WO2023088438A1

WO2023088438A1 - Screen module, electronic device, and manufacturing method for screen module

Info

Publication number: WO2023088438A1
Application number: PCT/CN2022/132926
Authority: WO
Inventors: 单昌鹏
Original assignee: 维沃移动通信有限公司
Priority date: 2021-11-22
Filing date: 2022-11-18
Publication date: 2023-05-25
Also published as: CN114038022A

Abstract

A screen module, an electronic device, and a manufacturing method for a screen module. The screen module comprises a display module, a protection panel and a fingerprint module, wherein the protection panel is arranged on the display module; and the fingerprint module is arranged on the lower surface of the protection panel, and is located between the display module and the protection panel. In a screen module, a fingerprint module is arranged on the lower surface of a protection panel, such that the fingerprint module is located above a display module, and when a user uses the fingerprint module, the fingerprint module fits to the finger of a human body, thereby realizing the collection of a fingerprint.

Description

Screen module, electronic device and method for manufacturing screen module

Cross References to Related Applications

This application claims the priority of the Chinese patent application with application number 202111389789.0 entitled "Screen Module, Electronic Device and Screen Module Manufacturing Method" filed with the China Patent Office on November 22, 2021, the entire contents of which are incorporated by reference incorporated in this application.

technical field

The present application relates to the technical field of electronic equipment, in particular, to a screen module, electronic equipment and a method for manufacturing the screen module.

Background technique

At present, in related technologies, the optical fingerprint module is installed under the screen module. When the fingerprint module is used, the screen module will be affected by the optical fingerprint module, which will cause the display brightness of the screen module to increase sharply, increasing the The risk of damage to the screen module is eliminated.

Contents of the invention

The purpose of this application is to at least solve the problem in the related art that there is a high risk of damage to the screen module.

To this end, the first aspect of the present application proposes a screen module.

A second aspect of the present application proposes an electronic device.

The third aspect of the present application proposes a method for manufacturing a screen module.

In view of this, the first aspect of the present application provides a screen module, including a display module, a protection board and a fingerprint module; the protection board is arranged on the display module; the fingerprint module is arranged on the protection board, located on the display Between the module and the protection board.

In the screen module provided by this application, the fingerprint module is set on the protective plate so that the fingerprint module is above the display module. When the user uses the fingerprint module, the fingerprint module cooperates with the fingers of the human body to realize the Collection of fingerprints. When collecting fingerprints, since the protective plate is located between the fingerprint module and the fingers of the human body, and the display module is not between the fingerprint module and the fingers of the human body, the impact of the fingerprint module on the display module is reduced when collecting fingerprints. impact, reducing the risk of damage to the display module due to the impact of the fingerprint module.

Moreover, the fingerprint module is arranged between the display module and the protection board, so that the protection board can protect the fingerprint module, and there is no need to set an additional protection board on the fingerprint module, which reduces the thickness of the fingerprint module, thereby reducing The thickness of the screen module is convenient for thin and light design of electronic equipment. Especially for the flexible screen module, the fingerprint module is easier to bend along with the flexible screen module, thus making the screen module more suitable for electronic devices with folding screens.

The second aspect of the present application provides an electronic device, including the screen module according to any one of the above technical solutions. Therefore, the electronic device has all the beneficial effects of the screen module of any one of the above technical solutions.

The third aspect of the present application provides a method for manufacturing a screen module. The manufacturing method is used to manufacture a screen module according to any of the above technical solutions. The manufacturing method includes: coating a protective plate to form a coating layer on the protective plate ; Etching the coating layer to form a fingerprint module on the protective plate.

In the manufacturing method of the screen module provided by this application, the fingerprint module is arranged on the protective plate so that the fingerprint module is above the display module. When the user uses the fingerprint module, the fingerprint module cooperates with the fingers of the human body, And then realize the collection of fingerprints. When collecting fingerprints, since the protective plate is located between the fingerprint module and the fingers of the human body, and the display module is not between the fingerprint module and the fingers of the human body, when the fingerprint module is working, the light emitted by the fingerprint module does not It will pass through the display module, and then when the fingerprint is collected, the influence of the fingerprint module on the display module is reduced, and the risk of damage to the display module due to the influence of the fingerprint module is reduced.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Description of drawings

The above and/or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, wherein:

FIG. 1 shows a schematic cross-sectional view of a screen module according to an embodiment of the present application;

Fig. 2 shows a schematic structural diagram of a screen module according to an embodiment of the present application;

Fig. 3 shows a partial schematic diagram of a screen module according to an embodiment of the present application;

Fig. 4 shows one of the flowcharts of the manufacturing method of the screen module according to an embodiment of the present application;

Fig. 5 shows the second flowchart of the manufacturing method of the screen module according to an embodiment of the present application.

Wherein, the corresponding relationship between reference numerals and component names in Fig. 1 to Fig. 3 is:

100 display modules, 110 substrates, 120 light-emitting pixels, 122 green light-emitting pixels, 124 blue light-emitting pixels, 126 red light-emitting pixels, 130 polarizers, 140 optical glue, 150 support layers, 200 protective plates, 300 fingerprint modules, 310 Fingerprint sensor, 320 leads, 330 flexible circuit boards, 340 connectors, 350 fingerprint driver chips, 400 ink layers.

specific embodiment

In order to better understand the above-mentioned purpose, features and advantages of the present application, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

In the following description, many specific details are set forth in order to fully understand the application, but the application can also be implemented in other ways different from those described here, therefore, the protection scope of the application is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.

A screen module, an electronic device, and a manufacturing method of the screen module according to some embodiments of the present application are described below with reference to FIGS. 1 to 5 .

In one embodiment of the present application, as shown in FIGS. 1 to 3 , a screen module is provided, including a display module 100 , a protection plate 200 and a fingerprint module 300 ; the protection plate 200 is arranged on the display module 100 Above; the fingerprint module 300 is disposed on the protective plate 200 and located between the display module 100 and the protective plate 200 .

In this embodiment, as shown in Fig. 1 and Fig. 2, the fingerprint module 300 is arranged on the protective plate 200, so that the fingerprint module 300 is above the display module 100, when the user uses the fingerprint module 300, the fingerprint The module 300 cooperates with the fingers of the human body to further realize the collection of fingerprints. When collecting fingerprints, since the protective plate 200 is located between the fingerprint module 300 and the fingers of the human body, and the display module 100 is not between the fingerprint module 300 and the fingers of the human body, the fingerprint module 300 is lowered when collecting fingerprints. The impact on the display module 100 reduces the risk of damage to the display module 100 due to the impact of the fingerprint module 300 .

And, as shown in FIG. 1 , the fingerprint module 300 is arranged between the display module 100 and the protective plate 200, so that the protective plate 200 can protect the fingerprint module 300 without additional protection on the fingerprint module 300. The board 200 reduces the thickness of the fingerprint module 300, thereby reducing the thickness of the screen module, which is convenient for thinner and lighter design of electronic equipment. Especially for a flexible screen module, the fingerprint module 300 is easier to bend along with the flexible screen module, which makes the screen module more suitable for electronic devices with folding screens.

In one embodiment of the present application, the fingerprint module 300 is coated and/or etched on the protective plate 200 .

In this embodiment, the fingerprint module 300 is coated and/or etched on the protective plate 200, and no optical glue 140 (OCA) is required for lamination. The layer of optical glue 140 is reduced, and the thickness of the screen module can be further reduced. And since there is no need to use the optical glue 140 for bonding, a process step of bonding the optical glue 140 can be omitted, thereby simplifying the manufacturing process of the screen module and reducing the difficulty of manufacturing the screen module.

In one embodiment of the present application, as shown in Figure 1 and Figure 3, the fingerprint module 300 includes a fingerprint sensor 310 and a lead 320; the fingerprint sensor 310 is arranged on the protection board 200; the lead 320 is connected to the fingerprint sensor 310, and The edge of the protective plate 200 extends.

In this embodiment, the fingerprint module 300 includes a fingerprint sensor 310 and a lead wire 320. The fingerprint sensor 310 can detect the fingerprint information of a human finger, and transmit the fingerprint information to the main board of the electronic device through the lead wire 320, thereby realizing fingerprint identification.

In one embodiment of the present application, as shown in Figure 1 and Figure 2, the fingerprint module 300 also includes a flexible circuit board 330 and a connector 340; the first end of the flexible circuit board 330 is connected to the lead wire 320; the connector 340 is set on the second end of the flexible circuit board 330 .

In this embodiment, the screen module further includes a flexible circuit board 330 and a connector 340. The flexible circuit board 330 is connected to the lead wire 320, so that the fingerprint information collected by the fingerprint sensor 310 can be transmitted through the lead wire 320 and the flexible circuit board 330. transfer. The connector 340 is arranged on the flexible circuit board 330 and can be inserted into the main board of the electronic device or the circuit board of the screen module, so as to facilitate the electrical connection between the fingerprint sensor 310 and the main board of the electronic device.

Specifically, the connector 340 is plugged into the main board of the electronic device, and the fingerprint information detected by the fingerprint sensor 310 can be transmitted to the main board of the electronic device through the lead wire 320 , the flexible circuit board 330 and the connector 340 .

Specifically, the connector 340 is inserted into the circuit board of the screen module, and the fingerprint information detected by the fingerprint sensor 310 can be transmitted to the circuit board of the electronic device through the lead wire 320, the flexible circuit board 330, the connector 340 and the circuit board of the screen module. motherboard.

Specifically, a fingerprint driver chip 350 and other external components are disposed on the flexible circuit board 330 .

In one embodiment of the present application, as shown in FIG. 3 , the screen module further includes an ink layer 400, and the ink layer 400 is arranged on the protective plate 200 and arranged along the edge of the protective plate 200; the flexible circuit board 330 and the lead 320 The junction is located at the ink layer 400 .

In this embodiment, the screen module further includes an ink layer 400 , and the ink layer 400 is disposed along the edge of the protective plate 200 to form a black area on the edge of the protective plate 200 . Since the connection between the flexible circuit board 330 and the lead 320 is located at the ink layer 400, the connection between the flexible circuit board 330 and the lead 320 will not block the content displayed by the screen module, which improves the display effect of the screen module.

In one embodiment of the present application, as shown in FIG. 1 , a display module 100 includes a substrate 110 , a plurality of light-emitting pixels 120 , a polarizer 130 and an optical adhesive 140 . A plurality of light-emitting pixels 120 are disposed on the substrate 110 ; a polarizer 130 is disposed on the plurality of light-emitting pixels 120 ; and an optical glue 140 is disposed on the polarizer 130 .

In this embodiment, the display module 100 includes a substrate 110, a plurality of light-emitting pixels 120, a polarizer 130, and an optical adhesive 140. The plurality of light-emitting pixels 120 are disposed on the substrate 110, and polarized light The polarizer 130 and the polarizer 130 are attached to the protective plate 200 through the optical adhesive 140 to form a screen module.

Specifically, the substrate 110 is a glass substrate, and a support layer 150 is pasted on the substrate 110, and the support layer 150 is a foam layer or a copper foil layer.

Specifically, the plurality of light-emitting pixels 120 includes green light-emitting pixels 122 , blue light-emitting pixels 124 and red light-emitting pixels 126 .

In one embodiment of the present application, as shown in FIG. 1 and FIG. 3 , in a direction perpendicular to the display module 100 , the projection of the fingerprint sensor 310 is located between adjacent light-emitting pixels 120 .

In this embodiment, the gap between the fingerprint sensor 310 and the adjacent light-emitting pixels 120 among the plurality of light-emitting pixels 120 is relatively arranged, so as to reduce the influence of the fingerprint sensor 310 on the content displayed by the display module 100, thereby improving the display module. 100% display effect, improve the quality of the screen module.

Specifically, the positions where the light-emitting pixels 120 are located are display areas, and the gaps between adjacent light-emitting pixels 120 are non-display areas.

In one embodiment of the present application, the protective plate 200 includes a glass cover or a polyimide flexible material cover.

In this embodiment, the thickness of the glass cover plate or the polyimide flexible material cover plate is smaller than the maximum penetration capability of the fingerprint sensor 310, thereby enabling the fingerprint sensor 310 to collect fingerprints more accurately and improving the electronic device's ability to detect fingerprints. acquisition accuracy and response speed.

Specifically, the protection plate 200 is an ultra-thin glass (UTG) cover plate, a transparent polyimide flexible material (CPI) cover plate or a common glass cover plate.

Specifically, the wiring channel of the fingerprint sensor 310 is smaller than 50 microns.

Since the width of the ridges and grooves of human fingers is between 100 microns and 200 microns, the wiring channel of the fingerprint sensor 310 is smaller than 50 microns, which can collect fingerprints more accurately.

Fingerprints can penetrate up to 200 microns, and the thickness of the ultra-thin glass cover is less than 200 microns, thereby improving the accuracy of fingerprint sensor 310 for fingerprint collection.

The thickness of the ultra-thin glass cover plate is less than or equal to 50 microns.

In one embodiment of the present application, the display module 100 is a flexible display module 100 .

In this embodiment, the display module 100 is a flexible display module 100, and the flexible display module 100 cooperates with the fingerprint module 300, so that the screen module is more suitable for electronic equipment with a folding screen module.

In one embodiment of the present application, the screen module is an Organic Light-Emitting Diode (OLED) screen.

In one embodiment of the present application, an electronic device is provided, including the screen module of any one of the above-mentioned embodiments, so the electronic device has all the beneficial effects of the screen module of any of the above-mentioned embodiments.

Specifically, the electronic device is a folding screen electronic device, such as a folding screen mobile phone, a folding screen notebook or a folding screen watch.

In one embodiment of the present application, as shown in FIG. 4 , a method for manufacturing a screen module is provided. The manufacturing method is used to manufacture a screen module as in any of the above embodiments. The manufacturing method includes:

Step 402, coating the protective plate to form a coating layer on the protective plate;

Step 404, etching the coating layer to form a fingerprint module on the protective plate.

In this embodiment, the fingerprint module is arranged on the protective plate, so that the fingerprint module is above the display module. When the user uses the fingerprint module, the fingerprint module cooperates with the fingers of the human body to realize the collection of fingerprints. . When collecting fingerprints, since the protective plate is located between the fingerprint module and the fingers of the human body, and the display module is not between the fingerprint module and the fingers of the human body, when the fingerprint module is working, the light emitted by the fingerprint module does not It will pass through the display module, and then when the fingerprint is collected, the influence of the fingerprint module on the display module is reduced, and the risk of damage to the display module due to the influence of the fingerprint module is reduced.

The fingerprint module is coated and/or etched on the protective plate without optical adhesive (OCA) for lamination, which reduces the optical adhesive layer and can further reduce the thickness of the screen module. And since there is no need for bonding with optical glue, a process step of bonding with optical glue can be omitted, thereby simplifying the manufacturing process of the screen module and reducing the difficulty of manufacturing the screen module.

The area and size of the fingerprint module can be adjusted according to the usage requirements and the layout of the electronic equipment.

Specifically, the etching process is yellow photolithography.

Specifically, the manufacturing method of the screen module should also ensure that the ultra-thin glass will not be damaged during the transmission process, and then cut and finally thinned to the thickness we need.

In one embodiment of the present application, etching the coating layer to form a fingerprint module on the protection plate includes: etching the coating layer to form a fingerprint sensor on the protection plate; etching the coating layer to form an ink layer from the fingerprint sensor to the protection plate Extended leads.

In this embodiment, a fingerprint sensor is formed on the protective plate, and the fingerprint information of the human body can be collected by the fingerprint sensor. A lead wire extending from the fingerprint module to the ink layer is formed on the protective plate. The fingerprint sensor can detect the fingerprint information of the human finger, and transmit the fingerprint information to the main board of the electronic device through the lead wire, thereby realizing the recognition of the fingerprint.

Specifically, as shown in Figure 5, the manufacturing method of the screen module includes:

Step 502, coating the protective plate to form a coating layer on the protective plate;

Step 504, etching the coating layer to form a fingerprint sensor on the protective plate;

Step 506, etching the coating layer, and forming leads extending from the fingerprint sensor to the ink layer on the protective plate.

In an embodiment of the present application, the manufacturing method of the screen module further includes: pressing the flexible circuit board to the ink layer, and connecting the flexible circuit board to the leads.

In this embodiment, since the connection between the flexible circuit board and the lead is located at the ink layer, the connection between the flexible circuit board and the lead will not block the content displayed by the screen module, thereby improving the display effect of the screen module.

In the claims, specification and drawings of this application, the term "plurality" refers to two or more than two, unless otherwise clearly defined, the orientation or position indicated by the terms "upper", "lower", etc. The relationship is based on the orientation or positional relationship shown in the drawings, and is only for the purpose of more conveniently describing the present application and making the description process easier, and is not intended to indicate or imply that the referred device or element must have the specific orientation described, so as to specific orientation, construction and operation, so these descriptions should not be construed as limitations on the present application; the terms "connection", "installation", "fixation" and the like should be interpreted in a broad sense, for example, "connection" can be between multiple objects It can also be a detachable connection between multiple objects, or an integral connection; it can be a direct connection between multiple objects, or an indirect connection between multiple objects through an intermediary. Those skilled in the art can understand the specific meanings of the above terms in this application according to the specific situation of the above data.

In the claims, description and drawings of the present application, descriptions of the terms "one embodiment", "some embodiments", "specific embodiments" and the like mean specific features and structures described in conjunction with the embodiment or example , material or feature is included in at least one embodiment or example of the present application. In the claims, description and drawings of this application, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above descriptions are only preferred embodiments of the present application, and are not intended to limit the present application. For those skilled in the art, there may be various modifications and changes in the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application shall be included within the protection scope of this application.

Claims

A screen module, comprising:

display module;

a protection plate, the protection plate is arranged on the display module;

A fingerprint module, the fingerprint module is set on the protection board and is located between the display module and the protection board.
The screen module according to claim 1, wherein the fingerprint module comprises:

a fingerprint sensor, the fingerprint sensor is arranged on the protective plate;

lead wires, the lead wires are connected to the fingerprint sensor and extend toward the edge of the protection board.
The screen module according to claim 2, wherein the fingerprint module further comprises:

a flexible circuit board, the first end of the flexible circuit board is connected to the lead;

A connector, the connector is arranged at the second end of the flexible circuit board.
The screen module according to claim 3, further comprising:

an ink layer, the ink layer is arranged on the protective plate and arranged along the edge of the protective plate;

The connection between the flexible circuit board and the lead is located at the ink layer.
The screen module according to claim 2, wherein the display module comprises:

Substrate;

a plurality of light-emitting pixels, the plurality of light-emitting pixels are arranged on the substrate;

a polarizer, the polarizer is arranged on the plurality of light-emitting pixels;

Optical glue, the optical glue is arranged on the polarizer.
The screen module according to claim 5, wherein,

In a direction perpendicular to the display module, projections of the fingerprint sensor are located between adjacent luminescent pixels.
An electronic device, comprising the screen module according to any one of claims 1-6.
A manufacturing method of a screen module, wherein the manufacturing method is used to manufacture the screen module according to any one of claims 1 to 6, the manufacturing method comprising:

Coating a film on the protective plate to form a coating layer on the protective plate;

Etching the coating layer to form a fingerprint module on the protective plate.
The manufacturing method of a screen module according to claim 8, wherein said etching said coating layer and forming a fingerprint module on said protective plate comprises:

Etching the coating layer to form a fingerprint sensor on the protective plate;

Etching the coating layer, forming a lead extending from the fingerprint sensor to the ink layer on the protective plate.
The method for manufacturing a screen module according to claim 9, further comprising:

The flexible circuit board is pressed on the ink layer, and the flexible circuit board is connected with the lead.