CN112584613A

CN112584613A - Multilayer high strength circuit board that can buckle according to in service behavior

Info

Publication number: CN112584613A
Application number: CN202110023128.XA
Authority: CN
Inventors: 王少平
Original assignee: Shenzhen Xinrun Industrial Co ltd
Current assignee: Shenzhen Xinrun Industrial Co ltd
Priority date: 2021-01-08
Filing date: 2021-01-08
Publication date: 2021-03-30
Anticipated expiration: 2041-01-08
Also published as: CN112584613B

Abstract

The invention discloses a multilayer high-strength circuit board capable of being bent according to use conditions, which comprises a board body, wherein the board body comprises a reinforcing base plate, a hot melting layer, an insulating board layer, a circuit board layer and a transparent hardening layer are sequentially bonded on two sides of the reinforcing base plate, rotating support plates are integrally connected on two sides of the board body, the rotating support plates are provided with first through holes, locking parts are matched with the first through holes, the locking parts comprise locking sleeves and locking screws, the locking sleeves are in threaded connection with the locking screws, the locking sleeves and the locking screws are uniformly and integrally connected with baffle discs, U-shaped ear plates are integrally connected on two sides of the board body, a support column is fixedly connected with the U-shaped ear plates on one side, the support column is sleeved with a connecting plate, second through holes are arranged on two sides of the connecting plate, the U-shaped ear plates on the other side are detachably matched with the connecting screws, the plate body both sides all are equipped with the IDE interface, the IDE interface matches has IDE ribbon cable.

Description

Multilayer high strength circuit board that can buckle according to in service behavior

Technical Field

The invention belongs to the technical field of circuit boards, and particularly relates to a multilayer high-strength circuit board capable of being bent according to use conditions.

Background

With the development and progress of science and technology, the requirements of people for things are changed from old thinking that people can use things as things to be quite fine and smooth, and only with the continuous progress or innovation conception, a new form is generated to improve the added value of the product, so that people can live under the test of intense market competition. The wiring boards are classified into three major categories, that is, single-sided boards, double-sided boards, and multilayer wiring boards, in which a multilayer board is formed by laminating three or more conductive pattern layers with insulating materials therebetween at intervals, and the conductive patterns therebetween are interconnected as required. The multilayer circuit board is a product of the development of electronic information technology toward high speed, multifunction, large capacity, small volume, thinning and light weight, and the multilayer circuit board gradually replaces a single-layer circuit board in order to meet the integration of more electronic components.

But the setting of multilayer circuit board leads to whole plate body flexibility relatively poor, can't accomplish the bending of multi-angle, buckles promptly and splits, causes unable effective installation under some specific environment, and the practicality is lower.

Disclosure of Invention

In view of the problems raised by the above background art, the present invention is directed to: aims to provide a multilayer high-strength circuit board which can be bent according to the use condition. In order to achieve the technical purpose, the technical scheme adopted by the invention is as follows:

a multilayer high-strength circuit board capable of being bent according to use conditions comprises a board body, wherein the board body comprises a reinforcing base board, a hot melt layer, an insulation board layer, a circuit board layer and a transparent hardening layer are sequentially bonded on two sides of the reinforcing base board, rotary support boards are integrally connected on two sides of the board body, the rotary support boards are attached in position and provided with first through holes, locking parts are matched with the first through holes and comprise locking sleeves and locking screws, the locking sleeves are in threaded connection with the locking screws, the locking sleeves and the locking screws are integrally connected with baffle discs, U-shaped ear boards are integrally connected on two sides of the board body, a strut is fixedly connected with the U-shaped ear boards on one side and sleeved with a connecting plate, second through holes are formed in two sides of the connecting plate, the U-shaped ear boards on the other side can be detachably matched with the connecting screws, and the strut and the connecting screws are matched with second through, the plate body both sides all are equipped with the IDE interface, the IDE interface matches has IDE ribbon cable.

Further inject, the fender dish outside is connected an organic whole and is connected with and twist the strip, and such design is convenient for twist of fender dish.

Further, friction lines are arranged in the first through holes, and due to the design, friction force is increased, and the locking component can be conveniently matched for fixing the position after rotation.

And by further limiting, the number of the IDE interfaces is four, and the design ensures the connection effect and the service life, and shows that after one position is damaged, the IDE interface at the other position can be used for replacing the damaged IDE interface.

Further, the insulation board layer () comprises one or more of biaxially oriented polypropylene, polyimide and polyethylene terephthalate, and the design ensures the insulation effect.

Further inject, hot melt layer, insulation board layer, circuit board layer and transparent sclerosis layer thickness size are mu m ~ mu m, and holistic thickness is guaranteed to such design, and the adaptation is installed.

Further, the diameter of the support column is the same as that of the connecting screw, and the design ensures the connecting effect with the connecting plate.

Further define, IDE interface matches has the dirt proof gum cover, and such design protects IDE interface.

Further define, U type otic placode sets up to the counter bore with connecting screw thread matching position, and such design guarantees the outward appearance.

Further, the support column is detachably connected with the U-shaped ear plate, and the connecting plate can be detached through the design.

The invention has the following beneficial effects:

1. the plate body can be bent in the axial direction by matching the unilateral support with the connecting plate, and the locking component can be bent in the axial direction by matching the rotating support plate with the locking component, so that the plate body can be bent in multiple directions, the aim of bending according to the use condition is fulfilled, and the plate body is high in applicability;

2. the multi-layer structure ensures the integral strength of the plate body, has strong pressure resistance and further ensures the service life.

Drawings

The invention is further illustrated by the non-limiting examples given in the accompanying drawings;

FIG. 1 is a schematic diagram of a general structure of a multilayer high-strength circuit board of the present invention, which can be bent according to the use situation;

FIG. 2 is a schematic structural diagram of a first bending manner of an embodiment of a multilayer high-strength circuit board capable of being bent according to use conditions of the present invention;

FIG. 3 is a schematic structural diagram of a second bending method of an embodiment of a multilayer high-strength circuit board of the present invention, which can be bent according to the use situation;

FIG. 4 is a schematic cross-sectional view of a board body of an embodiment of a multilayer high-strength circuit board of the present invention, which can be bent according to usage;

FIG. 5 is an enlarged view of the structure at A in FIG. 1;

FIG. 6 is a schematic sectional view showing the position of a locking member of an embodiment of a multilayer high-strength wiring board of the present invention which can be bent according to the use condition;

the main element symbols are as follows:

the plate comprises a plate body 1, a reinforcing substrate 101, a hot melt layer 102, an insulation plate layer 103, a circuit board layer 104, a transparent hardened layer 105, a rotating support plate 2, a first through hole 21, a locking component 3, a locking sleeve 31, a locking screw 32, a baffle disc 33, a twisting strip 34, a U-shaped lug plate 4, a support column 41, a connecting screw 42, a connecting plate 5, a second through hole 51 and an IDE interface 6.

Detailed Description

In order that those skilled in the art can better understand the present invention, the following technical solutions are further described with reference to the accompanying drawings and examples.

As shown in fig. 1 to 6, the multilayer high-strength circuit board capable of being bent according to use conditions comprises a board body 1, wherein the board body 1 comprises a reinforcing substrate 101, a hot melting layer 102, an insulating board layer 103, a circuit board layer 104 and a transparent hardening layer 105 are sequentially bonded on two sides of the reinforcing substrate 101, rotating support plates 2 are integrally connected on two sides of the board body 1, the two rotating support plates 2 are attached to each other, a first through hole 21 is formed in each rotating support plate 2, a locking component 3 is matched with each first through hole 21, each locking component 3 comprises a locking sleeve 31 and a locking screw 32, each locking sleeve 31 is in threaded connection with each locking screw 32, each locking sleeve 31 and each locking screw 32 is integrally connected with a baffle disc 33, U-shaped ear plates 4 are integrally connected on two sides of the board body 1, a support column 41 is fixedly connected to each U-shaped ear plate 4 on one side, each support column is sleeved with a connecting plate 5, second through holes 51 are formed in two, the pillar 41 and the connecting screw 42 are matched with the second through hole 51 in size, the IDE interfaces 6 are arranged on two sides of the plate body 1, and the IDE interfaces 6 are matched with IDE ribbon cables.

In this embodiment, when a multilayer high-strength circuit board which can be bent according to the use condition is used, the board body 1 is bent according to the use condition, what is needed is a multilayer structure design of the reinforcing substrate 101, the hot melt layer 102, the insulation board layer 103, the circuit board layer 104 and the transparent hardened layer 105 of the board body 1, so that the overall strength of the board body 1 is ensured, the board body 1 is not affected during bending, when bending is required to be performed on two sides of the board body 1 in the plane direction, only the support column 41, the connecting plate 5 and the connecting screw 42 are needed to be matched for connection in the direction which needs to be bent, and other positions are not connected, so that under the effect of the connecting plate 5, the board body 1 can be bent at any position in the horizontal left-right direction, and then an IDE ribbon cable is used for data connection in cooperation; need carry out the bending of direction about the level, connect the rotatory extension board 2 of plate body 1 with the first through-hole 21 of locking part 3 cooperation, other positions do not throw out of gear, when buckling when being fit for the position, screw up locking screw 32, under the cooperation effect of lock sleeve 31, locking screw 32's removal makes fender dish 33 and rotatory extension board 2 contact, thereby realize the rigidity, then use IDE ribbon cable cooperation IDE interface 6 to carry out data connection, and then reach the purpose of buckling, to sum up, the bending of direction and longitudinal direction about having realized, be applicable to different installation environment, excellent in use effect, and wide application range.

Preferably, the outer side of the plate 33 is integrally connected with a screwing strip 34, which is designed to facilitate screwing of the plate 33, and actually, the manner of facilitating screwing of the plate 33 can be considered according to specific situations.

Preferably, the first through hole 21 has friction lines therein, so as to increase friction force and facilitate the position fixing after the locking component 3 is rotated, and in fact, the measures for facilitating the position fixing can be considered according to specific situations.

Preferably, the number of the IDE interfaces 6 is four, such design ensures the connection effect and the service life, and represents that when one location is damaged, the IDE interfaces 6 of another location can be used for replacement, and actually, the number of the IDE interfaces 6 can be considered according to specific situations.

Preferably, the insulation board layer (103) comprises one or more of biaxially oriented polypropylene, polyimide and polyethylene terephthalate, and such design ensures the insulation effect, and in fact, the material of the insulation board layer (103) can be considered according to specific situations.

The thickness of the heat-fusible layer 102, the insulation board layer 103, the circuit board layer 104 and the transparent hardened layer 105 is preferably 10 μm to 50 μm, and the design ensures the overall thickness and the adaptive installation, and in fact, the thickness of each layer can be considered according to specific conditions.

The diameter of the support 41 and the diameter of the connecting screw 42 are preferably the same, so that the design ensures the connecting effect with the connecting plate 5, and in fact, the diameter of the support 41 and the diameter of the connecting screw 42 can be considered according to specific situations.

Preferably, the IDE interface 6 is matched with a dustproof rubber sleeve, and such a design protects the IDE interface 6, and actually, a method for protecting the IDE interface 6 can be considered according to specific situations.

The U-shaped ear plate 4 and the connecting screw 42 are preferably provided with countersunk holes at the thread matching positions, so that the appearance is ensured, and in fact, the appearance design can be considered according to specific conditions.

The post 41 is preferably detachably connected to the U-shaped ear plate 4, so that the connecting plate 5 can be detached, and in fact, the connection mode between the post 41 and the U-shaped ear plate 4 can be considered according to specific situations.

The foregoing embodiments are merely illustrative of the principles of the present invention and its efficacy, and are not to be construed as limiting the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. The utility model provides a can carry out multilayer high strength circuit board of buckling according to in service behavior, includes plate body (1), its characterized in that: the plate body (1) comprises a reinforcing base plate (101), both sides of the reinforcing base plate (101) are sequentially bonded with a hot melt layer (102), an insulating plate layer (103), a circuit board layer (104) and a transparent hardened layer (105), both sides of the plate body (1) are integrally connected with a rotating support plate (2), two rotating support plates (2) are attached to each other, the rotating support plate (2) is provided with a first through hole (21), a locking component (3) is matched with the first through hole (21), the locking component (3) comprises a locking sleeve (31) and a locking screw (32), the locking sleeve (31) is in threaded connection with the locking screw (32), the locking sleeve (31) is integrally connected with a baffle disc (33) with the locking screw (32), both sides of the plate body (1) are integrally connected with U-shaped ear plates (4), and one side of the U-shaped ear plates (4) is fixedly connected with a support column (41), pillar cover is equipped with connecting plate (5), connecting plate (5) both sides are equipped with second through-hole (51), the opposite side U type otic placode (4) can be dismantled and be equipped with connecting screw (42), pillar (41) and connecting screw (42) equal size adaptation second through-hole (51), plate body (1) both sides all are equipped with IDE interface (6), IDE interface (6) are equipped with IDE ribbon cable.

2. The multilayer high-strength wiring board capable of being bent according to use conditions of claim 1, wherein: the outer side of the baffle disc (33) is connected with a twisting strip (34) in an integrated manner.

3. The multilayer high-strength wiring board capable of being bent according to use conditions of claim 2, wherein: friction grains are arranged in the first through hole (21).

4. A multilayer high-strength wiring board bendable according to use according to claim 3, characterized in that: the IDE interfaces (6) are four in total.

5. The multilayer high-strength wiring board capable of being bent according to use conditions of claim 4, wherein: the insulation board layer (103) comprises one or more of biaxially oriented polypropylene, polyimide, and polyethylene terephthalate.

6. The multilayer high-strength wiring board capable of being bent according to use conditions of claim 5, wherein: the thickness of the hot melting layer (102), the thickness of the insulating board layer (103), the thickness of the circuit board layer (104) and the thickness of the transparent hardening layer (105) are all 10-50 mu m.

7. The multilayer high-strength wiring board capable of being bent according to use according to claim 6, wherein: the strut (41) and the connecting screw (42) are the same in diameter size.

8. The multilayer high-strength wiring board capable of being bent according to use according to claim 7, characterized in that: the IDE interface (6) is matched with a dustproof rubber sleeve.

9. The multilayer high-strength wiring board capable of being bent according to use conditions of claim 8, wherein: the U-shaped ear plate (4) and the connecting screw (42) are provided with countersunk holes at the thread matching positions.

10. The multilayer high-strength wiring board bendable according to use according to claim 9, wherein: the support column (41) is detachably connected with the U-shaped ear plate (4).