CN112521139A - 一种跨尺度多孔陶瓷及其制备方法 - Google Patents

一种跨尺度多孔陶瓷及其制备方法 Download PDF

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CN112521139A
CN112521139A CN201910826082.8A CN201910826082A CN112521139A CN 112521139 A CN112521139 A CN 112521139A CN 201910826082 A CN201910826082 A CN 201910826082A CN 112521139 A CN112521139 A CN 112521139A
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董雷
唐胤洲
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Nanjing Youdeng Technology Co ltd
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Abstract

本发明涉及一种兼有除尘和除废气功能的跨尺度多孔陶瓷及制备方法，属于功能材料领域。本发明的跨尺度多孔陶瓷具有大孔(大于50nm)、介孔(2nm到50nm)、微孔(小于2nm)的多级孔隙结构，在宏观、介观和微观三个尺度实现跨尺度仿生结构。本发明使用波长在红外波段的激光对硅藻土，介孔二氧化硅和全硅分子筛的混合粉体激光选区烧结制备的跨尺度多孔陶瓷。本发明的跨尺度多孔陶瓷用于恶劣工况下粉尘治理和有毒废气治理。

Description

一种跨尺度多孔陶瓷及其制备方法
技术领域
本发明属于新材料领域，具体属于用于多孔陶瓷制备领域。
背景技术
硅藻是水生单细胞藻类，具有多样的形貌和丰富的孔隙结构，以圆形藻为例，大小约几微米到几十微米，硅藻的外壳密布着与外界进行物质交换孔洞，孔洞的形状为圆形，孔洞的大小在亚微米和纳米尺度，硅藻的外壳主要成分是无定形的二氧化硅，属于天然的生物玻璃材料，太阳光透过硅藻的玻璃外壳，在硅藻壳内参与光合作用。硅藻死后，由于二氧化硅的很稳定，难于分解，经过成千上万年的积累，形成了丰富廉价的硅藻土。硅藻土主要由硅藻壳组成，有的形貌还很完整，有的已经破碎，但都保留了丰富的孔隙结构。由于孔隙率很高，硅藻土除了在饮料、化工和家装等传统领域有广泛的应用外，还被做成陶瓷膜、多孔陶瓷等用于水处理和光催化等。
介孔二氧化硅具有孔道结构规则，孔径分布窄等特点，广泛应用于分离提纯、吸附、催化等领域，目前的介孔二氧化硅多为粉体状态，由于表面多羟基，介孔二氧化硅存在严重团聚的问题，如能将介孔二氧化硅做成块体材料，可拓宽应用范围。全硅分子筛具有微观尺度的孔道结构，广泛应用于工业催化，吸附分离等领域。
现有技术制备硅藻土基多孔陶瓷的成型工艺主要有模压法，添加造孔剂法，泡沫浸渍法，发泡法等，很难实现自由成型。烧结工艺为常规的加热烧结工艺，由于常规的烧结工艺提供的是均一的温度场，由于尺寸效应，微孔已经坍塌闭合的情况，大颗粒材料还未烧结，所以普通烧结工艺很难实现在宏观，微观和介观领域跨尺度的孔隙结构。另外在应用上大孔结构多用于除尘，介孔和微孔结构多用于气体吸附，现有技术很难实现制备同时兼有除尘和除废气功能的多孔体。
发明内容
本发明要解决的问题
本发明要公布一种兼有除尘和除废气功能的多孔体及制备方法，本发明的多孔体具有大孔(大于50nm)、介孔(2nm到50nm)、微孔(小于2nm)的多级孔隙结构，在宏观、介观和微观三个尺度实现跨尺度仿生结构。本发明的多孔体的成分为二氧化硅。
本发明的技术路线
本发明使用的原料为50～70wt％硅藻壳。10～30wt％的介孔二氧化硅，10～20wt％的全硅沸石。本发明的制备工艺为成型和烧结一步完成工艺，本发明的工艺为自由成型工艺。具体为软件控制的铺粉和激光分层烧结工艺，铺粉的层厚度为80微米～300微米，优选为100微米～200微米，激光器为固体激光器，光纤激光器，二氧化碳激光器中的一种，优选为激光波长为红外区的二氧化碳激光器。本发明的跨尺度孔隙结构，大孔由选区预留，激光扫描分辨率、激光束直径和硅藻壳自身孔径实现，介孔由介孔二氧化硅实现，微孔由全硅分子筛实现。
本发明的有益效果
本发明在二氧化硅材质多孔体上实现了大孔，介孔，微孔的跨尺度孔隙，同时兼有除尘和除废气功能。
附图说明
图1本发明多孔体的典型形貌。
具体实施方式
下面对本发明实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。
实施例1
将50wt％的硅藻壳，30wt％的介孔二氧化硅，20wt％的全硅沸石均匀混合后，使用功率为100瓦，激光波长10.6微米的二氧化碳激光器进行激光选区烧结，通过软件控制铺粉，粉层厚设置为150微米，光斑直径为15微米，激光扫描速度为40cm/s,分辨率为500DPI,得到兼有除尘和除废气功能的多孔体。
实施例2
将70wt％的硅藻壳，10wt％的介孔二氧化硅，20wt％的全硅沸石均匀混合后，使用功率为60瓦，激光波长10.6微米的二氧化碳激光器进行激光选区烧结，通过软件控制铺粉，粉层厚设置为200微米，光斑直径为10微米，激光扫描速度为50cm/s,分辨率为400DPI,得到兼有除尘和除废气功能的多孔体。
实施例3
将70wt％的硅藻壳，20wt％的介孔二氧化硅，10wt％的全硅沸石均匀混合后，使用功率为40瓦，激光波长10.6微米的二氧化碳激光器进行激光选区烧结，通过软件控制铺粉，粉层厚设置为170微米，光斑直径为50微米，激光扫描速度为10cm/s,分辨率为400DPI,得到兼有除尘和除废气功能的多孔体。

Claims (5)

1.一种跨尺度多孔陶瓷的制备方法，其特征在于，该方法包括如下步骤：
步骤一，原料的制备：将硅藻壳、介孔二氧化硅，全硅沸石按比例均匀混合，其配比为50wt％-70wt％：10wt％-30wt％：10wt％-20wt％；优选比例为50wt％：30wt％：20wt％或70wt％：10wt％：20wt％或70wt％：20wt％：10wt％之一。
步骤二，激光器的选择与设定：选取固体激光器，光纤激光器，二氧化碳激光器中的一种，优选为激光波长为红外区的二氧化碳激光器，激光波长优选10.6nm，使用功率为40瓦-100瓦，光斑直径为10微米-50微米，激光扫描速度为10cm/s-50cm/s，分辨率为400DPI-500DPI。
步骤三，软件控制自动铺粉和激光分层烧结：软件控制铺粉，粉层厚设置为150微米-200微米，优选150微米、170微米、200微米，通过二氧化碳激光器在选区时将大孔预留，层层烧结，得到跨尺度多孔陶瓷。
2.根据权利要求1所述的跨尺度多孔陶瓷的制备方法，其特征在于：所述步骤一中的硅藻壳、介孔二氧化硅，全硅沸石的比例为：50wt％：30wt％：20wt％；步骤二中激光器为红外区的二氧化碳激光器，激光波长为10.6微米，使用功率为100瓦，光斑直径为15微米，激光扫描速度为40cm/s，分辨率为500DPI；步骤三中粉层厚设置为150微米。
3.根据权利要求1所述跨尺度多孔陶瓷的制备方法，其特征在于：所述步骤一中的硅藻壳、介孔二氧化硅，全硅沸石的比例为：70wt％：10wt％：20wt％；步骤二中激光器为红外区的二氧化碳激光器，激光波长为10.6微米，使用功率为60瓦，光斑直径为10微米，激光扫描速度为50cm/s，分辨率为400DPI；步骤三中粉层厚设置为200微米。
4.根据权利要求1所述跨尺度多孔陶瓷的制备方法，其特征在于：所述步骤一中的硅藻壳、介孔二氧化硅，全硅沸石的比例为：70wt％：20wt％：10wt％；步骤二中激光器为红外区的二氧化碳激光器，激光波长为10.6微米，使用功率为40瓦，光斑直径为50微米，激光扫描速度为10cm/s，分辨率为400DPI；步骤三中粉层厚设置为170微米。
5.根据权利要求1-4所述的任一一种制备方法所得的跨尺度多孔陶瓷，其特征在于：多孔陶瓷体的孔隙结构包括大孔≥50nm，介孔2nm至50nm，微孔小于2nm。
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CN115385668A (zh) * 2022-09-22 2022-11-25 营口理工学院 可快速烧结的环保型水基镁质转炉修补料及其制备方法

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