CN112614874A - Display module and electronic equipment - Google Patents
Display module and electronic equipment Download PDFInfo
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- CN112614874A CN112614874A CN202011470830.2A CN202011470830A CN112614874A CN 112614874 A CN112614874 A CN 112614874A CN 202011470830 A CN202011470830 A CN 202011470830A CN 112614874 A CN112614874 A CN 112614874A
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims description 112
- 239000002184 metal Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000011888 foil Substances 0.000 claims description 17
- 239000002390 adhesive tape Substances 0.000 claims description 13
- 239000010409 thin film Substances 0.000 claims description 4
- 239000011247 coating layer Substances 0.000 claims 2
- 238000010030 laminating Methods 0.000 abstract description 15
- 238000005516 engineering process Methods 0.000 abstract description 11
- 230000005611 electricity Effects 0.000 abstract description 3
- 238000004891 communication Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 16
- 238000005538 encapsulation Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 6
- 229920001621 AMOLED Polymers 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 239000004568 cement Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000007903 penetration ability Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the application provides a display module and electronic equipment, and belongs to the technical field of communication. Display module assembly includes: the packaging layer, the base layer, the luminous circuit, the functional chip, the FPC and the fingerprint module; the base layer comprises a first area and a second area, and the packaging layer covers the first area of the base layer; the light-emitting layer and the light-emitting circuit are arranged between the packaging layer and the base layer and are positioned in the first area of the base layer; a functional chip binding area, an FPC binding area and a fingerprint module area are arranged in the second area of the base layer; the functional chip is arranged in the functional chip binding area, the FPC is arranged in the FPC binding area, and the fingerprint module is arranged in the fingerprint module area; the fingerprint module is connected with FPC electricity. In the embodiment of this application, directly make the fingerprint module in the basic unit, replace the original mode at basic unit back laminating fingerprint module, attenuate display module whole thickness by a wide margin, reduce the laminating technology, reduce the laminating damage to display module, realize fingerprint identification function under the screen.
Description
Technical Field
The embodiment of the application relates to the technical field of communication, in particular to a display module and electronic equipment.
Background
Ultrasonic fingerprint can only be used at present on the stromatolite does not have gapped flexible screen, and the fingerprint need use the double faced adhesive tape to paste at the flexible screen back with solitary module moreover, and technology is loaded down with trivial details, and flexible screen intensity itself is just very poor, and is not withstand voltage, can not local atress, and laminating technology very easily causes the display screen damage, causes outward appearance or functional bad, and the manufacturing degree of difficulty and cost are very high.
Simultaneously, the ultrasonic wave fingerprint module is independent module, and adopts double faced adhesive tape to paste technology, influences the thickness of whole module.
Disclosure of Invention
The purpose of this application embodiment is to provide a display module assembly and electronic equipment, can solve current ultrasonic wave fingerprint module laminating technology degree of difficulty height, and the great problem of the whole thickness of module.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a display module, including: the packaging layer, the base layer, the luminous circuit, the functional chip, the FPC and the fingerprint module;
the base layer comprises a first area and a second area, and the packaging layer covers the first area of the base layer;
the light emitting layer and the light emitting circuit are arranged between the packaging layer and the base layer and are positioned in a first area of the base layer;
a functional chip binding area, an FPC binding area and a fingerprint module area are arranged in the second area of the base layer;
the functional chip is arranged in the functional chip binding area, the FPC is arranged in the FPC binding area, and the fingerprint module is arranged in the fingerprint module area;
the fingerprint module is electrically connected with the FPC.
In a second aspect, an embodiment of the present application provides an electronic device, including the display module according to the first aspect.
In the embodiment of this application, directly make the fingerprint module in the basic unit, replace the original mode at basic unit back laminating fingerprint module, attenuate display module whole thickness by a wide margin, reduce the laminating technology, reduce the laminating damage to display module, realize fingerprint identification function under the screen.
Drawings
FIG. 1a is a schematic view of a conventional display module;
FIG. 1b is a second schematic view of a conventional display module;
FIG. 1c is a schematic diagram of an ultrasonic fingerprint module;
FIG. 1d is a third schematic view of a conventional display module;
fig. 2 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;
fig. 3 is a second schematic structural diagram of a display module according to an embodiment of the present disclosure;
fig. 4 is a third schematic structural diagram of a display module according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The conventional Organic light-emitting diode (OLED) flexible screen mainly includes: an upper Film Encapsulation (TFE) layer, a lower polyester resin (PET base layer), and a light emitting layer and a Low Temperature Polysilicon (LTPs) Circuit between the lower PET and the upper TFE layer, wherein a Chip bonding (COP) region is designed in a PET layer single layer region, and a Flexible Circuit board is bonded in a resin (FOP) bonding region, specifically, see fig. 1a, wherein 101 is the upper TFE layer, 102 is the lower PET layer, 101 and 102 are the light emitting layer and the LTPs Circuit layer therebetween, 103 is the COP bonding region, and 104 is the FOP bonding region.
A cross-section taken along the longitudinal axis of FIG. 1a is shown in FIG. 1b, where 201 is an upper TFE layer, 203 is a lower PET base layer, 202 is a light-emitting layer and LTPs circuit layer, 204 is a COP bonding region, and 205 is an FOP bonding region.
Ultrasonic fingerprint module stack constructs and the principle is shown in fig. 1c under the screen of using at present on electronic equipment, the piezoelectric layer of ultrasonic fingerprint module 04 (bond on display panel 03 through double faced adhesive tape 05) of placing below the display screen (including glass apron 01, transparent optical cement 02, display panel 03) sends out the ultrasonic wave under the voltage pulse effect, pass the display module assembly, reach finger 06 surface, the reflectivity of ultrasonic wave at skin 061 and air 062 is different, the sound wave that ultrasonic fingerprint discernment reflected back, form the pattern of finger fingerprint, reach fingerprint identification's purpose.
Since ultrasonic waves cannot penetrate through vacuum and have poor penetration ability from solid to air, they cannot be applied to hard-screen Active matrix organic light-emitting diodes (AMOLEDs) or Active-matrix organic light-emitting diodes (AMOLEDs), which are currently used only on flexible screens with no gap in the stack.
Ultrasonic wave fingerprint and flexible display module integrated configuration are shown in FIG. 1d, and at flexible display screen back copper foil department opening, adopt double faced adhesive tape laminating technology, with the laminating of ultrasonic wave fingerprint at the PET back, through external drive circuit, the ultrasonic wave sees through double faced adhesive tape, PET, TFE, optical cement, cover plate glass, reaches to show openly, and the response finger fingerprint reaches fingerprint identification's purpose. As shown in fig. 1d, 401 is cover glass, 402 is optical adhesive, 403 is TFE encapsulation film and LTPs Circuit layer, 404 is PET, 405 is copper foil, 406 is driver Integrated Circuit (IC) chip, 407 is FPC, 408 is ultrasonic fingerprint, and 409 is double-sided adhesive.
Ultrasonic fingerprint can only be used at present on the stromatolite does not have gapped flexible screen, and the fingerprint need use the double faced adhesive tape to paste at the flexible screen back with solitary module moreover, and technology is loaded down with trivial details, and flexible screen intensity itself is just very poor, and is not withstand voltage, can not local atress, and laminating technology very easily causes the display screen damage, causes outward appearance or functional bad, and the manufacturing degree of difficulty and cost are very high.
Simultaneously, the ultrasonic wave fingerprint module is independent module, and adopts double faced adhesive tape to paste technology, influences the thickness of whole module.
The display module provided in the embodiments of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
Referring to fig. 2 to 4, an embodiment of the present application provides a display module, including: the packaging structure comprises a packaging layer 1, a base layer 2, a luminous layer, a luminous circuit layer 3, a functional chip 4, an FPC 5 and a fingerprint module 6;
the encapsulation layer 1 may be a TFE layer, and may be referred to as an upper TFE layer; the base layer 2 may be a PET layer, which may also be referred to as a lower PET layer; the light-emitting layer and the light-emitting circuit layer 3 may be a light-emitting layer and an LTPs circuit layer; the functional chip 4 may be a driver IC chip for display screen display.
Further, as shown in fig. 4, the display module further includes and stacks an optical adhesive 7 and a glass cover plate 8 disposed on the surface of the encapsulation layer 1, it is understood that the encapsulation layer 1 is generally thinner, and thus the encapsulation layer 1 and the light emitting layer and the light emitting circuit layer 3 are shown in fig. 4 as being combined together.
As shown in fig. 2, the base layer 2 includes a first region 21 and a second region 22, and the encapsulation layer 1 covers the first region 21 of the base layer 2;
the light emitting layer and the light emitting circuit layer 3 are arranged between the packaging layer 1 and the base layer 2 and are positioned in the first area 21 of the base layer 2;
a functional chip bonding area 221 (specifically, COP bonding area), an FPC bonding area 222 (specifically, COP bonding area) and a fingerprint module area 223 are provided in the second area 22 of the base layer 2;
the functional chip 4 is arranged in the functional chip binding area 221, the FPC 5 is arranged in the FPC binding area 222, and the fingerprint module 6 is arranged in the fingerprint module area 223;
In the embodiment of this application, directly make the fingerprint module in the basic unit, replace the original mode at basic unit back laminating fingerprint module, attenuate display module whole thickness by a wide margin, reduce the laminating technology, reduce the laminating damage to display module, realize fingerprint identification function under the screen.
In some embodiments, the fingerprint module 6 is an ultrasonic fingerprint module, and the specific principle can be seen in fig. 1 c.
As shown in fig. 3, in some embodiments, the ultrasonic fingerprint module includes a Thin Film Transistor (TFT) sensing layer 61, i.e., a TFT Sensor (which may be manufactured by a process such as plating etching), a piezoelectric sensing layer 62 (which may be manufactured by a plating process), a metal coating 63 (which may be manufactured by a screen printing process), and a Thin Film layer or an ink layer 64 (which may be manufactured by a process such as bonding, screen printing, and spraying).
Referring to fig. 4, in some embodiments, the display module further includes: the metal foil 9 may be, for example, a copper foil, and the material thereof is not particularly limited in the embodiment of the present application;
the metal foil layer 9 is disposed in the first region 21 of the substrate 2, and the metal foil layer 9 and the encapsulation layer 1 are respectively disposed on two opposite sides of the first region 21 of the substrate 2.
The metal foil layer 9 is mainly used for electromagnetic shielding and antistatic, and a conductive metal foil, such as a copper foil, is disposed on the substrate surface, combined with a metal base material, has excellent conductivity, and provides an electromagnetic shielding effect.
Referring to fig. 4, in some embodiments, the substrate 2 is a flexible substrate;
the second region 22 of the base layer 2 is bent to be parallel to the first region 21 of the base layer 2, and the second region 22 of the base layer 2 and the package layer 1 are respectively located at two opposite sides of the first region 21 of the base layer 2.
In the embodiment of the present application, the flexible base layer is utilized to be bendable, and after the bonding is completed, the whole second region 22 including the functional chip 4, the FPC 5 and the fingerprint module 6 is bent to the back side.
Referring to fig. 4, in some embodiments, a notch 91 is provided in metal foil layer 9, with a portion of first region 21 of substrate 2 exposed through notch 91;
a double-sided adhesive tape 92 is arranged at the notch 91;
the second region 22 of the base layer 2 is fixedly connected to the first region 21 of the base layer 2 by means of a double-sided adhesive 92.
In this application embodiment, because fingerprint module 6 directly makes on basic unit 2, consequently offer a notch 91 on metal foil layer 9, let the dorsal part of first region 21 of basic unit 2 can expose, then through double faced adhesive tape 92 with the dorsal fixed connection of the dorsal part that the dorsal part of first region 21 exposes with second region 22, when realizing the module assembly, effectively reduce the thickness of whole module.
In addition, air has a certain influence on the propagation of the ultrasonic waves, and the double-sided adhesive tape 92 can fill the gap between the first area 21 and the second area 22, so as to improve the transmittance of the ultrasonic waves, and specifically, the ultrasonic waves penetrate through the second area 22 of the base layer 2, the double-sided adhesive tape 92, the first area 21 of the base layer 2, the light emitting layer and the light emitting circuit layer 3, the encapsulation layer 1, the optical adhesive 7 and the glass cover plate 8, reach the finger touch surface of the user, and feed back fingerprint information to the fingerprint module 6.
In some embodiments, the notch 91 is located in the orthographic projection area of the fingerprint module 6 on the metal foil 9, that is, after the base layer 2 is bent, the fingerprint module 6 is opposite to the notch 91 on the metal foil 9, so as to ensure that the ultrasonic wave vertically penetrates through the whole module.
In some embodiments, the area of the notch 91 is greater than or equal to the orthographic projection area of the fingerprint module 6 on the metal foil 9, so that the metal foil 9 can be prevented from shielding the ultrasonic waves, and the ultrasonic wave transmittance is improved.
In some embodiments, the fingerprint module 6 is electrically connected to the FPC through an Anisotropic Conductive Film (ACF) bonding process. Specifically, a TFT Sensor circuit in the fingerprint module is led out and integrated with a binding area of the FPC, and is connected with the FPC through an ACF binding process.
Through the implementation mode, the integrated ultrasonic fingerprint Sensor is manufactured in the Panel PET Bonding area of the flexible screen, and the fingerprint identification function is realized. The novel Panel design adopts a flexible screen array manufacturing process, the fingerprint Sensor is manufactured in a PET Bonding area and then is folded back to a back fingerprint identification area, the independent process of the fingerprint module is reduced, the laminating process is reduced, the thickness of the fingerprint Sensor and the thickness of the whole module are reduced, the transmittance is improved, and the purposes of lightness, thinness and cost reduction are achieved.
The embodiment of the application can be applied to all AMOLED flexible screens, the positions and the sizes of the ultrasonic fingerprints and the positions and the sizes of FPC bonding areas can be adjusted according to actual needs, and local, large-area, half-screen and even full-screen unlocking is achieved.
An embodiment of the present application further provides an electronic device, including the display module shown in fig. 2 to fig. 2.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A display module, comprising: the packaging structure comprises a packaging layer, a base layer, a luminous circuit layer, a functional chip, a Flexible Printed Circuit (FPC) and a fingerprint module;
the base layer comprises a first area and a second area, and the packaging layer covers the first area of the base layer;
the light-emitting layer and the light-emitting circuit layer are arranged between the packaging layer and the base layer and are positioned in a first area of the base layer;
a functional chip binding area, an FPC binding area and a fingerprint module area are arranged in the second area of the base layer;
the functional chip is arranged in the functional chip binding area, the FPC is arranged in the FPC binding area, and the fingerprint module is arranged in the fingerprint module area;
the fingerprint module is electrically connected with the FPC.
2. The display module assembly of claim 1, wherein the display module assembly further comprises: a metal foil layer;
the metal foil layer is arranged in the first area of the base layer, and the metal foil layer and the packaging layer are respectively positioned on two opposite sides of the first area of the base layer.
3. The display module of claim 2, wherein the base layer is a flexible base layer;
the second region of the base layer is parallel to the first region of the base layer, and the second region of the base layer and the packaging layer are respectively positioned at two opposite sides of the first region of the base layer.
4. The display module of claim 3, wherein the metal foil layer is provided with a notch, and a portion of the first region of the base layer is exposed from the notch;
double-sided adhesive tape is arranged at the notch;
the second area of the base layer is fixedly connected with the first area of the base layer through the double-sided adhesive tape.
5. The display module of claim 4, wherein the notch is located in an orthographic projection area of the fingerprint module on the metal foil.
6. The display module of claim 5, wherein the area of the notch is greater than or equal to an orthographic area of the fingerprint module on the metal foil.
7. The display module according to any one of claims 1 to 6, wherein the fingerprint module is an ultrasonic fingerprint module.
8. The display module according to claim 7, wherein the ultrasonic fingerprint module comprises a Thin Film Transistor (TFT) sensing layer, a piezoelectric sensing layer, a metal coating layer and a thin film layer which are stacked.
9. The display module according to claim 7, wherein the ultrasonic fingerprint module comprises a stacked TFT sensor layer, a piezoelectric sensor layer, a metal coating layer and an ink layer.
10. An electronic device, comprising the display module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011470830.2A CN112614874A (en) | 2020-12-14 | 2020-12-14 | Display module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011470830.2A CN112614874A (en) | 2020-12-14 | 2020-12-14 | Display module and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN112614874A true CN112614874A (en) | 2021-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011470830.2A Pending CN112614874A (en) | 2020-12-14 | 2020-12-14 | Display module and electronic equipment |
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| CN (1) | CN112614874A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114613262A (en) * | 2022-02-18 | 2022-06-10 | 维沃移动通信有限公司 | Electronic device |
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| CN104751126A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
| CN107564416A (en) * | 2017-09-15 | 2018-01-09 | 上海天马微电子有限公司 | Display panel and display device |
| CN108075024A (en) * | 2016-11-15 | 2018-05-25 | 致伸科技股份有限公司 | Fingerprint identification module and its manufacturing method with lighting function |
| CN108733260A (en) * | 2018-04-27 | 2018-11-02 | 上海天马有机发光显示技术有限公司 | Display panel and display device |
| CN110299381A (en) * | 2018-03-22 | 2019-10-01 | 三星显示有限公司 | Display device |
-
2020
- 2020-12-14 CN CN202011470830.2A patent/CN112614874A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104751126A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
| CN108075024A (en) * | 2016-11-15 | 2018-05-25 | 致伸科技股份有限公司 | Fingerprint identification module and its manufacturing method with lighting function |
| CN107564416A (en) * | 2017-09-15 | 2018-01-09 | 上海天马微电子有限公司 | Display panel and display device |
| CN110299381A (en) * | 2018-03-22 | 2019-10-01 | 三星显示有限公司 | Display device |
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| CN114613262A (en) * | 2022-02-18 | 2022-06-10 | 维沃移动通信有限公司 | Electronic device |
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Application publication date: 20210406 |