CN112513520A - 便携式灯 - Google Patents

便携式灯 Download PDF

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Publication number
CN112513520A
CN112513520A CN201980050829.3A CN201980050829A CN112513520A CN 112513520 A CN112513520 A CN 112513520A CN 201980050829 A CN201980050829 A CN 201980050829A CN 112513520 A CN112513520 A CN 112513520A
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chip
board assembly
assembly
cob
curved
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马尔科姆·麦基奇尼
胡戈·戴维森
克里斯·比拉内科
伊莱·蒂尔罗古德
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Knog Pty Ltd
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Knog Pty Ltd
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Priority claimed from AU2018902757A external-priority patent/AU2018902757A0/en
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Publication of CN112513520A publication Critical patent/CN112513520A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H05K1/00—Printed circuits
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    • B21D11/00—Bending not restricted to forms of material mentioned in only one of groups B21D5/00, B21D7/00, B21D9/00; Bending not provided for in groups B21D5/00 - B21D9/00; Twisting
    • B21D11/02—Bending by stretching or pulling over a die
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
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    • B62J6/00—Arrangement of optical signalling or lighting devices on cycles; Mounting or supporting thereof; Circuits therefor
    • B62J6/01—Electric circuits
    • B62J6/015—Electric circuits using electrical power not supplied by the cycle motor generator, e.g. using batteries or piezo elements
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    • B62J6/26—Warning or information lights warning or informing other road users, e.g. police flash lights
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    • F21V21/08—Devices for easy attachment to any desired place, e.g. clip, clamp, magnet
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    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/20—Light sources with three-dimensionally disposed light-generating elements on convex supports or substrates, e.g. on the outer surface of spheres
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  • Engineering & Computer Science (AREA)
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  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

本公开提供了一种便携式灯。便携式灯包括壳体，该壳体具有前表面、后表面以及内部空间，该内部空间用于接纳电子部件和电池。便携式灯还包括板上芯片(COB)组件。COB组件包括基板、安装至基板的单独的发光二极管(LED)芯片的矩阵、以及覆盖LED芯片的矩阵的外部涂层。壳体的前表面沿一个方向弯曲，并且COB组件相对应地弯曲并安装至前表面，使得单独的LED芯片围绕弯曲部定位并定向成将光围绕弯曲部向外引导，以提供大于220度的总光束角。便携式灯还包括前透镜盖，该前透镜盖用以保护COB组件。

Description

便携式灯
技术领域
本发明涉及便携式灯及制造方法。
背景技术
至少在澳大利亚，有法律规定要求在夜间骑行时在自行车上使用灯。在前部必须使用白光灯，并且在后部要使用红光灯。这些灯中的每个灯必须分别在前方和后方200米处是可见的。自行车灯的主要功能是使骑手能够被其他道路使用者比如其他骑行者、汽车以及行人看到。对于某些骑行，前灯的功能还有使骑行者能够向前看到障碍物。
自行车碰撞最常发生在交叉路口处，并且在光线不足时更有可能发生。因为许多灯的光束角有限，因此，在其他道路使用者正从他们那一侧接近自行车的情况下，交叉路口会使得难以看到自行车。
光的光束角是光从原始光源扩散或分布的角度。这通常从光源的前方直接测量，并且通常可以从4度变化至60度。一般而言，光源的亮度越高，则光束角越窄。相反地，较宽的光束角对应于较低的亮度。
可以通过使用透镜来改变光束角，透镜坐置在光源上并且使光折射或弯折以加宽角度。然而，这种系统对于光束可以被加宽的宽度程度有限制。
板上芯片(COB)发光二极管(LED)组件的最近发展已经允许在小的壳体中制造出非常明亮的光。能够这样的原因在于，该组件可以在使用单个电路和仅两个触点的基板上使用大量的LED芯片，从而减少了所需的部件。然而，尽管可以通过使用COB LED组件来增加亮度，但在光束角方面仍然存在限制。因此，期望的目的是提供可以适合于在自行车上使用的替代性便携式灯。
在说明书中对任何现有技术的引用不是承认或暗示该现有技术形成任何管辖范围内的公知常识的一部分，或者该现有技术可以合理地被期望为被本领域技术人员理解、认为是相关的和/或与其他现有技术结合。
发明内容
根据第一方面，提供了一种便携式灯，其包括：
壳体，该壳体具有前表面、后表面以及内部空间，该内部空间用于接纳电子部件和电池；
板上芯片(COB)组件，该COB组件包括：
基板、安装至基板的单独的发光二极管(LED)芯片的矩阵、以及覆盖LED芯片的矩阵的外部涂层；
其中，前表面沿一个方向弯曲，并且COB组件相对应地弯曲并安装至前表面，使得单独的LED芯片围绕弯曲部定位并定向成将光围绕弯曲部向外引导，以提供大于220度的总光束角；以及
前透镜盖，该前透镜盖用以保护COB组件。
总光束角更优选地大于270度。
便携式灯可以是自行车灯。在这样的实施方式中，壳体的后表面可以是弯曲的以抵靠管状框架构件、比如座杆或头管坐置。替代性地，后表面可以是平坦的或略微弯曲的，并且便携式灯可以用作头灯。将理解的是，本发明不受便携式灯能够使用的方式的限制。
后表面可以包括用于将灯安装至一元件的器件。在一个实施方式中，后表面可以包括构造成将灯安装至该元件的安装支架。安装支架可以通过至少部分地环绕该元件而将灯安装至该元件。安装支架还可以包括至少部分地环绕该元件的安装带。安装带可以是可移除的或者永久性地附接至壳体和/或安装支架。安装带可以是刚性的或挠性的。安装支架和/或安装带可以摩擦接合该元件，以将灯固定至该元件。
壳体中可以集成有USB连接器，以实现电池的充电。USB连接器可以包括阳USB连接器或阴USB连接器。阳USB连接器可以从壳体突出。阴USB连接器可以呈延伸到壳体中的端口的形式。USB连接可以呈USB-A连接器、USB-B连接器、USB-C连接器、迷你USB连接器、微型USB连接器或者任何其他形式的USB或充电连接的形式。
前透镜盖优选地是弯曲的以与前表面和COB组件的弯曲部相对应。前透镜盖可以是透明的或者可以是被着色的。前透镜盖旨在为COB组件提供物理保护，并为内部部件提供一定程度的防水。尽管透镜盖将可能导致少量的折射，但是光发射的方向是由单独的LED芯片的取向提供的，而不是来自由前透镜盖引起的任何折射。
COB组件基板可以由任何合适的半导体或导热材料——例如铝、聚合物如复合聚合物、聚酰胺等——制成。基板可以用作散热器。基板优选地是可弯折的，使得在制造期间COB组件可以被弯折以形成弯曲的形状并且在释放后能够保持该形状。替代性地，基板可以是挠性的并且附接至壳体，以便保持弯曲的形状，或者在弯折期间可以施加热。
COB组件基板将具有第一表面，该第一表面可以包括导热的介电层。介电层上可以印刷有铜电路层。然后可以在第一表面上施加绝缘涂层，保持铜焊盘的矩阵暴露。绝缘涂层可以是白色陶瓷涂料，以将光从COB组件的第一表面向外反射。
LED芯片可以包括通过导电粘合剂连接至铜焊盘的管芯以及将管芯连接至相邻的铜焊盘的引线键合部。替代性地，LED芯片可以是被称为倒装芯片封装的非有线封装，由此电触点位于芯片的基部上并且经由焊料直接连接至铜焊盘。另外替代性地，LED芯片可以是任何其他形式的LED部件，包括表面安装的(或SMT)LED芯片、或安装至基板的任何其他完全封装的或自给式LED部件。印刷电路板(PCB)可以在COB组件的边缘处或经由COB组件中的一个或更多个开口、凹口或槽电连接至COB组件。
对于白色LED管芯，可以在施加外部涂层之前在第一表面的顶部上施加黄色磷光体层。外部涂层可以是透明的硅胶层；替代性地，可以将硅胶着色。将理解的是，对于所有部件，可以使用合适的替代性材料。
弯曲方向优选地垂直于引线键合部的方向，使得引线不会弯折。例如，当便携式灯以一个实施方式使用时，引线键合部可以竖向地延伸，并且弯曲部围绕水平扫描区域延伸。弯曲部可以是参数化的弯曲部。
物理弯折延伸90度直至360度的角度。更优选地，弯折延伸120度与220度之间的角度，最优选地延伸180度。
根据第二方面，提供了一种便携式灯，其包括：
壳体，该壳体限定用于接纳电子部件和电池的空间；
板上芯片(COB)组件，该COB组件包括：
基板、安装至基板的多个单独的发光二极管(LED)、以及覆盖
所述多个LED的外部涂层；
其中，COB组件是弯曲的并且位于壳体内，使得单独的LED围绕弯曲部定位并定向成将光围绕弯曲部向外引导，以提供大于220度的总光束角；以及
前透镜盖，该前透镜盖用以保护COB组件。
总光束角更优选地大于270度。
前透镜盖可以安装至壳体。COB组件可以安装至壳体。壳体可以包括曲率与COB组件相似的弯曲表面。
根据第二方面的便携式灯可以包括关于根据第一方面的便携式灯的上述特征中的任何一个或更多个特征。
根据第三方面，提供了一种用于使板上芯片(COB)组件弯折的装置，该装置包括：
导引件，该导引件具有用于保持平坦的COB组件的第一表面，其中，COB组件的第一侧面相对于该导引件的该表面向外定位；
两个相对的致动器，致动器能够向内朝向彼此移动；
两个相对的夹持装置，夹持装置各自枢转地附接至相应的致动器的内端部，夹持装置构造成夹持定位在导引件中的COB组件的相对的外周边缘；
成形模，成形模位于导引件的下方或后方，使得COB组件定位在成形模的上方或前方，成形模具有弯曲的接合表面；
由此，成形模可以被致动以抵靠COB组件的第二侧面而推动，从而使COB组件在第一方向上在中央弯折，由此致动器随着COB组件弯折而与COB组件的被夹持的边缘一起向内移动，同时夹持装置随着边缘移动而旋转。
根据第四方面，提供了一种使板上芯片(COB)组件弯折的方法，该COB组件具有基板，该基板具有安装至第一表面的单独的发光二极管(LED)芯片的矩阵，该方法包括：
将至少一个COB组件放置到导引件中，其中，第一表面定位成在第一方向上面向外；
将两个相对的外周边缘夹持在相应的夹持装置中；
致动具有弯曲的接合表面的成形模，该成形模使接合表面在第一方向上朝向COB组件的第二表面移动，以使COB组件弯折，从而使得COB组件呈接合表面的形状；
由此，当成形模抵靠第二表面而推动时，夹持装置向内朝向彼此移动并且朝向第一方向枢转，以在COB组件弯折时跟随COB组件的边缘。
有利地，致动器、夹持装置以及成形模的移动遵循预定义的顺序和定时的移动。
导引件将COB组件定位成使得相对的外周边缘与夹持装置相邻，由此致动器被编程为向内移动所设定的距离，同时夹持装置的钳口打开以将钳口定位在相对边缘的第一侧面和第二侧面上，然后钳口闭合以将COB组件夹持住。
然后，COB组件可以从夹持装置被释放并转移至另一工位，该另一工位剪除基板的相对的外周边缘。
在一个实施方式中，COB组件是由单个基板片一体地形成的多个间隔开的COB组件，由此，剪除相对外周边缘将各单独的COB组件分开。
该弯折的方法确保COB组件的第一表面不接触弯折装置。
可以将单独的COB组件组装到本发明的第一方面的便携式灯中。
本发明的其他方面和在前面的段落中描述的方面的其他实施方式将通过以下作为示例并参照附图给出的描述而变得明显。
附图说明
图1示出了根据本发明的实施方式的便携式灯的正视立体图；
图2示出了图1的便携式灯的后视立体图；
图3示出了具有自行车安装件的图2的便携式灯的后视立体图；
图4示出了图3的便携式灯的俯视图；
图5示出了便携式灯的更小尺寸的替代性实施方式；
图6示出了图3的便携式灯的分解图；
图7示出了根据本发明的实施方式的板上芯片(COB)组件；
图8示出了根据第一实施方式的发光二极管(LED)芯片的放大视图；
图9示出了根据第二实施方式的LED芯片的侧视图；
图10示出了图9的LED芯片的俯视图；
图11示出了根据第三实施方式的LED芯片的侧视图；
图12示出了图11的LED芯片的俯视图；
图13示出了根据实施方式的用于使COB组件弯折的装置；
图14是图13的装置的横截面图；
图15a至图15d示出了COB组件被弯折的阶段；
图16示出了被逐渐弯折的COB组件；以及
图17示出了COB组件的一体式带。
具体实施方式
图1和图2示出了在以竖直取向使用时的便携式灯10，便携式灯10具有前部12、后部14、顶部14和底部16。该灯具有壳体18和透镜盖20，透镜盖20具有从一侧延伸至另一侧的弯曲表面，其中，该表面从上到下是直的。
壳体的后表面22是弯曲的以抵靠管状物、比如自行车框架坐置。该后表面还包括呈两个间隔开的平行槽24的形式的结构，以允许下面将描述的安装支架的连接。壳体18还包括用于对内部电池进行充电的USB连接器26以及按钮28。按钮28可以用于将灯打开和关闭，并且按钮28还可以用于在比如闪烁或恒定的模式之间循环。
如在图3中可以看到的，安装支架30可以以可移除的方式连接至后表面22。安装支架包括可以围绕管状框架缠绕的硅胶带32。也由硅胶制成的安装垫34可以粘接至安装支架30的表面。安装垫有助于保护管状框架并且提供摩擦以防止灯发生滑动。
图4是灯的平面图，该图图示了前透镜盖20的弯曲部以及壳体前部的对应弯曲部。弯曲部绕180度的角度延伸并且在形状上是参数化的。然而，将理解的是，本发明可以与大于或小于180度、通常在90度至360度的范围内的弯曲部一起使用。
如图5中所示，可以提供不同尺寸的灯10a。除了灯10a更短之外，灯10a与灯10在所有方面都是相同的。
图6是灯组件的分解图。壳体18由后本体36和前本体38构成。当两个本体联接在一起时，这两个本体形成内部空间41，内部空间41用于接纳电池40和印刷电路板(PCB)42。后本体36包括带有槽24的后弯曲表面22。安装支架30具有两个间隔开的轨44，轨44滑动到槽24中。嵌入后表面22中的孔中的是第一磁体46。第二磁体48嵌入安装支架30中的孔中，使得当安装支架滑动到后表面上时，两个磁体接合以加强连接，同时使安装支架能够容易地移除。
图6图示了两个替代性的安装垫34、34a。安装垫34a具有不同的后轮廓，以提供更小的弯曲表面以用于配装到更小直径的管状物上。
前本体38具有前表面39，前表面39在一个方向上向侧面弯曲，从而如上文所述与前透镜的弯曲部相对应。定位于前本体38与前透镜盖20之间的是板上芯片组件50，板上芯片组件50在图7中更详细地示出。
通常被称为COB组件的板上芯片组件包括基板52，基板52由半导体材料、例如铝或选择性聚合物制成。该基板可以是导热的以用作散热器。安装至基板的第一表面的是发光二极管(LED)芯片54的矩阵。芯片54的矩阵通常以列和行布置，但这是可以变化的。芯片54的类型也可以变化。图8至图10示出了引线键合的LED芯片。该实施方式中的基板52是铝，基板52在第一表面上具有导热的介电层56。然后，在层56上添加铜电路层。然后施加阻焊层58，阻焊层58覆盖大部分表面且同时使铜电路层的区域暴露以形成铜焊盘60。阻焊层58优选为白色陶瓷涂料。管芯62通过使用导电粘合剂64被附接至铜焊盘60，并且然后使用引线键合部66被连接至另一铜焊盘60。矩阵中所有引线键合部66的方向被定向成在同一方向上延伸。该方向在本实施方式中是竖向的，以允许COB组件在水平方向上弯折，而不破坏极易损坏的引线键合部中的任何引线键合部。引线键合的LED芯片通常用于红色LED。
图11和图12中示出了另一LED芯片，该LED芯片是白色倒装芯片。在本实施方式中，基板和各层与第一实施方式相同，仅是LED芯片不同。倒装芯片封装68通过焊料70结合至铜焊盘60。与引线键合的LED芯片类似，取向使得倒装芯片封装68全部都在同一方向上延伸，该方向与弯折方向垂直。
在LED芯片的顶部上的是由硅胶制成的外部涂层72(仅在图9中示出)，以保护组件，但LED芯片仍然非常易损，并且施加至LED芯片的压力可能会造成损坏。
回到图6，弯折的COB组件被放置在壳体的弯曲前表面上，从而提供支撑。来自PCB的两根引线(未示出)延伸穿过前本体38中的间隙并被焊接至COB组件的边缘上的两个触点。然后透镜盖20被放置在前部上以将灯围封并为COB组件提供保护。
弯曲的COB组件围绕弯曲部定位有多个LED，使得所述多个LED被定向成将光围绕弯曲部向外引导。这种设计意味着，各个LED以直线方向、侧面方向以及其间的锐角投射光束。这样的结果是大约300度的总光束角。这种方式产生的增大的光束角不需要光学透镜来使光弯折，因此照明仍然明亮。当灯附接至自行车框架时，对其他道路使用者而言骑手的能见度大大提高，因为光在两个方向上以及其间的所有角度处都明显地向侧面投射。
LED芯片的易损性意味着在不损坏任何LED芯片的情况下将COB组件弯折是复杂的。已经开发出独特的装置和方法来生产用于在便携式灯中使用的弯曲的COB组件。
COB组件被制造成平坦的，并且COB组件具有基板余量部(substrate salvage)，该基板余量部结合到两个相对的外周边缘74中，以协助在不接触部件的情况下对组件进行处理。图13和图14示出了用于使COB组件弯折的装置。该装置包括导引件80，导引件80具有两个阶梯状的间隔开的支撑部82，支撑部82具有面向上的表面，平坦的COB组件可以放置在该面向上的表面上。导引件被定尺寸且定形状为将COB组件定位成COB组件的第一表面向上并且COB组件的余量部边缘74在侧面。
两个相对的夹持装置84定位至导引件80的两侧。夹持装置84包括夹持到余量部外周边缘74上的一个或更多个钳口86。夹持装置经由旋转销90枢转地附接至水平线性致动器88的端部。
位于导引件80和COB组件50下方的是成形模92(见图14)，成形模92附接至竖向线性致动器94的端部。成形模92具有弯曲的接合表面96，该弯曲的接合表面96在被升高时与COB组件的第二侧面接触。该弯曲的接合表面与便携式灯的期望的弯曲部相对应。
在操作中，平坦的COB组件50被放置到导引件50上，并且致动器88被编程成略微向内移动，以将打开的钳口86定位在余量部边缘74上。然后合上钳口，从而将边缘夹持住。竖向致动器94将成形模92向上推动到COB组件的第二侧面中，从而将基板从中央弯折。为了允许基板弯折，水平致动器88也随着基板弯折向内移动，并且夹持装置84能够自由地旋转以跟随弯折。图15a至图15d以及图16中图示了该运动。致动器的运动可以全部被预先编程，以确保在弯折期间保持正确的张力。
如在图15a中可以看到的，钳口86夹持在平坦的COB组件的余量部边缘74上。当成形模压靠基板的中央时，基板开始向上弯折。如图15b至图15d以及图16中接连所示的，为了允许弯折，边缘需要向内移动并旋转。
在弯折处理之后，COB组件被从钳口86释放，并且被从该装置移除。然后，余量部边缘74被剪除。
该装置和弯折处理适合于形成单独的COB组件。然而，该装置和弯折处理还可以适于同时弯折多个COB组件。如图17中所示，多个COB组件可以使用一体的基板来制造，由此，所述多个COB组件通过共用的余量部边缘74连接在一起。在弯折处理完成后，可以沿着线98将余量部边缘74切掉。
弯折处理和方法允许将易损的COB组件弯折来形成弯曲形状，而不与LED芯片所位于的第一表面产生任何接触。
将理解的是，在本说明书中公开和限定的发明扩展至在文本或附图中提及或明显的单独特征中的两个或更多个特征的所有替代性组合。所有这些不同的组合构成本发明的各种替代性方面。

Claims (21)

1.一种便携式灯，包括：
壳体，所述壳体具有前表面、后表面以及内部空间，所述内部空间用于接纳电子部件和电池；
板上芯片(COB)组件，所述板上芯片组件包括：
基板、安装至所述基板的单独的发光二极管(LED)芯片的矩阵、以及覆盖发光二极管芯片的所述矩阵的外部涂层；
其中，所述前表面沿一个方向弯曲，并且所述板上芯片组件相对应地弯曲并安装至所述前表面，使得单独的发光二极管芯片围绕弯曲部定位并定向成将光围绕所述弯曲部向外引导，以提供大于220度的总光束角；以及
前透镜盖，所述前透镜盖用以保护所述板上芯片组件。
2.根据权利要求1所述的便携式灯，其中，所述总光束角大于270度。
3.根据权利要求1或2所述的便携式灯，还包括安装件，所述安装件用于将所述便携式灯安装至一元件。
4.根据前述权利要求中的任一项所述的便携式灯，还包括USB连接器，所述USB连接器构造成使所述电池能够充电。
5.根据前述权利要求中的任一项所述的便携式灯，其中，所述前透镜盖是弯曲的以与所述前表面和所述板上芯片组件的弯曲部相对应。
6.根据前述权利要求中的任一项所述的便携式灯，其中，所述前透镜盖构造成保护所述板上芯片组件免受由于水造成的损坏或故障。
7.根据前述权利要求中的任一项所述的便携式灯，其中，所述板上芯片组件包括半导体或导热材料，并且其中，所述基板构造成用作散热器。
8.根据前述权利要求中的任一项所述的便携式灯，其中，所述基板是能够弹性地弯折的，以形成并保持所述板上芯片组件的弯曲形状。
9.根据权利要求1至7中的任一项所述的便携式灯，其中，所述基板是挠性的，以被构造成形成所述板上芯片组件的弯曲形状。
10.根据前述权利要求中的任一项所述的便携式灯，其中，所述基板包括第一表面，所述第一表面包括导热的介电层，其中，所述介电层上定位有铜电路层，并且其中，所述第一表面上施加有绝缘涂层，使得所述铜电路层的铜焊盘矩阵暴露。
11.根据权利要求10所述的便携式灯，其中，所述发光二极管芯片中的每个发光二极管芯片包括通过导电粘合剂连接至相应的铜焊盘的管芯，并且其中，引线键合部将所述管芯连接至相邻的铜焊盘。
12.根据权利要求11所述的便携式灯，其中，所述板上芯片组件的弯曲大体垂直于所述引线键合部的方向，使得所述引线键合部不会弯折。
13.根据权利要求10所述的便携式灯，其中，所述发光二极管芯片中的每个发光二极管芯片包括位于该发光二极管芯片的基部上的一个或更多个电触点，所述一个或更多个电触点构造成经由焊料直接连接至相应的铜焊盘。
14.根据前述权利要求中的任一项所述的便携式灯，其中，所述前表面和所述板上芯片组件的弯曲部延伸90度与360度之间的角度。
15.根据权利要求14所述的便携式灯，其中，所述前表面和所述板上芯片组件的弯曲部延伸120度与220度之间的角度。
16.根据前述权利要求中的任一项所述的便携式灯，其中，所述前表面和所述板上芯片组件的弯曲部延伸约180度的角度。
17.根据前述权利要求中的任一项所述的便携式灯，其中，所述后表面通常是弯曲的，以被构造成抵靠自行车的管状框架构件坐置。
18.根据权利要求1至16中的任一项所述的便携式灯，其中，所述后表面是基本平坦的。
19.一种便携式灯，包括：
壳体，所述壳体限定用于接纳电子部件和电池的空间；
板上芯片(COB)组件，所述板上芯片组件包括：
基板、安装至所述基板的多个单独的发光二极管(LED)、以及覆盖多个所述发光二极管的外部涂层；
其中，所述板上芯片组件是弯曲的并且位于所述壳体内，使得单独的发光二极管围绕弯曲部定位并定向成将光围绕弯曲部向外引导，以提供大于220度的总光束角；以及
前透镜盖，所述前透镜盖用以保护所述板上芯片组件。
20.一种用于使板上芯片(COB)组件弯折的装置，所述装置包括：
导引件，所述导引件具有用于保持平坦的板上芯片组件的第一表面，其中，所述板上芯片组件的第一侧面相对于所述导引件的所述表面向外定位；
两个相对的致动器，所述致动器能够向内朝向彼此移动；
两个相对的夹持装置，所述夹持装置各自枢转地附接至相应的致动器的内端部，所述夹持装置构造成夹持定位在所述导引件中的板上芯片组件的相对的外周边缘；
成形模，所述成形模位于所述导引件的下方或后方，使得所述板上芯片组件定位在所述成形模的上方或前方，所述成形模具有弯曲的接合表面；
由此，所述成形模能够被致动以抵靠所述板上芯片组件的第二侧面而推动，从而使所述板上芯片组件在第一方向上在中央弯折，由此所述致动器随着所述板上芯片组件弯折而与所述板上芯片组件的被夹持的边缘一起向内移动，同时所述夹持装置随着所述边缘移动而旋转。
21.一种使板上芯片(COB)组件弯折的方法，所述板上芯片组件具有基板，所述基板具有安装至第一表面的单独的发光二极管(LED)芯片的矩阵，所述方法包括：
将至少一个板上芯片组件放置到导引件中，其中，所述第一表面定位成在第一方向上面向外；
将两个相对的外周边缘夹持在相应的夹持装置中；
致动具有弯曲的接合表面的成形模，所述成形模使所述接合表面在所述第一方向上朝向所述板上芯片组件的第二表面移动，以使所述板上芯片组件弯折，从而使得所述板上芯片组件呈所述接合表面的形状；
由此，当所述成形模抵靠所述第二表面而推动时，所述夹持装置向内朝向彼此移动并且朝向所述第一方向枢转，以在所述板上芯片组件弯折时跟随所述板上芯片组件的边缘。
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