CN112549730B - Double-glass photovoltaic assembly lamination positioning structure - Google Patents

Double-glass photovoltaic assembly lamination positioning structure Download PDF

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Publication number
CN112549730B
CN112549730B CN202011229656.2A CN202011229656A CN112549730B CN 112549730 B CN112549730 B CN 112549730B CN 202011229656 A CN202011229656 A CN 202011229656A CN 112549730 B CN112549730 B CN 112549730B
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glass photovoltaic
rubber strip
partial pressure
component
photovoltaic module
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CN112549730A (en
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林维红
江昊
毛云飞
王林
周光大
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Hangzhou First Applied Material Co Ltd
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Hangzhou First Applied Material Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/12—Photovoltaic modules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention relates to a laminated positioning structure of a double-glass photovoltaic assembly, and belongs to the technical field of laminating structures of layered products. The double-glass photovoltaic module comprises a laminated board arranged on an upper cavity of the laminating machine and a partial pressure rubber strip arranged on the outer surface of the laminated board, wherein the distance from the partial pressure rubber strip protruding out of the laminated board is larger than the thickness of the double-glass photovoltaic module, and the partial pressure rubber strip is at least positioned on two sides of the double-glass photovoltaic module; the laminated board and the partial pressure rubber strip are bonded together through a structural adhesive layer; the structural adhesive layer is a two-component structural adhesive consisting of a component A and a component B. The structure not only has excellent physical properties, but also has low cost and simple and convenient replacement, and can effectively prolong the service life of the rubber strip structure and improve the process efficiency.

Description

Double-glass photovoltaic assembly lamination positioning structure
Technical Field
The invention relates to the technical field of laminating structures of layered products, in particular to a laminating and positioning structure of a double-glass photovoltaic assembly.
Background
In recent years, the development and innovation of the photovoltaic power generation industry as a main body of new energy are faster and faster, and as a main target of the development of new energy in the future, the electricity consumption cost is continuously reduced to realize the flat-price internet surfing, the technical improvement and the replacement are actively promoted in the industry, high-efficiency battery pieces are continuously pushed out, the standard is also continuously improved in the aspect of the manufacturing process, and the process efficiency and the yield are improved.
With its excellent weather-proof characteristic, dual-glass photovoltaic module has greatly reduced the emergence probability of risks such as environment aqueous vapor, ultraviolet illumination, stand wear and tear, and the application is wider and wider, and the productivity is also bigger and bigger. However, in terms of manufacturing process, although the dual-glass assembly is different from the single-glass assembly only in terms of back plate glass, the manufacturing process is much more complex, and the production efficiency and the yield are greatly different from those of the single-glass assembly, which is particularly reflected in the laminating process.
The lamination process is to glue all the laminated layers of materials of the photovoltaic module together generally in a vacuum high-temperature environment of 140-160 ℃, and is a most critical process for manufacturing the dual-glass photovoltaic module. The laminating process is characterized in that the laminating machine is mainly internally divided into an upper cavity and a lower cavity, the middle of the upper cavity and the lower cavity are separated by a soft laminating plate, the thickness of a silica gel plate is about 5mm, the silica gel plate is embedded in the lower surface layer of the upper cavity and fixed, in the laminating process, a double-glass photovoltaic assembly is placed on the upper surface layer of the lower cavity of the laminating machine, the upper cavity and the lower cavity are exhausted in the vacuumizing process, air in the assembly is exhausted, after a period of time, the upper cavity starts to be inflated, the lower cavity keeps the exhausting state, the silica gel plate is enabled to be pressed downwards, a certain pressure is formed on the surface of the assembly, the assembly is tightly pressed, meanwhile, a small amount of air remained in the assembly is exhausted, the pressure is maintained for a certain time to be cured, and the whole laminating process is finished after the curing is finished. In the laminating process, because the thickness of the dual-glass photovoltaic module is generally 4 to 8mm, when the silica gel plate is pressed down, the edge of the module meets a larger step-shaped structure, the pressure on the edge and four corners of the dual-glass photovoltaic module is larger, and the glass is often deformed and warped, so that the problems of edge bonding delamination, glue shortage, air bubbles and the like are caused. The finishing quality of the lamination process directly influences the quality of finished products, namely the yield, and also has great potential influence on the late stage hidden crack of the cell and the stability of long-term power generation.
In order to improve the adverse phenomenon, a related technical scheme is adopted in the prior art to solve the problem, for example, chinese patent with application publication number CN201910022284.7 discloses a lamination structure of a dual-glass photovoltaic assembly, which includes a lamination cloth liner for placing the dual-glass photovoltaic assembly and a silica gel plate covering the dual-glass photovoltaic assembly, wherein the surface of the silica gel plate is covered with a high-temperature cloth which moves synchronously with the silica gel plate, and a plurality of strip-shaped raised cushion strips perpendicular to the transmission direction are arranged on the high-temperature cloth at intervals along the transmission direction, and the cushion strips are respectively arranged on two sides of the dual-glass photovoltaic assembly along the transmission direction, and the high-temperature cloth is also provided with a plurality of raised cushion blocks which are in a point shape and are arranged on two sides of the dual-glass photovoltaic assembly perpendicular to the transmission direction and on the high-temperature cloth at intervals along the transmission direction.
However, in the above technical solution, the filler strip is wrapped between the lower cloth and the upper cloth, the structural stability at high temperature is to be improved, and the replacement operation thereof is cumbersome.
Therefore, the development of a double-glass assembly laminating and positioning structure which is stable in structure, long in service life and convenient and fast to replace is a problem which needs to be solved urgently in the manufacturing process of the double-glass photovoltaic assembly backboard.
Disclosure of Invention
In view of the above problems, the present invention aims to provide a laminated positioning structure for a dual-glass photovoltaic module, which has excellent physical properties, low cost, and easy replacement, and can effectively prolong the service life of a rubber strip structure and improve the process efficiency.
The technical scheme for solving the problems is as follows:
a double-glass photovoltaic assembly laminating and positioning structure comprises a laminated board arranged on an upper cavity of a laminating machine and a partial pressure rubber strip arranged on the outer surface of the laminated board, wherein the distance of the partial pressure rubber strip protruding out of the laminated board is larger than the thickness of a double-glass photovoltaic assembly, and the partial pressure rubber strip is at least positioned on two sides of the double-glass photovoltaic assembly during laminating operation;
the laminated board and the partial pressure rubber strip are bonded together through a structural adhesive layer;
the structural adhesive layer consists of a component A and a component B;
the component A comprises 30 to 50wt% of hydroxyl-terminated polydimethylsiloxane, 5 to 10wt% of modified silicone oil, 40 to 60wt% of first filler and 0.5 to 10wt% of modified resin, and the component B comprises 40 to 60wt% of dimethyl silicone oil, 10 to 35wt% of second filler, 5 to 40wt% of auxiliary agent and 0.01 to 0.5wt% of catalyst.
The outer surface of the laminate is the surface facing the double-glass photovoltaic module.
Preferably, the partial pressure rubber strips are made of silicon rubber or ethylene propylene diene monomer, and the silicon rubber or the ethylene propylene diene monomer has certain elasticity, can keep certain strength in the vacuum lamination process, and cannot deform greatly.
Preferably, the thickness of the structural adhesive layer is greater than 0.5mm, preferably 1 to 3mm, when the thickness of the structural adhesive layer is too large, the effect of the laminating process is adversely affected, and when the thickness is too small, the adhesive property is insufficient.
In order to increase the connectivity of the structural adhesive layer, the laminated plate and the partial pressure rubber strip, as the preferred preference of the technical scheme, the connection surface of the laminated plate and the structural adhesive layer and the connection surface of the partial pressure rubber strip and the structural adhesive layer are modified by one or a combination of plasma corona, physical coarsening and flame treatment.
In the above-mentioned means, the thickness of the modified part is preferably more than 0.1. Mu.m, preferably 0.1um to 15um, and when the thickness is too thin, the effect of increasing the connection performance is limited, and when the thickness is too thick, the original performance of the base material is deteriorated.
Preferably, the distance of the partial pressure rubber strip protruding out of the laminated board is 0.5-3mm longer than the thickness of the double-glass photovoltaic assembly.
Preferably, in the component A, the viscosity of the hydroxyl-terminated polydimethylsiloxane is 10000cs to 100000cs; the modified silicone oil is formed by mixing one or more of hydroxyl modified silicone oil, polyether modified silicone oil, alkoxy modified silicone oil and epoxy modified silicone oil with the viscosity of 500cs to 10000cs according to any proportion; the first filler is formed by mixing one or two of active calcium carbonate with the grain diameter of 5nm to 25nm and active silicon micro powder with the grain diameter of 2um to 20um according to any proportion; the modified resin is formed by mixing one or more of silane modified polyether resin, hydroxyl terminated polybutadiene resin and silane modified polyurethane resin with the viscosity of 1000-30000cs according to any proportion.
Preferably, in the above technical solution, the activated calcium carbonate and the activated fine silica powder are: calcium carbonate and silicon micropowder are obtained by dispersing one or a mixture of several of methyl trimethoxy silane, methyl triethoxy silane, gamma- (ethylenediamine) propyl trimethoxy silane, gamma- (2, 3-epoxypropoxy) propyl trimethoxy silane, 3-aminopropyl triethoxy silane, 1, 2-bis (triethoxysilyl) ethane, N- [3- (trimethoxysilyl) propyl ] ethylenediamine and bis (3-trimethoxysilylpropyl) amine at the temperature of 30-150 ℃ for 0.3 to 2h.
Preferably, in the component B, the viscosity of the dimethyl silicone oil is 5000cs to 15000cs; the second filler is formed by mixing one or two of carbon black or fumed silica with the particle size of 0.3nm to 10nm; the auxiliary agent is formed by mixing one or more of propyl trimethoxy silane, propyl triethoxy silane, 3- (2, 3-epoxypropoxy) propyl triethoxy silane, 3-aminopropyl trimethoxy silane and 3-aminopropyl triethoxy silane according to any proportion; the catalyst is formed by mixing one or more of dibutyltin dilaurate, dibutyltin diacetate, dioctyltin dilaurate, dimethyltin dioctanoate, dioctadecanoic acid, bismuth isooctanoate, organic phosphate, titanate, chelate and tin according to any proportion.
Preferably, in the technical scheme, the component A and the component B are mixed according to the volume ratio of 8 to 13:1, gluing the laminated board, the partial pressure rubber strip and the connection surface of the structural adhesive layer, then jointing, and placing and maintaining for 1-4 h at 20-80 ℃ to form the structural adhesive layer. Curing can be continued in the environment of actual use.
In summary, the embodiment of the present application has the following beneficial effects:
1) The embodiment of the application said two glass photovoltaic module lamination location structure not only can provide outstanding cohesiveness and heat resistance, still has outstanding mechanical properties and structural strength, has increased the life of rubber strip structure.
2) Furthermore, the short maintenance time of the structure glue layer can be controlled within 4h, the maintenance time after the replacement of the positioning structure is greatly reduced, and the replacement efficiency is improved.
3) Furthermore, the structural adhesive layer is matched with the rubber strip to be used for laminating and positioning the double-glass photovoltaic assembly, the material is low in price, the weight is light, the replacement is simple and convenient, and the process efficiency is effectively improved.
Drawings
Fig. 1 is a schematic view of a positioning structure of a dual-glass photovoltaic module according to an embodiment of the present application, wherein a cross-sectional shape of a partial pressure rubber strip is rectangular;
fig. 2 is a schematic view of a positioning structure of the dual-glass photovoltaic module according to the embodiment of the present application, wherein a cross section of the partial pressure rubber strip is trapezoidal;
fig. 3 is a schematic top view of a laminate during lamination of a monolithic dual glass photovoltaic module laminator according to embodiments of the present application;
FIG. 4 is a schematic top view of a multi-sheet dual-glass photovoltaic module laminator according to embodiments of the present disclosure;
fig. 5 is a schematic structural diagram of positions of a dual-glass photovoltaic module, a partial pressure rubber strip and an upper layer high temperature cloth when the laminator is laminated according to the embodiment of the present application;
in the figure, 1-laminated board, 2-partial pressure rubber strip, 3-double-glass photovoltaic component, 4-structural adhesive layer and a-laminating machine upper cavity are shown.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. The embodiments of the present invention, and all other embodiments obtained by those skilled in the art without any inventive step, are within the scope of the present invention.
The mixing conditions are 23 +/-2 ℃ and 50 +/-5% of relative humidity, and the relative humidity of the curing environment is 30% -80%. Some of the performance indicators were measured by the following methods:
1. tensile strength, elongation at break and bonding area of H-shaped test sample
The test method refers to the standard GB 16776 silicone structural sealant for buildings.
Testing the instrument: a tensile machine.
And (3) testing conditions are as follows: temperature (23 Shi 2) deg.C, relative humidity (50 Shi 5)%.
Testing the substrate: silica gel plate, rubber strip.
DH aging at high temperature and high humidity
The test method refers to the standard IEC 61215 crystalline silicon photovoltaic module for ground-design identification and sizing.
The test conditions are as follows: +85 ℃ and 85% relative humidity.
As shown in fig. 1 to 5, a laminating and positioning structure of a dual-glass photovoltaic module includes a laminate 1 disposed in an upper cavity of a laminating machine and a partial pressure rubber strip 2 disposed on an outer surface of the laminate 1. Partial pressure rubber strip 2 bonds together through structure glue film 4 and silica gel board 1, and is parallel with dual glass assembly transmission direction, and is located dual glass photovoltaic module's both sides, and each side respectively has one. For the laminator that can place polylith subassembly, all install partial pressure rubber strip 2 additional in every subassembly both sides, wherein, partial pressure rubber strip 2 section is rectangle or trapezoidal as shown in fig. 1, 2.
During lamination, an upper cavity of the laminating machine, a laminated board 1, upper-layer high-temperature cloth, a double-glass photovoltaic assembly 3, lower-layer high-temperature cloth and a lower cavity of the laminating machine are arranged in the laminating machine from top to bottom at one time, a partial pressure rubber strip 2 bonded with a structural adhesive layer 4 is arranged on the laminated board 1 in the downward direction, and the partial pressure rubber strip 2 is in direct contact with the upper-layer high-temperature cloth.
Example 1:
the partial pressure rubber strip 2 is a silicon rubber strip.
The thickness of the structural adhesive layer 4 is 1mm.
The connection surfaces of the laminated board 1 and the partial pressure rubber strip 2 are modified in a plasma corona mode, and the thickness of the modified part is 1-5 um.
The component A of the structural adhesive comprises 10000cs hydroxyl-terminated polydimethylsiloxane 30wt%, 500cs hydroxyl-modified silicone oil 5wt%, active calcium carbonate 5nm 60wt% and silane-modified polyether resin modified resin 5wt% to 1000c. Calcium carbonate is dispersed for 0.3 to 2h at the temperature of 70-100 ℃ through a 1.
The component B of the structural adhesive comprises 60wt% of 5000cs dimethyl silicone oil, 30wt% of 0.3nm carbon black, 4.99wt% of propyl trimethoxy silane auxiliary agent, 5wt% of 3-aminopropyl trimethoxy silane auxiliary agent and 0.01wt% of dibutyltin dilaurate catalyst.
The volume ratio of the component A to the component B is 8:1, gluing the laminated board 1 and the partial pressure rubber strip 2, then attaching, and placing and maintaining for 4 hours at the temperature of 20-30 ℃ to form a structural adhesive layer 4.
Example 2:
the partial pressure rubber strip 2 is a silicon rubber strip.
The thickness of the structural adhesive layer 4 is 2mm.
The connection surfaces of the laminated board 1 and the partial pressure rubber strip 2 are modified in a physical coarsening mode, and the thickness of the modified part is 10-15um.
The component A of the structural adhesive comprises 50wt% of 20000cs hydroxyl-terminated polydimethylsiloxane, 9.5wt% of 1000cs epoxy modified silicone oil, 40wt% of 25nm active calcium carbonate and 0.5wt% of 1000c hydroxyl-terminated polybutadiene resin modified resin. Calcium carbonate is a product obtained by dispersing a mixture of methyltrimethoxysilane and N- [3- (trimethoxysilyl) propyl ] ethylenediamine, wherein the mixture is 2.
The component B of the structural adhesive comprises 40wt% of 15000cs dimethyl silicone oil, 30wt% of fumed silica of 7nm to 10nm, 16wt% of propyl triethoxysilane, 8wt% of 3- (2, 3-epoxypropoxy) propyl triethoxysilane, 5.5wt% of 3-aminopropyl triethoxysilane and 0.5wt% of dibutyltin diacetate catalyst.
The volume ratio of the component A to the component B is 13:1, gluing the laminated board 1 and the partial pressure rubber strip 2, then attaching, and placing and maintaining for 1h at 70-80 ℃ to form a structural adhesive layer 4.
Example 3:
the partial pressure rubber strip 2 is a silicon rubber strip.
The thickness of the structural adhesive layer 4 is 3mm.
The connection surfaces of the laminated board 1 and the partial pressure rubber strip 2 are modified in a flame treatment mode, and the thickness of the modified part is 0.1-1um.
The structural adhesive A component comprises 80000cs hydroxyl-terminated polydimethylsiloxane 40wt%, 5000cs polyether modified silicone oil 10wt%, 20um active silica powder 40wt%, and silane modified polyurethane resin modified resin 10 wt%. Dispersing silicon micropowder in a mixture of methyltrimethoxysilane and N- [3- (trimethoxysilyl) propyl ] ethylenediamine at a temperature of between 100 and 150 ℃ for 0.3 to 2h to obtain the product, wherein the mixture is 1.
The component B of the structural adhesive comprises 49.5wt% of 10000cs dimethyl silicone oil, 10wt% of 0.3nm to 0.5nm fumed silica, 10wt% of propyl trimethoxy silane, 15wt% of 3- (2, 3-epoxy propoxy) propyl triethoxy silicon, 15wt% of 3-aminopropyl trimethoxy silane and 0.5wt% of dioctyl decanoic acid dimethyl tin catalyst.
The volume ratio of the component A to the component B is 10:1, gluing the laminated board 1 and the partial pressure rubber strip 2, attaching, and then placing and maintaining for 2 hours at the temperature of 30-40 ℃ to form a structural adhesive layer 4.
Example 4:
the partial pressure rubber strip 2 is a silicon rubber strip.
The thickness of the structural adhesive layer 4 is 1.5mm.
The connection surfaces of the laminated board 1 and the partial pressure rubber strip 2 are respectively modified in a plasma corona and physical roughening mode, and the thickness of the modified part is respectively 2um-7um.
The structural adhesive A component comprises 100000cs hydroxyl-terminated polydimethylsiloxane 35wt%, 5000cs alkoxy-modified silicone oil 8wt%, 5um active silica powder 50wt%, and hydroxyl-terminated polybutadiene resin modified resin 7wt% 3000cs. Dispersing the silicon micropowder by 3-aminopropyltriethoxysilane at 100-150 ℃ for 0.3-2h to obtain the product.
The component B of the structural adhesive comprises 10000cs dimethyl silicone oil of 60 weight percent, 34.5 weight percent of fumed silica of 8nm to 10nm, 3-aminopropyl trimethoxy silane of 5 weight percent and titanate catalyst of 0.5 weight percent.
The volume ratio of the component A to the component B is 9:1, gluing the laminated board 1 and the partial pressure rubber strip 2, then jointing, and then placing and maintaining for 3 hours at the temperature of 60-70 ℃ to form a structural adhesive layer 4.
Example 5:
the partial pressure rubber strip 2 is a silicon rubber strip.
The thickness of the structural adhesive layer 4 is 2.5mm.
The connecting surfaces of the laminated board 1 and the partial pressure rubber strip 2 are modified in a plasma corona mode, and the thickness of the modified part is 5-8um.
The component A of the structural adhesive comprises 45wt% of 50000cs hydroxyl-terminated polydimethylsiloxane, 7wt% of 8000cs alkoxy modified silicone oil, 30wt% of 2um active silicon powder, 15wt% of 10nm active calcium carbonate and 3wt% of 3000cs silane modified polyether resin modified resin. Calcium carbonate and silicon micropowder are dispersed for 0.3 to 2h at the temperature of 100 to 150 ℃ by 3-aminopropyltriethoxysilane and gamma- (2, 3-epoxypropoxy) propyltrimethoxysilane 3.
The structural adhesive B component comprises 50wt% of 8000cs dimethyl silicone oil, 35wt% of fumed silica with the particle size of 8nm to 10nm, 2.9wt% of 3-aminopropyl trimethoxy silane, 7wt% of 3- (2, 3-glycidoxy) propyl triethoxysilane, 5wt% of 3-aminopropyl triethoxysilane and 0.1wt% of titanate catalyst.
The volume ratio of the component A to the component B is 12:1, gluing the laminated board 1 and the partial pressure rubber strip 2, then attaching, and placing and maintaining for 3 hours at 50-60 ℃ to form a structural adhesive layer 4.
Comparative example 1:
the partial pressure rubber strip 2 is a silicon rubber strip.
The thickness of the structural adhesive layer 4 is 2.5mm.
The connecting surfaces of the laminated board 1 and the partial pressure rubber strip 2 are modified in a plasma corona mode, and the thickness of the modified part is 5-8um.
The component A of the structural adhesive comprises 45wt% of 50000 cs-terminal hydroxyl polydimethylsiloxane, 10wt% of 8000cs alkoxy modified silicone oil, 30wt% of 2um active silicon micro powder and 15wt% of 10nm active calcium carbonate. Calcium carbonate and silicon micropowder are dispersed for 0.3 to 2h at the temperature of 100 to 150 ℃ by 3-aminopropyltriethoxysilane and gamma- (2, 3-epoxypropoxy) propyltrimethoxysilane 3.
The component A of the structural adhesive comprises 55wt% of 50000cs hydroxyl-terminated polydimethylsiloxane, 3wt% of 8000cs alkoxy modified silicone oil, 28wt% of 2um active silica powder, 15wt% of 10nm active calcium carbonate and 3wt% of 3000cs silane modified polyether resin modified resin. The calcium carbonate and the silicon micropowder are not treated.
The structural adhesive B component comprises 45wt% of 8000cs dimethylsilicone oil, 40wt% of fumed silica from 8nm to 10nm, 2.9wt% of 3-aminopropyltrimethoxysilane, 7wt% of 3- (2, 3-glycidoxy) propyltriethoxysilane, 5wt% of 3-aminopropyltriethoxysilane and 0.1wt% of titanate catalyst.
The structural adhesive B component comprises 50wt% of 8000cs dimethyl silicone oil, 35wt% of fumed silica with the particle size of 8nm to 10nm, 2.9wt% of 3-aminopropyl trimethoxy silane, 7wt% of 3- (2, 3-glycidoxy) propyl triethoxysilane, 5wt% of 3-aminopropyl triethoxysilane and 0.1wt% of titanate catalyst.
The volume ratio of the component A to the component B is 12:1, gluing the laminated board 1 and the partial pressure rubber strip 2, then attaching, and placing and maintaining for 3 hours at 50-60 ℃ to form a structural adhesive layer 4.
Comparative example 2:
the partial pressure rubber strip 2 is a silicon rubber strip.
The thickness of the structural adhesive layer 4 is 2.5mm.
The joint surfaces of the laminated board 1 and the partial pressure rubber strip 2 are not treated.
The component A of the structural adhesive comprises 45wt% of 50000cs hydroxyl-terminated polydimethylsiloxane, 7wt% of 8000cs alkoxy modified silicone oil, 30wt% of 2um active silicon powder, 15wt% of 10nm active calcium carbonate and 3wt% of 3000cs silane modified polyether resin modified resin. Calcium carbonate and silicon micropowder are dispersed for 0.3 to 2h at the temperature of 100 to 150 ℃ by 3-aminopropyltriethoxysilane and gamma- (2, 3-epoxypropoxy) propyltrimethoxysilane 3.
The component B of the structural adhesive comprises 50wt% of 8000cs dimethyl silicone oil, 35wt% of gas phase white carbon black with the particle size of 8nm to 10nm, 14.9wt% of 3-aminopropyl trimethoxy silane and 0.1wt% of titanate catalyst.
The volume ratio of the component A to the component B is 12:1, gluing the laminated board 1 and the partial pressure rubber strip 2, then attaching, and placing and maintaining for 3 hours at 50-60 ℃ to form a structural adhesive layer 4.
Comparative example 3:
a commercially available metal frame was used for positioning.
The results of testing the materials for the laminated positioning structure of the dual-glass photovoltaic module prepared in the examples 1 to 5 and the comparative examples 1 to 3 are shown in table 1. 60 double-sided double-glass assemblies and double-row assemblies are adopted, and the lamination condition is 145 ℃ and 18min and 1atm.
Table 1: relevant performance parameters of the laminated positioning structure of the dual-glass photovoltaic assembly prepared in examples 1 to 5 and comparative examples 1 to 3
Figure DEST_PATH_IMAGE002
As can be seen from the data in table 1, compared with comparative example 2, after the surface modification is performed on example 5 for 5 to 8um, the edge warping and the peripheral adhesive delamination of the rubber strip are obviously improved after the lamination frequency is increased to 2000 times, and the abnormal string spacing and the subfissure phenomenon of the battery piece do not occur after the lamination frequency is increased to 10000 times. In comparative example 1, the formula system ratio is different compared with example 5, and the caking property is seriously reduced after aging when the filler is not modified.
The double-glass assembly laminating and positioning structure has a good optimization effect on the laminating process of the assembly, can obviously improve the yield and the process efficiency in the laminating process, and has the characteristic of long service life, so that the material loss in the laminating process is greatly reduced. Meanwhile, the structural material is low in price, light in weight, simple and convenient to replace and stable in performance.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (9)

1. The utility model provides a dual-glass photovoltaic module lamination location structure, including set up in the lamination board (1) of laminator epicoele (a) and set up in partial pressure rubber strip (2) of laminate (1) surface, partial pressure rubber strip (2) protrusion in the distance of lamination board (1) is greater than the thickness of dual-glass photovoltaic module (3), during the lamination operation, partial pressure rubber strip (2) are located the both sides of dual-glass photovoltaic module (3) at least, its characterized in that:
the laminated board (1) and the partial pressure rubber strip (2) are bonded together through a structural adhesive layer (4);
the structural adhesive layer (4) comprises a two-component structural adhesive;
the structural adhesive layer (4) consists of a component A and a component B; the component A comprises 30 to 50wt% of hydroxyl-terminated polydimethylsiloxane, 5 to 10wt% of modified silicone oil, 40 to 60wt% of first filler and 0.5 to 10wt% of modified resin, the component B comprises 40 to 60wt% of dimethicone, 10 to 35wt% of second filler, 5 to 40wt% of auxiliary agent and 0.01 to 0.5wt% of catalyst, and the component A and the component B are mixed according to the volume ratio of 8 to 13:1, gluing the glue on the connection surface of the laminated board (1) and the partial pressure rubber strip (2) after uniform mixing, and then placing and maintaining for 1 to 4 hours at the temperature of 20 to 80 ℃ to form the structural glue layer (4);
the modified resin is formed by mixing one or more of silane modified polyether resin, hydroxyl terminated polybutadiene resin and silane modified polyurethane resin with the viscosity of 1000-30000cs according to any proportion;
the positioning structure is used for a laminating process of the double-glass photovoltaic assembly.
2. The dual glass photovoltaic module lamination positioning structure of claim 1, characterized in that: the partial pressure rubber strip (2) is made of silicon rubber or ethylene propylene diene monomer.
3. The dual glass photovoltaic module lamination positioning structure of claim 1, characterized in that: the thickness of the structural adhesive layer (4) is 1-3mm.
4. The dual glass photovoltaic module lamination positioning structure of claim 1, characterized in that: the connection surface of the laminated board (1) and the structure adhesive layer (4) and the connection surface of the partial pressure rubber strip (2) and the structure adhesive layer (4) are modified by one or a combination of plasma corona, physical coarsening and flame treatment.
5. The dual glass photovoltaic module lamination positioning structure of claim 4, characterized in that: the thickness of the modified part is 0.1um to 15um.
6. The dual glass photovoltaic module lamination positioning structure of claim 1, characterized in that: the distance of the partial pressure rubber strip (2) protruding out of the laminated board (1) is 0.5 to 3mm longer than the thickness of the double-glass photovoltaic assembly (3).
7. The dual glass photovoltaic module lamination positioning structure of claim 1, characterized in that: in the component A, the viscosity of the hydroxyl-terminated polydimethylsiloxane is 10000cs to 100000cs; the modified silicone oil is formed by mixing one or more of hydroxyl modified silicone oil, polyether modified silicone oil, alkoxy modified silicone oil and epoxy modified silicone oil with the viscosity of 500cs to 10000cs according to any proportion; the first filler is formed by mixing one or two of active calcium carbonate with the grain diameter of 5nm to 25nm and active silicon micro powder with the grain diameter of 2um to 20um according to any proportion.
8. The dual glass photovoltaic module lamination positioning structure of claim 7, wherein: the active calcium carbonate and the active silicon micropowder are as follows: calcium carbonate and silicon micropowder are obtained by dispersing one or a mixture of several of methyl trimethoxy silane, methyl triethoxy silane, gamma- (ethylenediamine) propyl trimethoxy silane, gamma- (2, 3-epoxypropoxy) propyl trimethoxy silane, 3-aminopropyl triethoxy silane, 1, 2-di (triethoxysilyl) ethane, N- [3- (trimethoxysilyl) propyl ] ethylenediamine and di (3-trimethoxysilylpropyl) amine at the temperature of 30-150 ℃ for 0.3-2h.
9. The dual glass photovoltaic module lamination positioning structure of claim 7 or 8, wherein: in the component B, the viscosity of the dimethyl silicone oil is 5000cs to 15000cs; the second filler is formed by mixing one or two of carbon black or gas phase white carbon black with the particle size of 0.3nm to 10nm; the auxiliary agent is formed by mixing one or more of propyl trimethoxy silane, propyl triethoxy silane, 3- (2, 3-epoxypropoxy) propyl triethoxy silane, 3-aminopropyl trimethoxy silane and 3-aminopropyl triethoxy silane according to any proportion; the catalyst is formed by mixing one or more of dibutyltin dilaurate, dibutyltin diacetate, dioctyltin dilaurate, dimethyltin dioctanoate decanoate, dioctadecanoic acid, bismuth isooctanoate, organic phosphate, titanate, chelate and tin according to any proportion.
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