CN105586551A - Thermal-treatment method for back boards - Google Patents
Thermal-treatment method for back boards Download PDFInfo
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- CN105586551A CN105586551A CN201410563121.7A CN201410563121A CN105586551A CN 105586551 A CN105586551 A CN 105586551A CN 201410563121 A CN201410563121 A CN 201410563121A CN 105586551 A CN105586551 A CN 105586551A
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Abstract
A thermal-treatment method for back boards includes the steps of (a) providing a back board; (b) clamping the back board with two clamp boards on the two end surfaces of the back board; (c) performing solution thermal treatment to the back board clamped between the clamp boards; and (d) performing aging thermal treatment to the back board clamped between the clamp boards, wherein the end surfaces of the back board are always clamped between the clamp boards during the solution thermal treatment and the aging thermal treatment in the method, so that uneven defect due to non-uniform shrinkage of different parts on the end surfaces of the back board during a cooling process can be prevented.
Description
Technical field
The present invention relates to field of semiconductor manufacture, relate in particular to a kind of heat treatment method of backboard.
Background technology
In large-scale integrated circuit fabrication process of modern times, magnetron sputtering is high with its sputtering raste, substrate temperatureThe advantages such as liter is low, film-Ji adhesion is good become the most excellent substrate coating technique.
In magnetron sputtering membrane process, target material assembly by meet the target of sputtering performance and with described targetIn conjunction with, have some strength backboard form. Backboard is not only assembled to sputter base station at described target material assemblyIn play a supporting role, and it has effect of conduction heat, for magnetron sputtering technique targetHeat radiation. In magnetron sputtering membrane process, backboard working environment is comparatively harsh.
Target material assembly is in the larger magnetic field of high temperature, high voltage electric field and magnetic field intensity, and front is 10-9PaHigh vacuum environment under, be subject to the bombardment of various high energy ions, cause target generation sputter, and sputterNeutral target atom or molecule deposition on substrate, form film. In the process of sputter, if the back of the bodyThe hardness of plate is not high enough, and backboard meeting temperature distortion, will cause target material assembly operational failure. Therefore, logicalOften need to heat-treat the backboard after moulding, thereby realize the object that improves backboard hardness.
But the backboard hardness that existing backboard heat treatment method obtains still cannot meet technological requirement, andExisting backboard heat treatment method also causes back plate surface uneven, affect follow-up backboard machining andUse.
Summary of the invention
The problem that the present invention solves is to provide a kind of heat treatment method of backboard, to improve the hardness of backboard,And prevent that backboard from surface occurring in heat treatment process and occur rough situation, ensure after heat treatmentBackboard can normally carry out machining, improves the serviceability of backboard.
For addressing the above problem, the invention provides a kind of heat treatment method of backboard, comprising:
Backboard is provided;
Adopt two clamping plates to clamp described backboard along two end faces of described backboard respectively;
Described backboard to described clamping plate clamping carries out solution heat treatment;
Described backboard to described clamping plate clamping carries out timeliness heat treatment.
Optionally, described backboard inside has ventilating water pipe.
Optionally, two described clamping plate entire area of two described end faces of fitting respectively.
Optionally, the cold process of described solution heat treatment comprises radially described backboard is hung down along described backboardIn straight immersion water or oil.
Optionally, after described timeliness heat treatment, also comprise radially described backboard is hung down along described backboardStep in straight immersion water or oil.
Optionally, the material of described backboard is aluminium, copper or their alloy, and the material of described clamping plate isCopper, aluminium or their alloy, or the material of described clamping plate is steel.
Optionally, described clamping plate have screw, adopt screw rod that two described clamping plate are locked in together to press from both sidesHold described backboard.
Optionally, described clamping plate are 1500Pa～2000Pa to the pressure range of described end face.
Optionally, the solid solubility temperature scope of described solution heat treatment is 510 DEG C～550 DEG C, described solution heat treatmentThe time range of reason is 2.5h～3.5h.
Optionally, described aging heat treatment solid solubility temperature scope is 150 DEG C～190 DEG C, described timeliness heat placeThe time range of reason is 7.5h～8.5h.
Compared with prior art, technical scheme of the present invention has the following advantages:
In technical scheme of the present invention, first provide backboard, then adopt two clamping plates respectively along the described back of the bodyTwo end faces of plate clamp described backboard, afterwards the described backboard of described clamping plate clamping are carried out to solution heat treatmentReason, finally carries out timeliness heat treatment to the described backboard of described clamping plate clamping. Due in solution heat treatment andIn timeliness heat treatment process, clamping plate clamp the end face of described backboard all the time, and therefore, described backboard end face is notCan because shrinking inequality, each several part produce rough situation in cooling procedure.
Further, clamping plate are controlled at 1500Pa～2000Pa to the pressure of backboard end face. If pressure is less than1500Pa, clamping plate are inadequate to the chucking power of end face, and backboard end face still easily shrinks distortion. IfPressure is greater than 2000Pa, on the one hand may make end face be out of shape by compression, on the other hand for sealed clamping plateThe easy stripped thread of screw rod.
Brief description of the drawings
Fig. 1 is the heat treatment method schematic flow sheet of the backboard that provides of the embodiment of the present invention;
Fig. 2 is the perspective view of the backboard that provides of the embodiment of the present invention;
Fig. 3 is the top view of backboard shown in Fig. 2;
Fig. 4 be backboard shown in Fig. 3 dissect along DD chain-dotted line the profile obtaining;
Fig. 5 be adopt screw rod by backboard shown in Fig. 2 and clamping plate the perspective view after sealed.
Detailed description of the invention
As described in background, the heat treatment method of existing backboard cannot make the hardness of backboard reach correspondingTechnological requirement, and the heat treatment method of existing backboard also causes back plate surface uneven. Analyze the back of the bodyPlate surface occurs that rough reason is as follows: in the heat treatment process of backboard, conventionally need to carry out water-cooled,In Cooling Process, it is sharply cooling that back plate surface is met water, if back plate surface each several part internal stress inequality, justEasily shrink the rough situation that produces. Backboard inside has defect in various degree conventionally, therefore,The internal stress of each several part is not the same, and backboard size is larger, more easily causes rough feelingsCondition. More importantly, in order to make backboard in use keep lower temperature, also can be at backboardIndoor design ventilating water pipe. The existence of ventilating water pipe makes ability that backboard diverse location meets with stresses more notBalance, therefore back plate surface is more prone to occur rough situation.
For this reason, the invention provides a kind of new, the heat treatment method of backboard, described method adopts twoClamping plate clamp described backboard along two end faces of backboard respectively, and then to backboard carry out solution heat treatment andTimeliness heat treatment, because clamping plate clamp the end face of described backboard all the time, therefore, described backboard end face can notBecause shrinking inequality, each several part produces rough situation in cooling procedure.
For above-mentioned purpose of the present invention, feature and advantage can more be become apparent, below in conjunction with accompanying drawingSpecific embodiments of the invention are described in detail.
A heat treatment method for backboard, incorporated by reference to referring to figs. 1 to Fig. 5.
Incorporated by reference to reference to figure 1 and Fig. 2, perform step S1, backboard 100 is provided.
In the present embodiment, backboard 100 is flattened cylindrical body structure, and therefore backboard has end face 100A, endFace 100B and side 100C. End face 100A and end face 100B are circular flat, and in the present embodimentThe diameter of circular flat can be 590mm. And side 100C is that (side 100C is cylinder side to curved surfaceFace), the height of side can be 35mm.
In other embodiments of the invention, backboard can be also the structure of other shape, for example flat lengthCube structure or tetragonal prism structure etc., now backboard still has two end faces that are plane. BackboardEach size can be also other numerical value.
In the present embodiment, have two openings 111 on end face 100A, one of them opening 111 is as logicalThe water inlet of waterpipe 110 (please refer to Fig. 3), another opening 111 going out as ventilating water pipe 110The mouth of a river.
The material of backboard 100 can be aluminium, copper or their alloy, in the present embodiment, and backboard 100Material specifically taking the Si-Mg alloy of aluminium as example.
Please refer to Fig. 3, backboard 100 inside have ventilating water pipe 110 (ventilating water pipe 110 is represented by dotted lines).
In the present embodiment, the ventilating water pipe 110 of backboard 100 inside is the vertical distribution situation of three horizontal strokes two, butThat in other embodiments of the invention, ventilating water pipe 110 can be also other distribution situation.
Please refer to Fig. 4, show backboard 100 along the section knot obtaining after the DD chain-dotted line cutting in Fig. 3Structure schematic diagram. Therefrom can see, ventilating water pipe 110 is positioned at the centre position of two end faces. And logicalThe cross section of waterpipe 110 is square substantially. In other embodiments of the invention, cutting of ventilating water pipeFace also can be other shape, such as circle or rectangle etc.
Backboard 100 is normally formed through steps such as machining, hole milling road and welding by two block parts, the process that forms backboard 100 is specifically as follows: by machining, by the outer wheels of two block partsWide car out. Then by milling machine, the duct part in parts is milled out. Finally incite somebody to action by welding procedureTwo parts are welded together, thereby make the duct of two parts coordinate formation ventilating water pipe 110.
Incorporated by reference to reference to figure 1 and Fig. 5, perform step S2, adopt two clamping plates 200 respectively along backboard 100Two end faces (please refer to end face 100A and end face 100B in Fig. 2 to 3) clampings backboard 100.
The material of clamping plate 200 can be steel, can be also copper, aluminium or their alloy, this enforcementIn example, the material of clamping plate is specifically taking steel as example.
In the present embodiment, the shape of clamping plate 200 is also flattened cylindrical shape, considers the size of backboard 100(Φ 590mm × 35mm), clamping plate 200 sizes can be Φ 620mm × 20mm (clamping plate end face diameterFor 620mm, thickness is 20mm). It should be noted that, in other embodiments of the invention, clamping plate 200Also can be other shape, such as cuboid or square etc., only need to ensure that clamping plate 200 have oneIndividual area is greater than the plane of backboard 100 end faces, and this plane can clamp backboard 100.
Clamping plate 200 have screw (not shown), adopt screw rod 300 that two clamping plates 200 is locked in togetherWith clamping backboard 100. Concrete, the present embodiment adopts the screw rod 300 of 8 M10 by solid backboard 100Fix in the middle of two clamping plates 200, on clamping plate 200, correspondence is provided with 8 screws, and 8 screws are symmetrical and equalOn the even circle that is distributed in clamping plate 200 end face Φ 600mm, (be that clamping plate 200 end face diameters are 600mmCircle). When sealed, first backboard 100 be stacked in the middle of two clamping plate 200, and ensure backboard 100Two end faces fit completely with the clamping face of two clamping plate 200 respectively, then via on clamping plate 200Screw, adopts screw rod 300 and nut 400 that three blocks of plates are closely locked in together, as shown in Figure 5.
It should be noted that, in other embodiments of the invention, the number of screw can be also 4 withOn other number, for example 4,5,6 or 7 are with first-class. And the number of screwBe well even number, so that when proper clamping plate clampings backboard 100, the pressure that the diverse location of backboard end face is subject toThis equates strong basis. In other embodiments of the invention, screw rod can be also other model.
Follow-up need to the welding with target of at least one end face of backboard 100, if the end face of backboard producesRaw rough situation, is unfavorable for follow-up and target welding. And end in order to make to weld with targetThe chucking power that face is subject to, in the present embodiment, arranges two clamping plates 200 two end faces of fitting respectively especially,And by screw, two clamping plates 200 is locked in together, thereby two of intermediate back-plate end faces are produced to footEnough chucking powers.
And the present embodiment arranges especially the clamping face of two clamping plates 200 correspondences and fits respectively described in twoThe entire area of end face. In the time of the entire area of clamping plate 200 clamping faces laminatings backboard 100 end faces, canMore effectively prevent that backboard 100 end faces from shrinking distortion, produces rough surface.
It should be noted that, in other embodiment of the present invention, the small part area of end face edge also canNeedn't fit with the clamping face of clamping plate, outside the small part area of part end face edge can be exposed to, butThis part should not have ventilating water pipe under being exposed to outer end face conventionally.
In the present embodiment, clamping plate 200 are controlled at 1500Pa～2000Pa to the pressure of backboard 100 end faces. AsFruit pressure is less than 1500Pa, and clamping plate 200 are inadequate to the chucking power of end face, and backboard 100 end faces are still easyShrink distortion. If pressure is greater than 2000Pa, may make end face be out of shape by compression on the one hand, anotherAspect is for the easy stripped thread of screw rod 300 of sealed clamping plate 200.
Though do not show in figure, the present embodiment, adopting clamping plate 200 to clamp after backboard 100, continues folderThe backboard 100 that plate 200 clamps carries out solution heat treatment.
Solution treatment is alloy is heated to proper temperature and keeps the sufficient time, makes some in alloyConstituent is dissolved in matrix, forms uniform solid solution, then that alloy is cooling rapidly, makes to dissolve in baseThe constituent of body is stayed becomes supersaturated solid solution in matrix. Solution treatment can improve the ductility of alloyAnd toughness, and create conditions for further carrying out precipitation-hardening processing.
In the present embodiment, the solid solubility temperature scope of described solution heat treatment is 510 DEG C～550 DEG C. Due to solid solutionHeat treatment is alloy to be heated to high temperature monophase field constant temperature keep, and makes the mutually abundant molten speed of surplus cooling, withTo the Technology for Heating Processing of supersaturated solid solution. Therefore, if temperature, lower than 510 DEG C, forms the single-phase institute of high temperatureTake time for a long time, the production technology cycle is oversize, and if temperature higher than 550 DEG C, excess Temperature, consumes energy larger,And equipment is also caused to adverse effect.
In the present embodiment, the time range of described solution heat treatment is 2.5h～3.5h. If the time lower than2.5h, the temperature of required solution heat treatment need to be adjusted get Geng Gao, otherwise it is single-phase not to form high temperature. ButAs noted earlier, and excess Temperature all has adverse effect to equipment and power consumption. And the time is too short, the back of the bodyThe stress that plate 100 stayed in the solution heat treatment stage cannot discharge completely at Stages of Aging, causes backboard 100Internal stress is larger, and hardness cannot improve, and the time is oversize, wastes energy. And if the time is longer than 3.5h,The production technology cycle is long, affects production capacity.
Please continue to refer to Fig. 1, execution step S3, the cold process of described solution heat treatment comprises along backboard 100Radially by backboard 100 vertical immersion water or oil.
Water-cooled (or oil cooling) is an indispensable step of solution heat treatment, under high temperature, formsSingle-phase by cooling rapidly, could form supersaturated solid solution.
In the present embodiment, adopt fork truck to provoke iron chains, iron chains pull-up fixture is together with backboard 100, vertical, fastEnter water cooling fastly. The screw rod 300 of slinging between clamping plate 200 with iron chains, backboard 100 gravitates,Naturally just become plumbness, over entry handled easily. Vertically, cooling is fast in order to make as early as possible the back of the bodyPlate 100 submerges in water. Concept of time is between 3s～5s fast. If not Putting into water rapidly, backboard 100The part that first enters water is first shunk, after enter the part after-contraction of water, so successively enter the part amount of contraction meeting of waterInconsistent, cause backboard 100 radial direction deflections inhomogeneous, affect backboard 100 quality.
Please continue to refer to Fig. 1, execution step S4, but the present embodiment is carrying out solution heat treatment to backboard 100After reason, the backboard 100 that continues clamping plate 200 to clamp carries out timeliness heat treatment.
Timeliness heat treatment refers to that alloy workpiece is after solution treatment, cold plastic deformation or casting are forged, higherTemperature place the Technology for Heating Processing that keeps its performance, shape and size time to time change. Timeliness heat placeReason be metal in supersaturated solid solution Segregation solute atom district and (or) by precipitation go out particulate disperse and divideBe distributed in matrix and lead scleratogenous a kind of Technology for Heating Processing.
In the present embodiment, described aging heat treatment solid solubility temperature scope is 150 DEG C～190 DEG C. Timeliness heat placeReason is that the alloy workpiece after quenching is placed under room temperature or higher temperature and keeps appropriate time, to improve metalThe metal heating processing technology of intensity. Draw according to Al-Mg-Si phasor and concrete practice experience adjustments, 150DEG C～temperature range of 190 DEG C in, after backboard 100 timeliness heat treatments, internal stress is eliminated, and intensityReach necessary requirement. If temperature is lower than 150 DEG C, it is inner remaining that timeliness heat treatment is difficult to eliminate backboard 100Stress. If temperature is higher than 190 DEG C, backboard 100 after follow-up (enter water or enter oil) is cooling, Yi ZaoBecome secondary internal stress.
In the present embodiment, described aging heat treatment time range is 7.5h～8.5h. If timeliness heat treatmentTime be less than 7.5h, timeliness heat treatment is difficult to eliminate backboard 100 internal residual stress, if timeliness heatThe time of processing is greater than 8.5h, and the time is oversize, and the production technology cycle is long, affects production capacity.
Please continue to refer to Fig. 1, execution step S5, after described timeliness heat treatment, along the footpath of backboard 100To by backboard 100 vertical immersion water or oil.
It should be noted that, water-cooled (or oil cooling) is not the indispensable step after timeliness heat treatment,In other embodiments of the invention, also can after timeliness heat treatment, adopt air cooling. But air cooling is coldBut speed is slow, easily delays production, reduces production capacity. Therefore, the present embodiment adopts water-cooled (or oil cooling).
In the present embodiment, provoke iron chains with fork truck, iron chains pull-up fixture is together with backboard 100, vertical, quickGround enters water cooling. The screw rod 300 of slinging between clamping plate 200 with iron chains, backboard 100 gravitates, fromSo just become plumbness, over entry handled easily. Vertically, cooling is fast in order to make as early as possible backboard100 submerge in water. Concept of time is between 3s～5s fast. If not Putting into water rapidly, backboard 100 firstThe part that enters water is first shunk, after enter the part after-contraction of water, the part amount of contraction that so successively enters water can be notUnanimously, cause backboard 100 radial direction deflections inhomogeneous, affect backboard 100 quality.
If there is no clamping plate 200, at solution heat treatment and timeliness heat treatment stages backboard 100 directly into water,The power that the whole surface of backboard 100 all can be shunk. The ability meeting with stresses due to backboard 100 each several partsDifference, backboard 100 end faces of otherwise flat are more yielding, and backboard 100 end faces easily form rough and uneven in surfaceSurface. And in the time that backboard 100 inside have ventilating water pipe 110, backboard 100 end faces are more prone toThere is this scraggly situation. Therefore, in the present embodiment, in solution heat treatment and timeliness heat treatmentIn two stages, backboard 100 is fixed always and is clamped between two clamping plates 200, presss from both sides by clamping plate 200Hold the end face of backboard 100, can, by chucking power clamping backboard 100 end faces of clamping plate 200, make the back of the bodyThe distortion of plate 100 end faces is able to effective control, thereby prevents on solution heat treatment and timeliness heat treatment rankSection backboard 100 end faces occur rough and uneven in surface.
Though in figure, do not show, but after the Technologies for Heating Processing such as solution heat treatment and timeliness heat treatment,The present embodiment is follow-up can, by backboard 100 and corresponding target welding, form final target material assembly product.
Although the present invention discloses as above, the present invention is not defined in this. Any those skilled in the art,Without departing from the spirit and scope of the present invention, all can make various changes or modifications, therefore guarantor of the present inventionThe scope of protecting should be as the criterion with claim limited range.
Claims (10)
1. a heat treatment method for backboard, is characterized in that, comprising:
Backboard is provided;
Adopt two clamping plates to clamp described backboard along two end faces of described backboard respectively;
Described backboard to described clamping plate clamping carries out solution heat treatment;
Described backboard to described clamping plate clamping carries out timeliness heat treatment.
2. the heat treatment method of backboard as claimed in claim 1, is characterized in that, described backboard inside hasVentilating water pipe.
3. the heat treatment method of backboard as claimed in claim 1, is characterized in that, two described clamping plate respectivelyThe entire area of two described end faces of laminating.
4. the heat treatment method of backboard as claimed in claim 1, is characterized in that, described solution heat treatmentCold process comprise along described backboard radially by described backboard vertical immersion water or oil.
5. the heat treatment method of backboard as claimed in claim 1, is characterized in that, in described timeliness heat treatmentAfter, also comprise along described backboard radially by the step in described backboard vertical immersion water or oil.
6. the heat treatment method of backboard as claimed in claim 1, is characterized in that, the material of described backboard isAluminium, copper or their alloy, the material of described clamping plate is copper, aluminium or their alloy, orThe material of described clamping plate is steel.
7. the heat treatment method of backboard as claimed in claim 1, is characterized in that, described clamping plate have screw,Adopt screw rod that two described clamping plate are locked in together to clamp described backboard.
8. the heat treatment method of backboard as claimed in claim 1, is characterized in that, described clamping plate are to described endThe pressure range of face is 1500KPa～2000KPa.
9. the heat treatment method of backboard as claimed in claim 1, is characterized in that, described solution heat treatmentSolid solubility temperature scope is 510 DEG C～550 DEG C, and the time range of described solution heat treatment is 2.5h～3.5h.
10. the heat treatment method of backboard as claimed in claim 1, is characterized in that, described aging heat treatmentSolid solubility temperature scope is 150 DEG C～190 DEG C, and described aging heat treatment time range is 7.5h～8.5h.
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| CN107502842A (en) * | 2017-10-20 | 2017-12-22 | 吉林大学 | A kind of 6 systems and the supper-fast solid solution treatment method of 7 line aluminium alloys |
| CN108950440A (en) * | 2018-07-17 | 2018-12-07 | 苏州温锑姆精密机械有限公司 | Aluminium alloy plate processing technology |
| CN112475802A (en) * | 2020-11-19 | 2021-03-12 | 宁波江丰电子材料股份有限公司 | Method for assembling aluminum target and aluminum alloy back plate |
| CN112522502A (en) * | 2020-11-11 | 2021-03-19 | 宁波江丰电子材料股份有限公司 | Treatment method for prolonging service life of ring piece |
| CN113883191A (en) * | 2021-09-24 | 2022-01-04 | 山东金麒麟股份有限公司 | Method for improving loading strength of disc brake pad and brake pad |
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| CN101595822A (en) * | 2009-06-12 | 2009-12-09 | 杭州旗锐工具有限公司 | A kind of manufacture method of replaceable guide plate head |
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