CN101054713A - Electrolysis silver/tin plating technique for copper wire - Google Patents
Electrolysis silver/tin plating technique for copper wire Download PDFInfo
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- CN101054713A CN101054713A CN 200610039724 CN200610039724A CN101054713A CN 101054713 A CN101054713 A CN 101054713A CN 200610039724 CN200610039724 CN 200610039724 CN 200610039724 A CN200610039724 A CN 200610039724A CN 101054713 A CN101054713 A CN 101054713A
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- silver
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- anode
- copper wire
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Abstract
A process for copper wire electroanalysis silver plating/tin plating relates to the process for plating copper wire with silver/tin and comprises an anode, a cathode and an electrolytic solution, wherein the copper wire billet is used for the cathode, the anode is formed by tin or silver granules, said tin or silver granules is put into a metallic titanium basket of grid shape, the contact area of the anode and the plating solution is increased by improving the anode to the formation of tin grains/silver grains. Then, the final product silver-coated/tin-coated copper wire is higher in quality than other existent electrically silver-plating and tin plating product in china, especially the compact and continuance of plating crystallization and uniform thickness ensure the subsequent application, and all technical targets of the product entirety achieve standard requests of ASTM and DIN.
Description
Technical field
The present invention relates to silver-plated on copper cash/tinned technology, refer in particular to a kind of electrolytic process silver-plated on copper cash/tinned technology.
Background technology
Silver-plated on copper cash/zinc-plated, traditional method is that the copper cash base after decontamination and sheet tin or silver plate are immersed in the electroplate liquid, and on copper cash base (negative electrode) and sheet tin or silver plate (anode), apply certain voltage, make it electrochemical reaction occur, sheet tin or silver plate are under electrolytic action on the anode, constantly lose electronics and form the free divalent tin ion or the monovalence silver ions, making divalent tin ion or monovalence silver ions regain electronics under the electrolytic action and being deposited on the copper cash base, form zinc-plated/silver-coated copper wire at copper cash base on the negative electrode.Because the surface-area of sheet tin is little with respect to spherical area, the speed that divalent tin ion forms is slow, satisfy galvanized requirement by booster tension, this will produce a large amount of tetravalent tin (solid), make that the crystallization of plating line coating is slightly made, embrittlement, produce bar shaped and pin hole, coating is poor in the sticking power and the compactness of copper cash.
And make anode with silver plate, and the contact area of itself and electrolytic solution is little, and current density is bigger when high-speed silver plating, and coating can be inhomogeneous, and the temperature height of electroplate liquid under high-density current in addition shortened life-span of electroplate liquid.
Summary of the invention
The present invention is just in order to overcome above-mentioned deficiency, provide a kind of copper cash electrolysis silver-plated/tin plating technique, make copper cash behind eleetrotinplate/silver, sticking power and compactness are good, coating is even, do not influence the work-ing life of electroplate liquid, main innovation is that anodic sheet tin or silver plate are changed into particle, be placed in the latticed metal titanium basket, like this contact area of anode and electroplate liquid exceed equivalent weight sheet tin/silver plate area 6-8 doubly, electric conductivity, current density increases 4-5 doubly, while sheet tin/silver plate in use surface-area reduces gradually and can not change (except that changing positive plate), and tin/silver-colored particle can regularly increase, and the voltage during plating is far below using sheet tin/silver plate to make anode, tetravalent tin produces hardly like this, and the degree of adhering to of coating and density are obviously improved; During high speed electrodeposition silver, the electric current flow density is less, coating is even, temperature of electroplating solution is low, and its life-span is prolonged, and specifically implements like this: the copper cash electrolysis is silver-plated/and tin plating technique, comprise negative electrode, anode and electrolytic solution, the copper cash base is made negative electrode, it is characterized in that anode is made of tin or silver-colored particle, and described tin or silver-colored particle place latticed metal titanium basket.Because of metal titanium contacts well with copper bar, go back acid-fast alkali-proof, be fit to very much electroplate environment.
In this technology continuous production, the no specific restriction of particulate size, but do not connecting in the production, the too small easy oxidation meeting in tin particles surface influences the purity of electroplate liquid, so when zinc-plated, the optimum diameter of tin particles is Φ 6-10mm.
The present invention is coated with one deck polypropylene filter cloth at latticed metal titanium basket, it filters the order number smaller or equal to 10 μ m, and the impurity that produces when electroplating is deposited in the titanium basket, makes that the foreign matter content in the electroplate liquid is few, current density is stable, this also corresponding degree of adhering to and density that has improved coating.
This technology constitutes by anode being changed into tin grain/silver granuel, increase the contact area of anode and electroplate liquid, make that finished product is silver-plated, tinned wird is much better than domestic other electrosilverings, tin-plated product at present on quality, particularly the coating compact crystallization is continuous, thickness is even, ensured follow-up use, every technical indicator of product reaches the requirement of ASTM and DIN standard fully.
Embodiment
Embodiment 1, and copper cash electrolysis silver plating process comprises negative electrode, anode and electrolytic solution, wherein the copper cash base is made negative electrode, the silver particle is made anode, and silver-colored particle is positioned in the latticed metal titanium basket, and latticed metal titanium basket is coated with one deck and filters the polypropylene filter cloth of order number smaller or equal to 10 μ m.
Embodiment 2, copper cash electrolytic tinning technology comprises negative electrode, anode and electrolytic solution, and wherein the copper cash base is made negative electrode, tin particles is made anode, tin particles is positioned in the latticed metal titanium basket, and latticed metal titanium basket is coated with one deck and filters the polypropylene filter cloth of order number smaller or equal to 10 μ m, when continuous production, the big or small not specially provided for of tin particles, when discontinuous production, for avoiding the oxidation of tiny tin particles, the diameter of tin particles is chosen in Φ 6-10mm.
Claims (4)
- The copper cash electrolysis silver-plated/tin plating technique, comprise negative electrode, anode and electrolytic solution, the copper cash base is made negative electrode, it is characterized in that anode is made of tin or silver-colored particle, described tin or silver-colored particle place latticed metal titanium basket.
- 2. copper cash electrolysis according to claim 1 is silver-plated/tin plating technique, and the diameter that it is characterized in that tin particles is Φ 6-10mm.
- 3. copper cash electrolysis according to claim 1 and 2 is silver-plated/tin plating technique, it is characterized in that latticed metal titanium basket is coated with one deck polypropylene filter cloth.
- 4. copper cash electrolysis according to claim 3 is silver-plated/tin plating technique, and the filtration order number that it is characterized in that polypropylene filter cloth is smaller or equal to 10 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610039724 CN101054713A (en) | 2006-04-10 | 2006-04-10 | Electrolysis silver/tin plating technique for copper wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610039724 CN101054713A (en) | 2006-04-10 | 2006-04-10 | Electrolysis silver/tin plating technique for copper wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101054713A true CN101054713A (en) | 2007-10-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610039724 Pending CN101054713A (en) | 2006-04-10 | 2006-04-10 | Electrolysis silver/tin plating technique for copper wire |
Country Status (1)
| Country | Link |
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| CN (1) | CN101054713A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102605401A (en) * | 2012-03-23 | 2012-07-25 | 如皋市易达电子有限责任公司 | Online tin recycling structure for surface treating tank |
| CN110029381A (en) * | 2019-04-25 | 2019-07-19 | 首钢集团有限公司 | A kind of production method of high tin coating weight tin plate |
| CN114481247A (en) * | 2022-01-24 | 2022-05-13 | 中铁建电气化局集团康远新材料有限公司 | Tin plating equipment and tin plating process for contact wire |
-
2006
- 2006-04-10 CN CN 200610039724 patent/CN101054713A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102605401A (en) * | 2012-03-23 | 2012-07-25 | 如皋市易达电子有限责任公司 | Online tin recycling structure for surface treating tank |
| CN102605401B (en) * | 2012-03-23 | 2015-11-18 | 如皋市易达电子有限责任公司 | The online tin recovery structure of a kind of surface processing trough |
| CN110029381A (en) * | 2019-04-25 | 2019-07-19 | 首钢集团有限公司 | A kind of production method of high tin coating weight tin plate |
| CN110029381B (en) * | 2019-04-25 | 2020-12-15 | 首钢集团有限公司 | Production method of tin plate with high tin plating amount |
| CN114481247A (en) * | 2022-01-24 | 2022-05-13 | 中铁建电气化局集团康远新材料有限公司 | Tin plating equipment and tin plating process for contact wire |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20071017 |