CN112541881A - Electronic equipment failure analysis method and system - Google Patents
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- 238000012360 testing method Methods 0.000 claims abstract description 54
- 238000000034 method Methods 0.000 claims abstract description 47
- 238000003384 imaging method Methods 0.000 claims abstract description 11
- 230000007547 defect Effects 0.000 claims description 28
- 238000007689 inspection Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 25
- 230000006870 function Effects 0.000 claims description 23
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 230000002159 abnormal effect Effects 0.000 claims description 7
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- 238000012795 verification Methods 0.000 claims description 7
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- 238000002474 experimental method Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 3
- 230000005856 abnormality Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
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- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
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- H04M1/24—Arrangements for testing
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
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Abstract
An electronic device failure analysis method and system are used for analyzing the reason of the functional failure of the electronic device, and the method comprises the following steps: establishing a total database, wherein the total database comprises a first database, test data of the electronic equipment to be analyzed are stored in the first database, and the test data comprise the serial number of the electronic equipment to be analyzed, a test name, a test instruction, a device related to the test and a failure record appearing in the test process; an imaging display step, which is to image the devices related to the failure phenomenon according to the test data corresponding to the failure record, and generate and display a corresponding first picture, wherein the first picture comprises the related devices and the signal transceiving conditions among the related devices; and a failure reason checking step, namely judging the failure reason of the electronic equipment to be analyzed, and displaying the device causing the failure phenomenon in the first picture according to the failure reason.
Description
Technical Field
The present invention relates to a method and a system for analyzing failure of an electronic device, and more particularly, to a method and a system for analyzing failure of an electronic device based on big data and image processing.
Background
The existing electronic equipment, such as a mobile phone, often has a failure phenomenon in the production, manufacturing, or maintenance process, for example, a touch screen, a speaker, a microphone, a camera, etc. have a failure to cause a corresponding function failure, and therefore, a user needs to analyze the reason for the failure phenomenon of the electronic equipment so as to solve the failure problem in time.
Disclosure of Invention
In view of the above problems, it is desirable to provide a failure analysis system for electronic devices, which can automatically check the cause of failure.
In addition, it is necessary to provide a failure analysis method for electronic devices corresponding to the above system.
A failure analysis method is used for analyzing the failure reason of the electronic equipment, and comprises the following steps:
establishing a total database, wherein the total database comprises a first database, test data of the electronic equipment to be analyzed are stored in the first database, and the test data comprise the serial number of the electronic equipment to be analyzed, a test name, a test instruction, a device related to the test and a failure record appearing in the test process;
an imaging display step, which is to image the devices related to the failure phenomenon according to the test data corresponding to the failure record, and generate and display a corresponding first picture, wherein the first picture comprises the related devices and the signal transceiving conditions among the related devices; and
and a failure reason checking step, namely judging the failure reason of the electronic equipment to be analyzed, and displaying the device causing the failure phenomenon in the first picture according to the failure reason.
A failure analysis system for analyzing the failure reasons of electronic equipment, wherein the failure reasons include poor manufacturing process, poor appearance and other defects, the system comprising:
the system comprises a total database, a first database and a second database, wherein the total database comprises the first database, test data of the electronic equipment to be analyzed are stored in the first database, and the test data comprise the serial number of the electronic equipment to be analyzed, a test name, a test instruction, a device related to the test and a failure record appearing in the test process;
the imaging display module is used for imaging devices related to the failure phenomenon according to test data corresponding to failure records, generating and displaying a corresponding first picture, wherein the first picture comprises related devices and signal transceiving conditions among the related devices; and
and the failure reason checking module is used for judging the failure reason of the electronic equipment to be analyzed and displaying the device causing the failure phenomenon in the first picture according to the failure reason.
The failure analysis system and method can automatically check the failure reason of the electronic equipment when the electronic equipment fails, and are favorable for rapidly solving the failure problem.
Drawings
Fig. 1 is a functional block diagram of a failure analysis apparatus according to a preferred embodiment of the present invention.
FIG. 2 is a functional block diagram of a failure analysis system in accordance with a preferred embodiment of the present invention.
FIG. 3 is a diagram of a first picture according to a preferred embodiment of the invention.
FIG. 4 is a diagram illustrating the probability of display device failure in a preferred embodiment of the present invention.
FIG. 5 is a flow chart of a failure analysis method according to a preferred embodiment of the invention.
Description of the main elements
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
Referring to fig. 1, a failure analysis apparatus 1 according to a preferred embodiment of the present invention is used for performing failure analysis on an electronic device to find a failure reason when the electronic device fails during production, manufacturing, or maintenance. The electronic equipment can be a mobile phone, and the failure phenomenon is defined as that some function or functions of the mobile phone cannot be normally used, for example, a touch screen, a loudspeaker, a microphone, a camera and the like fail to work, so that the corresponding function fails. The failure analysis device 1 is installed and operates a failure analysis system 10 (shown in fig. 2). The failure analysis device 1 may be a computer. In the preferred embodiment, the failure cause includes a process defect, an appearance defect, and other defects, wherein the process defect is defined as a defect in the manufacturing process of the electronic device, such as a solder void, a solder joint, etc., for example, the material appearance defect is located as a defect in the appearance of a device (e.g., a touch screen, a speaker, a microphone, a camera, etc.) of the electronic device, such as a device breakage, a functional failure of a part of the device, etc., and the other defects are defined as a non-process defect and a material appearance defect, such as a software design error, etc.
The failure analysis device 1 further comprises a display 11, a memory 13 and a processor 15. The display 11 is used for displaying data or pictures in the analysis process. The memory 13 may be built in the failure analysis apparatus 1, or may be a separate external memory Card, such as an SM Card (Smart Media Card), an SD Card (Secure Digital Card), or the like. The memory 13 is used for storing various types of data and program codes, such as the failure analysis system 10, and the memory 13 further includes a general database 131, and the general database 131 includes a first database 131a, a second database 131b, a third database 131c, and a fourth database 131 d. The first database 131a stores test data of the electronic device to be analyzed, where the test data includes a serial number of the electronic device to be analyzed, a test name, a test instruction, a device related to the test, and a failure record occurring in the test process. The second database 131b stores a second picture of the electronic device to be analyzed and the electronic device with a normal function, which have a failure phenomenon, during X-ray detection, and the second picture is used for displaying tin spot conditions of a main board of the electronic device, such as whether a bad tin spot, continuous tin, empty tin, and the like exist. The third database 131c stores a third picture taken when the electronic device to be analyzed and the electronic device with a normal function perform automatic optical detection, where the third picture is used to display an appearance condition of a device of the electronic device, for example, whether a display screen is damaged. The fourth database 131d stores all failure analysis data including failure phenomena, analysis steps, and corresponding analysis results. It is understood that the first database 131a, the second database 131b, the third database 131c, and the fourth database 131d may also be stored in other devices, such as servers, respectively, and the failure analysis system 10 may access and obtain the required data. The processor 15 is used for executing an operating system and various application programs in the failure analysis device 1, such as the failure analysis system 10.
Referring to fig. 2, the failure analysis system 10 mainly includes a failure confirmation module 101, an imaging display module 102, a process defect inspection module 103, a material appearance inspection module 104, an experiment verification analysis module 105, an auxiliary analysis module 106, and an interaction module 107.
The failure phenomenon determination module 101 is configured to determine whether the electronic device to be analyzed has a failure phenomenon, obtain test data of the electronic device to be analyzed from the first database 131a, extract a failure record therein, send a corresponding test instruction to the electronic device to be analyzed according to the extracted failure record, determine whether the electronic device to be analyzed has a failure phenomenon again, and determine that the electronic device to be analyzed has a failure phenomenon if the electronic device to be analyzed has a failure phenomenon again.
The imaging display module 102 is configured to image devices related to the failure phenomenon according to test data corresponding to the failure record, and generate and display a corresponding first picture, where the first picture includes related devices and a signal transceiving status between the related devices. In the preferred embodiment, the first picture is shown in fig. 3, the related devices are device a, device B and device C, and the devices a, B and C can transmit and receive signals to and from each other. The related devices include all related physical parts such as ICs, resistors, capacitors, inductors, traces of a circuit board, and the like.
The poor process inspection module 103 is configured to determine whether a poor process exists in the electronic device to be analyzed, and if the poor process exists, display a device with the poor process in the first picture. In the preferred embodiment, the process defect inspection module 103 obtains a second picture of the electronic device to be analyzed, which has a failure phenomenon, from the second database 131b to compare with a second picture of the electronic device with a normal function, and when the difference between the two pictures is within a preset range, determines that the electronic device to be analyzed does not have a process defect; and judging that the electronic equipment to be analyzed has poor manufacturing process when the difference between the two exceeds a preset range. For example, when the electronic device to be analyzed has a bad solder point, it is determined that the process is bad, wherein the bad solder point includes a solder point with a size exceeding a preset size, a solder point with a brightness exceeding a preset brightness, and a solder point not normally connected. It can be understood that the misprocess inspection module 103 may compare the second picture of the electronic device to be analyzed, which has a failure phenomenon, with the second picture of the electronic device with a normal function by using an image recognition technology.
The material appearance inspection module 104 is configured to determine whether the electronic device to be analyzed has an appearance defect, and if the electronic device to be analyzed has an appearance defect, display a device with the appearance defect in the first picture. In this preferred embodiment, the material appearance inspection module 104 obtains the third picture of the electronic device to be analyzed and the third picture of the electronic device with normal function from the third database 131c for comparison, and when the difference between the third picture and the third picture is within a preset range, it is determined that the electronic device to be analyzed does not have poor material appearance; and when the difference between the two exceeds a preset range, judging that the electronic equipment to be analyzed has poor material appearance. The preset range may be the number of device breakages, for example, 1. It is understood that the material appearance inspection module 104 may compare the electronic device to be analyzed with the third picture of the electronic device with normal functions by using an image recognition technology.
It can be understood that the process defect inspection module 103 and the material appearance inspection module 104 may be collectively referred to as a failure cause inspection module, and are configured to determine a failure cause of the electronic device to be analyzed, and display a device causing a failure phenomenon in the first picture according to the failure cause.
The experiment verification analysis module 105 is configured to calculate, when it is determined that the electronic device to be analyzed does not have poor manufacturing process and appearance, a probability that each of all related devices is abnormal according to the same failure phenomenon and the corresponding analysis result stored in the fourth database 131d, and display the probability in the first picture. The user can verify and find the abnormal device according to the probability. Referring to fig. 4, in the preferred embodiment, the probability of defects occurring in the devices a, B and C is 50%, 20% and 30%. According to the bad probability, the user can check the device a preferentially, so the experimental verification analysis module 105 can assist in manual analysis of the failure reason.
The auxiliary analysis module 106 is configured to obtain and display analysis steps and analysis results corresponding to the same failure phenomenon, where the failure cause stored in the fourth database 131d belongs to other bad conditions, so as to provide a reference basis for analysis by a user. After the user analysis is finished, the auxiliary analysis module 106 may store the analysis result into the fourth database 131d to enrich the analysis data of the fourth database 131 d.
The interaction module 107 is configured to implement an information interaction function between the failure analysis system 10 and a user, for example, receive a number of an electronic device to be analyzed, which is input by the user, so that the failure phenomenon confirmation module 101 obtains test data of the electronic device to be analyzed from the first database 131a according to the number, and receive an analysis result of the user.
FIG. 5 is a flow chart of a preferred embodiment of the failure analysis method of the present invention. The method is applied to a failure analysis apparatus 1 equipped with a failure analysis system 10, and includes the following steps.
It is understood that the step 302 may be omitted, and the step 302 may be directly performed by obtaining the failure record from the first database 131a to determine whether the failure phenomenon exists, and if the failure record exists, determine that the failure phenomenon exists, and enter the step 304, and if the failure record does not exist, determine that the failure phenomenon does not exist, and enter the step 303.
In step 305, the process defect inspection module 103 determines whether the electronic device to be analyzed has a process defect, and if the process defect exists, the step 306 is executed, and if the process defect does not exist, the step 307 is executed. In the preferred embodiment, the process defect inspection module 103 obtains a second picture of the electronic device to be analyzed, which has a failure phenomenon, from the second database 131b to compare with a second picture of the electronic device with a normal function, and when the difference between the two pictures is within a preset range, determines that the electronic device to be analyzed does not have a process defect; and judging that the electronic equipment to be analyzed has poor manufacturing process when the difference between the two exceeds a preset range. For example, when the electronic device to be analyzed has a bad solder point, it is determined that the process is bad, wherein the bad solder point includes a solder point with a size exceeding a preset size, a solder point with a brightness exceeding a preset brightness, and a solder point not normally connected. It can be understood that the misprocess inspection module 103 may compare the second picture of the electronic device to be analyzed, which has a failure phenomenon, with the second picture of the electronic device with a normal function by using an image recognition technology.
In step 306, the under-process inspection module 103 displays the devices with the under-process defect in the first picture.
In step 307, the material appearance inspection module 104 determines whether the electronic device to be analyzed has poor appearance, and if so, the process goes to step 308, and if not, the process goes to step 309. In this preferred embodiment, the material appearance inspection module 104 obtains the third pictures of the electronic device to be analyzed and the electronic device with normal function from the third database 131c for comparison, and when the difference between the third pictures is within a preset range, it is determined that the electronic device to be analyzed does not have poor material appearance; and when the difference between the two exceeds a preset range, judging that the electronic equipment to be analyzed has poor material appearance. The preset range may be the number of device breakages, for example, 1. It is understood that the material appearance inspection module 104 may compare the electronic device to be analyzed with the third picture of the electronic device with normal functions by using an image recognition technology.
In step 308, the material appearance inspection module 104 displays that there is a device with poor appearance in the first picture.
It is understood that the steps 304 to 308 may be collectively referred to as failure cause checking steps, and determine a failure cause of the electronic device to be analyzed, and display the device causing the failure phenomenon in the first picture according to the failure cause.
In step 309, when it is determined that the electronic device to be analyzed does not have poor process and appearance, the experimental verification analysis module 105 calculates the probability of each abnormal device in all the related devices according to the same failure phenomenon and the corresponding analysis result stored in the fourth database 131 d.
In step 310, the imaging display module 102 displays the probability into the first picture. The user can verify and find the abnormal device according to the probability. Referring to fig. 4, in the preferred embodiment, the probability of defects occurring in the devices a, B and C is 50%, 20% and 30%. According to the bad probability, the user can check the device a preferentially, so the experimental verification analysis module 105 can assist in manual analysis of the failure reason.
In step 311, the interactive module 107 receives the analysis result of the user, determines whether to find the failure reason, if not, then proceeds to step 312, and if so, then proceeds to step 313.
In step 312, the auxiliary analysis module 106 obtains and displays analysis steps and analysis results corresponding to the same failure phenomenon, where the failure cause stored in the fourth database 131d belongs to other bad conditions, so as to provide a reference basis for analysis by a user. After the user analysis is finished, the auxiliary analysis module 106 stores the analysis result into the fourth database 131d to enrich the analysis data of the fourth database 131 d.
In step 313, the auxiliary analysis module 106 prompts the user that the analysis is finished.
The failure analysis system 10 and method of the present invention can automatically check whether the failure reason is bad process and bad material appearance when the failure phenomenon occurs in the electronic device, and provide data to assist in manually analyzing the failure reason when the failure reason is other bad.
Furthermore, various modifications, additions and substitutions in form and detail may be made by those skilled in the art within the scope and spirit of the disclosure of the preferred embodiments of the invention as disclosed in the accompanying claims. It is understood that various modifications, additions and substitutions are possible, within the scope of the invention as claimed.
Claims (16)
1. A failure analysis method is used for analyzing the reason of functional failure of electronic equipment, and is characterized by comprising the following steps:
establishing a total database, wherein the total database comprises a first database, test data of the electronic equipment to be analyzed are stored in the first database, and the test data comprise the serial number of the electronic equipment to be analyzed, a test name, a test instruction, a device related to the test and a failure record appearing in the test process;
an imaging display step, which is to image the devices related to the failure phenomenon according to the test data corresponding to the failure record, and generate and display a corresponding first picture, wherein the first picture comprises the related devices and the signal transceiving conditions among the related devices; and
and a failure reason checking step, namely judging the failure reason of the electronic equipment to be analyzed, and displaying the device causing the failure phenomenon in the first picture according to the failure reason.
2. A failure analysis method as claimed in claim 1, characterized in that: the method further comprises, before the step of graphically displaying:
and a failure phenomenon confirming step, namely judging whether the electronic equipment to be analyzed has a failure phenomenon, acquiring test data of the electronic equipment to be analyzed from the first database, extracting failure records in the test data, sending corresponding test instructions to the electronic equipment to be analyzed according to the extracted failure records, confirming whether the electronic equipment to be analyzed has the failure phenomenon again, and if the electronic equipment to be analyzed has the failure phenomenon again, judging that the electronic equipment to be analyzed has the failure phenomenon.
3. A failure analysis method as claimed in claim 1, characterized in that: the failure reason checking step comprises a poor process checking step, wherein the poor process checking step is used for judging whether the electronic equipment to be analyzed has poor processes, and if so, displaying devices with poor processes in the first picture.
4. A failure analysis method as claimed in claim 3, characterized in that: the total database also comprises a second database, and a second picture when the electronic equipment to be analyzed with the failure phenomenon and the electronic equipment with the normal function perform X-ray detection is stored in the second database; the process defect inspection step includes:
obtaining a second picture of the electronic equipment to be analyzed with a failure phenomenon from the second database, comparing the second picture with a second picture of the electronic equipment with a normal function, and judging that the electronic equipment to be analyzed has no bad manufacturing process when the difference between the second picture and the second picture is within a preset range; and judging that the electronic equipment to be analyzed has poor manufacturing process when the difference between the two exceeds a preset range.
5. The failure analysis method according to claim 4, wherein: the failure cause checking step further includes:
and a material appearance checking step, namely judging whether the electronic equipment to be analyzed has poor appearance, and if so, displaying a device with poor appearance in the first picture.
6. The failure analysis method according to claim 5, wherein: the total database also comprises a third database, and the third database stores a third picture shot when the electronic equipment to be analyzed and the electronic equipment with normal functions perform automatic optical detection; the material appearance inspection step comprises the following steps:
obtaining a third picture of the electronic equipment to be analyzed and the electronic equipment with normal functions from the third database for comparison, and judging that the electronic equipment to be analyzed does not have poor material appearance when the difference between the third picture and the third picture is within a preset range; and when the difference between the two exceeds a preset range, judging that the electronic equipment to be analyzed has poor material appearance.
7. The failure analysis method according to claim 6, wherein: the method further comprises the following steps:
the total database further comprises a fourth database, the fourth database stores all failure analysis data, and the failure analysis data comprise failure phenomena and corresponding analysis results;
an experiment verification analysis step, wherein when the electronic equipment to be analyzed is judged to have no poor manufacturing process and appearance, the probability of abnormality of each device in all related devices is calculated according to the same failure phenomenon and the corresponding analysis result stored in the fourth database, and the probability is displayed in the first picture; and
and verifying and searching the abnormal device according to the probability.
8. The failure analysis method according to claim 7, wherein: the analyzing data further comprises an analyzing step, the method further comprising:
and a secondary analysis step, namely acquiring and displaying analysis steps and analysis results corresponding to other bad failure reasons and the same failure phenomena stored in the fourth database.
9. A failure analysis system for analyzing causes of functional failures of electronic devices, the system comprising:
the system comprises a total database, a first database and a second database, wherein the total database comprises the first database, test data of the electronic equipment to be analyzed are stored in the first database, and the test data comprise the serial number of the electronic equipment to be analyzed, a test name, a test instruction, a device related to the test and a failure record appearing in the test process;
the imaging display module is used for imaging devices related to the failure phenomenon according to test data corresponding to failure records, and generating and displaying a corresponding first picture, wherein the first picture comprises related devices and signal transceiving conditions among the related devices; and
and the failure reason checking module is used for judging the failure reason of the electronic equipment to be analyzed and displaying the device causing the failure phenomenon in the first picture according to the failure reason.
10. The failure analysis system of claim 9, wherein: the system further comprises:
and the failure phenomenon confirming module is used for acquiring the test data of the electronic equipment to be analyzed from the first database, extracting failure records in the test data, sending corresponding test instructions to the electronic equipment to be analyzed according to the extracted failure records, confirming whether the failure phenomenon occurs again in the electronic equipment to be analyzed, and judging that the failure phenomenon occurs in the electronic equipment to be analyzed if the failure phenomenon occurs again.
11. The failure analysis system of claim 9, wherein: the failure reason checking module comprises a poor processing checking module, and the poor processing checking module is used for judging whether the electronic equipment to be analyzed has poor processing, and if so, displaying the devices with poor processing in the first picture.
12. The failure analysis system of claim 11, wherein: the total database also comprises a second database, and a second picture when the electronic equipment to be analyzed with the failure phenomenon and the electronic equipment with the normal function perform X-ray detection is stored in the second database; the processing failure inspection module is used for obtaining a first picture of the electronic equipment to be analyzed with failure phenomenon from the second database and comparing the first picture with a first picture of the electronic equipment with normal function, and when the difference between the first picture and the first picture is within a preset range, judging that the electronic equipment to be analyzed does not have processing failure; and judging that the electronic equipment to be analyzed has poor manufacturing process when the difference between the two exceeds a preset range.
13. The failure analysis system of claim 12, wherein: the failure cause checking module further comprises
And the material appearance inspection module is used for judging whether the electronic equipment to be analyzed has poor appearance, and if so, displaying a device with poor appearance in the first picture.
14. The failure analysis system of claim 13, wherein: the total database also comprises a third database, and the third database stores a third picture shot when the electronic equipment to be analyzed and the electronic equipment with normal functions perform automatic optical detection; the material appearance inspection module acquires third pictures of the electronic equipment to be analyzed and the electronic equipment with normal functions from the third database for comparison, and when the difference between the third pictures is within a preset range, the material appearance inspection module judges that the electronic equipment to be analyzed does not have poor material appearance; and when the difference between the two exceeds a preset range, judging that the electronic equipment to be analyzed has poor material appearance.
15. The failure analysis system of claim 14, wherein: the system further comprises:
the total database further comprises a fourth database, the fourth database stores all failure analysis data, and the failure analysis data comprise failure phenomena and corresponding analysis results;
the experiment verification analysis module is used for calculating the abnormal probability of each device in all related devices according to the same failure phenomenon and corresponding analysis results stored in the fourth database when the electronic equipment to be analyzed is judged to have no poor manufacturing process and appearance, and displaying the probability to the third picture; and
and verifying and searching the abnormal device according to the probability.
16. The failure analysis system of claim 15, wherein: the analyzing data further comprises an analyzing step, the system further comprises:
and the auxiliary analysis module is used for acquiring and displaying analysis steps and analysis results corresponding to other bad failure reasons and the same failure phenomena stored in the fourth database.
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| CN201910838290.XA CN112541881A (en) | 2019-09-05 | 2019-09-05 | Electronic equipment failure analysis method and system |
| TW108140845A TWI816932B (en) | 2019-09-05 | 2019-11-11 | Failure analyzing method and system for electronic device |
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2019
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- 2019-11-11 TW TW108140845A patent/TWI816932B/en active
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| TWI816932B (en) | 2023-10-01 |
| TW202111530A (en) | 2021-03-16 |
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