CN112577135A - Air conditioner and control method thereof - Google Patents

Abstract

The invention discloses an air conditioning device and a control method thereof, which are used for solving the problem of poor refrigeration effect of the air conditioning device in the prior art, the air conditioning device comprises a shell, a cavity is formed in the shell, an air inlet and an air outlet which are communicated with the cavity are formed in the shell, and an airflow channel is formed between the air inlet and the air outlet; the fluid storage device is used for containing a refrigerant; the heat extraction component is communicated with the fluid storage device in a fluid mode and can cool the refrigerant flowing through the heat extraction component; the deep cooling assembly is communicated with the fluid storage device in a fluid mode, and can cool the refrigerant flowing through the deep cooling assembly; the heat exchange assembly is arranged in the airflow channel and is communicated with the heat extraction assembly and the deep cooling assembly in a fluid mode, and the heat exchange assembly can utilize the refrigerant cooled by the heat extraction assembly and/or the deep cooling assembly to cool air flowing through the heat exchange assembly; and the airflow driving assembly is matched with the heat exchange assembly to guide the air flowing through the heat exchange assembly to the air outlet to be ejected.

Description

Air conditioner and control method thereof

Technical Field

The invention belongs to the technical field of household appliances, and particularly relates to an air conditioning device and a control method thereof.

Background

With the improvement of living standard of people, the traditional fan can not meet the daily use requirement of people gradually, and the fan with the temperature adjusting function is widely applied gradually. The existing temperature regulation fan is generally provided with a water tank, a water pump is arranged in the water tank, normal-temperature water in the water tank is pumped by the water pump, water is conveyed above a water curtain, the temperature of the surrounding air is reduced through evaporation and heat absorption of the water curtain, the motor drives a wind wheel to rotate to generate wind, the air after being cooled is driven to blow out of a box body, and the purpose of cooling is achieved.

However, the existing temperature adjusting fan mainly absorbs heat energy in the evaporation process of water on the water curtain, that is, sensible heat of air is absorbed under the condition of unchanged enthalpy value, so that the temperature of dry balls of the air is reduced, the actual cooling effect is poor, the temperature of the air blown out by the wind wheel is not much different from the room temperature, and the air is still not cold air, so that the purpose of cooling cannot be well achieved.

In view of the above, it is an urgent need to provide an air-conditioning fan with higher cooling efficiency.

Disclosure of Invention

The application aims to provide an air conditioning device and a control method thereof, so as to solve the problem that the using effect of a household fan in the prior art is poor.

In order to achieve the above object, an embodiment of the present application provides the following technical solutions:

an air conditioning device comprising:

the air conditioner comprises a shell, a fan and a controller, wherein a cavity is formed in the shell, an air inlet and an air outlet which are communicated with the cavity are formed in the shell, and an air flow channel is formed between the air inlet and the air outlet;

the fluid storage device is used for containing a refrigerant;

a heat removal assembly in fluid communication with the fluid storage device, the heat removal assembly being capable of cooling a refrigerant flowing therethrough;

a deep cooling assembly in fluid communication with the fluid storage device, the deep cooling assembly being capable of cooling a refrigerant flowing therethrough;

the heat exchange assembly is arranged in the airflow channel and is communicated with the heat extraction assembly and the deep cooling assembly in a fluid mode, and the heat exchange assembly can cool air flowing through the heat extraction assembly and/or the deep cooling assembly by using a refrigerant cooled by the heat extraction assembly and/or the deep cooling assembly;

and the airflow driving assembly is matched with the heat exchange assembly so as to guide the air flowing through the heat exchange assembly to the air outlet to be ejected.

In one embodiment, the heat exchange assembly includes an evaporation medium and a deep air cooling device, the evaporation medium can cool air flowing through the heat extraction assembly and/or the deep cooling assembly by using a refrigerant cooled by the heat extraction assembly and/or the deep cooling assembly, and the deep air cooling device can cool or heat the air flowing through the heat exchange assembly.

In one embodiment, the heat exchange assembly comprises at least two evaporation media and a control valve, wherein the control valve is used for controlling the number of the evaporation media connected in series in the at least two evaporation media.

In one embodiment, the heat exchange assembly includes a first evaporation medium, a second evaporation medium and a control valve, the first evaporation medium and the second evaporation medium being connected in parallel, and the control valve is configured to control a refrigerant cooled by one of the heat rejection assembly and the deep cooling assembly to flow through the first evaporation medium and control a refrigerant cooled by the other of the heat rejection assembly and the deep cooling assembly to flow through the second evaporation medium.

In one embodiment, the heat exchange assembly includes a flow regulating valve, and the flow regulating valve is used for controlling the flow of the refrigerant flowing into the heat exchange assembly.

In one embodiment, the air conditioning device includes at least two heat discharging assemblies and a control valve, and the control valve is used for controlling the number of the heat discharging assemblies which are connected in series to cool the refrigerant flowing through the heat discharging assemblies.

In one embodiment, the air conditioning device includes at least two of the deep cooling modules and a control valve for controlling the number of the deep cooling modules connected in series to cool the refrigerant flowing therethrough.

In one embodiment, the deep cooling assembly comprises a semiconductor refrigerator.

An embodiment of the present application further provides a control method of an air conditioning apparatus, including:

starting the airflow driving assembly to enable air to enter the shell from the air inlet and to be ejected from the air outlet along the airflow channel;

switching the air conditioning device among a first mode, a second mode, a third mode and a fourth mode to change the temperature of the air emitted from the air outlet; wherein the content of the first and second substances,

in the first mode, the refrigerant in the fluid storage device flows through the heat exchange assembly, so that the temperature of the refrigerant is reduced at the heat exchange assembly;

in the second mode, the refrigerant in the fluid storage device sequentially flows through the heat extraction assembly and the heat exchange assembly, the refrigerant is cooled at the heat extraction assembly, and the heat exchange assembly cools the air flowing through the heat extraction assembly by using the cooled refrigerant;

in the third mode, the refrigerant in the fluid storage device sequentially flows through the deep cooling assembly and the heat exchange assembly, the refrigerant is cooled at the deep cooling assembly, and the heat exchange assembly cools the air flowing through the heat exchange assembly by using the cooled refrigerant;

in the fourth mode, a refrigerant in the fluid storage device flows through the heat extraction assembly, the deep cooling assembly and the heat exchange assembly, the refrigerant is cooled step by step at the heat extraction assembly and the heat extraction assembly, and the heat exchange assembly cools air flowing through the heat extraction assembly by using the cooled refrigerant; wherein the content of the first and second substances,

the operating noise of the air conditioning device in the third mode is less than the operating noise in the second mode.

In one embodiment, when the air conditioning device works in the third mode or the fourth mode, the operating power of the deep cooling assembly is controlled so that the air conditioning device is switched among the first sub-mode, the second sub-mode, the third sub-mode, the fourth sub-mode and the fifth sub-mode; wherein the content of the first and second substances,

in the first sub-mode, the deep cooling assembly cools the refrigerant to be below the dew point temperature of the ambient air;

in the second sub-mode, the deep cooling assembly cools the refrigerant to be equal to the ambient air dew point temperature;

in the third sub-mode, the deep cooling assembly cools the refrigerant to be above the dew point temperature of the ambient air and below the wet bulb temperature of the air;

in the fourth sub-mode, the deep cooling assembly cools the refrigerant to be equal to the air wet bulb temperature;

and in the fifth sub-mode, the deep cooling assembly cools the refrigerant to a temperature which is higher than the wet bulb temperature of the air and lower than the dry bulb temperature of the air.

By the arrangement, the heat extraction assembly and/or the deep cooling assembly can be used for pre-cooling the refrigerant, so that the heat exchange assembly can exchange heat with air flowing through the pre-cooled refrigerant, and the refrigeration effect of the air conditioning device is improved; meanwhile, the running states of the heat extraction assembly and the deep cooling assembly in different environments are combined, the air conditioning device can be switched under various air supply modes, and a better refrigerating/heating effect is achieved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a block diagram of an air conditioning apparatus according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a semiconductor cooling plate according to an embodiment of the present disclosure;

FIG. 3 is a schematic block diagram of an air conditioning unit according to yet another embodiment of the present application;

FIG. 4 is a schematic block diagram of an air conditioning unit according to yet another embodiment of the present application;

FIG. 5 is a schematic block diagram of an air conditioning unit according to yet another embodiment of the present application;

FIG. 6 is a schematic block diagram of an air conditioning unit according to yet another embodiment of the present application;

fig. 7 is a block diagram of an air conditioning apparatus according to another embodiment of the present application.

Detailed Description

The present invention will be described in detail below with reference to embodiments shown in the drawings. The embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to the embodiments are included in the scope of the present invention.

Referring to fig. 1, an embodiment of an air conditioning device 100 of the present application is described. In the present embodiment, the air conditioning device 100 includes a housing 10, a fluid storage device 20, a heat rejection assembly 50, a deep cooling assembly 60, a heat exchange assembly 40, and an airflow driving assembly 70.

The housing 10 is used to substantially constitute the overall appearance of the air conditioning device 100, and the housing 10 includes, for example, a front panel, a rear panel, side panels, and a top panel, and collectively defines the outer contour of the housing 10 and an inner chamber. Meanwhile, the physical structures including the control panel, the carrying handle, the chassis with the roller, etc. may be provided as required, the control panel may be connected to the circuit or the control component inside the air conditioning device 100 to allow the operator to perform the function control or setting of the air conditioning device 100, which will be described in the following embodiments, while the other physical structures on the housing 10 that are optional are not related to the inventive main points of the present application and thus are not developed in detail herein.

The housing 10 is formed with a cavity therein for accommodating the fluid storage device 20, the heat rejection assembly 50, the deep cooling assembly 60, the heat exchange assembly 40, and the airflow driving assembly 70. The housing 10 has an inlet 11 and an outlet 12 communicating with the chamber, and an airflow path P is formed between the inlet 11 and the outlet 12. It should be noted that the housing 10 and the fluid storage device 20, the heat exhausting assembly 50, the deep cooling assembly 60, the heat exchanging assembly 40 and the airflow driving assembly 70 arranged in the cavity shown in the drawings of the present application are not illustrated in the air conditioning device 100 according to the actual production application, but are merely used for illustrating the air conditioning device 100 and the matching manner of the components.

It should be noted that the air flow path P is not limited to a physical structure, that is, the air flow path P is not strictly separated or limited from other spaces in the chamber, but only illustrates that there is an air flow path in the chamber for the external air to enter the chamber from the air inlet 11 of the housing 10 and to exit the chamber from the air outlet 12 of the housing 10, so as to form a complete air circulation.

The fluid storage device 20 is used for containing a cooling medium, such as water. The air conditioning device 100 may include a pump 30 for circulating the refrigerant in the fluid storage device 20 among the fluid storage device 20, the heat rejection assembly 50, the deep cooling assembly 60, and the heat exchange assembly 40. The refrigerant undergoes sensible heat exchange or latent heat exchange in the different heat exchange function modules (here, the heat rejection assembly 50, the deep cooling assembly 60, and the heat exchange assembly 40) so that the cooling air is ejected from the air outlet 12.

In a specific structural design, the fluid storage device 20 may be supported on a chassis, and a water level indicator, a water level sensor, etc. may be cooperatively disposed in the fluid storage device 20 for observing the water level in the fluid storage device 20 and implementing automatic water replenishment to the fluid storage device 20. The fluid storage device 20 is configured to be removable for easy filling and cleaning.

Hereinafter, a description will be given of how the air conditioning apparatus 100 cools the injected air in a cooling mode typical of the present embodiment.

The heat discharging assembly 50 and the deep cooling assembly 60 are in fluid communication with the fluid storage device 20, and cool the refrigerant flowing through the fluid storage device, and the refrigerant undergoes sensible heat exchange at the heat discharging assembly 50 and/or the deep cooling assembly 60, so that the temperature of the refrigerant is reduced without phase change. The heat exchange assembly 40 is disposed in the airflow channel P and is in fluid communication with the heat discharging assembly 50 and the deep cooling assembly 60, and the heat exchange assembly 40 can cool air flowing through the heat discharging assembly 50 and/or the deep cooling assembly 60 by using a refrigerant cooled by the heat discharging assembly 50 and/or the deep cooling assembly 60. Since the refrigerant is pre-cooled in the heat discharging assembly 50 and/or the deep cooling assembly 60, the heat exchange efficiency of the cooling fan can be improved at the heat exchange assembly 40 compared with the uncooled refrigerant, and the cooling capacity of the cooling fan can be improved.

In one embodiment, the airflow driving assembly 70 integrally drives the air inside the housing 10 to form an airflow, and the airflow generally has a substantially stable flow direction due to the imbalance of the wind pressures at the wind inlet 11 and the wind outlet 12, so that the airflow can define the airflow channel P. The heat exchange assembly 40 cools the airflow formed in the airflow channel P, for example, the heat exchange assembly 40 may be disposed near or near the air outlet 12 to ensure that the cooled air can reach the air outlet 12 through the shortest path of the airflow channel P, thereby reducing the dissipation of cold.

The airflow driving component 70 is further configured to provide kinetic energy for the air to be ejected from the air outlet 12, and in a physical position, the airflow driving component 70 may cooperate with the heat exchanging component 40 to guide the air flowing through the heat exchanging component 40 to the air outlet 12 for ejection. In one embodiment, airflow actuation assembly 70 may be a wind rotor disposed in airflow path P.

In the embodiment of the present application, a control method for cooperating with the air conditioning device 100 is also provided, which provides a plurality of operation modes of the air conditioning device 100 to realize the application of the air conditioning device 100 in different environments and scenes. Specifically, the method comprises the following steps:

starting the airflow driving assembly 70, so that the air enters the interior of the housing 10 from the air inlet 11 and is ejected from the air outlet 12 along the airflow path;

switching the air conditioning device 100 among a first mode, a second mode, a third mode and a fourth mode to change the temperature of the air emitted from the air outlet 12; wherein the content of the first and second substances,

in the first mode, the refrigerant in the fluid storage device 20 flows through the heat exchange assembly 40, so that the refrigerant is cooled at the heat exchange assembly 40;

in the second mode, the refrigerant in the fluid storage device 20 flows through the heat extraction assembly 50 and the heat exchange assembly 40 in sequence, the refrigerant is cooled at the heat extraction assembly 50, and the heat exchange assembly 40 cools the air flowing through the heat extraction assembly by using the cooled refrigerant;

in the third mode, the refrigerant in the fluid storage device 20 sequentially flows through the deep cooling assembly 60 and the heat exchange assembly 40, the refrigerant is cooled at the deep cooling assembly 60, and the heat exchange assembly 40 cools the air flowing through the heat exchange assembly 40 by using the cooled refrigerant;

in the fourth mode, the refrigerant in the fluid storage device 20 flows through the heat extraction assembly 50, the deep cooling assembly 60 and the heat exchange assembly 40, the refrigerant is gradually cooled at the heat extraction assembly 50 and the heat extraction assembly 50, and the heat exchange assembly 40 cools the air flowing through the refrigerant by using the cooled refrigerant.

The first mode may be a general water cooling mode, the heat exchange assembly 40 may be a heat exchange medium including wet curtain paper, and the refrigerant exchanges heat with air flowing through the heat exchange assembly 40, so that the air is cooled. The second mode and the third mode pre-cool the refrigerant through the heat discharging assembly 50 and the deep cooling assembly 60, respectively, so that the refrigerant has higher heat exchange efficiency when exchanging heat at the heat exchange assembly 40. In contrast, heat exhausting assembly 50 in the second mode generally includes heat exhausting fan 51, which is generally noisy to operate, while deep cooling assembly 60 in the third mode may utilize a semiconductor cooler, so that air conditioning apparatus 100 is more suitable for quiet environment applications because the noise of operation in the third mode is less than that of operation in the second mode. In the fourth mode, the heat discharging assembly 50 and the deep cooling assembly 60 are used to pre-cool the refrigerant at the same time, so as to achieve the highest cooling efficiency.

In one embodiment, heat rejection assembly 50 may be a cooling tower.

The deep cooling assembly 60 can also be controlled to work at various refrigeration powers, and when the deep cooling assembly 60 works at a higher refrigeration power, the deep cooling assembly 60 has relatively higher heat exchange efficiency and can cool more refrigerants in the same time; when operating at a lower cooling capacity, the deep cooling module 60 can cool down a relatively smaller volume of the cooling medium in the same time. In this way, in the third mode or the fourth mode, according to different expected values selected by the user or different temperatures detected by the temperature sensor cooperatively arranged, the following sub-operation modes can be provided:

the first sub-mode: the deep cooling module 60 operates at high load to cool the refrigerant below the dew point temperature of the ambient air. At the moment, the refrigerant is in contact with the air at the heat exchange assembly 40, heat exchange is directly carried out, and sensible heat is reduced; simultaneously, because the refrigerant temperature is less than air dew point temperature, so vapor in the air can condense, and the water content and the latent heat of air reduce, obtain low-temperature low-humidity air-out, improve the travelling comfort.

The second sub-mode: the deep cooling module 60 operates at a higher load to cool the refrigerant to a temperature equal to the ambient dew point temperature. At the moment, the refrigerant is in contact with the air at the heat exchange assembly 40, heat exchange is directly carried out, and sensible heat is reduced; meanwhile, because the temperature of the refrigerant is equal to the dew point temperature of the air, water vapor in the air cannot be condensed, the water content of the air is unchanged, low-temperature and equal-humidity outlet air is obtained, and the comfort is improved.

The third sub-mode: the deep cooling module 60 operates at an appropriate load to cool the refrigerant above the air dew point temperature and below the air wet bulb temperature. At the moment, the refrigerant is in contact with the air at the heat exchange assembly 40, heat exchange is directly carried out, and sensible heat is reduced; meanwhile, because the temperature of the refrigerant is higher than the dew point temperature of the air, the refrigerant is evaporated at the heat exchange assembly 40 to absorb the heat of the air and reduce the temperature of the air dry bulb. Moreover, because the refrigerant evaporates, the humidity of the air is increased, the latent heat of the air is increased, the enthalpy value of the air is reduced, the outlet air with low temperature and high humidity is obtained, and the comfort is increased in some cases.

A fourth sub-mode: the deep cooling module 60 operates at the proper load to cool the refrigerant to equal the wet bulb temperature of the air. At the moment, the refrigerant is in contact with the air at the heat exchange assembly 40, heat exchange is directly carried out, and sensible heat is reduced; meanwhile, because the temperature of the refrigerant is higher than the dew point temperature of the air, the refrigerant is evaporated at the heat exchange assembly 40 to absorb the heat of the air and reduce the temperature of the air dry bulb. In addition, the humidity of air is increased due to the evaporation of the refrigerant, the latent heat of the air is increased, but the enthalpy value of inlet and outlet air is not changed, outlet air with low temperature and high humidity is obtained, and the comfort is increased in some cases.

A fifth sub-mode: the deep cooling module 60 operates at a suitable load to cool the refrigerant to a temperature greater than the wet bulb temperature of the air and less than the dry bulb temperature of the air. At the moment, the refrigerant is in contact with the air at the heat exchange assembly 40, heat exchange is directly carried out, and sensible heat is reduced; meanwhile, because the temperature of the refrigerant is higher than the dew point temperature of the air, the refrigerant is evaporated at the heat exchange assembly 40 to absorb the heat of the air and reduce the temperature of the air dry bulb. Moreover, because the refrigerant evaporates, the humidity of the air rises, the latent heat of the air increases, the enthalpy value of the outlet air rises, the outlet air with low temperature and high humidity is obtained, and the comfort is increased under certain conditions.

Referring to fig. 2, in an embodiment, the deep cooling module 60 may include a semiconductor chilling plate disposed in cooperation, the semiconductor chilling plate generally includes a plurality of N-type semiconductors and P-type semiconductors connected in series at intervals, taking fig. 3 as an example, when a current flows through, electrons in the N-type semiconductors move downward under the action of an electric field, and polymerize with positive charges of a power supply at a lower end to release heat, and holes in the P-type semiconductors move downward under the action of the electric field, and polymerize with negative charges of the power supply at the lower end to release heat; at the same time, the electrons and holes separate at the upper end, absorbing heat during separation. Thus, the semiconductor cooler as a whole has a cold side and a hot side opposite the cold side. In the application of the semiconductor refrigerating sheet, the cold end of the semiconductor refrigerating sheet can be used for cooling the passing refrigerant.

Referring to fig. 3, in yet another embodiment of the air conditioning unit 100 of the present application. The heat exchange assembly 40 includes an evaporative medium 41 and a deep air cooler 42. The evaporation medium 41 may cool the air flowing through the heat discharging assembly 50 and/or the deep cooling assembly 60 by using the refrigerant cooled by the heat discharging assembly, and the deep air cooling device 42 may cool or heat the air flowing through the heat exchanging assembly 40.

The deep-air cooling device 42 may include, for example, a semiconductor cooling fin, and the deep-air cooling device 42 is not used for cooling the refrigerant, but is selectively turned on to heat or cool the outlet air as required.

Referring to fig. 4, in yet another embodiment of the air conditioning unit 100 of the present application. The heat exchange assembly 40 comprises at least two evaporation media 41 and a control valve 43, the control valve 43 is used for controlling the amount of the evaporation media 41 connected in series in the at least two evaporation media 41. Through connecting more evaporation medium 41 in series, can effectively reduce the air-out temperature.

Shown in fig. 4 is an embodiment in which the heat exchange assembly 40 comprises two evaporation media 41. The control valve 43 is used for controlling whether the refrigerant flows through the other evaporation medium 41 in the heat discharging assembly 40, and a pump 44 is further disposed between the two evaporation media 41 for driving the refrigerant to flow through each evaporation medium 41.

Referring to fig. 5, in yet another embodiment of the air conditioning unit 100 of the present application. The heat exchange assembly 40 comprises a first 411 and a second 412 evaporation media in parallel, and a control valve 43. The control valve 43 is used for controlling the refrigerant cooled by one of the heat discharging assembly 50 and the deep cooling assembly 60 to flow through the first evaporation medium 411, and controlling the refrigerant cooled by the other of the heat discharging assembly 50 and the deep cooling assembly 60 to flow through the second evaporation medium 412.

Because the heat extraction assembly 50 and the deep cooling assembly 60 correspond to different heat exchange efficiencies, the refrigerant flowing through the heat extraction assembly 50 or the deep cooling assembly 60 at different temperatures can be adjusted to enter different evaporation media through the control valve 43, so that different cooling effects can be realized.

Referring to fig. 6, in yet another embodiment of the air conditioning device 100 of the present application. The heat exchange assembly 40 includes a flow control valve 44, and the flow control valve 44 is used for controlling the flow rate of the refrigerant flowing into the heat exchange assembly 40.

The flow rate of the refrigerant determines the heat exchange efficiency of the heat exchange assembly 40. Taking the heat exchange assembly 40 for exchanging heat by using the evaporation medium 41 as an example, the larger the refrigerant flow is, the larger the evaporation capacity is, the lower the outlet air temperature is, and the larger the refrigerating capacity is; the smaller the refrigerant flow is, the smaller the evaporation capacity is, the higher the outlet air temperature is, and the smaller the refrigerating capacity is. In this way, an effect similar to "variable frequency" refrigeration can be achieved.

Referring to fig. 7, in yet another embodiment of the air conditioning device 100 of the present application. The air conditioning device 100 includes at least two heat discharging assemblies 50 and a control valve 51, wherein the control valve 51 is used for controlling the number of the heat discharging assemblies which are connected in series in the at least two heat discharging assemblies 50 to cool the refrigerant flowing through. Similarly, the refrigerant passes through the heat discharging assemblies 50 and exchanges heat with air for multiple times, so that a refrigerant with a lower temperature can be obtained. Therefore, the refrigerant can have lower temperature when entering the heat exchange assembly 40, and the refrigeration efficiency is improved.

Similarly, the air conditioning device 100 may further include at least two deep cooling modules 60 and a control valve (not shown) for controlling the number of deep cooling modules 60 connected in series to cool the refrigerant flowing through the at least two deep cooling modules 60. The tandem deep cooling module 60 also serves to provide higher cooling efficiency to the refrigerant.

In the above embodiments, the heat discharging assembly 50, the deep cooling assembly 60, the heat exchanging assembly 40, the airflow driving assembly 70, the pump 30, the flow regulating valve 44, etc. in the air conditioning apparatus 100 may be controlled by a built-in controller, for example, and may be adjusted by a user according to the requirement, for example, by matching with a receiver and a remote controller, an integrated control panel, etc. The Controller may be an integrated circuit including a Microcontroller (MCU), and as is well known to those skilled in the art, the microcontroller may include a Central Processing Unit (CPU), a Read-Only Memory (ROM), a Random Access Memory (RAM), a timing module, a digital-to-analog conversion (a/D Converter), and several input/output ports. Of course, the controller may also be an Application Specific Integrated Circuit (ASIC) or a Field Programmable Gate Array (FPGA).

In a specific air conditioner product, water is commonly used as a refrigerant for heat exchange, and working modes including air supply, refrigeration, heating, dehumidification, humidification, purification and the like can be provided. The cooling operation mode may be referred to as a water cooling fan mode, and the non-cooling operation mode may be referred to as a fan mode.

Also, it should be understood that, although the terms first, second, etc. may be used herein to describe various elements or structures, these described elements should not be limited by these terms. These terms are only used to distinguish these descriptive objects from one another. For example, the first guide mode may be referred to as the second mode, and similarly the second mode may also be referred to as the first mode, without departing from the scope of the present application.

Also, the same reference numbers or symbols may be used in different embodiments, but this does not represent a structural or functional relationship, but merely for convenience of description.

The use of terms such as "upper," "above," "lower," "below," and the like in describing relative spatial positions herein is for the purpose of facilitating description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

When an element or layer is referred to as being "on," or "connected" to another element or layer, it can be directly on, connected to, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or layers present.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (10)

1. An air conditioning device characterized by comprising:

the air conditioner comprises a shell, a fan and a controller, wherein a cavity is formed in the shell, an air inlet and an air outlet which are communicated with the cavity are formed in the shell, and an air flow channel is formed between the air inlet and the air outlet;

the fluid storage device is used for containing a refrigerant;

a heat removal assembly in fluid communication with the fluid storage device, the heat removal assembly being capable of cooling a refrigerant flowing therethrough;

a deep cooling assembly in fluid communication with the fluid storage device, the deep cooling assembly being capable of cooling a refrigerant flowing therethrough;

the heat exchange assembly is arranged in the airflow channel and is communicated with the heat extraction assembly and the deep cooling assembly in a fluid mode, and the heat exchange assembly can cool air flowing through the heat extraction assembly and/or the deep cooling assembly by using a refrigerant cooled by the heat extraction assembly and/or the deep cooling assembly;

and the airflow driving assembly is matched with the heat exchange assembly so as to guide the air flowing through the heat exchange assembly to the air outlet to be ejected.

2. The air conditioning device of claim 1, wherein the heat exchange assembly comprises an evaporation medium and a deep air cooling device, the evaporation medium can cool air flowing through the evaporation medium by using a refrigerant cooled by the heat extraction assembly and/or the deep cooling assembly, and the deep air cooling device can cool or heat air flowing through the heat exchange assembly.

3. The air conditioning unit of claim 1, wherein the heat exchange assembly comprises at least two evaporation media and a control valve for controlling the amount of evaporation media in series of the at least two evaporation media.

4. The air conditioning unit of claim 1, wherein the heat exchange assembly comprises a first evaporative medium and a second evaporative medium connected in parallel, and a control valve for controlling the flow of refrigerant cooled by one of the heat rejection assembly and the deep cooling assembly through the first evaporative medium and controlling the flow of refrigerant cooled by the other of the heat rejection assembly and the deep cooling assembly through the second evaporative medium.

5. The air conditioning unit according to claim 1, wherein the heat exchange unit includes a flow control valve for controlling a flow rate of the refrigerant flowing into the heat exchange unit.

6. The air conditioning unit of claim 1, wherein the air conditioning unit comprises at least two heat rejection assemblies and a control valve, wherein the control valve is configured to control the number of heat rejection assemblies of the at least two heat rejection assemblies that are connected in series to cool a refrigerant flowing therethrough.

7. The air conditioning unit of claim 1, wherein the air conditioning unit comprises at least two of the deep cooling modules and a control valve for controlling the number of deep cooling modules of the at least two deep cooling modules connected in series to cool the refrigerant flowing therethrough.

8. The air conditioning unit of any one of claims 1 to 7, wherein the deep cooling module comprises a semiconductor refrigerator.

9. The control method of an air conditioning device according to any one of claims 1 to 7, characterized by comprising:

starting the airflow driving assembly to enable air to enter the shell from the air inlet and to be ejected from the air outlet along the airflow channel;

switching the air conditioning device among a first mode, a second mode, a third mode and a fourth mode to change the temperature of the air emitted from the air outlet; wherein the content of the first and second substances,

in the first mode, the refrigerant in the fluid storage device flows through the heat exchange assembly, so that the temperature of the refrigerant is reduced at the heat exchange assembly;

in the second mode, the refrigerant in the fluid storage device sequentially flows through the heat extraction assembly and the heat exchange assembly, the refrigerant is cooled at the heat extraction assembly, and the heat exchange assembly cools the air flowing through the heat extraction assembly by using the cooled refrigerant;

in the third mode, the refrigerant in the fluid storage device sequentially flows through the deep cooling assembly and the heat exchange assembly, the refrigerant is cooled at the deep cooling assembly, and the heat exchange assembly cools the air flowing through the heat exchange assembly by using the cooled refrigerant;

in the fourth mode, a refrigerant in the fluid storage device flows through the heat extraction assembly, the deep cooling assembly and the heat exchange assembly, the refrigerant is cooled step by step at the heat extraction assembly and the heat extraction assembly, and the heat exchange assembly cools air flowing through the heat extraction assembly by using the cooled refrigerant; wherein the content of the first and second substances,

the operating noise of the air conditioning device in the third mode is less than the operating noise in the second mode.

10. The control method of an air conditioning unit according to claim 9, wherein when the air conditioning unit operates in the third mode or the fourth mode, the operating power of the deep cooling module is controlled to switch the air conditioning unit between the first sub-mode, the second sub-mode, the third sub-mode, the fourth sub-mode, and the fifth sub-mode; wherein the content of the first and second substances,

in the first sub-mode, the deep cooling assembly cools the refrigerant to be below the dew point temperature of the ambient air;

in the second sub-mode, the deep cooling assembly cools the refrigerant to be equal to the ambient air dew point temperature;

in the third sub-mode, the deep cooling assembly cools the refrigerant to be above the dew point temperature of the ambient air and below the wet bulb temperature of the air;

in the fourth sub-mode, the deep cooling assembly cools the refrigerant to be equal to the air wet bulb temperature;

and in the fifth sub-mode, the deep cooling assembly cools the refrigerant to a temperature which is higher than the wet bulb temperature of the air and lower than the dry bulb temperature of the air.

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