CN112519234A - Temperature control chip for 3D printing nozzle, debugging system and 3D printer - Google Patents
Temperature control chip for 3D printing nozzle, debugging system and 3D printer Download PDFInfo
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- CN112519234A CN112519234A CN202011121267.8A CN202011121267A CN112519234A CN 112519234 A CN112519234 A CN 112519234A CN 202011121267 A CN202011121267 A CN 202011121267A CN 112519234 A CN112519234 A CN 112519234A
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- 238000010146 3D printing Methods 0.000 title abstract description 10
- 239000007921 spray Substances 0.000 claims abstract description 5
- 238000007639 printing Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- Chemical & Material Sciences (AREA)
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- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
The invention discloses a temperature control chip for a 3D printing nozzle, a temperature control system and a 3D printer. The temperature control circuit is used for controlling the temperature of the spray head, and the debugging circuit is used for debugging the temperature control circuit. The debugging circuit includes: one end of the first debugging register is connected with the output end of a target module in the temperature control circuit, and the other end of the first debugging register is connected with the interface module; the data selector comprises a first input end, a second input end, a gating end and an output end, wherein the output end of the data selector is connected with the input end of the target module, and the first input end is used for inputting an input signal of the target module in a normal working mode; one end of the second debugging register is connected with the gating end of the data selector, and the other end of the second debugging register is connected with the interface module; and one end of the third debugging register is connected with the second input end, and the other end of the third debugging register is connected with the interface module.
Description
Technical Field
The invention relates to the technical field of 3D printing, in particular to a temperature control chip for a 3D printing nozzle, a debugging system and a 3D printer.
Background
In the printing nozzle composition structure of the 3D printer, a temperature control circuit for controlling the temperature of the nozzle is an important component, and the effect of the temperature control circuit determines the printing quality of a final finished product.
In the design and development process of the temperature control circuit, capturing the internal signals of the circuit for observation and control is an indispensable debugging step. However, generally, an interface presented to the outside by a circuit system only has its pin IO, and internal signals are buried inside the circuit; for development and debugging personnel, internal signals of the circuit are invisible and cannot be directly controlled conveniently, so that the temperature control circuit is difficult to debug.
Disclosure of Invention
The invention provides a temperature control chip for a 3D printing nozzle, a debugging system and a 3D printer, which can facilitate debugging personnel to debug a temperature control circuit integrated in the chip.
In a first aspect, an embodiment of the present specification provides a temperature control chip for 3D printing nozzle, which is characterized in that, includes a temperature control circuit, a debugging circuit and an interface module for connecting an upper computer, wherein, the temperature control circuit is used for controlling the temperature of the nozzle, the debugging circuit is used for right the temperature control circuit is debugged, the debugging circuit includes:
one end of the first debugging register is connected with the output end of a target module in the temperature control circuit, and the other end of the first debugging register is connected with the interface module and used for capturing output data of the target module so as to output the output data to the upper computer through the interface module;
the data selector comprises a first input end, a second input end, a gating end and an output end, wherein the output end of the data selector is connected with the input end of the target module, and the first input end is used for inputting an input signal of the target module in a normal working mode;
one end of the second debugging register is connected with the gating end of the data selector, the other end of the second debugging register is connected with the interface module, and the second debugging register is used for controlling the gating end based on a control instruction of the upper computer so as to enable the target module to work in a debugging mode;
and one end of the third debugging register is connected with the second input end, and the other end of the third debugging register is connected with the interface module and is used for writing debugging data input by a debugging worker through an upper computer into the target module so as to debug the target module.
Further, the target module belongs to a sequential logic circuit in the temperature control circuit.
Further, the target module is a state register of a state machine in the temperature control circuit.
Further, the target module is a parameter register in the temperature control circuit for storing parameters.
Further, the target module belongs to a combinational logic circuit in the temperature control circuit.
Furthermore, the interface module adopts a UART serial port, an IIC interface, an SPI interface, an APB bus interface or an AXI bus interface.
Further, the data selector is a one-out-of-two selector, a one-out-of-three selector or a one-out-of-four selector.
Furthermore, the temperature control chip is an Application Specific Integrated Circuit (ASIC) chip.
In a second aspect, an embodiment of the present specification provides a debugging system, which includes an upper computer and the temperature control chip provided in the first aspect. And the upper computer is connected with an interface module of the temperature control chip. And the upper computer is used for reading the output data of the target module in the temperature control circuit from the first debugging register in the temperature control chip. The upper computer is further used for firstly controlling a second debugging register in the temperature control chip to gate a debugging path of the target module, so that the target module works in a debugging mode, and then controlling a third debugging register in the temperature control chip to input debugging data to the target module, so as to debug the target module.
In a third aspect, embodiments of the present specification provide a 3D printer, including: printer main part, shower nozzle and the temperature control chip that the aforesaid first aspect provided. The shower nozzle set up in on the printer main part for spray the printing material, the control by temperature change chip is used for controlling the temperature of shower nozzle.
The temperature control chip for 3D print head that this specification embodiment provided compares in current control by temperature change chip, has add the debugging circuit in the piece, just so can read the inside debugging information of control by temperature change circuit and set up the inside signal value of circuit through upper computer control interface logic, has improved the observable and the controllability of chip internal signal, makes things convenient for the debugging personnel to debug the control by temperature change circuit of integrated in the piece, satisfies the debugging demand to 3D printer control by temperature change chip.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the specification. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 is a block diagram of a temperature control chip provided in a first aspect of an embodiment of the present disclosure;
FIG. 2 is a schematic circuit diagram of an exemplary temperature control chip provided in an embodiment of the present disclosure;
FIG. 3 is a schematic circuit diagram of another exemplary temperature control chip provided in an embodiment of the present disclosure;
fig. 4 is a system diagram of a debugging system provided in the second aspect of the embodiment of the present specification;
fig. 5 is a schematic structural diagram of a 3D printer provided in the third aspect of the embodiments of the present description.
Detailed Description
In order to better understand the technical solutions provided by the embodiments of the present specification, the technical solutions of the embodiments of the present specification are described in detail below with reference to the drawings and specific embodiments, and it should be understood that the specific features in the embodiments and examples of the present specification are detailed descriptions of the technical solutions of the embodiments of the present specification, and are not limitations on the technical solutions of the embodiments of the present specification, and the technical features in the embodiments and examples of the present specification may be combined with each other without conflict.
In a first aspect, an embodiment of the present specification provides a temperature control chip for a 3D printing nozzle, as shown in fig. 1, the temperature control chip 10 includes: the device comprises a temperature control circuit 11, a debugging circuit 12 and an interface module 13 for connecting an upper computer.
Wherein, temperature control circuit 11 is used for controlling the temperature of 3D printing shower nozzle. In this embodiment, the specific structure of the temperature control circuit 11 may refer to an existing temperature control circuit for a 3D printing head, and will not be described in detail here.
The debug circuit 12 is used to debug the temperature control circuit 11, and specifically may be used to read debug information inside the temperature control circuit and set a signal value inside the circuit. Through set up corresponding debugging circuit 12 in chip inside, improve the observable and the controllability of the inside signal of chip, be favorable to satisfying the debugging demand to 3D printer control by temperature change chip.
In this embodiment, a circuit module to be debugged in the temperature control circuit 11 is referred to as a target module 110, that is, a module in which a debugger needs to read debug information and write a debug signal value off-chip, output data of the target module 110 is the debug information that needs to be read, and input data may be the debug signal value written off-chip, so that the temperature control circuit operates in a debug mode. The target module can be determined according to the debugging requirements of debugging personnel on the temperature control circuit in the actual application scene. It is to be understood that the target module may be one circuit module, or may include a plurality of circuit modules, and when a plurality of circuit modules are included, a corresponding debugging circuit needs to be provided for each circuit module.
Specifically, debug circuitry 12 may include: a first debug register 121, a second debug register 122, a third debug register 123, and a data selector 124.
One end of the first debug register 121 is connected to the output end of the target module 110 in the temperature control circuit 11, and the other end is connected to the interface module 13, and is configured to capture the output data of the target module 110, so as to output the output data to the upper computer through the interface module 13.
Second debug register 122 and third debug register 123 are both connected to target module 110 through data selector 124. The data selector 124 includes a first input terminal i1, a second input terminal i2, a gate terminal c, and an output terminal o. The output o is connected to the input of the target module 110, and the first input i1 is used for inputting the input signal of the target module 110 in the normal operation mode. The pass terminal c is used for selecting the input terminal to be turned on.
One end of the second debugging register 122 is connected to the gate terminal c of the data selector 124, and the other end is connected to the interface module 13 of the chip, and is configured to control the gate terminal c based on a control instruction of the upper computer, so that the target module 110 operates in a debugging mode.
One end of the third debug register 123 is connected to the second input terminal i2 of the data selector 124, and the other end is connected to the interface module 13 of the chip. The third debugging register 123 is used to write the debugging data input by the debugging personnel through the upper computer into the target module 110, so as to debug the target module 110.
In this embodiment, the data selector (MUX) may be an alternative selector, a three-alternative selector, or a four-alternative selector. The two-select-one means that one of the two input terminals is selected to be conducted, the three-select-one means that one of the three input terminals is selected to be conducted, and the four-select-one means that one of the four input terminals is selected to be conducted. The specific data selector is determined according to the number of debugging channels required in an actual application scene. For example, if a debug channel is required, an alternative selector may be used; if two debugging channels are needed, a one-out-of-three selector is adopted, and the selector comprises two second input ends which are respectively connected with a third debugging register; if three debugging channels are needed, a one-out-of-four selector is adopted, and at the moment, the selector comprises three second input ends which are respectively connected with a third debugging register.
The description is given by taking a scene of adopting an alternative selector as an example, namely if a channel 0 is selected, a normal working channel is gated, and a target module works in a normal working mode; if the channel 1 is selected, namely the gating debugging channel, the target module works in a debugging mode, and the target module receives debugging data written by a debugging person through the third debugging register and completes the numerical value writing into the internal circuit of the chip.
And the interface module is an interface between the on-chip debugging logic and the off-chip. The external interface of the chip can be a UART serial port, an IIC interface, an SPI interface, an APB bus interface or an AXI bus interface and the like. It should be noted that the interface control logic does not need extra special design, and it can directly borrow the existing external interface circuit module in the temperature control chip before adding the debug circuit, so as to reduce the circuit scale and save the area resource.
In this embodiment, the host computer can be a computer, and can also be an MCU, a DSP, etc., and the debugging personnel interacts with the debugging circuit through the host computer.
It should be understood that, for convenience of describing the technical solution provided in this embodiment, the temperature control circuit may be represented by a general circuit structure of a finite state machine, and the temperature control circuit is divided into a combinational logic circuit and a sequential logic circuit.
In an alternative embodiment, as shown in FIG. 2, the target module may belong to sequential logic in a temperature control circuit. For example, a state register of a state machine in the temperature control circuit may be used as the target module, and/or a parameter register for storing a parameter in the temperature control circuit may be used as the target module. The temperature control chip obtained in this way can meet the debugging requirements of debugging personnel on some sequential logic circuits in the temperature control circuit.
For example, the debugging register 1 in fig. 2 is the first debugging register, and can capture the register output value of the state machine, capture the state value of the state machine off-chip, and allow a debugging person to check the state value, so as to improve observability of the internal circuit of the temperature control chip.
The debugging register 2 in fig. 2 is the third debugging register, and can store the injection value of the state variable, and a debugger can force the register node of the internal circuit of the temperature control chip to be a designated value through the register, so as to improve the controllability of the in-chip circuit.
The debug register 3 in fig. 2 is the second debug register, which is used to control the selection input terminal of the data selector, and when it selects channel 0, the state machine works in the normal operating mode; when it selects channel 1, the state register of the state machine will receive the injection value written from debugging register 2 by the debugging personnel, and complete the value writing into the chip internal circuit.
Taking a scenario in which a parameter register for storing a parameter is used as a target module as an example, the output data of the parameter register may be read through the first debug register, for example, the output data may include a target temperature value that is expected to be reached, and when a debugger needs to check some parameters stored in the parameter register, the corresponding value in the first debug register may be directly captured through the upper computer control interface logic. Moreover, when some parameters stored in the parameter register may further need to be set, a debugger may select a debug path of the data selector through the upper computer control interface logic, and then write a new data value into the parameter register through the third debug register, for example, the target temperature value may be forcibly set to a target value different from the normal operating mode.
Taking a scenario in which a state register of a state machine is used as a target module as an example, the output state of the state register can be read through a first debugging register, and when a debugging worker needs to check the output state of the state register, the corresponding value in the first debugging register can be directly captured through the upper computer control interface logic. If the captured state data is monitored to find that the state machine has an illegal state, the debugging path of the data selector is selected first through the upper computer control interface logic, and then a new data value is written into the state register through the third debugging register to reset the state register.
In an alternative embodiment, as shown in FIG. 3, the target module may belong to a combinational logic circuit in the temperature control circuit. For example, a temperature control algorithm module included in the temperature control circuit may be used as the target module. It should be understood that the temperature control algorithm module is a hardware circuit module, and may include an adder, a multiplier, etc. The temperature control chip obtained in this way can meet the debugging requirements of debugging personnel on some combinational logic circuits in the temperature control circuit.
For example, the debug register 1 in fig. 3 is the third debug register, and is used to force the input end of the combinational logic to a specific value, so as to improve the controllability of the on-chip circuit.
The debug register 2 in fig. 3 is the second debug register, and is used to control the gating end of the data selector, and when the value is 0, the combinational logic works in the normal operating mode, and when the value is 1, the combinational logic works in the debug mode.
The debugging register 3 in fig. 3 is the first debugging register, and is used to capture the output logic value of the combinational logic for the debugging personnel to check, so as to improve the observability of the internal circuit of the temperature control chip.
It should be noted that the interface module shown in fig. 3 is exemplified by a UART controller.
Taking the temperature control algorithm module as an example of a target module, the output value of the temperature control algorithm module can be read through the first debugging register, and when a debugging worker needs to check the output value of the temperature control algorithm module, the corresponding value in the first debugging register can be directly captured through the upper computer control interface logic. For example, the output value is a temperature control amount for making the actual temperature of the 3D printer head coincide with a target temperature value. Furthermore, a debugger can select a debugging path of the data selector through the upper computer control interface logic to enable the temperature control algorithm module to work in a debugging mode, and then write a new input data value into the temperature control algorithm module through the third debugging register to debug the temperature control algorithm module.
In an alternative embodiment, the temperature control chip may be an ASIC (Application Specific Integrated Circuit). Of course, in other embodiments of the present disclosure, the temperature control chip may be other integrated circuit chips.
To sum up, the temperature control chip for 3D print head that this specification embodiment provided compares in current temperature control chip, has add the debugging circuit in the piece, just so can read the inside debugging information of temperature control circuit and set up the inside signal value of circuit through upper computer control interface logic, has improved the observable and the controllability of chip internal signal, makes things convenient for the debugging personnel to debug the temperature control circuit of integration in the piece, satisfies the debugging demand to 3D printer temperature control chip.
In a second aspect, an embodiment of the present specification further provides a debugging system, which is used for debugging the temperature control chip provided in the first aspect. As shown in fig. 4, the debugging system includes an upper computer 42 and a temperature control chip 41.
The implementation principle and the generated technical effects of the temperature control chip 41 provided by the first aspect are the same as those of the embodiment provided by the first aspect, and reference may be made to the corresponding contents in the embodiment provided by the first aspect.
The upper computer 42 is connected with the interface module of the temperature control chip 41. The upper computer is used for reading the output data of the target module in the temperature control circuit from the first debugging register in the temperature control chip.
In addition, the upper computer 42 is further configured to control a second debugging register in the temperature control chip to gate a debugging path of the target module, so that the target module operates in a debugging mode, and then control a third debugging register in the temperature control chip to input debugging data to the target module, so as to debug the target module.
It should be noted that, the implementation principle and the resulting technical effects of the debugging system provided by the embodiments of the present specification have been described in detail in the embodiments provided by the foregoing first aspect, and specific reference may be made to corresponding contents in the embodiments provided by the foregoing first aspect.
In a third aspect, embodiments of the present specification further provide a 3D printer. As shown in fig. 5, the 3D printer 50 includes: a printer body 51, a head 52, and a temperature control chip 53.
The printer main body 51 is similar to the conventional 3D printer, and may include a housing, a sample stage, a moving mechanism for driving the nozzle to move, and the like, which are not described in detail herein. The head 52 is provided on the printer main body 51 and ejects a printing material.
The temperature control chip 53 is the temperature control chip provided in the foregoing first aspect, and is configured to control the temperature of the nozzle 52, so as to make the viscosity of the printing material meet the requirement of the printing process, specifically, the temperature control chip provided in the foregoing first aspect is used, the implementation principle and the generated technical effect of the temperature control chip are the same as those of the embodiment provided in the foregoing first aspect, and reference may be made to corresponding contents in the embodiment provided in the foregoing first aspect.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
In the embodiments provided in the present application, it should be understood that the disclosed system and apparatus may be implemented in other ways. The apparatus embodiments described above are merely illustrative, and each block of the block diagrams, and combinations of blocks in the block diagrams, can be implemented by special purpose hardware-based systems that perform the specified functions or acts. In addition, the functional modules in the embodiments of the present invention may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.
In this document, relational terms such as first, second, third, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element. The term "plurality" includes two or more.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present disclosure, and all such changes or substitutions are included in the scope of the present disclosure. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a temperature control chip for 3D prints shower nozzle, its characterized in that, includes temperature control circuit, debugging circuit and is used for connecting the interface module of host computer, wherein, the temperature control circuit is used for control the temperature of shower nozzle, the debugging circuit is used for right the temperature control circuit debugs, the debugging circuit includes:
one end of the first debugging register is connected with the output end of a target module in the temperature control circuit, and the other end of the first debugging register is connected with the interface module and used for capturing output data of the target module so as to output the output data to the upper computer through the interface module;
the data selector comprises a first input end, a second input end, a gating end and an output end, wherein the output end of the data selector is connected with the input end of the target module, and the first input end is used for inputting an input signal of the target module in a normal working mode;
one end of the second debugging register is connected with the gating end of the data selector, the other end of the second debugging register is connected with the interface module, and the second debugging register is used for controlling the gating end based on a control instruction of the upper computer so as to enable the target module to work in a debugging mode;
and one end of the third debugging register is connected with the second input end, and the other end of the third debugging register is connected with the interface module and is used for writing debugging data input by a debugging worker through an upper computer into the target module so as to debug the target module.
2. The temperature control chip of claim 1, wherein the target module belongs to a sequential logic circuit in the temperature control circuit.
3. The temperature control chip of claim 2, wherein the target module is a state register of a state machine in the temperature control circuit.
4. The temperature control chip of claim 2, wherein the target module is a parameter register in the temperature control circuit for storing a parameter.
5. The temperature-controlled chip of claim 1, wherein the target module belongs to a combinational logic circuit in the temperature-controlled circuit.
6. The temperature control chip according to claim 1, wherein the interface module employs a UART serial port, an IIC interface, an SPI interface, an APB bus interface, or an AXI bus interface.
7. The temperature control chip of claim 1, wherein the data selector is one-out-of-two selector, one-out-of-three selector, or one-out-of-four selector.
8. The temperature-controlled chip of claim 1, wherein the temperature-controlled chip is an application-specific integrated circuit (ASIC) chip.
9. A debugging system, comprising a host computer and the temperature control chip of any one of claims 1-8,
the upper computer is connected with an interface module of the temperature control chip,
the upper computer is used for reading output data of a target module in the temperature control circuit from a first debugging register in the temperature control chip;
the upper computer is further used for firstly controlling a second debugging register in the temperature control chip to gate a debugging path of the target module, so that the target module works in a debugging mode, and then controlling a third debugging register in the temperature control chip to input debugging data to the target module, so as to debug the target module.
10. A3D printer, comprising: the printer comprises a printer body, a spray head and the temperature control chip of any one of claims 1 to 8, wherein the spray head is arranged on the printer body and used for spraying printing materials, and the temperature control chip is used for controlling the temperature of the spray head.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011121267.8A CN112519234B (en) | 2020-10-19 | 2020-10-19 | Temperature control chip for 3D printing nozzle, debugging system and 3D printer |
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| CN202011121267.8A CN112519234B (en) | 2020-10-19 | 2020-10-19 | Temperature control chip for 3D printing nozzle, debugging system and 3D printer |
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| CN112519234B CN112519234B (en) | 2022-07-01 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113238941A (en) * | 2021-05-12 | 2021-08-10 | 展讯通信（上海）有限公司 | Development debugging system, method, device and medium |
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