CN215372763U

CN215372763U - Cooling fan

Info

Publication number: CN215372763U
Application number: CN202121650819.4U
Authority: CN
Inventors: 沈洪波; 周伙喜; 蒲毅
Original assignee: Jiema Technology Zhongshan Co ltd
Current assignee: Jiema Technology Zhongshan Co ltd
Priority date: 2021-07-20
Filing date: 2021-07-20
Publication date: 2021-12-31
Anticipated expiration: 2031-07-20

Abstract

The utility model discloses a cooling fan which comprises a first refrigerant storage device, a second refrigerant storage device, a plurality of heat exchange devices and a plurality of airflow driving devices matched with the heat exchange devices. A refrigerant circulation passage is formed between the first refrigerant storage device and the plurality of heat exchange devices, and the refrigerant required by heat exchange is provided for the heat exchange devices; the plurality of heat exchange devices can respectively cool the refrigerant flowing through the heat exchange devices, and simultaneously cool the air flowing through the heat exchange devices by utilizing the refrigerant, and the cooled air is guided to be ejected through the plurality of airflow driving devices; the second refrigerant storage device is communicated with the first refrigerant storage device and can supplement the refrigerant for the first refrigerant storage device, and the capacity of the second refrigerant storage device is larger than that of the first refrigerant storage device. According to the cooling fan, the first refrigerant storage device with small capacity and the plurality of heat exchange devices are additionally arranged, so that the temperature of the refrigerant is rapidly reduced in the circulation process, and the temperature of air blown out from the air outlet is rapidly reduced.

Description

Cooling fan

Technical Field

The utility model relates to the technical field of cooling fans, in particular to a cooling fan with high-efficiency refrigeration and low humidity and a control method thereof.

Background

The thermantidote has the function of cooling, and its structure is generally including the box, the motor and by motor drive's wind wheel, is provided with water tank and cascade in the box, is provided with the water pump in the water tank, by the normal atmospheric temperature water in the water pump extraction water tank and carry the cascade top with water, through cascade evaporation heat absorption, reduces the temperature of air on every side, is rotated by motor drive wind wheel again and is produced wind, drives the air after the cooling and blows off the box, reaches the purpose of cooling.

In the cooling fan in the prior art, firstly, in order to meet the system requirements, the capacity of a water tank is generally large, and water in the water tank is at room temperature, so that the cooling effect of air is not particularly large when heat exchange is carried out, and a space is also improved; secondly, under high humidity environment, the vapor in the near air of cascade has been close to saturation, and the water through the cascade has been difficult to evaporate, therefore the difference in temperature of air outlet and air intake air is not very big, and the refrigeration effect has the space that promotes yet.

The information disclosed in this background section is only for enhancement of understanding of the general background of the utility model and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a cooling fan with high-efficiency refrigeration and low humidity, which can solve the problem of poor refrigeration effect of the existing cooling fan.

In order to achieve the above object, the present invention provides a cooling fan, which includes a first heat exchange device, a first refrigerant storage device, a second refrigerant storage device, and a first airflow driving device.

The first heat exchange device can cool the refrigerant flowing through the first heat exchange device, and meanwhile, the refrigerant is used for cooling the air flowing through the first heat exchange device.

And a refrigerant circulation passage is formed between the first refrigerant storage device and the first heat exchange device, and the refrigerant circulation passage provides refrigerant for the first heat exchange device.

The second refrigerant storage device and the first refrigerant storage device form a refrigerant circulation passage, the first refrigerant storage device can be supplemented with refrigerants, and the capacity of the second refrigerant storage device is larger than that of the first refrigerant storage device.

The first airflow driving device is matched with the first heat exchange device to guide the air flowing through the first heat exchange device to be ejected.

In the above technical solution, the capacity of the first refrigerant storage device is much smaller than the capacity of the second refrigerant storage device, and the purpose is to make the temperature of the refrigerant lower in a shorter time as the amount of the refrigerant participating in the circulation is smaller.

In one or more embodiments, the second refrigerant storage device, the first heat exchanger, and the first refrigerant storage device are sequentially connected to form a circulation passage.

In one or more embodiments, the first refrigerant storage device is disposed above the second refrigerant storage device, the first refrigerant storage device is provided with an overflow outlet, and the overflow outlet is communicated with the second refrigerant storage device.

In one or more embodiments, a water level sensor assembly is disposed in the first refrigerant storage device, a first pump is disposed on the second refrigerant storage device, and the first pump can be controlled to turn on or off the supply of the refrigerant of the second refrigerant storage device according to a sensing signal of the water level sensor assembly.

In one or more embodiments, the water level sensor assembly includes a low water level sensor disposed in the first refrigerant storage device, and when the low water level sensor sends a low water level sensing signal, the second refrigerant storage device delivers the refrigerant to the first refrigerant storage device.

In one or more embodiments, the water level sensor further includes a high water level sensor disposed in the first refrigerant storage device, the high water level sensor is disposed above the low water level sensor, and when the high water level sensor sends a high water level sensing signal, the second refrigerant storage device stops conveying the cold coal to the first refrigerant storage device.

In one or more embodiments, a semiconductor refrigeration assembly is disposed in the first refrigerant storage device, and the semiconductor refrigeration assembly is configured to cool a refrigerant in the first refrigerant storage device.

In one or more embodiments, an outer portion of the first refrigerant storage device is coated with an insulating layer.

In one or more embodiments, a second pump is disposed between the first refrigerant storage device and the first heat exchange device, and the second pump is configured to drive a refrigerant to circulate between the first heat exchange device and the first refrigerant storage device.

In one or more embodiments, a low water level sensor is disposed in the second refrigerant storage device, and when the amount of refrigerant in the second refrigerant storage device is low, the low water level sensor sends a low water level sensing signal to remind a user to add refrigerant.

In one or more embodiments, the heat exchanger further includes a housing, a chamber is formed in the housing, the housing has an air inlet and an air outlet communicated with the chamber, a first air flow channel is formed between the air inlet and the air outlet, and the first heat exchanging device is disposed in the first air flow channel.

In one or more embodiments, the heat exchanger further includes a second heat exchanger and a second airflow driving device, a circulation path of the refrigerant is formed between the second heat exchanger and the first refrigerant storage device, and the second airflow driving device and the second heat exchanger cooperate to guide and eject air flowing through the second heat exchanger.

In one or more embodiments, a second air flow channel is further formed in the chamber, and the second air flow channel can guide at least part of the air cooled by the second heat exchange device into the first air flow channel.

In one or more embodiments, an air valve is disposed in the second air flow passage, and the air valve is used for controlling the opening degree of the second air flow passage.

In one or more embodiments, the second airflow channel directs the air cooled by the second heat exchange device upstream of the first airflow driving device.

In one or more embodiments, a third airflow channel is further formed in the chamber, the second heat exchange device is disposed in the third airflow channel, and the third airflow channel can discharge the water vapor and the air, which have undergone heat exchange by the second heat exchange device, out of the chamber.

In one or more embodiments, the cooling fan further includes a dehumidifying device disposed in the first air flow channel, the dehumidifying device is disposed upstream and/or downstream of the first heat exchanging device in a direction in which the first air flow channel extends from the air inlet to the air outlet, the dehumidifying device disposed upstream can dehumidify air blown to the first heat exchanging device, and the dehumidifying device disposed downstream dehumidifies air cooled by the first heat exchanging device.

In one or more embodiments, the dehumidification device is a semiconductor dehumidification device or an adsorbent dehumidification device.

The utility model also provides a control method of the cooling fan, which comprises the following steps:

when the heat exchanger works, the first refrigerant storage device provides working refrigerant for the first heat exchange device.

In one or more embodiments, when a water level in the first refrigerant storage device is lower than a preset position, the second refrigerant storage device supplements the first refrigerant storage device with refrigerant.

in a first mode, the first heat exchange device and the first airflow driving device work;

the refrigerant in the first refrigerant storage device flows through the first heat exchange device, the air flowing through the first heat exchange device is cooled to a first cooling temperature by the refrigerant through the first heat exchange device and then is ejected from the air outlet, and the refrigerant is cooled to the first cooling temperature at the first heat exchange device;

in the second mode, the first heat exchange device and the first airflow driving device work at the same time, and the second heat exchange device and the second airflow driving device work;

the refrigerant with the first cooling temperature flows through the second heat exchange device, and the air flowing through the second heat exchange device is cooled to a second cooling temperature by the refrigerant with the first cooling temperature through the second heat exchange device and then is guided into the first air flow channel so as to increase the air volume of the air ejected from the air outlet and/or reduce the temperature of the air ejected from the air outlet;

and/or

And the air flowing through the second heat exchange device is cooled to a second cooling temperature by the second heat exchange device through the refrigerant with the first cooling temperature and then is guided to the third airflow channel to be ejected.

the air inlet side and the air outlet side of the first heat exchange device are both provided with a first dehumidifying device and a second dehumidifying device which are semiconductor dehumidifying devices,

the method comprises the following steps: alternatively controlling the first dehumidifying device or the second dehumidifying device to work, or controlling the first dehumidifying device and the second dehumidifying device to work simultaneously.

Compared with the prior art, the cooling fan has the advantages that the cooling medium in the large-capacity second cooling medium storage device is input into the small-capacity first cooling medium storage device in advance, and the semiconductor refrigeration assembly is arranged in the first cooling medium storage device, so that the cooling medium can be quickly cooled when circulating between the first heat exchange device and the first cooling medium storage device, and the temperature reduction speed is higher when air subjected to heat exchange through the first heat exchange device is blown out from the air outlet; meanwhile, when the refrigerant in the first refrigerant storage device with small capacity is insufficient, the second refrigerant storage device with large capacity is used for supplementing the refrigerant, and the stable operation of the system is ensured.

According to the cooling fan, the first heat exchange device and the second heat exchange device are arranged, so that a refrigerant is cooled for many times on the circulating path, the air temperature of the air outlet is further reduced, and the refrigeration efficiency is improved.

According to the cooling fan, the dehumidification devices are arranged on the two sides of the upstream and downstream of the first heat exchange device, so that air passing through the first heat exchange device is dehumidified for multiple times, the refrigeration effect of the cooling fan in a high-humidity environment is improved, and low-temperature and low-humidity air can be formed at the air outlet.

Drawings

Fig. 1 is a schematic block diagram of a cooling fan according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a semiconductor chilling plate according to an embodiment of the present invention.

Fig. 3 is a schematic block diagram of a cooling fan according to still another embodiment of the present invention.

Fig. 4 is a schematic block diagram of a cooling fan according to still another embodiment of the present invention.

Fig. 5 is a schematic block diagram of a cooling fan according to still another embodiment of the present invention.

Detailed Description

The following detailed description of the present invention is provided in conjunction with the accompanying drawings, but it should be understood that the scope of the present invention is not limited to the specific embodiments.

Throughout the specification and claims, unless explicitly stated otherwise, the word "comprise", or variations such as "comprises" or "comprising", will be understood to imply the inclusion of a stated element or component but not the exclusion of any other element or component.

As shown in fig. 1, an embodiment of the utility model provides a cooling fan 100, which includes a casing 10, a first heat exchanger 20, a first refrigerant storage device 30, a second refrigerant storage device 40, and a first airflow driving device 50.

The casing 10 is used to substantially constitute the overall appearance of the cooling fan 100, and the casing 10 includes, for example, a front panel, a rear panel, side panels, and a top plate, and collectively defines the outer contour of the casing 10 and an inner chamber. Meanwhile, the setting of physical structures such as the chassis including controlling the panel, carrying the handle, taking the gyro wheel can be carried out as required, control panel can be connected with the inside circuit of thermantidote 100 or control assembly to supply the operator to realize adjusting and controlling or setting the function of thermantidote 100, it will be described in the embodiment below to relate to this part to relate to adjusting and controlling or setting the function of thermantidote 100, and other physical structures of selectivity on casing 10 do not expand in detail here because do not relate to the utility model discloses the main points of this application.

The housing 10 has a cavity formed therein for accommodating the first refrigerant storage device 30, the first heat exchanger 20, the second refrigerant storage device 40, and the first airflow driving device 50. The housing 10 has an inlet 11 and an outlet 12 communicating with the chamber, and a first airflow path P1 is formed between the inlet 11 and the outlet 12.

It should be noted that the housing 10, the first refrigerant storage device 30, the first heat exchanging device 20, the second refrigerant storage device 40, and the first airflow driving device 50 which are arranged in the cavity and shown in the drawings of the present application are not illustrated by the cooling fan 100 according to actual production application, but are merely used to illustrate a matching manner of the cooling fan 100 and each component.

It should be noted that the first air flow passage P1 is not limited to a physical structure, that is, the first air flow passage P1 is not strictly separated or limited from other spaces in the chamber, but only illustrates that there is an air flow path in the chamber for the outside air to enter the chamber from the air inlet 11 of the housing 10 and to exit the chamber from the air outlet 12 of the housing 10, so as to form a complete air circulation.

The first refrigerant storage device 30 is used for containing a refrigerant, such as water. The second coolant storage device 40 is also used for containing coolant, such as water. A circulation path is formed between the first refrigerant storage device 30 and the second refrigerant storage device 40, and the capacity of the second refrigerant storage device 40 is larger than that of the first refrigerant storage device 30.

The cooling fan 100 may include a first pump 60 for driving the refrigerant in the second refrigerant storage device 40 to circulate between the second refrigerant storage device 40 and the first refrigerant storage device 30.

Specifically, a high water level sensor 31 and a low water level sensor 32 are disposed in the first refrigerant storage device 30, and the high water level sensor 31 is disposed above the low water level sensor 32. The first pump 60 is in signal connection with the high water level sensor 31 and the low water level sensor 32, and can be controlled to turn on or off the refrigerant delivery of the second refrigerant storage device 40 according to a sensing signal of the water level sensor. That is, when the low water level sensor 32 sends a low water level sensing signal, the first pump 60 is turned on, and the second refrigerant storage device 40 delivers the refrigerant to the first refrigerant storage device 30. When the high water level sensor 31 sends a high water level sensing signal, the first pump 60 is turned off, and the second refrigerant storage device 40 stops delivering the cold coal to the first refrigerant storage device 30.

The cooling fan 100 may further include a second pump 70 for driving the cooling medium in the first cooling medium storage device 30 to circulate between the first heat exchanging device 20 and the first cooling medium storage device 30. The refrigerant is subjected to sensible heat exchange or latent heat exchange in different heat exchange function modules (herein, the first heat exchange device 20), so that the cooling air is ejected from the air outlet 12.

In a specific structural design, the second refrigerant storage device 40 may be supported on a chassis, and a water level indicator and the like may be disposed in the second refrigerant storage device 40 in a matching manner, so as to observe a water level in the second refrigerant storage device 40. The first refrigerant storage device 30 is disposed above the second refrigerant storage device 40, a semiconductor refrigeration assembly 33 is disposed in the first refrigerant storage device 30, and the semiconductor refrigeration assembly 33 is used for cooling the refrigerant in the first refrigerant storage device 30. The first refrigerant storage device 30 is provided with an overflow port, and the overflow port is communicated with the second refrigerant storage device 40.

Hereinafter, how the cooling fan 100 cools the ejection air in the cooling mode, which is a typical cooling mode of the present embodiment, will be described in detail.

When the cooling fan 100 operates, the first refrigerant storage device 30 provides the first heat exchanging device 20 with a working refrigerant. When the water level in the first refrigerant storage device 30 is lower than the preset position, the low water level sensor 32 sends a low water level sensing signal, and the second refrigerant storage device 40 supplements the refrigerant to the first refrigerant storage device 30.

The semiconductor refrigeration unit 33 operates to continuously cool the refrigerant in the first refrigerant storage device 30.

The first heat exchanger 20 is disposed in the first air flow path P1, and is in fluid communication with the first refrigerant storage device 30, so as to cool the refrigerant flowing through the first heat exchanger 20, and the refrigerant exchanges heat at the first heat exchanger 20, thereby reducing its temperature and being stored in the first refrigerant storage device 30. The first heat exchange device 20 can cool the air flowing through the semiconductor refrigeration assembly 33 by using the refrigerant cooled by the semiconductor refrigeration assembly. Since the cooling medium is cooled in the semiconductor cooling module 33 in advance, the first heat exchanging device 20 can provide higher heat exchanging efficiency and increase the cooling capacity of the cooling fan compared with the uncooled cooling medium.

In one embodiment, the first airflow driving device 50 integrally drives the air inside the housing 10 to form an airflow, and the airflow generally has a substantially stable flow direction by utilizing the imbalance of the wind pressures at the wind inlet 11 and the wind outlet 12, so that the airflow can be the airflow that defines the first airflow channel P1. The first airflow driving device 50 is also used to provide the kinetic energy of the air emitted from the air outlet 12. In the physical position, the first airflow driving device 50 may cooperate with the first heat exchanging device 20 to guide the air flowing through the first heat exchanging device 20 to the air outlet 12 for emission. In one embodiment, the first airflow driving device 50 may be a wind wheel disposed in the first airflow passage P1.

The semiconductor cooling component 33 can be a semiconductor cooling plate, which generally includes several N-type semiconductors and P-type semiconductors connected in series at intervals, for example, as shown in fig. 2, when a current passes through the semiconductor cooling plate, electrons in the N-type semiconductors move downward under the action of an electric field, and polymerize with positive charges of the power supply at the lower end to release heat, and holes in the P-type semiconductors move downward under the action of the electric field, and polymerize with negative charges of the power supply at the lower end to release heat; at the same time, the electrons and holes separate at the upper end, absorbing heat during separation. Thus, the semiconductor cooler as a whole has a cold side and a hot side opposite the cold side. In the application of the semiconductor refrigerating sheet, the cold end of the semiconductor refrigerating sheet can be used for cooling the passing refrigerant.

In the above embodiment, the outer portion of the first refrigerant storage device 30 is coated with the insulating layer, wherein the position of the hot end of the semiconductor refrigeration component 33 is not coated with the insulating layer.

Referring to fig. 3, there is shown a further embodiment of a cooling fan 100 according to the present invention. In this embodiment, the second fluid storage device 40 is in communication with the first heat exchange device 20 and the first fluid storage device 30 in sequence to form a circulation path.

The cooling fan 100 also includes a first pump 60 and a second pump 70, the first pump 60 is configured to drive the refrigerant in the second refrigerant storage device 40 to flow to the first heat exchange device 20, the refrigerant cooled by the first heat exchange device 20 flows into the first refrigerant storage device 30, and then flows into the first heat exchange device 20 again under the driving of the second pump 70, and the first heat exchange device 20 cools the air flowing through the first heat exchange device 20 by using the cooled refrigerant.

Similarly, the first refrigerant storage device 30 is provided with a high water level sensor 31 and a low water level sensor 32, the first pump 60 is in signal connection with the high water level sensor 31 and the low water level sensor 32, and the first pump 60 can be controlled to turn on or off the refrigerant delivery of the second refrigerant storage device 40 according to a sensing signal of the water level sensor. That is, when the low water level sensor 32 sends a low water level sensing signal, the first pump 60 is turned on, and the second refrigerant storage device 40 delivers the refrigerant to the first heat exchanger 20. When the high water level sensor 31 sends a high water level sensing signal, the first pump 60 is turned off, and the second refrigerant storage device 40 stops delivering the cold coal to the first heat exchanging device 20.

Referring to fig. 4, there is shown a further embodiment of a cooling fan 100 according to the present invention. In this embodiment, a second heat exchanger 80 and a second airflow driving device 81 are further disposed between the first heat exchanger 20 and the first refrigerant storage device 30. The second heat exchanger 80 is in fluid communication with the first heat exchanger 20 and the first refrigerant storage device 30, and the refrigerant cooled by the first heat exchanger 20 can be further cooled when flowing through the second heat exchanger 80.

The second heat exchanger 80 can also cool the air flowing through the first heat exchanger 20 by using the refrigerant cooled by the first heat exchanger, and when the cooling fan 100 needs a larger cooling capacity and air volume, the air cooled by the second heat exchanger 80 can be used for supplement. Specifically, a second air flow passage P2 is formed in the cavity of the casing 10, and the second air flow passage P2 can guide at least part of the air cooled by the second heat exchanging device 80 into the first air flow passage P1. The second air flow path P2 may be defined by a path having a physical configuration, and the opening degree of the second air flow path P2 is controlled by the air valve 82 provided in cooperation. In this way, the damper 82 controls the amount of the air flow in the second air flow passage P2 through the opening degree adjustment, thereby regulating the amount of the air supplemented into the first air flow passage P1.

The second airflow driving device 81 may be a fan structure that may provide a driving force for the air flowing along the second airflow path P2. In the selection of the position where the second air flow passage P2 introduces air into the first air flow passage P1, in the present embodiment, in the direction that the first air flow passage P1 extends from the air inlet 11 to the air outlet 12, the second air flow passage P2 guides the air cooled by the second heat exchange device 80 to the upstream of the first air flow driving device 50. Of course, in some alternative embodiments, the second airflow path P2 may also directly guide the cooled air to the air outlet 12, so as not to pass through the first airflow path P1, and the second airflow path P2 may also be provided with a separate airflow driving device to achieve the adjustment of the air output and the air speed.

A third air flow path P3 is further formed in the chamber of the casing 10, the second heat exchanging device 80 and the second air flow driving device 81 are disposed in the third air flow path P3, and the third air flow path P3 can discharge the air and the moisture, which have been heat exchanged by the second heat exchanging device 80, to the outside of the chamber.

In this embodiment, a method for controlling the cooling fan 100 is further provided, where the method provides two working modes of the cooling fan 100, including:

passing air through the cooling fan 100;

the cooling fan 100 is switched between a first mode and a second mode to change the temperature and/or the air volume of the air emitted from the air outlet 12; wherein,

in the first mode, the first heat exchange device 20 and the first airflow driving device 50 operate, the refrigerant in the first refrigerant storage device 30 flows through the first heat exchange device 20, the air flowing through the first heat exchange device 20 is cooled to a first cooling temperature by the refrigerant through the first heat exchange device 20 and then is ejected from the air outlet 12, and meanwhile, the refrigerant is cooled to the first cooling temperature at the first heat exchange device 20;

in the second mode, while the first heat exchanger 20 and the first airflow driver 50 work, the second heat exchanger 80 and the second airflow driver 80 work, the refrigerant with the first cooling temperature cooled by the first heat exchanger 20 flows through the second heat exchanger 80, and the air flowing through the second heat exchanger 80 is cooled to the second cooling temperature by the refrigerant with the first cooling temperature through the second heat exchanger 80, and then is partially guided into the first airflow channel P1 to increase the air volume of the air ejected from the air outlet 12 and/or reduce the temperature of the air ejected from the air outlet 12; and the rest of the cooled air is guided into the third airflow path P3 and is emitted (the two ends of the third airflow path P3 may also be provided with an air inlet and an air outlet, and the air inlet and the air outlet may be arranged up and down with the air inlet 11 and the air outlet 12 of the first airflow path P1 on the housing 10).

Referring to fig. 5, there is shown still another embodiment of a cooling fan 100 according to the present invention. In the present embodiment, a dehumidifying apparatus 90 is also provided. The dehumidifying device 90 is disposed in the first air flow path P1, and the dehumidifying device 90 is disposed upstream and/or downstream of the first heat exchanging device 20 in a direction in which the first air flow path P1 extends from the air inlet 11 to the air outlet 12. The dehumidification device 90 located at the upstream can dehumidify the air blown to the first heat exchange device 20, and the dehumidification device 90 located at the downstream can dehumidify the air cooled by the first heat exchange device 20.

The water collecting tank 91 can be disposed below the dehumidification device 90 and the first heat exchange device 20, and the water collecting tank 91 is used for containing the refrigerant cooled by the first heat exchange device 20 and containing the condensed water condensed by the dehumidification device 90. The water collecting tank 91 is in fluid communication with the second heat exchanging device 80 or the first refrigerant storage device 30.

In the embodiment, the second air flow path P2 may also guide the temperature-reduced air between the dehumidification device 90 and the first air flow driving device 50 located downstream in the selection of the position where the second air flow path P2 introduces the air into the first air flow path P1.

Alternatively, the second air flow path P2 guides the air cooled by the second heat exchanging device 80 to between the first heat exchanging device 20 and the dehumidifying device 90 located downstream, that is, the air introduced into the first air flow path P1 by the second air flow path P2 is not cooled by the first heat exchanging device 20 any more, but is dehumidified by the dehumidifying device 90.

In this embodiment, a method for controlling the cooling fan 100 is further provided, where the method provides another three operating modes of the cooling fan 100, including:

passing air through the cooling fan 100;

the cooling fan 100 is switched among a third mode, a fourth mode and a fifth mode to change the humidity of the air emitted from the air outlet 12; wherein,

in the third mode, only the upstream dehumidifying device 90 is started, so that the air is dehumidified to the first humidity after flowing through the upstream dehumidifying device 90, and is ejected from the air outlet 12 after being cooled by the first heat exchanging device 20;

in the fourth mode, only the downstream dehumidifying device 90 is activated, so that the air heat-exchanged by the first heat exchanging device 20 is dehumidified to the second humidity after passing through the downstream dehumidifying device 90, and is emitted from the air outlet 12.

In the fifth mode, both the upstream and downstream dehumidification devices 90 are activated, the upstream dehumidification device 90 performs primary dehumidification on the high-humidity and high-heat airflow entering from the air inlet 11, and the dehumidified airflow is cooled by the first heat exchange device 20, then is dehumidified again to a third humidity by the downstream dehumidification device 90, and is ejected from the air outlet. The dehumidifying device 90 and the first heat exchanging device 20 can be disposed near or near the air outlet 12 to ensure that the cooled air can reach the air outlet 12 through the shortest path of the first airflow channel P1, thereby reducing the dissipation of the cooling energy.

The dehumidifier 90 may be a semiconductor refrigeration dehumidifier, which includes a semiconductor refrigeration sheet, a heat sink, and a heat dissipation fan. In the dehumidification application of the semiconductor refrigeration piece, the cold end of the semiconductor refrigeration piece is utilized to condense and dehumidify the air flowing through, and the radiator and the heat dissipation fan are matched with the hot end of the semiconductor refrigeration piece to dissipate the heat of the heat dissipation end.

The third mode, the fourth mode, and the fifth mode relate to modes of different dehumidification forces, and in each mode, the air volume of the cooling fan and the mode adjustment of the air cooling are both in the first mode and the second mode.

In the above embodiment, when the humidity of the ambient air reaches more than 80%, the power of the cooling fan 100 is maximized in the third mode, and the dehumidification and cooling effects are good. Therefore, the upstream dehumidifying device 90 can be connected to a humidity sensor, and when the humidity sensor detects that the humidity of the ambient air reaches 80% or more, the upstream dehumidifying device 90 can be controlled to start itself; alternatively, the user may control the upstream dehumidifier 90 to be activated by himself or herself according to an external remote controller or control panel. When the user feels that the humidity of the cold air blown out from the air outlet is large (the humidity is larger than 90%), the cooling fan 100 can be automatically adjusted to start the fourth mode, namely, the downstream dehumidifying device 90 is started to work, and the dehumidifying effect is good. When the ambient air humidity reaches about 80% and the user feels that the cold air humidity blown out from the air outlet is higher (the humidity is higher than 90%), the cooling fan 100 operates in the fifth mode, and the dehumidification and cooling effects are good.

In the above-described embodiments, both the first heat exchange device 20 and the second heat exchange device 80 may be wet curtain paper heat exchangers. The second heat exchanger 80, the first heat exchanger 20, the dehumidifier 90, the first airflow driving device 50, the second airflow driving device 81, the air valve 82, the second pump 60, the second pump 70, etc. in the cooling fan 100 may be controlled by a built-in controller, for example, and may be adjusted by a user as required by cooperating with a receiver, a remote controller, an integrated control panel, etc. to control the functions of cooling and emitting the airflow. The Controller may be an integrated circuit including a Microcontroller (MCU), and as is well known to those skilled in the art, the microcontroller may include a Central Processing Unit (CPU), a Read-Only Memory (ROM), a Random Access Memory (RAM), a timing module, a digital-to-analog conversion (a/D Converter), and several input/output ports. Of course, the controller may also be an Application Specific Integrated Circuit (ASIC) or a Field Programmable Gate Array (FPGA).

In an embodiment of the present invention, the capacity of the first refrigerant storage device is set to 2L, the capacity of the second refrigerant storage device is set to 30L, the cooling fan and a common cooling fan (only with a large-capacity refrigerant storage device) in the market are placed in a laboratory with a working condition temperature of 35 ℃ and a humidity of 40%, and simultaneously the cooling fan is started to operate and a temperature acquisition device is placed at the air outlet. After 1 minute, the temperature of the air outlet of the cooling fan is reduced to 29 ℃, and at the moment, the temperature of the air outlet of the common cooling fan is reduced to 32 ℃ at the lowest. After 3 minutes, the temperature of the air outlet of the cooling fan is reduced to 28 ℃ at the lowest, and at the moment, the temperature of the air outlet of the common cooling fan is reduced to 30 ℃. After a period of time, the temperature of the air outlet of the cooling fan is stabilized at about 28.5 ℃, and the temperature of the air outlet of the common cooling fan is stabilized at about 30.5 ℃.

Therefore, the temperature of the air outlet of the traditional cooling fan can be reduced by 4-5 ℃ after the traditional cooling fan operates stably, the cooling fan has high temperature reduction speed after being started, the temperature of the air outlet can be reduced by 6-7 ℃ after the traditional cooling fan operates stably, and the air temperature of the air outlet can be cooled quickly in a shorter time.

An exemplary workflow of the cooling fan 100 of the present invention is as follows:

after the cooling fan 100 is started by inserting electricity, the first pump 60 pumps the refrigerant from the second refrigerant storage device 40 to the first refrigerant storage device 30, the refrigerant is primarily cooled by the semiconductor refrigeration assembly 33, the second pump 70 pumps the refrigerant from the first refrigerant storage device 30 to the first heat exchange device 20 for air cooling, and the first airflow driving device 50 guides the cooled air to the air outlet 12 through the first airflow channel P1 to blow out the cooled air.

On the first heat exchange device 20, the air at the air inlet 11 passes through the wet first heat exchange device 20, the refrigerant (water) evaporates to absorb the heat of the surrounding air, so that the air is cooled, meanwhile, the heat of the refrigerant is absorbed, the refrigerant is cooled, and the cooled refrigerant enters the second heat exchange device 80.

The second heat exchanging device 80 cools the air flowing through it by using the cooled refrigerant, and further cools the refrigerant at the same time, the second airflow driving device 81 guides a part of the cooled air to the first airflow channel P1 or the air outlet 12 through the second airflow channel P2, and the opening angle of the air valve 82 can be adjusted as required. The second air flow driving means 81 discharges another part of the moisture to the outdoor side through the third air flow path P3.

When the amount of refrigerant in the first refrigerant storage device 30 is large, the refrigerant flows into the second refrigerant storage device 40 through the overflow port.

When the amount of refrigerant in the first refrigerant storage device 30 is extremely low, the low water level sensor 32 will detect a signal and transmit the signal to the controller, so as to control the first pump 60 to be turned on, and supplement the refrigerant in the second refrigerant storage device 40 to the system.

When the semiconductor refrigeration and dehumidification device is powered on to work, the high-humidity and high-heat ambient air firstly passes through the low-temperature semiconductor refrigeration and dehumidification device positioned at the upstream, part of vapor in the air is liquefied into water on the semiconductor refrigeration and dehumidification device and flows into the water collection tank 91, meanwhile, the air temperature is reduced, the air passes through the first heat exchange device 20 for heat exchange, the temperature is reduced again, the air passes through the semiconductor refrigeration and dehumidification device positioned at the downstream again, part of vapor in the air is also converted into water on the component and flows into the water collection tank 91, and the low-temperature and low-humidity air is finally blown to a consumer through the air outlet 12 to enable the consumer to feel cool.

The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to limit the utility model to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain certain principles of the utility model and its practical application to enable one skilled in the art to make and use various exemplary embodiments of the utility model and various alternatives and modifications as are suited to the particular use contemplated. It is intended that the scope of the utility model be defined by the claims and their equivalents.

Claims

1. The utility model provides a thermantidote, its characterized in that includes:

the first heat exchange device can cool the refrigerant flowing through the first heat exchange device, and simultaneously, the refrigerant is used for cooling the air flowing through the first heat exchange device;

the first refrigerant storage device and the first heat exchange device form a refrigerant circulation passage and provide a refrigerant for the first heat exchange device;

the second refrigerant storage device and the first refrigerant storage device form a refrigerant circulation passage, and can supplement refrigerants for the first refrigerant storage device, and the capacity of the second refrigerant storage device is larger than that of the first refrigerant storage device;

the first air flow driving device is matched with the first heat exchange device to guide the air flowing through the first heat exchange device to be ejected.

2. The cooling fan according to claim 1, wherein the second cooling medium storage device, the first heat exchanging device, and the first cooling medium storage device are connected in series to form a circulation path.

3. The cooling fan according to claim 1, wherein the first cooling medium storage device is disposed above the second cooling medium storage device, and the first cooling medium storage device is provided with an overflow outlet, and the overflow outlet is communicated with the second cooling medium storage device.

4. The cooling fan according to claim 1, wherein a water level sensor assembly is disposed in the first cooling medium storage device, and a first pump is disposed on the second cooling medium storage device, and the first pump is controlled to turn on or off a cooling medium supply of the second cooling medium storage device according to a sensing signal of the water level sensor assembly.

5. The cooling fan according to claim 4, wherein the water level sensor assembly includes a low water level sensor disposed in the first cooling medium storage device.

6. The cooling fan according to claim 5, wherein the water level sensor further comprises a high water level sensor disposed in the first cooling medium storage device, and the high water level sensor is disposed above the low water level sensor.

7. The cooling fan according to claim 1, wherein a semiconductor cooling module is provided in the first cooling medium storage device.

8. The cooling fan according to claim 1, wherein an insulating layer is coated on an outer side of the first cooling medium storage device.

9. The cooling fan according to claim 1, wherein a second pump is disposed between the first cooling medium storage device and the first heat exchanging device.

10. The cooling fan according to claim 1, further comprising a housing, wherein a chamber is formed in the housing, the housing has an air inlet and an air outlet communicated with the chamber, a first air flow channel is formed between the air inlet and the air outlet, and the first heat exchanging device is disposed in the first air flow channel.

11. The cooling fan according to claim 10, further comprising:

a second heat exchange device and the first refrigerant storage device form a refrigerant circulation passage,

and the second air flow driving device is matched with the second heat exchange device to guide the air flowing through the second heat exchange device to be ejected.

12. The cooling fan according to claim 11, wherein a second air flow channel is further formed in the chamber, and the second air flow channel guides at least a part of the air cooled by the second heat exchanging device into the first air flow channel.

13. The cooling fan according to claim 12, wherein an air valve is provided in the second air flow path, and the air valve is configured to control an opening degree of the second air flow path.

14. The cooling fan according to claim 12, wherein a third air flow channel is further formed in the chamber, the second heat exchanging device is disposed in the third air flow channel, and the third air flow channel can discharge the vapor and the air, which have been heat exchanged by the second heat exchanging device, out of the chamber.

15. The cooling fan according to claim 10, further comprising a dehumidifying device disposed on an air inlet side and/or an air outlet side of the first heat exchanging device.

16. The cooling fan according to claim 15, wherein the dehumidifying apparatus is a semiconductor dehumidifying apparatus or an adsorbent dehumidifying apparatus.