CN112553662A - Method for plating precious metal on silver substrate - Google Patents
Method for plating precious metal on silver substrate Download PDFInfo
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- CN112553662A CN112553662A CN202011182262.6A CN202011182262A CN112553662A CN 112553662 A CN112553662 A CN 112553662A CN 202011182262 A CN202011182262 A CN 202011182262A CN 112553662 A CN112553662 A CN 112553662A
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- electroplating
- silver
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- noble metal
- cleaning
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
Abstract
The invention provides a method for plating a precious metal on a silver substrate, which comprises an electroplating process, wherein the electroplating process comprises the following steps: s101, silver plating: the silver plating device is used for plating silver on the surface of a silver substrate; s102, precious metal electroplating: the electroplating method is used for electroplating noble metal on the silver-plated surface. The jewelry is a decoration which is popular with women, but the jewelry such as gold, color gold, platinum and the like is cast by precious metals such as gold, platinum and the like, so that the price is high, and the purchase of women is severely limited. With the popularization of electroplating technology, silver jewelry can form gold, color gold, platinum and other electric coatings on the surface through electroplating, the appearance of the silver jewelry is almost the same as that of gold jewelry, and the cost is much lower. However, the silver substrate has relatively active property, so that the surface is easy to oxidize, the electroplating firmness is poor in the precious metal electroplating process, and a part of electroplated layer is easy to fall off after long-time use. The method for plating the precious metal on the silver substrate can effectively solve the problem of reduced electroplating effect.
Description
Technical Field
The invention relates to a metal surface treatment technology, in particular to electroplating equipment and a method for plating noble metals on metal materials such as silver and the like.
Background
The jewelry is a decoration which is popular with women, but the jewelry such as gold, color gold, platinum and the like is cast by precious metals such as gold, platinum and the like, so that the price is high, and the purchase of women is severely limited. With the popularization of electroplating technology, silver jewelry can form gold, color gold, platinum and other electric coatings on the surface through electroplating, the appearance of the silver jewelry is almost the same as that of gold jewelry, and the cost is much lower. However, the silver substrate has relatively active property, so that the surface is easy to oxidize, the electroplating firmness is poor in the precious metal electroplating process, and a part of electroplated layer is easy to fall off after long-time use.
Disclosure of Invention
The invention provides a method for plating a precious metal on a silver substrate, which at least solves the problem that the electroplating effect is easy to reduce due to relatively active property of the silver substrate in the prior art.
The invention provides a method for plating a precious metal on a silver substrate, which comprises an electroplating process, wherein the electroplating process comprises the following steps:
s101, silver plating: the silver plating device is used for plating silver on the surface of a silver substrate;
s102, precious metal electroplating: the electroplating method is used for electroplating noble metal on the silver-plated surface.
Further, the noble metal comprises one or more of pure gold, silver, rhodium, platinum, ruthenium, rhodium, palladium, osmium, iridium and platinum.
Further, the method for plating the silver substrate with the noble metal further comprises a cleaning process for cleaning the silver-based surface before electroplating, wherein the cleaning process comprises the following steps:
s201, ultrasonic cleaning: for cleaning silver-based surfaces.
Still further, the cleaning process further includes:
s202, electrolysis: for removing oxides or inorganic salts from silver-based surfaces after ultrasonic cleaning
Further, S101, silver plating comprises the following steps:
s1011, placing the silver substrate in silver electroplating liquid, and electroplating for 1-10 min;
s1012, cleaning the electroplated silver substrate for 1-3 times by adopting a dipping method.
Further, s102. noble metal plating includes the steps of:
s1021, placing the silver-plated silver substrate in precious metal electroplating liquid, and electroplating for 1-10 min;
s1022, cleaning the silver substrate electroplated with the noble metal for 1-3 times by adopting a pickling method.
Further, the noble metal electroplating solution is a solution containing one or more compounds of noble metal chloride salt, noble metal nitrate, noble metal sulfate and noble metal complex.
Further, the electroplating process also comprises an electroplating solution effective content monitoring process, and the electroplating solution effective content monitoring process comprises the following steps:
s301, collecting the content of effective noble metal in electroplating solution before S101 silver plating or S102 noble metal electroplating;
s302, calculating the electric quantity required for completely converting the effective noble metals in the electroplating solution into the noble metal simple substances;
s302, in the electroplating process, monitoring the current output condition, collecting the information of the electric quantity consumed in the electroplating process, and ensuring that the electric quantity consumed in the electroplating process does not exceed 95-99% of the electric quantity calculated in the step S302.
Further, the gold plating process comprises the following steps:
s401, according to metal elements required by the K gold, taking electroplating raw materials of corresponding metals, and mixing the electroplating raw materials with water to form electroplating solution, wherein the molar ratio of each metal in the electroplating solution is the same as the content ratio of each metal in the K gold;
s402, placing the silver-plated silver substrate in a K gold electroplating solution, and electroplating for 1-10 min;
s403, cleaning the silver substrate after the K gold electroplating for 1-3 times by adopting a pickling method.
Furthermore, the electroplating process also comprises an electroplating solution recovery process after electroplating, and the specific steps are as follows: and (4) placing the electroplated silver substrate in water, and recovering the electroplating solution.
Compared with the prior art, the silver substrate surface is smooth and flat by utilizing the first silver plating, and the defect that the smooth surface cannot be formed in the conventional casting and polishing process is avoided. Meanwhile, the invention ensures the subsequent noble metal electroplating process by adopting a secondary electroplating mode, can form a uniform noble metal layer on the surface of the silver base and improves the electroplating quality.
Detailed Description
In order to make the technical solutions of the present invention better understood by those skilled in the art, the technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments.
The embodiment of the invention discloses a method for plating a noble metal on a silver substrate, which comprises the following steps:
step 1. cleaning Process
Putting the silver-based jewelry into an ultrasonic cleaning device containing cleaning solution, and ultrasonically cleaning for 1-30min at room temperature;
secondly, cleaning the surface of the silver substrate for 1-3 times by adopting a soaking mode;
thirdly, electrolyzing the cleaned silver substrate for 1-30 min;
and fourthly, cleaning the surface of the electrolyzed silver substrate for 1 to 3 times by adopting a dip-cleaning mode.
The embodiment of the invention effectively removes stains on the surface of the silver substrate by adopting ultrasonic cleaning, and simultaneously, the embodiment of the invention can effectively remove oxides and inorganic salts on the surface of the silver substrate by utilizing an electrolysis process, thereby avoiding negative effects (including the reduction of the durability of an electroplated layer and the reduction of the bonding force of the electroplated layer) of the oxides and the inorganic salts on the electroplated layer formed in the subsequent electroplating process.
Step 2 electroplating process
Putting a silver substrate into silver electroplating solution, and electroplating for 1-10 min;
placing the electroplated silver substrate in water, and recovering the electroplating solution;
thirdly, cleaning the silver substrate after the electrosilvering for 1 to 3 times by adopting a dipping method;
fourthly, placing the silver substrate after silver plating into noble metal electroplating liquid for electroplating for 1 to 10 min;
fifthly, placing the electroplated silver substrate in water, and recovering the precious metal electroplating solution;
sixthly, cleaning the silver substrate after the precious metal electroplating for 1-3 times by adopting a dipping method to obtain the finished product of the electroplated jewelry.
Wherein the noble metal comprises one or more of pure gold, gold K, silver, rhodium, platinum, ruthenium, rhodium, palladium, osmium, iridium and platinum. In the electroplating process, the noble metal electroplating solution is a solution formed by one or more of chloride, nitrate, sulfate and complex containing noble metal.
The embodiment of the invention utilizes the first silver plating to ensure that the surface of the silver substrate is smooth and flat, thereby avoiding the defect that the smooth surface cannot be formed in the conventional casting and polishing processes. Meanwhile, the embodiment of the invention ensures the subsequent noble metal electroplating process by adopting a secondary electroplating mode, can form a uniform noble metal layer on the surface of the silver base and improves the electroplating quality.
The noble metal electroplating process of the embodiment of the invention also comprises a K gold electroplating process, and the method comprises the following specific steps:
step 1, according to metal elements required by the K gold, taking electroplating raw materials of corresponding metals, and mixing the electroplating raw materials with water to form electroplating solution, wherein the molar ratio of each metal in the electroplating solution is the same as the content ratio of each metal in the K gold;
step 2, placing the silver-plated silver substrate in a K gold electroplating solution, and electroplating for 1-10 min;
step 3, placing the electroplated silver substrate in water, and recovering the K gold electroplating solution;
and 4, cleaning the silver substrate after the K gold electroplating solution is recovered for 1-3 times by adopting a pickling method to obtain the K gold electroplated jewelry.
The embodiment of the invention adopts an electroplating mode to form a stable K gold electroplating layer while the steps are simple, and compared with the traditional hot melting mixing, the method has the characteristics of low cost, smooth and uniform surface of a finished product and convenience in manufacturing.
It should be noted that the embodiment of the invention also discloses a method for monitoring the effective content of the electroplating solution in the electroplating process, which comprises the following steps:
step 1, collecting the content of effective noble metal in electroplating solution before silver plating or noble metal electroplating;
step 2, calculating the electric quantity required for completely converting the effective noble metal in the electroplating solution into the noble metal simple substance;
and 3, monitoring the current output condition in the electroplating process, acquiring the information of the electric quantity consumed in the electroplating process, and ensuring that the electric quantity consumed in the electroplating process does not exceed 95-99% of the electric quantity calculated in the step 1.
In the traditional electroplating process, the effective metal content in the electroplating solution is determined mainly by empirically matching with multiple chemical detections, but the embodiment of the invention effectively avoids multiple chemical detection processes by monitoring the electric quantity and calculating the consumption of electroplating raw materials by the electric quantity, and has the characteristics of accuracy and high efficiency.
To verify the beneficial effects of the method for plating the noble metal on the silver substrate, design examples 1-2 and comparative examples 1-3 are compared, and the specific contents are as follows:
example 1
Step 1. cleaning Process
Putting the silver-based jewelry into an ultrasonic cleaning device containing cleaning solution, and ultrasonically cleaning for 1min at room temperature;
secondly, cleaning the surface of the silver substrate for 3 times by adopting a soaking mode;
thirdly, electrolyzing the cleaned silver substrate for 5 min;
and fourthly, cleaning the surface of the electrolyzed silver substrate for 3 times by adopting a dip-cleaning mode.
Step 2 electroplating process
Putting a silver substrate into silver electroplating solution, and electroplating for 5 min;
placing the electroplated silver substrate in water, and recovering the electroplating solution;
thirdly, cleaning the silver substrate after the silver electroplating for 3 times by adopting a dip-cleaning method;
fourthly, placing the silver substrate after silver plating into gold electroplating liquid, and electroplating for 1 min;
fifthly, placing the electroplated silver substrate in water, and recovering the gold electroplating solution;
sixthly, cleaning the silver substrate after gold electroplating for 3 times by adopting a dipping method to obtain a jewelry finished product after gold electroplating.
Example 2
Step 1. cleaning Process
Putting the silver-based jewelry in an acid solution tank, and carrying out acid pickling for 1 min;
secondly, cleaning the surface of the silver substrate for 3 times by adopting a soaking mode;
thirdly, placing the silver-based jewelry in an ultrasonic cleaning device containing cleaning solution, and ultrasonically cleaning for 1min at room temperature;
fourthly, cleaning the surface of the silver substrate for 3 times by adopting a dipping and washing mode;
thirdly, electrolyzing the cleaned silver substrate for 5 min;
and fourthly, cleaning the surface of the electrolyzed silver substrate for 3 times by adopting a dip-cleaning mode.
Step 2 electroplating process
Putting a silver substrate into silver electroplating solution, and electroplating for 5 min;
placing the electroplated silver substrate in water, and recovering the electroplating solution;
thirdly, cleaning the silver substrate after the silver electroplating for 3 times by adopting a dip-cleaning method;
fourthly, placing the silver substrate after silver plating into gold electroplating liquid, and electroplating for 1 min;
fifthly, placing the electroplated silver substrate in water, and recovering the gold electroplating solution;
sixthly, cleaning the silver substrate after gold electroplating for 3 times by adopting a dipping method to obtain a jewelry finished product after gold electroplating.
Comparative example 1
Step 1. cleaning Process
Putting the silver-based jewelry into an ultrasonic cleaning device containing cleaning solution, and ultrasonically cleaning for 1min at room temperature;
secondly, cleaning the surface of the silver substrate for 3 times by adopting a soaking mode;
thirdly, electrolyzing the cleaned silver substrate for 5 min;
and fourthly, cleaning the surface of the electrolyzed silver substrate for 3 times by adopting a dip-cleaning mode.
Step 2 electroplating process
Putting the silver substrate after silver plating into a gold electroplating solution, and electroplating for 1 min;
secondly, placing the electroplated silver substrate in water, and recovering gold electroplating liquid;
thirdly, the silver substrate after gold electroplating is cleaned for 3 times by adopting a dip-cleaning method to obtain a jewelry finished product after gold electroplating.
Comparative example 2
Step 1. cleaning Process
Putting the silver-based jewelry in an acid solution tank, and carrying out acid pickling for 1 min;
secondly, cleaning the surface of the silver substrate for 3 times by adopting a soaking mode;
thirdly, placing the silver-based jewelry in an ultrasonic cleaning device containing cleaning solution, and ultrasonically cleaning for 1min at room temperature;
and fourthly, cleaning the surface of the silver substrate for 3 times by adopting a dipping and washing mode.
Step 2 electroplating process
Putting a silver substrate into silver electroplating solution, and electroplating for 5 min;
placing the electroplated silver substrate in water, and recovering the electroplating solution;
thirdly, cleaning the silver substrate after the silver electroplating for 3 times by adopting a dip-cleaning method;
fourthly, placing the silver substrate after silver plating into gold electroplating liquid, and electroplating for 1 min;
fifthly, placing the electroplated silver substrate in water, and recovering the gold electroplating solution;
sixthly, the silver base material after the gold electroplating is cleaned for 3 times by adopting a dipping method to obtain a jewelry finished product after the gold electroplating
Comparative example 3
Step 1. cleaning Process
Putting the silver-based jewelry in an acid solution tank, and carrying out acid pickling for 1 min;
secondly, cleaning the surface of the silver substrate for 3 times by adopting a soaking mode;
thirdly, placing the silver-based jewelry in an ultrasonic cleaning device containing cleaning solution, and ultrasonically cleaning for 1min at room temperature;
fourthly, cleaning the surface of the silver substrate for 3 times by adopting a dipping and washing mode;
thirdly, electrolyzing the cleaned silver substrate for 5 min;
and fourthly, cleaning the surface of the electrolyzed silver substrate for 3 times by adopting a dip-cleaning mode.
Step 2 electroplating process
Putting the silver substrate after silver plating into a gold electroplating solution, and electroplating for 1 min;
secondly, placing the electroplated silver substrate in water, and recovering gold electroplating liquid;
thirdly, the silver substrate after gold electroplating is cleaned for 3 times by adopting a dip-cleaning method to obtain a jewelry finished product after gold electroplating.
In the embodiment 1-2 and the comparative example 1-3, the same batch of cast silver-based jewelry is used as a raw material to carry out the cleaning and electroplating processes, so that the effective metal contents of the electroplating solutions in the embodiment 1-2 and the comparative example 1-3 are the same, the voltage and the current in the electroplating process are the same, and the voltage and the current in the gold electroplating process are just selected according to the condition that the jewelry in the embodiment 1 is electroplated for 1min to form a complete gold-plated layer.
The quality tests of the finished products obtained in examples 1 to 2 and comparative examples 1 to 3 showed the following results:
compared with the comparative examples, the silver substrate in the embodiments 1 and 2 of the invention has smooth and flat surface by utilizing the first silver plating, thereby avoiding the defect that the smooth surface can not be formed in the conventional casting and polishing processes. Meanwhile, in the embodiments 1 and 2 of the invention, a secondary electroplating mode is adopted to ensure the subsequent noble metal electroplating process, so that a uniform noble metal layer can be formed on the surface of the silver base, the electroplating quality is improved, the metal amount required by electroplating is reduced, and the production cost is reduced.
Finally, it should be noted that the above-mentioned embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the same, and although the present invention is described in detail with reference to the above-mentioned embodiments, it should be understood by those skilled in the art that the modifications and equivalents of the specific embodiments of the present invention can be made by those skilled in the art after reading the present specification, but these modifications and variations do not depart from the scope of the claims of the present application.
Claims (10)
1. A method for plating a silver substrate with a noble metal, characterized in that the method for plating a silver substrate with a noble metal comprises an electroplating process, and the electroplating process comprises the following steps:
s101, silver plating: the silver plating device is used for plating silver on the surface of a silver substrate;
s102, precious metal electroplating: the electroplating method is used for electroplating noble metal on the silver-plated surface.
2. The method of claim 1, wherein the noble metal comprises a mixture of one or more elements selected from the group consisting of pure gold, silver, rhodium, platinum, ruthenium, rhodium, palladium, osmium, iridium, and platinum.
3. The method of claim 1, further comprising a cleaning process for cleaning the silver-based surface before electroplating, wherein the cleaning process comprises:
s201, ultrasonic cleaning: for cleaning silver-based surfaces.
4. The method of claim 2, wherein the cleaning process further comprises:
s202, electrolysis: used for removing oxides or inorganic salts on the silver-based surface after ultrasonic cleaning.
5. The method for plating the silver substrate with the noble metal according to claim 1, wherein S101. silver plating comprises the following steps:
s1011, placing the silver substrate in silver electroplating liquid, and electroplating for 1-10 min;
s1012, cleaning the electroplated silver substrate for 1-3 times by adopting a dipping method.
6. The method of claim 1, wherein S102. noble metal electroplating comprises the following steps:
s1021, placing the silver-plated silver substrate in precious metal electroplating liquid, and electroplating for 1-10 min;
s1022, cleaning the silver substrate electroplated with the noble metal for 1-3 times by adopting a pickling method.
7. The method of claim 1, wherein the noble metal plating solution is a solution containing one or more compounds selected from the group consisting of noble metal chloride salts, noble metal nitrate salts, noble metal sulfate salts, and noble metal complexes.
8. The method of claim 1, wherein the electroplating process further comprises an effective content monitoring process of the electroplating solution, and the effective content monitoring process of the electroplating solution comprises the following steps:
s301, collecting the content of effective noble metal in electroplating solution before S101 silver plating or S102 noble metal electroplating;
s302, calculating the electric quantity required for completely converting the effective noble metals in the electroplating solution into the noble metal simple substances;
s302, in the electroplating process, monitoring the current output condition, collecting the information of the electric quantity consumed in the electroplating process, and ensuring that the electric quantity consumed in the electroplating process does not exceed 95-99% of the electric quantity calculated in the step S302.
9. The method of claim 2, wherein the K gold electroplating process comprises the steps of:
s401, according to metal elements required by the K gold, taking electroplating raw materials of corresponding metals, and mixing the electroplating raw materials with water to form electroplating solution, wherein the molar ratio of each metal in the electroplating solution is the same as the content ratio of each metal in the K gold;
s402, placing the silver-plated silver substrate in a K gold electroplating solution, and electroplating for 1-10 min;
s403, cleaning the silver substrate after the K gold electroplating for 1-3 times by adopting a pickling method.
10. The method for plating a noble metal on a silver substrate according to any one of claims 1, 5, 6 and 9, further comprising a recovery process of the plating solution after the plating, comprising the following steps: and (4) placing the electroplated silver substrate in water, and recovering the electroplating solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202011182262.6A CN112553662A (en) | 2020-10-29 | 2020-10-29 | Method for plating precious metal on silver substrate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011182262.6A CN112553662A (en) | 2020-10-29 | 2020-10-29 | Method for plating precious metal on silver substrate |
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| CN112553662A true CN112553662A (en) | 2021-03-26 |
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| CN202011182262.6A Pending CN112553662A (en) | 2020-10-29 | 2020-10-29 | Method for plating precious metal on silver substrate |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1621568A (en) * | 2004-09-29 | 2005-06-01 | 刘广斯 | Nickel silver platinum rhodium multilayer composite plating process |
| CN102936740A (en) * | 2012-11-19 | 2013-02-20 | 成都泛华航空仪表电器有限公司 | Gold-silver-rhodium multilayer composite plating process |
| CN105018995A (en) * | 2015-07-10 | 2015-11-04 | 陈圳浩 | Silver ornament surface brightness five-layer electroplating technology |
-
2020
- 2020-10-29 CN CN202011182262.6A patent/CN112553662A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1621568A (en) * | 2004-09-29 | 2005-06-01 | 刘广斯 | Nickel silver platinum rhodium multilayer composite plating process |
| CN102936740A (en) * | 2012-11-19 | 2013-02-20 | 成都泛华航空仪表电器有限公司 | Gold-silver-rhodium multilayer composite plating process |
| CN105018995A (en) * | 2015-07-10 | 2015-11-04 | 陈圳浩 | Silver ornament surface brightness five-layer electroplating technology |
Non-Patent Citations (2)
| Title |
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| 张允诚等: "《电镀手册》", 31 January 2007, 国防工业出版社 * |
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Application publication date: 20210326 |