CN112521885A - 一种高从形性通讯电缆用半导电自粘带 - Google Patents

一种高从形性通讯电缆用半导电自粘带 Download PDF

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CN112521885A
CN112521885A CN202011299071.8A CN202011299071A CN112521885A CN 112521885 A CN112521885 A CN 112521885A CN 202011299071 A CN202011299071 A CN 202011299071A CN 112521885 A CN112521885 A CN 112521885A
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汪明骏
秦安康
吴海涛
邹明选
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Abstract

本发明公开了一种高从形性通讯电缆用半导电自粘带，属于高从形性半导电带技术领域。所述半导电自粘带的原料按重量份数比计，包含如下组分：聚合物A 5‑30份；聚合物B 5‑15份；导电炭黑5‑25份；填料5‑20份；增粘剂1‑20份；增塑剂5‑20份；抗氧剂0.5‑3份。采用高分子橡胶为主体，配合抗氧剂，弥补在高温环境下产品出现开裂、收缩的缺陷；采用高性能的导电炭黑，保证产品的体积电阻率的合规和稳定；采用高粘性的增粘树脂，弥补产品在粘性方面的欠缺，防止使用后出现松脱的现象；采用的高性能的增塑剂，降低了材料在加工过程中对压辊的粘性，提高了产品的生产效率。

Description

一种高从形性通讯电缆用半导电自粘带
技术领域
本发明涉及一种高从形性通讯电缆用半导电自粘带，属于高从形性半导电带技术领域。
背景技术
半导电胶带是一种高从形性、半导电的乙丙橡胶绝缘胶带，不需硫化，性能稳定，在宽广的使用温度范围内保持稳定的电导率，其电导率受低粘度油的影响，不影响电缆半导电层的电导率。主要用于额定电压不超过10kV的橡塑绝缘电缆终端、接头制作屏蔽层,也可以用于其它设施所需要的屏蔽结构。它具有以下特性：(1)半导电性(低电阻率)，拉伸时保持电导率；(2)易于拉伸，对在不规则表面有良好的从形性；(3)过载温度下(130℃/266oF以下)性能保持稳定；(4)适用于所有固体介质电缆，抗溶剂，抗紫外和潮气；(5)适用于高压接头与终端材料；(6)可用于室内和室外。
传统的半导电带在耐热性方面表现不佳，130℃环境下会出现开裂、收缩的现象。传统的半导电带的体积电阻率不稳定，标准是≤100Ω·cm，但常常会超过这个标准。传统的半导电带在自粘性方面也稍有欠缺，使用后会出现松脱的现象。因此，设计一种高从形性通讯电缆用半导电自粘带，采用高分子橡胶为主体，配合抗氧剂，弥补在高温环境下产品出现开裂和收缩的缺陷；采用高性能的导电炭黑，保证产品的体积电阻率的合规和稳定；采用高粘性的增粘树脂，弥补产品在粘性方面的欠缺，防止使用后出现松脱的现象；采用的高性能的增塑剂，降低了材料在加工过程中对压辊的粘性，提高了产品的生产效率。
CN104861885A公开一种自粘性橡胶带的制作方法及其成分：增粘剂：30-50；增粘橡胶：20-40；补强剂：50-200；增强树脂：10-20；硫化剂：0.5-1.5；促进剂：4-6；碳黑：3-50；并且采用硫化工艺，与本发明中的非硫化工艺不同。其应用中提到半导电应用，但是碳黑并没有特别申明为导电碳黑。
发明内容
本发明所要解决的技术问题在于：提供一种高从形性通讯电缆用半导电自粘带，它解决了目前传统的半导电带在耐热性方面表现不佳、体积电阻率不稳定、自粘性方面也稍有欠缺的问题。
本发明所要解决的技术问题采取以下技术方案来实现：
一种高从形性通讯电缆用半导电自粘带，所述半导电自粘带的原料按重量份数比计，包含如下组分：
聚合物A 5-30份；
聚合物B 5-15份；
导电炭黑 5-25份；
填料 5-20份；
增粘剂 1-20份；
增塑剂 5-20份；
抗氧剂 0.5-3份；
所述聚合物A的分子量大于10万，采用丁基橡胶或聚异丁烯中任意一种。
所述聚合物B的分子小50000万，采用中低分子量聚异丁烯或PE蜡中任意一种。
作为优选实例，所述导电炭黑的比表面积在1000m2/g左右，粒径在30左右的超导电炭黑。
作为优选实例，所述填料采用目数800的碳酸钙。
作为优选实例，所述增粘剂采用软化点＞70℃的增粘树脂。
作为优选实例，所述增塑剂的密度在1.05g/cm3的氧基硅烷。
作为优选实例，所述抗氧剂为酚类抗氧剂或含P,N类抗氧剂。
本半导电自粘带的生产工艺，包括以下步骤：
(1)原材料检测；
(2)配料；
(3)密炼；
(4)压延成型；
(5)模切包装；
(6)成品检测。
制成半导电自粘带成品。
本发明的有益效果是：
(1)采用高分子橡胶为主体，配合抗氧剂，弥补在高温环境下产品出现开裂、收缩的缺陷；
(2)采用高性能的导电炭黑，保证产品的体积电阻率的合规和稳定；
(3)采用高粘性的增粘树脂，弥补产品在粘性方面的欠缺，防止使用后出现松脱的现象；
(4)采用的高性能的增塑剂，降低了材料在加工过程中对压辊的粘性，提高了产品的生产效率。
附图说明
图1为本发明的生产工艺流程示意图。
具体实施方式
为了对本发明的技术手段、创作特征、达成目的与功效易于明白了解，下面结合具体图示，进一步阐述本发明。
一种高从形性通讯电缆用半导电自粘带，半导电自粘带的原料按重量份数比计，包含如下组分：
聚合物A 5-30份；
聚合物B 5-15份；
导电炭黑 5-25份；
填料 5-20份；
增粘剂 1-20份；
增塑剂 5-20份；
抗氧剂 0.5-3份；
其中：
聚合物A的分子量大于10万，采用丁基橡胶或聚异丁烯中任意一种。
聚合物B的分子小50000万，采用中低分子量聚异丁烯或PE蜡中任意一种。
导电炭黑的比表面积在1000m2/g左右，粒径在30左右的超导电炭黑。
填料采用目数800的碳酸钙。
增粘剂采用软化点＞70℃的增粘树脂。
增塑剂的密度在1.05g/cm3的氧基硅烷。
抗氧剂为酚类抗氧剂或含P,N类抗氧剂。
如图1所示，本半导电自粘带的生产工艺，包括以下步骤：
(1)原材料检测，使用规格检测合格的原材料；
(2)配料，将各种原材料按照以上配方比进行配料；
(3)密炼，对各配料进行密炼；
(4)压延成型，将密炼后的原料进行压延成型；
(5)模切包装，根据所需规格进行模切和包装；
(6)成品检测，检测合格的产品，为可销售的成品。
制成半导电自粘带成品。
实施例1
一种高从形性通讯电缆用半导电自粘带，半导电自粘带的原料按重量份数比计，包含如下组分：
聚合物A 25份
聚合物B 10份
导电炭黑 15份
填料 15份
增粘剂 15份
增塑剂 18份
抗氧剂 2份。
通过以上生产工艺生产实施例1成品。
该半导电自粘带测试结果见下表，所有指标合格。
Figure BDA0002786281340000041
Figure BDA0002786281340000051
实施例2
一种高从形性通讯电缆用半导电自粘带，半导电自粘带的原料按重量份数比计，包含如下组分：
聚合物A 30份
聚合物B 5份
导电炭黑 20份
填料 15份
增粘剂 13份
增塑剂 15份
抗氧剂 2份。
通过以上生产工艺生产实施例1成品。
该半导电自粘带测试结果见下表，所有指标合格。
Figure BDA0002786281340000052
通过以上两个实施例，能够充分说明本半导电自粘带的各项性能优异，能够达到预期目的。
它具有以下优点：
(1)采用高分子橡胶为主体，配合抗氧剂，弥补在高温环境下产品出现开裂、收缩的缺陷；
(2)采用高性能的导电炭黑，保证产品的体积电阻率的合规和稳定；
(3)采用高粘性的增粘树脂，弥补产品在粘性方面的欠缺，防止使用后出现松脱的现象；
(4)采用的高性能的增塑剂，降低了材料在加工过程中对压辊的粘性，提高了产品的生产效率。
以上显示和描述了本发明的基本原理、主要特征和优点。本领域的技术人员应该了解，本发明不受上述实施例的限制，在不脱离本发明精神和范围的前提下，本发明还会有各种变化和改进，这些变化和改进都落入本发明要求保护的范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。

Claims (6)

1.一种高从形性通讯电缆用半导电自粘带，其特征在于，所述半导电自粘带的原料按重量份数比计，包含如下组分：
聚合物A 5-30份；
聚合物B 5-15份；
导电炭黑5-25份；
填料5-20份；
增粘剂1-20份；
增塑剂5-20份；
抗氧剂0.5-3份；
所述聚合物A的分子量大于10万，采用丁基橡胶或聚异丁烯中任意一种；
所述聚合物B的分子小50000万，采用中低分子量聚异丁烯或PE蜡中任意一种。
2.根据权利要求1所述一种高从形性通讯电缆用半导电自粘带，其特征在于，所述导电炭黑的比表面积在1000m2/g左右，粒径在30左右的超导电炭黑。
3.根据权利要求1所述一种高从形性通讯电缆用半导电自粘带，其特征在于，所述填料采用目数800的碳酸钙。
4.根据权利要求1所述一种高从形性通讯电缆用半导电自粘带，其特征在于，所述增粘剂采用软化点＞70℃的增粘树脂。
5.根据权利要求1所述一种高从形性通讯电缆用半导电自粘带，其特征在于，所述增塑剂的密度在1.05g/cm3的氧基硅烷。
6.根据权利要求1所述一种高从形性通讯电缆用半导电自粘带，其特征在于，所述抗氧剂为酚类抗氧剂或含P,N类抗氧剂。
CN202011299071.8A 2020-11-18 2020-11-18 一种高从形性通讯电缆用半导电自粘带 Pending CN112521885A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113185925A (zh) * 2021-03-25 2021-07-30 中国电力科学研究院有限公司 一种半导电屏蔽带及其制备方法和用途

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3278471A (en) * 1962-03-26 1966-10-11 Johns Manville Roofing compositions comprising polyisobutylene, polyethylene and pigment
WO1991015860A1 (en) * 1990-04-03 1991-10-17 The Furukawa Electric Co., Ltd. Semiconductive resin composition and rubber/plastic insulated power cable produced by using the same
CN104861885A (zh) * 2015-02-05 2015-08-26 无锡龙舜实业有限公司 一种自粘性橡胶带的制作方法
CN106317658A (zh) * 2016-08-06 2017-01-11 无锡龙舜实业有限公司 一种改性自粘性橡胶带
CN108641631A (zh) * 2018-04-20 2018-10-12 江苏同盟汽车零部件实业有限公司 一种自粘型隔音膨胀胶及其制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3278471A (en) * 1962-03-26 1966-10-11 Johns Manville Roofing compositions comprising polyisobutylene, polyethylene and pigment
WO1991015860A1 (en) * 1990-04-03 1991-10-17 The Furukawa Electric Co., Ltd. Semiconductive resin composition and rubber/plastic insulated power cable produced by using the same
CN104861885A (zh) * 2015-02-05 2015-08-26 无锡龙舜实业有限公司 一种自粘性橡胶带的制作方法
CN106317658A (zh) * 2016-08-06 2017-01-11 无锡龙舜实业有限公司 一种改性自粘性橡胶带
CN108641631A (zh) * 2018-04-20 2018-10-12 江苏同盟汽车零部件实业有限公司 一种自粘型隔音膨胀胶及其制备方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
陈晓松等: "中压电缆用半导电绝缘屏蔽层胶料的研制", 《化工新型材料》 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113185925A (zh) * 2021-03-25 2021-07-30 中国电力科学研究院有限公司 一种半导电屏蔽带及其制备方法和用途

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