CN112599456A - Intelligent chip packaging structure and use method thereof - Google Patents
Intelligent chip packaging structure and use method thereof Download PDFInfo
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- CN112599456A CN112599456A CN202110057390.6A CN202110057390A CN112599456A CN 112599456 A CN112599456 A CN 112599456A CN 202110057390 A CN202110057390 A CN 202110057390A CN 112599456 A CN112599456 A CN 112599456A
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- sliding block
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 19
- 230000005540 biological transmission Effects 0.000 claims abstract description 41
- 230000000694 effects Effects 0.000 claims abstract description 24
- 238000012545 processing Methods 0.000 claims abstract description 14
- 238000002955 isolation Methods 0.000 claims description 39
- 230000007246 mechanism Effects 0.000 claims description 19
- 239000003292 glue Substances 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 15
- 238000005538 encapsulation Methods 0.000 claims description 13
- 238000002347 injection Methods 0.000 claims description 11
- 239000007924 injection Substances 0.000 claims description 11
- 238000005096 rolling process Methods 0.000 claims description 11
- 230000008878 coupling Effects 0.000 claims description 10
- 238000010168 coupling process Methods 0.000 claims description 10
- 238000005859 coupling reaction Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000000428 dust Substances 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 230000029058 respiratory gaseous exchange Effects 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 1
- 238000003754 machining Methods 0.000 claims 1
- 230000007306 turnover Effects 0.000 abstract 1
- 238000012546 transfer Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Basic Packing Technique (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
Abstract
The invention discloses an intelligent chip packaging structure and a using method thereof, and the intelligent chip packaging structure comprises a bottom plate, wherein a supporting plate is fixedly arranged on one side of the upper end of the bottom plate, a first sliding groove is formed in the surface of the outer side of the supporting plate, a first screw rod is movably arranged in the middle of the inner side of the first sliding groove through a bearing, a first mounting seat is fixedly arranged at the upper end of the first sliding groove in the supporting plate, a first motor is fixedly arranged in the first mounting seat, the output shaft end of the first motor is in transmission connection with the first screw rod through a coupler, a first sliding block is movably clamped at the upper end in the first sliding groove, and a second sliding block is movably clamped at the lower end in. The invention has good use effect, can be convenient for simultaneously packaging chips on two sides of the circuit board, does not need to turn over the circuit board for packaging again after packaging one side, and thus can effectively improve the processing efficiency of the device.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to an intelligent chip packaging structure and a using method thereof.
Background
The chip package has semiconductor IC chip casing to hold, fix, seal, protect chip and strengthen electrothermal performance, and is also bridge to the inside world of chip and outer circuit. Therefore, the package plays an important role for both the CPU and other LSI integrated circuits.
The chip is generally packaged by glue filling, and the packaging method has the following disadvantages:
1. due to the fluidity of the colloid, when chips are mounted on two surfaces of a circuit board and need to be packaged, the chips on one surface of the circuit board are often packaged firstly, and then the chips on the other surface of the circuit board are packaged by turning over the circuit board, so that the working efficiency is low and the using effect is poor;
2. when the current chip is packaged, the dust-free environment inside a dust-free workshop is often relied on to guarantee that no dust can influence the packaging quality, the space of the dust-free workshop is large, the dust-free difficulty is completely guaranteed to be large, and therefore, in the long-time packaging and processing operation, the dust of some batches of chips is easily caused to enter the inside during packaging.
Disclosure of Invention
The present invention is directed to an intelligent chip package structure and a method for using the same, which are used to solve the problems of the related art.
In order to achieve the purpose, the invention provides the following technical scheme: an intelligent chip packaging structure comprises a bottom plate, wherein a supporting plate is fixedly arranged on one side of the upper end of the bottom plate, a first chute is formed in the surface of the outer side of the supporting plate, a first screw rod is movably arranged in the middle of the inner side of the first chute through a bearing, a first mounting seat is fixedly arranged at the upper end of the first chute in the supporting plate, a first motor is fixedly arranged in the first mounting seat, the output shaft end of the first motor is in transmission connection with the first screw rod through a coupler, a first sliding block is movably clamped at the upper end in the first chute, a second sliding block is movably clamped at the lower end in the first chute, the first sliding block and the second sliding block are movably sleeved on the surface of the outer side of the first screw rod through threads, a cross rod is movably arranged on one side of the surfaces of the first sliding block and the second sliding block through a bearing, and a conveying roller is fixedly arranged at one end, the transmission belt is sleeved between the transmission rollers, the circuit board is movably clamped between the transmission belts, chip bodies are fixedly arranged on two sides of the surface of the circuit board, pins are fixedly arranged between the chip bodies and the circuit board, a transmission mechanism is arranged on one side surface, away from the circuit board, of the supporting board, the transmission mechanism comprises a first belt pulley, an extension rod, a second mounting seat, a second motor, a mounting plate, a first rotating shaft, a second belt pulley, a belt, a first gear and a second gear, the first belt pulley is fixedly arranged at one end, away from the transmission rollers, of the cross rod at the upper end of the cross rod, an extension rod is fixedly arranged on the upper end of the first belt pulley on the surface of the supporting board, the second mounting seat is fixedly arranged at one end, away from the supporting board, of the extension rod, the second motor is fixedly arranged in the second mounting seat, and the output, the surface of the outer side of the second sliding block is fixedly provided with a mounting plate, one side of the surface of the mounting plate is fixedly provided with a first rotating shaft, one end of the first rotating shaft is fixedly provided with a second belt pulley, a belt is sleeved between the second belt pulley and the first belt pulley, the middle part of the outer side surface of the first rotating shaft is fixedly provided with a first gear, the lower end of the cross rod far away from the conveying roller is fixedly provided with a second gear, the first gear and the second gear are mutually meshed, the middle part of the outer side surface of the support plate is fixedly provided with a tensioning mechanism, the tensioning mechanism comprises a second rotating shaft, a rotating block, a rotating rod, a third rotating shaft and a tensioning wheel, the middle part of the outer side surface of the support plate is movably provided with the second rotating shaft through a bearing, the surface of the rotating block is fixedly provided with the rotating rod, and the end of the rotating, and a tensioning wheel is fixedly arranged on the outer side surface of the third rotating shaft, the outer side surface of the tensioning wheel is mutually attached to the belt, and packaging mechanisms are arranged at the two sides of the circuit board at the upper end of the bottom plate.
Preferably, the packaging mechanism comprises a support rod, a second chute, a third slide block, a second screw rod, a third mounting seat, a third motor, a first electric push rod, a separation cover, an electromagnetic valve, an air suction pipe and a liquid injection pipe, wherein the support rod is fixedly arranged at the two sides of the circuit board at the upper end of the bottom plate, the second chute is arranged on the outer surface of the support rod, the third slide block is movably clamped in the second chute, the second screw rod is movably arranged in the second chute through a bearing, the third slide block is movably sleeved on the outer surface of the second screw rod through a thread, the third mounting seat is fixedly arranged at the upper end of the second chute in the support rod, the third motor is fixedly arranged in the third mounting seat, the output shaft end of the third motor is in transmission connection with the second screw rod through a coupler, the first electric push rod is fixedly arranged in the middle part of the inner side of the, the fixed cage that is provided with of telescopic link axle head of first electric putter, the cage cover is established on chip body outside surface, the fixed solenoid valve that is provided with in cage outside surface upper end, solenoid valve outside fixed surface is provided with the breathing pipe, the fixed notes liquid pipe that is provided with of cage outside surface lower extreme can conveniently carry out isolated encapsulation to the chip through packaging mechanism to can encapsulate the chip on circuit board two sides simultaneously, thereby can improve encapsulation efficiency.
Preferably, the lower end of the air suction pipe is fixedly provided with a first connecting flange, the lower end of the liquid injection pipe is fixedly provided with a second connecting flange, and the air suction pipe and the liquid injection pipe can be conveniently connected with other pipelines externally through the first connecting flange and the second connecting flange.
Preferably, the side wall of the inner side of the isolation cover is fixedly provided with a heat conduction copper pipe, and the heat transfer speed can be increased through the heat conduction copper pipe to accelerate glue pouring and solidification.
Preferably, the surface of the outer side of the isolation cover is fixedly provided with a sealing ring, and the sealing effect of the isolation cover can be improved when the isolation cover is attached to the surface of the circuit board through the sealing ring.
Preferably, the four corners of the surface of the upper end of the bottom plate are provided with mounting holes, and the device can be conveniently and fixedly mounted at a target position through the mounting holes.
Preferably, backup pad surface one side activity is provided with the rolling disc, the fixed fourth mount pad that is provided with in inside one side of rolling disc, the inside fixed fourth motor that is provided with of fourth mount pad, the output axle head of fourth motor is provided with fixture through the shaft coupling, the activity of one side that the backup pad was kept away from to the rolling disc is provided with the fourth pivot, fourth pivot outside fixed surface is provided with the transmission cylinder, be provided with the conveyer belt between the transmission cylinder, fourth pivot outside surface is provided with the torsional spring, can conveniently transmit the circuit board that encapsulates through the conveyer belt to can conveniently carry out the processing of next step, can conveniently drive fourth pivot clockwise rotation automatically through the torsional spring.
Preferably, fixture includes fixed frame, telescopic link, splint, second electric putter, rubber pad, the output axle head of fourth motor passes through the fixed frame that is provided with of shaft coupling, the inside both sides of fixed frame are all fixed and are provided with the telescopic link, the fixed splint that are provided with of telescopic link one end, the fixed frame is inside to be fixed between the telescopic link and be provided with second electric putter, second electric putter is close to fixed connection between the one end of splint and the splint, splint outside surface is provided with the rubber pad, can conveniently overturn the circuit board centre gripping of packing through clamping structure to can conveniently transmit.
A use method of an intelligent chip packaging structure comprises the following specific steps:
the first step is as follows: the circuit board welded with the chip body is clamped between the transmission belts, then the first motor can be opened, the circuit board can be driven by the first motor to be transmitted, the transmission can be stopped when the circuit board is transmitted to the position of the isolation cover, then the first electric push rod is controlled to extend, so that the isolation cover can be covered on the outer side surface of the chip body, the sealing effect of the isolation cover can be improved when the isolation cover is attached to the surface of the circuit board through the sealing ring, then the electromagnetic valve can be opened, then air between the isolation cover and the chip body is pumped out through the air suction pipe, so that the influence of air and glue filling can be reduced, dust can be pumped away, the isolation cover can isolate the external environment, so that the glue filling effect can be improved, glue filling can be carried out to the inside of the isolation cover through the liquid injection pipe, and packaging can be completed after glue is cooled, the device can process two surfaces of the circuit board simultaneously during processing, and does not need to package the other surface after one surface is packaged, so that the processing efficiency can be improved;
the second step is that: when the device is used, the distance between the conveying rollers can be adjusted according to the requirement, when the device is adjusted, the first screw rod is driven to rotate by the first motor, and the threads on the upper side and the lower side of the first screw rod are opposite, so that the first slide block and the second slide block can be driven to move in opposite directions, the distance between the conveying rollers can be adjusted, thereby being convenient for clamping circuit boards with different sizes, and when the first slide block and the second slide block move, if the first slide block and the second slide block are close to each other, the belt can be loosened, at the moment, the fourth rotating shaft can drive the rotating rod and the tensioning wheel to rotate clockwise by the torsional spring, so that the belt can be automatically tensioned, and if the first slide block and the second slide block are far away from each other, the belt can be tightened, so that the rotating rod can be automatically rotated in an anticlockwise stressed manner, so that the first, therefore, no matter how the distance between the conveying rollers is adjusted by the device, the belt can be always in a tensioning state, so that the rotation of the conveying rollers is not influenced;
the third step: the device encapsulates when using the circuit board after accomplishing can enter into fixed frame along with the transmission of transmission band inside, can promote splint through second electric putter afterwards and get up the circuit board centre gripping, and the rolling disc rotates clockwise afterwards to drive fixed frame through the fourth motor and rotate 90 degrees, so can make the circuit board lie in the conveyer belt upper end, can conveniently transmit the circuit board that encapsulates this moment through the conveyer belt, thereby can conveniently carry out the processing of step on next step.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the circuit board welded with the chip body is clamped between the transmission belts, then the first motor can be opened, so that the circuit board can be driven by the first motor to be transmitted, the transmission can be stopped when the circuit board is transmitted to the position of the isolation cover, then the first electric push rod is controlled to extend, so that the isolation cover can be covered on the outer side surface of the chip body, at the moment, the sealing effect of the isolation cover can be improved when the isolation cover is attached to the surface of the circuit board through the sealing ring, then the electromagnetic valve can be opened, then air between the isolation cover and the chip body is pumped out through the air suction pipe, so that the influence of air and glue filling can be reduced, dust can be pumped away, meanwhile, the isolation cover can isolate the external environment, and thus the glue filling effect can.
2. According to the invention, glue is injected into the isolation cover through the liquid injection pipe, the encapsulation can be completed after the glue is cooled, the device can simultaneously process two surfaces of the circuit board during processing, and the encapsulation of the other surface is not required after the encapsulation of one surface is completed, so that the processing efficiency can be improved.
3. When the circuit board clamping device is used, the distance between the conveying rollers can be adjusted according to needs, the first screw rod is driven to rotate only through the first motor when the distance is adjusted, the first sliding block and the second sliding block can be driven to move in opposite directions only by the fact that the threads on the upper side and the lower side of the first screw rod are opposite, and therefore the distance between the conveying rollers can be adjusted, and the circuit board clamping device can be conveniently suitable for clamping circuit boards of different sizes.
Drawings
FIG. 1 is a schematic diagram of an overall structure of an intelligent chip package structure according to the present invention;
FIG. 2 is a rear view of a support plate of an intelligent chip package structure of the present invention;
FIG. 3 is an installation view of a rotating disk of an intelligent chip package structure according to the present invention;
FIG. 4 is a view of the overall structure of an intelligent chip package clamping mechanism of the present invention;
FIG. 5 is an enlarged view taken at A of FIG. 1 in accordance with the present invention;
fig. 6 is an enlarged view of the invention at B in fig. 1.
In the figure: 1. a base plate; 2. a support plate; 3. a first chute; 4. a first screw; 5. a first mounting seat; 6. a first motor; 7. a first slider; 8. a second slider; 9. a cross bar; 10. a conveying roller; 11. a conveyor belt; 12. a circuit board; 13. a chip body; 14. a pin; 15. a first pulley; 16. an extension rod; 17. a second mounting seat; 18. a second motor; 19. mounting a plate; 20. a first rotating shaft; 21. a second pulley; 22. a belt; 23. a first gear; 24. a second gear; 25. a second rotating shaft; 26. rotating the block; 27. rotating the rod; 28. a third rotating shaft; 29. a tension wheel; 30. a support bar; 31. a second chute; 32. a third slider; 33. a second screw; 34. a third mounting seat; 35. a third motor; 36. a first electric push rod; 37. an isolation cover; 38. an electromagnetic valve; 39. an air intake duct; 40. a liquid injection pipe; 41. a first connecting flange; 42. a second connecting flange; 43. a heat conducting copper pipe; 44. a seal ring; 45. mounting holes; 46. rotating the disc; 47. a fourth mounting seat; 48. a fourth motor; 49. a fixed frame; 50. a fourth rotating shaft; 51. a transfer drum; 52. a conveyor belt; 53. a telescopic rod; 54. a splint; 55. a second electric push rod; 56. and (7) a rubber pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: an intelligent chip packaging structure comprises a bottom plate 1, wherein a supporting plate 2 is fixedly arranged on one side of the upper end of the bottom plate 1, a first chute 3 is arranged on the outer side surface of the supporting plate 2, a first screw rod 4 is movably arranged in the middle of the inner side of the first chute 3 through a bearing, a first mounting seat 5 is fixedly arranged at the upper end of the first chute 3 in the supporting plate 2, a first motor 6 is fixedly arranged in the first mounting seat 5, the output shaft end of the first motor 6 is in transmission connection with the first screw rod 4 through a coupler, a first slide block 7 is movably clamped at the upper end in the first chute 3, a second slide block 8 is movably clamped at the lower end in the first chute 3, the first slide block 7 and the second slide block 8 are movably sleeved on the outer side surface of the first screw rod 4 through threads, and a cross rod 9 is movably arranged on one side of the surfaces of the first slide block 7 and the second slide block 8 through, the fixed conveying roller 10 that is provided with of one end that keeps away from first slider 7 and second slider 8 is kept away from to horizontal pole 9, the cover is equipped with transmission band 11 between the conveying roller 10, the activity block is provided with circuit board 12 between the transmission band 11, circuit board 12 surface both sides all are fixed and are provided with chip body 13, the fixed pin 14 that is provided with between chip body 13 and the circuit board 12, one side surface that circuit board 12 was kept away from to backup pad 2 is provided with drive mechanism, drive mechanism includes first belt pulley 15, extension rod 16, second mount pad 17, second motor 18, mounting panel 19, first pivot 20, second belt pulley 21, belt 22, first gear 23, second gear 24, the upper end the one end that conveying roller 10 was kept away from to horizontal pole 9 is fixed and is provided with first belt pulley 15, backup pad 2 surface is fixed and is provided with extension rod 16 in first belt pulley 15 upper end, the fixed second mount pad 17 that is provided with of one end that the backup pad 2 was kept away from to extension rod 16, the inside fixed second motor 18 that is provided with of second mount pad 17, the output axle head of second motor 18 passes through the shaft coupling and is connected with the transmission between first belt pulley 15, the fixed mounting panel 19 that is provided with of second slider 8 outside surface, the fixed first pivot 20 that is provided with of mounting panel 19 surface one side, the fixed second belt pulley 21 that is provided with of first pivot 20 one end, the cover is equipped with belt 22 between second belt pulley 21 and the first belt pulley 15, the fixed first gear 23 that is provided with of first pivot 20 outside surface middle part, the lower extreme the fixed second gear 24 that is provided with of one end that transfer roller 10 was kept away from to horizontal pole 9, intermeshing between first gear 23 and the second gear 24, the fixed straining device that is provided with in backup pad 2 outside surface middle part, straining device includes second pivot 25, turning block 26, dwang 27, third pivot 28, take-up pulley 29, 2 outside surface middle parts of backup pad are provided with second pivot 25 through the bearing activity, 25 outside fixed surfaces of second pivot are provided with turning block 26, 26 fixed surfaces of turning block are provided with dwang 27, the one end that turning block 26 was kept away from to dwang 27 is provided with third pivot 28 through the bearing activity, 28 outside fixed surfaces of third pivot are provided with take-up pulley 29, laminate each other between take-up pulley 29 outside surface and the belt 22, bottom plate 1 upper end is provided with the encapsulation mechanism in circuit board 12 both sides.
The packaging mechanism comprises a supporting rod 30, a second sliding groove 31, a third sliding block 32, a second screw 33, a third mounting seat 34, a third motor 35, a first electric push rod 36, a separation cover 37, an electromagnetic valve 38, an air suction pipe 39 and a liquid injection pipe 40, wherein the supporting rod 30 is fixedly arranged at the upper end of the bottom plate 1 on both sides of the circuit board 12, the second sliding groove 31 is arranged on the outer side surface of the supporting rod 30, the third sliding block 32 is movably clamped in the second sliding groove 31, the second screw 33 is movably arranged in the second sliding groove 31 through a bearing, the third sliding block 32 is movably sleeved on the outer side surface of the second screw 33 through threads, the third mounting seat 34 is fixedly arranged at the upper end of the second sliding groove 31 in the supporting rod 30, the third motor 35 is fixedly arranged in the third mounting seat 34, and the output shaft end of the third motor 35 is in transmission connection with the second screw 33 through a shaft coupling, the fixed first electric putter 36 that is provided with in the inboard middle part of second slider 8, the fixed cage 37 that is provided with of telescopic link axle head of first electric putter 36, the cage 37 cover is established on chip body 13 outside surface, the fixed solenoid valve 38 that is provided with in cage 37 outside surface upper end, the fixed breathing pipe 39 that is provided with in solenoid valve 38 outside surface, the fixed notes liquid pipe 40 that is provided with of cage 37 outside surface lower extreme can conveniently carry out isolated encapsulation to the chip through packaging mechanism to can encapsulate the chip on circuit board 12 two sides simultaneously, thereby can improve encapsulation efficiency.
The lower end of the air suction pipe 39 is fixedly provided with a first connecting flange 41, the lower end of the liquid injection pipe 40 is fixedly provided with a second connecting flange 42, and the air suction pipe 39 and the liquid injection pipe 40 can be conveniently connected with other pipelines externally through the first connecting flange 41 and the second connecting flange 42.
The side wall of the inner side of the isolation cover 37 is fixedly provided with a heat conduction copper pipe 43, and the heat transfer speed can be increased through the heat conduction copper pipe 43 to accelerate glue pouring and solidification.
The outer side surface of the isolation cover 37 is fixedly provided with a sealing ring 44, and the sealing effect of the isolation cover 37 can be improved when the isolation cover 37 is attached to the surface of the circuit board 12 through the sealing ring 44.
Mounting holes 45 are formed in four corners of the surface of the upper end of the bottom plate 1, and the device can be conveniently and fixedly mounted at a target position through the mounting holes 45.
2 surperficial one side activities of backup pad are provided with rolling disc 46, the fixed fourth mount pad 47 that is provided with in inside one side of rolling disc 46, the inside fixed fourth motor 48 that is provided with of fourth mount pad 47, the output shaft end of fourth motor 48 is provided with fixture through the shaft coupling, the activity of one side that backup pad 2 was kept away from to rolling disc 46 is provided with fourth pivot 50, the fixed surface in the 50 outsides of fourth pivot is provided with transmission cylinder 51, be provided with conveyer belt 52 between the transmission cylinder 51, the 50 outside surfaces of fourth pivot are provided with the torsional spring, can conveniently transmit the circuit board 12 that encapsulates through conveyer belt 52 to can conveniently carry out the processing of next step, can conveniently drive the 50 clockwise rotations of fourth pivot automatically through the torsional spring.
Fixture includes fixed frame 49, telescopic link 53, splint 54, second electric putter 55, rubber pad 56, the fixed frame 49 that is provided with of shaft coupling is passed through to the output axle head of fourth motor 48, the inside both sides of fixed frame 49 are all fixed and are provided with telescopic link 53, the fixed splint 54 that is provided with of telescopic link 53 one end, fixed frame 49 is inside to be fixed between telescopic link 53 and is provided with second electric putter 55, second electric putter 55 is close to fixed connection between the one end of splint 54 and the splint 54, splint 54 outside surface is provided with rubber pad 56, can conveniently overturn the circuit board 12 centre gripping of encapsulation through clamping structure to can conveniently transmit.
A use method of an intelligent chip packaging structure comprises the following specific steps:
the first step is as follows: the circuit board 12 welded with the chip body 13 is clamped between the transmission belts 11, then the first motor 6 can be opened, so that the circuit board 12 can be driven by the first motor 6 to be transmitted, the transmission can be stopped when the circuit board is transmitted to the position of the isolation cover 37, then the first electric push rod 36 is controlled to extend, so that the isolation cover 37 can be covered on the outer side surface of the chip body 13, at the moment, the sealing effect of the isolation cover 37 can be improved when the isolation cover 37 is attached to the surface of the circuit board 12 through the sealing ring 44, then the electromagnetic valve 38 can be opened, then the air between the isolation cover 37 and the chip body 13 is pumped out through the air suction pipe 39, so that the influence of the air and the glue can be reduced, and the dust can be pumped away, meanwhile, the isolation cover 37 can isolate the external environment, so that the glue filling effect can be improved, then glue can be filled into the isolation cover, the packaging can be completed after the glue is cooled, the device can simultaneously process two surfaces of the circuit board 12 during processing, and the packaging of the other surface is not required after the packaging of one surface is completed, so that the processing efficiency can be improved, and the device can drive the second screw 33 to rotate through the third motor 35 according to the requirement during the packaging, so that the third slide block 32 can be driven to move up and down through the second screw 33, and the position of the isolation cover 37 can be adapted to the position of the chip;
the second step is that: when the device is used, the distance between the conveying rollers 10 can be adjusted as required, when the device is adjusted, the first motor 6 is only needed to drive the first screw rod 4 to rotate, and the threads on the upper side and the lower side of the first screw rod 4 are opposite, so that the first sliding block 7 and the second sliding block 8 can be driven to move in opposite directions, so that the distance between the conveying rollers 10 can be adjusted, thereby being convenient for clamping circuit boards 12 with different sizes, and when the first sliding block 7 and the second sliding block 8 move, if the first sliding block 7 and the second sliding block 8 are close to each other, the belt 22 can be loosened, at the moment, the fourth rotating shaft 50 can drive the rotating rod 27 and the tensioning wheel 29 to rotate clockwise through the torsion spring, so that the belt 22 can be automatically tensioned, and when the first sliding block 7 and the second sliding block 8 are far away from each other, the belt 22 can be tightened, so that the rotating rod 27 can be, therefore, the first sliding block 7 and the second sliding block 8 can be conveniently separated from each other, so that the belt 22 can be always in a tensioning state no matter how the device adjusts the distance between the conveying rollers 10, and the rotation of the conveying rollers 10 cannot be influenced;
the third step: when the device is used, the packaged circuit board 12 can enter the fixed frame 49 along with the transmission of the transmission belt 11, then the circuit board 12 can be clamped by the clamping plate 54 pushed by the second electric push rod 55, then the rotating disc 46 rotates clockwise, and the fixed frame 49 is driven by the fourth motor 48 to rotate for 90 degrees, so that the circuit board 12 can lie on the upper end of the transmission belt 52, the packaged circuit board 12 can be conveniently transmitted by the transmission belt 52, and the next step of processing can be conveniently carried out.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. An intelligent chip packaging structure, includes bottom plate (1), its characterized in that: a supporting plate (2) is fixedly arranged on one side of the upper end of the bottom plate (1), a first sliding groove (3) is formed in the outer side surface of the supporting plate (2), a first screw rod (4) is movably arranged in the middle of the inner side of the first sliding groove (3) through a bearing, a first mounting seat (5) is fixedly arranged at the upper end of the first sliding groove (3) in the supporting plate (2), a first motor (6) is fixedly arranged in the first mounting seat (5), the output shaft end of the first motor (6) is in transmission connection with the first screw rod (4) through a coupler, a first sliding block (7) is movably clamped at the upper end in the first sliding groove (3), a second sliding block (8) is movably clamped at the lower end in the first sliding groove (3), the first sliding block (7) and the second sliding block (8) are movably sleeved on the outer side surface of the first screw rod (4) through threads, first slider (7) and second slider (8) surface one side all are provided with horizontal pole (9) through the bearing activity, the fixed conveying roller (10) that is provided with of one end of keeping away from first slider (7) and second slider (8) is gone up in horizontal pole (9), the cover is equipped with transmission band (11) between conveying roller (10), the activity block is provided with circuit board (12) between transmission band (11), circuit board (12) surface both sides are all fixed and are provided with chip body (13), it is provided with pin (14) to fix between chip body (13) and circuit board (12), a side surface that circuit board (12) were kept away from in backup pad (2) is provided with drive mechanism, drive mechanism includes first belt pulley (15), extension rod (16), second mount pad (17), second motor (18), mounting panel (19), first pivot (20), A second belt pulley (21), a belt (22), a first gear (23) and a second gear (24), wherein a first belt pulley (15) is fixedly arranged at one end of the cross rod (9) far away from the conveying roller (10), an extension rod (16) is fixedly arranged at the upper end of the first belt pulley (15) on the surface of the support plate (2), a second mounting seat (17) is fixedly arranged at one end of the extension rod (16) far away from the support plate (2), a second motor (18) is fixedly arranged inside the second mounting seat (17), the output shaft end of the second motor (18) is in transmission connection with the first belt pulley (15) through a shaft coupling, a mounting plate (19) is fixedly arranged on the outer side surface of the second sliding block (8), a first rotating shaft (20) is fixedly arranged on one side of the surface of the mounting plate (19), a second belt pulley (21) is fixedly arranged on one end of the first rotating shaft (20), a belt (22) is sleeved between the second belt pulley (21) and the first belt pulley (15), a first gear (23) is fixedly arranged in the middle of the outer side surface of the first rotating shaft (20), a second gear (24) is fixedly arranged at the lower end of one end, far away from the conveying roller (10), of the cross rod (9), the first gear (23) and the second gear (24) are meshed with each other, a tensioning mechanism is fixedly arranged in the middle of the outer side surface of the supporting plate (2), the tensioning mechanism comprises a second rotating shaft (25), a rotating block (26), a rotating rod (27), a third rotating shaft (28) and a tensioning wheel (29), the second rotating shaft (25) is movably arranged in the middle of the outer side surface of the supporting plate (2) through a bearing, the rotating block (26) is fixedly arranged on the outer side surface of the second rotating shaft (25), and the rotating block (27) is fixedly arranged, one end, far away from the rotating block (26), of the rotating rod (27) is provided with a third rotating shaft (28) through a bearing in a movable mode, a tensioning wheel (29) is fixedly arranged on the outer side surface of the third rotating shaft (28), the outer side surface of the tensioning wheel (29) and the belt (22) are mutually attached, and packaging mechanisms are arranged on two sides of the circuit board (12) at the upper end of the bottom plate (1).
2. The smart chip package structure of claim 1, wherein: the packaging mechanism comprises a supporting rod (30), a second sliding groove (31), a third sliding block (32), a second screw rod (33), a third mounting seat (34), a third motor (35), a first electric push rod (36), a shielding cover (37), an electromagnetic valve (38), an air suction pipe (39) and a liquid injection pipe (40), wherein the supporting rod (30) is fixedly arranged at the two sides of the circuit board (12) at the upper end of the bottom plate (1), the second sliding groove (31) is formed in the outer side surface of the supporting rod (30), the third sliding block (32) is movably clamped in the second sliding groove (31), the second screw rod (33) is movably arranged in the second sliding groove (31) through a bearing, the third sliding block (32) is movably sleeved on the outer side surface of the second screw rod (33) through threads, the third mounting seat (34) is fixedly arranged in the supporting rod (30) at the upper end of the second sliding groove (31), the utility model discloses a chip of chip's structure, including third mount pad (34), third motor (35) is fixed to inside being provided with of third mount pad (34), the output axle head of third motor (35) passes through the shaft coupling and is connected with the transmission between second screw rod (33), the inboard middle part of second slider (8) is fixed and is provided with first electric putter (36), the fixed cage (37) that is provided with of telescopic link axle head of first electric putter (36), the outer surface of chip body (13) is established to cage (37) cover, the fixed solenoid valve (38) that is provided with in cage (37) outside surface upper end, solenoid valve (38) outside fixed surface is provided with breathing pipe (39), the fixed notes liquid pipe (40) that is provided with of cage (37).
3. The smart chip package structure of claim 2, wherein: the lower end of the air suction pipe (39) is fixedly provided with a first connecting flange (41), and the lower end of the liquid injection pipe (40) is fixedly provided with a second connecting flange (42).
4. The smart chip package structure of claim 2, wherein: and a heat conduction copper pipe (43) is fixedly arranged on the side wall of the inner side of the isolation cover (37).
5. The smart chip package structure of claim 2, wherein: and a sealing ring (44) is fixedly arranged on the outer side surface of the isolation cover (37).
6. The smart chip package structure of claim 1, wherein: and mounting holes (45) are formed in four corners of the surface of the upper end of the bottom plate (1).
7. The smart chip package structure of claim 1, wherein: backup pad (2) surface one side activity is provided with rolling disc (46), the fixed fourth mount pad (47) that is provided with in inside one side of rolling disc (46), fourth mount pad (47) inside fixed fourth motor (48) that is provided with, the output axle head of fourth motor (48) is provided with fixture through the shaft coupling, the one side activity that backup pad (2) was kept away from in rolling disc (46) is provided with fourth pivot (50), fourth pivot (50) outside fixed surface is provided with transmission cylinder (51), be provided with conveyer belt (52) between transmission cylinder (51), fourth pivot (50) outside surface is provided with the torsional spring.
8. The smart chip package structure of claim 7, wherein: fixture includes fixed frame (49), telescopic link (53), splint (54), second electric putter (55), rubber pad (56), the output shaft end of fourth motor (48) is provided with fixed frame (49) through the shaft coupling is fixed, fixed frame (49) inside both sides all fixed telescopic link (53) that are provided with, telescopic link (53) one end is fixed and is provided with splint (54), fixed frame (49) inside is fixed between telescopic link (53) and is provided with second electric putter (55), fixed connection between one end that second electric putter (55) are close to splint (54) and splint (54), splint (54) outside surface is provided with rubber pad (56).
9. The method of claim 1, wherein the method further comprises: the method specifically comprises the following steps:
the first step is as follows: the circuit board (12) welded with the chip body (13) is clamped between the transmission belts (11), then the first motor (6) can be opened, the circuit board (12) can be driven by the first motor (6) to be transmitted, the transmission can be stopped when the position of the isolation cover (37) is transmitted, then the first electric push rod (36) is controlled to extend, the isolation cover (37) can be covered on the outer side surface of the chip body (13), the sealing effect of the isolation cover (37) can be improved when the isolation cover (37) is attached to the surface of the circuit board (12) through the sealing ring (44), then the electromagnetic valve (38) can be opened, then air between the isolation cover (37) and the chip body (13) is pumped out through the air suction pipe (39), so the influence of air and glue filling can be reduced, dust can be pumped away, and the isolation cover (37) can isolate the external environment, so can improve the glue-pouring effect, can carry out the injecting glue to cage (37) inside through annotating liquid pipe (40) afterwards, can accomplish the encapsulation after waiting glue cooling, and the device can process the two sides of circuit board (12) simultaneously when processing, need not to carry out the encapsulation of another side again after the encapsulation of one side finishes, thereby can improve machining efficiency, and the device is when carrying out the encapsulation effect, can drive second screw rod (33) through third motor (35) as required and rotate, so can drive third slider (32) through second screw rod (33) and reciprocate, so can make the position of cage (37) can adapt to the position that the chip was located;
a second step; when the device is used, the distance between the conveying rollers (10) can be adjusted as required, when in adjustment, only the first motor (6) is needed to drive the first screw rod (4) to rotate, and the threads on the upper side and the lower side of the first screw rod (4) are opposite, so that the first sliding block (7) and the second sliding block (8) can be driven to move in opposite directions, the distance between the conveying rollers (10) can be adjusted, and therefore circuit boards (12) with different sizes can be conveniently clamped, and when the first sliding block (7) and the second sliding block (8) move, if the first sliding block (7) and the second sliding block (8) are close to each other, the belt (22) can be loosened, at the moment, the fourth rotating shaft (50) can drive the rotating rod (27) and the tensioning wheel (29) to rotate clockwise through the torsion spring, the belt (22) can be automatically tensioned, and the belt (22) can be tightened if the first sliding block (7) and the second sliding block (8) are far away from each other, therefore, the rotating rod (27) can be automatically forced to rotate anticlockwise, the first sliding block (7) and the second sliding block (8) can be conveniently separated from each other, and the belt (22) can be always in a tensioning state no matter how the device adjusts the distance between the conveying rollers (10), so that the rotation of the conveying rollers (10) cannot be influenced;
the third step: the device encapsulates circuit board (12) after accomplishing when using and can enter into fixed frame (49) along with the transmission of transmission band (11) inside, can promote splint (54) through second electric putter (55) afterwards and get up circuit board (12) centre gripping, rolling disc (46) clockwise rotation afterwards, and drive fixed frame (49) through fourth motor (48) and rotate 90 degrees, so can make circuit board (12) lie in conveyer belt (52) upper end, can conveniently transmit the circuit board (12) that encapsulate this moment through conveyer belt (52), thereby can conveniently carry out the processing of next step.
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| CN202110057390.6A CN112599456B (en) | 2021-01-15 | 2021-01-15 | Intelligent chip packaging structure and application method thereof |
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| CN202110057390.6A CN112599456B (en) | 2021-01-15 | 2021-01-15 | Intelligent chip packaging structure and application method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114256109A (en) * | 2021-12-22 | 2022-03-29 | 荣耀智能(山东)电子有限公司 | Packaging manufacturing equipment for multi-chip integrated circuit |
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