CN112533461A

CN112533461A - Drive and control integrated board, control system and robot

Info

Publication number: CN112533461A
Application number: CN202011562541.5A
Authority: CN
Inventors: 石金博; 陈理辉; 俞春华; 沙琪; 刘虹
Original assignee: Dongguan Liqun Automation Technology Co ltd
Current assignee: Dongguan Liqun Automation Technology Co ltd
Priority date: 2020-12-25
Filing date: 2020-12-25
Publication date: 2021-03-19
Also published as: JP2024500534A; US20240098875A1; WO2022134461A1; EP4269046A1

Abstract

The invention belongs to the technical field of robot control, and discloses a drive and control integrated board, a control system and a robot, wherein the drive and control integrated board comprises a control module, a driving module and a first substrate, the control module and the driving module are arranged on the first substrate, and the control module is electrically connected with the driving module. The control system and the robot comprise the driving and controlling integrated plate. According to the scheme, the control function and the driving function are set to be of an integrated structure, so that the overall structure of the control function and the driving function assembly is more compact, and miniaturization of application equipment is facilitated.

Description

Drive and control integrated board, control system and robot

Technical Field

The invention relates to the technical field of robot control, in particular to a driving and controlling integrated plate, a control system and a robot.

Background

The robot is a cross technical product integrating the fields of machinery, electricity, electronic information and the like, is an industrial robot, and can replace a human being to carry out the work of carrying, assembling, loading and unloading, stacking, welding, spraying and the like. The main components of the robots at least comprise a mechanical body, a speed reducer, a motor, a driver and a controller, the controller and the driver of the common robots in the current market are mutually separated and need to be respectively installed, the occupied space is large, more installation auxiliary materials are consumed, the signal transmission connection is complex, and in addition, the split design is difficult to meet the use requirement of the narrow space.

In view of the above situation, it is necessary to design a new combination structure of driver and controller.

Disclosure of Invention

One object of the present invention is: the drive and control integrated plate, the control system and the robot are provided, integration of a drive function and a control function is achieved, and the overall drive and control structure is more compact.

In order to achieve the purpose, the invention adopts the following technical scheme:

in a first aspect, a driving and controlling integrated board is provided, which includes a control module, a driving module and a first substrate, wherein the control module and the driving module are disposed on the first substrate, and the control module is electrically connected to the driving module.

Particularly, the control module and the driving module are arranged on the same substrate, so that the overall structure of the control module and the driving module is more compact, and miniaturization of application equipment is facilitated.

As an alternative, the device further comprises an isolation device, wherein the isolation device is arranged between the driving module and the control module.

Specifically, the isolation device is used for isolating the driving module and the control module, so as to avoid interference between strong current and weak current, and further improve respective working reliability of the driving module and the control module.

Optionally, the isolation device is disposed on the first substrate.

Optionally, the isolation device covers the driving module and/or the control module.

Optionally, the isolation device is one or a combination of two or more of a magnetic coupler, an optical coupler and a capacitive isolator.

Alternatively, an isolation slot is formed in the first substrate, and the isolation slot is located between the driving module and the control module.

Specifically, the isolation slot forms air isolation between the driving module and the control module, so that interference signals are switched and transmitted between two different media, namely solid and gas, and the interference signals are blocked, thereby being beneficial to reducing mutual interference between the driving module and the control module.

As an alternative, a plurality of isolation slots are arranged between the driving module and the control module;

or a plurality of partition plates are arranged in the isolation open groove.

Particularly, through setting up many keep apart fluting or polylith space bar, can make interference signal switch repeatedly between solid and gaseous medium many times, and then improve the separation effect to interference signal.

Preferably, all of the isolation slots are arranged in parallel.

Preferably, all of the partition plates are arranged in parallel.

Alternatively, the driving module is disposed near an edge of one end of the first substrate, and the control module is disposed near an edge of the other end of the first substrate.

Specifically, the driving module and the control module are arranged at two ends which are relatively far away from each other, so that interference between the driving module and the control module is reduced.

As an alternative, the control module and the driving module are arranged on the same side of the first substrate;

or, the control module is arranged on the first surface of the first substrate, and the driving module is arranged on the second surface of the first substrate;

or, the control module comprises a first control part and a second control part, the first control part is arranged on the first surface of the first substrate, and the second control part and the driving module are arranged on the second surface of the first substrate;

or, the driving module includes a first driving portion and a second driving portion, the first driving portion is disposed on the first surface of the first substrate, and the second driving portion and the control module are disposed on the second surface of the first substrate.

Specifically, control module and drive module are as the source that generates heat, will control module divide into two parts or will drive module divide into two parts, can make the source that generates heat more dispersed, help avoiding local position overheated, and then effectively improve the operational reliability who drives accuse intergral template.

Optionally, the first control part is electrically connected with the second control part, and the first control part and/or the second control part are electrically connected with the driving module.

Optionally, the first driving portion is electrically connected to the second driving portion, and the first driving portion and/or the second driving portion are electrically connected to the control module.

As an alternative, the display device further comprises a first low-voltage power supply and a first high-voltage power supply which are arranged on the first substrate, and the control module, the first low-voltage power supply, the first high-voltage power supply and the driving module are sequentially and adjacently arranged, or the control module, the first low-voltage power supply, the driving module and the first high-voltage power supply are sequentially and adjacently arranged.

Optionally, the system further comprises an I/O interface, and the I/O interface is electrically connected with the control module.

As an alternative, the I/O interface is disposed on a side of the control module away from the driving module; or the I/O interface is arranged on one side of the control module close to the driving module; or the I/O interface is arranged on one side of the first low-voltage power supply close to the driving module.

Specifically, through the above design, on one hand, the connection distance between the control module and the I/O interface can be shortened, and on the other hand, the space between the control module and the driving module can be fully utilized, and the first low-voltage power supply is made to approach the control module, and the first high-voltage power supply is made to approach the driving module, so that the control module and the driving module can be more efficiently and reliably powered.

Optionally, the isolation device is located between the first low voltage power supply and the first high voltage power supply.

Optionally, the isolation slot is located between the first low voltage power supply and the first high voltage power supply.

Alternatively, the drive module is connected to an external strong power supply.

As an alternative, the display device further comprises a first communication module arranged on the first substrate, and the first communication module is electrically connected with the control module and/or the driving module.

Specifically, through setting up first communication module can realize control module and external equipment's remote connection, and then improve the flexibility of use and the application scope of this driving and controlling integrated board.

Optionally, the first communication module is disposed on the first surface or the second surface of the first substrate.

Optionally, the first communication module is located between the control module and the driving module. Further, the first communication module is arranged close to the control module.

Optionally, the first communication module is located between the first low-voltage power supply and the first high-voltage power supply.

Optionally, the first communication module is located at one side of the isolation device or the isolation slot close to the control module.

As an alternative, the first communication module is connected to a network bus.

As an alternative, the heat dissipation module further comprises two heat dissipation assemblies, wherein the heat dissipation assemblies are arranged on the first substrate, one of the heat dissipation assemblies is located on one side of the control module, which is far away from the driving module, and the other heat dissipation assembly is located on one side of the driving module, which is far away from the control module.

Specifically, the heat dissipation assemblies are arranged on the outer sides of the two ends and are respectively adjacent to the control module and the driving module, so that the heat dissipation effect is improved.

Optionally, the heat sink further comprises at least one heat dissipation assembly, and the heat dissipation assembly is arranged on the first substrate.

Specifically, the heat dissipation assembly can dissipate heat of the control module and the drive module, so that the working reliability of the control module and the drive module is guaranteed, and the service life of the control module and the drive module is prolonged.

As an alternative, the heat dissipation assembly includes a heat dissipation bottom plate and a plurality of heat dissipation fins, the heat dissipation bottom plate is mounted on the first substrate, and the heat dissipation fins are mounted on the heat dissipation bottom plate.

Optionally, the heat dissipation base plate and the heat dissipation fins are disposed between the driving module and the control module.

Alternatively, the heat sink base plate abuts against the drive module and/or the control module.

Specifically, the heat dissipation assembly is in direct heat transfer connection with the control module and/or the driving module, so that the heat dissipation effect can be improved.

As an alternative, the heat dissipation bottom plate is connected with the control module and/or the driving module through heat-conducting silica gel.

Alternatively, the heat dissipation assembly further comprises a first fan mounted on one side of the heat dissipation fins and capable of driving the flow of air in the region of the heat dissipation fins.

Alternatively, the heat dissipation assembly includes a second fan disposed at an edge of the first substrate.

Specifically, will the second fan sets up in the border, can simplify and drive the global design degree of difficulty and the manufacturing process of controlling integrated board, is favorable to driving the popularization and application of controlling integrated board.

As an alternative, the heat dissipation device further comprises a heat dissipation assembly, and the heat dissipation assembly is arranged on the first substrate.

As an alternative, the heat sink base plate abuts against the drive module and/or the control module and/or the first communication module.

As an alternative, the heat dissipation bottom plate is connected to the control module and/or the driving module and/or the first communication module through heat-conducting silica gel.

As an alternative, the safety circuit module is further included, the safety circuit module is arranged on the first substrate, and the safety circuit module is electrically connected with the control module and/or the driving module.

Particularly, by providing the safety circuit module, the operational reliability of the control module and/or the driving module can be improved.

Optionally, the safety circuit module is electrically connected to the first communication module.

As an alternative, the device further comprises a heat insulation piece which is arranged between the driving module and the control module.

Specifically, the heat insulation piece can reduce heat transfer between the driving module and the control module, and further ensure the reliability of independent work of the driving module and the control module.

Optionally, the heat insulation member is a hollow structural member.

Optionally, the thermal insulation is located between the first low voltage power supply and the first high voltage power supply.

Optionally, the thermal insulation element and the isolation device are the same structural element.

Optionally, the heat insulation member is disposed in the isolation slot.

Optionally, the first communication module is located on a side of the heat insulation member close to the control module.

As an alternative, the driving module is attached to the first substrate, the first communication module is attached to one side of the driving module, which is far away from the first substrate, and the control module is attached to one side of the first communication module, which is far away from the first substrate.

As an alternative, the control module is attached to the first substrate, and the driving module is arranged in parallel with the control module and attached to the first substrate;

or the control module is attached to the first substrate, and the driving module is attached to one side of the control module, which is far away from the first substrate;

or, the driving module is attached to the first substrate, and the control module is attached to one side of the driving module, which is far away from the first substrate.

In a second aspect, a driving and controlling integrated board is disclosed, which includes a first substrate and a second substrate integrally disposed, wherein the first substrate is a control function board, the second substrate is a driving function board, and the first substrate is electrically connected to the second substrate.

Alternatively, the second substrate is disposed in superimposition with the first substrate.

Alternatively, the second substrate is attached to the first substrate and connected by a daisy chain.

Optionally, the substrate further comprises an isolation device disposed between the second substrate and the first substrate.

As an alternative, the substrate structure further comprises a first low-voltage power supply and a first high-voltage power supply, wherein the first substrate, the first low-voltage power supply, the first high-voltage power supply and the second substrate are sequentially and adjacently arranged, or the first substrate, the first low-voltage power supply, the second substrate and the first high-voltage power supply are sequentially and adjacently arranged.

Optionally, the first substrate further comprises an I/O interface electrically connected to the first substrate.

As an alternative, the I/O interface is disposed on a side of the first substrate away from the second substrate; or the I/O interface is arranged on one side of the first substrate close to the second substrate; or the I/O interface is arranged on one side of the first low-voltage power supply close to the second substrate.

Alternatively, the second substrate is connected to an external strong power source.

Optionally, the display device further comprises a communication module, and the communication module is electrically connected with the first substrate and/or the second substrate.

As an alternative, the communication module is connected to a network bus.

Optionally, at least one heat dissipation assembly is further included for dissipating heat from the first substrate and/or the second substrate.

Alternatively, the number of the heat dissipation assemblies is two, one of the heat dissipation assemblies is located on the side of the first substrate away from the second substrate, and the other heat dissipation assembly is located on the side of the second substrate away from the first substrate.

As an alternative, the number of the heat dissipation assemblies is one, and the heat dissipation assemblies are arranged between the second substrate and the first substrate; or, the heat dissipation assembly abuts against the first substrate; or, the heat dissipation assembly abuts against the second substrate.

As an alternative, the heat dissipation assembly includes a heat dissipation base plate and a plurality of heat dissipation fins, the heat dissipation base plate is mounted on one of the second substrate and the first substrate, the heat dissipation fins are mounted on the heat dissipation base plate, and the other of the second substrate and the first substrate is attached to the heat dissipation fins.

As an alternative, the heat dissipation bottom plate is connected to the first substrate or the second substrate through heat-conducting silica gel.

Alternatively, the heat dissipation assembly further comprises a heat dissipation fan mounted on one side of the heat dissipation fins and capable of driving the air flow of the heat dissipation fin region.

As an alternative, the heat insulation device is further included, and the heat insulation device is arranged between the second substrate and the first substrate.

As an alternative, the number of the first substrates is equal to the number of the second substrates, and the first substrates are electrically connected with the second substrates in a one-to-one correspondence manner;

or the number of the first substrates is less than that of the second substrates, and at least one first substrate is electrically connected with more than two second substrates.

In a third aspect, a control system is provided, which comprises the above-mentioned integrated control plate.

Particularly, the control system adopting the driving and controlling integrated plate can enable the overall structure of the system to be more compact, further provide a larger design space for the execution component, and reduce the overall design difficulty of the equipment and facilitate the miniaturization of the equipment.

As an alternative, the device further comprises a signal adapter plate, a second low-voltage power supply and a second high-voltage power supply, the number of the driving and controlling integrated plates is two, and one driving and controlling integrated plate, the signal adapter plate, the second low-voltage power supply, the second high-voltage power supply and the other driving and controlling integrated plate are sequentially stacked.

Specifically, the signal adapter plate is used for realizing the connection between the driving and controlling integrated plate and the signal input and output of the external equipment. Furthermore, the driving and controlling integrated plates, the signal adapter plate, the second low-voltage power supply, the second high-voltage power supply and the other driving and controlling integrated plate are sequentially and adjacently arranged, so that on one hand, the connection distance between one driving and controlling integrated plate and the signal adapter plate can be shortened, on the other hand, the second low-voltage power supply is close to one driving and controlling integrated plate, and the second high-voltage power supply is close to the other driving and controlling integrated plate, so that the two driving and controlling integrated plates can be more efficiently and reliably powered, on the other hand, the two driving and controlling integrated plates can be isolated by using structures such as the second low-voltage power supply and the second high-voltage power supply, the mutual interference between the two driving and controlling integrated plates is reduced, and the respective working reliability of the two driving and controlling integrated plates is further ensured.

Optionally, the drive-control integrated board adjacent to the signal adapter board is only used for realizing a control function, and may be replaced by a conventional single control board; the driving and controlling integrated board adjacent to the second high-voltage power supply is only used for realizing a driving function and can be replaced by a conventional single driving board.

As an alternative, two heat sinks are further included, one of the heat sinks is located on one side, away from the signal adapter board, of one of the control integrated boards, and the other heat sink is located on one side, away from the second high-voltage power supply, of the other control integrated board.

Specifically, the radiators are arranged on the outer sides of two ends of the control system and are respectively adjacent to the driving and control integrated plates, so that the improvement of the heat dissipation effect is facilitated.

As an alternative, the number of the drive and control integrated plates is more than two, and all the drive and control integrated plates are arranged at intervals along one row and are sequentially connected in a cascade manner, or all the drive and control integrated plates are arranged at intervals along two rows and are sequentially connected in a cascade manner.

Specifically, every drive and control integrated board can control an executive component respectively, and this kind of stacked layout mode can make control system compacter, is favorable to concentrating the overall arrangement with the drive and control structure that all executive components correspond, and then improves the convenience of later maintenance.

Specifically, all the driving and controlling integrated plates are arranged along a column at intervals in an overlapping mode, namely a three-like distribution structure is formed; all the driving and controlling bodies are arranged in a stacking mode at intervals along two columns, namely a non-shaped distribution structure is formed.

As an alternative, any one of the driving and controlling integrated boards can be used as a main control board, and is used for controlling signals of all the driving and controlling integrated boards and is in signal connection with external equipment;

or all the driving and controlling integrated plates are connected with a cloud end controller, and the cloud end controller controls signals of all the driving and controlling integrated plates and is in signal connection with external equipment.

Specifically, the design can enable the driving and controlling integrated board to realize external connection, and linkage among different robots is realized.

As an alternative, the driving and controlling integrated plate further comprises a connecting plate arranged in a stacked manner at an interval with the driving and controlling integrated plate, the connecting plate comprises a third control part and a second substrate, the third control part is arranged on the second substrate, and the driving and controlling integrated plate is electrically connected with the third control part after being sequentially connected in a cascade manner.

Specifically, the third control part electrically connected with the driving and controlling integrated board is arranged, so that the overall control of all the driving and controlling integrated boards can be realized, and the signal interaction between different driving and controlling integrated boards can be coordinated, so that the control system can comprehensively and reliably control the execution part.

Optionally, the connection board is disposed on one side of an entirety formed by all the control integrated boards in one of the columns, so that the connection board is connected to an external controller.

As an alternative, the connection board further includes a second communication module, the second communication module is disposed on the second substrate, and the third control portion is electrically connected to the second communication module.

Specifically, the second communication module can realize remote interaction between the third control part and external equipment, so that the efficiency of interconnection between the control system and the external equipment is improved.

As an alternative, the integrated plate driving and controlling device further comprises a connecting seat, wherein the connecting seat comprises more than two first cascade sockets for the driving and controlling integrated plate to be inserted, all the first cascade sockets are distributed at equal intervals along one row and are sequentially connected in a cascade mode, or all the first cascade sockets are distributed at intervals along two rows and are sequentially connected in a cascade mode.

Specifically, through setting have first cascade socket the connecting seat can improve on the one hand drive the installation reliability of accuse intergral template, on the other hand can make things convenient for drive accuse integrative with the quick assembly disassembly of connecting seat, and then improve convenience and the flexibility that different accuse intergral template combinations used.

As an alternative, the connecting device further comprises a connecting seat, the connecting seat comprises more than two first cascade sockets for the driving and controlling of the integrated plate and a second cascade socket for the connecting plate to be plugged, all the first cascade sockets are distributed at equal intervals along one row and are sequentially connected in a cascade mode or are all the first cascade sockets are distributed at intervals along two rows and are sequentially connected in a cascade mode, and the second cascade socket is electrically connected with at least one first cascade socket.

Specifically, through setting have first cascade socket with the second cascade socket the connecting seat can improve on the one hand drive the installation reliability of accuse intergral template, connecting plate, and on the other hand can be convenient drive the accuse integratively, connecting plate with the quick assembly disassembly of connecting seat, and then improve convenience and the flexibility that different accuse intergral templates, connecting plate combined use.

Optionally, the second cascade socket is disposed on one side of an entirety formed by the first cascade sockets in one row, so that the second cascade socket plate is connected with an external controller.

Alternatively, the second cascading socket is electrically connected to the adjacent first cascading socket.

As an alternative, still include the connecting seat, the connecting seat includes the confession more than two the first cascade socket that drives the grafting of accuse integrated board, all first cascade socket is along a equidistant distribution and cascade connection or whole in proper order first cascade socket is along two interval superpose distributions and cascade connection in proper order, the connecting plate welding or paste adorn in the connecting seat, just the connecting plate with at least one first cascade socket electricity is connected.

Specifically, the connecting plate is welded or attached to the connecting seat, so that the connection reliability of the connecting plate and the connecting seat can be improved, and the working reliability of the whole control system is further improved.

Optionally, the connecting plate is disposed on one side of an entirety formed by all the first cascading sockets in one row, so that the connecting plate is connected with an external controller.

Alternatively, the connection plate is electrically connected to the adjacent first cascading sockets.

The control integrated board is welded or attached to the main substrate.

Specifically, the driving and controlling integrated plate is welded or attached to the main base plate, so that the connection reliability of the driving and controlling integrated plate and the main base can be improved, and the working reliability of the whole control system is further improved.

As an alternative, the driving and controlling integrated circuit further comprises a main substrate, and the connecting plate and/or all the driving and controlling integrated plates are welded or attached to the main substrate.

As an alternative, the integrated drive and control plate further comprises a temperature controller, and the temperature controller can perform high-temperature protection on the integrated drive and control plate.

Particularly, through setting up the temperature controller can avoid this control system to carry out work under overheated state, and then effectively prolong control system's life.

In a fourth aspect, another control system is provided, which includes a control function board, a driving function board, a signal adapter board, a second low voltage power supply and a second high voltage power supply, wherein the control function board, the driving function board, the signal adapter board, the second low voltage power supply and the second high voltage power supply are connected in a daisy chain.

Specifically, the daisy chain is adopted to realize the connection of devices such as a control function board, a drive function board and the like, so that the control function board, the drive function board and the like can form a high-efficiency interconnected drive and control integrated system, and the miniaturization of the control system is favorably realized.

Specifically, the signal adapter board is used for realizing the connection between the control function board, the driving function board and the signal input and output of the external device.

As an alternative, the number of the control function board is one, the number of the driving function board is one, and the control function board, the signal adapter board, the second low-voltage power supply, the second high-voltage power supply and the driving function board are sequentially stacked, or the control function board, the signal adapter board, the second low-voltage power supply, the driving function board and the second high-voltage power supply are sequentially stacked.

Specifically, through the structure that the control function board and the signal adapter board are sequentially stacked, on one hand, the connection distance between the control function board and the signal adapter board can be shortened, on the other hand, the control function board and the driving function board are isolated, the mutual interference between the control function board and the driving function board is reduced, and further the working reliability of each control function board and the driving function board is guaranteed, on the other hand, the second low-voltage power supply is made to be close to the control function board, and the second high-voltage power supply is made to be close to the driving function board, so that the control function board and the driving function board can be more efficiently and reliably powered.

As an alternative, two radiators are further included, and one of the radiators is located on the side of the control function board far away from the drive function board, and the other radiator is located on the side of the drive function board far away from the control function board.

Specifically, the radiators are arranged at the outer sides of the two ends of the control system and are respectively adjacent to the control function board and the driving function board, so that the improvement of the radiating effect is facilitated.

Alternatively, the control function board and/or the driving function board adopts the above-mentioned driving and controlling integrated board.

In a fifth aspect, a robot is provided, which comprises the control system.

The invention has the beneficial effects that: the control function and the driving function are set to be of an integrated structure, so that the overall structure of the control function and the driving function assembly is more compact, and miniaturization of application equipment is facilitated.

Drawings

The invention is explained in more detail below with reference to the figures and examples.

FIG. 1 is a first structural diagram of a driving and controlling integrated plate according to a first embodiment;

FIG. 2 is a second structural diagram of a driving and controlling integrated plate according to the first embodiment;

FIG. 3 is a third structural diagram of a control integrated plate according to the first embodiment;

FIG. 4 is a fourth structural diagram of a driving and controlling integrated plate according to the first embodiment;

FIG. 5 is a schematic view of a fifth embodiment of a control integrated plate according to the first embodiment;

FIG. 6 is a sixth schematic view of a control integrated plate according to the first embodiment;

FIG. 7 is a seventh structural diagram of a driving and controlling integrated plate according to the first embodiment;

FIG. 8 is a schematic structural diagram of a driving and controlling integrated plate according to the second embodiment;

FIG. 9 is a schematic structural diagram of a control integrated plate according to a third embodiment;

FIG. 10 is a schematic structural diagram of a control system according to a seventh embodiment;

FIG. 11 is a schematic structural diagram of a control system according to the ninth embodiment;

FIG. 12 is a schematic structural diagram of a driving and controlling integrated plate according to a sixth embodiment;

FIG. 13 is a schematic diagram of a robot according to an embodiment;

FIG. 14 is a schematic view of another embodiment of a robot;

fig. 15 is a schematic structural diagram of a robot according to an embodiment.

In fig. 1 to 15:

100. a driving and controlling integrated plate;

1. a control module; 11. a first control section; 12. a second control section; 2. a drive module; 21. a first driving section; 22. a second driving section; 3. a first substrate; 41. an isolation device; 42. separating and slotting; 5. a heat dissipating component; 51. a heat dissipation base plate; 52. a heat dissipating fin; 6. a first fan; 7. an I/O interface; 8. a first low voltage power supply; 9. a first high voltage power supply;

200. a signal transfer board; 300. a second low voltage power supply; 400. a second high voltage power supply; 500. a connecting plate; 501. a third control section; 502. a second substrate; 503. a second communication module; 600. a connecting seat; 601. a first cascading socket; 602. a second cascade socket.

In fig. 12:

1. a first substrate; 2. a second substrate; 3. a first low voltage power supply; 4. a second low voltage power supply; 5. a heat dissipation assembly.

Detailed Description

In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.

The first embodiment is as follows:

a drive and control integrated board is shown in fig. 1 and comprises a control module 1, a drive module 2 and a first substrate 3, wherein the control module 1 and the drive module 2 are arranged on the first substrate 3, and the control module 1 is electrically connected with the drive module 2. Specifically, by disposing the control module 1 and the driving module 2 on the same substrate, the overall structure of the control module 1 and the driving module 2 can be made more compact, which is beneficial to miniaturization of the application devices.

In this embodiment, the control module 1 is attached to the first substrate 3, and the driving module 2 is disposed in parallel with the control module 1 and attached to the first substrate 3. In other embodiments, the following design is also possible: the control module is attached to the first substrate, and the driving module is attached to one side of the control module, which is far away from the first substrate; or the driving module is attached to the first substrate, and the control module is attached to one side of the driving module, which is far away from the first substrate.

Optionally, as shown in fig. 2, the driving and controlling integrated board 100 further includes an isolation device 41, and the isolation device 41 is disposed between the driving module 2 and the control module 1. Specifically, the isolation device 41 is used for isolating the driving module 2 and the control module 1, so as to avoid interference between strong current and weak current, and further improve respective working reliability of the driving module 2 and the control module 1. Further, the isolation device 41 is disposed on the first substrate 3. In other embodiments, the isolation device 41 may also encase the drive module 2 and/or the control module 1.

Optionally, the isolation device 41 is one or a combination of two or more of a magnetic coupler, an optical coupler, and a capacitive isolator.

Optionally, the driving module 2 is disposed near an edge of one end of the first substrate 3, and the control module 1 is disposed near an edge of the other end of the first substrate 3. Specifically, by disposing the drive module 2 and the control module 1 at the two ends relatively far away from each other, it is possible to contribute to reducing interference between the two.

Optionally, the control module 1 and the driving module 2 are disposed on the same side of the first substrate 3. Of course, in other embodiments, the following design is also possible: the control module 1 is disposed on a first surface of the first substrate 3, and the driving module 2 is disposed on a second surface of the first substrate 3, as shown in fig. 3; or, the control module 1 includes a first control part 11 and a second control part 12, the first control part 11 is disposed on the first surface of the first substrate 3, the second control part 12 and the driving module 2 are disposed on the second surface of the first substrate 3, as shown in fig. 4, further, the first control part 11 is electrically connected to the second control part 12, and the first control part 11 and/or the second control part 12 is electrically connected to the driving module 2; alternatively, the driving module 2 includes a first driving portion 21 and a second driving portion 22, the first driving portion 21 is disposed on the first surface of the first substrate 3, and the second driving portion 22 and the control module 1 are disposed on the second surface of the first substrate 3, as shown in fig. 5, further, the first driving portion 21 is electrically connected to the second driving portion 22, and the first driving portion 21 and/or the second driving portion 22 is electrically connected to the control module 1. Specifically, control module 1 and drive module 2 are as generating heat the source, divide into two parts with control module 1 or divide into two parts with drive module 2, can make the source that generates heat more dispersed, help avoiding local position overheated, and then effectively improve the operational reliability who drives accuse integrated board 100.

Alternatively, the driving module 2 can be directly connected to an external strong power source to improve the flexibility of connection and use of the driving and controlling integrated board 100.

Optionally, the driving and controlling integrated board 100 further includes at least one heat dissipation assembly 5, and the heat dissipation assembly 5 is disposed on the first substrate 3. Specifically, the heat dissipation assembly 5 can dissipate heat of the control module 1 and the driving module 2, so that the working reliability of the control module 1 and the driving module 2 is ensured, and the service life of the control module and the driving module is prolonged.

Optionally, the heat dissipation assembly 5 includes a heat dissipation base plate 51 and a plurality of heat dissipation fins 52, the heat dissipation base plate 51 is mounted on the first substrate 3, and the heat dissipation fins 52 are mounted on the heat dissipation base plate 51. Further, as shown in fig. 6, the heat dissipation base plate 51 and the heat dissipation fins 52 are disposed between the driving module 2 and the control module 1, or the heat dissipation base plate 51 is designed to abut against the driving module 2 and/or the control module 1, and the heat dissipation base plate 51 is connected to the control module 1 and/or the driving module 2 through the heat conductive silicone, so that the heat dissipation effect can be improved, as shown in fig. 7.

Optionally, the heat sink assembly 5 further comprises a first fan 6, wherein the first fan 6 is installed at one side of the heat sink fins 52 and can drive the air flow in the region of the heat sink fins 52.

Optionally, the heat dissipation assembly 5 includes a second fan, and the second fan is disposed at the edge of the first substrate 3. Specifically, set up the second fan in the border, can simplify and drive the global design degree of difficulty and the manufacturing process of controlling integrated board 100, be favorable to driving the popularization and application of controlling integrated board 100.

Optionally, the driving and controlling integrated board 100 further includes a safety circuit module, the safety circuit module is disposed on the first substrate 3, and the safety circuit module is electrically connected to the control module 1 and/or the driving module 2. In particular, by providing the safety circuit module, the operational reliability of the control module 1 and/or the drive module 2 can be improved. Further, on the premise that the first communication module is arranged, the safety circuit module is electrically connected with the first communication module.

Optionally, the driving and controlling integrated board 100 further includes a heat insulation member, and the heat insulation member is disposed between the driving module 2 and the control module 1. Specifically, the heat insulation member can reduce heat transfer between the driving module 2 and the control module 1, thereby ensuring the reliability of independent operation of the driving module and the control module.

Optionally, the thermal insulation member is a hollow structural member.

Optionally, the thermal insulation is the same structural member as the insulation device 41.

Example two:

the present embodiment differs from the first embodiment in that the isolation device 41 in the first embodiment is replaced by the following design:

as shown in fig. 8, the first substrate 3 is provided with an isolation slot 42, and the isolation slot 42 is located between the driving module 2 and the control module 1. Specifically, the isolation slot 42 forms air isolation between the driving module 2 and the control module 1, so that interference signals are switched and transmitted between two different media, namely solid and gas, and the interference signals are blocked, thereby being beneficial to reducing mutual interference between the driving module 2 and the control module 1.

Optionally, a plurality of isolation slots 42 are arranged between the driving module 2 and the control module 1, and all the isolation slots 42 are arranged in parallel; alternatively, a plurality of partition plates are arranged in the isolation slot 42, and all the partition plates are arranged in parallel. Specifically, through setting up many isolation flutings 42 or polylith space bar, can make interference signal switch repeatedly between solid and gaseous medium many times, and then improve the separation effect to interference signal.

Alternatively, the insulation member of the first embodiment may be disposed in the insulation slot 42.

Example three:

the difference between this embodiment and the first or second embodiment is:

as shown in fig. 9, the driving and controlling integrated board 100 further includes an I/O interface 7, a first low voltage power supply 8, and a first high voltage power supply 9 disposed on the first substrate 3, and the control module 1, the I/O interface 7, the first low voltage power supply 8, the first high voltage power supply 9, and the driving module 2 are sequentially disposed adjacent to each other. Specifically, by arranging the control module 1, the I/O interface 7, the first low-voltage power supply 8, the first high-voltage power supply 9 and the driving module 2 adjacent to each other in sequence, on one hand, the connection distance between the control module 1 and the I/O interface 7 can be shortened, on the other hand, the space between the control module 1 and the driving module 2 can be fully utilized, the first low-voltage power supply 8 is made to be close to the control module 1, the first high-voltage power supply 9 is made to be close to the driving module 2, and then the control module 1 and the driving module 2 can be more efficiently and reliably powered. Of course, in other embodiments, the following design is also possible: the I/O interface is arranged on one side of the control module, which is far away from the driving module; or the I/O interface is arranged on one side of the first low-voltage power supply close to the driving module.

Optionally, an isolation device 41 or isolation slot 42 is located between the first low voltage supply 8 and the first high voltage supply 9.

Optionally, the driving and controlling integrated board 100 further includes two heat dissipation assemblies 5, the heat dissipation assemblies 5 are disposed on the first substrate 3, one of the heat dissipation assemblies 5 is located on one side of the control module 1 away from the driving module 2, and the other heat dissipation assembly 5 is located on one side of the driving module 2 away from the control module 1. Specifically, the heat dissipation assembly 5 is arranged at the outer sides of the two ends and is respectively adjacent to the control module 1 and the driving module 2, so that the heat dissipation effect is improved.

Example four:

the difference between this embodiment and the first or second or third embodiment is that:

the driving and controlling integrated body further comprises a first communication module arranged on the first substrate 3, and the first communication module is electrically connected with the control module 1 and/or the driving module 2. Specifically, through setting up first communication module, can realize control module 1 and external equipment's remote connection, and then improve this driving and controlling integrated board 100's flexibility of use and application scope.

Optionally, the first communication module is disposed on the first surface or the second surface of the first substrate 3.

Optionally, the first communication module is located between the control module 1 and the driving module 2. Further, the first communication module is disposed close to the control module 1.

Optionally, the first communication module is located between the first low voltage power supply 8 and the first high voltage power supply 9.

Optionally, the first communication module is located on one side of the isolation device 41 or the isolation slot 42 close to the control module 1.

Optionally, the first communication module is connected to a network bus.

Optionally, the driving module 2 is attached to the first substrate 3, the first communication module is attached to one side of the driving module 2 away from the first substrate 3, and the control module 1 is attached to one side of the first communication module away from the first substrate 3.

Optionally, the driving and controlling integrated board 100 further includes a heat dissipation assembly 5, and the heat dissipation assembly 5 is disposed on the first substrate 3. Specifically, the heat dissipation assembly 5 can dissipate heat of the control module 1 and the driving module 2, so that the working reliability of the control module 1 and the driving module 2 is ensured, and the service life of the control module and the driving module is prolonged.

Optionally, the heat dissipation assembly 5 includes a heat dissipation base plate 51 and a plurality of heat dissipation fins 52, the heat dissipation base plate 51 is mounted on the first substrate 3, and the heat dissipation fins 52 are mounted on the heat dissipation base plate 51. Further, the heat dissipation base plate 51 and the heat dissipation fins 52 are disposed between the driving module 2 and the control module 1, and may also be designed to abut against the heat dissipation base plate 51 and the driving module 2 and/or the control module 1 and/or the first communication module, and the heat dissipation base plate 51 is connected to the control module 1 and/or the driving module 2 and/or the first communication module through the heat conductive silica gel, so that the heat dissipation effect can be improved.

Example five:

the difference between this embodiment and the first or second embodiment is:

the integrated driving and controlling plate further comprises an I/O interface, a first low-voltage power supply and a first high-voltage power supply, wherein the I/O interface, the first low-voltage power supply and the first high-voltage power supply are arranged on the first substrate, the control module and the driving module are arranged on the first substrate in parallel, the I/O interface is installed on one side, far away from the first substrate, of the control module, the first low-voltage power supply is installed on one side, far away from the first substrate, of the I/O interface, and the first high-voltage power supply is installed. Specifically, the connection distance between the control module and the I/O interface can be shortened by adjacently arranging the control module, the I/O interface and the first low-voltage power supply, the first low-voltage power supply is close to the control module, the first high-voltage power supply is close to the driving module, and the control module and the driving module can be more efficiently and reliably powered.

Optionally, the driving and controlling integrated board further includes two heat dissipation assemblies, the heat dissipation assemblies are disposed on the first substrate, one of the heat dissipation assemblies is located on one side of the control module away from the driving module, and the other heat dissipation assembly is located on one side of the driving module away from the control module. Specifically, the heat dissipation assemblies are arranged at the outer sides of the two ends and are respectively adjacent to the control module and the driving module, so that the heat dissipation effect is improved.

EXAMPLE six

A driving and controlling integrated board, as shown in fig. 12, includes a first substrate 1 and a second substrate 2 integrally disposed, the first substrate 1 is a control function board, the second substrate 2 is a driving function board, and the first substrate 1 is electrically connected to the second substrate 2.

Optionally, the second substrate 2 is disposed to overlap with the first substrate 1. Further, the second substrate 2 is attached to the first substrate 1 and connected by daisy chain.

Optionally, the driving and controlling integrated board further includes an isolation device, and the isolation device is disposed between the second substrate 2 and the first substrate 1. Specifically, the isolation device is used for isolating the first substrate 1 and the second substrate 2, so as to avoid interference between strong current and weak current, and further improve the respective working reliability of the first substrate 1 and the second substrate 2.

Optionally, the driving and controlling integrated board further includes a first low voltage power supply 3 and a first high voltage power supply 4, and the first substrate 1, the first low voltage power supply 3, the first high voltage power supply 4 and the second substrate 2 are sequentially and adjacently disposed, or the first substrate 1, the first low voltage power supply 3, the second substrate 2 and the first high voltage power supply 4 are sequentially and adjacently disposed. Further, the driving and controlling integrated board further comprises an I/O interface, and the I/O interface is electrically connected with the first substrate 1. The I/O interface is arranged on one side of the first substrate 1 far away from the second substrate 2; or, the I/O interface is disposed on one side of the first substrate 1 close to the second substrate 2; or, the I/O interface is disposed on a side of the first low voltage power supply 3 close to the second substrate 2.

Optionally, the second substrate 2 is connected to an external strong power supply.

Optionally, the driving and controlling integrated board further includes a communication module, and the communication module is electrically connected to the first substrate 1 and/or the second substrate 2. The communication module is connected with the network bus.

Optionally, the driving and controlling integrated board further includes at least one heat dissipation assembly 5 for dissipating heat from the first substrate 1 and/or the second substrate 2.

Optionally, the number of the heat dissipation assemblies 5 of the driving and controlling integrated plate is two, one of the heat dissipation assemblies 5 is located on one side of the first substrate 1 away from the second substrate 2, and the other heat dissipation assembly 5 is located on one side of the second substrate 2 away from the first substrate 1.

Optionally, the number of the heat dissipation assemblies 5 of the driving and controlling integrated plate is one, and the heat dissipation assemblies 5 are arranged between the second substrate 2 and the first substrate 1; alternatively, the heat sink 5 abuts the first substrate 1; alternatively, the heat sink 5 abuts against the second substrate 2.

Optionally, the heat dissipation assembly 5 includes a heat dissipation bottom plate and a plurality of heat dissipation fins, the heat dissipation bottom plate is mounted on one of the second substrate 2 and the first substrate 1, the heat dissipation fins are mounted on the heat dissipation bottom plate, and the other of the second substrate 2 and the first substrate 1 is attached to the heat dissipation fins.

Optionally, the heat dissipation bottom plate is connected to the first substrate 11 or the second substrate 2 through heat conductive silicone.

Optionally, the heat dissipation assembly 5 further includes a heat dissipation fan, and the heat dissipation fan is installed on one side of the heat dissipation fin and can drive the air in the heat dissipation fin region to flow.

Optionally, the driving and controlling integrated board further includes a heat insulation member, and the heat insulation member is disposed between the second substrate 2 and the first substrate 1.

Optionally, the number of the first substrates 1 is equal to the number of the second substrates 2, and the first substrates 1 are electrically connected to the second substrates 2 in a one-to-one correspondence manner; or, the number of the first substrates 1 is smaller than that of the second substrates 2, and at least one first substrate 1 is electrically connected to more than two second substrates 2.

Example seven:

the control system including the drive and control integrated board 100 described in any one of the first to fifth embodiments is provided, and specifically, the control system using the drive and control integrated board 100 can make the overall structure of the system more compact, thereby providing a larger design space for the execution component, reducing the overall design difficulty of the device, and facilitating the miniaturization of the device.

Optionally, as shown in fig. 10, the control system further includes a signal adapter board 200, a second low-voltage power supply 300, and a second high-voltage power supply 400, the number of the driving and controlling integrated boards 100 is two, and one driving and controlling integrated board 100, the signal adapter board 200, the second low-voltage power supply 300, the second high-voltage power supply 400, and the other driving and controlling integrated board 100 are sequentially stacked. Specifically, the signal adapter board 200 is used to implement signal input and output connection between the integrated driving and controlling board 100 and an external device. Further, the driving and controlling integrated plates 100, the signal adapter plate 200, the second low-voltage power supply 300, the second high-voltage power supply 400 and the other driving and controlling integrated plate 100 are sequentially and adjacently arranged, on one hand, the connection distance between one driving and controlling integrated plate 100 and the signal adapter plate 200 can be shortened, on the other hand, the second low-voltage power supply 300 is close to one driving and controlling integrated plate 100, and the second high-voltage power supply 400 is close to the other driving and controlling integrated plate 100, so that the two driving and controlling integrated plates 100 can be more efficiently and reliably powered, on the other hand, the two driving and controlling integrated plates 100 can be isolated by using structures such as the second low-voltage power supply 300 and the second high-voltage power supply 400, the mutual interference between the two driving and controlling integrated plates 100 is reduced, and the respective working reliability of the two driving and controlling integrated plates 100 is further.

Alternatively, the driving and controlling integrated board 100 adjacent to the signal adapting board 200 is only used for realizing a control function, and may be replaced by a conventional single control board; the driving and controlling integrated board 100 adjacent to the second high voltage power supply 400 is only used to implement a driving function, and may be replaced with a conventional single driving board.

Optionally, the control system further includes two heat sinks, one of the heat sinks is located on a side of one of the driving and controlling integrated boards 100 away from the signal adapter board 200, and the other heat sink is located on a side of the other driving and controlling integrated board 100 away from the second high voltage power supply 400. Specifically, the radiators are arranged outside two ends of the control system and are respectively adjacent to one driving and controlling integrated plate 100, so that the radiating effect is improved.

The embodiment also provides a robot comprising the control system, specifically, the robot is a six-axis robot, as shown in fig. 13, and the control system is suitable for various specific shapes, structures and models of the six-axis robot. Of course, the robot may be any one of a two-axis robot, a three-axis robot, a four-axis robot, a five-axis robot, a multi-axis robot, a SCARA robot, and a Delta robot, and the control system is applicable to various specific shape structures and models of the two-axis robot, the three-axis robot, the four-axis robot, the five-axis robot, the multi-axis robot, the SCARA robot, and the Delta robot.

Example eight:

the control system comprises the drive and control integrated plate, and particularly, the control system adopting the drive and control integrated plate can enable the overall structure of the system to be more compact, further provide larger design space for an execution component, reduce the overall design difficulty of equipment and facilitate the miniaturization of the equipment.

Optionally, the control system further comprises a connecting seat, a signal adapter plate, a second low-voltage power supply and a second high-voltage power supply, the number of the driving and controlling integrated plates is two, the two driving and controlling integrated plates are arranged on the connecting seat in parallel, the signal adapter plate is installed on one side, away from the connecting seat, of one of the driving and controlling integrated plates, the second low-voltage power supply is installed on one side, away from the connecting seat, of the signal adapter plate, and the second high-voltage power supply is installed on one side, away from the connecting seat, of the other driving and controlling. Specifically, the signal adapter plate is used for realizing the connection of the driving and controlling integrated plate and the signal input and output of the external equipment. Further, through driving and controlling one of them intergral template, the signal keysets, second low voltage power supply, adjacent setting in proper order to and drive and control another intergral template and adjacent setting of second high voltage power supply, can shorten one of them and drive the distance of being connected of intergral template and signal keysets on the one hand, on the other hand makes second low voltage power supply be close to one of them and drives and control intergral template, and makes second high voltage power supply be close to another and drive and control intergral template, and then can supply power to two more high-efficient reliable ground and control intergral templates.

Optionally, the drive-control integrated board adjacent to the signal adapter board is only used for realizing a control function, and can be replaced by a conventional single control board; the driving and controlling integrated plate adjacent to the second high-voltage power supply is only used for realizing a driving function and can be replaced by a conventional single driving plate.

Optionally, the control system further includes two radiators, and the radiators are located on one side of the driving and controlling integrated board away from the other driving and controlling integrated board, that is, the two radiators are located on the outer sides of the two driving and controlling integrated boards arranged in parallel. Specifically, the radiators are arranged on the outer sides of two ends of the control system and are respectively adjacent to the driving and controlling integrated plates, so that the radiating effect is improved.

The embodiment also provides a robot, which comprises the control system, specifically, the robot is a Delta robot, as shown in FIG. 14, and the control system is suitable for various specific shapes, structures and models of the Delta robot. Of course, the robot may be any one of a two-axis robot, a three-axis robot, a four-axis robot, a five-axis robot, a six-axis robot, a multi-axis robot, and a SCARA robot, and the control system is applicable to various specific shape structures and models of the two-axis robot, the three-axis robot, the four-axis robot, the five-axis robot, the six-axis robot, the multi-axis robot, and the SCARA robot.

Example nine:

Alternatively, as shown in fig. 11, the number of the driving and controlling integrated plates 100 is two or more, and all the driving and controlling integrated plates 100 are stacked and distributed at intervals along one row and are sequentially connected in cascade. Specifically, each driving and controlling integrated board 100 can control one executing component respectively, and this kind of stacked layout mode can make control system more compact, is favorable to concentrating the overall arrangement with the driving and controlling structure that all executing components correspond, and then improves the convenience of later maintenance. Specifically, all the control integrated plates 100 are stacked at intervals along one column, i.e., a distribution structure similar to "three" is formed.

Optionally, the control system further includes a connection board 500 arranged in a stacked manner with the driving and controlling integrated board 100, the connection board 500 includes a third control portion 501 and a second substrate 502, the third control portion 501 is disposed on the second substrate 502, and the driving and controlling integrated board 100 is electrically connected to the third control portion 501 after being sequentially connected in a cascade manner. Specifically, by providing the third control part 501 electrically connected to the driving and controlling integrated board 100, the overall control of all the driving and controlling integrated boards 100 can be realized, and the signal interaction between different driving and controlling integrated boards 100 can be coordinated, so that the control system can comprehensively and reliably control the execution components.

Alternatively, the connection plate 500 is disposed at one side of the whole formed by all the actuating-integrated plates 100 positioned at one of the columns, so that the connection plate 500 is connected with an external controller.

Optionally, the connection board 500 further includes a second communication module 503, the second communication module 503 is disposed on the second substrate 502, and the third control portion 501 is electrically connected to the second communication module 503. Specifically, the second communication module 503 can realize remote interaction between the third control part 501 and an external device, thereby improving the efficiency of interconnection between the control system and the external device.

Optionally, the control system further includes a connection seat 600, the connection seat 600 includes more than two first cascade sockets 601 for inserting the driving and controlling integrated board 100 and a second cascade socket 602 for inserting the connection board 500, all the first cascade sockets 601 are distributed along a row at equal intervals and are connected in series in a cascade manner, and the second cascade socket 602 is electrically connected to at least one first cascade socket 601. Specifically, have first cascade socket 601 and second cascade socket 602's connecting seat 600 through the setting, can improve the installation reliability of driving and controlling integrated board 100, connecting plate 500 on the one hand, on the other hand can conveniently drive and control integrative, connecting plate 500 and connecting seat 600's quick assembly disassembly, and then improves convenience and the flexibility that different driving and controlling integrated board 100, connecting plate 500 combined use.

Optionally, the second cascading sockets 602 are disposed on one side of the entirety formed by the first cascading sockets 601 in one of the columns so that the second cascading sockets 602 are connected to an external controller.

Optionally, the second cascading socket 602 is electrically connected to an adjacent first cascading socket 601.

Optionally, the control system further includes a temperature controller, and the temperature controller can perform high-temperature protection on the driving and controlling integrated board 100. Particularly, through setting up the temperature controller, can avoid this control system to carry out work under overheated state, and then effective life who prolongs control system.

The present embodiment also provides a robot comprising the control system described above, in particular, the robot is a SCARA robot, as shown in fig. 15, and the control system is suitable for various specific shapes, structures and models of the SCARA robot. Of course, the robot may be any one of a two-axis robot, a three-axis robot, a four-axis robot, a five-axis robot, a six-axis robot, a multi-axis robot, and a Delta robot, and the control system is applicable to various specific shape structures and models of the two-axis robot, the three-axis robot, the four-axis robot, the five-axis robot, the six-axis robot, the multi-axis robot, and the Delta robot.

Example ten:

the present embodiment differs from embodiment nine in that:

the control system further comprises a connecting seat 600, the connecting seat 600 comprises more than two first cascade sockets 601 for the driving and controlling of the integrated plate 100 in an inserted mode, all the first cascade sockets 601 are distributed along one row at equal intervals and are sequentially connected in a cascade mode or all the first cascade sockets 601 are distributed along two rows at intervals and are sequentially connected in a cascade mode, the connecting plate 500 is welded or attached to the connecting seat 600, and the connecting plate 500 is electrically connected with at least one first cascade socket 601. Specifically, the connection reliability of the connection plate 500 and the connection seat 600 can be improved by welding or attaching the connection plate 500 to the connection seat 600, and the working reliability of the entire control system is further improved.

Alternatively, the connection plate 500 is disposed at one side of the whole formed by all the first cascade sockets 601 of one of the columns so that the connection plate 500 is connected with an external controller.

Optionally, the connection plate 500 is electrically connected to the adjacent first cascading socket 601.

Example eleven:

the difference between this embodiment and the ninth embodiment is that the connection socket 600 is replaced by the following design:

the control system further includes a main substrate to which the connection plate 500 and/or the entire driving-control integrated plate 100 are welded or attached. Specifically, the driving and controlling integrated plate 100 is welded or attached to the main substrate, so that the connection reliability of the driving and controlling integrated plate 100 and the main base can be improved, and the working reliability of the whole control system can be improved.

Example twelve:

the control system comprises a control function board, a driving function board, a signal adapter board, a second low-voltage power supply and a second high-voltage power supply, wherein the control function board, the driving function board, the signal adapter board, the second low-voltage power supply and the second high-voltage power supply are connected through a daisy chain. Specifically, the daisy chain is adopted to realize the connection of devices such as the control function board, the drive function board and the like, so that the control function board, the drive function board and the like can form a high-efficiency interconnected drive and control integrated system, and the miniaturization of the control system is favorably realized. Specifically, the signal adapter board is used for realizing signal input and output connection between the control function board and the driving function board and between the control function board and the external device.

Optionally, the number of the control function board is one, the number of the driving function board is one, and the control function board, the signal adapter board, the second low-voltage power supply, the second high-voltage power supply and the driving function board are sequentially stacked. Specifically, through the structure that the above-mentioned stacks gradually, on the one hand can shorten the distance of being connected of control function board and signal keysets, and on the other hand keeps apart control function board and drive function board, reduces the mutual interference between control function board and the drive function board, and then guarantees the reliability of work separately, and on the other hand, makes the second low voltage power supply be close to the control function board to and make the second high voltage power supply be close to the drive function board, and then can supply power to control function board, drive function board more high-efficiently reliably.

Optionally, the control system further includes two heat sinks, one of the heat sinks is located on one side of the control function board away from the signal adapter board, and the other heat sink is located on one side of the driving function board away from the second high-voltage power supply. Specifically, the radiators are arranged at the outer sides of the two ends of the control system and are respectively adjacent to the control function board and the driving function board, so that the radiating effect is improved.

Optionally, the control function board and/or the driving function board adopts the driving and controlling integrated board in the first embodiment, the second embodiment, the third embodiment, the fourth embodiment and the fifth embodiment.

Example thirteen:

the present embodiment differs from embodiment nine in that:

the number of the drive and control integrated plates is more than two, and all the drive and control integrated plates are distributed along two lines at intervals in an overlapping mode and are sequentially connected in a cascade mode. Specifically, every drives and controls integrated board and can control an executive component respectively, and this kind of range upon range of layout mode can make control system compacter, is favorable to concentrating the overall arrangement with the drive and control structure that all executive components correspond, and then improves the convenience of later maintenance. Specifically, all the driving and controlling bodies are arranged at intervals along two columns in a stacking mode, namely a non-shaped distribution structure is formed.

Optionally, the control system further comprises a connecting seat, the connecting seat comprises more than two first cascade sockets for the driving and controlling of the integrated plate to be plugged and a second cascade socket for the connecting plate to be plugged, all the first cascade sockets are distributed along two rows of intervals in a stacked mode and are connected in a cascade mode in sequence, and the second cascade socket is electrically connected with at least one first cascade socket.

In the description herein, it is to be understood that the terms "upper", "lower", "left", "right", and the like are used in a descriptive sense or positional relationship based on the orientation or positional relationship shown in the drawings for convenience in description and simplicity of operation, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.

In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.

In addition, the foregoing is only the preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A drive and control integrated plate is characterized in that: the device comprises a control module, a driving module and a first substrate, wherein the control module and the driving module are arranged on the first substrate, and the control module is electrically connected with the driving module.

2. The drive and control integrated plate of claim 1, wherein: the isolation device is arranged between the driving module and the control module.

3. The drive and control integrated plate of claim 1, wherein: an isolation slot is formed in the first substrate and located between the driving module and the control module.

4. The drive and control integrated plate of claim 3, wherein: a plurality of isolation slots are arranged between the driving module and the control module;

or a plurality of partition plates are arranged in the isolation open groove.

5. The drive and control integrated plate of claim 1, wherein: the driving module is arranged close to the edge of one end of the first substrate, and the control module is arranged close to the edge of the other end of the first substrate.

6. The drive and control integrated plate of claim 1, wherein:

the control module and the driving module are arranged on the same side of the first substrate;

7. The drive and control integrated plate of claim 1, wherein: still including set up in first low voltage power supply and first high voltage power supply on the first base plate, just control module first low voltage power supply first high voltage power supply with drive module is adjacent setting in proper order, perhaps control module first low voltage power supply drive module with first high voltage power supply is adjacent setting in proper order.

8. The drive and control integrated plate of claim 7, wherein: the system also comprises an I/O interface which is electrically connected with the control module.

9. The drive and control integrated plate of claim 8, wherein: the I/O interface is arranged on one side of the control module, which is far away from the driving module; or the I/O interface is arranged on one side of the control module close to the driving module; or the I/O interface is arranged on one side of the first low-voltage power supply close to the driving module.

10. The drive and control integrated plate of claim 1, wherein: the driving module is connected with an external strong power supply.

11. The drive and control integrated plate according to any one of claims 1 to 10, wherein: the first communication module is arranged on the first substrate and electrically connected with the control module and/or the driving module.

12. The drive and control integrated plate of claim 11, wherein: the first communication module is connected with a network bus.

13. The drive and control integrated plate of claim 7, wherein: the heat dissipation module is arranged on the first substrate, one of the heat dissipation assemblies is located on one side, away from the driving module, of the control module, and the other heat dissipation assembly is located on one side, away from the control module, of the driving module.

14. The drive and control integrated plate according to any one of claims 1 to 6, wherein: the heat dissipation structure comprises a first substrate and at least one heat dissipation assembly, wherein the heat dissipation assembly is arranged on the first substrate.

15. The drive and control integrated plate of claim 14, wherein: the heat dissipation assembly comprises a heat dissipation bottom plate and a plurality of heat dissipation fins, the heat dissipation bottom plate is installed on the first base plate, and the heat dissipation fins are installed on the heat dissipation bottom plate.

16. The drive control integrated plate of claim 15, wherein: the heat dissipation bottom plate is abutted against the driving module and/or the control module.

17. The drive control integrated plate of claim 16, wherein: the heat dissipation bottom plate is connected with the control module and/or the driving module through heat conduction silica gel.

18. The drive and control integrated plate of claim 15, wherein: the heat dissipation assembly further comprises a first fan, wherein the first fan is installed on one side of the heat dissipation fins and can drive air in the heat dissipation fin area to flow.

19. The drive and control integrated plate of claim 14, wherein: the heat dissipation assembly comprises a second fan, and the second fan is arranged at the edge of the first substrate.

20. The drive and control integrated plate of claim 11, wherein: the heat dissipation structure comprises a first substrate and at least one heat dissipation assembly, wherein the heat dissipation assembly is arranged on the first substrate.

21. The drive and control integrated plate of claim 20, wherein: the heat dissipation assembly comprises a heat dissipation bottom plate and a plurality of heat dissipation fins, the heat dissipation bottom plate is installed on the first base plate, and the heat dissipation fins are installed on the heat dissipation bottom plate.

22. The drive control integrated plate of claim 21, wherein: the heat dissipation bottom plate is abutted with the driving module and/or the control module and/or the first communication module.

23. The drive control integrated plate of claim 22, wherein: the heat dissipation bottom plate is connected with the control module and/or the driving module and/or the first communication module through heat conduction silica gel.

24. The drive and control integrated plate of claim 21, wherein: the heat dissipation assembly further comprises a first fan, wherein the first fan is installed on one side of the heat dissipation fins and can drive air in the heat dissipation fin area to flow.

25. The drive and control integrated plate according to any one of claims 20 to 24, wherein: the heat dissipation assembly comprises a second fan, and the second fan is arranged at the edge of the first substrate.

26. The drive and control integrated plate according to any one of claims 1 to 10, wherein: the safety circuit module is arranged on the first substrate and electrically connected with the control module and/or the driving module.

27. The drive and control integrated plate of claim 1, wherein: the device also comprises a heat insulation piece, wherein the heat insulation piece is arranged between the driving module and the control module.

28. The drive and control integrated plate of claim 11, wherein: the driving module is attached to the first substrate, the first communication module is attached to one side, away from the first substrate, of the driving module, and the control module is attached to one side, away from the first substrate, of the first communication module.

29. The drive and control integrated plate of claim 1, wherein: the control module is attached to the first substrate, and the driving module and the control module are arranged in parallel and attached to the first substrate;

30. The integrated driving and controlling board is characterized by comprising a first substrate and a second substrate which are integrally arranged, wherein the first substrate is a control function board, the second substrate is a driving function board, and the first substrate is electrically connected with the second substrate.

31. The drive and control integrated plate of claim 30, wherein the second substrate is disposed in superimposition with the first substrate.

32. The drive and control integrated plate of claim 31, wherein the second substrate is attached to the first substrate and daisy-chained.

33. The drive control integrated plate of claim 30, further comprising an isolation device disposed between the second substrate and the first substrate.

34. The drive and control integrated plate of claim 30, wherein: still include first low voltage power supply and first high voltage power supply, just first base plate first low voltage power supply first high voltage power supply with the second base plate is adjacent setting in proper order, perhaps, first base plate first low voltage power supply second base plate with first high voltage power supply is adjacent setting in proper order.

35. The drive and control integrated plate of claim 34, wherein: the first substrate is electrically connected with the first substrate through the I/O interface.

36. The drive and control integrated plate of claim 35, wherein: the I/O interface is arranged on one side of the first substrate, which is far away from the second substrate; or the I/O interface is arranged on one side of the first substrate close to the second substrate; or the I/O interface is arranged on one side of the first low-voltage power supply close to the second substrate.

37. The drive and control integrated plate of claim 30, wherein: the second substrate is connected with an external strong power supply.

38. The drive and control integrated plate according to any one of claims 30 to 37, wherein: the communication module is electrically connected with the first substrate and/or the second substrate.

39. The drive and control integrated plate of claim 38, wherein: the communication module is connected with a network bus.

40. The drive and control integrated plate of claim 30, wherein: the heat dissipation device also comprises at least one heat dissipation assembly used for dissipating heat of the first substrate and/or the second substrate.

41. The drive and control integrated plate of claim 40, wherein: the number of the heat dissipation assemblies is two, one of the heat dissipation assemblies is located on one side, away from the second substrate, of the first substrate, and the other heat dissipation assembly is located on one side, away from the first substrate, of the second substrate.

42. The drive and control integrated plate of claim 40, wherein: the number of the heat dissipation assemblies is one, and the heat dissipation assemblies are arranged between the second substrate and the first substrate; or, the heat dissipation assembly abuts against the first substrate; or, the heat dissipation assembly abuts against the second substrate.

43. The drive and control integrated plate of claim 40, wherein: the heat dissipation assembly comprises a heat dissipation bottom plate and a plurality of heat dissipation fins, the heat dissipation bottom plate is arranged on one of the second substrate and the first substrate, the heat dissipation fins are arranged on the heat dissipation bottom plate, and the other of the second substrate and the first substrate is attached to the heat dissipation fins.

44. The drive control integrated plate of claim 43, wherein: the heat dissipation bottom plate is connected with the first substrate or the second substrate through heat conduction silica gel.

45. The drive and control integrated plate of claim 43, wherein: the heat dissipation assembly further comprises a heat dissipation fan, wherein the heat dissipation fan is installed on one side of the heat dissipation fins and can drive air in the heat dissipation fin area to flow.

46. The drive and control integrated plate of claim 30, wherein: the heat insulation piece is arranged between the second substrate and the first substrate.

47. The drive and control integrated plate of claim 30, wherein the number of the first substrates is equal to the number of the second substrates, and the first substrates are electrically connected to the second substrates in a one-to-one correspondence;

48. A control system, characterized by: comprising a control-integrated plate according to any of claims 1-47.

49. The control system of claim 48, wherein: the driving and controlling integrated board is two, and one driving and controlling integrated board is stacked in sequence.

50. The control system of claim 49, wherein: the signal adapter plate is arranged on the first high-voltage power supply, the signal adapter plate is arranged on the second high-voltage power supply, and the signal adapter plate is arranged on the first high-voltage power supply.

51. The control system of claim 48, wherein: the number of the drive and control integrated plates is more than two, all the drive and control integrated plates are distributed along one row at intervals in an overlapping mode and are sequentially connected in a cascade mode, or all the drive and control integrated plates are distributed along two rows at intervals in an overlapping mode and are sequentially connected in a cascade mode.

52. The control system of claim 51, wherein: any one of the driving and controlling integrated plates can be used as a main control plate, is used for controlling signals of all the driving and controlling integrated plates and is in signal connection with external equipment;

53. The control system of claim 51, wherein: the connecting plate is arranged on the driving and controlling integrated plate in an overlapped mode at intervals and comprises a third control part and a second substrate, the third control part is arranged on the second substrate, and the driving and controlling integrated plate is electrically connected with the third control part after being sequentially connected in a cascade mode.

54. The control system of claim 53, wherein: the connecting plate further comprises a second communication module, the second communication module is arranged on the second substrate, and the third control part is electrically connected with the second communication module.

55. The control system of claim 51, wherein: still include the connecting seat, including the confession more than two on the connecting seat drive the first cascade socket that the integrated board of accuse was pegged graft, whole first cascade socket is along a equidistant distribution and cascade connection in proper order, perhaps, whole first cascade socket is along two interval superpose distributions and cascade connection in proper order.

56. The control system of claim 53 or 54, wherein: still include the connecting seat, the connecting seat includes the confession more than two first cascade socket and a confession of driving the grafting of accuse integrated board the second cascade socket that the connecting plate was pegged graft, all first cascade socket is along a equidistant distribution and cascade connection or whole in proper order first cascade socket is along two interval superpose distributions and cascade connection in proper order, second cascade socket and at least one first cascade socket electricity is connected.

57. The control system of claim 56, wherein: the second cascading socket is electrically connected with the adjacent first cascading socket.

58. The control system of claim 53 or 54, wherein: still include the connecting seat, the connecting seat includes the confession more than two the first cascade socket that drives the grafting of accuse integrated board, whole first cascade socket is along a uniform spacing distribution and cascade connection or whole in proper order first cascade socket is along two interval superpose distributions and cascade connection in proper order, the connecting plate welding or paste adorn in the connecting seat, just the connecting plate with at least one first cascade socket electricity is connected.

59. The control system of claim 58, wherein: the connecting plate is electrically connected with the adjacent first cascade socket.

60. The control system of claim 51, wherein: the driving and controlling integrated board is welded or attached to the main substrate.

61. The control system of claim 53 or 54, wherein: the control integrated circuit board is characterized by further comprising a main substrate, and the connecting board and/or all the control integrated boards are welded or attached to the main substrate.

62. The control system of any one of claims 48 to 55, wherein: still include the temperature controller, the temperature controller can be right drive and control integrated board and carry out high temperature protection.

63. A control system, characterized by: the control function board, the drive function board, the signal adapter board, the second low voltage power supply and the second high voltage power supply are connected in a daisy chain mode.

64. The control system of claim 63, wherein: the number of control function board is one, the number of driving function board is one, just the control function board the signal keysets the second low voltage power supply the second high voltage power supply with the driving function board sets up in proper order range upon range of, perhaps, the control function board the signal keysets the second low voltage power supply the driving function board with the second high voltage power supply sets up in proper order range upon range of.

65. The control system of claim 64, wherein: the heat radiator is arranged on one side, far away from the driving function board, of the control function board, and the heat radiator is arranged on one side, far away from the control function board, of the driving function board.

66. The control system of claim 63, wherein: the control function board and/or the drive function board adopts the drive control integrated board as claimed in any one of claims 1 to 29.

67. A robot, characterized by: comprising a control system according to any of claims 48-66.