CN112533457B - Heat dissipation frame and structure for power supply power device - Google Patents
Heat dissipation frame and structure for power supply power device Download PDFInfo
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- CN112533457B CN112533457B CN202011483003.7A CN202011483003A CN112533457B CN 112533457 B CN112533457 B CN 112533457B CN 202011483003 A CN202011483003 A CN 202011483003A CN 112533457 B CN112533457 B CN 112533457B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a heat dissipation frame and a structure for a power supply power device, and belongs to the field of heat dissipation. It includes the heat dissipation case, the heat dissipation incasement be equipped with one-level heat dissipation space and second grade heat dissipation space, one-level heat dissipation space and second grade heat dissipation space between separate through separating the grade board, just one-level heat dissipation space and second grade heat dissipation space set up the opening intercommunication on separating the grade board through a plurality of, one-level heat dissipation space in be equipped with the one-level heat dissipation piece, second grade heat dissipation space in be equipped with the second grade heat dissipation piece, one-level heat dissipation space in be equipped with the rack, the rack with separate grade board sliding connection, just the rack can extend to in the second grade heat dissipation space.
Description
Technical Field
The invention belongs to the field of heat dissipation, and particularly relates to a heat dissipation frame and a structure for a power supply power device.
Background
The heat radiation structure of the power supply power device is used for effectively radiating the power supply power device and preventing the structure with overhigh temperature, mainly has the function of radiating the power supply power device by using the fan and the radiating fin, and is an indispensable structure in the existing power supply module. However, the heat dissipation structure of the conventional power device is usually only in one mode, and with the development of science and technology, the conventional power device is usually in a normal working power mode and a high power mode, and in the high power mode, the normal heat dissipation mechanism is not enough to reduce the temperature of the power device.
For example, chinese patent document discloses a heat dissipation structure of a power supply [ patent application No.: CN200710194744.1], further providing at least one heat pipe in a housing for conducting heat, wherein one end of the heat pipe can be connected to at least one heat sink contacting a heat source, and the other end can be inserted into the plurality of heat dissipating fins of at least one heat dissipating fin set, and the remaining outer wall of the heat pipe can directly or indirectly contact the inner wall of the housing. Therefore, the heat generated by the heat source can be quickly conducted to the shell and the heat dissipation fins through the heat dissipation seat by the heat pipe, so as to be dissipated in an external medium. However, the existing power supply device often has a normal working power and a high power mode, and in the high power mode, the heat dissipation mechanism is not enough to reduce the temperature of the power supply device.
Disclosure of Invention
The present invention is directed to the above problems, and provides a heat dissipation frame and structure for a power device.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a heat dissipation frame and structure for power supply unit, includes the heat dissipation case, the heat dissipation incasement be equipped with one-level heat dissipation space and second grade heat dissipation space, one-level heat dissipation space and second grade heat dissipation space between separate through separating the shelves board and separate, just one-level heat dissipation space and second grade heat dissipation space through the circulation hole intercommunication of a plurality of setting on separating the shelves board, one-level heat dissipation space in be equipped with the one-level heat dissipation piece, second grade heat dissipation space in be equipped with the second grade heat dissipation piece, one-level heat dissipation space in be equipped with the rack, the rack is used for placing power supply unit, rack and separate shelves board sliding connection, just the rack can extend to second grade heat dissipation space in, make power supply unit is close to the second grade heat dissipation piece.
In the heat dissipation frame and the structure for the power supply power device, the first-stage heat dissipation member is a heat conduction sheet, the four sides of the placement frame are respectively provided with a plurality of heat conduction sheets, one end of each heat conduction sheet is fixedly arranged on the inner wall of the first-stage heat dissipation space, the other end of each heat conduction sheet is fixedly arranged on the baffle, and the placement frame is surrounded by the plurality of heat conduction sheets on the four sides of the placement frame.
In the above heat dissipation frame and structure for a power supply device, the second-stage heat dissipation member is a heat pipe, when the rack extends into the second-stage heat dissipation space, a plurality of heat pipes are arranged on four sides of the rack, each heat pipe corresponds to two heat conduction fins, one end of each heat pipe is fixedly arranged in the second-stage heat dissipation space, and the other end of each heat pipe is fixed on the baffle plate and connected with the corresponding two heat conduction fins.
In the heat dissipation frame and the structure for the power supply power device, the heat conduction pipes are internally provided with the cooling pipes, and the cooling pipes in the heat conduction pipes on each side of the placing rack are sequentially connected end to end and connected with the external circulation mechanism.
In the above-mentioned heat dissipation frame and structure for power supply power device, external circulation mechanism include two circulation casees that set up on the heat dissipation case, a plurality of heat pipe cooling pipe of each side of rack in proper order end to end form the side pipe, the side pipe of rack wherein one side be connected with one of them adjacent side pipe and form the circulating pipe, and two other side pipes also form a circulating pipe, the both ends of two circulating pipes link to each other with two circulation casees respectively.
In the heat dissipation frame and the structure for the power supply power device, each circulation box is arranged in a hollow manner, a coiled pipe is arranged in each circulation box, and two ends of the coiled pipe are respectively connected with the two circulation pipes.
In the above heat dissipation frame and structure for a power supply power device, the top of the primary heat dissipation space is provided with a plurality of air inlets, the top of the secondary heat dissipation space is provided with a plurality of air outlets, the circulation hole is located at the bottom of the baffle plate, the primary heat dissipation member is located between the air inlets and the circulation hole, the secondary heat dissipation member is located between the air outlets and the circulation hole, and each circulation hole is internally provided with a fan.
In the heat dissipation frame and the structure for the power supply power device, each air inlet is connected with a replacement cylinder in a threaded manner, the replacement cylinder is arranged in a hollow manner, a plurality of layers of filter screens are arranged in the replacement cylinder, and the diameters of filter holes of the plurality of layers of filter screens are gradually reduced from the top to the bottom.
In foretell heat dissipation frame and structure for power device, the top of each venthole has the ash blocking that sets firmly on the heat dissipation case and colludes, the top that the ash blocking colluded be the arc form, and the ash blocking colludes the exit that forms with the heat dissipation case and has the ash blocking arc surface that sets up on the heat dissipation case.
In the heat dissipation frame and the structure for the power supply power device, the baffle plate is internally provided with an extension cavity matched with the placing frame, two sides of the extension cavity are respectively provided with a clamping groove, and two sides of the placing frame are respectively provided with a clamping rod in sliding connection with the clamping grooves.
Compared with the prior art, the invention has the advantages that:
1. the invention has two heat dissipation modes, wherein the primary mode is a common mode, the secondary mode is a rapid heat dissipation mode or a high-power mode, and the heat dissipation mode can be switched between the primary mode and the secondary mode, so that the energy consumption can be reduced in the primary mode, the heat dissipation speed can be increased in the secondary mode, and the heat dissipation efficiency can be improved. Has the advantage of multi-mode high efficiency.
2. The heat conducting fin is communicated with the heat conducting pipe, part of heat absorbed by the heat conducting fin is absorbed by air flowing in the primary heat radiating space, the other part of heat is transferred to the heat conducting pipe, and the air flowing in the secondary heat radiating space can absorb the heat on the heat conducting pipe and flows out of the heat radiating box, so that the heat radiating efficiency is improved.
3. The cooling oil or water is filled in the cooling pipes, the external circulating mechanism enables the water or oil to continuously flow in the plurality of cooling pipes, the flow of the cooling water or oil can absorb more heat, and the heat dissipation efficiency is improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic cross-sectional view A-A of FIG. 1;
FIG. 3 is a schematic cross-sectional view of B-B of FIG. 1;
fig. 4 is a schematic cross-sectional view of C-C in fig. 1.
In the figure: the heat dissipation device comprises a heat dissipation box 10, a primary heat dissipation space 11, a secondary heat dissipation space 12, a baffle plate 13, a circulation hole 14, a placing frame 15, a heat conduction sheet 16, a heat conduction pipe 17, a cooling pipe 18, a circulation box 19, an air inlet hole 20, an air outlet hole 21, a fan 22, a replacement cylinder 23, a filter screen 24, an ash blocking hook 25, an ash blocking arc surface 26, an extension cavity 27, a clamping groove 28 and a clamping rod 29.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in the combination of figures 1-4, a heat dissipation frame and structure for power supply power device, including heat dissipation case 10, heat dissipation case 10 in be equipped with one-level heat dissipation space 11 and second grade heat dissipation space 12, one-level heat dissipation space 11 and second grade heat dissipation space 12 between separate through separating the plate washer 13, just one-level heat dissipation space 11 and second grade heat dissipation space 12 set up the opening 14 intercommunication on separating the plate washer 13 through a plurality of, one-level heat dissipation space 11 in be equipped with one-level heat dissipation piece, second grade heat dissipation space 12 in be equipped with second grade heat dissipation piece, one-level heat dissipation space 11 in be equipped with rack 15, rack 15 with separate plate washer 13 sliding connection, just rack 15 can extend to second grade heat dissipation space 12 in.
In this embodiment, the heat dissipation mode is divided into a primary mode and a secondary mode, the primary mode is a normal mode, and the secondary mode is a fast heat dissipation mode or a high power mode. The placing frame 15 is used for placing a power supply power device, the power supply power device is located in the first-stage heat dissipation space 11 in the first-stage mode, heat generated by the work of the power supply power device is absorbed by the first-stage heat dissipation part, air flows in the first-stage heat dissipation space 11, and the temperature of the first-stage heat dissipation part is reduced through heat exchange so as to dissipate heat. The radiating effect of second grade radiating piece is better than the one-level radiating piece, when power device high power during operation or power device temperature were higher, extends rack 15 into second grade heat dissipation space 12 in, makes power device be close to the second grade radiating piece, and the heat that power device work produced is absorbed by the second grade radiating piece, and the air flows in second grade heat dissipation space 12, thereby makes the one-level radiating piece reduce temperature through the heat exchange and dispels the heat.
The first-stage heat dissipation member is a heat conduction sheet 16, a plurality of heat conduction sheets 16 are arranged on four sides of the placement frame 15, one end of each heat conduction sheet 16 is fixedly arranged on the inner wall of the first-stage heat dissipation space 11, the other end of each heat conduction sheet is fixedly arranged on the baffle 13, and the placement frame 15 is surrounded by the heat conduction sheets 16 on the four sides of the placement frame 15.
In this embodiment, the material of conducting strip 16 is the better metal material of heat conductivility, like copper etc. including a plurality of conducting strip 16 surrounds rack 15, including a plurality of conducting strip 16 surrounds source power device promptly, according to the heat radiation, can make more heats timely by the conducting strip 16 absorption to in-process that the air flows is taken away by the air fast.
The second-stage heat dissipation member is a heat pipe 17, when the rack 15 extends into the second-stage heat dissipation space 12, a plurality of heat pipes 17 are disposed on four sides of the rack 15, each heat pipe 17 corresponds to two heat conduction fins 16, one end of each heat pipe 17 is fixedly disposed in the second-stage heat dissipation space 12, and the other end of each heat pipe 17 is fixed to the baffle 13 and connected to the corresponding two heat conduction fins 16.
In this embodiment, the material of the heat pipes 17 is the same as that of the heat conducting fins 16, but the areas of the outer surfaces of the heat pipes 17 are much larger than the areas of the heat conducting fins 16, so that the efficiency of the heat pipes 17 for absorbing heat is much larger than the efficiency of the heat conducting fins 16 for absorbing heat. In addition, the heat conducting fins 16 are communicated with the heat conducting pipes 17, and the air flows in the first-stage heat dissipation space 11 from the outside, then flows to the second-stage heat dissipation space 12, and finally flows out of the heat dissipation box 10, when the power supply device works in the first-stage heat dissipation space 10, the heat conducting fins 16 absorb heat, a part of the heat is absorbed by the air flowing in the first-stage heat dissipation space 11, the other part of the heat is transferred to the heat conducting pipes 17, when the air flows from the first-stage heat dissipation space 11 to the second-stage heat dissipation space 12, the air flowing in the second-stage heat dissipation space 12 can absorb the heat on the heat conducting pipes 17 and flows out of the heat dissipation box 10, and therefore the heat dissipation efficiency is improved.
The heat conduction pipes 17 are internally provided with cooling pipes 18, and the cooling pipes 18 in the plurality of heat conduction pipes 17 at each side of the placing frame 15 are sequentially connected end to end and connected with an external circulation mechanism.
In this embodiment, when the power device operates at a high power or the temperature of the power device is high, in order to further improve the heat dissipation efficiency and protect the power source, when the power device extends into the secondary heat dissipation space 12, the cooling oil or water is introduced into the cooling pipes 18, the external circulation mechanism enables the water or oil to continuously flow in the plurality of cooling pipes 18, and the flow of the cooling water or oil can absorb more heat, thereby improving the heat dissipation efficiency.
The external circulation mechanism comprises two circulation boxes 19 arranged on the heat dissipation box 10, the cooling pipes 18 in the plurality of heat conduction pipes 17 on each side of the placing frame 15 are sequentially connected end to form side pipes, the side pipe on one side of the placing frame 15 is connected with one adjacent side pipe to form a circulation pipe, the other two side pipes also form a circulation pipe, and two ends of the two circulation pipes are respectively connected with the two circulation boxes 19.
The cooling mode of the conventional cooling pipe usually has only one water tank, when the cooling water moves to the second half, because the absorbed heat approaches to the saturated state, the effect of the second half water absorbing heat is not very good, and the heat dissipation efficiency is reduced, and in this embodiment, unlike the conventional one, the cooling pipe has two circulation systems, the route is short, the absorbed heat is not enough to saturate the heat of water or oil, so the efficiency of the water or oil absorbing heat through each part of the cooling pipe 18 is almost, and the heat dissipation efficiency is improved.
Each circulation box 19 is arranged in a hollow mode, a coiled pipe is arranged in each circulation box 19, two ends of each coiled pipe are connected with the two circulation pipes respectively, and two ends of each coiled pipe are provided with a water pump respectively.
In this embodiment, when water or oil moves out of the circulation pipe and enters the coil, the heat exchange between the coil and the air is increased due to the hollow arrangement of the circulation tank 19, so that the water or oil is cooled again when it enters the next circulation pipe, and heat absorption can be performed.
The top of the first-stage heat dissipation space 11 is provided with a plurality of air inlet holes 20, the top of the second-stage heat dissipation space 12 is provided with a plurality of air outlet holes 21, the circulation hole 14 is positioned at the bottom of the baffle plate 13, the first-stage heat dissipation member is positioned between the air inlet holes 20 and the circulation hole 14, the second-stage heat dissipation member is positioned between the air outlet holes 21 and the circulation hole 14, and a fan 22 is arranged in each circulation hole 14.
In this embodiment, the air flows in the heat dissipation box 10 in a direction from the air inlet 20 into the primary heat dissipation space 11, flows through the heat conduction fins 16, then flows through the flow holes 14 into the secondary heat dissipation space 12, then flows through the heat conduction pipes 17, and finally flows out from the air outlet 21. Furthermore, a power supply is connected to the fan 22, and the rotation of the fan 22 further causes air to flow through the flow path, thereby preventing the air from flowing in a disturbed direction and improving the heat dissipation efficiency.
Each air inlet 20 is screwed with a replacing cylinder 23, the replacing cylinder 23 is arranged in a hollow way, a plurality of layers of filter screens 24 are arranged in the replacing cylinder 23, and the diameters of the filter holes of the plurality of layers of filter screens 24 are gradually reduced from the top to the bottom.
In the present embodiment, air enters through the air inlet hole 20, and the filter net 24 can discharge dust and foreign particles out due to the dust or foreign particles contained in the air, thereby preventing the dust and foreign particles from being accumulated in the heat dissipation case 10. The diameters of the filter holes of the filter screens 24 are gradually reduced from the top to the bottom, so that dust and particles can be blocked outside layer by layer, and the dust and the impurity particles are further isolated. In addition, because the replacement cylinder 23 is in threaded connection with the air inlet hole 20, after more dust is accumulated on the filter screen 24, the replacement cylinder can be screwed out and taken down for cleaning, and the situation that air cannot enter due to the fact that a channel is blocked is prevented.
The top of each air outlet 21 is provided with a dust blocking hook 25 fixedly arranged on the heat dissipation box 10, the top of each dust blocking hook 25 is arc-shaped, and an outlet formed by the dust blocking hook 25 and the heat dissipation box 10 is provided with a dust blocking arc surface 26 arranged on the heat dissipation box 10.
In this embodiment, the dust hook 25 covers the air outlet 21, so as to effectively prevent dust from entering the air outlet 21, and the dust hook 25 and the dust blocking arc surface 26 at the outlet formed by the heat dissipation box 10 can further prevent dust from entering the air outlet 21.
The baffle plate 13 is internally provided with an extension cavity 27 matched with the placing frame 15, two sides of the extension cavity 27 are respectively provided with a clamping groove 28, and two sides of the placing frame 15 are respectively provided with a clamping rod 29 in sliding connection with the clamping grooves 28.
In this embodiment, the catch 29 slides within the catch slot 28 for supporting and stabilizing the rack 15.
The working principle of the invention is as follows: the air flows in the heat dissipation box 10 in the direction of entering the primary heat dissipation space 11 from the air inlet 20, flowing through the heat conduction fins 16, entering the secondary heat dissipation space 12 through the circulation holes 14, flowing through the heat conduction pipes 17, and finally flowing out from the air outlet 21. When the power device works in the normal mode, the placing frame 15 is located in the primary heat dissipation space 11, when the power device works in the primary heat dissipation space 10, the heat conducting fins 16 absorb heat, a part of the heat is absorbed by air flowing in the primary heat dissipation space 11, the other part of the heat is transferred to the heat conducting pipes 17, and when the air flows from the primary heat dissipation space 11 to the secondary heat dissipation space 12, the air flowing in the secondary heat dissipation space 12 can absorb the heat on the heat conducting pipes 17 and flow out of the heat dissipation box 10. However, when the power supply power device works at a high power or the temperature of the power supply power device is too high, the placing frame 15 extends into the secondary heat dissipation space 12, so that the power supply power device is close to the heat conduction pipe 17, cooling oil or water is introduced into the cooling pipes 18, the external circulation mechanism enables the water or the oil to continuously flow in the plurality of cooling pipes 18, and the flow of the cooling water or the oil can absorb more heat.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments, or alternatives may be employed, by those skilled in the art, without departing from the spirit or ambit of the invention as defined in the appended claims.
Although the heat dissipation box 10, the primary heat dissipation space 11, the secondary heat dissipation space 12, the baffle plate 13, the circulation hole 14, the placing frame 15, the heat conduction fins 16, the heat conduction pipes 17, the cooling pipes 18, the circulation box 19, the air inlet holes 20, the air outlet holes 21, the fan 22, the replacement cylinder 23, the filter screen 24, the dust blocking hooks 25, the dust blocking arc surfaces 26, the extension cavities 27, the clamping grooves 28, the clamping rods 29, etc., are used more frequently herein, these terms are used only for the purpose of more conveniently describing and explaining the essence of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.
Claims (10)
1. A heat dissipation frame and structure for a power supply device comprises a heat dissipation box (10) and is characterized in that a first-stage heat dissipation space (11) and a second-stage heat dissipation space (12) are arranged in the heat dissipation box (10), the first-stage heat dissipation space (11) and the second-stage heat dissipation space (12) are separated by a baffle plate (13), the first-stage heat dissipation space (11) and the second-stage heat dissipation space (12) are communicated through a plurality of circulation holes (14) formed in the baffle plate (13), a first-stage heat dissipation part is arranged in the first-stage heat dissipation space (11), a second-stage heat dissipation part is arranged in the second-stage heat dissipation space (12), a placing frame (15) is arranged in the first-stage heat dissipation space (11), the placing frame (15) is used for placing the power supply device, the placing frame (15) is in sliding connection with the baffle plate (13), and the placing frame (15) can extend into the second-stage heat dissipation space (12), and enabling the power supply power device to be close to the secondary heat dissipation element.
2. The heat dissipation frame and structure for power supply power devices as claimed in claim 1, wherein the primary heat dissipation member is a heat conducting fin (16), the plurality of heat conducting fins (16) are disposed on four sides of the placement frame (15), one end of each heat conducting fin (16) is fixedly disposed on the inner wall of the primary heat dissipation space (11), the other end of each heat conducting fin is fixedly disposed on the baffle (13), and the placement frame (15) is surrounded by the plurality of heat conducting fins (16) disposed on the four sides of the placement frame (15).
3. The heat dissipation frame and structure for power devices according to claim 2, wherein the secondary heat dissipation member is a heat pipe (17), when the rack (15) extends into the secondary heat dissipation space (12), four sides of the rack (15) are provided with a plurality of heat pipes (17), each heat pipe (17) corresponds to two heat conduction fins (16), one end of each heat pipe (17) is fixed in the secondary heat dissipation space (12), and the other end of each heat pipe (17) is fixed on the baffle (13) and connected to the two corresponding heat conduction fins (16).
4. A heat dissipation frame and structure for power supply power devices according to claim 3, characterized in that the heat conduction pipes (17) are provided with cooling pipes (18), and the cooling pipes (18) in the plurality of heat conduction pipes (17) on each side of the placing rack (15) are sequentially connected end to end and connected with an external circulation mechanism.
5. The heat dissipation frame and structure for power supply power devices according to claim 4, wherein the external circulation mechanism comprises two circulation boxes (19) disposed on the heat dissipation box (10), the cooling pipes (18) in the plurality of heat conduction pipes (17) on each side of the placement frame (15) are sequentially connected end to form side pipes, the side pipe on one side of the placement frame (15) is connected with one of the adjacent side pipes to form a circulation pipe, the other two side pipes also form a circulation pipe, and two ends of the two circulation pipes are respectively connected with the two circulation boxes (19).
6. The heat dissipation frame and structure for power supply and power device as claimed in claim 5, wherein each circulation box (19) is hollow, and a coiled pipe is arranged in each circulation box (19), and two ends of the coiled pipe are respectively connected with two circulation pipes.
7. The heat dissipation frame and structure for power supply and power device as claimed in any one of claims 1-6, wherein the top of the primary heat dissipation space (11) is provided with a plurality of air inlet holes (20), the top of the secondary heat dissipation space (12) is provided with a plurality of air outlet holes (21), the flow holes (14) are located at the bottom of the baffle plate (13), the primary heat dissipation member is located between the air inlet holes (20) and the flow holes (14), the secondary heat dissipation member is located between the air outlet holes (21) and the flow holes (14), and each flow hole (14) is provided with a fan (22).
8. The heat dissipation frame and structure for power supply power devices as claimed in claim 7, wherein each air inlet (20) is screwed with a replacement cylinder (23), the replacement cylinder (23) is hollow, and a plurality of layers of filter screens (24) are arranged in the replacement cylinder (23), and the diameters of the filter holes of the plurality of layers of filter screens (24) gradually decrease from top to bottom.
9. The heat dissipation frame and structure for power devices of claim 7, wherein the top of each air outlet (21) has a dust-blocking hook (25) fixed on the heat dissipation box (10), the top of the dust-blocking hook (25) is arc-shaped, and the outlet formed by the dust-blocking hook (25) and the heat dissipation box (10) has a dust-blocking arc surface (26) arranged on the heat dissipation box (10).
10. The heat dissipation frame and structure for power supply power devices according to claim 1, wherein an extension cavity (27) adapted to the placement frame (15) is provided in the partition plate (13), two sides of the extension cavity (27) are respectively provided with a clamping groove (28), and two sides of the placement frame (15) are respectively provided with a clamping rod (29) slidably connected with the clamping groove (28).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011483003.7A CN112533457B (en) | 2020-12-15 | 2020-12-15 | Heat dissipation frame and structure for power supply power device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011483003.7A CN112533457B (en) | 2020-12-15 | 2020-12-15 | Heat dissipation frame and structure for power supply power device |
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| CN112533457A CN112533457A (en) | 2021-03-19 |
| CN112533457B true CN112533457B (en) | 2022-06-14 |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002033591A (en) * | 2000-07-18 | 2002-01-31 | Fujitsu Denso Ltd | Fixing structure for electronic component |
| CN107769044A (en) * | 2017-11-30 | 2018-03-06 | 苏州汇恒网络科技有限公司 | It is a kind of that there is the safety-protection system power equipment for being moved easily function |
| CN208386829U (en) * | 2018-05-14 | 2019-01-15 | 天津宏讯达通信技术有限公司 | A kind of rack for communication transmission equipment |
| CN210926123U (en) * | 2019-12-30 | 2020-07-03 | 福建中维动力科技股份有限公司 | Heat dissipation box |
| CN211015379U (en) * | 2020-02-19 | 2020-07-14 | 邢台职业技术学院 | Computer water-cooling heat abstractor |
| CN211127605U (en) * | 2020-02-27 | 2020-07-28 | 贾静 | Photovoltaic inverter with good heat dissipation performance |
| CN111479413A (en) * | 2020-03-25 | 2020-07-31 | 合肥森众科技有限公司 | Automatic change switch board |
| CN211531125U (en) * | 2020-03-30 | 2020-09-18 | 东莞洲煌塑胶五金制品有限公司 | Mobile phone upper cover heat radiation structure |
-
2020
- 2020-12-15 CN CN202011483003.7A patent/CN112533457B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002033591A (en) * | 2000-07-18 | 2002-01-31 | Fujitsu Denso Ltd | Fixing structure for electronic component |
| CN107769044A (en) * | 2017-11-30 | 2018-03-06 | 苏州汇恒网络科技有限公司 | It is a kind of that there is the safety-protection system power equipment for being moved easily function |
| CN208386829U (en) * | 2018-05-14 | 2019-01-15 | 天津宏讯达通信技术有限公司 | A kind of rack for communication transmission equipment |
| CN210926123U (en) * | 2019-12-30 | 2020-07-03 | 福建中维动力科技股份有限公司 | Heat dissipation box |
| CN211015379U (en) * | 2020-02-19 | 2020-07-14 | 邢台职业技术学院 | Computer water-cooling heat abstractor |
| CN211127605U (en) * | 2020-02-27 | 2020-07-28 | 贾静 | Photovoltaic inverter with good heat dissipation performance |
| CN111479413A (en) * | 2020-03-25 | 2020-07-31 | 合肥森众科技有限公司 | Automatic change switch board |
| CN211531125U (en) * | 2020-03-30 | 2020-09-18 | 东莞洲煌塑胶五金制品有限公司 | Mobile phone upper cover heat radiation structure |
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| CN112533457A (en) | 2021-03-19 |
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