CN113776689A - High-precision multidimensional adjustment alignment system and method for optical fiber sensor packaging - Google Patents
High-precision multidimensional adjustment alignment system and method for optical fiber sensor packaging Download PDFInfo
- Publication number
- CN113776689A CN113776689A CN202111014920.5A CN202111014920A CN113776689A CN 113776689 A CN113776689 A CN 113776689A CN 202111014920 A CN202111014920 A CN 202111014920A CN 113776689 A CN113776689 A CN 113776689A
- Authority
- CN
- China
- Prior art keywords
- optical fiber
- adjusting
- optical
- camera assembly
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013307 optical fiber Substances 0.000 title claims abstract description 121
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 17
- 230000003287 optical effect Effects 0.000 claims abstract description 74
- 239000004065 semiconductor Substances 0.000 claims abstract description 70
- 238000001179 sorption measurement Methods 0.000 claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 39
- 238000012544 monitoring process Methods 0.000 claims abstract description 21
- 230000008878 coupling Effects 0.000 claims abstract description 17
- 238000010168 coupling process Methods 0.000 claims abstract description 17
- 238000005859 coupling reaction Methods 0.000 claims abstract description 17
- 238000001228 spectrum Methods 0.000 claims abstract description 9
- 235000012431 wafers Nutrition 0.000 claims description 128
- 239000003292 glue Substances 0.000 claims description 8
- 238000005286 illumination Methods 0.000 claims description 6
- 230000001154 acute effect Effects 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 5
- 230000000007 visual effect Effects 0.000 claims description 2
- 230000007306 turnover Effects 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 8
- 230000000712 assembly Effects 0.000 description 6
- 238000000429 assembly Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000013519 translation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
- G01K11/32—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in transmittance, scattering or luminescence in optical fibres
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention provides a high-precision multidimensional adjustment alignment system and method for packaging an optical fiber sensor, which solve the problems that the conventional semiconductor wafer is coupled with an optical fiber, the wafer is easy to scratch, the coated surface is easy to turn over, the surface is easy to be dirty, the wafer is difficult to put down after being clamped, and alignment adjustment is time-consuming. The system comprises an optical platform, a wafer adsorption material box, an optical fiber clamping assembly, a display unit, a spectrum monitoring unit, a first adjusting base and a second adjusting base which are arranged on the optical platform, a first camera assembly arranged on the first adjusting base, and a second camera assembly arranged on the second adjusting base; the wafer adsorption material box is arranged on the optical platform; the optical fiber clamping assembly is erected on the optical platform through three-dimensional adjustment; the plane of the upper surface of the wafer adsorption material box is an XY plane; the display unit comprises an X-Z display interface and a Y-Z display interface which are respectively connected with the first camera component and the second camera component; the spectrum monitoring unit comprises a signal coupling monitoring module and an upper computer connected with the signal coupling monitoring module.
Description
Technical Field
The invention relates to the field of optical fiber sensor packaging, in particular to a high-precision multi-dimensional adjusting and aligning system and method for optical fiber sensor packaging.
Background
Semiconductor materials have absorption bands for the spectrum and, as temperature increases, the absorption bands are red shifted. By means of the principle, accurate temperature measurement can be achieved. And precisely coupling the cut semiconductor wafer with the optical fiber, and monitoring the displacement of the semiconductor material absorption spectrum band to realize optical fiber sensing temperature measurement. The precise coupling of the semiconductor wafer and the end face of the optical fiber is a key process for packaging the optical fiber sensor. Because the diameter of the optical fiber core and the size of the cut wafer are very small, the cut wafer is difficult to be clamped accurately, and in addition, the operation requirement of the precise alignment coupling of the optical fiber is extremely high.
And (3) cutting the wafer and accurately clamping: since the size of the wafer to be cut is very small, the precise gripping is usually performed manually by means of ultra-high precision tweezers. This approach has a number of disadvantages: (1) the hardness of the semiconductor material is usually soft, and the wafer is easily scratched by a metal tweezers when the semiconductor material is observed under a high-power microscope. (2) The very small size of the wafer is too light to be easily set down after being gripped by the tweezers due to electrostatic attraction.
(3) The upper and lower surfaces of the wafer are plated with dielectric films, one surface is a transmission film, the other surface is a reflection film, and the transmission surface is upward according to the process requirement. However, after the tweezers are used for clamping, the wafer is easy to turn over in the process of putting down, so that the reflecting film faces upwards; and in the process of correcting the direction of the wafer, a great amount of dust is easily attached to the film coating surface, so that the light transmission efficiency of the transmission surface is influenced. (4) The wafers are light and are easily blown away by ambient air flow when placed on the stage.
Precision alignment coupling of optical fibers: the precise alignment of the optical fiber is mainly observed by means of a high-power microscope, and the conventional mode is to adopt a single microscope to incline and select a certain magnification factor to observe the alignment state of the optical fiber and a wafer. This approach suffers from the following disadvantages: (1) because the microscope must be placed in an inclined mode, a certain observation angle exists, and the plane where the wafer is located is defined as an XY plane, the central alignment of X, Y in two axial directions is difficult to be considered simultaneously by a single microscope, and when a certain distance exists between the optical fiber and the wafer, a certain parallax exists between an X-Z plane and a Y-Z plane, so that misjudgment of an operator is easily caused. Only when the fiber end face is close enough to the wafer upper surface can a marginal decision be made as to whether the fiber axis is aligned with the wafer center. (2) After each wafer replacement, the position of the wafer is changed, the field of view of the high power microscope is usually very small, and the wafer is easy to get out of the field of view. At the moment, the operator needs to turn down the magnification of the microscope, finds the wafer to be assembled, then adjusts the first wheel of the position of the microscope, adjusts the position of the wafer to the center of the view field, and simultaneously turns up the magnification of the microscope step by step to see the details clearly. Thus, the time consumption for each time of the position adjustment greatly influences the production efficiency.
Disclosure of Invention
In order to solve the coupling of the existing semiconductor wafer and the end face of an optical fiber, the wafer is clamped by tweezers, so that the wafer is easy to scratch, the coated surface is easy to turn over, dirt is easy to adhere to the surface, and the wafer is difficult to put down after clamping; the invention also provides a high-precision multi-dimensional adjusting alignment system and method for packaging an optical fiber sensor, and solves the technical problems that the alignment adjustment takes long time and the production efficiency is influenced when a wafer is replaced.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
a high-precision multidimensional adjustment and alignment system for packaging an optical fiber sensor is characterized in that: the optical fiber laser alignment device comprises an optical platform, a wafer adsorption material box, an optical fiber clamping assembly, a three-dimensional adjusting frame, a first alignment unit, a second alignment unit, a display unit and a spectrum monitoring unit;
the wafer adsorption material box is arranged on the optical platform, and can move on the optical platform;
the optical fiber clamping assembly is arranged on the optical platform through the three-dimensional adjusting frame and used for clamping the optical fiber to be assembled, and the three-dimensional adjusting frame is used for adjusting the position of the optical fiber so as to realize the alignment of the optical fiber and the semiconductor wafer on the wafer adsorption material box;
defining that the plane of the upper surface of the wafer adsorption material box is an XY plane;
the first alignment unit comprises a first adjusting base arranged on the optical platform and a first camera component which is arranged on the first adjusting base and the lower end of which inclines to one side of the wafer adsorption material box;
the second alignment unit comprises a second adjusting base arranged on the optical platform and a second camera component which is arranged on the second adjusting base and the lower end of which inclines to one side of the wafer adsorption material box;
the first adjusting base is used for adjusting the position of the first camera component, so that the optical axis of the first camera component is positioned on an XZ plane, and the included angle between the optical axis of the first camera component and the XY plane is an acute angle;
the display unit comprises an X-Z display interface and a Y-Z display interface which are respectively connected with the first camera assembly and the second camera assembly;
the spectrum monitoring unit comprises a signal coupling monitoring module and an upper computer, wherein one end of the signal coupling monitoring module is used for being connected with the optical fiber, and the other end of the signal coupling monitoring module is connected with the upper computer.
Furthermore, the first adjusting base comprises an installation platform fixed on the optical platform, a one-dimensional adjusting frame arranged on the installation platform, a two-dimensional precise adjusting frame arranged on the one-dimensional adjusting frame and a rotary adjusting frame arranged on the two-dimensional precise adjusting frame;
the first camera assembly is mounted on a rotary adjusting frame of the first adjusting base, a one-dimensional adjusting frame of the first adjusting base is used for coarse translational adjustment of the first camera assembly along the Y direction and the Z direction, a two-dimensional precise adjusting frame is used for fine translational adjustment of the first camera assembly along the X direction and the Z direction, and the rotary adjusting frame is used for precise rotary adjustment of the first camera assembly around the Y axis in the XZ plane;
the second adjusting base has the same structure as the first adjusting base;
the second camera assembly is mounted on a rotary adjusting frame of the second adjusting base, a one-dimensional adjusting frame of the second adjusting base is used for coarse translational adjustment of the second camera assembly along the X direction and the Z direction, a two-dimensional precise adjusting frame is used for fine translational adjustment of the second camera assembly along the Y direction and the Z direction, and the rotary adjusting frame is used for precise rotary adjustment of the second camera assembly around the X axis in the YZ plane.
Furthermore, the included angle between the optical axis of the first camera assembly and the XY plane and the included angle between the optical axis of the second camera assembly and the XY plane are equal and are both 30-60 degrees.
Furthermore, the first camera component and the second camera component have the same structure and respectively comprise a camera, a high-magnification lens and an illumination light source which are sequentially connected, and the illumination light source is arranged close to the optical platform; and a magnification gear shifting hand wheel is arranged on the high-magnification lens.
Further, the display device also comprises an image display screen bracket for supporting the display unit;
furthermore, the X-Z display interface and the first camera assembly, and the Y-Z display interface and the second camera assembly are connected through HDMI connecting wires.
Meanwhile, the invention also provides a method for packaging the optical fiber sensor, which is characterized by comprising the following steps:
1) installation and adjustment
1.1) placing a wafer adsorption material box provided with a semiconductor wafer on an optical platform, and clamping an optical fiber on an optical fiber clamping component;
1.2) defining that the plane of the upper surface of the wafer adsorption material box is an XY plane, adjusting the position of an optical fiber through a three-dimensional adjusting frame to enable the optical fiber to be arranged right above a semiconductor wafer, wherein the space position of the semiconductor wafer is a three-dimensional coordinate origin;
2) correcting field of view axes of first and second camera assemblies
The first camera assembly is mounted on the optical platform through the first adjusting base, and the first camera assembly is translated along the Y axis and the Z coarse axis through the first adjusting base until the semiconductor wafer and the optical fiber are observed in the X-Z display interface; then, the first camera component is precisely translated along the X direction and the Z direction, and precisely rotated around the Y axis in the XZ plane, so that the optical axis of the first camera component is positioned on the XZ plane and passes through the three-dimensional coordinate origin of the step 1.2);
the second camera assembly is installed on the optical platform through a second adjusting base and roughly translates along the X axis and the Z axis through the second adjusting base until the semiconductor wafer and the optical fiber are observed in the Y-Z display interface; then, the second camera component is precisely translated along the Y direction and the Z direction and precisely rotated around the X axis in the YZ plane, so that the optical axis of the second camera component is positioned on the YZ plane and passes through the three-dimensional coordinate origin in the step 1.2);
3) adhesive package
3.1) placing a wafer adsorption material box filled with a semiconductor wafer to be sealed on an optical platform;
3.2) moving the wafer adsorption material box until any semiconductor wafer to be sealed is placed in the center of the view field of the X-Z display interface and the Y-Z display interface;
3.3) clamping the optical fiber to be sealed at the front end of the optical fiber clamping component, and arranging adhesive glue on the lower end surface of the optical fiber;
3.4) finely adjusting the position of the optical fiber to be sealed in the step 3.3) through a three-dimensional adjusting frame, so that the central axis of the optical fiber is superposed with the center of the semiconductor wafer to be sealed in the step 2.2);
meanwhile, the optical fiber to be sealed moves along the Z axis, and the signal intensity in the upper computer is monitored until the signal intensity reaches the best;
3.5) carrying out photocuring on the bonding glue to complete the fixation of the optical fiber and the semiconductor wafer; taking the optical fiber sealed with the semiconductor wafer down from the optical fiber clamping component;
3.6) adopting the method from the step 3.2) to the step 3.5) to finish the packaging of all the semiconductor wafers and the optical fibers on the wafer adsorption box.
Compared with the prior art, the invention has the advantages that:
1. the system and the method of the invention cancel the clamping of the semiconductor wafer, adopt the wafer to absorb the magazine to be regarded as the objective table directly, the thin silica gel layer in the box absorbs and fixes the semiconductor wafer naturally, through moving the wafer and absorbing the magazine, realize the selection to the semiconductor wafer; after the optical fiber and the semiconductor wafer are accurately aligned and well glued, the semiconductor wafer can be easily lifted to be separated from the wafer adsorption material box; the whole operation process does not need to be clamped by tweezers, and the problems of coating surface overturning and surface fouling can not occur.
2. The system and the method of the invention adopt two independent camera assemblies, respectively observe the center alignment of one dimension surface to achieve accurate adjustment alignment, and after the position of the camera assemblies is adjusted, the camera assemblies do not need to be adjusted again in the sealing process, thereby greatly solving the problems of repeated adjustment and low efficiency in the prior art.
3. The method preliminarily adjusts and defines origin coordinates (the optical axes of the two camera assemblies and the optical fiber intersect at the same point and are also the position of the semiconductor wafer), the optical fiber is replaced each time and clamped at the same position of the optical fiber clamping assembly, and the position of the selected semiconductor wafer is positioned at the center of a view field each time. After camera subassembly position control is good, need not readjustment, only need remove wafer adsorption material box and change optic fibre at every turn, the fine setting hand wheel that only needs three-dimensional alignment jig of fine setting in very little within range, alright reach accurate counterpoint with high efficiency rapidly, and counterpoint adjustment time is short, very big improvement production efficiency.
Drawings
FIG. 1 is a schematic structural diagram of a high-precision multi-dimensional adjustment alignment system for packaging an optical fiber sensor according to the present invention;
FIG. 2 is an enlarged view of a portion of the semiconductor wafer of FIG. 1 at the interface with the optical fiber;
FIG. 3 is a schematic structural diagram of a first adjusting base in the high-precision multi-dimensional adjusting and aligning system for packaging an optical fiber sensor according to the present invention;
FIG. 4 is a schematic structural diagram of a first camera assembly in a high-precision multi-dimensional adjustment alignment system for packaging an optical fiber sensor according to the present invention;
wherein the reference numbers are as follows:
1-a first adjusting base, 2-a first camera component fixing frame, 3-a first camera component, 4-a second adjusting base, 5-a second camera component fixing frame, 6-a second camera component, 7-an optical platform, 8-a three-dimensional adjusting frame, 9-an optical fiber clamping component, 10-a wafer adsorption material box, 11-a semiconductor wafer, 12-an optical fiber, 13-an image display screen bracket, 14-X-Z display interface, 15-Y-Z display interface, 16-HDMI connecting wire, 17-a display unit, 18-a signal coupling monitoring module, 19-an upper computer and 20-an optical fiber clamping tool locking nut;
1-1-one-dimensional adjusting frame, 1-11-first frame body, 1-12-second frame body, 1-2-mounting platform, 1-3-two-dimensional precise adjusting frame and 1-4-rotary adjusting frame;
1-5-a first adjusting hand wheel, 1-6-a second adjusting hand wheel, 1-7-a third adjusting hand wheel, 1-8-a fourth adjusting hand wheel, and 1-9-a fifth adjusting hand wheel;
3-1-camera, 3-2-high magnification lens, 3-3-lighting source and 3-4-magnification gear shifting hand wheel;
8-1-a first fine adjustment hand wheel, 8-2-a second fine adjustment hand wheel, and 8-3-a third fine adjustment hand wheel.
Detailed Description
The invention is described in further detail below with reference to the figures and specific embodiments.
As shown in fig. 1 and fig. 2, the high-precision multi-dimensional adjustment alignment system for optical fiber sensor package of the present invention includes an optical platform 7, a wafer adsorption magazine 10, a fiber holding assembly 9, a first alignment unit, a second alignment unit, a display unit 17, and a spectrum monitoring unit.
The wafer adsorption material box 10 is arranged on the optical platform 7, and the material of the wafer adsorption material box 10 is silica gel; the wafer adsorption material box 10 is used for placing a semiconductor wafer 11 to be packaged, the thin silica gel layer in the wafer adsorption material box 10 naturally adsorbs and fixes the semiconductor wafer 11, and after the optical fiber and the semiconductor wafer are accurately aligned and well adhered, the semiconductor wafer can be easily lifted to be separated from the wafer adsorption material box.
Defining that the plane of the upper surface of the wafer adsorption material box 10 is an XY plane;
the first alignment unit comprises a first adjusting base 1 vertically arranged on the optical platform 7 and a first camera assembly 3 obliquely arranged on the first adjusting base 1; the first adjusting base 1 is a multidimensional combined precise adjusting base and is used for adjusting the position of the first camera component 3, as shown in fig. 3, the first adjusting base 1 comprises a mounting platform 1-2 fixed on an optical platform 7, a one-dimensional adjusting frame 1-1 arranged on the mounting platform 1-2, a two-dimensional precise adjusting frame 1-3 arranged on the one-dimensional adjusting frame 1-1 and a rotary adjusting frame 1-4 arranged on the two-dimensional precise adjusting frame 1-3; the one-dimensional adjusting frame 1-1 comprises a first frame body 1-11 arranged on the mounting platform 1-2 and a second frame body 1-12 arranged on the first frame body 1-11, and adjusting hand wheels of the first frame body 1-11 and the second frame body 1-12 are respectively a first adjusting hand wheel 1-5 and a second adjusting hand wheel 1-6; the two-dimensional precise adjusting frame 1-3 is arranged on the second frame body 1-12, the adjusting hand wheels of the two-dimensional precise adjusting frame comprise third adjusting hand wheels 1-7 and fourth adjusting hand wheels 1-8, the adjusting hand wheels of the adjusting frame 1-4 are rotated to be fifth adjusting hand wheels 1-9, and each adjusting part is provided with a corresponding locking mechanism;
the first camera assembly 3 is mounted on a rotary adjusting frame 1-4 of the first adjusting base 1 through a first camera assembly fixing frame 2, the optical axis of the first camera assembly 3 is perpendicular to the rotary axis of the rotary adjusting frame 1-4 of the first adjusting base 1, a first adjusting hand wheel 1-5 is used for driving a first frame body 1-11 to move along the Y direction, a second adjusting hand wheel 1-6 is used for driving a second frame body 1-12 to move along the Z direction, namely the one-dimensional adjusting frame 1-1 realizes the rough translation adjustment of the first camera assembly 3 along the Y direction and the Z direction; a third adjusting hand wheel 1-7 and a fourth adjusting hand wheel 1-8 of the two-dimensional precise adjusting frame 1-3 are used for fine translation adjustment of the first camera component 3 along the X direction and the Z direction, a fifth adjusting hand wheel 1-9 of the rotary adjusting frame 1-4 is used for precise rotation adjustment of the first camera component 3 around the Y axis in the XZ plane, and finally the optical axis of the first camera component 3 is located on the XZ plane and an included angle between the optical axis of the first camera component 3 and the XY plane is an acute angle;
the second alignment unit and the first alignment unit are respectively arranged on two adjacent sides of the optical platform 7, the second alignment unit comprises a second adjusting base 4 arranged on the optical platform 7 and a second camera component 6 obliquely arranged on the second adjusting base 4, the second adjusting base 4 is used for adjusting the position of the second camera component 6, the second adjusting base 4 is the same as the first adjusting base 1 in structure, the second camera component 6 is arranged on a rotary adjusting frame 1-4 of the second adjusting base 4 through a second camera component fixing frame 5, the optical axis of the second camera component 6 is vertical to the rotary axis of the rotary adjusting frame 1-4 of the second adjusting base 4, the second camera component fixing frame 5 is the same as the first camera component fixing frame 2 in structure, the one-dimensional adjusting frame 1-1 of the second adjusting base 4 is used for rough translation adjustment of the second camera component 6 along the X direction and the Z direction, the two-dimensional precise adjusting frames 1-3 are used for fine translation adjustment of the second camera assembly 6 along the Y direction and the Z direction, and the rotary adjusting frames 1-4 are used for precise rotation adjustment of the second camera assembly 6 around the X axis in the YZ plane, so that the optical axis of the second camera assembly 6 is located on the YZ plane, and the included angle between the optical axis and the XY plane is an acute angle;
in the adjusting process of the positions of the first camera component 3 and the second camera component 6, the intersection point of the optical axis of the first camera component 3 and the optical axis of the second camera component 6 needs to be located on an XY plane, and the two camera components are independent and vertical to each other;
as shown in fig. 4, the first camera component 3 and the second camera component 6 have the same structure, and are both high-resolution visual camera components 3-1, the camera components 3-1 include a camera 3-1, a high-magnification lens 3-2 and an illumination light source 3-3 which are connected in sequence, and the illumination light source 3-3 is arranged close to the optical platform 7; and a magnification shift hand wheel 3-4 is arranged on the high-magnification lens 3-2.
The optical fiber clamping assembly 9 is arranged on the optical platform 7 through the three-dimensional adjusting frame 8, and the optical fiber clamping assembly 9 is arranged adjacent to the second adjusting base 4 and located on the same side of the optical platform 7. The optical fiber clamping component 9 is used for clamping an optical fiber 12 to be assembled, and an optical fiber clamping tool locking nut 20 is connected to the optical fiber clamping component 9 and used for fastening the optical fiber 12; the three-dimensional adjusting frame 8 is used for adjusting the position of the optical fiber 12 to realize the alignment of the optical fiber 12 and the semiconductor wafer 11 on the wafer adsorption box 10, and the X, Y, Z three-direction fine-tuning hand wheels of the three-dimensional adjusting frame 8 are respectively a first fine-tuning hand wheel 8-1, a second fine-tuning hand wheel 8-2 and a third fine-tuning hand wheel 8-3.
The display unit 17 comprises an X-Z display interface 14 and a Y-Z display interface 15 connected to the first camera assembly 3 and the second camera assembly 6, respectively; in this embodiment, the X-Z display interface 14 and the first camera assembly 3, and the Y-Z display interface and the second camera assembly 6 are connected via HDMI connection lines 16. The display unit 17 is supported by the image display screen support 13.
The spectrum monitoring unit comprises a signal coupling monitoring module 18 and an upper computer 19, wherein one end of the signal coupling monitoring module 18 is used for being connected with the upper end of the optical fiber 12, and the other end of the signal coupling monitoring module is connected with the upper computer 19.
The method for sealing the semiconductor wafer 11 and the optical fiber 12 by the high-precision multi-dimensional adjustment alignment system of the embodiment comprises the following steps:
1) installation and adjustment
1.1) placing a wafer adsorption material box 10 provided with a semiconductor wafer 11 in a working area of an optical platform 7, vertically clamping an optical fiber 12 with a ground end face at the front end of an optical fiber clamping component 9, and locking the optical fiber 12 through an optical fiber clamping tool locking nut 20;
wherein the semiconductor wafer 11 has a rectangular parallelepiped cut to a size of 0.2 × 0.1;
the optical fiber 12 is a polyimide coated high-temperature resistant quartz optical fiber 12, and the core diameter specification is 62.5/125 um;
1.2) finely adjusting three fine adjusting hand wheels (a first fine adjusting hand wheel 8-1, a second fine adjusting hand wheel 8-2 and a third fine adjusting hand wheel 8-3) of the three-dimensional adjusting frame 8, and preliminarily visually observing to enable the optical fiber 12 clamped in the step 1.1) to be placed right above the semiconductor wafer 11 on the wafer adsorption box 10, wherein the space position of the semiconductor wafer 11 is defined as a three-dimensional coordinate origin (0,0, 0);
2) correcting the field of view axis of the first and second camera assemblies 3, 6
As shown in fig. 1, the first camera assembly 3 is tiltably mounted on the optical bench 7 through the first adjustment base 1; as shown in fig. 3, the first adjustment handwheel 1-5 of the first adjustment base 1 is adjusted to translate the first camera assembly 3 along the Y-axis, the second adjustment handwheel 1-6 of the first adjustment base 1 is adjusted to translate the first camera assembly 3 along the Z-axis while observing the X-Z display interface 14, and the semiconductor wafer 11 and the optical fiber 12 enter the field of view of the X-Z display interface 14 in step 1.1). And then precisely adjusting a third adjusting hand wheel 1-7, a fourth adjusting hand wheel 1-8 and a fifth adjusting hand wheel 1-9 of the first adjusting base 1, and finally adjusting until the optical axis of the first camera component 3 passes through a three-dimensional coordinate origin (0,0,0), wherein at the moment, the semiconductor wafer 11 is positioned in the center of the view field of the X-Z display interface 14.
Similarly, as shown in fig. 1, the second camera assembly 6 is mounted on the optical platform 7 by tilting through the second adjustment base 4; adjusting the first adjusting handwheel 1-5 of the second adjusting base 4 to enable the second camera assembly 6 to translate along the X axis, adjusting the second adjusting handwheel 1-6 of the second adjusting base 4 to enable the second camera assembly 6 to translate along the Z axis, observing the Y-Z display interface 15 at the same time, and adjusting to the view field that the semiconductor wafer 11 and the optical fiber 12 enter the Y-Z display interface 15 in the step 1.1). Then precisely adjusting a third adjusting hand wheel 1-7, a fourth adjusting hand wheel 1-8 and a fifth adjusting hand wheel 1-9 of the second adjusting base 4, and finally adjusting until the optical axis of the second camera assembly 6 passes through a three-dimensional coordinate origin (0,0,0), wherein at the moment, the semiconductor wafer 11 is positioned at the center of the view field of the Y-Z display interface 15;
in the adjusting process, the adjusting range of the included angle between the optical axis of the first camera component 3 and the XY plane is 30-60 degrees, the adjusting range of the included angle between the optical axis of the second camera component 6 and the XY plane is 30-60 degrees, preferably, the included angle between the optical axis of the first camera component 3 and the XY plane is equal to the included angle between the optical axis of the second camera component 6 and the XY plane, and the included angle is preferably 45 degrees in the embodiment;
3) adhesive package
After the initial position of the system is adjusted, the semiconductor wafers 11 in batches can be bonded and packaged, and the specific operations are as follows:
3.1) assembling the semiconductor wafer 11 to be sealed on the wafer adsorption material box 10, and then placing the wafer adsorption material box 10 provided with the semiconductor wafer 11 to be sealed on the working area of the optical platform 7;
3.2) moving the wafer adsorption box 10, observing an X-Z display interface 14 and a Y-Z display interface 15 of a microscope display screen at the same time, and selecting a semiconductor wafer 11 to be sealed and simultaneously placing the semiconductor wafer in the center of the fields of view of the X-Z display interface 14 and the Y-Z display interface 15;
3.3) vertically clamping the optical fiber 12 to be sealed with the ground end face at the front end of the optical fiber clamping assembly 9, locking the optical fiber 12 through a locking nut 20 of an optical fiber clamping tool, and dipping a proper amount of bonding glue on the lower end face of the optical fiber 12 to be sealed;
3.4) observing a display screen, and finely adjusting three fine adjustment hand wheels of the three-dimensional adjusting frame 8 to ensure that the central axis of the optical fiber 12 to be sealed is superposed with the center of the semiconductor wafer 11 to be sealed in the step 3.2);
meanwhile, the signal intensity in the upper computer 19 is monitored, and the optical fiber 12 to be sealed moves up and down along the Z axis until the signal intensity reaches the best; wherein, when the polished end face of the optical fiber 12 to be sealed is tightly attached to the upper surface of the semiconductor wafer 11, the signal is optimal;
3.5) opening an ultraviolet lamp to irradiate the position of the semiconductor wafer 11, and carrying out photocuring on the bonding glue, wherein the bonding glue selected in the embodiment is cured, the curing glue is high-temperature-resistant epoxy glue which can be photocured in advance for a short time and then thermally cured for tens of seconds, and the optical fiber 12 and the semiconductor wafer 11 are sealed and connected; after the solidification, the optical fiber 12 sealed with the semiconductor wafer 11 is taken down from the optical fiber clamping assembly 9 and transferred to the next procedure;
thus, the above-mentioned methods from step 3.2) to step 3.5) are repeated to complete the packaging of all the semiconductor wafers 11 to be sealed and the optical fibers 12 on the wafer suction box 10.
In this embodiment, the high-precision multi-dimensional adjustment alignment system firstly defines a three-dimensional coordinate origin through a semiconductor wafer 11 and an optical fiber 12 (the optical axis of the first camera module 3 and the optical axis of the second camera module 6 intersect with the optical fiber 12 at the same point, which is also the position of the semiconductor wafer 11 itself), corrects the view field axes of two independent and mutually perpendicular micro-industrial cameras (the first camera module 3 and the second camera module 6) through the three-dimensional coordinate origin, and respectively observes the center alignment of a dimension plane, thereby achieving the precise adjustment alignment.
After the first camera component 3 and the second camera component 6 are corrected, the optical fiber 12 is replaced every time and clamped at the same position of the optical fiber clamping component 9; and, each selected wafer placement position is centered in the field of view; the advantage of this design is that after the camera assembly position is adjusted, no further adjustment is necessary. Only the wafer adsorption material box 10 is required to be moved (the semiconductor wafer 11 is simultaneously arranged in the center of the view field of the X-Z display interface 14 and the Y-Z display interface 15) and the optical fiber 12 is required to be replaced at each time, and the fine adjustment hand wheel of the three-dimensional adjusting frame 8 is required to be finely adjusted in a very small range, so that accurate alignment can be rapidly and efficiently achieved, the batch packaging of the semiconductor wafers 11 and the optical fiber 12 can be realized, the operation is efficient and rapid, and the production efficiency is greatly improved.
The above description is only for the preferred embodiment of the present invention and does not limit the technical solution of the present invention, and any modifications made by those skilled in the art based on the main technical idea of the present invention belong to the technical scope of the present invention.
Claims (7)
1. A high-precision multidimensional adjustment alignment system for packaging an optical fiber sensor is characterized in that: the device comprises an optical platform (7), a wafer adsorption material box (10), an optical fiber clamping assembly (9), a three-dimensional adjusting frame (8), a first alignment unit, a second alignment unit, a display unit (17) and a spectrum monitoring unit;
the wafer adsorption material box (10) is arranged on the optical platform (7);
the optical fiber clamping assembly (9) is arranged on the optical platform (7) through the three-dimensional adjusting frame (8), the optical fiber clamping assembly (9) is used for clamping an optical fiber (12) to be assembled, the three-dimensional adjusting frame (8) is used for adjusting the position of the optical fiber (12), and alignment of the optical fiber (12) and a semiconductor wafer (11) on the wafer adsorption material box (10) is realized;
defining that the plane of the upper surface of the wafer adsorption material box (10) is an XY plane;
the first alignment unit comprises a first adjusting base (1) arranged on the optical platform (7) and a first camera assembly (3) arranged on the first adjusting base (1);
the second alignment unit comprises a second adjusting base (4) arranged on the optical platform (7) and a second camera assembly (6) arranged on the second adjusting base (4);
the first adjusting base (1) is used for adjusting the position of the first camera component (3), so that the optical axis of the first camera component (3) is located on an XZ plane, an included angle between the optical axis of the first camera component (3) and an XY plane is an acute angle, the second adjusting base (4) is used for adjusting the position of the second camera component (6), so that the optical axis of the second camera component (6) is located on a YZ plane, an included angle between the optical axis of the second camera component (6) and the XY plane is an acute angle, and the intersection point of the optical axis of the first camera component (3) and the optical axis of the second camera component (6) is located on the XY plane;
the display unit (17) comprises an X-Z display interface (14) and a Y-Z display interface (15) which are respectively connected with the first camera assembly (3) and the second camera assembly (6);
the spectrum monitoring unit comprises a signal coupling monitoring module (18) and an upper computer (19), one end of the signal coupling monitoring module (18) is used for being connected with the optical fiber (12), and the other end of the signal coupling monitoring module is connected with the upper computer (19).
2. The system of claim 1, comprising: the first adjusting base (1) comprises a mounting platform (1-2) fixed on the optical platform (7), a one-dimensional adjusting frame (1-1) arranged on the mounting platform (1-2), a two-dimensional precise adjusting frame (1-3) arranged on the one-dimensional adjusting frame (1-1) and a rotary adjusting frame (1-4) arranged on the two-dimensional precise adjusting frame (1-3);
the first camera assembly (3) is mounted on a rotary adjusting frame (1-4) of the first adjusting base (1), the one-dimensional adjusting frame (1-1) of the first adjusting base (1) is used for coarse translational adjustment of the first camera assembly (3) along the Y direction and the Z direction, the two-dimensional precise adjusting frame (1-3) is used for fine translational adjustment of the first camera assembly (3) along the X direction and the Z direction, and the rotary adjusting frame (1-4) is used for rotary adjustment of the first camera assembly (3) around the Y axis in the XZ plane;
the second adjusting base (4) has the same structure as the first adjusting base (1);
the second camera assembly (6) is mounted on a rotary adjusting frame (1-4) of the second adjusting base (4), the one-dimensional adjusting frame (1-1) of the second adjusting base (4) is used for coarse translational adjustment of the second camera assembly (6) along the X direction and the Z direction, the two-dimensional precise adjusting frame (1-3) is used for fine translational adjustment of the second camera assembly (6) along the Y direction and the Z direction, and the rotary adjusting frame (1-4) is used for rotary adjustment of the second camera assembly (6) in the YZ plane around the X axis.
3. The system of claim 2, wherein: the included angle between the optical axis of the first camera assembly (3) and the XY plane and the included angle between the optical axis of the second camera assembly (6) and the XY plane are equal and are both 30-60 degrees.
4. The system of claim 1, wherein: the first camera assembly (3) and the second camera assembly (6) are identical in structure and respectively comprise a camera (3-1), a high-magnification lens (3-2) and an illumination light source (3-3) which are sequentially connected, and the illumination light source (3-3) is arranged close to the optical platform (7); a magnification shift hand wheel (3-4) is arranged on the high-magnification lens (3-2).
5. The high-precision multi-dimensional adjusting and aligning system for the optical fiber sensor package according to any one of claims 1 to 4, wherein: also comprises an image display screen bracket (13) for supporting the display unit (17).
6. The system of claim 1, wherein: the X-Z display interface (14) and the first camera assembly (3) as well as the Y-Z display interface (15) and the second camera assembly (6) are connected through HDMI connecting lines (16).
7. A method for a fiber optic sensor package, comprising the steps of:
1) installation and adjustment
1.1) placing a wafer adsorption material box (10) provided with a semiconductor wafer (11) on an optical platform (7) and clamping an optical fiber (12) on an optical fiber clamping component (9);
1.2), defining that the plane of the upper surface of the wafer adsorption material box (10) is an XY plane, and adjusting the position of the optical fiber (12) through the three-dimensional adjusting frame (8) to ensure that the optical fiber (12) is arranged right above the semiconductor wafer (11), wherein the space position of the semiconductor wafer (11) is a three-dimensional coordinate origin;
2) correcting the field of view axis of a first camera assembly (3) and a second camera assembly (6)
The first camera assembly (3) is mounted on the optical platform (7) through the first adjusting base (1), and the first camera assembly (3) is roughly translated along the Y axis and the Z axis through the first adjusting base (1) until the semiconductor wafer (11) and the optical fiber (12) are observed in the X-Z display interface (14); then, the first camera component (3) is precisely translated along the X direction and the Z direction, and is rotated around the Y axis in the XZ plane, so that the optical axis of the first camera component (3) is positioned on the XZ plane and passes through the three-dimensional coordinate origin of the step 1.2);
and the second camera assembly (6) is mounted on the optical platform (7) through the second adjustment base (4), and the second camera assembly (6) is roughly translated along the X-axis and the Z-axis through the second adjustment base (4) until the semiconductor wafer (11) and the optical fiber (12) are observed in the Y-Z display interface (15); then, the second camera assembly (6) is precisely translated along the Y direction and the Z direction and rotated around the X axis in the YZ plane, so that the optical axis of the second camera assembly (6) is positioned on the YZ plane and passes through the three-dimensional coordinate origin of the step 1.2);
3) adhesive package
3.1) placing a wafer adsorption material box (10) provided with a semiconductor wafer (11) to be sealed on an optical platform (7);
3.2) moving the wafer adsorption box (10) until any semiconductor wafer (11) to be sealed is simultaneously placed in the center of the visual field of the X-Z display interface (14) and the Y-Z display interface (15);
3.3) clamping the optical fiber (12) to be sealed at the front end of the optical fiber clamping component (9), and arranging adhesive glue on the lower end face of the optical fiber (12);
3.4) finely adjusting the position of the optical fiber (12) to be sealed in the step 3.3) through a three-dimensional adjusting frame (8), so that the central axis of the optical fiber (12) is superposed with the center of the semiconductor wafer (11) to be sealed in the step 2.2);
meanwhile, the optical fiber (12) to be sealed moves along the Z axis, and the signal intensity in the upper computer (19) is monitored until the signal intensity reaches the best;
3.5) carrying out light curing on the bonding glue to finish the fixation of the optical fiber (12) and the semiconductor wafer (11); removing the optical fiber (12) with the semiconductor chip (11) sealed thereon from the optical fiber holding assembly (9);
3.6) adopting the method from the step 3.2) to the step 3.5) to finish the packaging of all the semiconductor wafers (11) and the optical fibers (12) on the wafer adsorption material box (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111014920.5A CN113776689A (en) | 2021-08-31 | 2021-08-31 | High-precision multidimensional adjustment alignment system and method for optical fiber sensor packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111014920.5A CN113776689A (en) | 2021-08-31 | 2021-08-31 | High-precision multidimensional adjustment alignment system and method for optical fiber sensor packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113776689A true CN113776689A (en) | 2021-12-10 |
Family
ID=78840307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111014920.5A Pending CN113776689A (en) | 2021-08-31 | 2021-08-31 | High-precision multidimensional adjustment alignment system and method for optical fiber sensor packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113776689A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001242355A (en) * | 2000-03-01 | 2001-09-07 | Kyocera Corp | Optical module and method for manufacturing the same |
| CN209674056U (en) * | 2019-05-08 | 2019-11-22 | 武汉匠泽自动化设备有限公司 | A kind of manual fiber coupling equipment |
| CN112595433A (en) * | 2020-12-23 | 2021-04-02 | 西安和其光电科技股份有限公司 | Glue sealing system and method for optical fiber sensing probe |
-
2021
- 2021-08-31 CN CN202111014920.5A patent/CN113776689A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001242355A (en) * | 2000-03-01 | 2001-09-07 | Kyocera Corp | Optical module and method for manufacturing the same |
| CN209674056U (en) * | 2019-05-08 | 2019-11-22 | 武汉匠泽自动化设备有限公司 | A kind of manual fiber coupling equipment |
| CN112595433A (en) * | 2020-12-23 | 2021-04-02 | 西安和其光电科技股份有限公司 | Glue sealing system and method for optical fiber sensing probe |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110625256B (en) | Optical fiber coupling and welding device for butterfly laser | |
| JP4667952B2 (en) | Camera module adjustment device and adjustment method | |
| CN109507779B (en) | Lens clamp mechanism for automatic coupling packaging of butterfly-shaped semiconductor laser | |
| CN104779320A (en) | Method for producing concentrator photovoltaic unit, production apparatus used in the method, method for producing concentrator photovoltaic module, and production apparatus used in the method | |
| US20030011899A1 (en) | Method and structure for aligning optical elements | |
| JP2005198103A (en) | Apparatus and method for assembling camera module | |
| CN111645101A (en) | Micro device clamping and absorbing coupling equipment and machining method thereof | |
| CN114905247A (en) | Upper and lower lens base assembling equipment for high-precision optical lens | |
| CN109848554B (en) | Optical fiber automatic angle adjusting welding device | |
| CN113776689A (en) | High-precision multidimensional adjustment alignment system and method for optical fiber sensor packaging | |
| US20030063870A1 (en) | Microassembly and method for using same | |
| JPH11345955A (en) | Integrated lens solid-state image sensor and method and device for mounting lens thereof | |
| KR20160129651A (en) | Apparatus for manufacturing a camera module | |
| CN219234288U (en) | High-precision ultraviolet double-sided scribing mechanism | |
| CN110174776A (en) | A kind of more manual centralising devices of lens module high-precision optical of flexibility | |
| CN115847038A (en) | Full-automatic lens assembling and dispensing all-in-one machine and production line thereof | |
| CN209858870U (en) | Flexible multi-lens module high-precision optical manual centering device | |
| US11510351B2 (en) | Systems and methods for precision placement of components | |
| JP2002111197A (en) | Method and apparatus for replacing component | |
| CN216804802U (en) | Device for realizing glass fitting | |
| JP2008129180A (en) | Centering method of lens for compact camera lens unit, lens centering device, and compact camera lens unit manufactured by using same method or device | |
| CN117641082B (en) | Automatic core equipment of adjusting of on-vehicle camera AA | |
| CN114810763B (en) | Light engine assembling device and assembling method | |
| CN114810762B (en) | Light engine assembling device and assembling method | |
| CN114527552B (en) | Full-automatic large reflecting mirror assembly equipment and working method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |