CN112588363A

CN112588363A - Semiconductor material multi-stage reduction device

Info

Publication number: CN112588363A
Application number: CN202011351793.3A
Authority: CN
Inventors: 不公告发明人
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-11-26
Filing date: 2020-11-26
Publication date: 2021-04-02

Abstract

The invention discloses a semiconductor material multistage crushing device, which comprises: a base; four corners of the bottom end of the first shell are fixedly provided with first supporting legs, and the first supporting legs are fixedly arranged on one side of the top end of the base; the first pair of roller crushing assemblies are fixedly arranged in the inner cavity of the first shell; four corners of the bottom end of the second shell are fixedly provided with second supporting legs, and the second supporting legs are fixedly arranged on the other side of the top end of the base; the second pair of roller crushing assemblies are fixedly arranged in the inner cavity of the second shell; and the screening mechanism is arranged between the first shell and the second shell. This semiconductor material multi-stage reduction device carries out the breakage to the material through a lot of, has improved crushing strength to reach recycle's requirement, and very big save process time, reduced staff's the clearance degree of difficulty, avoid causing personnel's injury, improve the security of operation.

Description

Semiconductor material multi-stage reduction device

Technical Field

The invention relates to the technical field of semiconductors, in particular to a multistage crushing device for semiconductor materials.

Background

The semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device manufactured by adopting the semiconductor, the importance of the semiconductor is very great from the viewpoint of science and technology or economic development, most electronic products, such as computers, mobile phones or digital recorders, have very close association with the semiconductor, and common semiconductor materials comprise silicon, germanium, gallium arsenide and the like;

old and useless semiconductor material can be retrieved, in order to extract useful material, must be broken with it in the recovery process, traditional broken mode, crushing strength is not enough, be difficult to reach recycle's requirement, need take out the material after smashing and smash once more, very big wasted process time, and smash the in-process with old and useless material, cause the material outwards to jump out easily under the breakage of crushing roller, thereby not only increased staff's the degree of difficulty of picking up, still cause personnel's injury easily, the security is relatively poor.

Disclosure of Invention

The invention aims to provide a multistage crushing device for semiconductor materials, which aims to solve the problems that in the background technology, the crushing strength is insufficient, the requirement on recycling is difficult to meet, the crushed materials need to be taken out and crushed again, the processing time is greatly wasted, the difficulty in picking up workers is increased, the workers are easy to hurt, and the safety is poor.

In order to achieve the purpose, the invention provides the following technical scheme: a semiconductor material multi-stage reduction apparatus comprising:

a base;

four corners of the bottom end of the first shell are fixedly provided with first supporting legs, and the first supporting legs are fixedly arranged on one side of the top end of the base;

the first pair of roller crushing assemblies are fixedly arranged in the inner cavity of the first shell;

four corners of the bottom end of the second shell are fixedly provided with second supporting legs, and the second supporting legs are fixedly arranged on the other side of the top end of the base;

the second pair of roller crushing assemblies are fixedly arranged in the inner cavity of the second shell;

a sifting mechanism disposed between the first housing and the second housing;

the top end of the first shell is in a through shape and is provided with a protection mechanism.

Preferably, the top of base is provided with the conveyer belt along left right direction is fixed, just first casing with the bottom opening part of second casing all is located the top of conveyer belt.

Preferably, the crushing subassembly of first pair of roller is for tearing the crushing roller to along the left and right sides direction setting, the inner chamber top of first casing is provided with first baffle from last to the inboard slope down, just the bottom of first baffle is located the top of the crushing subassembly of first pair of roller.

Preferably, the second pair of roller crushing assemblies are strip toothed rollers and are arranged along the front-back direction, the inner cavity of the second shell is provided with a second baffle plate which inclines inwards from top to bottom, and the bottom end of the second baffle plate is located above the second pair of roller crushing assemblies.

Preferably, the sifting mechanism comprises: the top end of one side of the second shell is provided with a strip-shaped hole along the front-back direction, and the screening plate is inserted into the inner cavity of the strip-shaped hole; the guide arm, the left and right sides of sieve movable plate all pegs graft and has the guide arm, is located one side the guide arm is fixed to be set up the inside wall in bar hole, and is located the opposite side the guide arm is fixed to be set up the inboard of first supporting leg.

Preferably, the sifting mechanism further comprises: the fixing plate is fixedly arranged on one side of the bottom end of the first shell; the motor is fixedly arranged on one side of the fixing plate; the annular column is fixedly arranged on one side of the screening plate along the vertical direction; the output end of the motor extends out of one side of the fixed plate and is fixedly provided with a rotating plate; and the inserting column is fixedly arranged on one side of the rotating plate and is matched and spliced with the inner cavity of the annular column.

The multistage crushing device for the semiconductor material, provided by the invention, has the beneficial effects that:

1. the screening mechanism can control the screening plate to oscillate back and forth, so that the semiconductor material crushed by the first pair of roller crushing assemblies can be transferred into the second shell, the material meeting the requirement can be screened and dropped onto the conveying belt, the material not meeting the requirement is crushed again under the action of the second pair of roller crushing assemblies so as to meet the crushing requirement and directly drop onto the conveying belt for transfer, and the material is crushed for multiple times, so that the crushing strength is improved, the recycling requirement is met, and the processing time is greatly saved.

2. The protection mechanism can protect the upper part of the first shell, so that the semiconductor material is prevented from jumping out when being crushed, the cleaning difficulty of workers is reduced, the workers are prevented from being injured, and the operation safety is improved.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a front cross-sectional view of the present invention;

FIG. 3 is an exploded view of the sifting mechanism of the present invention;

fig. 4 is a schematic diagram of an explosive structure of the shielding mechanism of the present invention.

In the figure: 1. the base, 2, first casing, 3, first supporting leg, 4, the broken subassembly of first pair of roller, 5, the second casing, 6, the second supporting leg, 7, the broken subassembly of second pair of roller, 8, sieve moving mechanism, 81, sieve moving plate, 82, bar hole, 83, the guide arm, 84, the fixed plate, 85, the motor, 86, the ring post, 87, the rotor plate, 88, insert the post, 9, protection machanism, 91, the guard plate, 92, the rectangular hole, 93, the bull stick, 94, the feed plate, 95, the torsional spring, 96, the cardboard, 10, the conveyer belt, 11, first baffle, 12, the second baffle.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a semiconductor material multi-stage reduction apparatus comprising: the device comprises a base 1, a first shell 2, a first supporting leg 3, a first pair of roller crushing assemblies 4, a second shell 5, a second supporting leg 6, a second pair of roller crushing assemblies 7, a sieving mechanism 8 and a protection mechanism 9, wherein the first supporting leg 3 is fixedly arranged at four corners of the bottom end of the first shell 2, the first supporting leg 3 is fixedly arranged at one side of the top end of the base 1, the first pair of roller crushing assemblies 4 are fixedly arranged in an inner cavity of the first shell 2, the first pair of roller crushing assemblies 4 are in the prior art and can automatically control two rollers to rotate towards the inner side, the second supporting leg 6 is fixedly arranged at four corners of the bottom end of the second shell 5, the second supporting leg 6 is fixedly arranged at the other side of the top end of the base 1, the second pair of roller crushing assemblies 7 are fixedly arranged in the inner cavity of the second shell 5, the second pair of roller crushing assemblies 7 are in the prior art and can automatically control the two rollers, the sifting mechanism 8 is disposed between the first casing 2 and the second casing 5, and the top end of the first casing 2 is through and provided with a guard mechanism 9.

As preferred scheme, still further, the top of base 1 is provided with conveyer belt 10 along left and right sides direction is fixed, and the bottom opening part of first casing 2 and second casing 5 all is located the top of conveyer belt 10, and conveyer belt 10 is prior art, and steerable conveyer belt 10 is to one side transmission to in order to transmit the semiconductor material after smashing.

As preferred scheme, still further, broken subassembly 4 of first pair of roller is the shredding roller to along left right direction setting, can carry out quick shredding to semiconductor materials, the inner chamber top of first casing 4 is provided with first baffle 11 from last to the inboard slope down, and the bottom of first baffle 11 is located the top of broken subassembly 4 of first pair of roller, can block semiconductor materials through being provided with first baffle 11.

As a preferred scheme, furthermore, the second pair of roller crushing assemblies 7 are long toothed rollers and are arranged along the front-back direction, the incompletely crushed semiconductor material can be crushed again, the crushing effect is good, the inner cavity of the second shell 5 is obliquely provided with a second baffle plate 12 from top to bottom towards the inner side, the bottom end of the second baffle plate 12 is positioned above the second pair of roller crushing assemblies 7, and the second baffle plate 12 is arranged, so that the second pair of roller crushing assemblies 7 can be helped to crush the material.

Preferably, the sieving mechanism 8 further includes: sieve movable plate 81, bar hole 82 and guide arm 83, bar hole 82 has been seted up along the fore-and-aft direction on one side top of second casing 5, sieve movable plate 81 pegs graft mutually with the inner chamber in bar hole 82, sieve movable plate 81 is from the right side to the downward sloping setting in a left side, sieve movable plate 81's the left and right sides all is pegged graft and is had guide arm 83, can make sieve movable plate 81 steady movement under the restriction of guide arm 83, be located the fixed inside wall that sets up in bar hole 82 of one side guide arm 83, and be located the fixed inboard that sets up at first supporting leg 3 of opposite side guide arm 83.

Preferably, the sieving mechanism 8 further comprises: the fixed plate 84, the motor 85, the annular column 86, the rotating plate 87 and the inserting column 88, the fixed plate 84 is fixedly arranged on one side of the bottom end of the first shell 2, the motor 85 is fixedly arranged on one side of the fixed plate 84, the motor 85 is in the prior art, the motor 85 can drive the rotating plate 87 to rotate, the motor models conforming to the scheme can be used, the annular column 86 is fixedly arranged on one side of the sieving plate 81 along the vertical direction, the output end of the motor 85 extends out of one side of the fixed plate 84 and is fixedly provided with the rotating plate 87, one side of the rotating plate 87 is fixedly provided with the inserting column 88, the inserting column 88 can do clockwise circular motion around the output end of the motor 85, the inserting column 88 is in matched and inserted connection with the inner cavity of the annular column 86, the inserting column 88 does up-and-down movement in the inner cavity of the annular column 86, and then the.

Preferably, the protection mechanism 9 further includes: the semiconductor material packaging device comprises a protection plate 91, a rectangular hole 92, a rotating rod 93, a feeding plate 94, a torsional spring 95 and a clamping plate 96, wherein the protection plate 91 is fixedly arranged at the top end of the first shell 2, the semiconductor material can be prevented from jumping out under the action of tearing through the protection plate 91, the rectangular hole 92 is formed in the front side of the top end of the protection plate 91, the rotating rod 93 is rotatably arranged on the front side of the inner cavity of the rectangular hole 92 in the left-right direction, the feeding plate 94 is fixedly arranged on the outer wall of the rotating rod 93, the feeding plate 94 is in adaptive insertion connection with the inner cavity of the rectangular hole 92, the feeding plate 94 can rotate around the axis of the rotating rod 93, the torsional spring 95 is arranged between the rectangular hole 92 and the outer side of the feeding plate 94, the feeding plate 94 can be driven to automatically turn upwards under the action of the torsional spring 95 until the clamping plate 96 is in contact with the bottom end of the protection plate 91, so, and one side of the catch plate 96 is in contact with the bottom end of the guard plate 91.

The detailed connection means is a technique known in the art, and the following mainly describes the working principle and process, and the specific operation is as follows.

The method comprises the following steps: controlling the first pair of roller crushing assemblies 4, the second pair of roller crushing assemblies 7 and the conveyor belt 10 to be started, switching on an external power supply of a motor 85, controlling the motor 85 to be started, putting a semiconductor material to be crushed on a feeding plate 94, pressing the feeding plate 94 downwards to enable the feeding plate 94 to rotate downwards around the axis of a rotating rod 93 and twist a torsion spring 95, opening the inner cavity of a rectangular hole 92 after the feeding plate 94 rotates, putting the semiconductor material into the first shell 2 through the rectangular hole 92, loosening the discharging plate 94, driving the feeding plate 94 to automatically turn upwards under the action of the torsion spring 95 until a clamping plate 96 is contacted with the bottom end of a protection plate 91, fixing the feeding plate 94 in the rectangular hole 92, and further automatically closing the rectangular hole 92 by the feeding plate 94;

step two: the semiconductor material put into the second housing 1 can be torn into small pieces and fall on the sieving plate 81 under the crushing action of the first pair of roller crushing assemblies, part of the semiconductor material can be bounced out under the crushing action, and the bounced-out material can fall into the first housing 1 again under the blocking of the protection plate 91 and the feeding plate 94 so as to avoid the outward bounced-out material;

step three: after the motor 85 is started, the rotating plate 87 can be driven to rotate clockwise around the axis of the rotating plate to drive the inserting columns 88 to do clockwise circular motion around the output end of the motor 85, the inserting columns 88 can move up and down in the inner cavity of the annular column 86, the inner wall of the annular column 86 can be pushed to drive the annular column 86 to do reciprocating motion back and forth, and the sieving plate 81 is driven to do reciprocating oscillation back and forth under the limiting action of the guide rod 83;

step four: semiconductor materials torn by the first pair of roller crushing assemblies 4 can directly fall on the screening plate 81, materials meeting requirements can be screened on the conveying belt 10 under the oscillation of the screening plate 81, materials not meeting the requirements can fall into the second shell 5 under the inclined oscillation of the screening plate 81, the materials can be crushed again under the crushing effect of the second pair of roller crushing assemblies, the crushing requirements can be met under the crushing of the strip toothed rollers, the crushed materials can fall on the conveying belt 10 to be transmitted, the crushing effect on the semiconductor materials is improved, the processing time is effectively saved, and the wide popularization is facilitated.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor material multi-stage reduction apparatus, comprising:

a base (1);

the device comprises a first shell (2), wherein four corners of the bottom end of the first shell (2) are respectively and fixedly provided with a first supporting leg (3), and the first supporting legs (3) are fixedly arranged on one side of the top end of a base (1);

the first pair of roller crushing assemblies (4) are fixedly arranged in the inner cavity of the first shell (2);

the four corners of the bottom end of the second shell (5) are respectively and fixedly provided with a second supporting leg (6), and the second supporting legs (6) are fixedly arranged on the other side of the top end of the base (1);

the second pair of roller crushing assemblies (7) is fixedly arranged in the inner cavity of the second shell (5);

a sifting mechanism (8) disposed between the first housing (2) and the second housing (5);

the top end of the first shell (2) is in a through shape, and the protection mechanism (9) is arranged.

2. The multistage semiconductor material pulverizing apparatus according to claim 1, wherein: the top of base (1) is provided with conveyer belt (10) along left right direction is fixed, just first casing (2) with the bottom opening part of second casing (5) all is located the top of conveyer belt (10).

3. The multistage semiconductor material pulverizing apparatus according to claim 1, wherein: the broken subassembly of first pair of roller (4) is for tearing the crushing roller to along left right direction setting, the inner chamber top of first casing (4) is provided with first baffle (11) from last to the inboard slope down, just the bottom of first baffle (11) is located the top of the broken subassembly of first pair of roller (4).

4. The multistage semiconductor material pulverizing apparatus according to claim 1, wherein: the second is to broken subassembly of roller (7) for rectangular fluted roller to set up along the fore-and-aft direction, the inner chamber of second casing (5) is provided with second baffle (12) from last to the inboard slope down, just the bottom of second baffle (12) is located the top of the second is to broken subassembly of roller (7).

5. The multistage semiconductor material pulverizing apparatus according to claim 1, wherein: the sifting mechanism (8) comprises:

the screening plate (81), a strip-shaped hole (82) is formed in the top end of one side of the second shell (5) along the front-back direction, and the screening plate (81) is inserted into an inner cavity of the strip-shaped hole (82);

the left side and the right side of the screening plate (81) are respectively provided with the guide rods (83) in an inserted mode, the guide rods (83) are located on one side and fixedly arranged on the inner side walls of the strip-shaped holes (82), and the guide rods (83) are located on the other side and fixedly arranged on the inner sides of the first supporting legs (3).

6. The multistage semiconductor material pulverizing apparatus according to claim 5, wherein: the screening mechanism (8) further comprises:

a fixing plate (84) fixedly arranged on one side of the bottom end of the first shell (2);

a motor (85) fixedly arranged on one side of the fixing plate (84);

an annular column (86) which is fixedly arranged on one side of the screening plate (81) along the vertical direction;

the output end of the motor (85) extends out of one side of the fixed plate (84) and is fixedly provided with the rotating plate (87);

insert post (88), one side of rotor plate (87) is fixed to be provided with inserts post (88), just insert post (88) with the inner chamber looks adaptation grafting of annular post (86).