CN112566442A - Active heat dissipation device - Google Patents
Active heat dissipation device Download PDFInfo
- Publication number
- CN112566442A CN112566442A CN201910912644.0A CN201910912644A CN112566442A CN 112566442 A CN112566442 A CN 112566442A CN 201910912644 A CN201910912644 A CN 201910912644A CN 112566442 A CN112566442 A CN 112566442A
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- Prior art keywords
- condenser
- evaporator
- pipeline
- container
- cold
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 31
- 239000000110 cooling liquid Substances 0.000 claims abstract description 38
- 239000007788 liquid Substances 0.000 claims abstract description 29
- 239000012530 fluid Substances 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 238000004062 sedimentation Methods 0.000 claims abstract description 5
- 239000002826 coolant Substances 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 11
- 238000001816 cooling Methods 0.000 abstract description 7
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides an active heat dissipation device, comprising: container, evaporator, condenser, fan wall, hot superficial tedge pipeline and cold settlement pipeline. The container stores cooling liquid to soak the electronic heating element; the evaporator is arranged in the container; the condenser is arranged outside the container and above the evaporator; the fan wall is arranged on the condenser; the hot buoyancy pipeline and the cold sedimentation pipeline are both arranged in the container and are connected with the condenser and the evaporator. The working fluid in the evaporator is evaporated into gas by absorbing the heat energy of the cooling liquid and is actively sent into the condenser from the heat riser pipeline; after the air is condensed into liquid, the liquid is actively sent back to the evaporator from the cold settling pipeline downwards. Therefore, the effects of active circulation flow of working fluid, reduction of the whole volume, reduction of occupied space, avoidance of the heating problem and the service life problem of the compressor and the effects of more direct cooling mode and quicker cooling effect can be achieved.
Description
Technical Field
The invention relates to the field of heat dissipation of electronic heating parts, in particular to active heat dissipation equipment with working fluid capable of actively circulating.
Background
The heat dissipation device is mainly applied to heat dissipation of an electronic heating element. The electronic heating element can be, for example, a motherboard or other component used to constitute the server device.
The conventional heat dissipating apparatus includes two main bodies which are far away from each other and are respectively disposed in different spaces, and the two main bodies are connected to each other by a pipe.
One of the two main bodies contains cooling liquid and the electronic heating element is soaked in the cooling liquid; the evaporator structure and the condenser and fan structure are respectively arranged on the two main bodies.
Therefore, the conventional heat dissipation device has the following disadvantages: first, since the working fluid cannot actively circulate between the two main bodies, the compressor must be used, which causes problems such as heat generation and life span of the compressor itself, in addition to cost increase. Secondly, because two main parts are far away from each other and are respectively configured in different spaces, and in addition, a compressor is also needed, the problem of overlarge whole volume is caused. Thirdly, because the condenser in the condenser and fan structure is arranged in one of the two main bodies and is not integrated, the problem that the condenser cannot be directly cooled is caused, and the cooling effect is slow.
Disclosure of Invention
The invention aims to provide active heat dissipation equipment, which can enable working fluid to actively flow in a circulating manner.
In order to achieve the above object, the present invention provides an active heat dissipation device for dissipating heat from an electronic heat generating component immersed in a coolant by using a working fluid, the active heat dissipation device comprising: the container stores the cooling liquid and soaks the electronic heating element in the cooling liquid, and the cooling liquid absorbs the heat energy of the electronic heating element; an evaporator disposed in the container for absorbing heat energy of the cooling liquid; the condenser is arranged outside the container and is positioned above the evaporator; a fan wall, which is arranged corresponding to the condenser and comprises a plurality of fans, and the fan wall supplies air to the condenser to dissipate heat; a heat buoyancy pipeline arranged in the container and connected with the condenser and the evaporator; and a cold settling pipe arranged in the container and connecting the condenser and the evaporator; the working fluid in the evaporator absorbs heat to be evaporated into gas, the gas is sent into the condenser through the thermal buoyancy pipe by utilizing a thermal buoyancy principle to be condensed into liquid, and the liquid is sent back to the evaporator through the cold sedimentation pipe by utilizing a cold sedimentation principle.
The active heat dissipation device, wherein: the fan wall, the condenser and the evaporator are arranged above each other.
The active heat dissipation device, wherein: the container is provided with a liquid storage space, the cooling liquid is stored in the liquid storage space, and the fan wall, the condenser, the evaporator and the liquid storage space are sequentially arranged from top to bottom.
The active heat dissipation device, wherein: the heat buoyancy pipeline is provided with a first upper end and a first lower end, the first lower end is connected to the upper surface of the evaporator, and the first upper end is connected to the bottom surface or the side surface of the condenser; the cold-sinking pipeline is provided with a second upper end and a second lower end, the second lower end is connected to the upper surface of the evaporator, and the second upper end is connected to the bottom surface or the side surface of the condenser.
The active heat dissipation device, wherein: the heat buoyancy pipeline is a pure straight pipe, the cold sinking pipeline comprises an evaporator coil which is positioned at the middle section part of the cold sinking pipeline and is coiled up and down in a reciprocating manner, and the heat buoyancy pipeline and the cold sinking pipeline are both positioned above the liquid level of the cooling liquid.
The active heat dissipation device, wherein: the condenser is characterized by also comprising a controller, wherein the plurality of fans of the fan wall are arrayed and arranged side by side, the controller controls the plurality of fans to be selectively started, stopped and partially started, the condenser is integrally formed with a horizontal wind receiving surface, and the fan wall supplies wind towards the direction of the horizontal wind receiving surface.
The active heat dissipation device, wherein: the condenser comprises a pair of connecting parts, a plurality of condenser tubes and a plurality of radiating fin rows, wherein the connecting parts are horizontally arranged side by side and erected on the upper surface of the outer side of the container, the condenser tubes are horizontally arranged side by side and bridged between the connecting parts, and each radiating fin row is respectively connected between any two adjacent condenser tubes for heat conduction.
The active heat dissipation device, wherein: the fan wall comprises a plurality of fan rows, each fan row comprises a plurality of fans, and each fan row respectively corresponds to two adjacent radiating fins for air supply.
The active heat dissipation device, wherein: the pair of connecting parts are respectively provided with an inlet and an outlet, and the inlet and the outlet are respectively used for the working fluid to enter and exit.
The active heat dissipation device, wherein: the radiating fin rows form a horizontal wind receiving surface together, and the fan wall supplies air towards the direction of the horizontal wind receiving surface.
The active heat dissipation device, wherein: the evaporator is correspondingly positioned above the liquid level of the cooling liquid.
Compared with the prior art, the invention has the following effects: the active circulation flow of the working fluid can be realized, so that the effect of reducing the whole volume and the occupied space is realized, the heating problem and the service life problem of the compressor can be avoided, and even the cooling mode is more direct and effective, and the cooling effect is quicker.
Drawings
Fig. 1 is an exploded perspective view of the heat dissipating apparatus of the present invention.
Fig. 2 is a perspective assembly view of the heat dissipation apparatus of the present invention.
FIG. 3 is a right side view of the present invention in accordance with FIG. 2.
FIG. 4 is a schematic cross-sectional view of the present invention as viewed from the front in FIG. 2. Description of reference numerals: 1-a container; 1 a-a container body; 1 b-upper cover; 11-a reservoir space; 12-the outer side; 121-upper face; 2-an evaporator; 21-above; 3-a condenser; 31. 32-a connecting portion; 311-an inlet; 321-an outlet; 33-condenser tubes; 34-a heat sink row; 4-a fan wall; 41-fan row; 5-a thermal buoyancy pipeline; 51-a first upper end; 52-first lower end; 6-cold settling pipeline; 61-a second upper end; a second lower end; 63-evaporator coil; 7-a controller; f-horizontal wind surface; an H-electronic heating element; w-cooling liquid; w1-liquid level.
Detailed Description
The following detailed description and technical contents of the present invention are described with reference to the drawings, which are provided for reference and illustration purposes only and are not intended to limit the present invention.
As shown in fig. 4, the present invention provides an active heat dissipation apparatus, which can be applied to various electronic heating elements H, such as a motherboard and other components shown in the drawings.
As shown in fig. 1 to 4, the active heat dissipation device (hereinafter, referred to as a heat dissipation device) of the present invention can dissipate heat of a plurality of electronic heating elements H immersed in a cooling liquid W by using a working fluid (not shown). The heat dissipating apparatus of the present invention comprises: a container 1, an evaporator 2, a condenser 3, a fan wall 4, a hot uplift line 5 and a cold sink line 6, and preferably a controller 7.
The container 1 is used for storing the cooling liquid W, and each electronic heating element H is soaked in the cooling liquid W, so that the cooling liquid W absorbs the heat energy of the electronic heating element H. In detail, the container 1 has a liquid storage space 11, and the cooling liquid W is stored in the liquid storage space 11; the container 1 also has an outer side 12. In addition, the container 1 may be of a two-piece design and, as shown in fig. 2, comprises a container body 1a and an upper cover 1b, the container body 1a has a liquid storage space 11, and the upper cover 1b covers the container body 1a corresponding to the liquid storage space 11; the upper cover 1b may also be a transparent cover.
The evaporator 2 is suspended in the container 1 so that the evaporator 2 can be positioned above the liquid level W1 of the cooling liquid W as shown in fig. 4, and the evaporator 2 can absorb the heat energy of the cooling liquid W in the container 1. The heat energy absorbed by the cooling liquid W (from the electronic heat generating component H) can be absorbed by the working fluid in the evaporator 2 via the air in the container 1. In other embodiments not shown in the drawings, the evaporator 2 may also be immersed in the cooling liquid W or merely contacted with the cooling liquid W to directly absorb the heat energy of the cooling liquid W.
The condenser 3 is arranged outside 12 of the container 1 above the evaporator 2, in other words, as shown in fig. 4, the condenser 3 and the evaporator 2 are arranged close to each other and above each other. Specifically, condenser 3 is provided on upper surface 121 of outer side 12.
The fan wall 4 is arranged corresponding to the condenser 3, so that the fan wall 4 can supply air to the condenser 3 to dissipate heat. Preferably, the condenser 3 is a horizontally expanded structure, thereby facilitating the fan wall 4 to blow air to the condenser 3 in a face-to-face manner, and particularly suitable for a state where the fan wall 4, the condenser 3 and the evaporator 2 are disposed on top of each other. It should be noted that the fan wall 4 includes a plurality of fans (no reference numeral), and the plurality of fans are arranged in an array with each other to form a wall as shown in fig. 1. Therefore, the fan maintenance and replacement are facilitated, namely, the fan is maintained or replaced when the fan fails.
The hot buoyancy pipeline 5 and the cold sinking pipeline 6 are both disposed in the container 1, and the hot buoyancy pipeline 5 and the cold sinking pipeline 6 are both connected between the condenser 3 and the evaporator 2, so that the evaporator 2 is suspended in the container 1 by the connection of the hot buoyancy pipeline 5 and the cold sinking pipeline 6 as shown in fig. 3. It should be noted that, as shown in fig. 4, the hot float line 5 and the cold sink line 6 are both located above the liquid level W1 of the coolant W.
In this way, the fan wall 4, the condenser 3, the evaporator 2, and the cooling liquid W or/and the electronic heat generating components H contained in the liquid storage space 11 are close to each other and sequentially disposed from top to bottom (see fig. 4), and the condenser 3, the evaporator 2, and the cooling liquid W or/and the electronic heat generating components H are disposed above and below each other with a space therebetween. The terms "or/and" as used herein, are exemplified by the following: x comprises A or/and B, meaning: x comprises A or B, or X comprises A and B.
The pipeline of the present invention is filled with the working fluid, such as the hot riser pipeline 5 or/and the cold sinking pipeline 6, and can actively circulate.
Therefore, as each electronic heating element H is soaked in the cooling liquid W, the cooling liquid W can absorb the heat energy of each electronic heating element H; since the evaporator 2 is disposed in the container 1, in this embodiment, it is further located above the liquid level W1 of the cooling liquid W, so that the working fluid in the evaporator 2 can absorb the heat energy of the cooling liquid W through the air in the container 1 and evaporate into gas; at this time, since the condenser 3 and the evaporator 2 are disposed up and down, the gas can be actively sent into the condenser 3 from the bottom up through the thermal uplift pipe 5 by utilizing the thermal uplift principle to be condensed into liquid; since the condenser 3 and the evaporator 2 are disposed above each other, the liquid can be actively returned to the evaporator 2 from top to bottom via the cold-settling pipe 6 by utilizing the principle of cold-settling, and the operation is repeated to achieve the effect of actively circulating the working fluid.
The invention has the following effects: by means of special structural design, apart from being integrated into a single device (the heat dissipation device of the invention) to shorten the distance and reduce the whole volume and reduce the occupied space, the working fluid can also utilize the heat floating principle to actively send the evaporated gas upwards into the condenser 3 and utilize the cold sinking principle to actively send the condensed liquid downwards back to the evaporator 2, so that the working fluid can actively circulate and flow, and further solve the problems of cost increase and volume corresponding increase of the existing compressor, and can avoid the heating problem and service life problem of the compressor; even because the condenser 3 is also integrated in the same equipment (the heat dissipation device of the present invention), the cooling is more direct and efficient, and the cooling effect is faster.
In detail, as shown in fig. 1 and 4, the thermal uplift pipe 5 is a simple straight pipe and has a first upper end 51 and a first lower end 52, the first lower end 52 is connected to the output hole (not marked with a symbol) of the upper surface 21 of the evaporator 2, and the first upper end 51 is connected to the inlet 311 of the bottom surface or the side surface of the condenser 3; the cold-sink line 6 has a second upper end 61 and a second lower end 62, and preferably also has an evaporator coil 63 which is wound up and down reciprocally, the evaporator coil 63 being connected between the second upper and lower ends 61, 62 at the middle portion of the cold-sink line 6, wherein the second lower end 62 is connected to an input hole (not marked) of the upper face 21 of the evaporator 2, and the second upper end 61 is connected to an outlet 321 of the bottom face or side face of the condenser 3.
As shown in fig. 1 to 4, the condenser 3 includes a pair of connecting portions 31 and 32, a plurality of condenser tubes 33, and a plurality of fin rows 34. One end and the other end of the two connecting portions 31 and 32 have the inlet 311 and the outlet 321, respectively, so that the working fluid can enter and exit the condenser 3 through the inlet 311 and the outlet 321, respectively. The two connecting parts 31, 32 are horizontally arranged side by side and are arranged on the upper surface part 121 of the outer side 12 of the container 1; the plurality of condenser tubes 33 are also horizontally arranged side by side between the two connecting portions 31, 32, so that a space (not labeled) is formed between any two adjacent condenser tubes 33. Each fin row 34 is embedded and connected between any two adjacent condenser tubes 33 corresponding to each space for heat conduction. Further, the condenser 3 can thus be of the horizontally expanded configuration described above, so that the condenser 3 is formed integrally with a horizontal wind receiving surface F as shown in fig. 1 and 4; preferably, the rows of fins 34 together form a horizontal wind-receiving surface F.
As shown in fig. 1, 2 and 4, the fan wall 4 may further include a plurality of fan rows 41 arranged side by side, each fan row 41 having a plurality of fans, for each row, each fan row 41 supplies air corresponding to two adjacent heat sink rows 34; as a whole, the fan wall 4 blows air toward the horizontal wind receiving surface F. In this way, when the heat dissipation apparatus of the present invention further includes the controller 7 (for example, with PID control: proportional-integral-derivative control), the controller 7 can be used to control the local fans or the local fan rows 41 in the fan wall 4 to start, for example, control the single row of the fan rows 41 to start air supply, or control the middle fan of any three fans to stop air supply, so as to have the effects of saving energy and saving electricity when the heat generated by the electronic heating element H is low. Of course, the controller 7 can also control all fans of the fan wall 4 to be started or stopped completely according to the requirement; the controller 7 is disposed on the outer side 12 of the container 1 and electrically connected to the fan wall 4.
In addition, the invention has other effects: because the two-phase evaporation and condensation path of the working fluid is designed, the cooling liquid W is not required to be driven by gas power to change the state, and the conversion efficiency can be improved. Due to the serial heat dissipation design, the Power Usage Efficiency (PUE) value can be reduced, and the liquid temperature of the cooling liquid W can be controlled more accurately.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings are included in the scope of the present invention.
Claims (11)
1. An active heat dissipation device for dissipating heat from an electronic heat generating component immersed in a coolant by using a working fluid, the active heat dissipation device comprising:
the container stores the cooling liquid and soaks the electronic heating element in the cooling liquid, and the cooling liquid absorbs the heat energy of the electronic heating element;
an evaporator disposed in the container for absorbing heat energy of the cooling liquid;
the condenser is arranged outside the container and is positioned above the evaporator;
a fan wall, which is arranged corresponding to the condenser and comprises a plurality of fans, and the fan wall supplies air to the condenser to dissipate heat;
a heat buoyancy pipeline arranged in the container and connected with the condenser and the evaporator; and
a cold settling pipeline arranged in the container and connected with the condenser and the evaporator;
the working fluid in the evaporator absorbs heat to be evaporated into gas, the gas is sent into the condenser through the thermal buoyancy pipe by utilizing a thermal buoyancy principle to be condensed into liquid, and the liquid is sent back to the evaporator through the cold sedimentation pipe by utilizing a cold sedimentation principle.
2. The active heat sink of claim 1, wherein: the fan wall, the condenser and the evaporator are arranged above each other.
3. An active heat sink apparatus as claimed in claim 2, wherein: the container is provided with a liquid storage space, the cooling liquid is stored in the liquid storage space, and the fan wall, the condenser, the evaporator and the liquid storage space are sequentially arranged from top to bottom.
4. The active heat sink of claim 1, wherein: the heat buoyancy pipeline is provided with a first upper end and a first lower end, the first lower end is connected to the upper surface of the evaporator, and the first upper end is connected to the bottom surface or the side surface of the condenser; the cold-sinking pipeline is provided with a second upper end and a second lower end, the second lower end is connected to the upper surface of the evaporator, and the second upper end is connected to the bottom surface or the side surface of the condenser.
5. The active heat sink of claim 1, wherein: the heat buoyancy pipeline is a pure straight pipe, the cold sinking pipeline comprises an evaporator coil which is positioned at the middle section part of the cold sinking pipeline and is coiled up and down in a reciprocating manner, and the heat buoyancy pipeline and the cold sinking pipeline are both positioned above the liquid level of the cooling liquid.
6. The active heat sink of claim 1 further comprising a controller, said plurality of fans of said fan wall being arranged in an array and side-by-side relationship with each other, said controller controlling said plurality of fans to be selectively activated, deactivated, and partially activated, said condenser integrally forming a horizontal wind receiving surface, said fan wall blowing air in a direction toward said horizontal wind receiving surface.
7. The active heat sink of claim 1, wherein: the condenser comprises a pair of connecting parts, a plurality of condenser tubes and a plurality of radiating fin rows, wherein the connecting parts are horizontally arranged side by side and erected on the upper surface of the outer side of the container, the condenser tubes are horizontally arranged side by side and bridged between the connecting parts, and each radiating fin row is respectively connected between any two adjacent condenser tubes for heat conduction.
8. The active heat sink of claim 7, wherein: the fan wall comprises a plurality of fan rows, each fan row comprises a plurality of fans, and each fan row respectively corresponds to two adjacent radiating fins for air supply.
9. The active heat sink of claim 7, wherein: the pair of connecting parts are respectively provided with an inlet and an outlet, and the inlet and the outlet are respectively used for the working fluid to enter and exit.
10. The active heat sink of claim 7, wherein: the radiating fin rows form a horizontal wind receiving surface together, and the fan wall supplies air towards the direction of the horizontal wind receiving surface.
11. The active heat sink of claim 1, wherein: the evaporator is correspondingly positioned above the liquid level of the cooling liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910912644.0A CN112566442A (en) | 2019-09-25 | 2019-09-25 | Active heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910912644.0A CN112566442A (en) | 2019-09-25 | 2019-09-25 | Active heat dissipation device |
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| Publication Number | Publication Date |
|---|---|
| CN112566442A true CN112566442A (en) | 2021-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910912644.0A Pending CN112566442A (en) | 2019-09-25 | 2019-09-25 | Active heat dissipation device |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006269695A (en) * | 2005-03-23 | 2006-10-05 | Nissin Electric Co Ltd | Power apparatus |
| CN101179917A (en) * | 2006-11-08 | 2008-05-14 | 财团法人工业技术研究院 | Loop type hidden heat cooling method and loop type hidden heat radiating module |
| JP2012067981A (en) * | 2010-09-24 | 2012-04-05 | Fujitsu Ltd | Cooling system |
| CN206118286U (en) * | 2016-10-19 | 2017-04-19 | 许继电源有限公司 | Machine heat abstractor and soak heat dissipation machine that charges |
| WO2017188147A1 (en) * | 2016-04-27 | 2017-11-02 | 東芝ライフスタイル株式会社 | Refrigerator |
| CN211184715U (en) * | 2019-09-25 | 2020-08-04 | 营邦企业股份有限公司 | Active heat dissipation device |
-
2019
- 2019-09-25 CN CN201910912644.0A patent/CN112566442A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006269695A (en) * | 2005-03-23 | 2006-10-05 | Nissin Electric Co Ltd | Power apparatus |
| CN101179917A (en) * | 2006-11-08 | 2008-05-14 | 财团法人工业技术研究院 | Loop type hidden heat cooling method and loop type hidden heat radiating module |
| JP2012067981A (en) * | 2010-09-24 | 2012-04-05 | Fujitsu Ltd | Cooling system |
| WO2017188147A1 (en) * | 2016-04-27 | 2017-11-02 | 東芝ライフスタイル株式会社 | Refrigerator |
| CN206118286U (en) * | 2016-10-19 | 2017-04-19 | 许继电源有限公司 | Machine heat abstractor and soak heat dissipation machine that charges |
| CN211184715U (en) * | 2019-09-25 | 2020-08-04 | 营邦企业股份有限公司 | Active heat dissipation device |
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