CN112538236A - Epoxy plastic packaging material and preparation method and application thereof - Google Patents
Epoxy plastic packaging material and preparation method and application thereof Download PDFInfo
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- CN112538236A CN112538236A CN202011437185.4A CN202011437185A CN112538236A CN 112538236 A CN112538236 A CN 112538236A CN 202011437185 A CN202011437185 A CN 202011437185A CN 112538236 A CN112538236 A CN 112538236A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses an epoxy plastic packaging material and a preparation method and application thereof, wherein the epoxy plastic packaging material comprises the following raw materials in percentage by mass: 50-90% of high dielectric inorganic filler, 5-30% of epoxy resin, 2-25% of curing agent, 0.1-1% of coupling agent, 0.05-0.5% of curing accelerator, 0.5-10% of stress absorber, 0.1-1% of release agent and 0.2-5% of flame retardant; the high-dielectric inorganic filler is silicon dioxide coated barium titanate powder. The epoxy molding compound provided by the invention not only has low thermal expansion coefficient and high heat resistance, but also has the characteristics of high dielectric constant, small dielectric loss and low viscosity.
Description
Technical Field
The invention belongs to the technical field of integrated circuit electronic packaging, and relates to an epoxy plastic packaging material and a preparation method and application thereof.
Background
With the continuous development of the integrated circuit packaging technology, the epoxy molding compound is also rapidly developed as a main packaging material, and the basic position and the supporting position are more and more obvious. The epoxy molding compound is mainly used for protecting the integrated circuit chip from being damaged by external environment, and also needs to have low thermal expansion coefficient and high reliability. The main component of the material is epoxy resin, and various auxiliary agents such as curing agent, filler, curing accelerator, stress modifier, flame retardant and the like are added.
With the wider application of fingerprint sensors in intelligent devices, higher requirements are placed on the performance of epoxy molding compounds, namely, the epoxy molding compounds need to have the properties of low thermal expansion coefficient and high heat resistance, high dielectric constant and low dielectric loss of the traditional molding compounds, but the existing epoxy molding compounds are difficult to meet the requirements at the same time.
Disclosure of Invention
In order to solve the problems of the background art, the present invention is directed to an epoxy molding compound, a method for preparing the same, and an application of the same, wherein the epoxy molding compound has a low thermal expansion coefficient, a high glass transition temperature, a low viscosity, a high dielectric constant, and a low dielectric loss.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows: an epoxy plastic packaging material comprises the following raw materials in percentage by mass:
50-90% of high dielectric inorganic filler, 5-30% of epoxy resin, 2-25% of curing agent, 0.1-1% of coupling agent, 0.05-0.5% of curing accelerator, 0.5-10% of stress absorber, 0.1-1% of release agent and 0.2-5% of flame retardant;
the high-dielectric inorganic filler is a silica-coated barium titanate inorganic filler.
Further, the raw materials comprise the following components in percentage by mass: 70-90% of high dielectric inorganic filler, 5-15% of epoxy resin, 4-12% of curing agent, 0.1-1% of coupling agent, 0.05-0.6% of curing accelerator, 0.5-3% of stress absorber, 0.1-1% of release agent and 0.2-5% of flame retardant;
the high-dielectric inorganic filler is a silica-coated barium titanate inorganic filler.
Further, the silica-coated barium titanate inorganic filler is obtained by the steps of:
s1: uniformly dispersing barium titanate in a mixed solution of acetic acid and ethanol, adding tetraethyl orthosilicate TEOS, and fully stirring and dispersing to obtain a mixture;
s2: and (3) adjusting the pH value of the mixture in the S1 to 8-9, continuously stirring for 4-24h, and then putting into an oven to dry to obtain the silica-coated barium titanate inorganic filler.
Further, the barium titanate in S1 is spherical barium titanate having a particle diameter of 0.5 μm to 50 μm.
Further, the volume ratio of acetic acid to ethanol in the mixed solution of acetic acid and ethanol in S1 is 5-10: 1;
preferably, the mass ratio of the barium titanate to the tetraethyl orthosilicate in S1 is 0.5-20: 1, preferably 1 to 5: 1.
further, the stirring temperature in S1 is 20 to 80 ℃, preferably 30 to 50 ℃.
Further, the substance used for adjusting the pH of the mixture described in S1 in S2 is ammonia.
Further, the stirring temperature in S2 is 20-50 ℃, preferably 20-30 ℃;
preferably, the stirring time in S2 is 6-10h, preferably 8 h;
preferably, the temperature of the drying in S2 is 60-90 ℃, preferably 80 ℃;
preferably, the drying time in S2 is 10-20h, preferably 12 h.
Further, the epoxy resin is selected from one or a combination of at least two of o-cresol formaldehyde epoxy resin, dicyclopentadiene type epoxy resin, bisphenol a type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, naphthalene ring type epoxy resin, multifunctional group type epoxy resin, aliphatic glycidyl ether epoxy resin, glycidyl amine type epoxy resin and alicyclic epoxy resin;
preferably, the curing agent is selected from one or a combination of at least two of linear phenolic resin and derivatives thereof, biphenyl type phenolic resin and derivatives thereof, naphthalene type phenolic resin and derivatives thereof, and dicyclopentadiene and phenol copolymer;
preferably, the curing accelerator is selected from one or two of imidazole compound and triphenyl phosphorus; more preferably, the imidazole compound is selected from one or a combination of at least two of 2-phenyl-4, 5-dihydroxymethylimidazole, 2-methylimidazole, 2-phenylimidazole, dimethyl-imidazole isocyanurate, triphenylphosphine-1, 4-benzoquinone adduct;
preferably, the coupling agent is selected from one or a combination of at least two of gamma- (2, 3-epoxypropoxy) propyl trimethoxy silane, propyl glycidyl ether trimethoxy silane, gamma-epoxypropyl ether trimethoxy silane, gamma-aminopropyl triethoxy silane and gamma-mercaptopropyl trimethoxy silane;
preferably, the stress absorber is selected from one or a combination of at least two of nitrile rubber, polysulfide rubber, polybutadiene, polyether elastomer and polyurethane;
preferably, the release agent is selected from one or a combination of at least two of stearic acid wax, carnauba wax, polyethylene wax, oxidized polyethylene wax, Fischer-Tropsch wax;
preferably, the flame retardant is an environment-friendly flame retardant, and more preferably, the flame retardant is one or a combination of at least two of aluminum hydroxide, magnesium hydroxide, antimony trioxide, melamine, polysilane and phosphate.
The preparation method of the epoxy molding compound comprises the following steps: and mixing, cooling and crushing the raw materials in the epoxy molding compound to obtain the epoxy molding compound.
The epoxy molding compound is applied to integrated circuit packaging.
The invention has the beneficial effects that: in the preparation process of the epoxy plastic packaging material, the barium titanate inorganic filler coated with the high-dielectric silicon dioxide forming the core-shell structure is added, and the characteristics of high dielectric constant and low dielectric loss of barium titanate, and excellent low thermal expansion property and high heat resistance of silicon dioxide are utilized, so that the epoxy plastic packaging material has the characteristics of low thermal expansion coefficient and high Tg, high dielectric constant and low dielectric loss, and the viscosity of a system is reduced by adopting the barium titanate inorganic filler coated with the high-dielectric silicon dioxide forming the core-shell structure.
Detailed Description
For a better understanding of the present invention, the following examples are given to illustrate the present invention, but the present invention is not limited to the following examples.
Example 1
The components of the epoxy molding compound in this example are as follows:
| components | Mass percent/%) |
| Epoxy resin: o-cresol formaldehyde epoxy resin | 10.00％ |
| Curing agent: phenol novolac resin | 4％ |
| High dielectric inorganic filler: silica-coated barium titanate inorganic filler | 80.00％ |
| Coupling agent: propyl glycidyl ether trimethoxysilane | 0.20％ |
| Curing accelerator: triphenylphosphine | 0.50％ |
| Stress absorber: nitrile rubber | 0.80％ |
| Releasing agent: polyethylene wax | 0.50％ |
| Flame retardant: aluminum hydroxide | 4.00％ |
The high dielectric inorganic filler of this example was prepared by the following method:
100g of barium titanate having a particle size of 15 μm was dispersed in a mixed solution of 300ml of ethanol and 30ml of acetic acid, 100g of TEOS was added thereto, and the mixture was sufficiently stirred at 40 ℃ for 6 hours. And then, dropwise adding ammonia water into the mixed solution, adjusting the pH value to 8-9, continuously stirring at room temperature for 8 hours, and then, drying in an oven at 80 ℃ for 12 hours to obtain the silica-coated barium titanate inorganic filler.
The epoxy molding compound of this example was prepared by the following method:
30g of o-cresol formaldehyde epoxy resin, 12g of linear phenol formaldehyde resin, 240g of high dielectric inorganic filler, 0.6g of propyl glycidyl ether trimethoxy silane, 1.5g of triphenyl phosphorus, 2.4g of nitrile rubber, 1.5g of polyethylene wax and 12g of aluminum hydroxide are weighed and mixed in a high-speed mixer at the temperature of lower than 10 ℃ for 25min to obtain premixed powder, then the premixed powder is added into a double-roller mixer to be mixed for 10min at the temperature of 100 ℃, and the premixed powder is cooled and crushed into powder to obtain the epoxy molding compound.
In this example, the epoxy molding compound has a Tg of 148 ℃, a coefficient of thermal expansion CTE 1: 18ppm/K, CTE 2: 62ppm/K, a dielectric constant of 23(1kHz), a dielectric loss of 0.03, and a viscosity of 50 pas.
Example 2
The components of the epoxy molding compound in this example are as follows:
the high dielectric inorganic filler of this example was prepared by the following method:
100g of barium titanate having a particle size of 15 μm was dispersed in a mixed solution of 300ml of ethanol and 30ml of acetic acid, 80g of TEOS was added thereto, and the mixture was sufficiently stirred at 40 ℃ for 6 hours. And then, dropwise adding ammonia water into the mixed solution, adjusting the pH value to 8-9, continuously stirring at room temperature for 8 hours, and then, drying in an oven at 80 ℃ for 12 hours to obtain the silica-coated barium titanate inorganic filler.
The epoxy molding compound of this example was prepared by the following method:
30g of o-cresol formaldehyde epoxy resin, 12g of phenol novolac resin, 249g of high dielectric inorganic filler, 0.6g of propyl glycidyl ether trimethoxy silane, 1.5g of triphenyl phosphorus, 2.4g of nitrile rubber, 1.5g of polyethylene wax and 3g of magnesium hydroxide are weighed and mixed in a high-speed mixer at the temperature of lower than 10 ℃ for 25min to obtain premixed powder, then the premixed powder is added into a double-roll mixer to be mixed at the temperature of 100 ℃ for 20min, and the premixed powder is cooled and crushed into powder to obtain the epoxy molding compound.
In this example, the epoxy molding compound has a Tg of 150 ℃, a coefficient of thermal expansion CTE 1: 15ppm/K, CTE 2: 55ppm/K, a dielectric constant of 25(1kHz), a dielectric loss of 0.025, and a viscosity of 65 pas.
Example 3
The components of the epoxy molding compound in this example are as follows:
the high dielectric inorganic filler of this example was prepared by the following method:
100g of barium titanate having a particle size of 15 μm was dispersed in a mixed solution of 300ml of ethanol and 30ml of acetic acid, 80g of TEOS was added thereto, and the mixture was sufficiently stirred at 40 ℃ for 6 hours. And then, dropwise adding ammonia water into the mixed solution, adjusting the pH value to 8-9, continuously stirring at room temperature for 8 hours, and then, drying in an oven at 80 ℃ for 12 hours to obtain the silica-coated barium titanate inorganic filler.
The epoxy molding compound of this example was prepared by the following method:
weighing 30g of o-cresol formaldehyde epoxy resin, 9g of dicyclopentadiene epoxy resin, 13.5g of linear phenol novolac resin, 237g of high dielectric inorganic filler, 0.9g of propyl glycidyl ether trimethoxy silane, 1.2g of 2-phenylimidazole, 2.4g of nitrile rubber, 1.5g of stearic acid wax and 4.5g of magnesium hydroxide, mixing for 25min at the temperature of lower than 10 ℃ in a high-speed mixer to obtain premixed powder, adding the premixed powder into a double-roll mixer, mixing for 20min at the temperature of 100 ℃, cooling and crushing into powder to obtain the epoxy molding compound.
In this example, the epoxy molding compound has a Tg of 148 ℃, a coefficient of thermal expansion CTE 1: 18ppm/K, CTE 2: 60ppm/K, a dielectric constant of 25(1kHz), a dielectric loss of 0.03, and a viscosity of 52 pas.
Example 4
The components of the epoxy molding compound in this example are as follows:
the high dielectric inorganic filler of this example was prepared by the following method:
100g of barium titanate having a particle size of 15 μm was dispersed in a mixed solution of 300ml of ethanol and 30ml of acetic acid, 80g of TEOS was added thereto, and the mixture was sufficiently stirred at 40 ℃ for 6 hours. And then, dropwise adding ammonia water into the mixed solution, adjusting the pH value to 8-9, continuously stirring at room temperature for 8 hours, and then, drying in an oven at 80 ℃ for 12 hours to obtain the silica-coated barium titanate inorganic filler.
The epoxy molding compound of this example was prepared by the following method:
weighing 25g of o-cresol formaldehyde epoxy resin, 5g of bisphenol A epoxy resin, 12g of biphenyl phenolic resin, 249g of high dielectric inorganic filler, 0.6g of propyl glycidyl ether trimethoxy silane, 1.5g of triphenyl phosphorus, 2.4g of nitrile rubber, 1.5g of polyethylene wax and 3g of aluminum hydroxide, mixing for 25min at the temperature of lower than 10 ℃ in a high-speed mixer to obtain premixed powder, adding the premixed powder into a double-roll mixer, mixing for 15min at the temperature of 110 ℃, cooling and crushing the premixed powder into powder to obtain the epoxy molding compound.
In this example, the epoxy molding compound has a Tg of 155 ℃, a coefficient of thermal expansion CTE 1: 14ppm/K, CTE 2: 51ppm/K, a dielectric constant of 26(1kHz), a dielectric loss of 0.02, and a viscosity of 64 pas.
Example 5
The components of the epoxy molding compound in this example are as follows:
the high dielectric inorganic filler of this example was prepared by the following method:
100g of barium titanate having a particle size of 15 μm was dispersed in a mixed solution of 300ml of ethanol and 30ml of acetic acid, 100g of TEOS was added thereto, and the mixture was sufficiently stirred at 40 ℃ for 6 hours. And then, dropwise adding ammonia water into the mixed solution, adjusting the pH value to 8-9, continuously stirring at room temperature for 8 hours, and then, drying in an oven at 80 ℃ for 12 hours to obtain the silica-coated barium titanate inorganic filler.
The epoxy molding compound of this example was prepared by the following method:
34.5g of bisphenol A type epoxy resin, 16.5g of linear phenol phenolic resin, 225g of high dielectric inorganic filler, 2.1g of propyl glycidyl ether trimethoxy silane, 1.8g of triphenyl phosphorus, 6g of nitrile rubber, 2.1g of polyethylene wax and 12g of aluminum hydroxide are weighed and mixed in a high-speed mixer at the temperature of below 10 ℃ for 25min to obtain premixed powder, then the premixed powder is added into a double-roll mixer to be mixed for 10min at the temperature of 110 ℃, and the premixed powder is cooled and crushed into powder to obtain the epoxy molding compound.
In this example, the epoxy molding compound has a Tg of 150 ℃, a coefficient of thermal expansion CTE 1: 23ppm/K, CTE 2: 68ppm/K, a dielectric constant of 20(1kHz), a dielectric loss of 0.02 and a viscosity of 40 pas.
Comparative example 1
The components of the epoxy molding compound in this comparative example are as follows:
| components | Mass percent/%) |
| Epoxy resin: o-cresol formaldehyde epoxy resin | 10.00％ |
| Curing agent: phenol novolac resin | 4％ |
| Inorganic filler: silicon dioxide | 80.00％ |
| Coupling agent: propyl glycidyl ether trimethoxysilane | 0.20％ |
| Curing accelerator: triphenylphosphine | 0.50％ |
| Stress absorber: nitrile rubber | 0.80％ |
| Releasing agent: polyethylene wax | 0.50％ |
| Flame retardant: aluminum hydroxide | 4.00％ |
The epoxy molding compound of this comparative example was prepared by the following method:
weighing 30g of o-cresol formaldehyde epoxy resin, 12g of linear phenol formaldehyde resin, 240g of silicon dioxide powder, 0.6g of propyl glycidyl ether trimethoxy silane, 1.5g of triphenyl phosphorus, 2.4g of nitrile rubber, 1.5g of polyethylene wax and 12g of aluminum hydroxide, mixing for 25min at the temperature of lower than 10 ℃ in a high-speed mixer to obtain premixed powder, adding the premixed powder into a double-roll mixing mill, mixing for 10min at the temperature of 100 ℃, cooling, and crushing into powder to obtain the epoxy plastic sealing material.
In this comparative example, the viscosity of the epoxy molding compound was 55 pas, the dielectric constant was 7(1kHz), and the dielectric loss was 0.05.
Comparative example 2
The components of the epoxy molding compound in this comparative example are as follows:
the epoxy molding compound of this comparative example was prepared by the following method:
weighing 30g of o-cresol formaldehyde epoxy resin, 12g of linear phenol formaldehyde resin, 240g of barium titanate powder, 0.6g of propyl glycidyl ether trimethoxy silane, 1.5g of triphenyl phosphorus, 2.4g of nitrile rubber, 1.5g of polyethylene wax and 12g of aluminum hydroxide, mixing for 25min at the temperature of lower than 10 ℃ in a high-speed mixer to obtain premixed powder, adding the premixed powder into a double-roller mixer, mixing for 10min at the temperature of 100 ℃, cooling, and crushing into powder to obtain the epoxy plastic sealing material.
The epoxy molding compound in this comparative example had a Tg of 140 deg.C, a coefficient of thermal expansion CTE 1: 20ppm/K, CTE 2: 70ppm/K, viscosity of 60 pas, dielectric constant of 22(1kHz), and dielectric loss of 0.03.
Comparative example 3
The components of the epoxy molding compound in this comparative example are as follows:
| components | Mass percent/%) |
| Epoxy resin: o-cresol formaldehyde epoxy resin | 10.00％ |
| Curing agent: phenol novolac resin | 4％ |
| Inorganic filler: silicon dioxide | 40％ |
| Inorganic filler: barium titanate | 40％ |
| Coupling agent: propyl glycidyl ether trimethoxysilane | 0.20％ |
| Curing accelerator: triphenylphosphine | 0.50％ |
| Stress absorber: nitrile rubber | 0.80％ |
| Releasing agent: polyethylene wax | 0.50％ |
| Flame retardant: aluminum hydroxide | 4.00％ |
The epoxy molding compound of this comparative example was prepared by the following method:
weighing 30g of o-cresol formaldehyde epoxy resin, 12g of linear phenol formaldehyde resin, 120g of silicon dioxide, 120g of barium titanate powder, 0.6g of propyl glycidyl ether trimethoxy silane, 1.5g of triphenyl phosphorus, 2.4g of nitrile rubber, 1.5g of polyethylene wax and 12g of aluminum hydroxide, mixing for 25min at the temperature of lower than 10 ℃ in a high-speed mixer to obtain premixed powder, adding the premixed powder into a double-roll mixer, mixing for 10min at the temperature of 100 ℃, cooling, and crushing the premixed powder into powder to obtain the epoxy molding material.
In this comparative example, the epoxy molding compound has a Tg of 142 ℃, a coefficient of thermal expansion CTE 1: 22ppm/K, CTE 2: 68ppm/K, a viscosity of 58 pas, a dielectric constant of 22(1kHz), and a dielectric loss of 0.04.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, numerous simplifications or substitutions may be made without departing from the spirit of the invention, which should be construed as falling within the scope of the claims as filed.
Claims (10)
1. The epoxy plastic packaging material is characterized by comprising the following raw materials in percentage by mass:
50-90% of high dielectric inorganic filler, 5-30% of epoxy resin, 2-25% of curing agent, 0.1-1% of coupling agent, 0.05-0.5% of curing accelerator, 0.5-10% of stress absorber, 0.1-1% of release agent and 0.2-5% of flame retardant;
the high-dielectric inorganic filler is a silica-coated barium titanate inorganic filler.
2. The epoxy molding compound of claim 1, wherein the silica-coated barium titanate inorganic filler is obtained by:
s1: uniformly dispersing barium titanate in a mixed solution of acetic acid and ethanol, adding tetraethyl orthosilicate, and fully stirring and dispersing to obtain a mixture;
s2: and (3) adjusting the pH value of the mixture in the S1 to 8-9, continuously stirring for 4-24h, and then putting into an oven to dry to obtain the silica-coated barium titanate inorganic filler.
3. The epoxy molding compound of claim 2, wherein the barium titanate in S1 is spherical barium titanate having a particle size of 0.5 μm to 50 μm.
4. The epoxy molding compound of claim 2, wherein the volume ratio of acetic acid to ethanol in the mixed solution of acetic acid and ethanol in S1 is 5-10: 1;
preferably, the mass ratio of the barium titanate to the tetraethyl orthosilicate in S1 is 0.5-20: 1, preferably 1 to 5: 1.
5. the epoxy molding compound of claim 2, wherein the stirring temperature in S1 is 20-80 ℃, preferably 30-50 ℃.
6. The epoxy molding compound of claim 2, wherein the substance used in S2 for adjusting the pH of the mixture of S1 is ammonia.
7. The epoxy molding compound of claim 2, wherein the stirring temperature in S2 is 20-50 ℃, preferably 20-30 ℃;
preferably, the stirring time in S2 is 6-10h, preferably 8 h;
preferably, the temperature of the drying in S2 is 60-90 ℃, preferably 80 ℃;
preferably, the drying time in S2 is 10-20h, preferably 12 h.
8. The epoxy molding compound according to claim 1, wherein the epoxy resin is selected from one or a combination of at least two of o-cresol novolac epoxy resin, dicyclopentadiene type epoxy resin, bisphenol a type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, naphthalene ring type epoxy resin, polyfunctional epoxy resin, aliphatic glycidyl ether epoxy resin, glycidyl amine type epoxy resin, and alicyclic epoxy resin;
preferably, the curing agent is selected from one or a combination of at least two of linear phenolic resin and derivatives thereof, biphenyl type phenolic resin and derivatives thereof, naphthalene type phenolic resin and derivatives thereof, and dicyclopentadiene and phenol copolymer;
preferably, the curing accelerator is selected from one or two of imidazole compound and triphenyl phosphorus; more preferably, the imidazole compound is selected from one or a combination of at least two of 2-phenyl-4, 5-dihydroxymethylimidazole, 2-methylimidazole, 2-phenylimidazole, dimethyl-imidazole isocyanurate, triphenylphosphine-1, 4-benzoquinone adduct;
preferably, the coupling agent is selected from one or a combination of at least two of gamma- (2, 3-epoxypropoxy) propyl trimethoxy silane, propyl glycidyl ether trimethoxy silane, gamma-epoxypropyl ether trimethoxy silane, gamma-aminopropyl triethoxy silane and gamma-mercaptopropyl trimethoxy silane;
preferably, the stress absorber is selected from one or a combination of at least two of nitrile rubber, polysulfide rubber, polybutadiene, polyether elastomer and polyurethane;
preferably, the release agent is selected from one or a combination of at least two of stearic acid wax, carnauba wax, polyethylene wax, oxidized polyethylene wax, Fischer-Tropsch wax;
preferably, the flame retardant is an environment-friendly flame retardant, and more preferably, the flame retardant is one or a combination of at least two of aluminum hydroxide, magnesium hydroxide, antimony trioxide, melamine, polysilane and phosphate.
9. The method for preparing an epoxy molding compound according to any one of claims 1 to 8, comprising the steps of: the epoxy molding compound is obtained by mixing, kneading, cooling and pulverizing the raw material composition in the epoxy molding compound according to any one of claims 1 to 8.
10. Use of the epoxy molding compound of any one of claims 1 to 8 in integrated circuit packaging.
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| CN202011437185.4A CN112538236A (en) | 2020-12-10 | 2020-12-10 | Epoxy plastic packaging material and preparation method and application thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113808779A (en) * | 2021-11-17 | 2021-12-17 | 西安宏星电子浆料科技股份有限公司 | Low-temperature curing insulating medium slurry for chip resistor |
| WO2023097771A1 (en) * | 2021-12-03 | 2023-06-08 | 中国科学院深圳先进技术研究院 | Epoxy molding compound of modified silicon dioxide grafted epoxy resin, and preparation method therefor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113808779A (en) * | 2021-11-17 | 2021-12-17 | 西安宏星电子浆料科技股份有限公司 | Low-temperature curing insulating medium slurry for chip resistor |
| CN113808779B (en) * | 2021-11-17 | 2022-03-01 | 西安宏星电子浆料科技股份有限公司 | Low-temperature curing insulating medium slurry for chip resistor |
| WO2023097771A1 (en) * | 2021-12-03 | 2023-06-08 | 中国科学院深圳先进技术研究院 | Epoxy molding compound of modified silicon dioxide grafted epoxy resin, and preparation method therefor |
| WO2023245413A1 (en) * | 2022-06-21 | 2023-12-28 | 华为技术有限公司 | Epoxy molding compound and method for preparing same, semiconductor packaging structure, and electronic apparatus |
| CN116515242A (en) * | 2023-04-25 | 2023-08-01 | 上海道宜半导体材料有限公司 | High-dielectric-constant powdery epoxy molding compound and preparation method thereof |
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