CN112523459A - Indoor floor decoration method - Google Patents

Indoor floor decoration method Download PDF

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Publication number
CN112523459A
CN112523459A CN202011241202.7A CN202011241202A CN112523459A CN 112523459 A CN112523459 A CN 112523459A CN 202011241202 A CN202011241202 A CN 202011241202A CN 112523459 A CN112523459 A CN 112523459A
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CN
China
Prior art keywords
floor tile
tile composite
composite board
board
leveling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011241202.7A
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Chinese (zh)
Inventor
张引强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heshi Shanghai Construction Technology Co ltd
Original Assignee
Heshi Shanghai Construction Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heshi Shanghai Construction Technology Co ltd filed Critical Heshi Shanghai Construction Technology Co ltd
Priority to CN202011241202.7A priority Critical patent/CN112523459A/en
Publication of CN112523459A publication Critical patent/CN112523459A/en
Pending legal-status Critical Current

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    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/02Flooring or floor layers composed of a number of similar elements
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/18Separately-laid insulating layers; Other additional insulating measures; Floating floors
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/18Separately-laid insulating layers; Other additional insulating measures; Floating floors
    • E04F15/20Separately-laid insulating layers; Other additional insulating measures; Floating floors for sound insulation
    • E04F15/206Layered panels for sound insulation
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/02Flooring or floor layers composed of a number of similar elements
    • E04F15/02005Construction of joints, e.g. dividing strips
    • E04F15/02011Construction of joints, e.g. dividing strips with joint fillings integrated in the flooring elements
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/02Flooring or floor layers composed of a number of similar elements
    • E04F15/02044Separate elements for fastening to an underlayer
    • E04F2015/02105Separate elements for fastening to an underlayer without load-supporting elongated furring elements between the flooring elements and the underlayer
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F2201/00Joining sheets or plates or panels
    • E04F2201/05Separate connectors or inserts, e.g. pegs, pins, keys or strips

Abstract

The invention relates to the technical field of indoor decoration, in particular to an indoor floor decoration method, which comprises the following steps: the floor tile composite board module is installed and fixed on the ground to level the ground, and then the floor tile composite board module is laid on the leveling plate, so that the floor tile composite board module has the advantages of high installation efficiency and good laying effect, and simultaneously has the advantages of easiness in replacing the floor tile composite board after finishing decoration and quick secondary decoration.

Description

Indoor floor decoration method
Technical Field
The invention belongs to the technical field of indoor decoration, and particularly relates to an indoor floor decoration method.
Background
Along with the development of the building industry, people pay more and more attention to the indoor decoration of assembly type industrialization, but the current indoor decoration process method still stays on the traditional process. The traditional decoration system mainly uses mixed mortar to spread and paste the ceramic tiles on a ground substrate, has long operation time, high technical requirement on workers and high difficulty and cost of secondary decoration.
Aiming at the problems, through search, the Chinese invention patent is as follows: a new connecting structure and a using method of floor tiles (application No. 201911116040.1, application No. 2019.11.15) disclose a new connecting structure and a using method of floor tiles, which comprises a tile body and strip-shaped connecting pieces, the back of the tile body is provided with a strip-shaped groove at the edge of each edge of the tile body, the shape of the strip-shaped groove on the section vertical to the length direction of the strip-shaped groove is T-shaped, the bar connecting piece includes the bar bottom plate, and two positive long edges of bar bottom plate are provided with bar connecting portion symmetrically, and bar connecting portion include the bar piece of being connected with bar bottom plate is perpendicular and the bar card lamella of symmetry setting on two positive long edges of bar piece, and two positive bar connecting portion of bar bottom plate can insert the bar inslot of the ceramic tile body of two adjacent seamless butt joints respectively and make two bar card lamellas of bar connecting portion support and press on the lateral wall on the upper portion in bar groove. This application can reduce the cost of ground ceramic tile installation, reduces the process and the man-hour of ground ceramic tile installation.
However, the disadvantages of this application are: the ceramic tile joint strength who lays through this application is little, and the ceramic tile roughness of accomplishing of concatenation is low, and is high to workman's technological requirement, and is not convenient for dismantle the change during the secondary fitment, has improved the cost of secondary fitment.
Disclosure of Invention
1. Technical problem to be solved by the invention
The invention aims to solve the problems that the existing ground decoration process is complex, the construction period is long, the process difficulty of leveling the ground is high, and the cost and difficulty of secondary decoration are high.
2. Technical scheme
In order to achieve the purpose, the technical scheme provided by the invention is as follows: an indoor floor repair method comprises the following steps:
s1, mounting and fixing the leveling plate on the ground;
and S2, laying the floor tile composite board on the leveling plate.
Preferably, the leveling plate comprises a supporting plate and a buffer plate which are arranged in an overlapping mode.
Preferably, the floor tile composite board comprises a decorative board and a fixing board which are arranged in an overlapping mode.
Preferably, the different floor tile composite boards are connected through a buckle, the buckle comprises a connecting strip and a clamping section, and the clamping section is arranged on the side surface of the connecting strip, which is contacted with the floor tile composite board; the section of the connecting strip is rectangular, and the length of the section of the connecting strip is less than or equal to the thickness of the floor tile composite board; the height of the upper surface of the clamping section is lower than that of the upper surface of the connecting strip, and the height of the lower surface of the clamping section is higher than that of the bottom surface of the connecting strip; the binding surface of the floor tile composite board contacted with the connecting strip is provided with a groove tightly matched with the clamping section;
preferably, the block section includes embedding end and stiff end, the stiff end is used for fixed embedding end and connecting strip, the embedding end is used for imbedding the recess and fixed with the recess, the volume of embedding end is along the direction of deepening the recess crescent.
Preferably, the step S1 includes the steps of:
s11, placing the horizontal detector on the ground;
s12, smearing fixing glue, and evenly smearing the fixing glue on the supporting plate of the leveling plate;
s13, paving the leveling plate on the ground, and adhering the supporting plate of the leveling plate to the ground;
and S14, leveling the leveling plate, placing the calibration piece on the leveling plate, and knocking and pressing the leveling plate to align the laser emitted by the level detector with the calibration line on the calibration piece.
And S15, fully paving the leveling plates, and fully paving a plurality of leveling plates on the ground according to the steps S12 to S14, wherein different leveling plates are closely arranged.
Preferably, the step S2 includes the steps of:
s21, placing initial floor tile composite boards, placing two adjacent initial floor tile composite boards on a leveling plate in parallel, and attaching the fixing plates of the floor tile composite boards to the leveling plate;
s22, inserting buckles, and inserting the buckles between two adjacent floor tile composite boards;
s23, placing the spliced floor tile composite board, placing the floor tile composite board for splicing at the edge of the initial floor tile composite board, and attaching the fixing board of the floor tile composite board to the leveling board;
and S24, fully paving the floor tile composite board, repeating the steps S22 and S23, and fully paving the floor tile composite board on the leveling board.
Preferably, the step of laying the final floor tile composite board comprises: putting the last floor tile composite board on a leveling plate, pushing the nearest buckle of the last floor tile composite board to the center of the edge of the last floor tile composite board, clamping the last floor tile composite board, and finally inserting a seam beautifying strip into a gap reserved between the last floor tile composite board and the adjacent floor tile composite board.
3. Advantageous effects
Compared with the prior art, the technical scheme provided by the invention has the following beneficial effects:
the invention relates to an indoor floor decoration method, which comprises the following steps: the floor tile composite board module is installed and fixed on the ground to level the ground, and then the floor tile composite board module is laid on the leveling plate, so that the floor tile composite board module has the advantages of high installation efficiency and good laying effect, and simultaneously has the advantages of easiness in replacing the floor tile composite board after finishing decoration and quick secondary decoration.
Drawings
FIG. 1 is a flow chart of the finishing steps of the present invention;
FIG. 2 is a flowchart illustrating the steps of installing a leveling plate according to the present invention;
fig. 3 is a flowchart illustrating a process of installing a floor tile composite panel according to the present invention;
FIG. 4 is a schematic view of a finished structure of the present invention;
FIG. 5 is a schematic view of the structure of the composite floor tile panel and the fastener of the present invention;
fig. 6 is a schematic view of the floor tile composite board and the fastener according to the present invention.
The reference numerals in the schematic drawings illustrate:
100. leveling; 110. a support plate; 120. a buffer plate; 200. floor tile composite boards; 210. a decorative plate; 220. a fixing plate; 221. an anti-slip hole; 230. a groove; 300. buckling; 310. a connecting strip; 320. a clamping section; 321. a fixed end; 322. an embedded end; 400. and (5) beautifying seam strips.
Detailed Description
In order to facilitate an understanding of the invention, the invention will now be described more fully hereinafter with reference to the accompanying drawings, in which several embodiments of the invention are shown, but which may be embodied in many different forms and are not limited to the embodiments described herein, but rather are provided for the purpose of providing a more thorough disclosure of the invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present; when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present; the terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention; as used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Example 1
Referring to fig. 1 to 6, the present embodiment provides a technical solution: an indoor floor repair method, comprising the following steps:
s1, installing and fixing the leveling plate 100 on the ground;
and S2, laying the floor tile composite board 200 on the leveling board 100.
In a preferred embodiment, the leveling plate 100 includes a supporting plate 110 and a buffer plate 120 which are disposed to overlap. Buffer board 120 adopts XPS extrusion molding heated board setting, makes buffer board 120 has good sound insulation, heat preservation and shock resistance, backup pad 110 adopts calcium silicate board setting, makes backup pad 110 has the characteristics that light and intensity are high, leveling board 100 passes through backup pad 110 and buffer board 120 bonding are made, make leveling board 100 has that the roughness is high, light, intensity is high, sound insulation, heat preservation and shock-resistant advantage.
In a preferred embodiment, the floor tile composite board 200 includes a decorative board 210 and a fixing board 220, which are overlapped, wherein the decorative board 210 is used for decorating the ground, so that the laid floor tile composite board 200 has a good aesthetic effect, the fixing board 220 is made of a PVC foam board, so that the fixing board 220 has the advantages of fire resistance, water resistance, high strength, light weight and heat preservation, and meanwhile, the floor tile composite board 200 is formed by bonding the fixing board 220 and the decorative board 210, so that the floor tile composite board 200 has high strength and high toughness. The surface of the fixing plate 220, which is far away from the decorative plate 210, is provided with a plurality of anti-slip holes 221, and the anti-slip holes 221 are used for increasing the friction coefficient between the fixing plate 220 and the buffer plate 120, so that when the floor tile composite plate 200 is placed on the leveling plate 100, the floor tile composite plate 200 and the leveling plate 100 are difficult to slide relatively.
In a preferred embodiment, different floor tile composite boards 200 are connected by the buckles 300, which is beneficial to improving the splicing efficiency of the floor tile composite boards 200, and meanwhile, gaps between different floor tile composite boards 200 are filled by the buckles 300, so that the spliced floor tile composite board 200 does not need to be subjected to a seam beautifying process, which is beneficial to improving the decoration efficiency and shortening the construction period, wherein the buckles 300 comprise connecting strips 310 and clamping sections 320, and the clamping sections 320 are arranged on the side surfaces of the connecting strips 310, which are in contact with the floor tile composite boards 200; the section of the connecting strip 310 is rectangular, the length of the section of the connecting strip 310 is less than or equal to the thickness of the floor tile composite board 200, and when the length of the section of the connecting strip 310 is equal to the thickness of the floor tile composite board 200, gaps among different floor tile composite boards 200 after splicing are filled by the connecting strip 310, so that the spliced floor tile composite board 200 does not need to be filled in the splicing gaps, and has a good aesthetic effect; when the length of the cross section of the connecting strip 310 is smaller than the thickness of the floor tile composite board 200, the different floor tile composite boards 200 are tightly spliced after being spliced, so that the seamless splicing decoration effect is achieved. The height of the upper surface of the clamping section 320 is lower than that of the upper surface of the connecting strip 310, and the height of the lower surface of the clamping section 320 is higher than that of the bottom surface of the connecting strip 310; the abutting surface of the floor tile composite board 200 contacting the connecting strip 310 is provided with a groove 230 closely matching with the clamping section 320.
In a preferred embodiment, the fastening section 320 includes an embedded end 322 and a fixing end 321, the fixing end 321 is used for fixing the embedded end 322 and the connecting bar 310, the embedded end 322 is used for being embedded in the groove 230 and fixed with the groove 230, and the volume of the embedded end 322 gradually increases along a direction penetrating into the groove 230.
In a preferred embodiment, the step S1 includes the following steps:
s11, placing the horizontal detector on the ground;
s12, smearing fixing glue, wherein the fixing glue is evenly smeared on the supporting plate 110 of the leveling plate 100 in a certain thickness, and the fixing glue adopts quick-setting adhesives such as foaming agents, structural glue and putty;
s13, paving the leveling plate 100 on the ground, and adhering the support plate 110 of the leveling plate 100 to the ground, so that fixing glue on the support plate 110 is adhered to the uneven ground, and because the fixing glue has certain fluidity, when the leveling plate 100 is paved on the ground, the fixing glue can fill a gap between the leveling plate 100 and the ground, and a certain sealed cavity is reserved, so that after the leveling plate 100 is paved, the sealed cavity has good heat preservation and sound insulation effects, and the decoration effect of the ground is improved;
s14, leveling the leveling plate 100, placing the calibration piece on the leveling plate 100, and knocking and pressing the leveling plate 100 to adjust the flatness of the leveling plate 100, so that the laser emitted by the level detector is aligned with the calibration line on the calibration piece.
S15, fully paving the leveling plates 100, fully paving a plurality of the leveling plates 100 on the ground according to the steps S12 to S14, wherein the leveling plates 100 are different from one another and are closely arranged, the traditional method of paving ceramic tiles by mixed mortar is changed by paving the leveling plates 100, and the leveling plate has the advantages of simple leveling process, high solidification speed of fixing glue, short construction period and high flatness of the finished leveling plates 100.
In a preferred embodiment, the step S2 includes the following steps:
s21, placing the initial composite floor tile panel 200, placing two adjacent initial composite floor tile panels 200 on the leveling plate 100 in parallel, and attaching the fixing plate 220 of the composite floor tile panel 200 to the leveling plate 100, so that the composite floor tile panel 200 placed on the leveling plate 100 is easy to detach and replace.
S22, inserting the buckle 300, and inserting the buckle 300 between two adjacent floor tile composite boards 200;
s23, placing the spliced floor tile composite board 200, placing the floor tile composite board 200 for splicing at the edge of the initial floor tile composite board 200, and attaching the fixing board 220 of the floor tile composite board 200 to the leveling board 100;
and S24, fully paving the floor tile composite board 200, repeating the steps S22 and S23, and fully paving the floor tile composite board 200 on the leveling board 100.
Through the steps, different floor tile composite boards 200 are connected through the buckles 300, so that the floor tile composite board 200 laid on the leveling plate 100 is not easy to move relatively, the decoration effect is good, meanwhile, the construction process of secondary decoration is simplified, and the decoration cost is reduced.
In a preferred embodiment, the step of laying the final tile composite board 200 comprises: firstly, the last floor tile composite board 200 is placed on the leveling board 100, the nearest buckle 300 of the last floor tile composite board 200 is pushed to the center position of the edge of the last floor tile composite board 200, the last floor tile composite board 200 is clamped, and finally the seam beautifying strip 400 is inserted into a gap reserved between the last floor tile composite board 200 and the adjacent floor tile composite board 200.
The above-mentioned embodiments only express a certain implementation mode of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention; it should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which are within the protection scope of the present invention; therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (8)

1. An indoor floor repair method is characterized in that: the method comprises the following steps:
s1, installing and fixing the leveling plate (100) on the ground;
and S2, laying the floor tile composite board (200) on the leveling plate (100).
2. An indoor floor finishing method according to claim 1, characterized in that: the leveling plate (100) comprises a supporting plate (110) and a buffer plate (120) which are arranged in an overlapping mode.
3. An indoor floor finishing method according to claim 1, characterized in that: the floor tile composite board (200) comprises a decorative board (210) and a fixing board (220) which are overlapped.
4. An indoor floor finishing method according to claim 3, wherein: the different floor tile composite boards (200) are connected through buckles (300), each buckle (300) comprises a connecting strip (310) and a clamping section (320), and the clamping section (320) is arranged on the side face, in contact with the floor tile composite board (200), of each connecting strip (310); the section of the connecting strip (310) is rectangular, and the length of the section of the connecting strip (310) is less than or equal to the thickness of the floor tile composite board (200); the height of the upper surface of the clamping section (320) is lower than that of the upper surface of the connecting strip (310), and the height of the lower surface of the clamping section (320) is higher than that of the bottom surface of the connecting strip (310); the abutted surfaces of the floor tile composite board (200) and the connecting strips (310) are provided with grooves (230) which are tightly matched with the clamping sections (320).
5. An indoor floor finishing method according to claim 4, wherein: the clamping section (320) comprises an embedding end (322) and a fixed end (321), the fixed end (321) is used for fixing the embedding end (322) and the connecting bar (310), the embedding end (322) is used for being embedded into the groove (230) and fixed with the groove (230), and the volume of the embedding end (322) is gradually increased along the direction penetrating into the groove (230).
6. An indoor floor finishing method according to claim 2, wherein: the step S1 includes the steps of:
s11, placing the horizontal detector on the ground;
s12, smearing fixing glue, and evenly smearing the fixing glue on the supporting plate (110) of the leveling plate (100);
s13, paving the leveling plate (100) on the ground, and enabling a supporting plate (110) of the leveling plate (100) to be attached to the ground;
s14, leveling the leveling plate (100), placing the calibration piece on the leveling plate (100), and knocking and pressing the leveling plate (100) to align the laser emitted by the level detector with the calibration line on the calibration piece.
S15, fully laying the leveling plates (100), fully laying a plurality of leveling plates (100) on the ground according to the steps S12 to S14, and closely arranging different leveling plates (100).
7. An indoor floor finishing method according to claim 3, wherein: the step S2 includes the steps of:
s21, placing initial floor tile composite boards (200), placing two adjacent initial floor tile composite boards (200) on a leveling plate (100) in parallel, and attaching a fixing plate (220) of each floor tile composite board (200) to the leveling plate (100);
s22, inserting a buckle (300), and inserting the buckle (300) between two adjacent floor tile composite plates (200);
s23, placing the spliced floor tile composite board (200), placing the floor tile composite board (200) for splicing at the edge of the initial floor tile composite board (200), and attaching the fixing board (220) of the floor tile composite board (200) to the leveling board (100);
and S24, fully paving the composite floor tile board (200), repeating the steps S22 and S23, and fully paving the composite floor tile board (200) on the leveling plate (100).
8. An indoor floor finishing method according to claim 7, wherein: the step of laying the final tile composite board (200) comprises: firstly, the last floor tile composite board (200) is placed on a leveling plate (100), then the nearest buckle (300) of the last floor tile composite board (200) is pushed to the center position of the edge of the last floor tile composite board (200), the last floor tile composite board (200) is clamped, and finally a seam beautifying strip (400) is inserted into a gap reserved between the last floor tile composite board (200) and the adjacent floor tile composite board (200).
CN202011241202.7A 2020-11-09 2020-11-09 Indoor floor decoration method Pending CN112523459A (en)

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Application Number Priority Date Filing Date Title
CN202011241202.7A CN112523459A (en) 2020-11-09 2020-11-09 Indoor floor decoration method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011241202.7A CN112523459A (en) 2020-11-09 2020-11-09 Indoor floor decoration method

Publications (1)

Publication Number Publication Date
CN112523459A true CN112523459A (en) 2021-03-19

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CN202011241202.7A Pending CN112523459A (en) 2020-11-09 2020-11-09 Indoor floor decoration method

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113027065A (en) * 2021-04-02 2021-06-25 无锡高德康装饰新材料有限公司 Novel plate connecting structure

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CN104032925A (en) * 2014-06-30 2014-09-10 龙信建设集团有限公司 Construction method for CSI residential wall and ground empty space
CN204940784U (en) * 2015-07-09 2016-01-06 中恒建设集团有限公司 Compound indoor decorative floor
CN208310084U (en) * 2018-05-28 2019-01-01 浙江博泓建筑装饰有限公司 A kind of floor being convenient for changing

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Publication number Priority date Publication date Assignee Title
CN1343824A (en) * 2000-09-14 2002-04-10 普雷马克Rwp控股公司 Multi-direction floor veneer
US20090031658A1 (en) * 2005-06-02 2009-02-05 Snapsports Company Modular floor tile with resilient support members
CN104032925A (en) * 2014-06-30 2014-09-10 龙信建设集团有限公司 Construction method for CSI residential wall and ground empty space
CN204940784U (en) * 2015-07-09 2016-01-06 中恒建设集团有限公司 Compound indoor decorative floor
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Publication number Priority date Publication date Assignee Title
CN113027065A (en) * 2021-04-02 2021-06-25 无锡高德康装饰新材料有限公司 Novel plate connecting structure

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Application publication date: 20210319