CN112435559A

CN112435559A - Method for manufacturing body warming dummy with embedded stretchable circuit and body warming dummy

Info

Publication number: CN112435559A
Application number: CN202011275192.9A
Authority: CN
Inventors: 李宇航; 赵召; 管锡祺; 于雅楠
Original assignee: Beihang University
Current assignee: Beihang University
Priority date: 2020-11-15
Filing date: 2020-11-15
Publication date: 2021-03-02
Anticipated expiration: 2040-11-15
Also published as: CN112435559B

Abstract

The invention provides a method for manufacturing a warm-up dummy with an embedded stretchable circuit and the warm-up dummy, which comprises the following steps: establishing a three-dimensional model of the warm body dummy, and partitioning different parts of the warm body dummy according to curvature; carrying out curved surface expansion on each subarea; designing a stretchable flexible uniform heating film by taking the contour of each curved surface as a boundary; manufacturing a double-layer circuit; attaching a double-layer circuit to the part model; preparing corresponding three-dimensional curved surface glue pouring molds capable of wrapping different part models of the thermal manikin; packaging and curing through a gap between the glue pouring mold and the corresponding position model of the thermal manikin; and finishing the manufacture of the warm-up dummy after the encapsulation and the solidification of each part partition are finished. The invention adopts the flexible uniform heating device, designs the stretchable double-layer circuit according to the shapes of different areas of the human body, and uses the silicon rubber material to carry out curved surface packaging on the stretchable double-layer circuit, thereby ensuring the temperature uniformity of the thermal manikin.

Description

Method for manufacturing body warming dummy with embedded stretchable circuit and body warming dummy

Technical Field

The invention relates to the technical field of human body efficacy test equipment, in particular to a method for manufacturing a warm-up dummy with an embedded stretchable circuit and the warm-up dummy.

Background

The warm-up dummy is an instrument device which has the appearance of a human body and can simulate heat and moisture exchange between the human body and the environment, is a new biophysical test method which is gradually developed from the 40 th of the 20 th century, and the technology is widely applied to the fields of clothing, buildings, environments, aerospace, fire protection, traffic safety and the like, for example, the warm-up dummy is used for evaluating the comfort level of indoor environment, testing the thermal resistance of clothing and the like. The thermal environment can be objectively and systematically evaluated and the physiological response of the human body to the thermal environment can be predicted by utilizing the warm dummy to replace the real person to carry out experimental research, and under the conditions of severe and dangerous experimental environments, the risk coefficient of the experiment conducted by utilizing the real person is higher, the personal safety can not be guaranteed, the dummy is required to replace the real person to carry out the experiment, and the experimental safety is improved.

Due to the improvement of the recognition of the thermal manikin, the application range of the thermal manikin is expanded, the functions are continuously improved, and the manufacturing technology is also continuously improved. As a warm body dummy device for simulating heat and moisture exchange between a real human body and the environment, the more the physiological state of the human body can be simulated truly, the more the reality of the experimental data is. Because each main part of the thermal manikin is the non-developable surface, the traditional heating mode can not perfectly apply the surface of the thermal manikin, so that the condition of uneven temperature distribution can be generated, and meanwhile, the traditional heating wire winding method can not control the equidistant distribution, thereby causing the problem of poor temperature uniformity of the thermal manikin.

Disclosure of Invention

In order to solve the problems, the invention provides a method for manufacturing a warm body dummy with an embedded stretchable circuit and the warm body dummy.

The invention provides a method for manufacturing a warm-up dummy with an embedded stretchable circuit, which comprises the following steps: establishing a three-dimensional model of the warm body dummy, and partitioning different parts of the warm body dummy according to curvature; carrying out curved surface unfolding on each part partition of the warm body dummy; designing a stretchable flexible uniform heating film by taking the contour of each curved surface as a boundary; manufacturing a double-layer circuit in the stretchable flexible uniform heating film; attaching the double-layer circuit in the stretchable flexible uniform heating film to a position model corresponding to the warm-up dummy; preparing corresponding three-dimensional curved surface glue pouring molds capable of wrapping different part models of the thermal manikin; packaging and curing through a gap between the glue pouring mold and the corresponding position model of the thermal manikin; after the encapsulation and solidification of each part subarea are finished, all the part subareas are uniformly assembled, and the production of the warm-up dummy is finished.

Furthermore, the double-layer circuit is made of polyimide copper-clad film.

Further, the two-layer circuit is composed of a lower polyimide support configuration and an upper metal circuit configuration.

Furthermore, the circuit shape of the double-layer circuit adopts a snake-shaped configuration of a periodic repeating unit cell, and the edges are connected by adopting the snake-shaped configuration according to a curved surface contour.

Further, the manufacturing of the double-layer circuit comprises: setting parameters of the laser processing system according to the thickness of the material by using the laser processing system; firstly, cutting an integral structure of the double-layer circuit structure on a polyimide copper-clad film by laser, then selecting a part with a difference set between the shape of an upper-layer copper circuit of the double-layer circuit and a lower-layer polyimide support structure, selecting heating parameters according to a heating copper stripping process in a laser system, carrying out heating copper stripping treatment by a defocusing process, and leaving an upper-layer metal series circuit diagram above the polyimide support structure.

Further, gaps between the glue pouring mold and the models at different parts of the thermal manikin are controlled to be at the same distance.

Further, the space between adjacent wires, the width of the wires and the thickness of the wires are determined according to the heating power of the unit area of the double-layer circuit and the mechanical tensile property of the wires.

On the other hand, the invention also provides a warm-up dummy which is manufactured by the manufacturing method of the warm-up dummy with the built-in stretchable circuit.

The invention has the beneficial effects that: according to the invention, the main part of the thermal manikin is partitioned according to the curvature, the main part is expanded in a partitioned mode, and a double-layer stretchable circuit is designed according to an expanded plane contour diagram, so that the error of the non-stretchable surface expanded by software can be compensated through the micro deformation of the stretchable circuit; the lower layer circuit of the double-layer circuit and the insulated parallel PI (polyimide) circuit can provide a supporting effect for the upper layer series copper circuit, and meanwhile, the equal interval distribution of a certain degree after stretching deformation is guaranteed, so that the purpose of uniform heating is achieved. The stretchable double-layer circuit is firstly pasted on the surface of the warm-up dummy, and then the continuity of uniformly packaging the curved surface mold is better, so that the problem of gaps among different heating films when the heating films are pasted after the plane is solidified can be avoided.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

FIG. 1 is a flow chart of a method of making a thermal manikin;

FIG. 2 is a sectional view of the main part of the thermal manikin;

FIG. 3 is a development view of the curved surface of each part region;

FIG. 4 is a diagram of a front half-face two-layer circuit design;

FIG. 5 is a diagram of a two-layer circuit design for the rear half of the face;

fig. 6 is a schematic view of a header package.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Example 1

As shown in fig. 1, a method for manufacturing a thermal manikin with an embedded stretchable circuit specifically comprises the following steps:

and step S1, establishing a three-dimensional model of the warm body dummy, and partitioning different parts of the warm body dummy according to the curvature.

As shown in fig. 2: the three-dimensional model of the warm-up dummy is built by three-dimensional software, different parts of the warm-up dummy are partitioned according to curvature, the warm-up dummy is in a bilateral symmetry structure, so the warm-up dummy is divided into 12 part partitions of a front half face, a rear half face, a chest, a front upper abdomen, a back, a rear waist, a big arm, a small arm, a front lower abdomen, a hip, a thigh and a shank in the embodiment, and the part partitions of the warm-up dummy can be further increased on the basis of the 12 part partitions according to the application environment of the warm-up dummy, for example, the part partitions of a neck, a hand or a foot are increased, and/or the 12 part partitions are further subdivided.

And step S2, performing curved surface expansion on each part region of the thermal manikin.

As shown in fig. 3, the 12 part divisions divided in step S1 are each subjected to curved surface development.

And step S3, designing the stretchable flexible uniform heating film by taking the curved surface contours as boundaries.

The stretchable flexible uniform heating film capable of completely wrapping the head is designed and comprises a double-layer circuit, wherein the double-layer circuit consists of a lower-layer PI supporting configuration and an upper-layer metal circuit configuration. The upper layer metal circuit is in a series configuration, and the series circuit generates heat the same everywhere, so that the temperature distribution uniformity is ensured. The lower layer PI supporting configuration is a parallel configuration and is provided with a mesh configuration of middle supports, and the mesh configuration can support the upper layer metal circuit processed by laser and enable the upper layer metal circuit configuration to keep a characteristic shape.

In this embodiment, a head with the largest curvature is taken as an example, as shown in fig. 4-5, a double-layer circuit size configuration is designed by taking curved surface profiles of a front half face and a rear half face as boundaries, a circuit shape adopts a periodically repeated single-cell serpentine configuration, edges are connected according to the curved surface profiles by adopting the serpentine configuration, in order to ensure that the temperature uniformity of the outer surface of a final product is realized, parameters such as the distance between adjacent wires, the wire width, the wire thickness and the like need to be determined according to the heating power of a unit area and the mechanical tensile property of the wires, and a head area is taken as an example, the maximum distance between the adjacent wires is 4mm, the maximum wire width is 1mm, and the maximum thickness is.

And step S4, manufacturing a double-layer circuit in the stretchable flexible uniform heating film.

The PI (polyimide) copper-coated film is used as a processing material, the upper layer of the material is a copper material, the lower layer of the material is a polyimide material, and the middle of the material is an adhesive; setting parameters such as different powers, speeds, processing times and the like of the laser processing system by using the laser processing system according to the thickness of the material; firstly, laser cutting an integral structure of the double-layer circuit configuration on a PI copper-clad film, then taking a difference part between the upper-layer copper circuit shape and the lower-layer PI supporting configuration of the double-layer circuit, selecting heating parameters according to a heating copper stripping process in a laser system, carrying out heating copper stripping treatment by using a defocusing process, and leaving an upper-layer metal series circuit diagram above the PI supporting configuration.

And step S5, attaching the double-layer circuit in the stretchable flexible uniform heating film to the position model corresponding to the warm-up dummy.

The manufactured double-layer circuit is attached to the corresponding part partition of the warm-up dummy, taking the head as an example, as shown in fig. 6.

And step S6, preparing a corresponding three-dimensional curved surface glue pouring mold capable of wrapping different part models of the thermal manikin.

The gaps between the glue pouring mold and the models at different parts of the thermal manikin are controlled to be at the same distance, for example, 5mm, and the purpose is that after glue is poured on the curved surface, the thickness is the same, and the temperature uniformity is better.

And step S7, packaging and curing the gap between the glue pouring mold and the corresponding thermal manikin part model.

Ecoflex00-30 in which an agent A and an agent B are mixed well according to the proportion of 1: 1 is poured into a gap between a glue pouring mold and a corresponding main part model of the thermal manikin, and after the two-component silicon rubber is mixed and stirred uniformly by a container, the two-component silicon rubber is quickly poured into the gap and is placed into a vacuum drying box for vacuumizing and heating and curing at constant temperature. If the single-component silicon rubber is directly poured and contacts the glue solidified by moisture in the air, the glue is not required to be placed in a vacuum drying oven.

And step S8, after the encapsulation and solidification of each part subarea are finished, all part subareas are assembled in a unified mode, and the production of the warm-up dummy is finished.

After curing, opening the glue filling mold, taking out the part subarea of the warm body dummy with the silicon rubber packaging layer with the same thickness, finally uniformly assembling to obtain the warm body dummy which uniformly generates heat, and performing circuit connection at the position of the wafer of the lead port.

Example 2

A thermal manikin, which is manufactured by the manufacturing method of the embodiment 1.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for manufacturing a warming dummy with an embedded stretchable circuit is characterized by comprising the following steps:

establishing a three-dimensional model of the warm body dummy, and partitioning different parts of the warm body dummy according to curvature;

carrying out curved surface unfolding on each part partition of the warm body dummy;

designing a stretchable flexible uniform heating film by taking the contour of each curved surface as a boundary;

manufacturing a double-layer circuit in the stretchable flexible uniform heating film;

attaching the double-layer circuit in the stretchable flexible uniform heating film to a position model corresponding to the warm-up dummy;

preparing corresponding three-dimensional curved surface glue pouring molds capable of wrapping different part models of the thermal manikin;

performing glue pouring, packaging and curing through a gap between the glue pouring mold and the corresponding position model of the thermal manikin;

after the encapsulation and solidification of each part subarea are finished, all the part subareas are uniformly assembled, and the production of the warm-up dummy is finished.

2. The method of claim 1, wherein the two-layer circuit is formed by copper-clad polyimide film.

3. The method of claim 1 wherein the two-layer circuit is comprised of a lower polyimide support configuration and an upper metal circuit configuration.

4. The method of claim 1, wherein the double-layer circuit has a serpentine configuration with periodically repeating unit cells and edges connected in a serpentine configuration according to a curved profile.

5. The method of manufacturing according to claim 2, wherein the manufacturing of the two-layer circuit includes: setting parameters of the laser processing system according to the thickness of the material by using the laser processing system; firstly, cutting an integral structure of the double-layer circuit structure on a polyimide copper-clad film by laser, then selecting a part with a difference set between the shape of an upper-layer copper circuit of the double-layer circuit and a lower-layer polyimide support structure, selecting heating parameters according to a heating copper stripping process in a laser system, carrying out heating copper stripping treatment by a defocusing process, and leaving an upper-layer metal series circuit diagram above the polyimide support structure.

6. The method according to claim 1, wherein gaps between the glue-pouring mold and the model at different parts of the thermal manikin are controlled to be at the same distance.

7. The method of claim 1, wherein the spacing between adjacent wires, the width of the wires, and the thickness of the wires are determined according to the heating power per unit area of the double-layer circuit and the mechanical tensile properties of the wires themselves.

8. A thermal manikin made by the method of making a thermal manikin with embedded stretchable circuitry of any of claims 1-7.