CN211529946U - 便携式灯 - Google Patents

便携式灯 Download PDF

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Publication number
CN211529946U
CN211529946U CN201921219755.5U CN201921219755U CN211529946U CN 211529946 U CN211529946 U CN 211529946U CN 201921219755 U CN201921219755 U CN 201921219755U CN 211529946 U CN211529946 U CN 211529946U
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chip
board assembly
light
light emitting
portable
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马尔科姆·麦基奇尼
胡戈·戴维森
克里斯·比拉内科
伊莱·蒂尔罗古德
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Knog Pty Ltd
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Knog Pty Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D11/00—Bending not restricted to forms of material mentioned in only one of groups B21D5/00, B21D7/00, B21D9/00; Bending not provided for in groups B21D5/00 - B21D9/00; Twisting
    • B21D11/02—Bending by stretching or pulling over a die
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
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    • B21D35/007—Layered blanks
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B62J6/00—Arrangement of optical signalling or lighting devices on cycles; Mounting or supporting thereof; Circuits therefor
    • B62J6/01—Electric circuits
    • B62J6/015—Electric circuits using electrical power not supplied by the cycle motor generator, e.g. using batteries or piezo elements
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    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
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    • B62J6/00—Arrangement of optical signalling or lighting devices on cycles; Mounting or supporting thereof; Circuits therefor
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    • B62J6/26—Warning or information lights warning or informing other road users, e.g. police flash lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V21/08—Devices for easy attachment to any desired place, e.g. clip, clamp, magnet
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B62J6/04—Rear lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
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    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/20—Light sources with three-dimensionally disposed light-generating elements on convex supports or substrates, e.g. on the outer surface of spheres
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    • F21Y2107/70—Light sources with three-dimensionally disposed light-generating elements on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
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  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

本实用新型提供一种便携式灯，包括：壳体，所述壳体限定用于接纳电子部件和电池的空间；板上芯片组件，所述板上芯片组件包括基板、安装在所述基板上的多个单独的发光二极管以及覆盖多个所述发光二极管的外涂层，其中，所述板上芯片组件是弯曲的并且位于所述壳体内，使得各单独的发光二极管围绕弯曲部定位并且定向成围绕所述弯曲部向外直射光，以便提供大于220度的集成光束角度；以及前透镜盖，所述前透镜盖用以保护所述板上芯片组件，从而提供可以适用于自行车的替代性便携式灯。

Description

便携式灯
技术领域
本实用新型涉及便携式灯及其制造方法。
背景技术
至少在澳大利亚，存在强制性的法律要求在晚上骑行时在自行车上要使用灯。在正面必须使用白灯并且在背面要使用红灯。这些灯中的每个灯必须是分别在前后200米处可见的。自行车灯的主要功能是使骑车者能够被其他道路使用者、比如其他骑车者、汽车和行人看到。对于某些类型的骑行，前灯的功能还能够使骑车人向前看到障碍物。
自行车碰撞最常发生在十字路口处，并且在光线不好的时候更有可能发生。由于许多灯的光束角度有限，因此十字路口使正在从他们那一侧接近自行车的其他道路使用者难以看到自行车。
光的光束角度是从初始的光源处扩散或分布的光的角度。这通常从光源正面直接测量，并且大体上可以从4度变化至60度。总体而言，光源的亮度越高，光束角度越窄。相反地，较宽的光束角度对应于较低的亮度。
光束角度可以通过使用透镜来改变，将透镜置于光源上并折射或弯折光线以加宽角度。然而，这样的系统在光束能够加宽的宽度程度上有限制。
最近，板上芯片发光二极管组件的发展已允许在小的壳体中制造非常明亮的灯。其原因在于，组件可以在使用单个电路和仅两个触点的基板上使用大量发光二极管芯片，从而减少了所需的部件。然而，虽然可以通过使用板上芯片发光二极管组件来增加亮度，但是在光束角度方面仍然存在限制。因此，所期望的目的是提供可以适用于自行车的替代性便携式灯。
在本说明书中，对任何现有技术的引用并不是承认或暗示该现有技术构成任何管辖区域中的公知常识的一部分，或该现有技术可以合理地预期为被本领域技术人员理解、认为是相关的和/或与其他现有技术组合。
实用新型内容
根据第一方面提供了便携式灯，其包括：
壳体，该壳体具有前表面、后表面和用于接纳电子部件和电池的内部空间；
板上芯片组件，其包括：
基板、安装在该基板上的单独的发光二极管芯片矩阵、以及覆盖发光二极管芯片矩阵的外涂层，
其中，所述前表面在一个方向上弯曲，并且该板上芯片组件相应地弯曲并安装至该前表面，使得单独的发光二极管芯片围绕弯曲部定位并且定向成围绕弯曲部向外直射光以提供大于220度的集成光束角度；以及
前透镜盖，该前透镜盖用以保护该板上芯片组件。
更优选地，集成光束角度大于270度。
便携式灯可以是自行车灯。在这样的实施方式中，壳体的后表面可以弯曲成抵靠在管状框架构件、比如座杆或头管上放置。替代性地，后表面可以是平坦或略微弯曲的，并且便携式灯可以用作头灯。应理解，本实用新型不受便携式灯的使用方式的限制。
后表面可以包括用于将灯安装至元件的装置。在一个实施方式中，后表面可以包括安装支架，该安装支架构造成将灯安装至元件。安装支架可以通过至少部分地环绕元件来将灯安装至元件。安装支架还可以包括至少部分地环绕元件的安装带。安装带可以是可移除的或可以永久地附接至壳体和/或安装支架。安装带可以是刚性的或挠性的。安装支架和/或安装带可以摩擦地接合元件以将灯固定至元件。
USB连接器可以集成到壳体中以便能够为电池充电。USB连接器可以包括凸形USB连接器或凹形USB连接器。凸形USB连接器可以从壳体突出。凹形USB连接器可以呈延伸至壳体中的端口的形式。USB连接可以呈一下形式：USB-A连接器、USB-B连接器、USB-C连接器、迷你USB连接器、微型USB连接器、或任何其他形式的USB或充电连接。
优选地，前透镜盖弯曲成对应于前表面和板上芯片组件的弯曲部。前透镜盖可以是透明的或可以是彩色的。前透镜盖意在为板上芯片组件提供物理保护，并且为内部部件提供一定程度的防水性。尽管透镜盖可能导致的微小折射，但是发光的方向由单独的发光二极管芯片的方向来提供，而不是由前透镜盖引起的任何折射提供。
板上芯片组件基板可以由任何合适的半导体或导热材料、例如铝、诸如复合聚合物和聚酰胺之类的聚合物制成。基板可以用作散热器。优选地，基板是可弯折的，使得板上芯片组件在制造期间可以被弯折以形成弯曲形状并且能够在释放后保持该形状。替代性地，基板可以是挠性的并且附接至壳体以便保持弯曲形状，或者可以在弯折期间被加热。
板上芯片组件基板将具有第一表面，该第一表面可以包括热传导介质层。铜电路层可以印刷在该介质层上。然后可以在第一表面上施加绝缘涂层，并保持铜焊盘矩阵暴露。绝缘涂层可以是白色的陶瓷涂料，以便从板上芯片组件第一表面向外反射光。
发光二极管芯片可以包括连接至具有导电性粘合剂的铜焊盘的管芯和将管芯连接至相邻铜焊盘的引线键合。替代性地，发光二极管芯片可以是被称为倒装芯片封装的非线材封装，由此，电触点位于芯片的基部上并经由焊料直接连接至铜焊盘。进一步替代性地，发光二极管芯片可以是任何其他形式的发光二极管组件，包括表面安装的(或SMT)发光二极管芯片、或安装至基板的任何其他完全封装或独立的发光二极管部件。印刷电路板(PCB)可以在板上芯片组件的边缘处或经由板上芯片组件中的一个或更多个开口、凹口或狭槽电连接至板上芯片组件。
对于白色的发光二极管管芯，在施加外涂层之前可以在第一表面的顶部上施加黄色磷光层。外涂层可以是透明的硅树脂层；替代性地，硅树脂可以是有色的。应理解，合适的替代性材料可以用于所有部件。
优选地，弯曲方向垂直于引线键合的方向，因此引线不会弯折。例如，当便携式灯在一个实施方式中使用时，引线键合可以竖向延伸并且弯曲部围绕水平扫描延伸。弯曲部可以是参数化的弯曲部。
物理弯折延伸约90度的角度、至多至360度。更优选地，弯折延伸在120度与220度之间，最优选地在180度。
根据第二方面提供了便携式灯，其包括：
壳体，该壳体限定用于接纳电子部件和电池的空间；
板上芯片组件，其包括：
基板、安装在该基板上的多个单独的发光二极管、以及覆盖多个发光二极管的外涂层，
其中，该板上芯片组件是弯曲的并且位于该壳体内，使得各单独的发光二极管围绕弯曲部定位并且定向成围绕弯曲部向外直射光以提供大于220度的集成光束角度；以及
前透镜盖，该前透镜盖用以保护该板上芯片组件。
更优选地，集成光束角度大于270度。
前透镜盖可以安装至壳体。板上芯片组件可以安装至壳体。壳体可以包括弯曲的表面，该表面的曲率与板上芯片组件的曲率相似。
根据第二方面的便携式灯可以包括上文关于根据第一方面的便携式灯的描述的任意一个或更多个特征。
根据第三方面提供了用于弯折板上芯片组件的装置，其包括：
直射部，该直射部具有用于保持平坦的板上芯片组件的第一表面，其中板上芯片组件的第一侧定位成相对于直射表面向外；
能够朝向彼此向内移动的两个相对的致动器；
两个相对的夹持装置，每个夹持装置以可枢转的方式附接至相应致动器的内端，该夹持装置构造成夹持定位在直射部中的板上芯片组件的相对的外周边缘；
成形模定位在直射部下方或后方，使得板上芯片组件位于成形模的上方或前方，成形模具有弯曲的接合表面；
由此，可以致动成形模以在第一方向上压靠板上芯片组件的第二侧从而将板上芯片组件居中地弯折，由此致动器在板上芯片组件弯折时与板上芯片组件的被夹持的边缘一起向内移动，同时夹持装置随着边缘的移动而旋转。
根据第四方面提供了弯折板上芯片组件的方法，该板上芯片组件具有基板，该基板具有安装至第一表面的单独发光二极管芯片矩阵，该方法包括：
将至少一个板上芯片组件以将第一表面定位成朝向第一方向的方式放置在直射部处；
将两个相对的外周边缘夹持在相应的夹持装置中；
致动具有弯曲接合表面的成形模，成形模使接合表面朝向板上芯片组件的第二表面沿第一方向移动以将板上芯片组件弯折，使得板上芯片组件呈接合表面的形状；
由此，在成形模抵靠第二表面推压时，夹持装置朝向彼此向内移动并朝向第一方向枢转以在板上芯片组件被弯折时跟随板上芯片组件的边缘。
有利地，致动器、夹持装置和成形模的运动遵循预定义的序列和定时运动。
直射部通过与夹持装置相邻的相对的外周边缘将板上芯片组件定位，由此在致动器被编程为向内移动设定距离的同时，夹持装置的钳口打开以将钳口定位在相对的边缘的第一侧和第二侧上，然后钳口闭合以夹持板上芯片组件。
然后可以从夹持装置释放板上芯片组件并将板上芯片组件转移至剪除基板的相对外周边缘的另一工位。
在一个实施方式中，板上芯片组件是由单个基板片一体地形成的多个间隔开的板上芯片组件，通过剪除相对的外周边缘将各单独的板上芯片组件分开。
该弯折方法确保板上芯片组件的第一表面不会被弯折装置触及。
单独的板上芯片组件可以组装至本实用新型的第一方面的便携式灯中。
从通过示例和参照附图的方式给出的以下描述中，在前文中所描述的方面的其他实施方式和本实用新型的其他方面将变得明显。
附图说明
图1示出了根据本实用新型的实施方式的便携式灯的前立体图；
图2示出了图1的便携式灯的后立体图；
图3示出了具有自行车安装部的图2的便携式灯的后立体图；
图4示出了图3的便携式灯的俯视图；
图5示出了便携式灯的较小尺寸的替代实施方式；
图6示出了图3的便携式灯的分解图；
图7示出了根据本实用新型的实施方式的板上芯片组件；
图8示出了根据第一实施方式的发光二极管芯片的放大视图；
图9示出了根据第二实施方式的发光二极管芯片的侧视图；
图10示出了图9的发光二极管芯片的俯视图；
图11示出了根据第三实施方式的发光二极管芯片的侧视图；
图12示出了图11的发光二极管芯片的俯视图；
图13示出了用于将根据实施方式的板上芯片组件弯折的装置；
图14是图13的装置的横截面图；
图15a至图15d示出了板上芯片组件弯折阶段；
图16示出了逐渐弯折的板上芯片组件；并且
图17示出了一体式的板上芯片组件带。
具体实施方式
图1和图2示出了在竖直方向上使用时的便携式灯10，便携式灯10具有前部12、后部14、顶部14和底部16。该灯具有壳体18和透镜盖20，透镜盖20具有从一侧延伸到另一侧的弯曲表面，该表面从上到下是直的。
壳体的后表面22是弯曲的，以便座置抵靠诸如自行车框架的管状物体。后表面还包括呈两个间隔开的平行槽24的形式的结构以允许如下所述的安装支架的连接。壳体18还包括用于给内部电池充电的USB连接器26和按钮28。按钮28可以用来打开和关闭灯，也可以用来在诸如闪烁或恒定的模式之间循环。
如在图3中可以看到的，安装支架30能够以可移除的方式连接至后表面22。安装支架包括硅树脂带32，硅树脂带32可以卷绕在管状框架周围。同样由硅树脂制成的安装垫34可以附接至安装支架30的表面。安装垫有助于保护管状框架并提供摩擦力以防止灯发生滑动。
图4是灯的平面视图，其示出了前透镜盖20的弯曲部和相应的壳体前部的弯曲部。弯曲部围绕180度的角度延伸并且在形状上是参数化的。然而，应理解，本实用新型可以使用大于或小于180度、大体上在90度至360度的范围内的弯曲。
如在图5中示出的，灯10a可以设置成不同的尺寸。灯10a与灯10在所有方面都相同，除了灯10a更短。
图6是灯组件的分解图。壳体18由后本体36和前本体38构成。当两个本体联接在一起时，它们形成用于接纳电池40和印刷电路板(PCB)42的内部空间41。后本体36包括具有槽24的后弯曲表面22。安装支架30具有滑入至槽24中的两个间隔开的轨道44。嵌入在后表面22的孔口中的是第一磁体46。第二磁体48嵌入在安装支架30的孔口中，使得当安装支架滑动到后表面上时，两个磁体接合以加强连接，同时使安装支架易于移除。
图6示出了两个替代性安装垫34、34a。安装垫34a具有不同的后轮廓以提供用于装配在较小直径的管状物体上的较小弯曲表面。
前本体38具有在一个方向上向侧面弯曲的前表面39，从而与如上所述的前透镜的弯曲相对应。定位在前本体38与前透镜盖20之间的是板上芯片组件50，板上芯片组件50在图7中更详细地示出。
通常被称为板上芯片组件的板上芯片组件包括由半导体材料、例如铝或选择性聚合物制成的基板52。基板可以是导热的以用作散热器。安装至基板的第一表面的是发光二极管芯片矩阵54。芯片矩阵54总体上以列和行布置，但这是可以改变的。芯片54的类型也可以改变。图8至图10示出了引线键合的发光二极管芯片。基板52在该实施方式中为铝，其在第一表面上具有热传导介质层56。然后在层56上添加铜电路层。然后在施加覆盖了大部分表面的焊接掩模层58的同时，将铜电路层的区域暴露在外以形成铜焊盘60。焊接掩模层58优选地为白色的陶瓷涂料。使用导电性粘合剂64将管芯62附接至铜焊盘60，然后使用引线键合66将管芯62连接至另一铜焊盘60。矩阵中的所有引线键合66的方向定向成在相同方向上延伸。该方向在该实施方式中是竖向的，以允许板上芯片组件能够在水平方向上弯折而不会破坏任何引线键合，这种引线键合是高度易碎的。引线键合的发光二极管芯片通常用于红色的发光二极管。
在图11和图12中示出了另一种发光二极管芯片，这种发光二极管芯片是白色的倒装芯片。在该实施方式中，基板和各层与第一实施方式相同，只有发光二极管芯片不同。倒装芯片封装68通过焊料70结合至铜焊盘60。类似于引线键合的发光二极管芯片，倒装芯片封装68定向成全部在相同方向上延伸，该方向垂直于弯折方向。
尽管在发光二极管芯片的顶部上存在硅树脂外涂层72(仅在图9中示出)以保护组件，但发光二极管芯片仍是非常脆弱的并且对其施加压力可能会导致损坏。
回到图6，经弯折的板上芯片组件放置在壳体的弯曲前表面上以提供支撑。来自PCB的两个引线(未示出)延伸穿过前本体38中的间隙并焊接至板上芯片组件边缘上的两个触点。然后将透镜盖20放置在前部上以封围灯并为板上芯片组件提供保护。
弯曲的板上芯片组件围绕弯曲部定位有多个发光二极管，使所述多个发光二极管定向成围绕弯曲部向外直射光线。该设计意味各个发光二极管在直线方向、侧向方向和其间的锐角方向上投射光束。由此产生大约300度的集成光束角度。以这种方式产生的增加的光束角度不需要光学透镜来弯折光，因此照明度仍保持明亮。当灯被附接至自行车框架时，骑行者对于其他道路使用者的可见性极大地增加，因为光向两侧明显地投射在两个方向及其间所有的角度上。
发光二极管芯片的脆弱性意味着在不损坏任何发光二极管芯片的情况下使板上芯片组件弯折是复杂的。已经开发出独特的装置和方法来生产用于便携式灯的弯曲的板上芯片组件。
板上芯片组件制造为平坦的并且具有结合至两个相对的外周边缘74中的基板余量部(substrate salvage)，以便有助于在不接触组件的情况下处理组件。图13和图14示出了用于弯折板上芯片组件的装置。该装置包括直射部80，直射部80具有两个阶梯状的间隔开的支撑部82，支撑部82具有面朝上的表面，平坦的板上芯片组件可以放置在该表面上。直射部定尺寸及定形状成使板上芯片组件的第一表面朝上定位并且使该板上芯片组件的余量部边缘74定位在侧面。
两个相对的夹持装置84定位在直射部80的两侧。夹持装置84包括夹持在余量部边缘74上的一个或更多个钳口86。夹持装置经由旋转销90以可枢转的方式附接至水平线性致动器88的端部。
位于直射部80和板上芯片组件50下方的是附接至竖向线性致动器94的端部的成形模92(见图14)。成形模92具有弯曲的接合表面96，接合表面96在升高时与板上芯片组件的第二侧接触。弯曲的接合表面对应于便携式灯的期望的弯曲部。
在操作中，将平坦的板上芯片组件50放置在直射部50上，并且致动器88被编程为稍微向内移动以将打开的钳口86定位在余量部边缘74上。然后将钳口闭合，从而夹持边缘。竖向致动器94将成形模92向上推动至板上芯片组件的第二侧，使基板从中心弯折。为了允许将基板弯折，水平致动器88也随着基板的弯折而向内移动，并且夹持装置84能够自由旋转以跟随弯折。这种运动在图15a至图15d和图16中示出。致动器的运动可以全部被预编程以确保在弯折期间保持正确的张力。
如在图15a中可以看到的，钳口86夹持在平坦的板上芯片组件的余量部边缘74上。当成形模压靠在基板的中心时，基板开始向上弯折。如在图15b至图15d和图16中相继示出的，为了允许弯折，边缘需要向内移动并旋转。
在弯折过程之后，将板上芯片组件从钳口86释放并从装置中移除。然后剪除余量部边缘74。
该装置和弯折过程适用于形成单独的板上芯片组件。但是，该装置和弯折过程也可以适用于同时弯折多个板上芯片组件。如在图17中示出的，多个板上芯片组件可以使用一体式基板来制造，由此，所述多个板上芯片组件通过共用的余量部边缘74连接在一起。在弯折过程完成之后，可以沿着线98将余量部边缘74切除。
该弯折过程和方法允许在不与发光二极管芯片所在的第一表面进行任何接触的情况下将易碎的板上芯片组件弯折以形成弯曲的形状。
应理解的是，在本说明书中公开和限定的本实用新型延伸至在文本或附图中提及的、或由文本或附图显而易见的两个或更多个单独特征的所有替代性组合。所有这些不同的组合构成本实用新型的多个替代性方面。

Claims (15)

1.一种便携式灯，其特征在于，包括：
壳体，所述壳体限定用于接纳电子部件和电池的空间；
板上芯片组件，所述板上芯片组件包括：
基板、安装在所述基板上的多个单独的发光二极管以及覆盖多个所述发光二极管的外涂层，
其中，所述板上芯片组件是弯曲的并且位于所述壳体内，使得各单独的发光二极管围绕弯曲部定位并且定向成围绕所述弯曲部向外直射光，以便提供大于220度的集成光束角度；以及
前透镜盖，所述前透镜盖用以保护所述板上芯片组件。
2.根据权利要求1所述的便携式灯，其特征在于，所述集成光束角度大于270度。
3.根据权利要求1或2所述的便携式灯，其特征在于，所述壳体包括前表面和后表面，并且其中，所述前表面在一个方向上弯曲，并且所述板上芯片组件相应地弯曲并安装至所述前表面。
4.根据权利要求1或2所述的便携式灯，其特征在于，所述便携式灯还包括用于将所述便携式灯安装至元件的安装部。
5.根据权利要求1或2所述的便携式灯，其特征在于，所述便携式灯还包括USB连接器，所述USB连接器构造成能够为所述电池充电。
6.根据权利要求3所述的便携式灯，其特征在于，所述前透镜盖是弯曲的，以便对应于所述前表面和所述板上芯片组件的弯曲部。
7.根据权利要求6所述的便携式灯，其特征在于，所述前透镜盖构造成保护所述板上芯片组件免受由于水造成的损坏或故障。
8.根据权利要求1或2所述的便携式灯，其特征在于，所述板上芯片组件包括半导体或导热材料，并且其中，所述基板构造成用作散热器。
9.根据权利要求1或2所述的便携式灯，其特征在于，所述基板是能够弹性地弯折的，以便形成并保持所述板上芯片组件的弯曲形状。
10.根据权利要求1或2所述的便携式灯，其特征在于，所述基板包括第一表面，所述第一表面包括热传导的介质层，其中，铜电路层位于所述介质层上，并且其中，绝缘涂层施加在所述第一表面上，使得所述铜电路层的铜焊盘矩阵暴露。
11.根据权利要求10所述的便携式灯，其特征在于，所述发光二极管中的每个发光二极管包括管芯，所述管芯通过导电性粘合剂连接至相应铜焊盘，并且其中，引线键合将所述管芯连接至相邻的铜焊盘。
12.根据权利要求11所述的便携式灯，其特征在于，所述板上芯片组件的弯曲方向垂直于所述引线键合的方向，因此所述引线键合不会弯折。
13.根据权利要求10所述的便携式灯，其特征在于，所述发光二极管中的每个发光二极管包括位于所述发光二极管的基部上的一个或更多个电触点，所述一个或更多个电触点构造成经由焊料连接至相应的铜焊盘。
14.根据权利要求3所述的便携式灯，其特征在于，所述前表面和所述板上芯片组件的弯曲部的延伸角度介于90度与360度之间。
15.一种便携式灯，其特征在于，包括：
壳体，所述壳体具有前表面、后表面和用于接纳电子部件和电池的内部空间；
板上芯片组件，所述板上芯片组件包括：
基板、安装在所述基板上的单独的发光二极管芯片矩阵以及覆盖所述发光二极管芯片矩阵的外涂层，
其中，所述前表面在一个方向上弯曲，并且所述板上芯片组件相应地弯曲并安装至所述前表面，使得所述单独的发光二极管芯片绕弯曲部定位并且定向成绕所述弯曲部向外直射光，以便提供大于220度的集成光束角度；以及
前透镜盖，所述前透镜盖用以保护所述板上芯片组件。
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