CN106280281A - A kind of high dielectric-epoxy plastic packaging material and its preparation method and application - Google Patents

A kind of high dielectric-epoxy plastic packaging material and its preparation method and application Download PDF

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CN106280281A
CN106280281A CN201610657326.0A CN201610657326A CN106280281A CN 106280281 A CN106280281 A CN 106280281A CN 201610657326 A CN201610657326 A CN 201610657326A CN 106280281 A CN106280281 A CN 106280281A
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packaging material
plastic packaging
epoxy
mixing
high dielectric
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CN106280281B (en
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孙蓉
朱朋莉
李刚
赵涛
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Shenzhen Institute of Advanced Electronic Materials
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Shenzhen Institute of Advanced Technology of CAS
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Abstract

The present invention relates to a kind of high dielectric-epoxy plastic packaging material and its preparation method and application.It is in terms of 100% by the gross weight of this high dielectric-epoxy plastic packaging material, the raw material composition of this high dielectric-epoxy plastic packaging material includes: high dielectric filler 30% 70%, epoxy resin 10% 50%, phenolic resin 10% 50%, firming agent 10% 20%, accelerator 0.1% 0.5%, coupling agent 0.1% 1%, toughener 1% 10%, releasing agent 0.1% 0.5% and fire retardant 1% 10%, the percentage ratio sum of each component is 100%.This high dielectric-epoxy plastic packaging material not only has the low-expansion coefficient of traditional plastic packaging material, low stress feature, and dielectric constant is high, dielectric loss is less, dielectric properties frequency stability is good, can be used for fingerprint sensor package field.

Description

A kind of high dielectric-epoxy plastic packaging material and its preparation method and application
Technical field
The present invention relates to a kind of high dielectric-epoxy plastic packaging material for fingerprint sensor inductive layer and preparation method thereof and answer With.
Background technology
Increasing mobile device (including smart mobile phone) is anticipated will embed fingerprint identification function.Due to sapphire glass There is high-k, be therefore widely used in the fingerprint tough part of existing capacitance type fingerprint identification sensor encapsulation, but Sapphire glass existence makes it difficult for the shortcoming that sensor encapsulation is less, more slim, manufacturing process complexity is high, therefore limits it Transducer sensitivity and the lifting of encapsulation performance, and the epoxy molding compound of high-k provides another kind of fingerprint sensing The encapsulation approach of device, forms one layer of firm homogeneous dielectric quality guarantee by common IC packaging technology at fingerprint recognition chip surface Sheath, plays gain and amplifies the effect of capacitance signal, and this material can reduce package dimension and the thickness of fingerprint Identification sensor The outstanding resolution of fingerprint sensor and sensitivity still can be kept while degree.The most this plastic packaging material is meeting high dielectric The while of low-loss, also there is relatively low thermal coefficient of expansion, to reduce coefficient of thermal expansion differences between chip, substrate and plastic packaging material The different interfacial stress brought, increases the reliability of plastic device.
Summary of the invention
For solving above-mentioned technical problem, it is an object of the invention to provide a kind of high dielectric for fingerprint sensor inductive layer Epoxy-plastic packaging material, this high dielectric-epoxy plastic packaging material not only has the low-expansion coefficient of traditional plastic packaging material, low stress feature, Er Qiejie Electric constant is high, dielectric loss is less, dielectric properties frequency stability is good, can be used for fingerprint sensor package field.
In order to achieve the above object, the invention provides a kind of high dielectric-epoxy plastic packaging material.With this high dielectric-epoxy plastic packaging The gross weight of material is 100% meter, and its raw material composition includes:
High dielectric filler (dielectric constant is 10-1000) 30%-70%, epoxy resin 10%-50%, phenolic resin 10%-50%, firming agent 10%-20%, accelerator 0.1%-0.5%, coupling agent 0.1%-1%, toughener 1%-10%, de- Mould agent 0.1%-0.5% and fire retardant 1%-10%, the percentage ratio sum of each component is 100%.
In above-mentioned high dielectric-epoxy plastic packaging material, it is preferable that described high dielectric filler through the following steps that preparation: will Silicon dioxide (the lowest dielectric silicon dioxide, dielectric constant is 0.5-10) is dispersed in the solution of water and ethanol, adds barium Presoma and titanium precursors carry out hydro-thermal reaction, are precipitated, carry out precipitation washing, dry after obtain described high dielectric and fill out Material.
In above-mentioned high dielectric-epoxy plastic packaging material, it is preferable that described silicon dioxide be particle diameter be spherical the two of 50nm-20 μm Silicon oxide, it is preferable that particle diameter is 500nm-5 μm.
In above-mentioned high dielectric-epoxy plastic packaging material, it is preferable that described barium precursor be barium hydroxide, barium nitrate, barium acetate, One or more in barium chloride；Described titanium precursors is one or both in butyl titanate, titanium dioxide.
In above-mentioned high dielectric-epoxy plastic packaging material, it is preferable that described barium precursor and titanium precursors mol ratio are (1.5- 1.0): 1, silicon dioxide is 1:(0.1-1 with the mol ratio of Barium metatitanate .).
In above-mentioned high dielectric-epoxy plastic packaging material, it is preferable that the reaction temperature of described hydro-thermal reaction is 100-250 DEG C, excellent Elect 100-150 DEG C as；Response time is 1-10h, preferably 2-5h.
In above-mentioned high dielectric-epoxy plastic packaging material, it is preferable that described epoxy resin is hexamethylene-1,2-dicarboxylic acids two shrinks Glyceride, bisphenol A type epoxy resin E44, bisphenol-s epoxy resin, 3,4-epoxycyclohexyl-methyl-3,4-epoxycyclohexyl first The mixing of one or more in acid esters；
In above-mentioned high dielectric-epoxy plastic packaging material, it is preferable that described phenolic resin is o-cresol-formaldehyde resin, CF ring The mixing of one or more in epoxy resins, t-octyl phenolic resin；
In above-mentioned high dielectric-epoxy plastic packaging material, it is preferable that described firming agent be THPA, phenolic resin, dicyandiamide, The mixing of one or more in 4,4-diamino-dicyclohexyl methanes, it is preferable that the molecular weight of phenolic resin is 100-2000；
In above-mentioned high dielectric-epoxy plastic packaging material, it is preferable that described accelerator is triphenylphosphine, 1-cyanoethyl-2-methyl The mixing of one or more in imidazoles, 2-ethyl-4-methylimidazole, 2-phenylimidazole；
In above-mentioned high dielectric-epoxy plastic packaging material, it is preferable that described coupling agent be gamma-aminopropyl-triethoxy-silane, γ- Glycidyl ether oxygen propyl trimethoxy silicane, γ-methacryloxypropyl trimethoxy silane, γ-mercapto propyl group front three One or more in TMOS, trimethyoxysilane, allyl trimethyl silane, octadecyl trimethoxysilane Mixing；
In above-mentioned high dielectric-epoxy plastic packaging material, it is preferable that described toughener is aliphatic poly ethoxylated polyhydric alcohol, phthalic acid In dibutyl ester, dioctyl phthalate, aromatic polyether polyhydric alcohol, triethylene-glycol glycidyl ether, tributyl phosphate The mixing of one or more；
In above-mentioned high dielectric-epoxy plastic packaging material, it is preferable that described releasing agent is stearic acid wax, Tissuemat E, natural stone The mixing of one or more in wax；
In above-mentioned high dielectric-epoxy plastic packaging material, it is preferable that described fire retardant be aluminium hydroxide, magnesium hydroxide, titanium oxide, One or several mixing in calcium oxide, Firebrake ZB, polysilane oxygen alkane, APP, phosphate ester, tripolycyanamide.
The invention provides the preparation method of above-mentioned epoxy-plastic packaging material, it comprises the following steps:
A epoxy resin, phenolic resin, the mixing of high dielectric filler are carried out mixing by ()；
B () is subsequently adding coupling agent, toughener, releasing agent and fire retardant, continue mixing；
C () is eventually adding firming agent and accelerator carries out mixing, is cooled to room temperature, is grinding to obtain described epoxy-plastic packaging Material.
In above-mentioned preparation method, it is preferable that described mixing temperature is 100-150 DEG C；The described mixing time is 5- 60min, preferably 10-60min.
Present invention also offers the application in fingerprint sensor of the above-mentioned high dielectric-epoxy plastic packaging material.
High dielectric-epoxy plastic packaging material prepared by the present invention, not only has the low-expansion coefficient of traditional plastic packaging material, low stress spy Point, wherein CTE1 is between 10-30ppm/ DEG C, and CTE2 is between 40-80ppm/ DEG C.And dielectric constant high (between 20-35), Dielectric loss less (between 0.01-0.03), dielectric properties frequency stability are good.
Detailed description of the invention
In order to the technical characteristic of the present invention, purpose and beneficial effect are more clearly understood from, the existing skill to the present invention Art scheme carries out described further below, but it is not intended that to the present invention can the restriction of practical range.
Embodiment 1
The present embodiment provides the preparation method of a kind of high dielectric inorganic filler, and it comprises the following steps:
Weigh the spherical low dielectric silicon dioxide that 5.0g particle diameter is 500nm be dispersed in 100ml water and ethanol solution (water and The quality of ethanol can be 5:95) in, stir, add 0.5g butyl titanate and 0.5g barium hydroxide, stir, 100 DEG C hydro-thermal reaction 5h, stands, by the precipitation absolute ethanol washing obtained, dry after obtain high dielectric inorganic filler.
The present embodiment also provides for the preparation method of a kind of high dielectric-epoxy plastic packaging material, and it comprises the following steps:
Weigh 10g hexamethylene-1,2-dicarboxylic acids 2-glycidyl ester, 10g o-cresol formaldehyde epoxy resin, 53.75g high dielectric Filler through the mixing 10min of twin-screw extruder, is subsequently adding 0.5g allyl trimethyl silane, 5g phthalic acid two fourth at 110 DEG C Ester, 0.5g stearic acid wax and 5g titanium oxide, at 120 DEG C of mixing 15min, are eventually adding 15g THPA and 0.25g 1-cyanogen second Mixing 30min at base-2-methylimidazole 100 DEG C, is cooled to room temperature, is grinding to obtain high dielectric-epoxy plastic packaging material.
The dielectric constant of this plastic packaging material is 25 (1kHz), and loss is 0.02, and thermal coefficient of expansion is CTE1:30ppm/ DEG C, CTE2:60ppm/℃。
High dielectric-epoxy plastic packaging material prepared by the present embodiment, not only has the low-expansion coefficient of traditional plastic packaging material, low stress Feature, wherein CTE1 is between 10-30ppm/ DEG C, and CTE2 is between 40-80ppm/ DEG C.And dielectric constant high (20-35 it Between), dielectric loss less (between 0.01-0.03), dielectric properties frequency stability good.
This high dielectric-epoxy plastic packaging material can be used for fingerprint sensor package field.
Embodiment 2
The present embodiment provides the preparation method of a kind of high dielectric inorganic filler, and it comprises the following steps:
Weigh the spherical low dielectric silicon dioxide that 10.0g particle diameter is 5 μm be dispersed in 100ml water and ethanol solution (water and The quality of ethanol can be 5:95) in, stir, addition 1g titanium dioxide and 0.5g barium nitrate, 120 DEG C of hydro-thermal reactions 2h, quiet Put, after the precipitation absolute ethanol washing obtained, drying, obtain high dielectric inorganic filler.
The present embodiment also provides for the preparation method of a kind of high dielectric-epoxy plastic packaging material, and it comprises the following steps:
Weigh 10g 3,4-epoxycyclohexyl-methyl-3,4-epoxycyclohexyl formic acid esters, 10g t-octyl epoxy novolac tree Fat, 53.75g high dielectric filler through the mixing 10min of twin-screw extruder, are subsequently adding 0.5g γ-glycidyl ether oxygen third at 150 DEG C Base trimethoxy silane, 5g tributyl phosphate, 0.5g natural paraffin wax and 5g phosphate ester, at 100 DEG C of mixing 10min, are eventually adding Mixing 30min at 15g dicyandiamide and 0.25g 2-ethyl-4-methylimidazole 100 DEG C, is cooled to room temperature, is grinding to obtain Gao Jie Electricity epoxy-plastic packaging material.
The dielectric constant of this plastic packaging material is 22 (1kHz), and loss is 0.015, and thermal coefficient of expansion is CTE1:25ppm/ DEG C, CTE2:45ppm/℃。
High dielectric-epoxy plastic packaging material prepared by the present embodiment, not only has the low-expansion coefficient of traditional plastic packaging material, low stress Feature, wherein CTE1 is between 10-30ppm/ DEG C, and CTE2 is between 40-80ppm/ DEG C.And dielectric constant high (20-35 it Between), dielectric loss less (between 0.01-0.03), dielectric properties frequency stability good.
This high dielectric-epoxy plastic packaging material can be used for fingerprint sensor package field.
Embodiment 3
The present embodiment provides the preparation method of a kind of high dielectric inorganic filler, and it comprises the following steps:
Weigh the spherical low dielectric silicon dioxide that 5.0g particle diameter is 2 μm and be dispersed in solution (water and the second of 100ml water and ethanol The quality of alcohol can be 5:95) in, stir, add 0.5g titanium dioxide and 0.5g barium hydroxide, stir 150 DEG C of hydro-thermals Reaction 5h, stands, and obtains high dielectric inorganic filler after the precipitation absolute ethanol washing obtained, drying.
The present embodiment also provides for the preparation method of a kind of high dielectric-epoxy plastic packaging material, and it comprises the following steps:
Weigh 10g bisphenol A type epoxy resin E44,10g epoxy cresol novolac resin, 53.95g high dielectric filler at 150 DEG C Through the mixing 60min of twin-screw extruder, be subsequently adding 0.5g trimethyoxysilane, 5g triethylene-glycol glycidyl ether, 0.5g Tissuemat E and 5g melamine flame retardants, at 130 DEG C of mixing 20min, are eventually adding 15g 4,4-diaminocyclohexyl Mixing 30min at methane and 0.25g triphenylphosphine 110 DEG C, is cooled to room temperature, is grinding to obtain high dielectric-epoxy plastic packaging material.
The dielectric constant of this plastic packaging material is 20 (1kHz), and loss is 0.015, and thermal coefficient of expansion is CTE1:25ppm/ DEG C, CTE2:55ppm/℃。
High dielectric-epoxy plastic packaging material prepared by the present embodiment, not only has the low-expansion coefficient of traditional plastic packaging material, low stress Feature, wherein CTE1 is between 10-30ppm/ DEG C, and CTE2 is between 40-80ppm/ DEG C.And dielectric constant high (20-35 it Between), dielectric loss less (between 0.01-0.03), dielectric properties frequency stability good.
This high dielectric-epoxy plastic packaging material can be used for fingerprint sensor package field.
Embodiment 4
The present embodiment provides the preparation method of a kind of high dielectric inorganic filler, and it comprises the following steps:
Weigh the spherical low dielectric silicon dioxide that 10.0g particle diameter is 800nm and be dispersed in the solution (water of 100ml water and ethanol Can be 5:95 with the quality of ethanol) in, stir, add 1g butyl titanate and 1g barium hydroxide, stir, 100 DEG C Hydro-thermal reaction 2h, stands, and obtains high dielectric inorganic filler after the precipitation absolute ethanol washing obtained, drying.
The present embodiment also provides for the preparation method of a kind of high dielectric-epoxy plastic packaging material, and it comprises the following steps:
Weigh 8g3,4-epoxycyclohexyl-methyl-3,4-epoxycyclohexyl formic acid esters, 8g o-cresol formaldehyde epoxy resin, 57.75g high dielectric filler through the mixing 20min of twin-screw extruder, is subsequently adding 0.5g octadecyl silicon at 120 DEG C Alkane, 5g triethylene-glycol glycidyl ether, 0.5g Tissuemat E and 5g flame retardant of magnesium hydroxide are at 120 DEG C of mixing 15min, Mixing 30min at rear addition 15g THPA and 0.25g 1-1-cyanoethyl-2-methylimidazole 100 DEG C, is cooled to room temperature, through powder Broken obtain high dielectric-epoxy plastic packaging material.
The dielectric constant of this plastic packaging material is 28 (1kHz), and loss is 0.02, and thermal coefficient of expansion is CTE1:25ppm/ DEG C, CTE2:55ppm/℃。
High dielectric-epoxy plastic packaging material prepared by the present embodiment, not only has the low-expansion coefficient of traditional plastic packaging material, low stress Feature, wherein CTE1 is between 10-30ppm/ DEG C, and CTE2 is between 40-80ppm/ DEG C.And dielectric constant high (20-35 it Between), dielectric loss less (between 0.01-0.03), dielectric properties frequency stability good.
This high dielectric-epoxy plastic packaging material can be used for fingerprint sensor package field.
Embodiment 5
The present embodiment provides the preparation method of a kind of high dielectric inorganic filler, and it comprises the following steps:
Weigh the spherical low dielectric silicon dioxide that 8.0g particle diameter is 3 μm and be dispersed in solution (water and the second of 100ml water and ethanol The quality of alcohol can be 5:95) in, stir, addition 0.8g titanium dioxide and 0.8g barium nitrate, 140 DEG C of hydro-thermal reactions 3h, quiet Put, after the precipitation absolute ethanol washing obtained, drying, obtain high dielectric inorganic filler.
The present embodiment also provides for the preparation method of a kind of high dielectric-epoxy plastic packaging material, and it comprises the following steps:
Weigh 6g3,4-epoxycyclohexyl-methyl-3,4-epoxycyclohexyl formic acid esters, 6g o-cresol formaldehyde epoxy resin, 61.75g high dielectric filler through the mixing 10min of twin-screw extruder, is subsequently adding 0.5g trimethyoxysilane, 5g phosphorus at 150 DEG C Acid tributyl, 0.5g natural paraffin wax and 5g tripolycyanamide, at 100 DEG C of mixing 10min, are eventually adding 15g dicyandiamide and 0.25g tri- Mixing 30min at Phenylphosphine 100 DEG C, is cooled to room temperature, is grinding to obtain high dielectric-epoxy plastic packaging material.
The dielectric constant of this plastic packaging material is 24 (1kHz), and loss is 0.017, and thermal coefficient of expansion is CTE1:20ppm/ DEG C, CTE2:40ppm/℃。
High dielectric-epoxy plastic packaging material prepared by the present embodiment, not only has the low-expansion coefficient of traditional plastic packaging material, low stress Feature, wherein CTE1 is between 10-30ppm/ DEG C, and CTE2 is between 40-80ppm/ DEG C.And dielectric constant high (20-35 it Between), dielectric loss less (between 0.01-0.03), dielectric properties frequency stability good.
This high dielectric-epoxy plastic packaging material can be used for fingerprint sensor package field.
Embodiment 6
The present embodiment provides the preparation method of a kind of high dielectric inorganic filler, and it comprises the following steps:
Weigh the spherical low dielectric silicon dioxide that 4.0g particle diameter is 2 μm and be dispersed in solution (water and the second of 100ml water and ethanol The quality of alcohol can be 5:95) in, stir, addition 0.6g titanium dioxide and 0.6g barium nitrate, 130 DEG C of hydro-thermal reactions 3h, quiet Put, after the precipitation absolute ethanol washing obtained, drying, obtain high dielectric inorganic filler.
The present embodiment also provides for the preparation method of a kind of high dielectric-epoxy plastic packaging material, and it comprises the following steps:
Weigh 4g3,4-epoxycyclohexyl-methyl-3,4-epoxycyclohexyl formic acid esters, 4g o-cresol formaldehyde epoxy resin, 65.75g high dielectric filler through the mixing 20min of twin-screw extruder, is subsequently adding 0.5g γ-glycidyl ether oxygen propyl at 150 DEG C Trimethoxy silane, 5g tributyl phosphate, 0.5g Tissuemat E and 5g tripolycyanamide, at 100 DEG C of mixing 10min, are eventually adding Mixing 30min at 15g phenolic resin and 0.25g triphenylphosphine 100 DEG C, is cooled to room temperature, is grinding to obtain high dielectric-epoxy and moulds Envelope material.
The dielectric constant of this plastic packaging material is 20 (1kHz), and loss is 0.015, and thermal coefficient of expansion is CTE1:20ppm/ DEG C, CTE2:40ppm/℃。
High dielectric-epoxy plastic packaging material prepared by the present embodiment, not only has the low-expansion coefficient of traditional plastic packaging material, low stress Feature, wherein CTE1 is between 10-30ppm/ DEG C, and CTE2 is between 40-80ppm/ DEG C.And dielectric constant high (20-35 it Between), dielectric loss less (between 0.01-0.03), dielectric properties frequency stability good.
This high dielectric-epoxy plastic packaging material can be used for fingerprint sensor package field.

Claims (10)

1. an epoxy-plastic packaging material, is in terms of 100% by the gross weight of this epoxy-plastic packaging material, and its raw material composition includes:
High dielectric filler 30%-70%, epoxy resin 10%-50%, phenolic resin 10%-50%, firming agent 10%-20%, Accelerator 0.1%-0.5%, coupling agent 0.1%-1%, toughener 1%-10%, releasing agent 0.1%-0.5% and fire retardant 1%-10%, the percentage ratio sum of each component is 100%.
2. epoxy-plastic packaging material as claimed in claim 1, wherein, described high dielectric filler is through the following steps that preparation: will Silicon dioxide is dispersed in the solution of water and ethanol, adds barium precursor and titanium precursors carries out hydro-thermal reaction, be precipitated, will Precipitation carries out washing, dry after obtain described high dielectric filler.
3. epoxy-plastic packaging material as claimed in claim 2, wherein, described silicon dioxide is the spherical dioxy of particle diameter 50nm-20 μm SiClx, it is preferable that particle diameter is 500nm-5 μm.
4. epoxy-plastic packaging material as claimed in claim 2, wherein, described barium precursor be barium hydroxide, barium nitrate, barium acetate, One or more in barium chloride；Described titanium precursors is one or both in butyl titanate, titanium dioxide.
5. the epoxy-plastic packaging material as according to any one of claim 2-4, wherein, described barium precursor and titanium precursors mol ratio For (1.5-1.0): 1, silicon dioxide is 1:(0.1-1 with the mol ratio of barium precursor).
6. the epoxy-plastic packaging material as according to any one of claim 2-5, wherein, the reaction temperature of described hydro-thermal reaction is 100- 250 DEG C, preferably 100-150 DEG C；Response time is 1-10h, preferably 2-5h.
7. the epoxy-plastic packaging material as according to any one of claim 1-6, wherein, described epoxy resin is hexamethylene-1,2-bis- Carboxylic acid 2-glycidyl ester, bisphenol A type epoxy resin E44, bisphenol-s epoxy resin, 3,4-epoxycyclohexyl-methyl-3,4-ring The mixing of one or more in oxygen hexahydrobenzoid acid ester；
Preferably, the one during described phenolic resin is o-cresol-formaldehyde resin, CF epoxy resin, t-octyl phenolic resin Or several mixing；
Preferably, described firming agent be THPA, o-cresol-formaldehyde resin, dicyandiamide, 4, in 4-diamino-dicyclohexyl methane The mixing of one or more, it is preferable that the molecular weight of phenolic resin is 100-2000；
Preferably, described accelerator is triphenylphosphine, 1-1-cyanoethyl-2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl The mixing of one or more in imidazoles；
Preferably, described coupling agent be gamma-aminopropyl-triethoxy-silane, γ-glycidyl ether oxygen propyl trimethoxy silicane, γ-methacryloxypropyl trimethoxy silane, γ-mercaptopropyl trimethoxysilane, trimethyoxysilane, pi-allyl The mixing of one or more in trimethyl silane, octadecyl trimethoxysilane；
Preferably, described toughener is aliphatic poly ethoxylated polyhydric alcohol, phthalic acid dibutyl ester, dioctyl phthalate, aromatic series The mixing of one or more in polyether polyol, triethylene-glycol glycidyl ether, tributyl phosphate；
Preferably, the mixing of one or more during described releasing agent is stearic acid wax, Tissuemat E, natural paraffin wax；
Preferably, described fire retardant is aluminium hydroxide, magnesium hydroxide, titanium oxide, calcium oxide, Firebrake ZB, polysilane oxygen alkane, poly-phosphorus One or several mixing in acid ammonium, phosphate ester, tripolycyanamide.
8. the preparation method of the epoxy-plastic packaging material according to any one of claim 1-7, it comprises the following steps:
A epoxy resin, phenolic resin, the mixing of high dielectric filler are carried out mixing by ()；
B () is subsequently adding coupling agent, toughener, releasing agent and fire retardant, continue mixing；
C () is eventually adding firming agent and accelerator carries out mixing, is cooled to room temperature, is grinding to obtain described epoxy-plastic packaging material.
9. preparation method as claimed in claim 8, wherein, described mixing temperature is 100-150 DEG C；The described mixing time For 5-60min, preferably 10-60min.
10. the application in fingerprint sensor of the epoxy-plastic packaging material according to any one of claim 1-7.
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