CN112595433A - Glue sealing system and method for optical fiber sensing probe - Google Patents
Glue sealing system and method for optical fiber sensing probe Download PDFInfo
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- CN112595433A CN112595433A CN202011537809.XA CN202011537809A CN112595433A CN 112595433 A CN112595433 A CN 112595433A CN 202011537809 A CN202011537809 A CN 202011537809A CN 112595433 A CN112595433 A CN 112595433A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
- G01K11/32—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in transmittance, scattering or luminescence in optical fibres
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
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Abstract
The invention provides a glue sealing system and a glue sealing method for an optical fiber sensing probe, which solve the problems that the bonding position is easy to deviate and the product reliability is low in the existing optical fiber sensing probe sealing mode; long heat curing time and low efficiency. The system comprises an installation platform, a spectrum monitoring assembly, an optical fiber clamping assembly, a curing light source for realizing the precuring of the semiconductor wafer and the optical fiber, and an alignment lens for monitoring the positions of the semiconductor wafer and the optical fiber; the spectrum monitoring assembly comprises a light source driving circuit, a light source module, an optical fiber coupler, a spectrometer and a computer, wherein the light source driving circuit is connected with the input end of the light source module, the output of the light source module is connected with the input end of the optical fiber coupler, two outputs of the optical fiber coupler are respectively connected with the optical fiber holder at the upper end and the spectrometer, and the spectrometer is connected with the computer; the optical fiber clamping assembly comprises a three-dimensional adjusting support arranged on the mounting platform, a fixing frame arranged on the three-dimensional adjusting support, a rotating tool arranged on the fixing frame and N lower-end optical fiber clamping devices arranged on the rotating tool.
Description
Technical Field
The invention belongs to the field of optical fiber temperature sensors, relates to an optical fiber sensing probe glue sealing technology, and particularly relates to a glue sealing system and a glue sealing method for an optical fiber sensing probe.
Background
The optical fiber sensing technology is receiving more and more attention from various application industry fields due to its specific advantages. The optical fiber sensor is used as a core component of a test instrument, and the performance and reliability of the optical fiber sensor directly affect the technical level of the whole system. Because the optical fiber is very thin in size, most of the core probe part of the optical fiber sensor adopts the glue sealing process, and the process has extremely high index requirements on fine operation, convenience in operation, glue curing time, bonding firmness, high temperature resistant long-term reliability and the like, so that the glue sealing process of the optical fiber sensor is continuously improved and innovated to meet the requirement of continuous market development.
In the manufacturing process of the optical fiber sensing probe, the semiconductor wafer is small in size, needs to be bonded to the end face of the optical fiber, and needs to ensure that the signal strength before and after bonding and before and after curing is stable and unchanged.
The traditional glue sealing process comprises two modes, the first mode is that high-temperature resistant transparent glue is adopted and is coated on the end face of an optical fiber a little, and a semiconductor wafer is kept on the end face of the optical fiber by means of the natural adsorption force of the glue. After adsorption, the optical fiber is vertically placed in a reverse direction, the semiconductor wafer is flatly placed at the top end of the end face of the optical fiber, the whole semiconductor wafer enters the oven to be gradually heated for solidification, the semiconductor wafer is far away from an air outlet in the oven as far as possible in the solidification process, and the phenomenon that the signal intensity is reduced due to the fact that the semiconductor wafer deviates from the original position is avoided. The bonding method has the defects that the deviation change of the bonding position of the semiconductor wafer is easily caused by factors such as vibration, artificial collision, violent disturbance of air outlet of an oven and the like in the process of assembling and disassembling a tool table before solidification is finished, so that the signal intensity is reduced, the reliability of the sealing process is low, the signal intensity needs to be repeatedly measured in the process, the operation difficulty is increased, and in addition, the method greatly depends on the skill and the care degree of operators.
And secondly, placing the semiconductor wafer on a heating platform, coating glue on the end face of the optical fiber, then, tightly attaching the end face of the optical fiber to the center of the semiconductor wafer, opening a heating and curing furnace, and removing the optical fiber sensing probe (the structure formed by sealing the semiconductor wafer and the optical fiber) after the glue is cured. The glue curing method needs longer time, usually tens of minutes, and the next operation can be carried out after the previous curing is finished, so that the efficiency is lower. The method is feasible in the test stage, but is applied to the batch production stage, so that the production efficiency is greatly limited.
Disclosure of Invention
The method aims to solve the problems that the bonding position is easy to shift in the existing optical fiber sensing probe sealing mode, so that the reliability of a sealed product is low; or the technical problems of long thermal curing time and low batch processing efficiency exist, and the invention provides a glue sealing system and method for an optical fiber sensing probe.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
an adhesive sealing system for an optical fiber sensing probe, the optical fiber sensing probe comprising a semiconductor wafer and an optical fiber positioned above the semiconductor wafer, characterized in that:
the glue sealing system comprises an installation platform, a spectrum monitoring assembly, an optical fiber clamping assembly, a curing light source and an alignment lens;
the spectrum monitoring assembly comprises a light source driving circuit, a light source module, an optical fiber coupler, a spectrometer and a computer, wherein the output end of the light source driving circuit is connected with the input end of the light source module, the output end of the light source module is connected with the input end of the optical fiber coupler, one output end of the optical fiber coupler is provided with an upper-end optical fiber holder which is used for being connected with the upper end of an optical fiber, the other output end of the optical fiber coupler is connected with the spectrometer, and the spectrometer is connected with the computer;
the optical fiber clamping assembly comprises a three-dimensional adjusting support, a fixing frame, a rotating tool and N lower-end optical fiber clamping devices, wherein N is an integer larger than 1, the three-dimensional adjusting support is arranged on an installation platform, the fixing frame is arranged on the three-dimensional adjusting support and is positioned above the installation platform by about 20mm, the rotating tool is arranged on the fixing frame and can rotate on the fixing frame, the N lower-end optical fiber clamping devices are arranged on the rotating tool along the circumferential direction of the rotating tool, the optical fiber clamping devices are used for clamping optical fibers to prevent loosening, and the rotating tool is provided with N through holes matched with the N lower-end optical fiber clamping devices and used for allowing the optical fibers to pass through;
the three-dimensional adjusting bracket is used for adjusting the position of the optical fiber and realizing the alignment of the optical fiber and the semiconductor wafer on the mounting platform;
the alignment lens is arranged above the semiconductor wafer and used for monitoring the relative positions of the semiconductor wafer and the optical fiber;
the curing light source is used for realizing the pre-curing of the semiconductor wafer and the optical fiber.
Further, the N lower-end optical fiber holders are uniformly arranged along the circumferential direction of the rotary tool.
Furthermore, N scribed lines which correspond to the N lower-end optical fiber holders one by one are arranged on the rotary tool;
the fixing frame is provided with an initial reticle.
Furthermore, the fixing frame is provided with a groove for placing a rotary tool.
Further, an optical fiber connector is arranged between the upper end optical fiber holder and one output end of the optical fiber coupler.
Further, the curing light source is a light curing lamp;
the optical fiber coupler is a Y-shaped optical fiber coupler.
Further, it is characterized in that: the alignment lens is a microscope.
Meanwhile, the invention provides a glue sealing method for an optical fiber sensing probe, which is characterized in that: by adopting the glue sealing system for the optical fiber sensing probe, the glue sealing method comprises the following steps:
1) respectively clamping N optical fibers to be bonded on N lower-end optical fiber clampers, wherein the lower ends of the N bonded optical fibers respectively penetrate through N through holes of the rotary tool and then are positioned above the mounting platform;
2) defining that the N optical fibers to be bonded are respectively a first optical fiber, a second optical fiber and an … … Nth optical fiber which are sequentially arranged along the circumferential direction, and the first optical fiber is positioned in the illumination range of the curing light source;
mounting the upper end of the first optical fiber on an upper end optical fiber holder, and placing a semiconductor wafer on the mounting platform, wherein the semiconductor wafer is positioned below the first optical fiber;
3) turning on a light source driving circuit, driving a light source of a light source module to emit light by the light source driving circuit, and enabling an initial light signal to reach the semiconductor wafer in the step 2) after being emitted through the optical fiber coupler and the first optical fiber; the spectrometer collects the optical signals returned by the first optical fiber and the optical fiber coupler and displays the spectral curve on the computer in real time;
4) according to a spectrum curve displayed by a computer, the position of the first optical fiber is adjusted by adjusting the three-dimensional adjusting bracket until the peak intensity of the spectrum curve displayed by the computer reaches the maximum value;
5) coating UV mixed system glue on the lower end face of the first optical fiber, and adjusting the position of the first optical fiber through a three-dimensional adjusting bracket to enable a microscope to observe that the end face of the optical fiber is aligned with the center of the semiconductor wafer and is attached to the center;
6) turning on a curing light source, irradiating for tens of seconds, and separating the upper end of the first optical fiber from the upper end optical fiber holder to finish the pre-curing of the first optical fiber and the semiconductor wafer;
7) rotating the rotating tool to enable the second optical fiber to be located within the illumination range of the curing light source, placing a semiconductor wafer on the mounting platform again and located below the second optical fiber, and mounting the upper end of the second optical fiber on the upper-end optical fiber holder;
8) completing the pre-curing of the second optical fiber and the semiconductor wafer by using the methods from the step 3) to the step 6);
9) using the methods of the step 7) and the step 8) to finish the pre-curing of the third optical fiber to the Nth optical fiber and the semiconductor wafer;
10) and taking down the rotary tool with the N optical fibers, and heating for secondary curing.
Further, in the step 5), the UV mixing system adhesive is a UV mixing system adhesive produced by EPOTEK company and having a model number of HYB-353 ND.
Meanwhile, the invention also provides another glue sealing method for the optical fiber sensing probe, which is characterized in that: by adopting the glue sealing system for the optical fiber sensing probe, the glue sealing method comprises the following steps:
1) clamping an optical fiber to be bonded on one lower-end optical fiber holder, wherein the lower end of the optical fiber passes through the through hole of the rotary tool and then is positioned above the mounting platform;
2) rotating the rotary tool to enable the optical fiber in the step 1) to be positioned in the illumination range of a curing light source, installing the upper end of the optical fiber on an upper end optical fiber holder, and placing a semiconductor wafer on the installation platform, wherein the semiconductor wafer is positioned below the optical fiber;
3) turning on a light source driving circuit, driving a light source of a light source module to emit light by the light source driving circuit, and enabling an initial light signal to reach a semiconductor chip after being emitted through an optical fiber coupler and an optical fiber; the spectrometer collects the optical signals returned by the optical fiber and the optical fiber coupler and displays the spectral curve on the computer in real time;
4) according to a spectrum curve displayed by a computer, the position of the optical fiber is adjusted by adjusting the three-dimensional adjusting bracket until the peak intensity of the spectrum curve displayed by the computer reaches the maximum value;
5) coating UV mixed system glue on the lower end surface of the optical fiber in the step 1), and adjusting the position of the optical fiber through a three-dimensional adjusting bracket to ensure that the central position of the optical fiber end surface centering on the semiconductor wafer is observed by a microscope and is attached;
6) turning on a curing light source, irradiating for tens of seconds, separating the upper end of the optical fiber from the upper end optical fiber holder, and completing the pre-curing of the optical fiber and the semiconductor wafer on the lower end optical fiber holder in the step 1);
7) clamping the optical fiber on each lower-end optical fiber holder by using the method from the step 1) to the step 6), and completing the pre-curing of the optical fiber and the semiconductor wafer on the remaining N-1 lower-end optical fiber holders;
8) and taking down the rotary tool with the N optical fibers, and heating for secondary curing.
Compared with the prior art, the invention has the advantages that:
1. the glue sealing system monitors the optical signal returned after the semiconductor wafer is absorbed in real time through the spectrometer, and adjusts the position of the optical fiber through the three-dimensional adjusting bracket to realize the alignment of the optical fiber and the semiconductor wafer, so that the packaged optical fiber sensing probe has the advantages of stable signal and high packaging yield.
2. In the glue sealing system and method, the optical fiber clamping assembly comprises a rotating tool with N lower-end optical fiber clampers, each lower-end optical fiber clamper can clamp one optical fiber, and the optical fiber to be bonded is rotated to the illumination range of a curing light source through the rotation of the rotating tool, so that the precuring of a plurality of optical fibers and a semiconductor wafer can be realized, the time required by the precuring is short, the operation is convenient, and the production efficiency and the product quality are improved.
3. According to the glue sealing system and method, the rotary tool is provided with the N scribed lines, the fixed frame is provided with the initial scribed line, the rotary tool can accurately rotate through alignment of the scribed lines on the rotary tool and the initial scribed line, and the curing efficiency is improved.
4. In the glue sealing system, the optical fiber clamping component is provided with the rotary tool and the plurality of lower-end optical fiber clamps, the rotary tool can meet the requirement of one-time small-batch operation, the rotary tool can be taken down together with the optical fiber for secondary thermosetting after all the processes are finished, the rotary tool is simultaneously used as a support in the secondary heating and curing process, the complexity of secondary disassembly and assembly of the optical fiber before thermosetting is avoided, and the productivity and efficiency are further improved. The lower end optical fiber holder facilitates connection and separation of optical fibers, can meet transmission of optical signals during installation, adjustment and use, and can also meet the requirement of convenience in disassembly of the optical fibers.
5. According to the glue sealing method, N optical fibers can be fixed on a rotary tool through the lower end optical fiber holder, one semiconductor wafer is placed on the mounting platform each time through the rotation of the rotary tool, the position of the optical fiber is adjusted through the three-dimensional adjusting support, the precuring of each semiconductor wafer and the optical fiber is only dozens of seconds, the efficiency is high, and the operation is convenient; after all optical fibers and the semiconductor wafer are pre-cured, the rotary tool with the N optical fibers can be used as a whole for secondary curing, the secondary curing is simple and convenient, and the production efficiency and the product quality are greatly improved.
6. Compared with the traditional glue sealing mode, the unreliable factors before thermosetting are avoided, the productivity efficiency is improved, the UV hybrid system glue is selected, the optical precuring is carried out firstly when the UV hybrid system glue is used, the optical fiber and the semiconductor wafer are good in stability after curing, the precuring can be completed only by curing for dozens of seconds, the efficiency is high, and the operation is convenient; after the pre-curing is finished, secondary thermal curing can be realized in batches, so that the optical fiber sensing probe achieves stronger curing performance and temperature resistance degree, and the probe after thermal curing has high temperature resistance degree and strong bonding force.
Drawings
FIG. 1 is a schematic structural diagram of a glue sealing system for an optical fiber sensing probe according to the present invention;
FIG. 2 is a schematic structural diagram of an optical fiber clamping assembly in the optical fiber sensing probe sealing system according to the present invention;
wherein the reference numbers are as follows:
1-a light source driving circuit, 2-a light source module, 3-an alignment lens, 4-a curing light source, 5-a semiconductor wafer, 6-an optical fiber, 7-a rotating tool, 8-a fixing frame, 9-a three-dimensional adjusting bracket, 10-an optical fiber connector, 11-an optical fiber coupler, 12-a spectrometer, 13-an upper end optical fiber holder, 14-a lower end optical fiber holder, 15-a computer, 16-a mounting platform, 17-scribing and 18-starting scribing.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Example one
The invention analyzes the two traditional packaging modes, and both belong to single thermosetting packaging. The thermosetting mode has the defects of more curing stages and long time, but has strong bonding force, high curing firmness and outstanding high-temperature resistance. Compared with the prior art, the light curing mode has the advantage of high curing speed, but the traditional light curing glue is usually cured by adopting UV glue, so that the speed is high, but the temperature resistance is low. Therefore, the UV mixing system glue is adopted, when in use, the UV mixing system glue can be subjected to light pre-curing firstly, and then is subjected to heat curing after the curing is finished for tens of seconds, so that the UV mixing system glue achieves stronger curing performance and temperature resistance.
As shown in fig. 1, an adhesive sealing system for an optical fiber sensing probe, which is an encapsulated piece, includes a semiconductor wafer 5 and an optical fiber 6 located above the semiconductor wafer 5; the glue sealing system comprises a mounting platform 16, a spectrum monitoring assembly, a fiber clamping assembly, a curing light source 4, an alignment lens 3 and the mounting platform 16.
The spectrum monitoring assembly comprises a light source driving circuit 1, a light source module 2, an optical fiber coupler 11, a spectrometer 12 and a computer 15, the light source driving circuit 1 is connected with the input end of the light source module 2, the output end of the light source module 2 is connected with the input end of the optical fiber coupler 11, an output end of the optical fiber coupler 11 is provided with an optical fiber connector 10 used for being connected with the upper end of an optical fiber 6, the optical fiber 6 is connected with the optical fiber connector 10 through an upper end optical fiber holder 13, the other output end of the optical fiber coupler 11 is connected with the spectrometer 12, and the spectrometer 12 is connected with the computer 15. In this embodiment, the optical fiber coupler 11 is a Y-type optical fiber coupler 11, the spectrometer 12 is a micro spectrometer, and the optical fiber connector 10 is a ferrule-based coupler.
As shown in fig. 2, the optical fiber clamping assembly includes a three-dimensional adjusting bracket 9, a fixing bracket 8, a rotating tool 7 and N lower end optical fiber clamps 14, where N is an integer greater than 1, N is 12 in this embodiment, and in other embodiments, the number of N may be reasonably designed according to actual needs, the three-dimensional adjusting bracket 9 is disposed on the mounting platform 16, the fixing bracket 8 is disposed on the three-dimensional adjusting bracket 9 and located above the mounting platform 16 by about 20mm, a groove is disposed on the upper surface of the fixing bracket 8, the groove is a step-shaped through groove penetrating from the upper surface of the fixing bracket 8 to the lower surface of the fixing bracket 8, and a large end of the through groove is located at an end far from the mounting platform 16; rotatory frock 7 sets up in the groove main aspects that link up of mount 8, rotatory frock 7 can rotate on mount 8, 12 lower extreme fiber holder 14 evenly set up on rotatory frock 7 along 7 circumferencial directions of rotatory frock, and be equipped with on the rotatory frock 7 with 12 lower extreme fiber holder 14 complex 12 through-holes, the through-hole is used for supplying optic fibre 6 lower extreme to pass, lower extreme fiber holder 14 is used for pressing from both sides optic fibre 6, it is not hard up to prevent, three-dimensional regulation support 9 is used for adjusting the position of optic fibre 6, realize optic fibre 6 and 16 on the mounting platform alignment of semiconductor wafer 5, in this embodiment, three-dimensional regulation support 9 can be three-dimensional precision adjustment support.
The alignment lens 3 is disposed on the mounting platform 16, above the semiconductor wafer 5, and outside the rotary tool 7, and the alignment lens 3 is a microscope in this embodiment for monitoring the relative positions of the semiconductor wafer 5 and the optical fiber 6.
The curing light source 4 is arranged on the mounting platform 16, and the curing light source 4 is a light curing lamp and is used for irradiating the UV mixing system glue on the lower end face (used for being bonded with the semiconductor wafer 5) of the optical fiber 6 to cure the UV mixing system glue, so that the semiconductor wafer 5 and the optical fiber 6 are pre-cured.
The working process of the glue sealing system of the embodiment is as follows:
1) respectively clamping 12 optical fibers 6 to be bonded on 12 lower-end optical fiber clampers 14, wherein the lower ends of the 12 bonded optical fibers 6 respectively penetrate through 12 through holes of a rotary tool 7 and then are positioned above an installation platform 16;
before the optical fiber 6 is installed, the end faces of two ends of the optical fiber are ground in advance, the lower end of the optical fiber is plugged into the lower end optical fiber holder 14 during installation, the part of the bare fiber to be bonded at the lower end is exposed out of the ceramic ferrule of the lower end optical fiber holder 14, the lower end optical fiber holder 14 can clamp the optical fiber and can also be separated at any time, and the use is convenient; the lower end optical fiber holder 14 is vertically arranged on the rotary tool 7, and the perpendicularity of the optical fiber 6 to be bonded can be ensured by the longer ceramic ferrule inner hole of the lower end optical fiber holder 14;
2) defining that 12 optical fibers 6 to be bonded are respectively a first optical fiber, a second optical fiber and an … … twelfth optical fiber which are sequentially arranged along the circumferential direction, and the first optical fiber is positioned in the illumination range of the curing light source 4;
inserting the upper end of the first optical fiber into an upper end optical fiber holder 13, coupling the upper end optical fiber holder 13 with an optical fiber coupler 11 to realize signal transmission, and placing a semiconductor wafer 5 on a mounting platform 16, wherein the semiconductor wafer 5 is positioned below the first optical fiber; the upper end optical fiber holder 13 can clamp the optical fiber and can also be separated at any time, so the use is convenient;
3) the light source driving circuit 1 is turned on, the light source driving circuit 1 drives the light source of the light source module 2 to emit light, the initial optical signal reaches the optical fiber end face of the first optical fiber through the optical fiber coupler 11 and the optical fiber connector 10, the original optical signal reaches the semiconductor wafer 5 in the step 2) after being emitted, and the material absorbs the specific waveband of the spectrum; the returned light signal after the absorption of the semiconductor wafer 5 is emitted from the other end of the optical fiber coupler 11, collected by the spectrometer 12, and the spectrum curve is displayed in real time on the computer 15(PC upper computer software);
4) finely adjusting the position of the first optical fiber through the three-dimensional adjusting bracket 9 in real time according to the spectral curve displayed by the computer 15 until the peak intensity of the spectral curve displayed by the upper computer software of the computer 15 reaches the maximum value;
finally, the first optical fiber is accurately aligned with the semiconductor wafer 5, namely, the center of the end face of the first optical fiber is accurately aligned with the center of the semiconductor wafer 5;
5) coating a small amount of UV mixed system glue on the end face of the lower end face of the first optical fiber, observing through a microscope, adjusting the three-dimensional adjusting bracket 9 to enable the end face of the optical fiber to be centered on the central position of the semiconductor wafer and attached through the microscope, and enabling a spectrum curve peak intensity signal displayed by upper computer software to reach a maximum value at the moment;
6) then, the photocuring lamp is turned on, after tens of seconds, the upper end of the first optical fiber is separated from the upper end optical fiber holder 13, namely, the precuring of the first optical fiber and the semiconductor wafer 5 is completed, and the optical fiber is firmly bonded with the semiconductor wafer 5;
7) rotating the rotating tool 7 to enable the second optical fiber to be positioned in the illumination range of the curing light source 4, placing a semiconductor wafer 5 on the mounting platform 16 again and below the second optical fiber, and mounting the upper end of the second optical fiber on the upper-end optical fiber holder 13;
8) completing the pre-curing of the second optical fiber and the semiconductor wafer 5 by using the methods of the steps 3) to 6);
9) the method of the step 7) and the step 8) is repeatedly utilized to finish the pre-curing of the third optical fiber 6 to the twelfth optical fiber and the semiconductor wafer 5;
10) after the 12 optical fibers 6 to be bonded and the semiconductor wafer 5 are pre-cured, the rotary tool 7 (the lower end optical fiber holder 14 is fixed on the rotary tool 7) with the 12 optical fibers 6 (the semiconductor wafer 5 is pre-cured on the 12 optical fibers 6) is taken down, and the rotary tool 7 is placed in an oven in the opposite direction to perform secondary thermal curing of the wafer bonding glue.
In actual engineering processing, the number of the optical fiber holders 14 at the upper end and the lower end of the rotary tool can be increased according to needs, a plurality of sets of tools can be operated simultaneously and simultaneously thermally cured, the thermal curing time can be greatly shortened, and the production efficiency is improved.
The rotary tool 7 is provided with 12 scribed lines 17 corresponding to the positions of the 12 lower-end optical fiber holders 14 one by one, the 12 scribed lines 17 are uniformly distributed along the circumferential direction, a starting scribed line 18 is arranged on the fixing frame 8, preliminary alignment can be ensured, accurate rotation of the rotary tool 7 is realized through alignment of the scribed lines 17 on the rotary tool 7 and the starting scribed line 18, and the pre-curing efficiency is improved.
This embodiment is glued and is sealed the system and compare traditional gluey mode of sealing, avoid the unreliable factor before the thermosetting, and promote productivity efficiency, select UV hybrid system to glue, carry out light precuring earlier during the use, and optic fibre 6 is good with 5 stability of semiconductor wafer after the solidification, only need tens of seconds solidification can accomplish, after the precuring is accomplished, can realize the secondary thermosetting in batches, make optic fibre sensing probe reach stronger curing performance and temperature resistant degree, the probe temperature resistant degree after the thermosetting is high, the adhesion strength is strong. The UV mixing system adhesive is a UV mixing system adhesive with a model number of HYB-353ND, which is produced by EPOTEK company, is mainly a UV mixing system adhesive taking epoxy resin as a chemical base, and combines the bonding firmness of the epoxy resin and the quick curing function of the UV adhesive. The UV curing can be finished within dozens of seconds, the convenience of the calibration coupling and the operation process is facilitated, and in order to enhance the long-term bonding firmness, the secondary heat curing is performed for half an hour.
The optical fiber sensing probe prepared by the glue sealing system has the characteristic of high reliability, and the production efficiency and the product quality are greatly improved.
Example two
The difference from the first embodiment is that the working process of the glue sealing system is as follows:
1) an optical fiber 6 to be bonded is clamped on one lower-end optical fiber clamp 14, and the lower end of the optical fiber 6 passes through the through hole of the rotary tool 7 and then is positioned above the mounting platform 16;
2) rotating the rotating tool 7 to enable the optical fiber 6 in the step 1) to be positioned in the illumination range of the curing light source 4, installing the upper end of the optical fiber 6 on an upper end optical fiber holder 13, and placing a semiconductor wafer 5 on an installation platform 16, wherein the semiconductor wafer 5 is positioned below the optical fiber 6;
3) turning on the light source driving circuit 1, the light source driving circuit 1 drives the light source of the light source module 2 to emit light, the initial optical signal reaches the end face of the optical fiber 6 through the optical fiber coupler 11 and the optical fiber connector 10, and reaches the semiconductor wafer 5 in the step 2) after being emitted; the returned light signal after the absorption of the semiconductor wafer 5 is emitted from the other end of the optical fiber coupler 11, collected by the spectrometer 12, and the spectrum curve is displayed in real time on the computer 15(PC upper computer software);
4) according to the spectrum curve displayed by the computer 15, the rotating tool 7 is driven to move by finely adjusting the three-dimensional adjusting bracket 9 in real time, so that the position of the optical fiber 6 is adjusted until the peak intensity of the spectrum curve displayed by the upper computer software of the computer 15 reaches the maximum value; finally, the optical fiber 6 and the semiconductor wafer 5 are accurately aligned;
5) coating and smearing a small amount of UV mixed system glue on the lower end face of the optical fiber 6 in the step 1), observing through a microscope, adjusting the position of the optical fiber 6 through a three-dimensional adjusting bracket 9, enabling the end face of the optical fiber to be centered and attached to the central position of the semiconductor wafer through observation of the microscope, and enabling a spectrum curve peak intensity signal displayed by upper computer software to reach a maximum value at the moment;
6) then, turning on the curing light source 4, irradiating for tens of seconds, separating the upper end of the optical fiber 6 from the upper end optical fiber holder 13, and completing the pre-curing of the optical fiber 6 and the semiconductor wafer 5 on the lower end optical fiber holder 14 in the step 1);
7) clamping the optical fiber 6 on each lower end fiber holder 14 by using the method of the step 1) to the step 6), and completing the pre-curing of the optical fiber 6 and the semiconductor wafer 5 on the remaining 11 lower end fiber holders 14;
8) after the pre-curing of the 12 optical fibers 6 to be bonded and the semiconductor wafer 5 is completed, the rotary tool, the lower end optical fiber holder 14 and the 12 optical fibers bonded to the semiconductor wafer 5 are taken down together, and the assembly is placed in an oven in the opposite direction for secondary thermal curing of the wafer bonding glue.
In this embodiment, in order to improve the pre-curing efficiency of the plurality of optical fibers, the optical fibers 6 may be sequentially clamped on the lower-end fiber clamp 14 along the circumferential direction of the rotary tool 7, and the corresponding optical fibers 6 and the semiconductor wafer 5 may be pre-cured.
The above description is only for the purpose of describing the preferred embodiments of the present invention and does not limit the technical solutions of the present invention, and any known modifications made by those skilled in the art based on the main technical concepts of the present invention fall within the technical scope of the present invention.
Claims (10)
1. An adhesive sealing system for an optical fiber sensing probe, the optical fiber sensing probe comprising a semiconductor wafer (5) and an optical fiber (6) located above the semiconductor wafer (5), characterized in that:
the glue sealing system comprises a mounting platform (16), a spectrum monitoring assembly, an optical fiber clamping assembly, a curing light source (4) and an alignment lens (3);
the spectrum monitoring assembly comprises a light source driving circuit (1), a light source module (2), an optical fiber coupler (11), a spectrometer (12) and a computer (15), wherein the output of the light source driving circuit (1) is connected with the input end of the light source module (2), the output end of the light source module (2) is connected with the input end of the optical fiber coupler (11), one output end of the optical fiber coupler (11) is provided with an upper-end optical fiber holder (13) used for being connected with the upper end of an optical fiber (6), the other output end of the optical fiber coupler (11) is connected with the spectrometer (12), and the spectrometer (12) is connected with the computer (15);
the optical fiber clamping assembly comprises a three-dimensional adjusting support (9), a fixing frame (8), a rotating tool (7) and N lower-end optical fiber clamping devices (14), wherein N is an integer greater than 1, the three-dimensional adjusting support (9) is arranged on an installation platform (16), the fixing frame (8) is arranged on the three-dimensional adjusting support (9), the rotating tool (7) is arranged on the fixing frame (8) and can rotate on the fixing frame (8), the N lower-end optical fiber clamping devices (14) are arranged on the rotating tool (7) along the circumferential direction of the rotating tool (7), and the rotating tool (7) is provided with N through holes which are matched with the N lower-end optical fiber clamping devices (14) and used for the optical fibers (6) to pass through;
the three-dimensional adjusting bracket (9) is used for adjusting the position of the optical fiber (6) and realizing the alignment of the optical fiber (6) and the semiconductor wafer (5) on the mounting platform (16);
the alignment lens (3) is arranged above the semiconductor wafer (5) and is used for monitoring the relative positions of the semiconductor wafer (5) and the optical fiber (6);
the curing light source (4) is used for pre-curing the semiconductor wafer (5) and the optical fiber (6).
2. The system of claim 1, wherein: the N lower-end optical fiber holders (14) are uniformly arranged along the circumferential direction of the rotary tool (7).
3. The system of claim 2, wherein: n scribed lines (17) which correspond to the N lower-end optical fiber holders (14) one by one are arranged on the rotary tool (7);
the fixed frame (8) is provided with an initial marking line (18).
4. The system of claim 3, wherein: and a groove for placing the rotary tool (7) is formed in the fixing frame (8).
5. The system of claim 1, wherein: and an optical fiber connector (10) is arranged between the upper end optical fiber holder (13) and one output end of the optical fiber coupler (11).
6. The system of claim 1, wherein: the curing light source (4) is a light curing lamp;
the optical fiber coupler (11) is a Y-shaped optical fiber coupler (11).
7. The system of any one of claims 1 to 6, wherein: the alignment lens (3) is a microscope.
8. A glue sealing method for an optical fiber sensing probe is characterized in that: the glue sealing system for the optical fiber sensing probe according to any one of claims 1 to 7 is adopted, and the glue sealing method comprises the following steps:
1) the N optical fibers (6) to be bonded are respectively clamped on the N lower-end optical fiber clamps (14), and the lower ends of the N bonded optical fibers (6) respectively penetrate through the N through holes of the rotary tool (7) and then are positioned above the mounting platform (16);
2) defining N optical fibers (6) to be bonded as a first optical fiber, a second optical fiber and an … … Nth optical fiber which are sequentially arranged along the circumferential direction, wherein the first optical fiber is positioned in the illumination range of the curing light source (4);
mounting the upper end of the first optical fiber on an upper end fiber holder (13), and placing a semiconductor wafer (5) on a mounting platform (16), wherein the semiconductor wafer (5) is positioned below the first optical fiber;
3) the light source driving circuit (1) drives the light source of the light source module (2) to emit light, and the initial light signal is emitted through the optical fiber coupler (11) and the first optical fiber and then reaches the semiconductor wafer (5) in the step (2); the spectrometer (12) collects the optical signal returned by the first optical fiber and the optical fiber coupler (11), and displays the spectral curve on the computer (15) in real time;
4) according to a spectrum curve displayed by the computer (15), the position of the first optical fiber is adjusted by adjusting the three-dimensional adjusting bracket (9) until the peak intensity of the spectrum curve displayed by the computer (15) reaches the maximum value;
5) coating UV mixing system glue on the lower end face of the first optical fiber, and adjusting the position of the first optical fiber through a three-dimensional adjusting bracket (9) to enable the end face of the optical fiber (6) to be aligned with the central position of the semiconductor wafer (5) and be attached to the central position under the observation of a microscope;
6) turning on a curing light source (4), irradiating for tens of seconds, separating the upper end of the first optical fiber from an upper end optical fiber holder (13), and completing the pre-curing of the first optical fiber and the semiconductor wafer (5);
7) rotating the rotating tool (7) to enable the second optical fiber to be located in the illumination range of the curing light source (4), placing a semiconductor wafer (5) on the mounting platform (16) again, locating the semiconductor wafer below the second optical fiber, and mounting the upper end of the second optical fiber on the upper-end optical fiber holder (13);
8) completing the pre-curing of the second optical fiber and the semiconductor wafer (5) by using the methods from step 3) to step 6);
9) using the method of the step 7) and the step 8) to finish the pre-curing of the third optical fiber (6) to the Nth optical fiber and the semiconductor wafer (5);
10) and taking down the rotary tool (7) with the N optical fibers (6), and heating for secondary curing.
9. The method of claim 8, further comprising: in the step 5), the UV mixed system glue is produced by EPOTEK company and is HYB-353 ND.
10. A glue sealing method for an optical fiber sensing probe is characterized in that: the glue sealing system for the optical fiber sensing probe according to any one of claims 1 to 7 is adopted, and the glue sealing method comprises the following steps:
1) an optical fiber (6) to be bonded is clamped on one lower-end optical fiber clamp holder (14), and the lower end of the optical fiber (6) passes through a through hole of the rotary tool (7) and then is positioned above the mounting platform (16);
2) rotating the rotary tool (7) to enable the optical fiber (6) in the step 1) to be positioned in the illumination range of the curing light source (4), installing the upper end of the optical fiber (6) on an upper end optical fiber holder (13), and placing a semiconductor wafer (5) on an installation platform (16), wherein the semiconductor wafer (5) is positioned below the optical fiber (6);
3) the light source driving circuit (1) is turned on, the light source driving circuit (1) drives the light source of the light source module (2) to emit light, and the initial light signal is emitted through the optical fiber coupler (11) and the optical fiber (6) and then reaches the semiconductor wafer (5); the spectrometer (12) collects the optical signals returned by the optical fiber (6) and the optical fiber coupler (11), and displays the spectral curve on the computer (15) in real time;
4) according to a spectrum curve displayed by the computer (15), the position of the optical fiber (6) is adjusted by adjusting the three-dimensional adjusting bracket (9) until the peak intensity of the spectrum curve displayed by the computer (15) reaches the maximum value;
5) coating UV mixed system glue on the lower end face of the optical fiber (6) in the step 1), and adjusting the position of the optical fiber (6) through a three-dimensional adjusting bracket (9) to enable a microscope to observe that the end face of the optical fiber (6) is aligned with the central position of the semiconductor wafer (5) and is attached to the central position;
6) turning on a curing light source (4), irradiating for tens of seconds, separating the upper end of the optical fiber (6) from the upper end optical fiber holder (13), and completing the pre-curing of the optical fiber (6) and the semiconductor wafer (5) on the lower end optical fiber holder (14) in the step 1);
7) clamping the optical fiber (6) on each lower-end optical fiber holder (14) by using the method from the step 1) to the step 6), and completing the pre-solidification of the optical fiber (6) and the semiconductor wafer (5) on the remaining N-1 lower-end optical fiber holders (14);
8) and taking down the rotary tool (7) with the N optical fibers (6), and heating for secondary curing.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011537809.XA CN112595433A (en) | 2020-12-23 | 2020-12-23 | Glue sealing system and method for optical fiber sensing probe |
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| CN202011537809.XA CN112595433A (en) | 2020-12-23 | 2020-12-23 | Glue sealing system and method for optical fiber sensing probe |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113776689A (en) * | 2021-08-31 | 2021-12-10 | 西安和其光电科技股份有限公司 | High-precision multidimensional adjustment alignment system and method for optical fiber sensor packaging |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113776689A (en) * | 2021-08-31 | 2021-12-10 | 西安和其光电科技股份有限公司 | High-precision multidimensional adjustment alignment system and method for optical fiber sensor packaging |
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