CN112475802A - Method for assembling aluminum target and aluminum alloy back plate - Google Patents
Method for assembling aluminum target and aluminum alloy back plate Download PDFInfo
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- CN112475802A CN112475802A CN202011305209.0A CN202011305209A CN112475802A CN 112475802 A CN112475802 A CN 112475802A CN 202011305209 A CN202011305209 A CN 202011305209A CN 112475802 A CN112475802 A CN 112475802A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/0068—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for particular articles not mentioned below
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/12—Light metals
- C23G1/125—Light metals aluminium
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
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Abstract
The invention provides an assembly method of an aluminum target and an aluminum alloy backboard, which comprises the following steps: (1) carrying out solid solution treatment and aging treatment on the aluminum alloy back plate to obtain a hardness-enhanced aluminum alloy back plate; (2) performing thread turning on the welding surface of the hardness-enhanced aluminum alloy backboard obtained in the step (1), and performing acid washing treatment on the aluminum target material and the aluminum alloy backboard to obtain a pretreated aluminum target material and an pretreated aluminum alloy backboard; (3) and assembling the pretreated aluminum target material and the aluminum alloy back plate, placing the assembled aluminum target material and the aluminum alloy back plate in a sheath, vacuumizing, and performing hot isostatic pressing welding. The assembling method effectively improves the hardness of the aluminum alloy back plate while not influencing the grain size of the aluminum target material, and can also ensure that the back plate and the aluminum target material have higher welding bonding strength.
Description
Technical Field
The invention belongs to the field of target assembly, relates to an assembly method of an aluminum target, and particularly relates to an assembly method of an aluminum target and an aluminum alloy back plate.
Background
And (3) canning: a closed container is used for placing a product, and hot isostatic pressing can be carried out only by vacuumizing a sheath to a certain vacuum degree after welding, for example, the sheath bulges due to air leakage in the production process.
Solution treatment: the heat treatment process is to heat the alloy to a high-temperature single-phase region and keep the temperature constant, so that the excess phase is fully dissolved in the solid solution and then is rapidly cooled to obtain the supersaturated solid solution.
Aging treatment: the metal is subjected to solution treatment, high-temperature quenching or certain cold working deformation, and then is placed at a higher temperature or kept at room temperature to keep the performance, shape and size of the metal changed along with time. Generally speaking, the hardness and hardness increase and the plastic toughness and internal stress decrease with time.
Aluminum target assembly: an assembly made by combining a back plate and an aluminum target and applied to the semiconductor field.
The diffusion welding temperature of the existing aluminum alloy back plate and the aluminum target material is above 400 ℃, the crystal grains of the aluminum target material are easy to grow at the temperature, and the hardness of the back plate can be obviously reduced. Other low-temperature welding methods are difficult to meet the requirements of welding bonding rate, bonding strength and the like at the same time.
CN104625389A discloses a welding method of aluminum alloy sputtering target for integrated circuit packaging material, which comprises: processing convex teeth with certain shape and size on the welding surface of the target material, processing a corresponding groove on the back plate, assembling and combining the target material and the back plate, putting the target material and the back plate into a sheath for vacuum sealing welding, then completely filling the groove with materials by adopting a hot isostatic pressing method, and connecting the target material and the back plate. Due to the low welding temperature, the growth of aluminum alloy crystal grains can be avoided, the welding strength between the target and the back plate is high, the overall deformation of the target is small, and the later-stage processing is facilitated. According to the method, convex teeth are required to be machined on the welding surface of the target material, grooves with corresponding sizes are required to be machined on the back plate, and the machining process is complex and is not suitable for large-scale production.
Disclosure of Invention
In order to solve the technical problems in the prior art, the invention provides the assembling method of the aluminum target material and the aluminum alloy backboard, the assembling method effectively improves the hardness of the aluminum alloy backboard without influencing the grain size of the aluminum target material, and can also ensure that the backboard and the aluminum target material have higher welding bonding strength.
In order to achieve the technical effect, the invention adopts the following technical scheme:
the invention provides an assembly method of an aluminum target and an aluminum alloy backboard, which is characterized by comprising the following steps:
(1) carrying out solid solution treatment and aging treatment on the aluminum alloy back plate to obtain a hardness-enhanced aluminum alloy back plate;
(2) performing thread turning on the welding surface of the hardness-enhanced aluminum alloy backboard obtained in the step (1), and performing acid washing treatment on the aluminum target material and the aluminum alloy backboard to obtain a pretreated aluminum target material and an pretreated aluminum alloy backboard;
(3) and assembling the pretreated aluminum target material and the aluminum alloy back plate, placing the assembled aluminum target material and the aluminum alloy back plate in a sheath, vacuumizing, and performing hot isostatic pressing welding.
In the invention, because the aluminum alloy backboard of the aluminum target assembly has lower raw material hardness and the semiconductor sputtering machine needs higher hardness when in use, the aluminum alloy backboard of the aluminum target assembly can be subjected to solid solution aging heat treatment to ensure that the backboard hardness meets the requirement. The solution heat treatment temperature of the aluminum alloy back plate is 450-550 ℃, and the aging heat treatment temperature is 150-300 ℃. If the aluminum target material and the back plate are welded and bound firstly and then the solid solution aging strengthening of the back plate is carried out, the crystal grains of the aluminum target material can grow up, and finally the use requirements of customers cannot be met. Therefore, the back plate needs to be welded and bound with the target after being subjected to solid solution aging strengthening, and the welding method needs to ensure enough welding bonding strength, no growth of target crystal grains and no reduction of the hardness of the back plate.
As a preferable embodiment of the present invention, the temperature of the solution treatment in the step (1) is 450 to 500 ℃, such as 455 ℃, 460 ℃, 465 ℃, 470 ℃, 475 ℃, 480 ℃, 485 ℃, 490 ℃ or 495 ℃, but not limited to the values listed, and other values not listed in the range of the values are also applicable.
Preferably, the time of the solution treatment in step (1) is 0.5 to 2 hours, such as 0.6 hour, 0.7 hour, 0.8 hour, 0.9 hour, 1.0 hour, 1.1 hour, 1.2 hour, 1.3 hour, 1.4 hour, 1.5 hour, 1.6 hour, 1.7 hour, 1.8 hour or 1.9 hour, etc., but is not limited to the enumerated values, and other unrecited values in the numerical range are also applicable.
Preferably, the solution treatment in step (1) is followed by water cooling.
In a preferred embodiment of the present invention, the temperature of the aging treatment in step (1) is 150 to 300 ℃, for example, 160 ℃, 170 ℃, 180 ℃, 190 ℃, 200 ℃, 210 ℃, 220 ℃, 230 ℃, 240 ℃, 250 ℃, 270 ℃, 280 ℃ or 290 ℃, but is not limited to the above-mentioned values, and other values not listed in the above-mentioned range of values are also applicable.
Preferably, the aging treatment time in step (1) is 2 to 5 hours, such as 2.5 hours, 3 hours, 3.5 hours, 4 hours or 4.5 hours, but not limited to the recited values, and other values in the range are also applicable.
Preferably, air cooling is performed after the aging treatment in the step (1).
In a preferred embodiment of the present invention, the size of the turning thread in step (2) is (0.45 to 0.85) mm (0.15 to 0.6) mm, such as 0.50 x 0.55, 0.55 x 0.45, 0.60 x 0.40, 0.65 x 0.35, 0.70 x 0.25, 0.75 x 0.20, or 0.80 x 0.18, but not limited to the above-mentioned values, and other values not listed in this range are also applicable.
In a preferred embodiment of the present invention, the time for the acid washing in step (2) is 1-5 min, such as 1.5min, 2min, 2.5min, 3min, 3.5min, 4min or 4.5min, but is not limited to the above-mentioned values, and other values not listed in the above-mentioned range are also applicable.
As a preferable technical scheme of the invention, the acid solution for acid washing in the step (2) is a mixed solution of nitric acid and hydrofluoric acid.
Preferably, the molar ratio of nitric acid to hydrofluoric acid is 1 to 2:1, such as 1.1:1, 1.2:1, 1.3:1, 1.4:1, 1.5:1, 1.6:1, 1.7:1, 1.8:1, or 1.9:1, but not limited to the recited values, and other non-recited values within this range of values are equally applicable.
As a preferable technical scheme of the present invention, after the acid washing in the step (2), the aluminum target and the aluminum alloy backing plate are vacuum-dried.
Preferably, the temperature of the vacuum drying is 50 to 90 ℃, such as 55 ℃, 60 ℃, 65 ℃, 70 ℃, 75 ℃, 80 ℃ or 85 ℃, but not limited to the recited values, and other values not recited in the range of the values are also applicable.
Preferably, the vacuum drying time is 0.5-3 h, such as 1.0h, 1.5h, 2.0h or 2.5h, but not limited to the recited values, and other values not recited in the range of the values are also applicable.
As a preferable technical scheme of the invention, the vacuumizing in the step (3) enables the gas pressure in the sheath to be less than 10-3Pa, e.g. 1X 10-5、2×10-5、5×10-5、8×10-5、1×10-4、2×10-4、5×10-4Or 8X 10-4And the like, but are not limited to the recited values, and other values not recited within the numerical range are also applicable.
In a preferred embodiment of the present invention, the hot isostatic pressing welding in step (3) is performed at a temperature of 200 to 300 ℃, for example, 210 ℃, 220 ℃, 230 ℃, 240 ℃, 250 ℃, 260 ℃, 270 ℃, 280 ℃ or 290 ℃, but the temperature is not limited to the above-mentioned values, and other values not shown in the above-mentioned range are also applicable.
Preferably, the hot isostatic pressing welding in step (3) is performed at a pressure of 80 to 120MPa, such as 85MPa, 90MPa, 95MPa, 100MPa, 105MPa, 110MPa or 115MPa, but not limited to the recited values, and other values not recited in the range of the recited values are also applicable.
As a preferred technical solution of the present invention, the method for assembling the aluminum target and the aluminum alloy backing plate includes the following steps:
(1) carrying out solid solution treatment and aging treatment on the aluminum alloy back plate, wherein the temperature of the solid solution treatment is 450-500 ℃ and the time is 0.5-2 h, water cooling is carried out after the solid solution treatment, the temperature of the aging treatment is 150-300 ℃ and the time is 2-5 h, and air cooling is carried out after the aging treatment to obtain a hardness-enhanced aluminum alloy back plate;
(2) turning threads on the welding surface of the hardness-enhanced aluminum alloy backboard obtained in the step (2), wherein the size of the turned threads is (0.45-0.85) mm (0.15-0.6) mm, performing acid pickling on the aluminum target material and the aluminum alloy backboard for 1-5 min by using a mixed solution of nitric acid and hydrofluoric acid, and performing vacuum drying at 50-90 ℃ for 0.5-3 h to obtain the pretreated aluminum target material and the pretreated aluminum alloy backboard;
(3) and assembling the pretreated aluminum target and the aluminum alloy back plate, placing the aluminum target and the aluminum alloy back plate in a sheath, vacuumizing, and performing hot isostatic pressing welding at the temperature of 200-300 ℃ and under the pressure of 80-120 MPa.
Compared with the prior art, the invention has at least the following beneficial effects:
the invention provides an assembly method of an aluminum target material and an aluminum alloy backboard, which effectively improves the hardness of the aluminum alloy backboard without influencing the grain size of the aluminum target material and can also ensure that the backboard and the aluminum target material have higher welding bonding strength.
Drawings
Fig. 1 is a schematic flow chart of an assembly method of an aluminum target and an aluminum alloy backing plate according to the present invention.
The present invention is described in further detail below. The following examples are merely illustrative of the present invention and do not represent or limit the scope of the claims, which are defined by the claims.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
To better illustrate the invention and to facilitate the understanding of the technical solutions thereof, typical but non-limiting examples of the invention are as follows:
example 1
The embodiment provides an assembling method of an aluminum target and an aluminum alloy back plate, which comprises the following steps:
(1) carrying out solid solution treatment and aging treatment on the aluminum alloy back plate, wherein the temperature of the solid solution treatment is 450 ℃ and the time is 2 hours, water cooling is carried out after the solid solution treatment, the temperature of the aging treatment is 150 ℃ and the time is 5 hours, and air cooling is carried out after the aging treatment to obtain a hardness-enhanced aluminum alloy back plate;
(2) performing thread turning on the welding surface of the hardness-enhanced aluminum alloy backboard obtained in the step (2), wherein the size of the thread turning is 0.45mm x 0.15mm, performing acid pickling on the aluminum target material and the aluminum alloy backboard for 1min by using a mixed solution of nitric acid and hydrofluoric acid, and performing vacuum drying at 50 ℃ for 3h to obtain a pretreated aluminum target material and an aluminum alloy backboard;
(3) and assembling the pretreated aluminum target and the aluminum alloy back plate, placing the aluminum target and the aluminum alloy back plate in a sheath, vacuumizing, and performing hot isostatic pressing welding at the temperature of 200 ℃ and the pressure of 120 MPa.
Example 2
The embodiment provides an assembling method of an aluminum target and an aluminum alloy back plate, which comprises the following steps:
(1) carrying out solid solution treatment and aging treatment on the aluminum alloy backboard, wherein the temperature of the solid solution treatment is 500 ℃ and the time is 0.5h, water cooling is carried out after the solid solution treatment, the temperature of the aging treatment is 300 ℃ and the time is 2h, and air cooling is carried out after the aging treatment to obtain a hardness-enhanced aluminum alloy backboard;
(2) performing thread turning on the welding surface of the hardness-enhanced aluminum alloy backboard obtained in the step (2), wherein the size of the thread turning is 0.85mm x 0.6mm, performing acid pickling treatment on the aluminum target material and the aluminum alloy backboard for 5min by using a mixed solution of nitric acid and hydrofluoric acid, and performing vacuum drying at 90 ℃ for 0.5h to obtain a pretreated aluminum target material and an aluminum alloy backboard;
(3) and assembling the pretreated aluminum target and the aluminum alloy back plate, placing the aluminum target and the aluminum alloy back plate in a sheath, vacuumizing, and performing hot isostatic pressing welding at the temperature of 300 ℃ and the pressure of 80 MPa.
Example 3
The embodiment provides an assembling method of an aluminum target and an aluminum alloy back plate, which comprises the following steps:
(1) carrying out solid solution treatment and aging treatment on the aluminum alloy backboard, wherein the temperature of the solid solution treatment is 480 ℃ and the time is 1.8h, carrying out water cooling after the solid solution treatment, the temperature of the aging treatment is 180 ℃ and the time is 4.5h, and carrying out air cooling after the aging treatment to obtain a hardness-enhanced aluminum alloy backboard;
(2) performing thread turning on the welding surface of the hardness-enhanced aluminum alloy backboard obtained in the step (2), wherein the size of the thread turning is 0.50mm x 0.25mm, performing acid pickling treatment on the aluminum target material and the aluminum alloy backboard for 2min by using a mixed solution of nitric acid and hydrofluoric acid, and performing vacuum drying at 60 ℃ for 2.5h to obtain a pretreated aluminum target material and an aluminum alloy backboard;
(3) and assembling the pretreated aluminum target and the aluminum alloy back plate, placing the aluminum target and the aluminum alloy back plate in a sheath, vacuumizing, and performing hot isostatic pressing welding at the temperature of 220 ℃ and under the pressure of 110 MPa.
Example 4
The embodiment provides an assembling method of an aluminum target and an aluminum alloy back plate, which comprises the following steps:
(1) carrying out solid solution treatment and aging treatment on the aluminum alloy backboard, wherein the temperature of the solid solution treatment is 470 ℃, the time is 1.5h, water cooling is carried out after the solid solution treatment, the temperature of the aging treatment is 250 ℃, the time is 3.5h, and air cooling is carried out after the aging treatment to obtain the hardness-enhanced aluminum alloy backboard;
(2) performing thread turning on the welding surface of the hardness-enhanced aluminum alloy backboard obtained in the step (2), wherein the size of the thread turning is 0.65 x 0.30, performing acid pickling on the aluminum target material and the aluminum alloy backboard for 3min by using a mixed solution of nitric acid and hydrofluoric acid, and performing vacuum drying at 80 ℃ for 1.5h to obtain a pretreated aluminum target material and an aluminum alloy backboard;
(3) and assembling the pretreated aluminum target and the aluminum alloy back plate, placing the aluminum target and the aluminum alloy back plate in a sheath, vacuumizing, and performing hot isostatic pressing welding at the temperature of 250 ℃ and under the pressure of 100 MPa.
Comparative example 1
In this comparative example, the conditions were the same as in example 4 except that the aluminum target and the aluminum alloy backing plate were assembled, and then the solution treatment and the aging treatment in step (1) were performed. The operation of comparative example 1 causes the aluminum target to grow large in grains.
The aluminum target used in examples 1 to 4 and comparative example 1 was Al with a purity of 99.999% and the aluminum alloy backing plate used was a designation a 2024.
The bonding strength between the aluminum target material and the aluminum alloy backing plate of the aluminum targets obtained after assembly in examples 1 to 4 and the hardness of the aluminum alloy backing plate were measured, and the results are shown in table 1.
The method for testing the hardness of the aluminum alloy back plate is a Vickers hardness testing method. And testing the bonding strength by adopting a stretching method, taking a cylindrical sample with the diameter of 35mm, applying force to two ends until the two welding materials are separated, and recording the magnitude of the applied force during separation, wherein the strength is force/sectional area of the cylindrical sample.
TABLE 1
| Bonding strength/MPa | Vickers hardness/HV | |
| Example 1 | 21 | 131 |
| Example 2 | 37 | 118 |
| Example 3 | 27 | 135 |
| Example 4 | 30 | 128 |
The applicant declares that the present invention illustrates the detailed structural features of the present invention through the above embodiments, but the present invention is not limited to the above detailed structural features, that is, it does not mean that the present invention must be implemented depending on the above detailed structural features. It should be understood by those skilled in the art that any modifications of the present invention, equivalent substitutions of selected components of the present invention, additions of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (10)
1. The method for assembling the aluminum target and the aluminum alloy back plate is characterized by comprising the following steps of:
(1) carrying out solid solution treatment and aging treatment on the aluminum alloy back plate to obtain a hardness-enhanced aluminum alloy back plate;
(2) performing thread turning on the welding surface of the hardness-enhanced aluminum alloy backboard obtained in the step (1), and performing acid washing treatment on the aluminum target material and the aluminum alloy backboard to obtain a pretreated aluminum target material and an pretreated aluminum alloy backboard;
(3) and assembling the pretreated aluminum target material and the aluminum alloy back plate, placing the assembled aluminum target material and the aluminum alloy back plate in a sheath, vacuumizing, and performing hot isostatic pressing welding.
2. The assembling method according to claim 1, wherein the temperature of the solution treatment in the step (1) is 450 to 500 ℃;
preferably, the time of the solution treatment in the step (1) is 0.5-2 h;
preferably, the solution treatment in step (1) is followed by water cooling.
3. The assembling method according to claim 1 or 2, wherein the temperature of the aging treatment in the step (1) is 150 to 300 ℃;
preferably, the time of the aging treatment in the step (1) is 2-5 h;
preferably, air cooling is performed after the aging treatment in the step (1).
4. An assembly method according to any one of claims 1 to 3, wherein the size of the turned threads of step (2) is (0.45 to 0.85) mm (0.15 to 0.6) mm.
5. The assembling method according to any one of claims 1 to 4, wherein the pickling time in the step (2) is 1 to 5 min.
6. The assembling method according to any one of claims 1 to 5, wherein the acid solution for acid washing in the step (2) is a mixed solution of nitric acid and hydrofluoric acid;
preferably, the molar ratio of the nitric acid to the hydrofluoric acid is 1-2: 1.
7. The assembling method according to any one of claims 1 to 6, wherein after the pickling in the step (2), the aluminum target and the aluminum alloy backing plate are subjected to vacuum drying;
preferably, the temperature of the vacuum drying is 50-90 ℃;
preferably, the vacuum drying time is 0.5-3 h.
8. The assembly method of any one of claims 1 to 7, wherein said evacuation of step (3) is such that the gas pressure in the enclosure is less than 10 ° f-3Pa。
9. The assembly method according to any one of claims 1 to 8, wherein the temperature of the hot isostatic pressing welding in step (3) is 200 to 300 ℃;
preferably, the pressure of the hot isostatic pressing welding in the step (3) is 80-120 MPa.
10. An assembly method according to any one of claims 1-9, characterised in that the method comprises the steps of:
(1) carrying out solid solution treatment and aging treatment on the aluminum alloy back plate, wherein the temperature of the solid solution treatment is 450-500 ℃ and the time is 0.5-2 h, water cooling is carried out after the solid solution treatment, the temperature of the aging treatment is 150-300 ℃ and the time is 2-5 h, and air cooling is carried out after the aging treatment to obtain a hardness-enhanced aluminum alloy back plate;
(2) turning threads on the welding surface of the hardness-enhanced aluminum alloy backboard obtained in the step (2), wherein the size of the turned threads is (0.45-0.85) mm (0.15-0.6) mm, performing acid pickling on the aluminum target material and the aluminum alloy backboard for 1-5 min by using a mixed solution of nitric acid and hydrofluoric acid, and performing vacuum drying at 50-90 ℃ for 0.5-3 h to obtain the pretreated aluminum target material and the pretreated aluminum alloy backboard;
(3) and assembling the pretreated aluminum target and the aluminum alloy back plate, placing the aluminum target and the aluminum alloy back plate in a sheath, vacuumizing, and performing hot isostatic pressing welding at the temperature of 200-300 ℃ and under the pressure of 80-120 MPa.
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| CN202011305209.0A CN112475802B (en) | 2020-11-19 | 2020-11-19 | Method for assembling aluminum target and aluminum alloy back plate |
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| CN202011305209.0A CN112475802B (en) | 2020-11-19 | 2020-11-19 | Method for assembling aluminum target and aluminum alloy back plate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113020826A (en) * | 2021-03-16 | 2021-06-25 | 宁波江丰电子材料股份有限公司 | Diffusion welding method for nickel target and aluminum alloy back plate |
| CN113695730A (en) * | 2021-09-03 | 2021-11-26 | 宁波江丰电子材料股份有限公司 | Welding method of chromium target material assembly |
| CN113695732A (en) * | 2021-09-10 | 2021-11-26 | 宁波江丰电子材料股份有限公司 | Welding method of aluminum target material assembly |
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| CN101564793A (en) * | 2009-04-17 | 2009-10-28 | 宁波江丰电子材料有限公司 | Welding method of aluminum target blank and aluminum alloy backboard |
| CN102534518A (en) * | 2011-12-29 | 2012-07-04 | 宁波江丰电子材料有限公司 | Backboard fabricating method |
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| CN113020826A (en) * | 2021-03-16 | 2021-06-25 | 宁波江丰电子材料股份有限公司 | Diffusion welding method for nickel target and aluminum alloy back plate |
| CN113695730A (en) * | 2021-09-03 | 2021-11-26 | 宁波江丰电子材料股份有限公司 | Welding method of chromium target material assembly |
| CN113695730B (en) * | 2021-09-03 | 2023-01-13 | 宁波江丰电子材料股份有限公司 | Welding method of chromium target material assembly |
| CN113695732A (en) * | 2021-09-10 | 2021-11-26 | 宁波江丰电子材料股份有限公司 | Welding method of aluminum target material assembly |
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