CN112490163A - Solar silicon wafer light-decay-resistant equipment and light-decay-resistant treatment method - Google Patents
Solar silicon wafer light-decay-resistant equipment and light-decay-resistant treatment method Download PDFInfo
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 502
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 502
- 239000010703 silicon Substances 0.000 title claims abstract description 502
- 238000000034 method Methods 0.000 title claims description 41
- 238000007599 discharging Methods 0.000 claims abstract description 17
- 235000012431 wafers Nutrition 0.000 claims description 490
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- 230000007246 mechanism Effects 0.000 claims description 91
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- 230000000903 blocking effect Effects 0.000 claims description 12
- 238000005096 rolling process Methods 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000010992 reflux Methods 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000033001 locomotion Effects 0.000 description 16
- 238000010586 diagram Methods 0.000 description 7
- 230000003139 buffering effect Effects 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000009966 trimming Methods 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
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- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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Abstract
The invention relates to the technical field of solar silicon wafer production. A solar silicon wafer light attenuation resisting device comprises a workbench, and a silicon wafer feeding device, a silicon wafer conveying device, a light attenuation furnace and a discharging device which are fixed on the workbench; the input end and the output end of the silicon wafer feeding device are respectively connected with the silicon wafer feeding port and the input end of the silicon wafer conveying device; the output end of the silicon wafer conveying device is connected with the feed inlet of the light attenuation furnace, and the discharge outlet of the light attenuation furnace is connected with the feed end of the blanking device; the discharging end of the discharging device is connected with the discharging station. According to the equipment, the automatic processing and circulation of the solar silicon wafer are realized by arranging the silicon wafer feeding device, the silicon wafer conveying device, the light attenuation furnace and the discharging device, and the automation degree of the whole equipment is improved.
Description
Technical Field
The invention relates to the field of solar silicon wafers, in particular to a solar silicon wafer light-decay-resistant device and a light-decay-resistant processing method.
Background
At present, the boron-doped P-type crystalline silicon solar cell is a product occupying more than 70% of the photovoltaic market, however, the solar cell has a phenomenon of efficiency reduction when in use, and the phenomenon is called light-induced degradation. The light attenuation research is to irradiate the silicon wafer under a light source, test the electrical properties before and after irradiation and obtain the corresponding light attenuation amplitude. The study of the light attenuation of silicon wafers is generally carried out by placing the silicon wafers in a light attenuation box simulating a solar light generator for light irradiation and then testing the electrical properties of the silicon wafers. When the light attenuation condition of the silicon wafer is researched, the solar silicon wafer needs to be automatically subjected to loading and unloading and light irradiation treatment, so that the solar silicon wafer light attenuation resisting equipment used in the treatment process is particularly important.
The Chinese patent application (publication No. CN107046081A, published as 20170815) discloses a light attenuation resistant furnace, which comprises a furnace support and a plurality of constant current sources, wherein a conveying device for circularly conveying silicon wafers is arranged on the furnace support, the furnace support is sequentially provided with a preheating area, an illumination area and a cooling area along the material inlet end to the material outlet end of the conveying device, a plurality of groups of LED light illumination modules arranged side by side are arranged right above the illumination area, each group of LED light illumination modules consists of a plurality of LED light bars with water cooling function, and each LED light bar is independently controlled by one constant current source. The constant current source independently controls the LED lamp strip, so that the LED lamp strip has ultrahigh illumination intensity, and meanwhile, the heating temperature of the LED lamp strip can be controlled, and the LED lamp strip can work at a constant temperature. In the process that the silicon wafer enters the light attenuation resisting furnace, the silicon wafer is irradiated by the strong light of the plurality of groups of LED lamp light irradiation modules, and the hydrogen passivation effect of the silicon wafer is obvious.
Silicon wafer the prior art silicon wafer has the following disadvantages: 1. when the solar silicon wafer is subjected to light attenuation treatment, each procedure is independently completed on a single workbench by manual work, and then a product flow is sent to the next workbench through a conveying line for next procedure processing, so that the whole light attenuation treatment process of the solar silicon wafer is finally completed; and each process needs the manual work to participate in and assist the unloading circulation when processing, influences the machining efficiency of whole device to cause whole equipment's degree of automation to be lower. 2. When the solar silicon wafer is fed, the two cylinders are adopted to respectively drive the limiting heads to move to positions in contact with the two side faces of the solar silicon wafer so as to limit the solar silicon wafer on the conveying belt; when the solar silicon wafer is driven by the air cylinder, the moving stroke of the solar silicon wafer and the length of the limiting head connected with the air cylinder are fixed, namely, one group of air cylinders and the limiting head correspond to the solar silicon wafer with one size specification; when the solar silicon wafers with different specifications are subjected to feeding limiting, the length of a limiting cylinder or a limiting head needs to be changed, so that the applicability of the whole equipment is reduced; meanwhile, the manufacturing precision of the air cylinder is generally low, so that the position precision of the limiting head is low when the air cylinder drives the limiting head; the situation that the limiting head deviates from the limiting position and is excessively contacted with the solar silicon wafer to damage the solar silicon wafer or is insufficiently contacted with the solar silicon wafer to be incapable of limiting is easily caused, so that the accurate limiting of the solar silicon wafer is not facilitated. 3. When the solar silicon wafers are conveyed, the plurality of solar silicon wafers are moved into the positioning jig, and then the positioning jig is directly conveyed to the next station through the conveyor belt to complete the conveying process of the solar silicon wafers; the silicon wafer positioning jig is in clearance fit with the solar silicon wafer in order to ensure that the solar silicon wafer can be smoothly placed, namely, a gap is formed between the edge of the solar silicon wafer and the positioning jig; due to the moving error, when a plurality of solar silicon wafers are stacked in the silicon wafer positioning jig, the solar silicon wafer positioned above and the solar silicon wafer positioned below can be out of alignment; due to the fact that no device for arranging the stacked solar silicon wafers is arranged, the solar silicon wafers cannot be aligned when being subjected to light attenuation treatment after being conveyed, so that the solar silicon wafers at different positions have different light attenuation treatment effects, and the quality of the light attenuation treatment is reduced. 4. When the redundant positioning jigs are cached, the redundant positioning jigs are moved to a caching station by a moving device, and the positioning jigs on the caching station are moved to a jig output station by the moving device when the positioning jigs need to be used; when the positioning jig is input and output in the cache mode, the moving device is required to carry, and the moving device is required to complete three steps of downward moving, grabbing, translational conveying and jig falling, so that the cache of the positioning jig can be completed, and the complexity of equipment and the cache step of the positioning jig are increased; meanwhile, the solar silicon wafers are hard and brittle materials, and impact force generated in the processes of carrying, grabbing, moving upwards and falling easily causes mutual extrusion and collision of the solar silicon wafers stacked in the positioning jig; thereby causing the solar silicon wafer to be cracked and reducing the quality of the solar silicon wafer in the buffering process.
Disclosure of Invention
The purpose of the invention is: aiming at the problems, the solar silicon wafer light attenuation resisting equipment and the method are provided, wherein the automatic processing and circulation of the solar silicon wafer is realized by arranging the silicon wafer feeding device, the silicon wafer conveying device, the light attenuation furnace and the discharging device, and the automation degree of the whole equipment is improved.
In order to achieve the purpose, the invention adopts the following technical scheme:
a solar silicon wafer light attenuation resisting device comprises a workbench, and a silicon wafer feeding device, a silicon wafer conveying device, a light attenuation furnace, a discharging device and a jig backflow device which are fixed on the workbench; the input end and the output end of the silicon wafer feeding device are respectively connected with the silicon wafer feeding port and the input end of the silicon wafer conveying device; the output end of the silicon wafer conveying device is connected with the feed inlet of the light attenuation furnace, and the discharge outlet of the light attenuation furnace is connected with the feed end of the blanking device; the discharging end of the discharging device is connected with a discharging station; the silicon wafer feeding device is used for feeding the solar silicon wafer; the silicon wafer conveying device is used for conveying the solar silicon wafer to a feed inlet of the light attenuation furnace; the light attenuation furnace is used for simulating sunlight irradiation to enable the solar silicon wafer to generate a light attenuation effect; the blanking device is used for blanking the solar silicon wafer after light attenuation; the jig backflow device is connected with the silicon wafer feeding device and the discharging device; the silicon wafer feeding device comprises a feeding conveyer belt, a silicon wafer limiting mechanism and a silicon wafer moving mechanism; the feeding conveyer belt and the silicon wafer limiting mechanism are fixed on the workbench, and the output end of the feeding conveyer belt is in contact with the lower surface of the solar silicon wafer; the output end of the silicon wafer limiting mechanism is contacted with two end faces of the solar silicon wafer; the output end of the silicon wafer moving mechanism is contacted with the upper surface of the solar silicon wafer, and the output end of the silicon wafer moving mechanism is respectively connected with the feeding conveyer belt and the input end of the silicon wafer conveyer device; the feeding conveyer belt is used for conveying the solar silicon wafer; the silicon wafer limiting mechanism is used for conveying and positioning the solar silicon wafers with different widths; the silicon wafer conveying mechanism is used for conveying the solar silicon wafer into the silicon wafer conveying device; the silicon wafer conveying device comprises a jig feeding mechanism and a jig caching mechanism; the jig feeding mechanism and the jig caching mechanism are fixed on the workbench, the input end of the jig feeding mechanism is connected with the output end of the silicon wafer feeding device, and the output end of the jig feeding mechanism is connected with the input end of the jig caching mechanism; the output end of the jig caching mechanism is connected with the feed inlet of the light attenuation furnace; the jig feeding mechanism is used for positioning and conveying the solar silicon wafer; the jig caching mechanism is used for caching the conveyed redundant jigs and then outputting the buffered redundant jigs to the next station.
Preferably, the silicon wafer limiting mechanism comprises a limiting rack, a limiting motor, a limiting roller, a first limiting head and a second limiting head; the output end of the limiting motor is connected with the limiting rolling shaft, and the limiting rolling shaft is in running fit with the limiting rack; the first limiting head and the second limiting head comprise limiting connecting rods, limiting guide rail sliding blocks and limiting clamping blocks; one end of the limiting connecting rod is eccentrically hinged with the limiting rolling shaft, and the other end of the limiting connecting rod is hinged with the limiting clamping block; the guide rail in the limiting guide rail sliding block is fixed on the limiting rack, the sliding block in the limiting guide rail sliding block is connected with the limiting clamping block, and the output end of the limiting clamping block is contacted with the side end face of the solar silicon wafer; the limiting motor is used for driving the limiting rolling shaft to rotate; the limiting roller is used for driving the first limiting head and the second limiting head to move linearly; the limiting clamping block is used for limiting transmission of solar silicon wafers with different widths.
Preferably, the limiting rolling shaft comprises a limiting mandrel, an upper limiting roller and a lower limiting roller; the limiting mandrel is in running fit with the limiting frame, and the upper limiting roller and the lower limiting roller are respectively fixed above and below the limiting mandrel; the upper limiting roller is eccentrically hinged with a limiting connecting rod in the second limiting head, and the lower limiting roller is eccentrically hinged with a limiting connecting rod in the first limiting head; the lower limiting roller is a belt wheel and is connected with a limiting motor through a belt; the limiting clamping block comprises a clamping block base and a clamping block head; the clamping block base is fixed on a sliding block in the limiting guide rail sliding block; the lower end of the clamping block base is hinged with the limiting connecting rod, the upper end of the clamping block base is connected with the clamping block head, and the output end of the clamping block head is contacted with the side face of the solar silicon wafer; the clamping block head comprises a clamping block head fixing seat and a clamping block bearing; a plurality of clamping block bearings are fixed on the clamping block head fixing seat, and the outer surfaces of the clamping block bearings are in contact with the side surfaces of the solar silicon wafers; the outer surface material of the clamp block bearing is rubber; the silicon wafer moving mechanism comprises a moving driving motor and a moving sucker; the output end of the moving driving motor is connected with a moving sucker, the output end of the moving sucker is contacted with the upper surface of the solar silicon wafer, and the output end of the moving sucker is respectively connected with the feeding conveyer belt and the silicon wafer conveying device; the output end of the moving sucker is a silica gel sucker.
Preferably, the jig feeding mechanism comprises a jig conveying belt, a silicon wafer positioning jig, a jig top-pushing assembly and a silicon wafer sorting assembly; the silicon wafer arranging component comprises an arranging forward pushing cylinder, an arranging guide rail sliding block, a front and rear arranging element and a left and right arranging element; the front and rear arranging elements are fixed on the sliding blocks in the arranging guide rail sliding blocks, and the output end of the arranging forward pushing cylinder is connected with the front and rear arranging elements; the output ends of the left and right sorting elements are respectively contacted with the left and right side surfaces of the solar silicon wafer; the front and rear arrangement element comprises a front and rear arrangement cylinder and a front and rear arrangement head; the output end of the front and rear arrangement cylinder is connected with the front and rear arrangement heads, and the front and rear arrangement heads are respectively contacted with the front and rear side surfaces of the solar silicon wafer; the left and right arranging elements comprise a left and right arranging cylinder and a left and right arranging head; the output ends of the left and right arranging cylinders are connected with the left and right arranging heads, and the left and right arranging heads are contacted with the left and right sides of the solar silicon wafer; the jig conveying belt is used for conveying the silicon wafer positioning jig; the silicon wafer positioning jig is used for positioning the solar silicon wafers; the jig jacking assembly is used for jacking and positioning the silicon wafer positioning jig. The front and rear arranging heads comprise front and rear arranging bases and front and rear arranging clamping blocks; one end of the front and rear arranging base is connected with the output end of the front and rear arranging cylinder, the other end of the front and rear arranging base is connected with the front and rear arranging clamping blocks, and the output ends of the front and rear arranging clamping blocks are connected with the front and rear side surfaces of the solar silicon wafer; the left and right arranging heads comprise left and right arranging bases and left and right arranging clamping blocks; one end of the left and right arranging bases is connected with the output end of the left and right arranging cylinders, the other end of the left and right arranging bases is connected with the left and right arranging clamping blocks, and the output ends of the left and right arranging clamping blocks are connected with the left and right sides of the solar silicon wafer; the front and rear arranging heads and the left and right arranging heads also comprise elastic belts; elastic belts in the front and rear arrangement heads are fixed on the front and rear arrangement clamping blocks and are in contact with the front and rear side surfaces of the solar silicon wafer; elastic belts in the left and right arrangement heads are fixed on the left and right arrangement clamping blocks and are in contact with the left and right side surfaces of the solar silicon wafer. The silicon wafer positioning jig comprises a jig bottom plate and a jig stop lever; the jig stop rods are respectively fixed on the jig bottom plate and are respectively contacted with the front side surface, the rear side surface, the left side surface and the right side surface of the solar silicon wafer; the jig jacking assembly comprises a jig jacking motor and a jig jacking block; the output end of the jacking motor on the jig is connected with the lower end of the jacking block on the jig, and the upper end of the jacking block on the jig is in contact with the lower surface of the silicon wafer positioning jig.
Preferably, the jig caching mechanism comprises a jig moving assembly, a jig storing assembly and a jig output assembly; the input end of the jig moving component is connected with the output end of the jig feeding mechanism, and the output end of the jig moving component is connected with the input end of the jig output component; the tool storage component is connected with the silicon wafer positioning tool, and the output end of the tool storage component is connected with the tool moving component; the output end of the jig output assembly is connected with the feed inlet of the light attenuation furnace; the jig moving assembly is used for receiving and moving the solar silicon wafer; the jig storage assembly is used for storing redundant solar silicon wafers; the jig output assembly is used for outputting the solar silicon wafer to the light attenuation furnace; the jig storage assembly comprises a plurality of storage elements fixed on the workbench; the storage element comprises a storage rack, a storage driving motor, a storage conveying belt, a jig front baffle and a jig rear baffle module; the storage driving motor is fixed on the storage rack, and the output end of the storage driving motor is connected with the storage conveyer belt; the upper surface of the storage conveyer belt is contacted with the silicon wafer positioning jig, and the rear end of the storage conveyer belt is connected with the output end of the jig moving assembly; the storage conveyer belt is driven by the storage driving motor to move forwards or backwards so as to input the silicon wafer positioning jig from the jig moving component or output the silicon wafer positioning jig to the jig moving component respectively; the jig front baffle and the jig rear baffle module are fixed on the storage rack, and the output end of the jig front baffle and the output end of the jig rear baffle module are respectively contacted with the front side and the rear side of the silicon wafer positioning jig; the fixture front baffle is used for limiting the front side of the silicon wafer positioning fixture; the jig backstop module is used for opening or blocking the input or output of the silicon wafer positioning jig to the storage conveyer belt. The jig front baffle is a bending baffle, and the height of the jig front baffle is higher than the upper surface of the storage conveyor belt; the jig rear baffle module comprises a jig rear baffle cylinder and a jig rear baffle head; the jig rear air blocking cylinder is fixed on the storage rack, the output end of the jig rear air blocking cylinder is connected with the jig rear blocking head, and the jig rear blocking head is contacted with the rear side of the silicon wafer positioning jig; the storage driving motor is connected with the storage conveyer belt through a belt; the jig moving assembly comprises a jig driving element and a jig moving head; the jig driving element is fixed on the workbench, and the output end of the jig driving element is connected with the jig moving head; the jig moving head is connected with the silicon wafer positioning jig, the input end of the jig moving head is connected with the output end of the jig feeding mechanism, and the output end of the jig moving head is respectively connected with the jig storage assembly and the jig output assembly; the jig driving element is driven by a motor or an air cylinder. The jig moving head comprises a jig moving motor and a jig moving conveyer belt; the output end of the jig moving motor is connected with the jig moving conveyer belt, and the jig moving conveyer belt is contacted with the silicon wafer positioning jig; the height of the jig moving conveyer belt is the same as that of the storage conveyer belt; the jig output assembly comprises a jig output conveyor belt; the jig output conveyor belt is fixed on the workbench, and two ends of the jig output conveyor belt are respectively connected with the output end of the jig moving conveyor belt and the feeding hole of the light attenuation furnace.
In addition, the invention also discloses a solar silicon wafer light-decay-resisting method, which adopts the solar silicon wafer light-decay-resisting equipment and comprises the following steps:
(S1) silicon wafer loading: the silicon wafer feeding device is used for feeding a plurality of solar silicon wafers to the silicon wafer positioning jig;
(S2) silicon wafer finishing: the jig feeding mechanism aligns and arranges the plurality of solar silicon wafers in the silicon wafer positioning jig;
(S3) silicon wafer buffer conveyance: the jig caching mechanism temporarily stores the redundant silicon wafer positioning jig conveyed by the jig feeding mechanism and then conveys the redundant silicon wafer positioning jig to a light attenuation station;
(S4) light attenuation of silicon wafer: the light attenuation furnace is used for carrying out light attenuation treatment on the solar silicon wafer;
(S5) silicon wafer blanking: and the blanking device blanks the solar silicon wafer subjected to light attenuation to finish the light attenuation process of the solar silicon wafer.
The solar silicon wafer light attenuation resisting equipment and the method adopting the technical scheme have the advantages that:
1. through arranging a silicon wafer limiting mechanism; after the solar silicon wafer is fed to the feeding conveyer belt, the limiting motor acts to drive the limiting mandrel to rotate, and the limiting mandrel rotates to drive the limiting connecting rod connected with the limiting mandrel to move; the limiting connecting rod moves to drive the clamping block base to move along a guide rail in the limiting guide rail sliding block, and the plurality of clamping block bearings move to positions in contact with the side face of the solar silicon wafer to limit the solar silicon wafer; the movement driving motor drives the movement sucking disc to move to suck the solar silicon wafer and then move the solar silicon wafer to the feeding station of the silicon wafer conveying device to finish the feeding process of the solar silicon wafer. The limiting motor can rotate at different angles according to solar silicon wafers with different specifications, namely the limiting motor can drive the clamping block bearing to move to a corresponding position along a guide rail in the limiting guide rail sliding block according to the width of the solar silicon wafers; therefore, the situation that the air cylinder or the limiting head needs to be replaced when the air cylinder is driven to limit the solar silicon wafers with different sizes is avoided, and the applicability of the whole equipment is improved; meanwhile, the motion position of the clamp block bearing is driven by a limit motor, namely the motion precision of the clamp block bearing is ensured by the motion precision of the limit motor; the limiting motor has higher motion precision relative to the air cylinder, so that the condition that the deviation of the limiting head relative to the limiting position is larger when the air cylinder is driven is avoided, and the limiting precision of the solar silicon wafer is improved.
2. Arranging a silicon wafer arrangement component; after a sufficient number of solar silicon wafers are stacked on the silicon wafer positioning jig, arranging a forward pushing cylinder to drive a forward and backward arranging element to move to an arranging station; the arrangement forward pushing cylinder acts to drive the front and rear arrangement heads to be in contact with the front and rear side surfaces of the plurality of solar silicon wafers, and the left and right arrangement cylinders act to drive the left and right arrangement heads to extend out to be in contact with the left and right side surfaces of the plurality of solar silicon wafers; retracting the front and rear trimming elements and the left and right trimming elements to the initial position by the front and rear trimming pushing cylinders for trimming and post-trimming the solar silicon wafer; the jig jacking assembly puts down the silicon wafer positioning jig, and the jig conveying belt conveys the finished solar silicon wafer to the next station to complete the feeding process of the solar silicon wafer jig. Before the jig conveying belt conveys the stacked solar silicon wafers to the next station, the front and rear arranging heads and the left and right arranging heads are respectively contacted with the front and rear side faces and the left and right side faces of the stacked solar silicon wafers, namely the stacked solar silicon wafers are aligned in a front-back direction and a left-right direction; therefore, the condition that the light attenuation treatment effects of the solar silicon wafers at different positions are different when the unaligned solar silicon wafers are directly conveyed is avoided, and the quality of the light attenuation treatment of the stacked solar silicon wafers is improved.
3. The jig storage assembly is arranged; after the jig moving head receives the silicon wafer positioning jig, the jig driving element drives the jig moving head to move to a position connected with the storage conveyer belt of the storage element, the storage driving motor drives the storage conveyer belt to rotate, and the jig rear baffle cylinder drives the jig rear baffle to retract; the jig moving assembly conveys the silicon wafer positioning jig to the storage conveyor belt along the jig moving conveyor belt, and the jig rear baffle cylinder drives the jig rear baffle head to extend out to prevent the silicon wafer positioning jig from moving; when the cached silicon wafer positioning jig is output, the jig rear baffle cylinder drives the jig rear baffle to retract, and the storage driving motor reversely rotates to drive the storage conveying belt to move in the opposite direction so as to output the silicon wafer positioning jig to the jig moving assembly; the jig driving element drives the jig moving head to move to the jig output station, and the jig output assembly outputs the silicon wafer positioning jig to the light attenuation furnace to complete the caching process of the solar silicon wafer jig. When the silicon wafer positioning jig is input into and output from the caching station in the mode, the silicon wafer positioning jig on the storage conveyer belt can be input or output only by driving the storage conveyer belt to move forwards or backwards by storing the forward rotation and the reverse rotation of the driving motor, namely, the silicon wafer positioning jig can be cached only by one step of driving the storage conveyer belt to move by rotating the storage driving motor, and a jig moving device is not required to be added; therefore, the complexity of the equipment is reduced, and the caching step of the positioning jig is reduced; meanwhile, the input and the output of the silicon wafer positioning jig during caching are finished by mutually conveying the storage conveyer belt and the jig moving conveyer belt at the same height, namely, the silicon wafer positioning jig only moves in a translation mode on the conveyer belt at the same height, and the movement process is stable; therefore, when the moving device grabs the silicon wafer positioning jig, the situation that the stacked solar silicon wafers in the positioning jig are extruded and collided mutually due to the fact that impact force generated in the processes of moving, grabbing and moving upwards and falling is easy to cause is avoided, and the quality of the solar silicon wafers in the caching process is guaranteed.
Drawings
FIG. 1 is a flow chart of a method for resisting light decay of a solar silicon wafer.
FIG. 2 is a schematic diagram of a product structure of a monolithic solar silicon wafer.
Fig. 3 is a product structure diagram of the solar silicon wafer after stacking.
Fig. 4 is a schematic structural view of a silicon wafer loading apparatus.
FIG. 5 is a schematic structural view of a silicon wafer stopper mechanism.
Fig. 6 is a schematic structural view of a limiting roller.
FIG. 7 is a schematic structural view of a silicon wafer transfer apparatus.
Fig. 8 is a schematic structural view of a jig feeding mechanism.
Fig. 9 is a schematic structural view of a silicon wafer collating assembly.
Fig. 10 is a partially enlarged schematic structure diagram of the elastic band.
FIG. 11 is a schematic structural view of a silicon wafer positioning jig.
Fig. 12 is a schematic structural view of a jig buffer mechanism.
Fig. 13 is a schematic structural view of the storage element.
Fig. 14 is a schematic structural diagram of a jig rear block module.
Fig. 15 is a schematic structural diagram of a solar silicon wafer light attenuation resisting device.
Detailed Description
The following describes in detail embodiments of the present invention with reference to the drawings.
Example 1
1-15, the apparatus comprises a worktable and a silicon wafer feeding device 1, a silicon wafer conveying device 2, a light attenuation furnace 3, a blanking device 4 and a jig reflow device 5 which are fixed on the worktable, wherein the silicon wafer feeding device 1 and the blanking device 4 are connected; (ii) a The input end and the output end of the silicon wafer feeding device 1 are respectively connected with the silicon wafer feeding port and the input end of the silicon wafer conveying device 2; the output end of the silicon wafer conveying device 2 is connected with the feed inlet of the light attenuation furnace, and the discharge outlet of the light attenuation furnace is connected with the feed end of the blanking device; the discharging end of the discharging device is connected with a discharging station; the silicon wafer feeding device 1 is used for feeding solar silicon wafers; the silicon wafer conveying device 2 is used for conveying the solar silicon wafer to a feed inlet of the light attenuation furnace; the light attenuation furnace is used for simulating sunlight irradiation to enable the solar silicon wafer to generate a light attenuation effect; the blanking device is used for blanking the solar silicon wafer after light attenuation; the jig reflow device 5 is connected with the silicon wafer feeding device 1 and the blanking device 4.
The product flow direction of the solar silicon wafer is as follows: a silicon wafer feeding device 1, a silicon wafer conveying device 2, a light attenuation furnace and a blanking device.
Fig. 2 is a schematic product structure diagram of a single solar silicon wafer, and fig. 3 is a schematic product structure diagram of a stack of multiple solar silicon wafers. The solar silicon wafer a comprises a silicon wafer left side surface b and a silicon wafer right side surface c: the silicon wafer feeding device 1 is respectively contacted with the left side surface b and the right side surface c of the silicon wafer when feeding the solar silicon wafer a so as to carry out feeding and conveying limit on the single solar silicon wafer a; the stacked solar silicon wafers d are aligned and arranged in the silicon wafer conveying device 2 and then conveyed to a light attenuation furnace for light attenuation treatment.
As shown in fig. 4, the silicon wafer loading apparatus 1 includes a loading conveyor belt 11, a silicon wafer stopper mechanism 12, and a silicon wafer conveying mechanism 13; the feeding conveyer belt 11 and the silicon wafer limiting mechanism 12 are both fixed on the workbench, and the output end of the feeding conveyer belt 11 is in contact with the lower surface of the solar silicon wafer; the output end of the silicon wafer limiting mechanism 12 is contacted with two end faces of the solar silicon wafer; the output end of the silicon wafer moving mechanism 13 is contacted with the upper surface of the solar silicon wafer, and the output end of the silicon wafer moving mechanism 13 is respectively connected with the feeding conveyer belt 11 and the input end of the silicon wafer conveyer 2; the feeding conveyer belt 11 is used for conveying solar silicon wafers; the silicon wafer limiting mechanism 12 is used for conveying and positioning solar silicon wafers with different widths; the silicon wafer transfer mechanism 13 is used for transferring the solar silicon wafer to the silicon wafer transfer device 2.
As shown in fig. 5, the silicon wafer spacing mechanism 12 includes a spacing frame 14, a spacing motor 15, a spacing roller 16, a first spacing head 17 and a second spacing head 18; the output end of the limiting motor 15 is connected with a limiting rolling shaft 16, and the limiting rolling shaft 16 is in running fit with the limiting rack 14; the first limiting head 17 and the second limiting head 18 both comprise a limiting connecting rod 171, a limiting guide rail sliding block 172 and a limiting clamping block 173; one end of the limiting connecting rod 171 is eccentrically hinged with the limiting rolling shaft 16, and the other end of the limiting connecting rod 171 is hinged with the limiting clamping block 173; the guide rail in the limit guide rail sliding block 172 is fixed on the limit rack 14, the sliding block in the limit guide rail sliding block 172 is connected with the limit clamping block 173, and the output end of the limit clamping block 173 is contacted with the side end face of the solar silicon wafer; the limiting motor 15 is used for driving the limiting roller 16 to rotate; the limiting roller 16 is used for driving the first limiting head 17 and the second limiting head 18 to move linearly; the limit clamp 173 is used to limit the transmission of solar silicon wafers of different widths.
As shown in fig. 6, the limiting roller 16 includes a limiting mandrel 161, an upper limiting roller 162, and a lower limiting roller 163; the limiting mandrel 161 is in running fit with the limiting frame 14, and the upper limiting roller 162 and the lower limiting roller 163 are respectively fixed above and below the limiting mandrel 161; the upper limiting roller 162 is eccentrically hinged with a limiting connecting rod 171 in the second limiting head 18, and the lower limiting roller 163 is eccentrically hinged with a limiting connecting rod 171 in the first limiting head 17; the lower limit roller 163 is a pulley, and the lower limit roller 163 is connected to the limit motor 15 through a belt.
As shown in fig. 5, the retaining clamp block 173 includes a clamp block base 1731 and a clamp block head 1732; the clamp block base 1731 is fixed on a slide block in the limit guide rail slide block 172; the lower end of the clamp block base 1731 is hinged with the limiting connecting rod 171, the upper end of the clamp block base 1731 is connected with a clamp block head 1732, and the output end of the clamp block head 1732 is contacted with the side surface of the solar silicon wafer; the clamp block head 1732 comprises a clamp block head fixing seat 1733 and a clamp block bearing 1734; a plurality of clamp block bearings 1734 are fixed on the clamp block head fixing seat 1733, and the outer surfaces of the clamp block bearings 1734 are in contact with the side surfaces of the solar silicon wafer; the outer surface of the clamp block bearing 1734 is made of rubber.
As shown in fig. 4, the silicon wafer conveyance mechanism 13 includes a conveyance drive motor 131 and a conveyance chuck 132; the output end of the moving driving motor 131 is connected with the moving sucker 132, the output end of the moving sucker 132 is contacted with the upper surface of the solar silicon wafer, and the output end of the moving sucker 132 is respectively connected with the feeding conveyer belt 11 and the silicon wafer conveyer 2; the output end of the moving suction cup 132 is a silica gel suction cup.
The silicon wafer loading apparatus 1, in operation: 1) feeding solar silicon wafers to a feeding conveyer belt 11; 2) the limiting motor 15 acts to drive the limiting mandrel 161 to rotate, and the limiting mandrel 161 rotates to drive the limiting connecting rod 171 connected with the limiting mandrel to move; the limiting connecting rod 171 moves to drive the clamping block base 1731 to move along a guide rail in the limiting guide rail sliding block 172, and the plurality of clamping block bearings 1734 move to positions in contact with the side face of the solar silicon wafer to limit the solar silicon wafer; 3) the movement driving motor 131 drives the movement suction cup 132 to move to suck the solar silicon wafer and then move the solar silicon wafer to the feeding station of the silicon wafer conveying device 2 to complete the solar silicon wafer feeding process.
The silicon wafer feeding device 1 solves the problem that when solar silicon wafers are fed, two cylinders are adopted to respectively drive the limiting heads to move to positions in contact with two side faces of the solar silicon wafers so as to limit the solar silicon wafers on the conveying belt; when the solar silicon wafer is driven by the air cylinder, the moving stroke of the solar silicon wafer and the length of the limiting head connected with the air cylinder are fixed, namely, one group of air cylinders and the limiting head correspond to the solar silicon wafer with one size specification; when the solar silicon wafers with different specifications are subjected to feeding limiting, the length of a limiting cylinder or a limiting head needs to be changed, so that the applicability of the whole equipment is reduced; meanwhile, the manufacturing precision of the air cylinder is generally low, so that the position precision of the limiting head is low when the air cylinder drives the limiting head; the situation that the solar silicon wafer is damaged or is insufficiently contacted with the solar silicon wafer and cannot be limited due to the fact that the limiting head deviates from the limiting position and is excessively contacted with the solar silicon wafer is easily caused, and therefore the problem that the solar silicon wafer is not limited accurately is solved. By arranging the silicon wafer limiting mechanism 12; after the solar silicon wafer is fed to the feeding conveyer belt 11, the limiting motor 15 acts to drive the limiting mandrel 161 to rotate, and the limiting mandrel 161 rotates to drive the limiting connecting rod 171 connected with the limiting mandrel to move; the limiting connecting rod 171 moves to drive the clamping block base 1731 to move along a guide rail in the limiting guide rail sliding block 172, and the plurality of clamping block bearings 1734 move to positions in contact with the side face of the solar silicon wafer to limit the solar silicon wafer; the movement driving motor 131 drives the movement suction cup 132 to move to suck the solar silicon wafer and then move the solar silicon wafer to the feeding station of the silicon wafer conveying device 2 to complete the solar silicon wafer feeding process. The limiting motor 15 can rotate at different angles according to the solar silicon wafers with different specifications, that is, the limiting motor 15 can drive the clamp block bearing 1734 to move to a corresponding position along the guide rail in the limiting guide rail slider 172 according to the width of the solar silicon wafers; therefore, the situation that the air cylinder or the limiting head needs to be replaced when the air cylinder is driven to limit the solar silicon wafers with different sizes is avoided, and the applicability of the whole equipment is improved; meanwhile, the motion position of the clamp block bearing 1734 is driven by the limit motor 15, that is, the motion precision of the clamp block bearing 1734 is ensured by the motion precision of the limit motor 15; the limiting motor 15 has higher movement precision relative to the air cylinder, so that the situation that the limiting head has larger deviation relative to the limiting position when the air cylinder is driven is avoided, and the limiting precision of the solar silicon wafer is improved.
As shown in fig. 7, the silicon wafer conveying apparatus 2 includes a jig feeding mechanism 21 and a jig buffer mechanism 22; the jig feeding mechanism 21 and the jig caching mechanism 22 are fixed on the workbench, the input end of the jig feeding mechanism 21 is connected with the output end of the silicon wafer feeding device 1, and the output end of the jig feeding mechanism 21 is connected with the input end of the jig caching mechanism 22; the output end of the jig caching mechanism 22 is connected with the feed inlet of the light attenuation furnace; the jig feeding mechanism 21 is used for positioning and conveying the solar silicon wafer; the jig buffer mechanism 22 is used for buffering the conveyed redundant jigs and outputting the buffered redundant jigs to the next station.
As shown in fig. 8 and 9, the jig feeding mechanism 21 includes a jig conveying belt 211, a silicon wafer positioning jig 212, a jig jacking assembly 213, and a silicon wafer sorting assembly 214; the silicon wafer tidying assembly 214 comprises a tidying forward pushing cylinder 215, a tidying guide rail slide block 216, a front tidying element 217, a rear tidying element 218 and a left tidying element 218 and a right tidying element 218; the front and rear arranging element 217 is fixed on a slide block in the arranging guide rail slide block 216, and the output end of the arranging forward pushing cylinder 215 is connected with the front and rear arranging element 217; the output ends of the plurality of left and right collating elements 218 are in contact with the left and right sides of the solar silicon wafer, respectively; the front-to-back collation element 217 includes a front-to-back collation cylinder 2171 and a front-to-back collation head 2172; the output end of the front and rear tidying cylinder 2171 is connected with the front and rear tidying heads 2172, and the plurality of front and rear tidying heads 2172 are respectively contacted with the front and rear sides of the solar silicon wafer; the left and right collating elements 218 include left and right collating cylinders 2181 and left and right collating heads 2182; the output end of the left and right arranging cylinder 2181 is connected with a left and right arranging head 2182, and the left and right arranging heads 2182 are in contact with the left and right side surfaces of the solar silicon wafer; the jig conveying belt 211 is used for conveying the silicon wafer positioning jig 212; the silicon wafer positioning jig 212 is used for positioning a plurality of solar silicon wafers; the jig jacking assembly 213 is used for jacking up and positioning the silicon wafer positioning jig 212. Front-to-back collation head 2172 includes front-to-back collation base 2173 and front-to-back collation clip 2174; one end of the front and rear tidying base 2173 is connected with the output end of the front and rear tidying cylinder 2171, the other end of the front and rear tidying base 2173 is connected with the plurality of front and rear tidying clamp blocks 2174, and the output ends of the front and rear tidying clamp blocks 2174 are connected with the front and rear side surfaces of the solar silicon wafer; the left and right finishing heads 2182 comprise left and right finishing bases 2183 and left and right finishing blocks 2184; one end of the left and right arranging bases 2183 is connected with the output end of the left and right arranging cylinders 2181, the other end of the left and right arranging bases 2183 is connected with the left and right arranging clamping blocks 2184, and the output end of the left and right arranging clamping blocks 2184 is connected with the left and right side surfaces of the solar silicon wafer.
As shown in fig. 10, both front and rear collating heads 2172 and left and right collating heads 2182 also include elastic ribbons 2175; the elastic bands 2175 in the front and back collating heads 2172 are secured to the front and back collating grippers 2174 and contact the front and back sides of the solar silicon wafer; the elastomeric bands 2175 in the left and right collating heads 2182 are secured to the left and right collating nips 2184 and contact the left and right sides of the solar silicon wafer.
As shown in fig. 11, the silicon wafer positioning jig 212 includes a jig base plate 2121 and a jig stopper 2122; the plurality of jig stopper rods 2122 are respectively fixed to the jig base plate 2121, and the plurality of jig stopper rods 2122 are respectively in contact with the front and rear sides and the left and right sides of the solar silicon wafer;
as shown in fig. 8, the jig jacking assembly 213 includes a jig jacking motor 2131 and a jig jacking block 2132; the output end of the tool upper jacking motor 2131 is connected with the lower end of the tool upper jacking block 2132, and the upper end of the tool upper jacking block 2132 is in contact with the lower surface of the silicon wafer positioning tool 212.
The jig feeding mechanism 21 is used for moving a plurality of solar silicon wafers into the positioning jig when the solar silicon wafers are conveyed, and then directly conveying the positioning jig to the next station through the conveyor belt to finish the conveying process of the solar silicon wafers; the silicon wafer positioning jig is in clearance fit with the solar silicon wafer in order to ensure that the solar silicon wafer can be smoothly placed, namely, a gap is formed between the edge of the solar silicon wafer and the positioning jig; due to the moving error, when a plurality of solar silicon wafers are stacked in the silicon wafer positioning jig, the solar silicon wafer positioned above and the solar silicon wafer positioned below can be out of alignment; due to the fact that no device for arranging the stacked solar silicon wafers is arranged, the solar silicon wafers cannot be aligned when being subjected to light attenuation treatment after being conveyed, and therefore the solar silicon wafers at different positions are different in light attenuation treatment effect, and the quality of light attenuation treatment is reduced. By providing a silicon wafer conditioning assembly 214; after a sufficient number of solar silicon wafers are stacked on the silicon wafer positioning jig 212, the arrangement forward pushing cylinder 215 acts to drive the front and rear arrangement elements 217 to move to the arrangement station; arranging forward pushing cylinder 215 moves to drive front and rear arranging heads 2172 to be in contact with the front and rear side surfaces of the plurality of solar silicon wafers, and left and right arranging cylinders 2181 moves to drive left and right arranging heads 2182 to extend out to be in contact with the left and right side surfaces of the plurality of solar silicon wafers; the solar silicon wafer finishing and post-finishing forward pushing cylinder 215 retracts the front and rear finishing elements 217 and the left and right finishing elements 218 to the initial position; the jig jacking assembly 213 puts down the silicon wafer positioning jig 212, and the jig conveyer belt 211 conveys the sorted solar silicon wafer to the next station to complete the feeding process of the solar silicon wafer jig. Before the jig conveying belt 211 conveys the stacked solar silicon wafers to the next station, the front and rear sorting heads 2172 and the left and right sorting heads 2182 respectively contact with the front and rear sides and the left and right sides of the stacked solar silicon wafers, that is, the stacked solar silicon wafers are aligned front and rear and left and right; therefore, the condition that the light attenuation treatment effects of the solar silicon wafers at different positions are different when the unaligned solar silicon wafers are directly conveyed is avoided, and the quality of the light attenuation treatment of the stacked solar silicon wafers is improved.
As shown in fig. 12, the jig buffer mechanism 22 includes a jig moving component 23, a jig storage component 24, and a jig output component 25; the input end of the jig moving component 23 is connected with the output end of the jig feeding mechanism 21, and the output end of the jig moving component 23 is connected with the input end of the jig output component 25; the jig storage component 24 is connected with the silicon wafer positioning jig 212, and the output end of the jig storage component 24 is connected with the jig moving component 23; the output end of the jig output assembly 25 is connected with the feed inlet of the light attenuation furnace; the jig moving assembly 23 is used for receiving and moving the solar silicon wafer; the jig storage component 24 is used for storing redundant solar silicon wafers; the jig output assembly 25 is used for outputting the solar silicon wafer to the light attenuation furnace.
As shown in fig. 12 and 13, the jig storage assembly 24 includes a plurality of storage elements 26 fixed to the table; the storage element 26 comprises a storage rack 261, a storage driving motor 262, a storage conveyer belt 263, a jig front baffle 264 and a jig rear baffle module 265; the storage driving motor 262 is fixed on the storage rack 261, and the output end of the storage driving motor 262 is connected with the storage conveyer 263; the upper surface of the storage conveyer 263 is contacted with the silicon wafer positioning jig 212, and the rear end of the storage conveyer 263 is connected with the output end of the jig moving assembly 23; the storage conveyer 263 is driven by the storage driving motor 262 to move forward or backward, and respectively inputs the silicon wafer positioning jig 212 from the jig moving assembly 23 or outputs the silicon wafer positioning jig 212 to the jig moving assembly 23; the jig front baffle 264 and the jig rear baffle module 265 are fixed on the storage rack 261, and the output end of the jig front baffle 264 and the output end of the jig rear baffle module 265 are respectively contacted with the front side and the rear side of the silicon wafer positioning jig 212; the jig front baffle 264 is used for limiting the front side of the silicon wafer positioning jig 212; the jig back-up module 265 is used to open or block the input or output of the silicon wafer positioning jig 212 into the storage conveyer 263. The baffle 264 is a bending baffle before the tool, and the baffle 264 is higher than the upper surface of the storage conveyer 263 before the tool.
As shown in fig. 14, the jig back-stop module 265 includes a jig back-stop cylinder 2651 and a jig back-stop 2652; the jig rear baffle cylinder 2651 is fixed on the storage rack 261, the output end of the jig rear baffle cylinder 2651 is connected to the jig rear baffle 2652, and the jig rear baffle 2652 is in contact with the rear side of the silicon wafer positioning jig 212; the storage driving motor 262 is connected with the storage conveyer 263 by a belt.
As shown in fig. 12, the jig moving assembly 23 includes a jig driving element 231 and a jig moving head 232; the jig driving element 231 is fixed on the workbench, and the output end of the jig driving element 231 is connected with the jig moving head 232; the jig moving head 232 is connected with the silicon wafer positioning jig 212, the input end of the jig moving head 232 is connected with the output end of the jig feeding mechanism 21, and the output end of the jig moving head 232 is connected with the jig storage assembly 24 and the jig output assembly 25 respectively; the jig driving element 231 is motor-driven or air cylinder-driven. The jig moving head 232 includes a jig moving motor 2321 and a jig moving conveyor 2322; the output end of the jig moving motor 2321 is connected with the jig moving conveyor 2322, and the jig moving conveyor 2322 is in contact with the silicon wafer positioning jig 212; the height of the jig moving conveyor 2322 is the same as that of the storage conveyor 263; the jig output assembly 25 includes a jig output conveyor 251; the jig output conveyor belt 251 is fixed on the workbench, and two ends of the jig output conveyor belt 251 are respectively connected with the output end of the jig moving conveyor belt 2322 and the feed inlet of the light attenuation furnace.
Tool buffer memory mechanism 22 is in the course of the work: 1) the jig driving element 231 operates to drive the jig moving head 232 to move to the discharge port of the jig loading mechanism 21 to receive the silicon wafer positioning jig 212; 2) the tool driving element 231 drives the tool moving head 232 to move to a position where it is connected with the storage conveyer belt 263 of the storage element 26, the storage driving motor 262 drives the storage conveyer belt 263 to rotate, and the tool rear stop cylinder 2651 drives the tool rear stop head 2652 to retract; the jig moving assembly 23 conveys the silicon wafer positioning jig 212 to the storage conveyer 263 along the jig moving conveyer 2322, and the jig rear stopper 2651 drives the jig rear stopper 2652 to extend to stop the silicon wafer positioning jig 212 from moving; 3) when the buffered silicon wafer positioning jig 212 is output, the jig rear stop cylinder 2651 drives the jig rear stop 2652 to retract, and the storage driving motor 262 rotates reversely to drive the storage conveyer belt 263 to move reversely, so that the silicon wafer positioning jig 212 is output to the jig moving assembly 23; 4) the jig driving element 231 drives the jig moving head 232 to move to the jig output station, and the jig output assembly 25 outputs the silicon wafer positioning jig 212 to the light attenuation furnace to complete the buffering process of the solar silicon wafer jig.
The jig caching mechanism 22 solves the problem that when the redundant positioning jigs are cached, the redundant positioning jigs are firstly moved to the caching station by the moving device, and when the redundant positioning jigs are needed to be used, the positioning jigs on the caching station are moved to the jig output station by the moving device; when the positioning jig is input and output in the cache mode, the moving device is required to carry, and the moving device is required to complete three steps of downward moving, grabbing, translational conveying and jig falling, so that the cache of the positioning jig can be completed, and the complexity of equipment and the cache step of the positioning jig are increased; meanwhile, the solar silicon wafers are hard and brittle materials, and impact force generated in the processes of carrying, grabbing, moving upwards and falling easily causes mutual extrusion and collision of the solar silicon wafers stacked in the positioning jig; thereby causing the solar silicon wafer to be cracked and reducing the quality of the solar silicon wafer in the buffering process. By providing the jig storage assembly 24; after the jig moving head 232 receives the silicon wafer positioning jig 212, the jig driving element 231 drives the jig moving head 232 to move to a position where it is connected with the storage conveyer belt 263 of the storage element 26, the storage driving motor 262 drives the storage conveyer belt 263 to rotate, and the jig rear air blocking cylinder 2651 drives the jig rear air blocking head 2652 to retract; the jig moving assembly 23 conveys the silicon wafer positioning jig 212 to the storage conveyer 263 along the jig moving conveyer 2322, and the jig rear stopper 2651 drives the jig rear stopper 2652 to extend to stop the silicon wafer positioning jig 212 from moving; when the buffered silicon wafer positioning jig 212 is output, the jig rear stop cylinder 2651 drives the jig rear stop 2652 to retract, and the storage driving motor 262 rotates reversely to drive the storage conveyer belt 263 to move reversely, so that the silicon wafer positioning jig 212 is output to the jig moving assembly 23; the jig driving element 231 drives the jig moving head 232 to move to the jig output station, and the jig output assembly 25 outputs the silicon wafer positioning jig 212 to the light attenuation furnace to complete the buffering process of the solar silicon wafer jig. In this way, when the silicon wafer positioning jig 212 is input into and output from the buffer station, only the storage driving motor 262 needs to rotate forward and backward to drive the storage conveyer belt 263 to move forward or backward to input or output the silicon wafer positioning jig 212 on the storage conveyer belt 263, that is, only one step of the rotation of the storage driving motor 262 to drive the storage conveyer belt 263 to move is needed to complete the buffer storage of the silicon wafer positioning jig 212, and no jig moving device needs to be added; therefore, the complexity of the equipment is reduced, and the caching step of the positioning jig is reduced; meanwhile, the input and output of the silicon wafer positioning jig 212 during the buffer storage are completed by the mutual conveying of the storage conveyer belt 263 and the jig moving conveyer belt 2322 at the same height, that is, the silicon wafer positioning jig 212 only moves in a translation manner on the conveyer belt at the same height, and the movement process is stable; therefore, the situation that when the moving device grabs the silicon wafer positioning jig 212, impact force generated in the processes of moving, grabbing, moving upwards and falling easily causes mutual extrusion and collision of stacked solar silicon wafers in the positioning jig is avoided, and the quality of the solar silicon wafers in the caching process is ensured.
A solar silicon wafer light-decay resisting method as shown in fig. 1, which adopts the solar silicon wafer light-decay resisting apparatus, the method comprising the steps of:
(S1) silicon wafer loading: the silicon wafer feeding device 1 feeds a plurality of solar silicon wafers to the silicon wafer positioning jig 212;
(S2) silicon wafer finishing: the jig feeding mechanism 21 aligns and arranges the plurality of solar silicon wafers in the silicon wafer positioning jig 212;
(S3) silicon wafer buffer conveyance: the jig caching mechanism 22 temporarily stores the redundant silicon wafer positioning jigs 212 conveyed by the jig feeding mechanism 21 and conveys the redundant silicon wafer positioning jigs to a light attenuation station;
(S4) light attenuation of silicon wafer: the light attenuation furnace is used for carrying out light attenuation treatment on the solar silicon wafer;
(S5) silicon wafer blanking: and the blanking device blanks the solar silicon wafer subjected to light attenuation to finish the light attenuation process of the solar silicon wafer.
Claims (10)
1. The solar silicon wafer light attenuation resisting equipment is characterized by comprising a workbench, and a silicon wafer feeding device (1), a silicon wafer conveying device (2), a light attenuation furnace (3), a blanking device (4) and a jig backflow device (5) which are fixed on the workbench; the input end and the output end of the silicon wafer feeding device (1) are respectively connected with the silicon wafer feeding port and the input end of the silicon wafer conveying device (2); the output end of the silicon wafer conveying device (2) is connected with the feed inlet of the light attenuation furnace, and the discharge outlet of the light attenuation furnace is connected with the feed end of the blanking device; the discharging end of the discharging device is connected with a discharging station; the silicon wafer feeding device (1) is used for feeding solar silicon wafers; the silicon wafer conveying device (2) is used for conveying the solar silicon wafer to a feed inlet of the light attenuation furnace; the light attenuation furnace is used for simulating sunlight irradiation to enable the solar silicon wafer to generate a light attenuation effect; the blanking device is used for blanking the solar silicon wafer after light attenuation; the jig reflux device (5) is connected with the silicon wafer feeding device (1) and the blanking device (4);
the silicon wafer feeding device (1) comprises a feeding conveyer belt (11), a silicon wafer limiting mechanism (12) and a silicon wafer moving mechanism (13); the feeding conveyer belt (11) and the silicon wafer limiting mechanism (12) are fixed on the workbench, and the output end of the feeding conveyer belt (11) is in contact with the lower surface of the solar silicon wafer; the output end of the silicon wafer limiting mechanism (12) is contacted with two end faces of the solar silicon wafer; the output end of the silicon wafer moving mechanism (13) is contacted with the upper surface of the solar silicon wafer, and the output end of the silicon wafer moving mechanism (13) is respectively connected with the input ends of the feeding conveyer belt (11) and the silicon wafer conveyer device (2); the feeding conveyer belt (11) is used for conveying solar silicon wafers; the silicon wafer limiting mechanism (12) is used for conveying and positioning solar silicon wafers with different widths; the silicon wafer moving mechanism (13) is used for moving the solar silicon wafer into the silicon wafer conveying device (2);
the silicon wafer conveying device (2) comprises a jig feeding mechanism (21) and a jig caching mechanism (22); the jig feeding mechanism (21) and the jig caching mechanism (22) are fixed on the workbench, the input end of the jig feeding mechanism (21) is connected with the output end of the silicon wafer feeding device (1), and the output end of the jig feeding mechanism (21) is connected with the input end of the jig caching mechanism (22); the output end of the jig caching mechanism (22) is connected with the feed inlet of the light attenuation furnace; the jig feeding mechanism (21) is used for positioning and conveying the solar silicon wafer; the jig caching mechanism (22) is used for caching the conveyed redundant jigs and then outputting the buffered redundant jigs to the next station.
2. The solar silicon wafer light attenuation resisting equipment is characterized in that the silicon wafer limiting mechanism (12) comprises a limiting frame (14), a limiting motor (15), a limiting roller (16), a first limiting head (17) and a second limiting head (18); the output end of the limiting motor (15) is connected with a limiting rolling shaft (16), and the limiting rolling shaft (16) is in running fit with the limiting rack (14); the first limiting head (17) and the second limiting head (18) comprise limiting connecting rods (171), limiting guide rail sliding blocks (172) and limiting clamping blocks (173); one end of a limiting connecting rod (171) is eccentrically hinged with the limiting rolling shaft (16), and the other end of the limiting connecting rod (171) is hinged with a limiting clamping block (173); the guide rail in the limiting guide rail sliding block (172) is fixed on the limiting rack (14), the sliding block in the limiting guide rail sliding block (172) is connected with the limiting clamping block (173), and the output end of the limiting clamping block (173) is contacted with the side end face of the solar silicon wafer; the limiting motor (15) is used for driving the limiting rolling shaft (16) to rotate; the limiting roller (16) is used for driving the first limiting head (17) and the second limiting head (18) to move linearly; the limiting clamping block (173) is used for limiting the transmission of solar silicon wafers with different widths.
3. The solar silicon wafer light-decay-resisting equipment as claimed in claim 2, wherein the limiting roller (16) comprises a limiting mandrel (161), an upper limiting roller (162) and a lower limiting roller (163); the limiting mandrel (161) is in running fit with the limiting frame (14), and the upper limiting roller (162) and the lower limiting roller (163) are respectively fixed above and below the limiting mandrel (161); the upper limiting roller (162) is eccentrically hinged with a limiting connecting rod (171) in the second limiting head (18), and the lower limiting roller (163) is eccentrically hinged with a limiting connecting rod (171) in the first limiting head (17);
the lower limiting idler wheel (163) is a belt wheel, and the lower limiting idler wheel (163) is connected with the limiting motor (15) through a belt;
the limiting clamping block (173) comprises a clamping block base (1731) and a clamping block head (1732); the clamping block base (1731) is fixed on a slide block in the limiting guide rail slide block (172); the lower end of the clamp block base (1731) is hinged with the limiting connecting rod (171), the upper end of the clamp block base (1731) is connected with a clamp block head (1732), and the output end of the clamp block head (1732) is contacted with the side surface of the solar silicon wafer;
the clamping block head (1732) comprises a clamping block head fixing seat (1733) and a clamping block bearing (1734); a plurality of clamp block bearings (1734) are fixed on the clamp block head fixing seat (1733), and the outer surfaces of the clamp block bearings (1734) are contacted with the side surface of the solar silicon wafer;
the outer surface of the clamp block bearing (1734) is made of rubber;
the silicon wafer transfer mechanism (13) comprises a transfer drive motor (131) and a transfer chuck (132); the output end of the moving driving motor (131) is connected with the moving sucker (132), the output end of the moving sucker (132) is contacted with the upper surface of the solar silicon wafer, and the output end of the moving sucker (132) is respectively connected with the feeding conveyer belt (11) and the silicon wafer conveyer (2);
the output end of the moving sucker (132) is a silica gel sucker.
4. The solar silicon wafer light-decay-resisting equipment as claimed in claim 1, wherein the jig feeding mechanism (21) comprises a jig conveying belt (211), a silicon wafer positioning jig (212), a jig top-up component (213) and a silicon wafer sorting component (214); the silicon wafer tidying assembly (214) comprises a tidying forward pushing cylinder (215), a tidying guide rail slide block (216), a front tidying element (217) and a rear tidying element (218); the front and rear arranging element (217) is fixed on a slide block in the arranging guide rail slide block (216), and the output end of the arranging forward pushing cylinder (215) is connected with the front and rear arranging element (217); the output ends of the left and right sorting elements (218) are respectively contacted with the left and right sides of the solar silicon wafer; the front and rear collating element (217) comprises a front and rear collating cylinder (2171) and a front and rear collating head (2172); the output end of the front and rear tidying cylinder (2171) is connected with a front and rear tidying head (2172), and the front and rear tidying heads (2172) are respectively contacted with the front and rear side surfaces of the solar silicon wafer; the left and right arranging elements (218) comprise a left and right arranging cylinder (2181) and a left and right arranging head (2182); the output end of the left and right arranging cylinders (2181) is connected with a left and right arranging heads (2182), and the left and right arranging heads (2182) are contacted with the left and right side surfaces of the solar silicon wafer; the jig conveying belt (211) is used for conveying the silicon wafer positioning jig (212); the silicon wafer positioning jig (212) is used for positioning a plurality of solar silicon wafers; the jig jacking assembly (213) is used for jacking up and positioning the silicon wafer positioning jig (212).
5. The solar silicon wafer light-decay resisting apparatus as claimed in claim 4, wherein the front-back collating head (2172) includes a front-back collating base (2173) and a front-back collating clamp block (2174); one end of the front and rear arrangement base (2173) is connected with the output end of the front and rear arrangement cylinder (2171), the other end of the front and rear arrangement base (2173) is connected with a plurality of front and rear arrangement clamping blocks (2174), and the output ends of the front and rear arrangement clamping blocks (2174) are connected with the front and rear side surfaces of the solar silicon wafer;
the left and right arranging heads (2182) comprise a left and right arranging base (2183) and a left and right arranging clamping block (2184); one end of a left and right arranging base (2183) is connected with the output end of a left and right arranging cylinder (2181), the other end of the left and right arranging base (2183) is connected with a left and right arranging clamping block (2184), and the output end of the left and right arranging clamping block (2184) is connected with the left and right side surfaces of the solar silicon wafer;
both the front and rear collation heads (2172) and the left and right collation heads (2182) further include elastic bands (2175); elastic belts (2175) in the front and rear tidying heads (2172) are fixed on the front and rear tidying clamping blocks (2174) and are in contact with the front and rear side surfaces of the solar silicon wafer; elastic belts (2175) in the left and right arrangement heads (2182) are fixed on the left and right arrangement clamping blocks (2184) and are in contact with the left and right side surfaces of the solar silicon wafer.
6. The solar silicon wafer light-decay resisting device as claimed in claim 4, wherein the silicon wafer positioning jig (212) comprises a jig base plate (2121) and a jig stop rod (2122); the plurality of jig stop rods (2122) are respectively fixed on the jig base plate (2121), and the plurality of jig stop rods (2122) are respectively contacted with the front side surface, the rear side surface and the left side surface and the right side surface of the solar silicon wafer;
the jig jacking assembly (213) comprises a jig jacking motor (2131) and a jig jacking block (2132); the output end of the jig upper jacking motor (2131) is connected with the lower end of the jig upper jacking block (2132), and the upper end of the jig upper jacking block (2132) is contacted with the lower surface of the silicon wafer positioning jig (212).
7. The solar silicon wafer light-decay-resisting equipment as claimed in claim 1, wherein the jig buffer mechanism (22) comprises a jig moving component (23), a jig storing component (24) and a jig outputting component (25); the input end of the jig moving component (23) is connected with the output end of the jig feeding mechanism (21), and the output end of the jig moving component (23) is connected with the input end of the jig output component (25); the tool storage component (24) is connected with the silicon wafer positioning tool (212), and the output end of the tool storage component (24) is connected with the tool moving component (23); the output end of the jig output component (25) is connected with the feed inlet of the light attenuation furnace; the jig moving assembly (23) is used for receiving and moving the solar silicon wafer; the jig storage component (24) is used for storing redundant solar silicon wafers; the jig output component (25) is used for outputting the solar silicon wafer to the light attenuation furnace;
the jig storage assembly (24) comprises a plurality of storage elements (26) fixed on the workbench; the storage element (26) comprises a storage rack (261), a storage driving motor (262), a storage conveyer belt (263), a jig front baffle (264) and a jig rear baffle module (265); the storage driving motor (262) is fixed on the storage rack (261), and the output end of the storage driving motor (262) is connected with the storage conveyer belt (263); the upper surface of the storage conveyer belt (263) is contacted with the silicon wafer positioning jig (212), and the rear end of the storage conveyer belt (263) is connected with the output end of the jig moving component (23); the storage conveyer belt (263) respectively inputs the silicon wafer positioning jig (212) from the jig moving component (23) or outputs the silicon wafer positioning jig (212) to the jig moving component (23) when moving forwards or backwards under the driving of the storage driving motor (262); the jig front baffle (264) and the jig rear baffle module (265) are fixed on the storage rack (261), and the output end of the jig front baffle (264) and the output end of the jig rear baffle module (265) are respectively contacted with the front side and the rear side of the silicon wafer positioning jig (212); the fixture front baffle (264) is used for limiting the front side of the silicon wafer positioning fixture (212); the jig back-end module (265) is used for opening or blocking the input or output of the silicon wafer positioning jig (212) to the storage conveyor belt (263).
8. The solar silicon wafer light attenuation resisting equipment is characterized in that the jig front baffle (264) is a bending baffle, and the height of the jig front baffle (264) is higher than the upper surface of the storage conveyer belt (263);
the jig rear baffle module (265) comprises a jig rear baffle cylinder (2651) and a jig rear baffle head (2652); the jig rear blocking cylinder (2651) is fixed on the storage rack (261), the output end of the jig rear blocking cylinder (2651) is connected with the jig rear blocking head (2652), and the jig rear blocking head (2652) is contacted with the rear side of the silicon wafer positioning jig (212);
the storage driving motor (262) is connected with the storage conveyer belt (263) through a belt;
the jig moving assembly (23) comprises a jig driving element (231) and a jig moving head (232); the jig driving element (231) is fixed on the workbench, and the output end of the jig driving element (231) is connected with the jig moving head (232); the jig moving head (232) is connected with the silicon wafer positioning jig (212), the input end of the jig moving head (232) is connected with the output end of the jig feeding mechanism (21), and the output end of the jig moving head (232) is respectively connected with the jig storage component (24) and the jig output component (25);
the jig driving element (231) is driven by a motor or an air cylinder.
9. The solar silicon wafer light-decay-resisting equipment as claimed in claim 7, wherein the jig moving head (232) comprises a jig moving motor (2321) and a jig moving conveyor belt (2322); the output end of the jig moving motor (2321) is connected with the jig moving conveyer belt (2322), and the jig moving conveyer belt (2322) is contacted with the silicon wafer positioning jig (212);
the height of the jig moving conveyor belt (2322) is the same as that of the storage conveyor belt (263);
the jig output assembly (25) comprises a jig output conveyor belt (251); the jig output conveyor belt (251) is fixed on the workbench, and two ends of the jig output conveyor belt (251) are respectively connected with the output end of the jig moving conveyor belt (2322) and the feeding hole of the light attenuation furnace.
10. A method for resisting light decay of a solar silicon wafer, which is characterized by using the apparatus for resisting light decay of a solar silicon wafer according to claim 1, the method comprising the steps of:
(S1) silicon wafer loading: the silicon wafer feeding device (1) feeds a plurality of solar silicon wafers to a silicon wafer positioning jig (212);
(S2) silicon wafer finishing: the jig feeding mechanism (21) aligns and arranges the plurality of solar silicon wafers in the silicon wafer positioning jig (212);
(S3) silicon wafer buffer conveyance: the jig caching mechanism (22) temporarily stores the redundant silicon wafer positioning jigs (212) conveyed by the jig feeding mechanism (21) and conveys the redundant silicon wafer positioning jigs to a light attenuation station;
(S4) light attenuation of silicon wafer: the light attenuation furnace is used for carrying out light attenuation treatment on the solar silicon wafer;
(S5) silicon wafer blanking: and the blanking device blanks the solar silicon wafer subjected to light attenuation to finish the light attenuation process of the solar silicon wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011203226.3A CN112490163A (en) | 2020-11-02 | 2020-11-02 | Solar silicon wafer light-decay-resistant equipment and light-decay-resistant treatment method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011203226.3A CN112490163A (en) | 2020-11-02 | 2020-11-02 | Solar silicon wafer light-decay-resistant equipment and light-decay-resistant treatment method |
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| CN202011203226.3A Withdrawn CN112490163A (en) | 2020-11-02 | 2020-11-02 | Solar silicon wafer light-decay-resistant equipment and light-decay-resistant treatment method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113363353A (en) * | 2021-06-01 | 2021-09-07 | 中山大学新华学院 | Adaptive photovoltaic panel processing device based on 5G Beidou and Internet of things positioning system |
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2020
- 2020-11-02 CN CN202011203226.3A patent/CN112490163A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113363353A (en) * | 2021-06-01 | 2021-09-07 | 中山大学新华学院 | Adaptive photovoltaic panel processing device based on 5G Beidou and Internet of things positioning system |
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