the upper end of the C upper drainage strip 1035 abuts against the upper side wall of the C fluid chamber 1031, and a gap is reserved between the lower end of the C upper drainage strip 1035 and the lower side wall of the C fluid chamber 1031; the lower end of the C lower drainage strip 1036 abuts against the lower side wall of the C fluid chamber 1031, and a gap is reserved between the upper end of the C lower drainage strip 1036 and the upper side wall of the C fluid chamber 1031; the C upper drainage strips 1035 and the C lower drainage strips 1036 are alternately arranged to form a C serpentine channel.
In this embodiment, the groove bottom 101, the outer groove ring 102 and the inner groove ring 103 are all of a double-layer structure, the outer layer is fixed by screws, and the joint between the inner layer and the outer layer is sealed (when in operation, the inner layer is in contact with polishing liquid). The gap between the two layers is the fluid cavity, which is obtained by the design of two layers, thus the method is easy to implement and has low manufacturing cost.
In the present embodiment, the circulation temperature adjusting device is composed of a pump 2 and a heat exchange device 3 connected with the pump 2. The heat exchanger 3 is an air-water cooler, and the liquid heat exchange medium flows into the heat exchanger 3 and exchanges heat with air (external heat exchange medium) flowing through the heat exchanger 3, so that the liquid heat exchange medium in the circulation circuit can be maintained at a temperature close to room temperature, and the polishing liquid in the polishing tank can be maintained at a temperature close to room temperature.
In this embodiment, the outer surface of the polishing tank 1 is covered with a heat insulating material.
In this embodiment, the liquid heat exchange medium is water (water is easily available and is pollution-free, and is a preferred liquid heat exchange medium for implementing the present invention).
The system for regulating and controlling the temperature of the mechanical rheological polishing liquid can cool the mechanical rheological polishing liquid in polishing processing; during polishing, the pump 2 works to make the liquid heat exchange medium circularly flow in the circulating loop, when the liquid heat exchange medium flowing to the inside of the polishing tank 1 and the rheo-mechanical polishing solution in the polishing tank 1 have a temperature difference, the liquid heat exchange medium and the rheo-mechanical polishing solution exchange heat to cool the rheo-mechanical polishing solution, and when the liquid heat exchange medium after exchanging heat with the rheo-mechanical polishing solution flows through the heat exchange device 3, the liquid heat exchange medium exchanges heat with an external heat exchange medium (normal temperature air sent into the heat exchange device 3) in the heat exchange device 3 to dissipate heat absorbed by the rheo-mechanical polishing solution; through the continuous operation of the circulating temperature adjusting device, the temperature of the mechanical rheological polishing solution in the polishing tank 1 can be kept close to the room temperature, and the continuous temperature rise of the polishing solution in the polishing process is avoided.
Example 2 (see fig. 1-10):
different from the embodiment 1, in the embodiment, a temperature sensor 4 is arranged on a pipeline connected with an inlet of the circulating temperature adjusting device, and the temperature sensor 4 is electrically connected with the pump 2 through a temperature feedback control element 5. During polishing, the temperature sensor 4 detects the temperature of the liquid heat exchange medium flowing out of the fluid cavity in the polishing groove 1 in real time, and the temperature feedback control element 5 adjusts the rotating speed of the pump 2 according to the temperature value detected by the temperature sensor 4.
The system for regulating and controlling the temperature of the rheo-polishing liquid of the embodiment can maintain the rheo-polishing liquid in a set range during polishing. In operation, air (external heat exchange medium) at a temperature T ℃ is introduced into the heat exchange device 3 so that the temperature of the polishing liquid in the polishing tank 1 can be maintained around T ℃. The temperature sensor 4 detects the temperature of the liquid heat exchange medium flowing out of the fluid cavity in the polishing groove 1 in real time, when the temperature of the liquid heat exchange medium rises to a set high value, the temperature feedback control element 5 controls the pump 2 to increase the rotating speed, so that the flow of the liquid heat exchange medium is increased, the heat exchange is accelerated, after the temperature is detected to fall to a set low value, the temperature feedback control element 5 controls the pump 2 to operate at a lower rotating speed, the energy consumption is reduced, and the energy conservation and emission reduction are realized.
As a specific application case of the control system of example 2, in this case, the process requires the temperature of the polishing liquid to be controlled at 25. + -. 3 ℃. The temperature of the external heat exchange medium is set to 20 ℃ (in this case, the room temperature is controlled to be 20 ℃ by using an air conditioner, and actually, an inlet of the external heat exchange medium on the heat exchange device 3 can also be connected with an outlet of the air conditioning equipment through a pipeline), during polishing, the temperature sensor 4 detects the temperature of the liquid heat exchange medium flowing out of a fluid cavity inside the polishing tank 1 in real time, when the temperature sensor 4 detects that the temperature rises to 27.5 ℃, the temperature feedback control element 5 controls the pump 2 to increase the rotating speed, the flowing of the liquid heat exchange medium is accelerated, the heat exchange is accelerated, and after the temperature sensor 4 detects that the temperature drops to 22 ℃, the temperature feedback control element 5 controls the pump 2 to operate at a lower rotating speed. In the above case, the temperature of the slurry is maintained within the range of 25 + -3 deg.C required for the polishing process.
The above general description of the invention and the description of the specific embodiments thereof referred to in this application should not be construed as limiting the technical solutions of the invention.
It should be noted that, in the present application, the form of the heat exchanging device 3 is not limited to the air-water cooler in the above-described embodiment, and the external heat exchanging medium is not limited to air (or liquid), as long as the liquid heat exchanging medium can exchange heat with the external heat exchanging medium in the heat exchanging device 3, and the temperature of the liquid heat exchanging medium can be maintained within a required range. In the practice of the present invention, the heat exchange unit 3 may be made by itself or may be purchased in the appropriate size from the market.
In the above embodiments, the temperature control system of the present invention is used to cool the polishing liquid, but the temperature control system of the present invention is not limited to this application, and the temperature control system of the present invention may also be used to keep the temperature of the polishing liquid working in a low temperature environment, so as to prevent the polishing liquid from being affected by low temperature.
Those skilled in the art can add, reduce or combine the technical features disclosed in the general description and/or the embodiments to form other technical solutions within the protection scope of the present application without departing from the present disclosure.
Claims (10)
1. A system for regulating and controlling the temperature of mechanical rheological polishing liquid is characterized in that: the polishing device comprises a polishing groove (1), wherein the polishing groove (1) at least comprises a groove bottom (101) and a groove outer ring (102);
the interior of the tank bottom (101) is hollow to form an A fluid cavity (1011), an A separation strip (1012) is arranged in the A fluid cavity (1011), and a circulating water inlet (1013) and a circulating water outlet (1014) which are communicated with the outside are respectively arranged on two sides of the A separation strip (1012); the interior of the groove outer ring (102) is hollow to form a B fluid cavity (1021), a B separating strip (1022) is arranged in the B fluid cavity (1021), and a B circulating water inlet (1023) and a B circulating water outlet (1024) which are communicated with the outside are respectively arranged on two sides of the B separating strip (1022);
the circulating water outlet A (1014) and the circulating water outlet B (1024) are communicated with an inlet of the circulating temperature adjusting device through pipelines, and correspondingly, the circulating water inlet A (1013) and the circulating water inlet B (1023) are communicated with an outlet of the circulating temperature adjusting device through pipelines, so that a circulating loop is formed; the circulating loop is provided with a liquid heat exchange medium, and the circulating temperature adjusting device can make the liquid heat exchange medium in the circulating loop circularly flow and exchange heat with an external heat exchange medium when flowing through the circulating temperature adjusting device.
2. The system for modulating the temperature of a rheo-rheological polishing fluid of claim 1, wherein: a group of A external drainage strips (1015) and a group of A internal drainage strips (1016) are correspondingly arranged in the A fluid cavity (1011) along the circumferential direction; the outer end of the A outer drainage strip (1015) is abutted against the outer side wall of the A fluid cavity (1011), and a gap is reserved between the inner end of the A outer drainage strip and the inner side wall of the A fluid cavity (1011); the inner end of the A inner drainage strip (1016) is abutted against the inner side wall of the A fluid cavity (1011), and a gap is reserved between the outer end of the A inner drainage strip and the outer side wall of the A fluid cavity (1011); the A outer drainage strips (1015) and the A inner drainage strips (1016) are alternately arranged to form an A snake-shaped flow channel.
3. The system for modulating the temperature of a rheo-rheological polishing fluid of claim 1, wherein: a group of upper drainage strips (1025) and a group of lower drainage strips (1026) are correspondingly arranged in the fluid cavity (1021) along the circumferential direction; the upper end of the upper drainage strip (1025) is propped against the upper side wall of the fluid cavity (1021) and a gap is reserved between the lower end of the upper drainage strip (1025) and the lower side wall of the fluid cavity (1021); the lower end of the B lower drainage strip (1026) is abutted against the lower side wall of the B fluid cavity (1021), and a gap is reserved between the upper end of the B lower drainage strip and the upper side wall of the B fluid cavity (1021); the B upper drainage strips (1025) and the B lower drainage strips (1026) are alternately arranged to form a B snake-shaped flow passage.
4. The system for modulating the temperature of a rheo-rheological polishing fluid of claim 1, wherein: the polishing groove (1) further comprises a groove inner ring (103) arranged on the inner side of the groove outer ring (102).
5. The system for modulating the temperature of a rheo-rheological polishing fluid of claim 4, wherein: the inner part of the groove inner ring (103) is hollow to form a C fluid cavity (1031), a C separating strip (1032) is arranged in the C fluid cavity (1031), and a C circulating water inlet (1033) and a C circulating water outlet (1034) which are communicated with the outside are respectively arranged on two sides of the C separating strip (1032); and the C circulating water inlet (1033) and the C circulating water outlet (1034) are respectively communicated with the outlet and the inlet of the circulating temperature adjusting device through pipelines.
6. The system for modulating the temperature of a rheo-rheological polishing fluid of claim 5, wherein: a group of C upper drainage strips (1035) and a group of C lower drainage strips (1036) are correspondingly arranged in the C fluid cavity (1031) along the circumferential direction; the upper end of the C upper drainage strip (1035) is abutted against the upper side wall of the C fluid cavity (1031), and a gap is reserved between the lower end of the C upper drainage strip and the lower side wall of the C fluid cavity (1031); the lower end of the C lower drainage strip (1036) is abutted against the lower side wall of the C fluid cavity (1031), and a gap is reserved between the upper end of the C lower drainage strip and the upper side wall of the C fluid cavity (1031); the C upper drainage strips (1035) and the C lower drainage strips (1036) are arranged alternately to form a C snake-shaped flow channel.
7. The system for conditioning the temperature of a rheo-polishing fluid of any one of claims 1 to 6, wherein: the circulating temperature adjusting device comprises a pump (2) and a heat exchange device (3) connected with the pump (2).
8. The system for modulating the temperature of a rheo-rheological polishing fluid of claim 7, wherein: and a pipeline connected with the inlet of the circulating temperature adjusting device is provided with a temperature sensor (4), and the temperature sensor (4) is electrically connected with the pump (2) through a temperature feedback control element (5).
9. The system for conditioning the temperature of a rheo-polishing fluid of any one of claims 1 to 6, wherein: the outer surface of the polishing groove (1) is covered by a heat-insulating material.
10. The method for regulating and controlling the mechanical rheological polishing solution is characterized by comprising the following steps: the method utilizes the system for regulating and controlling the temperature of the mechanical rheological polishing liquid of claim 7 to cool the mechanical rheological polishing liquid in the polishing process; during polishing, the pump (2) works to enable the liquid heat exchange medium to circularly flow in the circulating loop, when the liquid heat exchange medium flowing to the inside of the polishing tank (1) and the rheologic polishing solution in the polishing tank (1) have temperature difference, the liquid heat exchange medium and the rheologic polishing solution exchange heat to cool the rheologic polishing solution, and when the liquid heat exchange medium after exchanging heat with the rheologic polishing solution flows through the heat exchange device (3), the heat absorbed by the rheologic polishing solution is dissipated in the heat exchange device (3) through exchanging heat with the external heat exchange medium; the dynamic rheological polishing solution in the polishing tank (1) is maintained in a temperature range meeting the process requirement by continuously operating the circulating temperature adjusting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120098455A (en) * | 2011-02-25 | 2012-09-05 | 가부시키가이샤 에바라 세이사꾸쇼 | Polishing apparatus having temperature regulator for polishing pad |
| CN207840983U (en) * | 2018-01-31 | 2018-09-11 | 湖南科技大学 | A kind of efficient ultraprecise shear thickening-chemical cooperated polishing processing device |
| CN109631417A (en) * | 2019-01-04 | 2019-04-16 | 重庆大学 | A kind of photovoltaic and photothermal integral device with nocturnal radiation refrigerating function |
| CN111186045A (en) * | 2020-01-03 | 2020-05-22 | 江苏奥天光学有限公司 | A constant temperature structure for batching bucket |
| CN111644949A (en) * | 2020-06-03 | 2020-09-11 | 大连理工大学 | Polishing device for crankshaft of diesel engine |
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2020
- 2020-12-14 CN CN202011469499.2A patent/CN112629124A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120098455A (en) * | 2011-02-25 | 2012-09-05 | 가부시키가이샤 에바라 세이사꾸쇼 | Polishing apparatus having temperature regulator for polishing pad |
| CN207840983U (en) * | 2018-01-31 | 2018-09-11 | 湖南科技大学 | A kind of efficient ultraprecise shear thickening-chemical cooperated polishing processing device |
| CN109631417A (en) * | 2019-01-04 | 2019-04-16 | 重庆大学 | A kind of photovoltaic and photothermal integral device with nocturnal radiation refrigerating function |
| CN111186045A (en) * | 2020-01-03 | 2020-05-22 | 江苏奥天光学有限公司 | A constant temperature structure for batching bucket |
| CN111644949A (en) * | 2020-06-03 | 2020-09-11 | 大连理工大学 | Polishing device for crankshaft of diesel engine |
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