CN112517349B - Packaging equipment and packaging method for air-sensitive two-dimensional material device - Google Patents
Packaging equipment and packaging method for air-sensitive two-dimensional material device Download PDFInfo
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- CN112517349B CN112517349B CN202011404712.1A CN202011404712A CN112517349B CN 112517349 B CN112517349 B CN 112517349B CN 202011404712 A CN202011404712 A CN 202011404712A CN 112517349 B CN112517349 B CN 112517349B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0486—Operating the coating or treatment in a controlled atmosphere
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
Abstract
The invention discloses packaging equipment and a packaging method for an air-sensitive two-dimensional material device, and belongs to the field of two-dimensional material packaging and measuring. The packaging method using the equipment is characterized in that the two-dimensional material device is packaged in a closed space formed by a base, a cover glass and packaging glue with the thickness higher than that of the two-dimensional material device in an inert gas environment, the air-sensitive two-dimensional material device is packaged by the method, the problem of track hybridization easily generated when the two-dimensional material to be tested is packaged by respectively stacking a layer of graphene or boron nitride on the upper side and the lower side of the two-dimensional material to be tested is solved, the material is protected from or less influenced by the external environment, meanwhile, the equipment is used for carrying out twice Raman tests, the influence of the cover glass is eliminated, and a safe and stable environment is provided for the subsequent research and test of the air-sensitive two-dimensional material device.
Description
Technical Field
The invention belongs to the field of two-dimensional material sealing and testing, and particularly relates to packaging equipment and a packaging method of an air-sensitive two-dimensional material device, which can realize efficient packaging, testing and protection of a two-dimensional material semiconductor device.
Background
Since the discovery of graphene in 2004, the search for other novel two-dimensional crystalline materials has been the leading edge of the two-dimensional material research field. Just like graphene, other large-size high-quality two-dimensional crystals are very important for exploring new physical phenomena and performances under two-dimensional limit, and have a plurality of novel applications in the fields of electronics, photoelectrons and the like. In recent years, two-dimensional materials such as two-dimensional hexagonal boron nitride, transition metal sulfides, oxides, black phosphorus and the like are prepared besides graphene, and the performance and application of the two-dimensional materials are greatly expanded.
The discovery and preparation of graphene and the rest of two-dimensional materials open the chapter of researching and applying novel two-dimensional materials. In these explorations and studies, the preparation of two-dimensional materials is a very important part. Aiming at the requirements of high performance, multiple functions, high reliability and the like of two-dimensional materials, electronic products and the like which need to be researched by people, the packaging operation flow needs to be better, faster and thinner, and the packaging operation of the two-dimensional materials also needs to consider the air sensitivity of the two-dimensional materials, for example, the chemical properties of the two-dimensional materials are generally unstable, halogen compounds, transition metal sulfur/oxides, black phosphorus and the like are easy to react with water and oxygen in the air to be polluted, and the like. And the working environment of the low-dimensional quantum device has severe requirements on temperature, humidity, aerosol particle concentration and the like.
In a conventional two-dimensional material packaging method, a layer of graphene or boron nitride is stacked on and under a two-dimensional material to be tested to isolate air. Such packaging methods can affect the results of optical and electrical transport tests. The way of overlapping other two-dimensional materials (such as graphene, boron nitride, etc.) up and down can affect the results of the optical test and the electric transport test of the two-dimensional material to be tested. Taking a monolayer of molybdenum disulfide as an example, orbital hybridization occurs when it is encapsulated by hexagonal boron nitride on top of each other and is subjected to van der waals forces from the hexagonal boron nitride. This makes the molybdenum disulfide after the encapsulation change from direct band gap to indirect band gap, is unfavorable for two-dimensional material's further research.
Disclosure of Invention
1. Problems to be solved
The invention provides packaging equipment and a packaging method for an air-sensitive two-dimensional material device, aiming at the problem that track hybridization is easily generated when a layer of graphene or boron nitride is respectively stacked on the upper side and the lower side of a two-dimensional material to be tested for packaging.
2. Technical scheme
In order to solve the problems, the technical scheme adopted by the invention is as follows:
a packaging method of an air-sensitive two-dimensional material device is characterized in that the two-dimensional material device is packaged in a closed space formed by a base, a cover glass and packaging glue with the thickness higher than that of the two-dimensional material device under the inert gas environment, wherein the base and the packaging glue are made of electromagnetic shielding materials.
Further, the packaging adhesive contains graphene powder.
Further, the graphene powder accounts for 10-15% of the volume fraction of the packaging adhesive.
Further, the base is selected from a metal-based copper-clad plate or a permalloy-sprayed ceramic plate.
Further, the height at which the coverslip is located is determined by the raman peak: when the Raman peaks of the sample are overlapped, the height of the cover slip is changed to stagger the Raman peaks of the sample and the cover slip.
Further, the height of the encapsulating adhesive is determined by the height of the cover glass.
The invention also provides packaging equipment for realizing the air sensitivity two-dimensional material device of the packaging method, which comprises a glue supply device, a fixing device and an operating device, wherein the glue supply device, the fixing device and the operating device are arranged in the integrated cavity; the operating device is used for controlling the glue feeding device to move.
Further, the packaging device also comprises a Raman spectrometer arranged inside the integrated cavity.
Further, the packaging apparatus further comprises a suction cup device for moving the cover glass. The sucking disc device comprises a sucking disc needle tube and a sucking disc, and the sucking disc needle tube is fixed on the support.
Furthermore, the operating device is a numerical control linear guide rail linear sliding table module consisting of a precise stepping cross motor and a ball screw guide rail, and can write G codes to accurately control the movement of the sliding table.
Furthermore, the glue feeding device comprises a glue spraying needle tube, an air pump and an air flow controller, wherein the air pump is connected with the glue spraying needle tube, the air pump extrudes the packaging glue by applying air pressure, and the glue spraying needle tube is fixed on the support.
Further, the movement of the sliding table, the bracket, the sucking disc needle tube and the glue spraying needle tube is controlled by a G code, and the G code is programmed according to the size, the relative position and the process setting of each component of the packaging system.
Further, the air pump is controlled by a program, the glue is pressurized and sprayed when the dispensing needle tube moves to a specified height and position, then the sucker needle tube moves to the cover glass groove where the cover glass is located, the cover glass is sucked up by using negative pressure generated by air suction of the air pump and moves to a glue dispensing area, and the cover glass is suspended above the two-dimensional material and contacts with glue solution until the glue solution is solidified, and packaging is completed.
Further, the fixing device comprises a substrate fixed inside the packaging device, and the substrate is used for placing the sample base and the cover slip.
The working principle of the equipment is as follows: firstly, vacuumizing an integrated cavity, erecting a Raman spectrometer right above a two-dimensional material, detecting a Raman peak of an air-sensitive two-dimensional material device arranged on a base by using the Raman spectrometer, measuring Raman scattering (first test) of the air-sensitive two-dimensional material device before a packaging step, outputting data, then filling inert gas into the integrated cavity, absorbing a cover glass sheet made of a transparent material by using a sucking disc device, hovering the cover glass sheet above the material, testing the Raman spectrum again, and determining the height of the cover glass sheet by using the Raman peak: when the Raman peaks of the sample are overlapped, the height of the cover slip is changed to stagger the Raman peaks of the sample and the cover slip so as to ensure that the cover slip does not influence the Raman peak of the air-sensitive two-dimensional material device, thereby eliminating influence. The operating device controls a glue dispensing needle tube of the glue feeding device to dispense glue on the edge of the base around the air-sensitive two-dimensional material device, the height of the glue dispensing is determined according to the height of the cover glass and is higher than the thickness of the air-sensitive two-dimensional material device, the glue is not contacted with the air-sensitive two-dimensional material device, and finally the cover glass sucked by the sucking disc is placed on the packaging glue for sealing, so that the packaging is completed.
The integrated cavity provides a packaging environment, an operator can vacuumize the cavity or add specific gas into the cavity, and the operating device, the glue feeding device and the fixing device are all arranged in the integrated cavity. In order to further prevent the fragile two-dimensional material device from being subjected to electromagnetic interference in the environment, the parts used for packaging in the invention, namely the sample base and the packaging adhesive, can be all made of electromagnetic shielding materials.
Preferably, the sample base is made of a metal-based copper-clad plate or a permalloy-sprayed ceramic sheet, the cover sealing glass is made of a transparent material, and laminated graphene powder with the volume fraction of 10 wt% is added into AB glue for packaging (the graphene powder has an electrostatic shielding effect).
3. Advantageous effects
Compared with the prior art, the invention has the beneficial effects that:
(1) according to the method, the air-sensitive two-dimensional material device is packaged in the enclosed space formed by the base, the cover glass and the packaging glue with the thickness higher than that of the two-dimensional material device in the inert gas environment, so that the problem that the traditional method is easy to generate track hybridization when the two-dimensional material to be tested is packaged by respectively stacking one layer of graphene or boron nitride on the upper side and the lower side is solved, a safe and stable environment is provided for the subsequent research and test of the air-sensitive two-dimensional material device, and the material is protected from or less influenced by the external environment;
(2) because the external electromagnetic interference can seriously threaten the stability of the two-dimensional material device, under a stronger radio frequency electric field, electronic equipment is easy to overload and damage, and a semiconductor device can be punctured, internally short-circuited or damaged by heating, the invention further adopts a base material with an electromagnetic shielding function and the packaging adhesive containing the graphene powder, so that the two-dimensional material device can effectively avoid the electromagnetic interference with complex external environment, and the two-dimensional material device is protected from being punctured and burnt by complex electromagnetic waves in the environment; the electromagnetic shielding sample base and the cover sealing glass are used for packaging, so that the upper and lower overlapping of other two-dimensional material compounds on a sample to be tested is avoided, and the reliability of the optical test and electric transport test results of the sample is ensured;
(3) the integrated cavity is vacuumized, so that Raman scattering light waves can be conveniently measured on the two-dimensional material; then, inert gas is used for filling the integrated cavity, so that a good protective gas environment is provided for packaging operation; this protects the two-dimensional material from oxygen and water contamination; in addition, the air pressure in the cavity is stabilized to be as high as 101 kilopascals by filling the inert gas, and the air pump controls the suction disc and the needle tube to reduce the pressure and absorb the air;
(4) according to the packaging equipment, the G-code controlled sliding table module is adopted to accurately control the dispensing path and the sealing cover height, so that the incompleteness and instability of manual operation are avoided; the real-time data fed back by the pressure sensor can clearly reflect the pressed condition of the cover glass, so that an operator can easily grasp the height of the cover glass and adjust the height to a proper value; the design not only improves the packaging efficiency, but also is beneficial to the accuracy of the performance test result of the two-dimensional material;
(5) the invention designs a process of spraying glue for a circle on the periphery (in a rectangular shape or other shapes) of a two-dimensional material block on a sample base and suspending a cover sealing glass slide to be in contact with the glue solution, so that the cover sealing glass slide is in full contact with the glue solution, and after the cover sealing glass slide is solidified by gelling, a seamless, air hole and other leakage packaging structures are formed.
Drawings
FIG. 1 is an assembly view of an automatic packaging apparatus for air-sensitive two-dimensional material devices according to the present invention;
FIG. 2 is a top view and a front view of a sample base during dispensing;
in the figure: 1. a sample base; 2. sealing a cover glass; 3. a substrate; 4. a support; 5. a sucker needle tube; 6. dispensing needle tubes; 7. an air pump; 8. a computer; 9. packaging the system platform; 10. a guide rail X axis; 11. a guide rail Y axis; 12. a guide rail Z axis; 13. an airflow controller; 14. a guide rail sliding table module control panel; 15. an integrated cavity; 16. a pressure sensor; 17. a Raman spectrometer.
Detailed Description
It will be understood that when an element is referred to as being "mounted on" another element, it can be directly on the other element or the two elements can be directly connected together; when an element is referred to as being "connected" to another element, it can be directly connected to the other element or the two elements may be directly integrated. In addition, the terms "upper", "lower", "left", "right" and "middle" used in the present specification are for clarity of description, and are not intended to limit the scope of the present invention, and the relative relationship between the terms and the relative positions may be changed or adjusted without substantial technical changes.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; as used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
As used herein, the term "about" is used to provide the flexibility and inaccuracy associated with a given term, measure or value. The degree of flexibility for a particular variable can be readily determined by one skilled in the art.
The invention is further described with reference to specific examples.
Example 1
Equipment structure and connected mode:
the embodiment provides packaging equipment of an air-sensitive two-dimensional material device, which comprises a glue feeding device, a fixing device and an operating device, wherein the glue feeding device, the fixing device and the operating device are arranged in an integrated cavity; the Raman spectrometer is arranged in the packaging equipment, the operating device is used for controlling the glue feeding device to move, and the assembled Raman spectrometer is arranged in the integrated cavity.
The fixture comprises a base 3 fixed inside the encapsulation device for placing the sample base 1 and the cover slip 2. The operating device is a numerical control linear guide rail linear sliding table module consisting of a precise stepping cross motor and a ball screw guide rail, and can compile G codes to precisely control the movement of the sliding table. The glue feeding device comprises a glue dispensing needle tube 6, an air pump 7 and an air flow controller 13 are connected with the glue dispensing needle tube 6, the air pump 7 extrudes packaging glue by applying air pressure, and the glue dispensing needle tube 6 is fixed on the support 4.
The apparatus further comprises suction cup means for moving the coverslip 2. The sucking disc device comprises a sucking disc needle tube 5 and a sucking disc, and the sucking disc needle tube 5 is fixed on the support 4. The air pump 7 and the airflow controller 13 can pressurize and glue the sample base 1 while sucking the cover glass 2 by negative pressure generated by air suction, and then move the cover glass 2 to fall on the upper end of the packaging adhesive to complete packaging after glue dispensing.
The movement of the sliding table, the bracket 4, the sucking disc needle tube 5 and the dispensing needle tube 6 is controlled by a G code which is programmed according to the size, the relative position and the process setting of each component of the packaging equipment.
The air pump 7 is controlled by a program, when the dispensing needle tube 6 moves to a designated height and position, the packaging glue is pressurized and sprayed, then the sucker needle tube 5 moves to the cover glass 2 groove where the cover glass 2 is located, the cover glass 2 is sucked up by using the negative pressure generated by air suction of the air pump 7 and moves to a dispensing area, and the cover glass is suspended above the two-dimensional material and contacts with the glue solution until the glue solution is solidified, and the packaging is completed.
As shown in fig. 1, the operating device is a numerical control linear guide rail linear sliding table module consisting of a precise stepping cross motor and three ball screw guide rails. The three ball screw guide rails are orthogonally combined in pairs and respectively used as an X axis 10, a Y axis 11 and a Z axis 12. The slider is mounted on the Y-axis 11 and is connected to the carriage 4. The precise stepping cross motor is arranged on the Z-axis 12 guide rail and drives the three guide rails and the slide block to move.
The glue feeding device is a glue dispensing needle tube 6 and an air pump 7 and an air flow controller 13 connected with the glue dispensing needle tube. The operation of the air pump 7 is controlled by a short-circuit current inputted from the control panel 14. The air flow output by the air pump 7 is firstly led into the air flow controller 13, converted into air flow with proper pressure intensity and then communicated with the dispensing needle tube 6 or the sucking disc needle tube 5. The air pump 7 can inject air into the dispensing needle tube 6 to make the air pressure in the tube larger than the outside, thereby spraying glue. The air pump 7 can also suck air from the sucker needle tube 5 to make the air pressure in the tube smaller than the outside so as to suck the cover glass 2.
The fixture includes a base 3 secured to a platform 9 of the packaging system. The base 3 is designed with screw holes and is fastened by screws to the platform 9 of the packaging system, which also has screw holes. The substrate 3 is located at the right edge of the packaging system platform. Two grooves are provided in the base to position a correspondingly sized sample base 1 and cover slip 2 along the platform edge. The bracket 4 is connected on the sliding table and moves synchronously with the sliding table. A sliding table loaded on a Y shaft 11 of a module guide rail is connected with a support 4 for fixing a needle tube, a dispensing needle tube 6 and a sucking disc needle tube 5 are inserted into two circular through holes which are arranged in parallel and have a distance of five centimeters and are arranged on the support 4, and the dispensing needle tube 6 is flush with a sucking disc on the right side of the sucking disc needle tube 5. The dispensing needle tube 6 is positioned at a proper distance on the right side of the sucking disc needle tube 5, so that the sucking disc is higher than the packaging system platform 9 in the dispensing process, and the dispensing needle tube 6 is suspended outside the packaging system platform 9 in the processes of adsorbing and moving the cover glass 2, and the two are not interfered with each other. A certain amount of AB glue is injected into the glue dispensing needle tube 6, and the inside of the sucking disc needle tube 5 is empty. The two needle tubes are communicated with the air pump 7 through an airflow controller 13. The pressure sensor 16 is fixed on the bracket 4, and data is output to the computer 8 outside the cavity.
The Raman spectrometer 17 is erected right above the two-dimensional material, can emit laser to the two-dimensional material and collect scattering spectra, and outputs data such as Raman peaks to the computer 8 outside the cavity.
The packaging method of the air-sensitive two-dimensional material device by adopting the equipment comprises the steps of packaging the two-dimensional material device in a sealed space formed by a sample base 1, a cover glass 2 and packaging glue with the thickness higher than that of the two-dimensional material device in an inert gas environment; wherein, the sample base 1 and the packaging adhesive both adopt electromagnetic shielding materials.
The working principle of the equipment is as follows: firstly, vacuumizing an integrated cavity 15, erecting a Raman spectrometer right above a two-dimensional material, detecting a Raman peak of an air-sensitive two-dimensional material device arranged on a sample base 1 by using the Raman spectrometer, measuring Raman scattering of the air-sensitive two-dimensional material device before a packaging step and outputting data, then filling inert gas into the integrated cavity 15, absorbing a cover glass 2 made of a transparent material by using a sucking disc device, hovering the cover glass 2 above the material, and testing the Raman spectrum again; the height at which the coverslip 2 is located is determined by the raman peak: when the Raman peaks of the sample are overlapped, the height of the cover slip 2 is changed to stagger the Raman peaks of the sample and the cover slip 2, and the Raman peak of the air-sensitive two-dimensional material device is determined not to be influenced by the cover slip 2, so that influence is eliminated. The operating device controls a glue dispensing needle tube 6 of the glue feeding device to perform point glue packaging on the edge of the sample base 1 around the air-sensitive two-dimensional material device, the height of the glue dispensing is determined by the height of the cover glass 2 and is higher than the thickness of the air-sensitive two-dimensional material device, the glue is not in contact with the air-sensitive two-dimensional material device, and finally the cover glass 2 sucked by the sucking disc is placed on the packaging glue for sealing to complete the packaging of the air-sensitive two-dimensional material device.
The air-sensitive two-dimensional material device is packaged in a closed space formed by the sample base 1, the cover glass 2 and packaging glue with the thickness higher than that of the two-dimensional material device by adopting the equipment in the embodiment under the inert gas environment, so that the problem that the conventional method for packaging the air-sensitive two-dimensional material device easily generates track hybridization when the two-dimensional material to be tested is respectively stacked with one layer of graphene or boron nitride on the upper side and the lower side is solved, a safe and stable environment is provided for the subsequent research and test of the air-sensitive two-dimensional material device, and the material is protected from or is less influenced by the external environment;
in addition, the base material with the electromagnetic shielding function and the packaging adhesive containing the graphene powder are adopted, so that the two-dimensional material device can effectively avoid the electromagnetic interference of the complex external environment, and the two-dimensional material device is protected from the breakdown and the burning-out of the complex electromagnetic waves in the environment; the electromagnetic shielding sample base 1 and the cover glass 2 are used for packaging, so that the upper and lower overlapping of other two-dimensional material compounds on a sample to be tested is avoided, and the reliability of the optical test and electric transportation test results of the sample is ensured.
It should be noted that the raman spectrometer 17 may be directly built into the integrated cavity 15, or only the probe of the raman spectrometer 17 may be built into the integrated cavity 15.
Each part of the packaging equipment of the embodiment is small in size and convenient to integrate. The operation, fixing and glue supply device and the Raman spectrometer are all arranged in the integrated cavity, the integrated cavity is vacuumized in the Raman test process, and inert gas is filled for protection in the processes of glue dispensing and cover sealing, so that the adsorption and pollution of oxygen, water and the like in the air on the surface of the two-dimensional material are reduced to the maximum extent.
Example 2
The method for packaging the air-sensitive two-dimensional material device in this embodiment is performed by using the air-sensitive two-dimensional material device packaging apparatus in embodiment 1.
The substrate 3 is fixed on the right edge of the platform 9 of the packaging system, so that the two steps of dispensing and sealing are conveniently matched and connected.
The bracket 4 is provided with two circular grooves for fixing the dispensing needle tube 6 and the sucking disc needle tube 5 and is fixed on the numerical control mechanical arm of the packaging system through screws. The dispensing needle tube 6 is arranged at the right side of the sucking disc needle tube 5 with a distance of five centimeters. When the dispensing needle tube 6 dispenses (encapsulates) glue on the sample base 1, the sucking disc needle tube 6 hangs outside the substrate 3; when the sucker needle tube 6 sucks up the cover glass 2 and hovers above the two-dimensional material, the dispensing needle tube 6 is suspended outside the platform 9 of the packaging system, and the two do not interfere with each other.
The sample base 1 of the embodiment adopts a lead-based copper-clad plate, and can also adopt a ceramic plate with a permalloy coating as the sample base 1 for containing two-dimensional materials. The cover glass 2 is a transparent glass slide.
Preparing AB glue solution (the other glue solution meeting the conditions can be also available), wherein the weight percentage of the glue A is 20 percent, and the weight percentage of the glue B is 80 percent. After the mixing is finished, 10 wt% of layered graphene powder is added into the glue solution and is uniformly mixed (10-15 wt% of the layered graphene powder can be used), and the thickness of the glue solution (packaging glue) is higher than that of the two-dimensional material when the glue is dripped.
G codes for controlling the movement of the mechanical arm are compiled, and the short-circuit current for pressurizing dispensing by the air pump 7 is controlled, so that the system automatically realizes the dispensing and packaging processes. The distance of the robot arm movement is matched to the position and structural dimensions of the substrate 3, the support 4 and the packaging system platform 9. Before the dispensing step is started, the manipulator is moved away from the area above the sample base 1 so that the raman instrument 17 mounted above measures the raman scattering of the two-dimensional material and determines the height of the cover slip 2. The start and the end of the dispensing by the air pump 7 are realized by the generation and the termination of the short-circuit current. The short circuit current is input into the airflow controller 13 of the air pump 7, and the time interval of the short circuit current is matched with that of the dispensing needle tube 6 which descends to a specific height and is surrounded by a rectangle. When the sucker needle tube 6 contacts the cover glass 2, short-circuit current is input into the air pump 7 to reduce the pressure in the needle tube, so that negative pressure is generated at the sucker opening to suck the cover glass 2. The robotic arm carries the coverslip 2 to a specified height above the two-dimensional material for hovering. The cover glass 2 is brought into full contact with the glue solution without touching the two-dimensional material. The cover glass 2 remains suspended until the AB glue solidifies.
The whole set of equipment is placed in a temperature-constant integrated chamber 15. Before the dispensing step is started, air in the integrated cavity 15 is firstly pumped out, and oxygen and water molecules are basically removed. And then starting the Raman spectrometer 17 to test Raman scattering of the two-dimensional material and output data. After the raman test, the cover slip 2 is moved by using the suction cup as described above, the cover slip 2 is suspended above the sample, the inert gas helium is filled into the integration cavity 15, the air pressure in the integration cavity 15 is maintained at 101 kpa, and then the raman spectrum is measured again. Then, the above dispensing and capping steps are sequentially performed, and the capped sample is as shown in fig. 2.
The height at which the cover slip 2 is located is determined by the raman peak. When the sample is tested for the first time, a Raman peak value appears on the sample, when the sample is measured again after the cover glass slide 2 is placed, the Raman peak of the sample and the Raman peak of the cover glass slide 2 are detected simultaneously, and when the Raman peaks of the sample and the Raman peak of the cover glass slide are overlapped, the height of the cover glass slide 2 is changed, so that the Raman peaks of the sample and the Raman peak of the cover glass are staggered.
The above description is illustrative of the present invention and its embodiments, and is not to be construed as limiting, and the embodiments and figures shown in the drawings are illustrative of the invention and are not intended to limit the invention. Therefore, if the person skilled in the art receives the teaching, without departing from the spirit of the invention, the person skilled in the art shall not inventively design the similar structural modes and embodiments to the technical solution, but shall fall within the scope of the invention.
Claims (6)
1. A packaging method of an air-sensitive two-dimensional material device is characterized in that the two-dimensional material device is packaged in a closed space formed by a base, a cover glass and packaging glue with the thickness higher than that of the two-dimensional material device under the inert gas environment, wherein the base and the packaging glue are made of electromagnetic shielding materials;
the packaging adhesive contains graphene powder;
the graphene powder accounts for 10-15% of the volume fraction of the packaging adhesive;
the base is selected from a metal-based copper-clad plate or a ceramic plate sprayed with permalloy;
the height at which the coverslip is located is determined by the raman peak: when the Raman peaks of the sample are overlapped, the height of the cover slip is changed to stagger the Raman peaks of the sample and the cover slip.
2. The method of claim 1, wherein the height of the encapsulating glue is determined by the height of the cover glass.
3. An encapsulation device for realizing the air-sensitive two-dimensional material device of the encapsulation method of any one of claims 1-2, which is characterized by comprising a glue feeding device, a fixing device and an operating device which are arranged in an integrated cavity; the operating device is used for controlling the glue feeding device to move.
4. The packaging apparatus of the air-sensitive two-dimensional material device of claim 3, further comprising a Raman spectrometer disposed inside the integrated cavity.
5. The packaging apparatus of air-sensitive two-dimensional material devices of claim 4, further comprising a suction cup device for moving a cover slip.
6. The packaging equipment of the air-sensitive two-dimensional material device according to claim 5, wherein the operating device is a numerical control linear guide rail linear sliding table module consisting of a precise stepping cross motor and a ball screw guide rail, and G codes can be programmed to precisely control the movement of the sliding table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011404712.1A CN112517349B (en) | 2020-12-03 | 2020-12-03 | Packaging equipment and packaging method for air-sensitive two-dimensional material device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011404712.1A CN112517349B (en) | 2020-12-03 | 2020-12-03 | Packaging equipment and packaging method for air-sensitive two-dimensional material device |
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| CN1555100A (en) * | 2003-12-25 | 2004-12-15 | 上海交通大学 | Glue coating package integrated robot of super thin space solar cell sheet |
| CN201233894Y (en) * | 2008-07-11 | 2009-05-06 | 常州亚玛顿光伏玻璃有限公司 | Glass board for solar energy cell assembly encapsulation |
| CN101593782A (en) * | 2008-05-26 | 2009-12-02 | 福建钧石能源有限公司 | Solar panel and manufacture method thereof |
| CN201374338Y (en) * | 2009-03-31 | 2009-12-30 | 常州天合光能有限公司 | Hollow assembly of photovoltaic cell |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20170117417A1 (en) * | 2015-07-13 | 2017-04-27 | Board Of Regents, The University Of Texas System | Integration of air-sensitive two-dimensional materials on arbitrary substrates for the manufacturing of electronic devices |
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| CN1555100A (en) * | 2003-12-25 | 2004-12-15 | 上海交通大学 | Glue coating package integrated robot of super thin space solar cell sheet |
| CN101593782A (en) * | 2008-05-26 | 2009-12-02 | 福建钧石能源有限公司 | Solar panel and manufacture method thereof |
| CN201233894Y (en) * | 2008-07-11 | 2009-05-06 | 常州亚玛顿光伏玻璃有限公司 | Glass board for solar energy cell assembly encapsulation |
| CN201374338Y (en) * | 2009-03-31 | 2009-12-30 | 常州天合光能有限公司 | Hollow assembly of photovoltaic cell |
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| Exfoliation and Analysis of Large-area, Air-Sensitive Two-Dimensional Materials;Josh P. Thompson et al;《Journal of Visualized Experiments》;20190105(第143期);文献编号e58693,第1-7页 * |
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