CN112490167A

CN112490167A - Substrate processing apparatus and substrate processing method

Info

Publication number: CN112490167A
Application number: CN202010805951.1A
Authority: CN
Inventors: 角间央章; 沖田有史; 犹原英司; 增井达哉; 出羽裕一
Original assignee: Screen Holdings Co Ltd
Current assignee: Screen Holdings Co Ltd
Priority date: 2019-09-12
Filing date: 2020-08-12
Publication date: 2021-03-12
Also published as: KR20210031613A; KR102443011B1; TWI749604B; JP7282640B2; JP2021044440A; TW202111769A

Abstract

The invention provides a substrate processing apparatus which improves the position detection precision of a moving nozzle. The substrate processing apparatus includes an imaging unit for imaging the nozzle and outputting image data of the nozzle, and a position detecting unit for detecting a position of the nozzle based on the image data. The position detecting unit detects the position of the nozzle by performing matching processing on the image data using the reference image data in the stop region, and detects the position of the nozzle by performing tracking processing between consecutive image data with the position of the nozzle detected in the stop region as a reference in the moving region.

Description

Substrate processing apparatus and substrate processing method

Technical Field

The technology disclosed in the present specification relates to a substrate processing apparatus and a substrate processing method.

Background

In a manufacturing process of a semiconductor device or the like, a substrate processing such as a cleaning process or a resist coating process is performed by supplying a processing liquid such as pure water, a resist liquid, or an etching liquid to the substrate.

As an apparatus for performing liquid processing using these processing liquids, a substrate processing apparatus is used which rotates a substrate and discharges the processing liquid from a nozzle onto an upper surface of the substrate.

For example, patent document 1 discloses a detection technique for detecting whether or not a treatment liquid is discharged from a nozzle disposed at a treatment position, whether or not the nozzle is normally disposed at the treatment position, or the like.

Patent document 1: japanese patent laid-open publication No. 2015-173148

However, it is difficult to detect the position of the moving nozzle in the related art. This is because, in the conventional technique, the matching process is performed on the captured image of the nozzle and the reference image of the nozzle, but when the nozzle moves, the shape and size of the nozzle differ depending on the position, and the accuracy of the matching process is lowered.

Disclosure of Invention

The technology disclosed in the present specification has been proposed in view of the above-described problems, and an object of the technology is to provide a technology for improving the accuracy of detecting the position of a moving nozzle.

A first aspect of the technology disclosed in the present specification includes: a nozzle which can swing and is used for ejecting the processing liquid to the substrate; a photographing part for photographing the nozzle and outputting image data of the nozzle; a position detecting section for detecting a position of the nozzle based on the image data, the swingable range of the nozzle including at least one stop region where the nozzle is stopped and at least one moving region where the nozzle is moved, respectively. In the stop region, the position detection section detects the position of the nozzle by performing matching processing on the image data using reference image data; in the movement region, the position detection unit detects the position of the nozzle by performing tracking processing between consecutive image data with reference to the position of the nozzle detected in the stop region.

A second mode of the technology disclosed in the present specification is related to the first mode, wherein the swingable range of the nozzle includes a plurality of the stop regions, and the reference image data is set in accordance with each of the stop regions.

A third aspect of the technology disclosed in the present specification is related to the first or second aspect, wherein the position detecting unit sets a target region corresponding to the position of the nozzle and a determination region for determining whether or not the treatment liquid ejected from the nozzle is ejected, and changes the size of the target region and the size of the determination region in conjunction with the matching process and the tracking process.

A fourth aspect of the technology disclosed in the present specification relates to any one of the first to third aspects, and further includes: and a positional deviation detecting unit that detects a positional deviation of the nozzle by comparing the position of the nozzle detected by the position detecting unit with a reference position of the nozzle measured in advance.

A fifth aspect of the technology disclosed in the present specification includes: a step of picking up an image of a nozzle which is swingable and ejects a processing liquid onto a substrate, and outputting image data of the nozzle; a step of detecting a position of the nozzle based on the image data, the swingable range of the nozzle including at least one stop region where the nozzle is stopped and at least one movement region where the nozzle is moved, respectively, the step of detecting the position of the nozzle including: a step of detecting the position of the nozzle by performing matching processing on the image data using reference image data in the stop region; and detecting the position of the nozzle in the moving region by performing a tracking process between the consecutive image data with reference to the position of the nozzle detected in the stop region.

According to the first to fifth aspects of the technology disclosed in the present specification, the position of the nozzle being stopped is detected by performing the matching process in the stop region, and the position of the nozzle being moved can be detected by performing the tracking process with reference to the detected position of the nozzle in the movement region.

Further, objects, features, aspects and advantages of the technology disclosed in the present specification will become more apparent from the detailed description and the accompanying drawings.

Drawings

Fig. 1 is a diagram showing an example of the overall configuration of a substrate processing apparatus according to an embodiment.

Fig. 2 is a plan view of the cleaning processing unit according to the embodiment.

Fig. 3 is a sectional view of the cleaning processing unit according to the embodiment.

Fig. 4 is a diagram showing a positional relationship between the camera and the nozzle.

Fig. 5 is a functional block diagram of the control unit.

Fig. 6 is a diagram schematically illustrating a hardware configuration when the control unit illustrated in fig. 5 is actually operated.

Fig. 7 is a flowchart showing the operation of the substrate processing apparatus according to the embodiment.

Fig. 8 is a diagram showing an example of the swingable range of the nozzle.

Fig. 9 is a flowchart showing the nozzle position detection operation.

Fig. 10 is a diagram for explaining template matching.

Fig. 11 is a diagram showing an example of reference image data corresponding to a matching window.

Fig. 12 is a diagram showing another example of the reference image data corresponding to the matching window.

Fig. 13 is a diagram showing an example of positional deviation when the nozzle is moved in a plurality of patterns.

Fig. 14 is a diagram showing an example of a determination region for ejection determination.

Fig. 15 is a diagram showing an example of an image in the determination region.

Fig. 16 is a diagram showing an example of an image in the determination region.

The reference numerals are explained as follows:

1 cleaning processing unit

9 control part

10 Chamber

11 side wall

12 top wall

13 bottom wall

14 FFU

15 partition board

18 exhaust channel

20 rotating chuck

21 rotating table

21a holding surface

22 rotating electric machine

23 cover component

24 rotating shaft

25 Flange member

26 chuck pin

28 lower surface treatment liquid nozzle

30. 60, 65 nozzle

31 discharge head

32. 62, 67 nozzle arm

33. 63, 68 nozzle base

40 treatment cup

41 inner cup

42 middle cup

43 outer cup

43a, 52a lower end

43b, 47b, 52b upper end

43c, 52c folded part

44 bottom part

45 inner wall part

46 outer wall part

47 first guide part

48 middle wall part

49 waste tank

50 inner side recovery groove

51 outer recovery tank

52 second guide part

53 treatment liquid separation wall

70 pick-up head

71 illumination unit

90 position detecting part

91 position deviation detecting part

92 Command transmitting part

94 discharge determining part

95 display unit

96 input unit

100 substrate processing apparatus

102 indexer

103 main carrying manipulator

201A、202A、302ROI

201. 202 matching window

301 determination region

332 electric machine

400 treatment liquid

1102A, 1102B processing circuit

1103 storage device

Detailed Description

The embodiments are described below with reference to the drawings. In the embodiments described below, detailed features and the like are listed for the purpose of explaining the technology, but these are examples and are not necessarily essential features for implementing the embodiments.

In addition, the drawings are schematically illustrated, and for convenience of explanation, the structure is appropriately omitted or simplified in the drawings. The mutual relationship between the size and the position of the structures and the like shown in different drawings is not necessarily described correctly, and may be changed as appropriate. In the drawings such as a plan view of a non-sectional view, hatching may be attached to facilitate understanding of the contents of the embodiments.

In the following description, the same components are denoted by the same reference numerals, and the names and functions thereof are also set to be the same. Therefore, a detailed description thereof will be omitted to avoid redundancy.

In the following description, if a certain component is described as "having", "including" or "having", it is not an exclusive expression that excludes the presence of other components unless otherwise specified.

In the following description, even if ordinal numbers such as "first" and "second" are used, the terms are not used to limit the order in which the ordinal numbers are generated, but are used to facilitate understanding of the contents of the embodiments.

In the following description, even when terms indicating specific positions or directions such as "upper", "lower", "left", "right", "side", "bottom", "front", and "back" are used, the terms are used regardless of the positions or directions in actual implementation and are used for easy understanding of the contents of the embodiments.

< embodiment >

Next, a substrate processing apparatus and a substrate processing method according to the present embodiment will be described.

< Structure of substrate processing apparatus >

Fig. 1 is a diagram showing an example of the overall configuration of a substrate processing apparatus 100 according to the present embodiment. As illustrated in fig. 1, the substrate processing apparatus 100 is a sheet-fed processing apparatus that processes substrates W to be processed one by one. Examples of the substrate to be processed include a semiconductor substrate, a substrate for a liquid crystal display device, a substrate for a Flat Panel Display (FPD) such as an organic EL (electroluminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a photomask, a ceramic substrate, and a substrate for a solar cell.

The substrate processing apparatus 100 according to the present embodiment performs a drying process after cleaning a substrate W, which is a circular thin plate-shaped silicon substrate, using a rinse solution such as a chemical solution and deionized water.

As the chemical solution, for example, a mixed solution of ammonia and hydrogen peroxide (SC1), a mixed aqueous solution of hydrochloric acid and hydrogen peroxide (SC2), a DHF solution (dilute hydrofluoric acid), or the like can be used.

In the following description, the chemical solution and the rinse solution are collectively referred to as "treatment solution". The "processing liquid" includes not only a processing liquid used for a cleaning process, but also a coating liquid such as a resist liquid used for a film formation process, a chemical liquid used for removing an unnecessary film, a chemical liquid used for etching, and the like.

The substrate processing apparatus 100 includes a plurality of cleaning units 1, an indexer 102, and a main transfer robot 103.

The indexer 102 conveys the substrate W as a processing target received from the outside of the apparatus into the inside of the apparatus, and conveys the processed substrate W having been subjected to the substrate processing (including the raising and lowering of the processing cup, the cleaning processing, and the drying processing) out of the apparatus. The indexer 102 includes a transfer robot (not shown) on which a plurality of placement members (not shown) are arranged.

As the mounting member, a Front Opening Unified Pod (FOUP) that houses the substrate W in a closed space, a Standard Mechanical Interface (SMIF) pod, or an Open Cassette (OC) that exposes the substrate W to the air may be used. Further, the transfer robot transfers the substrate W between the placing member and the main transfer robot 103.

The cleaning processing unit 1 performs liquid processing and drying processing on one substrate W. The substrate processing apparatus 100 according to the present embodiment is provided with twelve cleaning units 1.

Specifically, four towers each including three cleaning units 1 stacked in the vertical direction are provided so as to surround the main transport robot 103.

Fig. 1 schematically shows one layer of a three-layer overlapped cleaning processing unit 1. The number of cleaning units 1 in the substrate processing apparatus 100 is not limited to twelve, and may be changed as appropriate.

The main transport robot 103 is disposed at the center of the four towers on which the cleaning units 1 are stacked. The main transport robot 103 transports the target substrates W received from the indexer 102 into the respective cleaning units 1. The main transport robot 103 transports the processed substrates W from the respective cleaning units 1 to the indexer 102.

Next, one of the twelve cleaning processing units 1 mounted on the substrate processing apparatus 100 will be described, and the other cleaning processing units 1 have the same configuration except for the arrangement of the nozzles.

Fig. 2 is a plan view of the cleaning unit 1 according to the present embodiment. Fig. 3 is a cross-sectional view of the cleaning unit 1 according to the present embodiment.

Fig. 2 shows a state where the spin chuck 20 does not hold the substrate W, and fig. 3 shows a state where the spin chuck 20 holds the substrate W.

In the chamber 10, the cleaning processing unit 1 includes a spin chuck 20 for holding the substrate W in a horizontal posture (i.e., a posture in which a normal line of the upper surface of the substrate W is in a vertical direction), three nozzles 30 for supplying the processing liquid to the upper surface of the substrate W held by the spin chuck 20, a nozzle 60 and a nozzle 65, a processing cup 40 surrounding the spin chuck 20, and a camera 70 for imaging a space above the spin chuck 20.

Further, a partition plate 15 for vertically partitioning the inner space of the chamber 10 is provided around the processing cup 40 in the chamber 10.

The chamber 10 includes a side wall 11 surrounding the periphery in the vertical direction, a top wall 12 closing an upper side of the side wall 11, and a bottom wall 13 closing a lower side of the side wall 11. The space surrounded by the side walls 11, the ceiling wall 12, and the bottom wall 13 becomes a processing space for the substrate W.

A part of the side wall 11 of the chamber 10 is provided with a transfer port for transferring the substrate W into and out of the chamber 10 by the main transfer robot 103, and a shutter (both not shown) for opening and closing the transfer port.

A Fan Filter Unit (FFU)14 is installed on the top wall 12 of the chamber 10, and the fan filter unit 14 is used to further purify air in a clean room in which the substrate processing apparatus 100 is disposed and supply it to a processing space within the chamber 10. The FFU14 has a fan and filter (e.g., a highefficiency particulate air filter (HEPA) filter) that draws air from the clean room into and out of the chamber 10.

The FFU14 creates a down stream of cleaned air in the processing space within the chamber 10. In order to evenly distribute the purified air supplied by the FFU14, a punching plate provided with a plurality of air outlet holes may be provided directly below the top wall 12.

The spin chuck 20 includes a spin base 21, a spin motor 22, a cover member 23, and a rotation shaft 24. The rotary table 21 is formed in a disc shape and is fixed to an upper end of a rotary shaft 24 extending in the vertical direction in a horizontal posture. The rotary motor 22 is provided below the rotary table 21 and rotates a rotary shaft 24. The rotary motor 22 rotates the rotary table 21 in a horizontal plane via a rotary shaft 24. The cover member 23 has a cylindrical shape surrounding the rotary electric machine 22 and the rotary shaft 24.

The outer diameter of the disk-shaped turntable 21 is slightly larger than the outer diameter of the circular substrate W held by the spin chuck 20. Thus, the turntable 21 has a holding surface 21a facing the entire lower surface of the substrate W to be held.

A plurality of (four in the present embodiment) chuck pins 26 are provided on the periphery of the holding surface 21a of the rotary table 21. The chuck pins 26 are arranged at equal intervals along a circumference corresponding to the outer diameter of the outer circumference of the circular substrate W. In the present embodiment, four chuck pins 26 are provided at intervals of 90 °.

The plurality of chuck pins 26 are driven in conjunction by a link mechanism, not shown, housed in the rotary table 21. The spin chuck 20 holds the substrate W by bringing the plurality of chuck pins 26 into contact with the outer peripheral end of the substrate W, and holds the substrate W above the spin base 21 in a horizontal posture close to the holding surface 21a (see fig. 3). The spin chuck 20 separates each of the plurality of chuck pins 26 from the outer peripheral end of the substrate W, thereby releasing the substrate W from being gripped. The method of holding the substrate W is not limited to the method using the chuck pins described in the present embodiment, and may be, for example, a vacuum chuck for vacuum-sucking the substrate W, or a bernoulli disk for ejecting gas to suck the substrate W by the bernoulli principle.

The cover member 23 covering the rotary motor 22 has a lower end fixed to the bottom wall 13 of the chamber 10 and an upper end extending right below the rotary table 21. A flange member 25 is provided at an upper end portion of the cover member 23, and the flange member 25 projects outward from the cover member 23 substantially horizontally and further extends to be bent downward.

In a state where the spin chuck 20 holds the substrate W by gripping of the plurality of chuck pins 26, the rotation motor 22 rotates the rotation shaft 24 to rotate the substrate W about a rotation axis CX which is an axis line in the vertical direction passing through the center of the substrate W. Further, the driving of the rotating electrical machine 22 is controlled by the control unit 9.

The nozzle 30 is configured such that a discharge head 31 is attached to a tip of a nozzle arm 32. The base end side of the nozzle arm 32 is fixedly connected to the nozzle base 33. The nozzle base 33 is rotatable about an axis in the vertical direction by a motor 332 (nozzle moving unit) provided on the nozzle base 33.

As shown by an arrow AR34 in fig. 2, the nozzle 30 is moved in an arc-like manner in the horizontal direction between a position above the spin chuck 20 and a standby position outside the processing cup 40 by the rotation of the nozzle base 33. The nozzle 30 is swung above the holding surface 21a of the rotary table 21 by the rotation of the nozzle base 33. More specifically, the nozzle 30 moves above the turntable 21 in a predetermined processing section PS1 (described later) extending in the horizontal direction. Further, moving the nozzle 30 in the processing section PS1 is equivalent to moving the discharge head 31 at the tip in the processing section PS 1.

A plurality of types of treatment liquids (including at least pure water) are supplied to the nozzle 30, and the plurality of types of treatment liquids can be ejected from the ejection head 31. Further, a plurality of discharge heads 31 may be provided at the tip of the nozzle 30, and the same or different processing liquids may be discharged from the plurality of discharge heads 31. The nozzle 30 (more specifically, the discharge head 31) moves in a processing section PS1 extending in an arc shape in the horizontal direction and discharges the processing liquid. The processing liquid discharged from the nozzle 30 is landed on the upper surface of the substrate W held by the spin chuck 20.

In the cleaning unit 1 of the present embodiment, not only the nozzle 30 but also two nozzles, that is, a nozzle 60 and a nozzle 65 are provided. The nozzle 60 and the nozzle 65 of the present embodiment have the same configuration as the nozzle 30 described above.

That is, the nozzle 60 is configured such that a discharge head is attached to the tip of the nozzle arm 62, and the nozzle 60 is moved in an arc shape between a processing position above the spin chuck 20 and a standby position outside the processing cup 40 by the nozzle base 63 connected to the base end side of the nozzle arm 62 as indicated by an arrow AR 64.

Similarly, the nozzle 65 is configured such that a discharge head is attached to the tip of the nozzle arm 67, and the nozzle 65 is moved in an arc shape between a processing position above the spin chuck 20 and a standby position outside the processing cup 40 by the nozzle base 68 connected to the base end side of the nozzle arm 67 as indicated by an arrow AR 69.

A plurality of kinds of treatment liquids including at least pure water are also supplied to the

nozzles

60 and 65, and the treatment liquids are discharged onto the upper surface of the substrate W held by the spin chuck 20 at the treatment position. At least one of the nozzle 60 and the nozzle 65 may be a two-fluid nozzle that mixes a cleaning liquid such as pure water with a pressurized gas to generate droplets and ejects a mixed fluid of the droplets and the gas onto the substrate W. The number of nozzles provided in the cleaning unit 1 is not limited to three, and may be one or more.

It is not necessary to move all of the

nozzles

30, 60, and 65 in the circular arc shape. For example, the nozzle may be linearly moved by providing a linear driving unit, or may be rotated in the circumferential direction.

The lower surface treatment liquid nozzle 28 is provided in the vertical direction so as to be inserted through the inside of the rotation shaft 24. The upper end opening of the lower surface treatment liquid nozzle 28 is formed at a position facing the center of the lower surface of the substrate W held by the spin chuck 20. A plurality of treatment liquids are also supplied to the lower surface treatment liquid nozzle 28. The processing liquid discharged from the lower surface processing liquid nozzle 28 lands on the lower surface of the substrate W held by the spin chuck 20.

The processing cup 40 surrounding the spin chuck 20 has an inner cup 41, a middle cup 42, and an outer cup 43 which can be lifted and lowered independently of each other. The inner cup 41 surrounds the spin chuck 20 and has a shape that is substantially rotationally symmetrical with respect to the rotation axis CX passing through the center of the substrate W held by the spin chuck 20. The inner cup 41 integrally has the following members: a bottom portion 44 having a ring shape in plan view; a cylindrical inner wall portion 45 rising upward from the inner peripheral edge of the bottom portion 44; a cylindrical outer wall portion 46 rising upward from the outer peripheral edge of the bottom portion 44; a first guide portion 47 rising from between the inner wall portion 45 and the outer wall portion 46, having an upper end portion that draws a smooth arc shape and extends obliquely upward toward the center (in a direction close to the rotation axis CX of the substrate W held by the spin chuck 20); a cylindrical middle wall portion 48 rises upward from between the first guide portion 47 and the outer wall portion 46.

The inner wall portion 45 is formed to have such a length that, in a state where the inner cup 41 is raised to the highest position, the cover member 23 and the flange member 25 are accommodated therebetween with an appropriate gap maintained therebetween. The middle wall portion 48 is formed to have a length such that an appropriate gap is maintained between a second guide portion 52 of the middle cup 42, which will be described later, and the processing liquid separating wall 53 in a state where the inner cup 41 is closest to the middle cup 42, and is accommodated therebetween.

The first guide portion 47 has an upper end portion 47b that draws a smooth arc shape and extends obliquely upward toward the center (in a direction approaching the rotation axis CX of the substrate W). Further, a disposal groove 49 for collecting and disposing of used processing liquid is provided between the inner wall portion 45 and the first guide portion 47. An annular inner recovery groove 50 for collecting and recovering the used processing liquid is provided between the first guide portion 47 and the middle wall portion 48. An annular outer recovery tank 51 for collecting and recovering a treatment liquid of a different type from the inner recovery tank 50 is provided between the middle wall portion 48 and the outer wall portion 46.

An exhaust and drain mechanism, not shown, for discharging the processing liquid collected in the waste tank 49 and forcibly exhausting the inside of the waste tank 49 is connected to the waste tank 49. The exhaust drain mechanisms are provided at equal intervals in the circumferential direction of the waste groove 49, for example, four. Further, a recovery mechanism (both not shown) for recovering the processing liquids collected in the inner recovery tank 50 and the outer recovery tank 51 to a recovery tank provided outside the substrate processing apparatus 100 is connected to the inner recovery tank 50 and the outer recovery tank 51.

Further, the bottoms of the inner recovery tank 50 and the outer recovery tank 51 are inclined at a slight angle with respect to the horizontal direction, and the recovery mechanism is connected to the lowest position thereof. This enables smooth recovery of the treatment liquid flowing into the inner recovery tank 50 and the outer recovery tank 51.

The middle cup 42 surrounds the spin chuck 20 and has a shape that is substantially rotationally symmetrical with respect to the rotation axis CX passing through the center of the substrate W held by the spin chuck 20. The middle cup 42 has a second guide portion 52 and a cylindrical treatment liquid separation wall 53 connected to the second guide portion 52.

The second guide portion 52 is located outside the first guide portion 47 of the inner cup 41, and includes: a cylindrical lower end 52a coaxial with the lower end of the first guide 47; an upper end portion 52b that draws a smooth arc from the upper end of the lower end portion 52a and extends obliquely upward toward the center (in a direction close to the rotation axis CX of the substrate W); the folded portion 52c is formed by folding the tip end portion of the upper end portion 52b downward. In a state where the inner cup 41 is closest to the middle cup 42, the lower end portion 52a is accommodated in the inner recovery groove 50 with an appropriate gap maintained between the first guide portion 47 and the middle wall portion 48. The upper end portion 52b is provided to overlap the upper end portion 47b of the first guide portion 47 of the inner cup 41 in the vertical direction, and is provided to approach the upper end portion 47b of the first guide portion 47 with a very small gap therebetween in a state where the inner cup 41 is closest to the middle cup 42. In a state where the inner cup 41 and the middle cup 42 are closest to each other, the folded portion 52c horizontally overlaps the front end of the upper end portion 47b of the first guide portion 47.

The upper end 52b of the second guide 52 is formed to have a thicker wall thickness toward the lower side. The treatment liquid separation wall 53 has a cylindrical shape extending downward from the lower end outer peripheral portion of the upper end portion 52 b. In a state where the inner cup 41 is closest to the middle cup 42, the treatment liquid separation wall 53 is accommodated in the outer recovery groove 51 with an appropriate gap maintained between the middle wall portion 48 and the outer cup 43.

The outer cup 43 has a shape that is substantially rotationally symmetrical with respect to the rotation axis CX passing through the center of the substrate W held by the spin chuck 20. The outer cup 43 surrounds the spin chuck 20 outside the second guide portion 52 of the middle cup 42. The outer cup 43 functions as a third guide portion. The outer cup 43 has: a cylindrical lower end 43a coaxial with the lower end 52a of the second guide portion 52; an upper end portion 43b that draws a smooth arc from the upper end of the lower end portion 43a and extends obliquely upward toward the center (in a direction close to the rotation axis CX of the substrate W); the folded portion 43c is formed by folding the front end portion of the upper end portion 43b downward.

In a state where the inner cup 41 and the outer cup 43 are closest to each other, the lower end portion 43a is accommodated in the outer recovery groove 51 with an appropriate gap maintained between the treatment liquid separation wall 53 of the middle cup 42 and the outer wall portion 46 of the inner cup 41. The upper end portion 43b is provided to overlap the second guide portion 52 of the middle cup 42 in the vertical direction, and is close to the upper end portion 52b of the second guide portion 52 with a very small interval in a state where the middle cup 42 is closest to the outer cup 43. In a state where the middle cup 42 and the outer cup 43 are closest to each other, the folded portion 43c and the folded portion 52c of the second guide portion 52 overlap in the horizontal direction.

The inner cup 41, the middle cup 42 and the outer cup 43 can be lifted and lowered independently of each other. Namely: the inner cup 41, the middle cup 42, and the outer cup 43 are each provided with an elevating mechanism (not shown), and can be independently elevated. As such an elevating mechanism, various known mechanisms such as a ball screw mechanism and an air cylinder can be used.

The partition 15 is provided to vertically partition the inner space of the chamber 10 around the processing cup 40. The partition 15 may be a single plate-like member surrounding the processing cup 40, or may be a plurality of plate-like members joined together. In addition, a through hole or a slit penetrating in the thickness direction may be formed in the spacer 15, and in the present embodiment, a through hole for passing a support shaft for supporting the nozzle base 33, the nozzle base 63, and the nozzle base 68 of the nozzle 30, the nozzle 60, and the nozzle 65 is formed in the spacer 15.

The outer circumferential end of the partition 15 is coupled to the sidewall 11 of the chamber 10. The outer edge of the partition 15 surrounding the processing cup 40 is formed in a circular shape having an outer diameter larger than that of the outer cup 43. This prevents the partition 15 from interfering with the lifting of the outer cup 43.

Further, an exhaust passage 18 is provided at a position near the bottom wall 13 as a part of the side wall 11 of the chamber 10. The exhaust passage 18 is connected to an exhaust mechanism not shown. Among the clean air supplied from the FFU14 flowing downward in the chamber 10, the air passing between the processing cup 40 and the partition 15 is discharged from the exhaust passage 18 to the outside of the apparatus.

Fig. 4 is a diagram showing a positional relationship between the camera 70 and the nozzle 30. The camera 70 is disposed in the chamber 10 at a position closer to the upper side than the partition 15 (see fig. 3). The camera 70 includes an optical system such as a CCD (Charge Coupled Device), an electronic shutter, and a lens, which are one type of solid-state imaging Device.

The nozzle 30 is driven by the nozzle base 33 to reciprocate between a processing section PS1 (a dotted line position in fig. 4) above the substrate W held by the spin chuck 20 and a standby position (a solid line position in fig. 4) outside the processing cup 40.

The processing section PS1 is a section where the processing liquid is discharged from the nozzle 30 onto the upper surface of the substrate W held by the spin chuck 20 and the cleaning process is performed. Here, the processing section PS1 is a section extending in the horizontal direction between a first end TE1 and a second end TE2, the first end TE1 being located near an edge portion on one side of the substrate W held by the spin chuck 20, and the second end TE2 being located near an edge portion on the opposite side.

The standby position is a position where the discharge of the treatment liquid is stopped and the nozzle 30 is on standby when the cleaning process is not performed. In the standby position, a standby compartment may be provided which houses a spouting head 31 (see fig. 3) of the nozzle 30.

The camera 70 is disposed such that its shooting field of view includes the front end of the nozzle 30, that is, the camera 70 is disposed at a position including the vicinity of the ejection head 31 (see fig. 3).

In the present embodiment, the camera 70 can photograph a photographing region including the tip of the nozzle 30. Likewise, the camera 70 can photograph a photographing region including the front ends of the

nozzles

60 and 65.

When the camera 70 is disposed at the position shown in fig. 2 and 4, the nozzle 30 and the nozzle 60 move laterally within the imaging field of view of the camera 70, and therefore, the movement in the vicinity of each processing section can be appropriately imaged, but the nozzle 65 moves in the depth direction within the imaging field of view of the camera 70, and therefore, the movement amount in the vicinity of the processing section may not be appropriately imaged. In this case, a camera of the shooting nozzle 65 may be provided in addition to the camera 70.

As shown in fig. 3, an illumination portion 71 is provided in the chamber 10 at a position above the partition 15. If the chamber 10 is a dark room, the control unit 9 may control the illumination unit 71 so that the illumination unit 7 emits light when the camera 70 performs imaging.

Fig. 5 is a functional block diagram of the control unit 9. The hardware configuration of the control unit 9 provided in the substrate processing apparatus 100 is the same as that of a conventional computer. That is, as will be described later, the control unit 9 is configured to include a CPU and a storage unit, and the CPU executes various kinds of calculation processing, and the storage unit includes a Read Only Memory (ROM) which is a read only memory for storing a basic program, a Random Access Memory (RAM) which is a free-read memory for storing various kinds of information, a magnetic disk in which control software, data, and the like are stored, and the like. The CPU of the control unit 9 executes a predetermined processing program, and the control unit 9 controls each operation mechanism of the substrate processing apparatus 100 to execute the processing of the substrate processing apparatus 100.

The position detection unit 90, the position deviation detection unit 91, the ejection determination unit 94, and the command transmission unit 92 shown in fig. 5 are functional processing units that are realized in the control unit 9 by the CPU of the control unit 9 executing a predetermined processing program.

The position detecting unit 90 detects the position of the nozzle 30 based on the image data input from the camera 70.

The positional deviation detecting section 91 compares the position of the nozzle 30 detected by the position detecting section 90 with a reference position of the nozzle 30 measured in advance, thereby detecting the positional deviation of the nozzle 30.

The discharge determination unit 94 determines whether or not the processing liquid is discharged from the nozzle 30 by image analysis in a determination area described later.

The command transmitting unit 92 outputs a command (control information) according to a protocol describing various conditions for processing the substrate W, and operates each component of the cleaning processing unit 1. Specifically, the command transmitting unit 92 outputs a command to the nozzle 30, the nozzle 60, and the nozzle 65, and operates a driving source (motor) incorporated in the nozzle base 33, the nozzle base 63, and the nozzle base 68. For example, when the command transmitting unit 92 transmits a command to move to the first end TE1 of the processing section PS1 to the nozzle 30, the nozzle 30 moves from the standby position to the first end TE 1. Further, when the command transmitting unit 92 transmits a command to move to the second end TE2 of the processing section PS1 to the nozzle 30, the nozzle 30 moves from the first end TE1 to the second end TE 2. The discharge of the processing liquid from the nozzle 30 may be executed in accordance with the command transmission from the command transmitting unit 92.

Further, the display unit 95, the input unit 96, and the plurality of cleaning processing units 1 are connected to the control unit 9. The display unit 95 displays various information based on the image signal from the control unit 9. The input unit 96 is constituted by an input device such as a keyboard and a mouse connected to the control unit 9, and receives an input operation performed by an operator on the control unit 9. The plurality of cleaning processing units 1 operate the respective components in the respective cleaning processing units 1 in accordance with various commands (control information) transmitted by the command transmitting section 92.

Fig. 6 is a diagram schematically illustrating a hardware configuration when the control unit 9 illustrated in fig. 5 is actually operated.

Fig. 6 shows a processing circuit 1102A for performing calculation and a storage device 1103 capable of storing information, as hardware configurations for realizing the position detection unit 90, the misalignment detection unit 91, and the command transmission unit 92 in fig. 5.

The processing circuit 1102A is, for example, a CPU. The storage device 1103 is, for example, a Hard Disk Drive (HDD), a RAM, a ROM, a flash memory, or other memory (storage medium).

< action with respect to substrate processing apparatus >

The normal processing of the substrate W in the substrate processing apparatus 100 includes, in order, a process in which the main transport robot 103 carries the target substrate W to be processed received from the indexer 102 into each of the cleaning processing units 1, a process in which the cleaning processing units 1 perform substrate processing on the substrate W, and a process in which the main transport robot 103 carries the processed substrate W out of the cleaning processing units 1 and returns the processed substrate W to the indexer 102.

Next, a description will be given of a sequence of a cleaning process and a drying process in a typical substrate process of the substrates W in each cleaning process unit 1 with reference to fig. 7. Fig. 7 is a flowchart showing the operation of the substrate processing apparatus 100 according to the present embodiment.

First, a chemical solution is supplied to the front surface of the substrate W to perform a predetermined chemical solution process (step ST 01). Subsequently, pure water is supplied to perform pure water rinsing processing (step ST 02).

Further, the pure water is spun off by rotating the substrate W at a high speed, thereby drying the substrate W (step ST 03).

When the cleaning unit 1 performs substrate processing, the spin chuck 20 holds the substrate W and the processing cup 40 moves up and down.

When the cleaning processing unit 1 performs the chemical solution processing, for example, only the outer cup 43 is lifted, and an opening surrounding the periphery of the substrate W held by the spin chuck 20 is formed between the upper end portion 43b of the outer cup 43 and the upper end portion 52b of the second guide portion 52 of the middle cup 42. In this state, the substrate W is rotated together with the spin chuck 20, and the chemical liquid is supplied from the nozzle 30 and the lower surface treatment liquid nozzle 28 to the upper surface and the lower surface of the substrate W. The supplied chemical solution flows along the upper and lower surfaces of the substrate W by centrifugal force generated by rotation of the substrate W, and quickly splashes laterally from the outer edge portion of the substrate W. Thereby, the chemical treatment of the substrate W is performed. The chemical solution splashed from the outer edge of the rotating substrate W is stopped by the upper end portion 43b of the cup 43, flows down along the inner surface of the outer cup 43, and is collected in the outer collection tank 51.

When the cleaning processing unit 1 executes the pure water rinsing process, for example, the inner cup 41, the middle cup 42, and the outer cup 43 all rise, and the periphery of the substrate W held by the spin chuck 20 is surrounded by the first guide portion 47 of the inner cup 41. In this state, the substrate W is rotated together with the spin chuck 20, and pure water is supplied from the nozzle 30 and the lower surface treatment liquid nozzle 28 to the upper surface and the lower surface of the substrate W. The supplied pure water flows along the upper and lower surfaces of the substrate W by centrifugal force generated by rotation of the substrate W, and quickly splashes laterally from the outer edge portion of the substrate W. Thereby, the pure water rinsing process of the substrate W is performed. The pure water splashed from the outer edge of the rotating substrate W flows down along the inner wall of the first guide 47 and is discharged from the disposal tank 49. Further, if pure water is collected through a path different from the chemical solution, the middle cup 42 and the outer cup 43 can be raised, and an opening surrounding the periphery of the substrate W held by the spin chuck 20 can be formed between the upper end portion 52b of the second guide portion 52 of the middle cup 42 and the upper end portion 47b of the first guide portion 47 of the inner cup 41.

When the spin-dry process is performed by the cleaning process unit 1, all of the inner cup 41, the middle cup 42, and the outer cup 43 are lowered, and the upper end portion 47b of the first guide portion 47 of the inner cup 41, the upper end portion 52b of the second guide portion 52 of the middle cup 42, and the upper end portion 43b of the outer cup 43 are located below the substrate W held by the spin chuck 20. In this state, the substrate W is rotated at a high speed together with the spin chuck 20, and water droplets adhering to the substrate W are thrown off by centrifugal force to perform drying processing.

< location detection >

Next, the position detection of the nozzle performed by the substrate processing apparatus according to the present embodiment will be described with reference to fig. 8, 9, and 10. Since the nozzle 30 of the present embodiment can move as in the example shown in fig. 4 and the like, it is necessary to detect the position of the moving nozzle 30 as follows.

Fig. 8 is a diagram showing an example of the swingable range of the nozzle 30. Further, the swingable range of the nozzle 30 in fig. 8 does not include the standby position in fig. 4. Although fig. 8 is a diagram showing an example of an imaging area including the tip of the nozzle 30 imaged by the camera 70, the nozzle 60 and the nozzle 65 can be set in the same manner as the nozzle swingable range.

The nozzle 30 in fig. 8 has a nozzle arm 32 disposed above a processing cup 40, and a discharge head 31 attached to the tip of the nozzle arm 32 faces the upper surface of the substrate W surrounded by the processing cup 40 in a plan view.

In this case, a range in which the nozzle 30 can be swung by the rotation of the nozzle arm 32 driven by the nozzle base 33 is set as a swing range.

The swing range is set mainly to a range in a direction substantially parallel to the upper surface of the substrate W, and may be set to a range in a direction perpendicular to the upper surface of the substrate W.

The swing range of the nozzle 30 includes a region where the nozzle 30 substantially stops, i.e., a stop region, and a region where the nozzle 30 moves, i.e., a moving region.

The stop region in fig. 8 is a region including the first end TE1 or the second end TE2, and is a region in which the moving speed of the nozzle 30 is lower than the moving speed of the nozzle 30 in the moving region. That is, the moving speed of the nozzle 30 in the stop region may be 0 indicating a completely stopped state, or may be a speed much smaller than the moving speed in the moving region.

In the example shown in fig. 8, the stop regions are respectively represented as a matching window 201 composed of the first end TE1 and its vicinity (including a part of the processing section PS1), and a matching window 202 composed of the second end TE2 and its vicinity (including a part of the processing section PS 1). In the example shown in fig. 8, the moving area is shown as an area sandwiched between matching window 201 and matching window 202. Further, the stop region is not limited to be set to a plurality, and for example, in the case where the nozzle 30 moves around, at least one stop region may be set. In addition, the moving area may be set to be plural.

In the matching window 201, a region of interest (ROI) 201A is set, and the region of interest 201A is used for matching processing (template matching) using reference image data. Similarly, in the matching window 202, an ROI202A for template matching is set.

Next, the position detection operation of the nozzle performed by the substrate processing apparatus according to the present embodiment will be described with reference to fig. 9 and 10. Fig. 9 is a flowchart showing the position detection operation of the nozzle 30. Fig. 10 is a diagram for explaining template matching.

First, the position detecting unit 90 records an operation image of the nozzle 30 over the entire swing range by the camera 70 (step ST 101). On the other hand, the position detection unit 90 registers the reference image data (template) for template matching in each stop area (step ST 102). The reference image data is, for example, image data of the ejection head 31 attached to the tip of the nozzle 30 in the stop region.

Next, as illustrated in fig. 10, the position detector 90 sets an ROI201A in the matching window 201 corresponding to the first end TE1 and its vicinity with respect to one image frame (image frame at the time of operation start) of the image data of the recorded operation image, and performs template matching between the image superimposed on the ROI201A and the reference image data (step ST 103). Here, the ROI201A is set in accordance with, for example, the size of the discharge head 31 attached to the tip of the nozzle 30 at the matching window 201. When performing template matching, ROI201A is moved to search the inside of matching window 201, and an image superimposed on ROI201A and reference image data are searched for a region having a high similarity.

Then, the position detection unit 90 determines whether or not the template matching is successful (step ST 104). If the template matching is successful, the coordinate position (for example, XYZ-axis coordinates) of the nozzle 30 is registered or updated based on the matched image (step ST 105).

On the other hand, if the template matching is not successful, in the other matching window (matching window 202), the template matching using the reference image data is performed (step ST 106). Then, the coordinate position (for example, XYZ axis coordinates) of the nozzle 30 is registered or updated based on the matched image (step ST 105).

Although the matching window 201 (and the matching window 202) are set to include a part of the processing section PS1, the matching process can be performed even in the processing section PS1 at a stage when the moving speed of the nozzle 30 is sufficiently small (or at a stage when the shape or the like of the nozzle does not significantly change with respect to the reference image data in the matching window).

In addition, depending on the angle at which the nozzle 30 is photographed by the camera 70, the area including the front end of the nozzle 30 on the first end TE1 (or the second end TE2) may be sometimes shielded by the processing cup 40. In this case, if the matching window 201 (and the matching window 202) includes a part of the processing section PS1, the nozzle 30 in a state of moving from the first end TE1 (or the second end TE2) to the processing section PS1 can be subjected to the matching process within the matching window 201 (or the matching window 202).

Next, the position detecting unit 90 performs tracking processing between a plurality of image frames (step ST 107). At this time, the tracking process is performed between temporally successive image frames with reference to the coordinate position of the nozzle 30 registered or updated in the previous stop region (i.e., the position of the ROI successfully matched).

According to the tracking process, the coordinate position of the nozzle 30 (i.e., the position of the ROI) can be obtained in each of a plurality of image frames that are continuous with time. Further, as a method of the tracking processing, for example, a median flow tracking algorithm can be used.

In the median flow tracking algorithm, first, a tracking target point of a specified density is generated in a specified region of an initial image frame. Then, for each tracking object point, each position in the next image frame is tracked over time by a Lucas-Kanade Tracker (Lucas-Kanade Tracker). Further, the tracking target point having a large tracking Error is removed from the tracking by a Forward-Backward Error (Forward-Backward Error), and the median (central value) of the amount of change in the position of the tracking target point in the previous and subsequent image frames is obtained using the remaining tracking target points. And, when the value is smaller than the specified value, the tracking processing is continued.

Then, the position detecting unit 90 determines whether or not the coordinate position of the nozzle 30 (i.e., the position of the ROI) obtained by the tracking process is within the stop region (step ST 108).

If the coordinate position of the nozzle 30 reaches within the stop region, the process returns to step ST103 to perform template matching within the corresponding stop region for the image frame for which the coordinate position is obtained.

On the other hand, if the coordinate position of the nozzle 30 does not reach within the stop region, the process returns to step ST107 to perform the tracking process between a plurality of image frames.

According to the position detection operation, even if the nozzle 30 is moving, the position of the nozzle 30 can be appropriately detected by performing the tracking process between the plurality of image data.

Further, although the tracking error is accumulated and the position cannot be appropriately detected when the tracking process is continuously executed, the error accumulated by the tracking process can be reset because the template matching is performed in the stop area in the position detection operation. Thus, even when the position of the moving nozzle 30 is continuously detected by the tracking process, accumulation of the tracking error can be suppressed.

< about reference image data >

The images of the nozzles 30 in the respective matching windows differ depending on the distance or angle from the camera 70, and the like. For this purpose, it is preferable to register reference image data for template matching (that is, image data of the ejection heads 31 in the respective matching windows) for comparison with the image, in correspondence with each matching window.

Fig. 11 is a diagram showing an example of reference image data corresponding to matching window 201. Fig. 12 is a diagram showing another example of the reference image data corresponding to the matching window 202.

As illustrated in fig. 11 and 12, the shape of the discharge head 31 in each reference image data differs depending on the direction of the camera 70, the distance from the camera 70, and the like. Therefore, by using different reference image data for each matching window shown in fig. 11 and 12, template matching can be performed with high accuracy.

< detection of positional deviation >

The positional deviation detecting unit 91 can detect the positional deviation of the moved nozzle 30 from the reference position using the position of the nozzle as detected above. The reference position is, for example, a coordinate position of the nozzle 30 set in advance according to a protocol or the like.

Fig. 13 is a diagram showing an example of positional deviation when the nozzle 30 moves in a plurality of patterns. In fig. 13, the vertical axis represents the magnitude of the deviation from the reference position in the height direction, and the horizontal axis represents the horizontal movement distance of the nozzle.

In fig. 13, the change in position when the nozzle 30 swings is shown by a plurality of patterns (three patterns), and for example, when the detected position of the nozzle 30 is compared with a reference position of the nozzle 30, and the detected position of the nozzle 30 is deviated from the reference position by a magnitude equal to or larger than a threshold value, the position can be detected as being deviated. The threshold value can be determined by the required positional accuracy of the nozzle.

< judgment on blowout >

Next, with reference to fig. 14, 15, and 16, the ejection determination for determining whether or not the processing liquid is ejected from the nozzle will be described. Fig. 14 is a diagram showing an example of the determination region 301 for ejection determination.

As illustrated in fig. 14, when the ejection determination is performed, the determination region 301 is added directly below the ROI 302. In fig. 14, the determination region 301 is added directly below the ROI302 in the matching window 201, and the determination region 301 is similarly added directly below the ROI302 in other stop regions and moving regions.

The size (length and width) of the determination region 301 depends on the size of the ROI 302. That is, in the case where the ROI302 is set in accordance with the size of the discharge head 31 in conjunction with the matching process and the tracking process, the size of the determination region 301 is also set in accordance with the size of the discharge head 31.

The ejection determination is performed by image analysis in the determination region 301. Fig. 15 and 16 are diagrams showing examples of images in the determination region 301. In fig. 15 and 16, the horizontal direction is set as the X direction, and the vertical direction (i.e., the direction in which the processing liquid is discharged) is set as the Y direction.

As illustrated in fig. 15, if the processing liquid is not discharged, the image of the processing liquid is not displayed in the determination area 301, and the image of the substrate W, the processing cup 40, or the like is displayed. Therefore, no portion where a significant luminance difference occurs in the determination region 301 is determined.

On the other hand, as illustrated in fig. 16, if the processing liquid is discharged, an image of the processing liquid 400 having high luminance is displayed in a part of the determination area 301. Therefore, a significant difference in brightness occurs between the liquid column portion of the processing liquid 400 in the judgment region 301 and the peripheral portion thereof. Further, there is a case where the image of the processing liquid 400 is lower in brightness than the surrounding when the illumination directions are different, and even in this case, a significant difference in brightness occurs between the liquid column portion of the processing liquid 400 and the surrounding portion thereof in the determination region 301.

Thus, if the magnitude of the luminance difference in the determination region 301 exceeds the threshold value, it can be determined that the treatment liquid 400 is discharged.

In the calculation of the luminance difference in the determination region 301, the luminance value is integrated for each pixel row along the direction in which the processing liquid 400 is discharged (the direction in which the processing liquid flows down), and the luminance difference is calculated for each pixel row, whereby the luminance difference between the liquid column portion of the processing liquid 400 and the peripheral portion thereof can be further enhanced. Therefore, the ejection determination can be performed with higher accuracy.

< Effect obtained by the above-described embodiment >

Next, an example of the effects produced by the above-described embodiments will be shown. In the following description, although the effects are described based on the specific configurations exemplified in the above-described embodiments, the effects may be interchanged with other specific configurations exemplified in the present specification within the range where the similar effects are produced.

According to the above-described embodiment, the substrate processing apparatus includes the nozzle 30, the imaging unit, and the position detection unit 90. The imaging unit is a component corresponding to the camera 70, for example. The nozzle 30 is capable of oscillating. The nozzle 30 discharges the processing liquid toward the substrate W. The camera 70 photographs the nozzle 30. The camera 70 outputs image data of the nozzle 30. The position detecting unit 90 detects the position of the nozzle 30 based on the image data. The swingable range of the nozzles 30 includes a stop region where at least one nozzle 30 stops and a movement region where at least one nozzle 30 moves, respectively. The stop region is, for example, a region corresponding to the matching window 201, the matching window 202, and the like. The movement region is, for example, a region corresponding to a section sandwiched between two matching windows in the processing section PS 1. Then, the position detecting unit 90 performs matching processing on the image data using the reference image data in the stop region, thereby detecting the position of the nozzle 30. The position detecting unit 90 detects the position of the nozzle 30 by performing tracking processing between consecutive image data with reference to the position of the nozzle 30 detected in the stop region in the moving region.

In addition, according to the above-described embodiment, the substrate processing apparatus includes the nozzle 30 and the camera 70. The substrate processing apparatus includes a processing circuit 1102A for executing a program and a storage device 1103 for storing the executed program. Also, the following operation is realized by the processing circuit 1102A executing a program.

That is, in the stop region, the image data is subjected to matching processing using the reference image data, and the position of the nozzle 30 is detected. In the moving area, the position of the nozzle 30 is detected by performing tracking processing between consecutive image data with reference to the position of the nozzle 30 detected in the stop area.

With this configuration, the position of the nozzle 30 being stopped is detected by performing the matching process in the stop region (the matching windows 201 and 202), and the position of the nozzle 30 being moved can be detected by performing the tracking process with reference to the detected position of the nozzle 30 in the movement region (the processing section PS 1). This makes it possible to detect the position of the moving nozzle 30 without using a plurality of pieces of reference image data. Further, by the matching processing in the stop region, the position of the nozzle 30 which becomes the reference of the tracking processing can be detected, and the accumulation of errors due to the tracking processing can be eliminated.

The same effects can be produced if other structures exemplified in the present specification are appropriately added to the above-described structure, that is, if other structures in the present specification that are not mentioned are appropriately added to the above-described structure.

In addition, according to the above-described embodiment, the swingable range of the nozzle 30 includes the matching window 201 and the matching window 202. Then, reference image data is set for each of the matching window 201 and the matching window 202. With this configuration, the reference image data is set in correspondence with the image of the nozzle 30 whose size and shape have changed, in each of the stop regions (the matching window 201 and the matching window 202). Therefore, the matching process can be appropriately performed in each stop region.

Further, according to the above-described embodiment, the position detection unit 90 sets the target region corresponding to the position of the nozzle 30 and the determination region 301 which is located directly below the target region and determines whether or not the treatment liquid 400 is ejected from the nozzle 30. Wherein the target region is, for example, a region corresponding to the ROI302 or the like. Then, the position detecting unit 90 changes the size of the ROI302 and the size of the determination region 301 in conjunction with the matching process and the tracking process. With this configuration, the size of the determination region 301 is changed together with the size of the ROI302 in conjunction with the tracking process, thereby improving the accuracy of the discharge determination of the determination region 301.

In addition, according to the above-described embodiment, the substrate processing apparatus includes the misalignment detection unit 91, and the misalignment detection unit 91 detects the misalignment of the nozzle 30 by comparing the detected position of the nozzle 30 with the reference position of the nozzle 30 measured in advance by the position detection unit 90. With this configuration, when the difference between the position of the nozzle 30 detected by the position detecting unit 90 and the reference position of the nozzle 30 is equal to or greater than the threshold value, it can be detected that the nozzle 30 is out of position.

< modification of the above-described embodiment >

In the above-described embodiments, materials, dimensions, shapes, relative arrangement relationships, implementation conditions, and the like of the respective components are described, but these are examples of all the embodiments and do not limit the contents described in the present specification.

Therefore, a myriad of modifications and equivalent members not illustrated can be conceived within the technical scope disclosed in the present specification. For example, the case of deforming at least one structural member, the case of adding, or the case of omitting is included.

In addition, each component described in the above-described embodiments may be assumed to be software or firmware, or may be assumed to be hardware corresponding thereto, and in both concepts, each component is referred to as a "section" or a "processing circuit" (circuit).

Claims

1. A substrate processing apparatus includes:

a nozzle which is swingable and ejects a treatment liquid to a substrate;

a photographing part for photographing the nozzle and outputting image data of the nozzle;

a position detecting section for detecting a position of the nozzle based on the image data,

the swingable ranges of the nozzles respectively include at least one stop region where the nozzles are stopped and at least one moving region where the nozzles are moved,

in the stop region, the position detection section detects the position of the nozzle by performing matching processing on the image data using reference image data,

in the moving region, the position detecting unit detects the position of the nozzle by performing tracking processing between consecutive image data with reference to the position of the nozzle detected in the stop region.

2. The substrate processing apparatus according to claim 1,

the swingable range of the nozzle includes a plurality of the stop regions,

the reference image data is set according to each of the stop regions.

3. The substrate processing apparatus according to claim 1 or 2,

the position detection section sets a target region corresponding to a position of the nozzle and a determination region that is located directly below the target region and that determines whether or not the processing liquid ejected from the nozzle is ejected,

the size of the target region and the size of the determination region are changed in conjunction with the matching process and the tracking process.

4. The substrate processing apparatus according to claim 1 or 2,

further comprising:

and a positional deviation detecting unit that detects a positional deviation of the nozzle by comparing the position of the nozzle detected by the position detecting unit with a reference position of the nozzle measured in advance.

5. A method of processing a substrate, comprising:

a step of picking up an image of a nozzle which is swingable and ejects a processing liquid onto a substrate, and outputting image data of the nozzle;

detecting a position of the nozzle based on the image data,

the step of detecting the position of the nozzle includes:

detecting a position of the nozzle in the stop region by performing matching processing on the image data using reference image data;

and detecting the position of the nozzle by performing a tracking process between the consecutive image data with reference to the position of the nozzle detected in the stop region in the moving region.