CN112437541A - Manufacturing method of nail bed plate of printed circuit board anti-welding single-table-board full-automatic production line - Google Patents
Manufacturing method of nail bed plate of printed circuit board anti-welding single-table-board full-automatic production line Download PDFInfo
- Publication number
- CN112437541A CN112437541A CN202011213614.XA CN202011213614A CN112437541A CN 112437541 A CN112437541 A CN 112437541A CN 202011213614 A CN202011213614 A CN 202011213614A CN 112437541 A CN112437541 A CN 112437541A
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- Prior art keywords
- nail
- hole
- nail bed
- board
- plate
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Links
- 210000004904 fingernail bed Anatomy 0.000 title claims abstract description 106
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 72
- 238000003466 welding Methods 0.000 title claims abstract description 8
- 210000000282 nail Anatomy 0.000 claims abstract description 61
- 238000005553 drilling Methods 0.000 claims abstract description 35
- 229910000679 solder Inorganic materials 0.000 claims abstract description 20
- 239000004020 conductor Substances 0.000 claims abstract description 18
- 238000009826 distribution Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000003365 glass fiber Substances 0.000 claims abstract description 8
- 239000004744 fabric Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 abstract description 16
- 238000009434 installation Methods 0.000 abstract description 7
- 238000007639 printing Methods 0.000 abstract description 6
- 238000013461 design Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
Abstract
The invention discloses a method for manufacturing a nail bed plate of a printed circuit board solder mask single-table-board full-automatic production line, which comprises the following steps: determining the surface number of the nail according to the surface number of the plug hole; designing the hole distribution position, and manufacturing drilling tape data: selecting a substrate area and a gong-blank area in the unit, and designing a plurality of positioning holes and nail distribution holes in the substrate area, wherein the distance between the edge of each nail distribution hole and the conductor/hole edge is more than or equal to 0.2 mm; outputting the drilling belt of the nail bed; taking the cut glass fiber board, taking the nail bed drill belt, and drilling a positioning hole and a nail distributing hole; adjusting a universal routing belt, routing grooves in the nail bed plate and at the plate edges, wherein part of routing grooves divide the nail bed plate into three sections; and (5) welding resistance process nailing. The manufacture method of the nail bed plate of the printed circuit board solder-resisting single-table-board full-automatic production line can avoid product scrapping or bad reworking caused by nail bed printing due to line crushing caused by inaccurate nail bed installation, and solves the problem that the nail bed plate cannot be installed on a screen printing table due to the traditional nail bed plate whole-plate nail loading.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for manufacturing a nail bed plate of a printed circuit board anti-welding single-table-board full-automatic production line.
Background
Solder mask printing is an important process in circuit board production, and is to cover insulating ink on the surface of a circuit board in a screen printing mode and expose a bonding pad to be welded for use in a solder mask exposure development mode so as to achieve the effects of later insulation and oxidation prevention.
At present, most circuit board production companies adopt a nail bed double-sided printing mode to improve production capacity and competitiveness in the industry, but for most nail bed production, the nail bed is still manually produced manually or the whole board is adopted to arrange nails, so that a three-link machine full-automatic silk screen printing table top cannot be installed or the installation position of the nail bed cannot be accurately determined, the defects that the nail bed cannot be repeatedly used and the like are overcome, and the requirement of the existing full-automatic single-table three-machine line silk screen printing equipment cannot be met.
In view of the above, it is necessary to provide a new method for manufacturing a nail bed to solve the above technical problems.
Disclosure of Invention
The invention aims to solve the technical problem of providing a method for manufacturing a nail plate of a printed circuit board anti-welding single-table-board full-automatic production line, which can avoid product scrapping or bad reworking caused by nail bed printing due to line crushing caused by inaccurate nail bed installation, solve the problem that the nail plate cannot be installed on a screen printing table due to traditional nail plate whole-plate nail loading, improve the production efficiency and improve the product quality.
In order to solve the problems, the technical scheme of the invention is as follows:
a manufacturing method of a nail bed plate of a printed circuit board solder mask single-table-board full-automatic production line comprises the following steps:
step S1, determining the surface number of the nail bed according to the surface number of the plug hole;
step S2, designing the hole distribution position, making the drilling tape data: selecting a substrate area and a gong-blank area in the unit, and designing a plurality of positioning holes and nail distribution holes in the substrate area, wherein the distance between the edge of each nail distribution hole and the conductor/hole edge is more than or equal to 0.2 mm;
step S3, outputting a drilling belt of the nail bed;
step S4, taking the cut glass fiber board, taking the nail bed drill belt, and drilling a positioning hole and a nail distributing hole;
step S5, a universal gong belt is taken, gong grooves in the nail bed board and at the board edges are gong out, and the nail bed board is divided into three sections by part of the gong grooves;
and step S6, performing solder mask process binding to finish the manufacture of the nail bed plate.
Further, in step S2, the cloth nail holes are distributed in an equilateral triangle manner.
Further, in step S2, the tack holes are arranged at positions where the substrate area is large, and the tack holes are kept consistent with the peripheral conductor pitch.
Further, in step S2, the distance between the edge of the nail hole and the conductor/hole edge is more than or equal to 1 mm; if the space in the unit is insufficient and the distance between the edge of the cloth nail hole and the conductor/hole edge is less than or equal to 1mm, the cloth nail hole is arranged on the routing position of the jointed board or the line of the V-shaped groove, so that the distance between the edge of the cloth nail hole and the conductor/hole edge is more than or equal to 0.2 mm.
Further, the aperture of the cloth nail hole is 1.05 mm.
Furthermore, at least two positioning holes are distributed in each section of the nail bed plate, and the aperture of each positioning hole is 3.175mm or 2.5 mm.
Further, step S2 includes a step of designing a bed nail segment number drill hole provided at a position 2mm from the board edge at each of the bed nail short sides.
Further, the section number drilling hole is 5cm away from the positioning hole, or 5cm away from the side edge of the positioning hole, or 2mm away from the center point of the short edge to the positioning hole.
Further, the section number drilling adopts a 1.05mm drill bit.
Further, the size of the glass fiber plate is 620 × 720 mm; the width of a routing groove between two adjacent sections of nail bed plates is 10 mm.
Compared with the prior art, the manufacturing method of the nail bed plate of the printed circuit board solder mask single-table-board full-automatic production line has the beneficial effects that:
according to the manufacturing method of the printed circuit board solder mask single-table-board full-automatic production line nail bed board, due to the hole site design of the nail distribution holes, product scrapping caused by line crushing due to inaccurate nail bed installation or poor rework caused by nail bed printing can be avoided; through being the syllogic with the design of nail bed board, solved traditional nail bed board whole board binding and brought and can't install silk screen printing platform problem, reduce manual operation, improved production efficiency to improve product quality.
Secondly, according to the manufacturing method of the nail bed plate of the printed circuit board anti-welding single-table-board full-automatic production line, the nail bed plate can be rapidly installed and can be repeatedly used.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic flow chart of a manufacturing method of a nail bed plate of a printed circuit board solder-resisting single-table-board full-automatic production line provided by the invention;
FIG. 2 is a schematic structural diagram of the nail bed plate manufactured by the manufacturing method of the printed circuit board solder-resisting single-table-board full-automatic production line nail bed plate provided by the invention.
Detailed Description
In order to make the technical solutions in the embodiments of the present invention better understood and make the above objects, features, and advantages of the present invention more comprehensible, specific embodiments of the present invention are described below with reference to the accompanying drawings.
It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Please refer to fig. 1, which is a flow chart of a manufacturing method of a nail bed plate of a printed circuit board solder mask single-table-board full-automatic production line provided by the invention. The invention provides a manufacturing method of a nail bed plate of a printed circuit board solder-resisting single-table-board full-automatic production line, which comprises the following steps:
step S1, determining the surface number of the nail bed according to the surface number of the plug hole;
specifically, one surface with relatively sparse patterns and space is selected to be set as a nail bed surface.
Step S2, designing the hole distribution position, making the drilling tape data: selecting a substrate area and a gong-blank area in the unit, and designing a plurality of positioning holes and nail distribution holes in the substrate area, wherein the distance between the edge of each nail distribution hole and the conductor/hole edge is more than or equal to 0.2 mm;
specifically, a substrate area and a routing area are arranged in the unit, and conductors or hole areas are avoided, wherein the conductors comprise circuits, bonding pads, copper sheets and the like;
preferably, the distance between the edge of the cloth nail hole and the conductor/hole edge is designed to be more than or equal to 1 mm; if the space in the unit is insufficient, when the distance between the edge of the cloth nail hole and the conductor/hole edge is less than 1mm, the routing position of the jointed board or the V-shaped groove line can be selected to be provided with the cloth nail hole, so that the distance between the edge of the cloth nail hole and the conductor/hole edge is 0.2 mm;
when the cloth nail holes are arranged, preferably, the positions with large base material areas are selected to be arranged with the cloth nail holes, and the distances between the cloth nail holes and the peripheral conductors are kept consistent;
more preferably, the cloth nail holes are uniformly distributed in an equilateral triangle mode so as to meet the requirement of uniform stress during screen printing of the board surface;
in this embodiment, the aperture of the bed hole is set to 1.05 mm; the positioning holes are positioned at the same position as the holes of the production board (printed circuit board) so as to facilitate the positioning of the production board and the nail bed board and the alignment of the production board and the nail bed board through the pins, and the aperture of the positioning holes is larger than 1.5mm, preferably 3.175mm or 2.5 mm.
In this embodiment, in order to adapt to the full-automatic silk screen printing equipment of triple link machine, need be divided into three sections with the nail bed board, the locating hole distributes at least two in every section nail bed board to circuit board location and fixed more firmly.
Corresponding to the three nail bed plates, the method also comprises a step of designing nail bed plate section number drilling holes at the corresponding nail bed plate positions, and is used for quickly distinguishing the positions of the nail bed plates when a machine is installed. Specifically, the nail bed section number drilling holes are in the shapes of numbers 1, 2 and 3, the nail bed section number drilling holes are formed in the positions, 2mm away from the plate edges, of the short edges of each section of the nail bed, and the section number drilling holes are 5cm away from the positioning holes, or 5cm away from the side edges far away from the positioning holes, or 2mm away from the center points of the short edges to the positioning holes.
And editing and manufacturing the drilling tape data of the nail bed plate according to the logic.
Step S3, outputting a drilling belt of the nail bed;
step S4, taking the cut glass fiber board, taking the nail bed drill belt, and drilling a positioning hole and a nail distributing hole;
specifically, in this embodiment, the size of the glass fiber plate is 620 × 720mm, the drilling tape data of the nail plate is retrieved, the positioning holes and the nail distribution holes are drilled on the glass fiber plate, and the section number drilling holes are drilled at the same time. Wherein, the cloth nail hole is 1.05mm in length, the positioning hole is 3.175mm or 2.5mm in length, and the section number is drilled and 1.05mm in length;
step S5, a universal gong belt is taken, gong grooves in the nail bed board and at the board edges are gong out, and the nail bed board is divided into three sections by part of the gong grooves;
the utility model discloses a fine setting is carried out to the part that needs gong falls including designing out according to silk screen printing platform design structure, and the definition is first gong groove, and the quantity in first gong groove is two, and the symmetry sets up, begins and extends to central direction by the minor face of nail bed board respectively. The width of the first routing groove is 22mm, and the length of the first routing groove is based on the positioning of the machine table;
the routing grooves also comprise second routing grooves used for dividing the whole nail bed plate into three sections, and the width of each second routing groove is 10 mm; the three sections of formed nail bed plates are respectively arranged on three bed surfaces of a screen printing machine table, wherein one middle section of the automatic screen printing machine table is a movable table surface and is used for conveying the middle sections of the plates and the nail bed plates, and in the embodiment, the nail bed plate with the section number drilling mark of 2 is arranged on the movable table surface.
In this embodiment, because nail bed plate size is 620 × 720mm, the gong area that makes the gong nail bed plate can be general, has improved the efficiency of nail bed plate processing.
Step S6, performing solder mask process binding;
specifically, 1.0mm of nail needles are respectively arranged on the three sections of drilled and milled nail bed plates;
step S7, fixing the nail bed plate on the table surface of the screen printing machine;
specifically, two sections of the nail bed plates with section number drilling marks of '1' and '3' are directly aligned and fixed on a screen printing machine table by using a pipe position with a plate edge of 3.175mm and a circuit board to be screen printed, the nail bed plate with the section number drilling mark of '2' is aligned with a pin on the actual circuit board to be screen printed through a drilled pipe position hole of the circuit board with the thickness of more than 1.5mm and is fixed on a movable table top of the screen printing machine table, and nail bed installation is completed. Wherein, two sections of the nail bed plates marked with the section number drilling holes of 1 and 3 are distributed on two sides of the nail bed plate marked with the section number drilling hole of 2 after the grooves are milled.
Please refer to fig. 2, which is a schematic structural diagram of the nail plate manufactured by the manufacturing method of the printed circuit board solder-proof single-table-board full-automatic production line nail plate provided by the present invention. The prepared nail bed plate comprises a plurality of positioning holes 1 and nail distribution holes 2 formed in a base material area, a first routing groove 3 used for aligning with a screen printing machine table, a second routing groove 4 used for separating the whole plate into three sections, and section number drilling holes 5 distributed on the short sides of the nail bed plate in each section. The aperture of the positioning hole 1 is 3.175mm or 2.5mm, and the positioning hole is mainly distributed at the edge of the nail bed board and is used for positioning with a printed circuit board; specifically, the aperture of the nail bed plate positioning hole marked with the section number drilling hole as "1" or "3" is 3.175mm, the aperture of the nail bed plate positioning hole marked with the section number drilling hole as "2" is 2.5mm, and of course, the specification of the aperture of all the positioning holes as 2.5mm can also be adopted; the diameter of the cloth nail holes 2 is 1.05mm, and the number of the cloth nail holes is a plurality, and the cloth nail holes are used for cloth nails; the width of the first routing groove 3 is 22mm, and the first routing groove 3 is positioned on the bed nail with the section number drilling mark of 2; the width of the second routing groove 4 is 10 mm; the section number drilling holes 5 are drilled by adopting 1.05mm drill bits, and respectively form marks of 1, 2 and 3, and the accurate positioning and installation of the nail bed plate are realized according to different section number marks.
Compared with the prior art, the manufacturing method of the nail bed plate of the printed circuit board solder mask single-table-board full-automatic production line has the beneficial effects that:
according to the manufacturing method of the printed circuit board solder mask single-table-board full-automatic production line nail bed board, due to the hole site design of the nail distribution holes, product scrapping caused by line crushing due to inaccurate nail bed installation or poor rework caused by nail bed printing can be avoided; through being the syllogic with the design of nail bed board, solved traditional nail bed board whole board binding and brought and can't install silk screen printing platform problem, reduce manual operation, improved production efficiency to improve product quality.
Secondly, according to the manufacturing method of the nail bed plate of the printed circuit board anti-welding single-table-board full-automatic production line, the nail bed plate can be rapidly installed and can be repeatedly used.
The embodiments of the present invention are described in detail above with reference to the drawings, but the present invention is not limited to the described embodiments. Various changes, modifications, substitutions and alterations to these embodiments will occur to those skilled in the art without departing from the spirit and scope of the present invention.
Claims (10)
1. A manufacturing method of a nail bed plate of a printed circuit board solder mask single-table-board full-automatic production line is characterized by comprising the following steps:
step S1, determining the surface number of the nail bed according to the surface number of the plug hole;
step S2, designing the hole distribution position, making the drilling tape data: selecting a substrate area and a gong-blank area in the unit, and designing a plurality of positioning holes and nail distribution holes in the substrate area, wherein the distance between the edge of each nail distribution hole and the conductor/hole edge is more than or equal to 0.2 mm;
step S3, outputting a drilling belt of the nail bed;
step S4, taking the cut glass fiber board, taking the nail bed drill belt, and drilling a positioning hole and a nail distributing hole;
step S5, a universal gong belt is taken, gong grooves in the nail bed board and at the board edges are gong out, and the nail bed board is divided into three sections by part of the gong grooves;
and step S6, performing solder mask process binding to finish the manufacture of the nail bed plate.
2. The manufacturing method of the nail plate of the printed wiring board solder mask single-table-board full-automatic production line according to claim 1, wherein in step S2, the nail holes are arranged in an equilateral triangle manner.
3. The method for manufacturing the nail plate of the printed wiring board solder mask single-table-board fully automatic production line according to claim 1, wherein in step S2, the nail holes are arranged at a position where the base material area is large, and the distance between the nail holes and the peripheral conductor is kept consistent.
4. The manufacturing method of the nail plate of the printed wiring board solder mask single-table-board full-automatic production line according to claim 1, wherein in step S2, the distance between the edge of the hole of the nail distribution hole and the conductor/hole edge is more than or equal to 1 mm; if the space in the unit is insufficient and the distance between the edge of the cloth nail hole and the conductor/hole edge is less than or equal to 1mm, the cloth nail hole is arranged on the routing position of the jointed board or the line of the V-shaped groove, so that the distance between the edge of the cloth nail hole and the conductor/hole edge is more than or equal to 0.2 mm.
5. The manufacturing method of the nail plate of the printed circuit board solder mask single-table-board full-automatic production line according to claim 1, wherein the diameter of the hole for arranging the nail is 1.05 mm.
6. The manufacturing method of the nail bed plate of the printed circuit board solder mask single-table-board full-automatic production line according to claim 1, wherein at least two positioning holes are distributed in each section of the nail bed plate, and the diameter of each positioning hole is 3.175mm or 2.5 mm.
7. The manufacturing method of the nail bed plate of the printed circuit board anti-welding single-table-board full-automatic production line of claim 1, wherein the step S2 further comprises a step of designing a nail bed plate section number drilling hole, wherein the section number drilling hole is arranged at the position of each section of the short side of the nail bed plate and 2mm away from the plate edge.
8. The method for manufacturing the nail bed plate of the printed circuit board solder mask single-table-board full-automatic production line according to claim 7, wherein the section number drilling hole is 5cm away from the positioning hole, or 5cm away from the side edge of the positioning hole, or 2mm away from the center point of the short edge to the positioning hole.
9. The manufacturing method of the nail bed plate of the printed circuit board solder mask single-table-board full-automatic production line according to claim 7, wherein the section number drilling adopts a 1.05mm drill bit.
10. The manufacturing method of the nail bed plate of the printed circuit board solder-proof single-table-board full-automatic production line according to claim 1, wherein the size of the glass fiber plate is 620 x 720 mm; the width of a routing groove between two adjacent sections of nail bed plates is 10 mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011213614.XA CN112437541B (en) | 2020-11-04 | 2020-11-04 | Manufacturing method of nail bed plate of printed circuit board anti-welding single-table-board full-automatic production line |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011213614.XA CN112437541B (en) | 2020-11-04 | 2020-11-04 | Manufacturing method of nail bed plate of printed circuit board anti-welding single-table-board full-automatic production line |
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| Publication Number | Publication Date |
|---|---|
| CN112437541A true CN112437541A (en) | 2021-03-02 |
| CN112437541B CN112437541B (en) | 2022-08-23 |
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| Publication number | Publication date |
|---|---|
| CN112437541B (en) | 2022-08-23 |
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