CN218413409U

CN218413409U - Radiating assembly and solid-state storage board card

Info

Publication number: CN218413409U
Application number: CN202222634615.2U
Authority: CN
Inventors: 胡斌; 李礼; 张道迎; 王文波; 刘军; 付博; 戴华
Original assignee: Shanghai Wigurt Flash Information Technology Co ltd
Current assignee: Shanghai Wigurt Flash Information Technology Co ltd
Priority date: 2022-10-08
Filing date: 2022-10-08
Publication date: 2023-01-31
Anticipated expiration: 2032-10-08

Abstract

The utility model belongs to the field of storage devices, in particular to a heat dissipation component and a solid-state storage board card, which comprises a supporting mechanism for installation and an air guide mechanism for heat dissipation; the supporting mechanism comprises symmetrically arranged supports, each support is of a Z-shaped structure, an upper convex plate of each support is connected to a shell of the solid-state storage board card, a lower convex plate of each support is connected to a main board body, a through limiting groove is formed in the middle of each support, and a cross frame is clamped in the two limiting grooves; the mode that the supporting mechanism combination set up makes things convenient for each part cooperation, and unilateral installation prevents that its interface end that hinders solid-state storage integrated circuit board from being connected with external equipment, and the supporting mechanism of unilateral setting can carry out the unilateral transmission of the wind of dispelling the heat after supplementary heat dissipation platform installation, prevents that bilateral transmission wind from causing the heat dissipation of convection current hindrance plate body. The air guide mechanism is arranged in the air distribution table, the tail end of the air supply pipe is provided with the bent pipe, the output heat dissipation air directly acts on the surface of the plate body, the surface of the plate body is continuously swept and dissipated, and the heat dissipation efficiency of the plate body is improved.

Description

Radiating assembly and solid-state storage board card

Technical Field

The utility model relates to a storage device field, concretely relates to radiator unit and solid-state storage integrated circuit board.

Background

The solid-state storage board card is a highly integrated product, the SCSSD adopts an SIP (System In Package) BGA packaging technology, and the SCSSD has the characteristics of small product outline size and large storage capacity.

The prior art has the following problems:

1. the solid-state storage board card has high integration level, a built-in heat dissipation structure is abandoned to increase the installation space of storage particles in order to improve the storage performance, so that the temperature of the board is high in a long-time running state, the read-write performance is reduced, even the storage particles are damaged, a heat dissipation assembly assisting the board body to cool is absent, and the conventional heat dissipation structure has the problems of large occupied space and inconvenient installation;

2. and conventional radiating component mostly seals the heat dissipation, can occupy its some interface space, influences its external device of connecting.

SUMMERY OF THE UTILITY MODEL

Objects of the invention

For solving the technical problem who exists among the background art, the utility model provides a radiator unit and solid-state storage integrated circuit board has the radiator unit combination and sets up the characteristics that make things convenient for the dismouting fixed and wind-guiding mechanism to make things convenient for the wind to switch on for the heat dissipation.

(II) technical scheme

In order to solve the technical problem, the utility model provides a heat dissipation assembly, which comprises a supporting mechanism for installation and an air guide mechanism for heat dissipation;

the supporting mechanism comprises symmetrically arranged supports, each support is of a Z-shaped structure, an upper convex plate of each support is connected to a shell of the solid-state storage board card, a lower convex plate of each support is connected to a main board body, the middle of each support is provided with a through limiting groove, a cross frame is clamped in the two limiting grooves, and a bracket provided with a clamping groove is arranged at the bottom of each cross frame;

a heat dissipation table with a cavity arranged inside is clamped and installed between the bracket and the transverse frame;

the air guide mechanism comprises an air distribution table arranged at the bottom end inside the heat dissipation table, one end of the air distribution table is provided with an air inlet pipe penetrating through the outer wall of the heat dissipation table, and the other end of the air inlet pipe is provided with a fan switching end seat connected with an external heat dissipation fan;

hollow air supply pipes are installed at the top of the air distribution table at intervals, and air outlet ports, penetrating through the outer portion of the heat dissipation table, of the air supply pipes are inclined to the surface of the solid storage board card.

Preferably, a gasket is arranged below the upper convex plate of the support, bolt holes matched with the bolt pieces are formed in the middle parts of the gasket and the upper convex plate, and bolt holes matched with the bolt pieces are formed in the middle part of the lower convex plate of the support.

Preferably, bolt holes matched with bolt pieces are formed in attachment points of the limiting grooves and the cross frames of the support.

Preferably, the air inlet pipe, the air distribution table and the air supply pipe are connected into a whole to form an air guide passage.

Preferably, filter materials are placed in an inner cavity of the air distribution table, and air gaps for gas transmission are reserved among the filter materials.

Preferably, the lower part of the blast pipe is provided with heat dissipation fin fins arranged on the heat dissipation platform, the heat dissipation fin fins are parallel to the solid storage board card, and air holes are arranged in the guide grooves at intervals.

The utility model provides a solid-state storage integrated circuit board, including above-mentioned radiator unit.

The above technical scheme of the utility model has following profitable technological effect:

1. the mode that the supporting mechanism combination set up makes things convenient for each part cooperation, and unilateral installation prevents that its interface end that hinders solid-state storage integrated circuit board from being connected with external equipment, and the supporting mechanism of unilateral setting can carry out the unilateral transmission of the wind of dispelling the heat after supplementary heat dissipation platform installation, prevents that bilateral transmission wind from causing the heat dissipation of convection current hindrance plate body.

2. The air guide mechanism is arranged in the air distribution table, the tail end of the air supply pipe is provided with the bent pipe, the output heat dissipation air directly acts on the surface of the plate body, and elements such as storage particles on the surface of the plate body are continuously swept and dissipated, so that the heat dissipation efficiency of the plate body is improved.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic side view of the present invention;

FIG. 3 is a schematic sectional view of the present invention;

fig. 4 is a schematic view of the structure of the present invention.

Reference numerals:

11. a support; 12. a limiting groove; 13. a cross frame; 14. a bracket; 15. a gasket; 2. a heat dissipation table; 31. a fan adapter; 32. an air inlet pipe; 33. a wind distribution table; 34. an air supply pipe; 4. heat dissipation fins; 41. and (4) air holes.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.

As shown in fig. 1-4, the present invention provides a heat dissipation assembly, which includes a supporting mechanism for installation and an air guiding mechanism for heat dissipation;

the supporting mechanism comprises symmetrically arranged supports 11, the supports 11 are of a Z-shaped structure, an upper convex plate of each support is connected to a shell of the solid-state storage board card, a lower convex plate of each support is connected to a main board body, the middle of each support 11 is provided with a through limiting groove 12, cross frames 13 are clamped in the two limiting grooves 12, and brackets 14 provided with clamping grooves are mounted at the bottoms of the cross frames 13;

a heat radiation table 2 with a cavity arranged inside is clamped and installed between the bracket 14 and the cross frame 13.

The first embodiment,

As an example of mounting the support mechanism to the solid-state storage card housing:

1. a gasket 15 is arranged below the upper convex plate of the bracket 11, bolt holes matched with bolt pieces are formed in the attached middle parts of the gasket 15 and the upper convex plate, and bolt holes matched with the bolt pieces are formed in the middle part of the lower convex plate of the bracket 11; the gasket 15 is placed at the corner of the shell of the solid-state storage board card, the vertical plate of the support 11 is attached to the outer wall of the shell, the gasket 15 is pressed downwards by the upper convex plate, the upper part of the gasket is positioned by the bolt hole for screwing the bolt piece into the upper part of the gasket, and then the gasket is secondarily fixed at the position where the lower convex plate is attached to the main board by the bolt hole for screwing the bolt piece into the lower convex plate;

2. drawing the cross frame 13 to pass through the limiting grooves 12 at the vertical plates of the two supports 11, and hanging the cross frame 13 outside the supports 11;

3. because the bolt hole that the cooperation bolt piece was seted up to the attached point position of spacing groove 12 of support 11 and crossbearer 13, carry out the reinforcement of crossbearer 13 and the attached position of support 11 through the bolt piece, realize the stable installation of crossbearer 13 in the solid-state storage integrated circuit board casing outside.

It can be understood that supporting mechanism is unilateral installation, prevents that its interface end that hinders the solid-state storage integrated circuit board from being connected with external equipment, and the unilateral transmission of heat dissipation usefulness wind can be carried out to the supporting mechanism of unilateral setting at supplementary heat dissipation platform 2 installation backs, prevents that bilateral transmission usefulness wind from causing the heat dissipation of convection current hindrance plate body.

In the second embodiment, as shown in fig. 2-4, the air guiding mechanism includes an air distribution table 33 disposed at the bottom end inside the heat dissipation table 2, one end of the air distribution table 33 is installed with an air inlet pipe 32 penetrating through the outer wall of the heat dissipation table 2, and the other end of the air inlet pipe 32 is installed with a fan adapter 31 connected to an external heat dissipation fan;

hollow blast pipes 34 are installed at intervals on the top of the air distribution table 33, and the air outlet ports of the blast pipes 34 penetrating through the outside of the heat dissipation table 2 are inclined to the surface of the solid storage board card.

It should be noted that: the air inlet pipe 32, the air distribution table 33 and the air supply pipe 34 are connected into a whole to form an air guide passage, the air inlet pipe 32 is connected with an air outlet of the heat radiation fan through the fan switching end seat 31, and the air for heat radiation output by the heat radiation fan is conveyed into the air distribution table 33 along the air inlet pipe 32.

As an example of heat dissipation: air supply pipes 34 are arranged on the air distribution table 33 at intervals, the tail ends of the air supply pipes 34 are bent pipes, the output heat dissipation air directly acts on the surface of the plate body, elements such as storage particles on the surface of the plate body are continuously swept and dissipated, and the heat dissipation efficiency of the plate body is improved.

In an optional embodiment, filter materials are placed in the inner cavity of the air distribution table 33, air gaps for gas transmission are reserved among the filter materials, air for heat dissipation is filtered to remove impurities mixed in the air before heat dissipation, the air blown to the surface of the plate body is kept clean, and pollution to the surface of the plate body caused by heat dissipation is prevented.

In an alternative embodiment, a heat dissipation fin 4 mounted on the heat dissipation table 2 is arranged below the air supply pipe 34, the heat dissipation fin 4 is parallel to the solid storage board card, and air holes 41 are arranged in the guide groove at intervals.

The difference lies in that a heat dissipation structure is added, a large amount of heat dissipation fin fins 4 contact the plate body on the outer surface to conduct heat conduction and cool down, and the heat dissipation air sent out by the air supply pipe 34 flows along the guide groove in advance to cool down the heat dissipation fin fins 4, and then acts on the plate body through the air holes 41 to conduct air cooling and cool down, so that the cooling mode is improved.

What needs to be supplemented is: the heat dissipation fins 4 are detachably mounted on the heat dissipation table 2 and are fixed by adopting a matched insertion structure, and the guide grooves are required to be positioned under the air supply pipe 34, so that the heat dissipation air transmitted by the air supply pipe 34 can directly act in the guide grooves.

It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modifications, equivalents, improvements and the like which are made without departing from the spirit and scope of the present invention should be considered within the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.

Claims

1. A heat radiation component is characterized by comprising a supporting mechanism for mounting and an air guide mechanism for radiating heat;

the supporting mechanism comprises symmetrically arranged supports (11), the supports (11) are of a Z-shaped structure, an upper convex plate of each support is connected to a shell of the solid-state storage board card, a lower convex plate of each support is connected to a main board body, the middle of each support (11) is provided with a through limiting groove (12), a cross frame (13) is clamped in the two limiting grooves (12), and a bracket (14) provided with a clamping groove is installed at the bottom of each cross frame (13);

a heat dissipation table (2) with a cavity arranged inside is clamped and installed between the bracket (14) and the transverse frame (13);

the air guide mechanism comprises an air distribution table (33) arranged at the bottom end in the radiating table (2), one end of the air distribution table (33) is provided with an air inlet pipe (32) penetrating through the outer wall of the radiating table (2), and the other end of the air inlet pipe (32) is provided with a fan switching end seat (31) connected with an external radiating fan;

hollow blast pipes (34) are installed at the top of the air distribution table (33) at intervals, and the blast pipes (34) penetrate through an air outlet port outside the heat dissipation table (2) and are inclined to the surface of the solid storage board card.

2. The heat dissipation assembly of claim 1, wherein a gasket (15) is arranged below the upper convex plate of the bracket (11), the middle parts of the gasket (15) and the upper convex plate, which are attached to each other, are provided with bolt holes for matching with the bolt pieces, and the middle parts of the lower convex plate of the bracket (11) are provided with bolt holes for matching with the bolt pieces.

3. The heat dissipation assembly of claim 2, wherein the attachment point of the limiting groove (12) of the bracket (11) and the cross frame (13) is provided with a bolt hole for matching with a bolt piece.

4. A radiator module according to claim 1, wherein the air inlet duct (32), the air distribution table (33) and the air supply duct (34) are connected integrally as an air guide passage.

5. The heat dissipation assembly of claim 1, wherein filter materials are placed in the inner cavity of the air distribution table (33), and air gaps for gas transmission are reserved between the filter materials.

6. A radiator module according to claim 1, characterised in that the supply duct (34) is provided with cooling fins (4) mounted on the heat sink (2) below, the cooling fins (4) being parallel to the solid state memory cards and having air holes (41) spaced in the duct.

7. A solid state storage card comprising the heat dissipation assembly of any of claims 1-6.