CN112424921A

CN112424921A - Refrigerating machine

Info

Publication number: CN112424921A
Application number: CN201980046946.2A
Authority: CN
Inventors: 李基旭; 李南洙; 朴灿名
Original assignee: LG Electronics Inc
Current assignee: LG Electronics Inc
Priority date: 2018-07-13
Filing date: 2019-07-10
Publication date: 2021-02-26
Anticipated expiration: 2039-07-10
Also published as: US11674721B2; US20210116155A1; KR102570579B1; CN112424921B; WO2020013613A1; KR20200007596A

Abstract

A freezer according to an embodiment of the invention, comprising: a compressor for compressing a refrigerant; and a frequency converter module for controlling the compressor, the frequency converter module including: a radiator formed with a cooling flow path through which a coolant passes; a coolant inlet connected to the radiator so as to communicate with an inlet of the cooling flow path; a coolant outlet connected to the radiator so as to communicate with an outlet of the cooling flow path; at least one IGBT configured on the top surface of the radiator; and at least one diode disposed on a top surface of the heat sink so as to be spaced apart from the IGBT, the cooling flow path including: an IGBT cooling flow path closer to a coolant inlet of the coolant inlet and the coolant outlet; and a diode cooling flow path closer to the coolant outlet of the coolant inlet and the coolant outlet, the diode cooling flow path being located after the IGBT cooling flow path in a flow direction of the coolant.

Description

Refrigerating machine

Technical Field

The present invention relates to a Refrigerator (freezer).

Background

A refrigerator is a device that cools or freezes a liquid by obtaining a low temperature by a refrigerant, and the main part of the refrigerator is composed of four parts, i.e., a compressor, a condenser, an expansion valve, and an evaporator. The refrigerant is transported by a compression type (reciprocating, rotary, centrifugal refrigerator) or an absorption type.

The compressor constituting the refrigerator may further include: a motor; and an inverter (inverter) capable of changing the speed of the motor, and the inverter may include an IGBT (insulated gate bipolar transistor), a capacitor, or the like.

As mentioned above, the freezer comprising the motor and the frequency converter may further comprise a separate cooler (cooler) for absorbing heat of the frequency converter. Such coolers may have: an air-cooled cooler such as a radiator fan for causing air to flow to an inverter; and a water-cooled cooler for guiding cooling water to a cooling pipe of the inverter.

When the refrigerator includes a water-cooled cooler, a cooling pipe for passing cooling water is disposed around the inverter, and heat of the inverter can be absorbed.

In a refrigerator including a water-cooled cooler, a part of cooling piping may be disposed above an IGBT, and in this case, condensed water that has been generated on the surface of the cooling piping and then dropped may drop to the IGBT located below the cooling piping, and these cooling piping may increase the risk of electric leakage of the IGBT or fire.

Disclosure of Invention

Problems to be solved by the invention

An object of the present invention is to provide a refrigerator that can minimize the possibility of leakage or fire by minimizing the phenomenon in which condensed water drips onto an IGBT (insulated gate bipolar transistor), a diode, or the like.

Another object of the present invention is to provide a refrigerator that can dissipate heat from all of IGBTs and diodes and can preferentially dissipate heat with high reliability from IGBTs having a high heat generation amount.

Technical scheme for solving problems

A freezer according to an embodiment of the invention, comprising: a compressor for compressing a refrigerant; and an inverter module for controlling the compressor, the inverter module including: a radiator (heatsink) having a cooling flow path formed therein for passing a coolant (coolant); a coolant inlet (inlet) connected to the radiator so as to communicate with an inlet of the cooling flow path; a coolant outlet (outlet) connected to the radiator so as to communicate with an outlet of the cooling flow path; at least one IGBT disposed on a top surface of the heat sink; and at least one diode (diode) disposed on the top surface of the heat sink so as to be spaced apart from the IGBT, the cooling flow path including: an IGBT cooling flow path closer to a coolant inlet of the coolant inlet and the coolant outlet; and a diode cooling flow path that is closer to the coolant outlet of the coolant inlet and the coolant outlet, the diode cooling flow path being located after the IGBT cooling flow path in the flow direction of the coolant.

The cooling flow path may further include: and a connection flow path for connecting the IGBT cooling flow path and the diode cooling flow path.

The entire length of the IGBT cooling flow path may be longer than the entire length of the diode cooling flow path.

The IGBT cooling flow path and the diode cooling flow path may respectively include: a pair of parallel linear flow paths; and a return flow path for connecting the pair of linear flow paths. The distance between the pair of linear flow paths of the IGBT cooling flow path may be greater than the distance between the pair of linear flow paths of the diode cooling flow path.

The height of each of the coolant inlet and the coolant outlet may be lower than the height of each of the at least one IGBT and the at least one diode.

The coolant inlet and the coolant outlet may be connected to an outer circumferential surface of the radiator.

The IGBT and the diode may be provided in plural numbers, respectively.

The top surface of the heat sink may include: a first region in which a plurality of IGBTs are arranged; a second region in which a plurality of diodes are arranged; and a third region which is located between the first region and the second region and is not provided with an IGBT and a diode.

The first area may be larger than the second area.

The radiator may include a single cooling plate, the top and bottom surfaces of which are connected by the outer peripheral surface thereof, and a cooling flow path is formed between the top and bottom surfaces of the cooling plate. The cooling flow path may be formed by a plurality of linear opening portions that are sequentially communicated in the flow direction of the coolant.

A part of the plurality of linear openings may include: one end located on the outer peripheral surface of the cooling plate; and the other end located inside the cooling plate. The remaining portions of the plurality of linear openings may intersect the adjacent pair of linear openings, and may include a pair of ends located on the outer peripheral surface of the cooling plate.

The coolant inlet may be connected to one end of one of the plurality of linear openings. Also, the coolant outlet may be connected to one end of another of the plurality of linear openings.

The radiator may further include a plurality of covers for blocking one end of the other linear opening portion of the plurality of linear opening portions to which the coolant inlet and the coolant outlet are not connected.

The freezer may further include: the radiator is placed on the base; and a heat radiation fan which is arranged on the base in a mode of facing the IGBT, and an avoiding groove part for limiting avoiding the heat radiation fan is formed on a part of the periphery of the heat radiator.

A part of the heat dissipation fan may be located in the avoidance groove portion. The heat radiation fan may face the avoidance groove portion and the IGBT, respectively.

The heat dissipation fan may include a fan housing (housing) formed with a hollow, and the hollow may face the IGBT.

The lower portion of the fan housing may face the avoidance groove portion in the horizontal direction.

Effects of the invention

According to the embodiment of the present invention, since the coolant can cool the IGBT, which is a high heat generating component, first and then cool the diode, not only the IGBT can be cooled quickly, but also the diode can be cooled efficiently together with the IGBT.

Further, since the entire length of the IGBT cooling flow path is longer than the entire length of the diode cooling flow path, the coolant can sufficiently cool the IGBT first, and then cool the diode, so that the heat radiation performance of the IGBT can be improved, and the IGBT can be radiated with high reliability.

In addition, the IGBT cooling flow path can dissipate heat from the IGBT at least twice, the diode cooling flow path can dissipate heat from the diode at least twice, and the coolant passing through the cooling flow path can absorb heat from each of the IGBT and the diode with high reliability.

Further, the distance between the pair of linear flow paths of the IGBT cooling flow path may be larger than the distance between the pair of linear flow paths of the diode cooling flow path, whereby the IGBTs and the diodes having different sizes can be radiated with high reliability.

In addition, since the cooling flow path is formed between the top surface and the bottom surface of the single cooling plate, the radiator is less likely to leak the coolant and is more reliable than in the case where the cooling flow path is formed between the upper side plate and the lower side plate.

Further, the heat radiation fan is positioned in the avoidance groove portion, whereby the heat radiation fan can be disposed adjacent to the IGBT, and the inverter module can be made compact to the maximum extent.

In addition, since the IGBT and the diode are arranged on the top surface of the heat sink, and the coolant inlet and the coolant outlet are connected to one of the plurality of outer peripheral surfaces of the heat sink, the heat sink has: the condensed water dropping from the surface of the coolant inlet or the coolant outlet does not penetrate to the IGBT and the diode, and there is no advantage in that there is no possibility of electric leakage due to the condensed water dropping from the surface of the coolant inlet and the coolant outlet.

Drawings

Fig. 1 is a diagram showing a refrigerator to which a compressor according to an embodiment of the present invention is applied.

Fig. 2 is a perspective view of a refrigerator to which a compressor according to an embodiment of the present invention is applied.

Fig. 3 is a diagram showing the inside of the inverter outer case according to the embodiment of the present invention.

Fig. 4 is a perspective view showing a frequency converter module of an embodiment of the present invention.

Fig. 5 is a plan view showing the heat sink shown in fig. 4.

Fig. 6 is a top view of the IGBT and diode mounted on the heat sink shown in fig. 5.

Detailed Description

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 is a diagram showing a refrigerator to which a compressor according to an embodiment of the present invention is applied, fig. 2 is a perspective view of the refrigerator to which the compressor according to the embodiment of the present invention is applied, fig. 3 is a diagram showing an inside of an inverter outer case according to the embodiment of the present invention, fig. 4 is a perspective view showing an inverter module according to the embodiment of the present invention, fig. 5 is a plan view showing a heat sink shown in fig. 4, and fig. 6 is a plan view showing a state where an IGBT and a diode are mounted on heat dissipation shown in fig. 5.

The refrigerator of the present embodiment may include a compressor 1, a condenser 2, an expansion mechanism 3, and an evaporator 4, and the compressor 1 may compress a refrigerant evaporated in the evaporator 4. The refrigerant, which is compressed in the compressor 1 and discharged from the compressor 1, may be sequentially passed through the condenser 2, the expansion mechanism 3, and the evaporator 4, and then sucked into the compressor 1.

The compressor 1 may be connected to the evaporator 4 by a suction body 5 and to the condenser 2 by a discharge body 6.

The compressor 1 can compress the gas refrigerant flowing in from the evaporator 4. The compressor 1 may be configured to be capable of changing its operating capacity and may be configured to compress refrigerant into multiple stages.

The compressor 1 may include a motor 10, and the motor 10 generates a driving force for compressing a refrigerant. The motor 10 may be an alternating current motor, and may be a three-phase induction (induction) motor. The motor 10 may include a motor housing 12 with a space formed inside the motor housing 12. Further, the motor 10 may further include: a shaft; a rotor mounted on an outer periphery of the shaft; and a stator provided inside the housing 12 and surrounding the outer circumference of the rotor. The rotor may include a magnet, and the stator may include: a stator core; and a coil wound around the stator core.

The compressor 1 may be a centrifugal compressor that sucks refrigerant gas in an axial direction and discharges it toward a centrifugal direction, and the compressor 1 may further include a volute (volute case) 20. The compressor 1 may include a centrifugal impeller connected to a shaft of the motor 10. The centrifugal impeller may be rotatably accommodated in an impeller accommodating space formed inside the scroll casing 20, and may flow the gas refrigerant to the scroll casing.

Further, the compressor 1 may further include an inlet guide 21. The inlet guide 21 is connected to the scroll casing 20 so that the gas refrigerant suction can be guided to the scroll casing 20. The suction body 5 may be connected to the inlet guide 21, and the refrigerant flowing out of the suction body 5 may be guided to the inside of the scroll 20 via the inlet guide 21.

Each of the condenser 2 and the evaporator 4 may be a Shell and tube (Shell and tube) heat exchanger, in which case each of the condenser 2 and the evaporator 4 may include: a substantially hollow cylindrical housing; and an inner pipe disposed inside the outer shell, and through which cooling water or cold water passes.

The cooling water flows into the condenser 2 and is discharged from the condenser 2, and heat exchange between the refrigerant and the cooling water is realized inside the condenser 2. Further, the cooling water may be heated while passing through the condenser 2.

The expansion mechanism 3 may be an electronic expansion valve disposed between the condenser 2 and the evaporator 4.

Cold water flows into the evaporator 4 and is discharged from the evaporator 4, and heat exchange between the refrigerant and the cold water can be realized inside the evaporator 4. The cold water may be cooled while passing through the evaporator 4, and the cooled cold water may be supplied to a cold water demand.

The compressor 1 may be provided to be located at an upper side of at least one of the condenser 2 and the evaporator 4, and may be modularized as one module together with the condenser 2 and the evaporator 4.

The freezer may comprise an inverter 7 (see fig. 2) which is able to vary the rotational speed to the motor 10 by varying the frequency of the compressor 1, in particular the motor 10.

The inverter 7 may include an inverter housing 90 (see fig. 2). A space for accommodating various control components that can control the compressor 1, particularly the motor 10, may be formed inside the inverter casing 90. The inverter 7 may further include a door 91 (see fig. 2), and the door 91 is connected to the inverter outer case 90 and opens and closes a space of the inverter outer case 90.

An exhaust main body 92 (see fig. 3) may be disposed in the inverter outer case 90, and the exhaust main body 92 is configured to discharge air flowing by a heat dissipation fan 600 described later to the outside of the inverter outer case 90. As an example of the exhaust body 92, an exhaust grill formed in a grill shape may be used.

The frequency converter 7 may comprise a frequency converter module 100 for controlling the compressor 1, which frequency converter module 100 may be accommodated inside the frequency converter outer casing 90, as shown in fig. 3.

The frequency converter module 100 may include a power semiconductor module or the like.

As shown in fig. 3 and 4, the inverter module 100 may be an assembly that is modularized with an IGBT (Insulated gate bipolar transistor) 110, a diode 120, a buffer CAP (Snubber CAP)130, a capacitor 140, a heat sink 200, and the like.

In the inverter module 100 configured as described above, the at least one IGBT110, the at least one diode 120, the at least one buffer cover 130, the at least one capacitor 140, the heat sink 200, and the like can be assembled into one module outside the inverter case 90, and the assembled body assembled as described above can be inserted into the space of the inverter case 90. In this case, the assembling workability and productivity of the inverter can be improved.

In case the motor 10 is a three-phase alternating current motor, the inverter module 100 may comprise three IGBTs 110, three diodes 120 and three buffer covers 130.

The IGBT110 is a semiconductor element that can perform high-power low-speed switching, and the amount of heat generated during operation thereof may be larger than the amount of heat generated by each of the diode 120 and the buffer cover 130.

The inverter module 100 may be configured such that one heat sink 200 simultaneously dissipates heat from the IGBT110 and the diode 120, and for this purpose, the IGBT110 and the diode 120 may be respectively disposed in contact with the heat sink 200.

In the case where the inverter module 100 includes three IGBTs 110, three diodes 120, the three IGBTs 110 and three diodes 120 may be in contact with one heat sink 200 in a state of being spaced apart from each other, and the one heat sink 200 may absorb heat of the three IGBTs 110 and the three diodes 120, respectively, and transfer the heat to the working fluid passing through the heat sink 200.

As shown in fig. 6, at least one IGBT110 may be disposed on the top surface 201 of the heat sink 200. The IGBT110 may be in contact with the top surface 201 of the heat sink 200, and heat of the IGBT110 may be transferred to the heat sink 200 via the top surface 201 of the heat sink 200, and then to the coolant that is passing through the cooling flow path 210 of the heat sink 200.

As shown in fig. 6, at least one diode 120 may be disposed on the top surface 201 of the heat sink 200 in a spaced manner from the IGBT 110. The diode 120 may be in contact with the top surface 201 of the heat sink 200, and heat of the diode 120 may be transferred to the heat sink 200 via the top surface 201 of the heat sink 200 and then transferred to the coolant passing through the cooling flow path 210.

The heat sink 200 may be a three-dimensional shape having a thickness in the vertical direction as a heat radiation plate for absorbing heat of the IGBT110 and the diode 120. The heat sink 200 may include a top surface 201, a bottom surface 202, and a plurality of

peripheral surfaces

203, 204, 205, 206.

In the radiator 200, a cooling flow path 210 for passing a coolant may be formed. The cooling flow path 210 may include: an inlet 211 for inflow of coolant; and an outlet 212 for discharging the coolant.

The coolant may be cooling water such as water, and of course, the coolant of the present embodiment is not limited to water.

As shown in fig. 3 and 6, the coolant inlet 300 and the coolant outlet 400 may be connected to the radiator 200.

The coolant inlet 300 and the coolant outlet 400 may be connected to a cooling system such as a coolant pump and a radiator (or a coolant cooling tower), and the coolant cooled by the cooling system may flow into the radiator 200, particularly, the cooling flow path 210, through the coolant inlet 300.

The coolant inlet 300 may be connected to the radiator 200 in communication with the inlet 211 of the cooling flow path 210, and may guide the coolant to the cooling flow path 210.

The coolant outlet 400 may be connected to the radiator 200 in communication with the outlet 212 of the cooling flow path 210, and the coolant flowing out of the cooling flow path 210 may be guided to the coolant outlet 400.

The cooling flow path 210 may include:

IGBT cooling channels

213, 214, 215; a connection flow path 216; and

diode cooling channels

217, 218, 219.

The

IGBT cooling channels

213, 214, 215 and the

diode cooling channels

217, 218, 219 may be names that are distinguished according to the objects to be cooled.

The IGBT

cooling flow paths

213, 214, 215 may be closer to the coolant inlet 300 among the coolant inlet 300 and the coolant outlet 400. The IGBT

cooling flow paths

213, 214, 215 may be located after the inlet 211 in the flow direction of the coolant, and may communicate with the inlet 211.

The connection channel 216 may be formed to connect the

IGBT cooling channels

213, 214, 215 and the

diode cooling channels

217, 218, 219. The coolant may first cool the IGBT110 while flowing through the IGBT

cooling flow paths

213, 214, 215, may then flow into the diode

cooling flow paths

217, 218, 219 via the connection flow path 216, and may cool the diode 120 while flowing through the diode

cooling flow paths

217, 218, 219.

The diode

cooling flow paths

217, 218, 219 may be closer to the coolant outlet 400 of the coolant inlet 300 and the coolant outlet 400.

The diode

cooling flow paths

217, 218, 219 may be located after the IGBT

cooling flow paths

213, 214, 215 in the flow direction of the coolant. The diode

cooling flow paths

217, 218, 219 may communicate with the outlet 212, and may be located between the connection flow path 216 and the outlet 212 in the flow direction of the coolant.

Preferably, the heat sink 200 as described above preferentially radiates heat with high reliability to the IGBT110 having a heat generation amount higher than that of the diode 120, and for this reason, the entire length (L1+ L2+ L3) of the IGBT

cooling flow paths

213, 214, 215 may be larger than the entire lengths L4, L5, L6 of the diode

cooling flow paths

217, 218, 219.

The IGBT

cooling flow paths

213, 214, 215 and the diode

cooling flow paths

217, 218, 219 may respectively include: a pair of straight flow paths and a return flow path.

The return flow path may guide the coolant flowing through one of the pair of straight flow paths to the other flow path. The return flow paths may be formed to be orthogonal to the pair of straight flow paths, respectively.

The top surface 201 of the heat sink 200 may include: a first region in which the plurality of IGBTs 110 are arranged; a second region, in which the plurality of diodes 120 are disposed; and a third region located between the first region and the second region, in which the IGBT110 and the diode 120 are not arranged. The first and second regions may be quadrilateral shapes, respectively, and the first region may be larger than the second region.

The IGBT

cooling flow paths

213, 214, 215 may include: a pair of parallel

linear channels

213 and 215; and a return channel 214 for connecting the pair of

linear channels

213 and 215. The IGBT

cooling flow paths

213, 214, 215 may be ones of the cooling flow paths 210 that are located below the plurality of IGBTs 110, and may be ones that include a pair of

straight flow paths

213, 215 and a return flow path 214.

The diode

cooling flow paths

217, 218, 219 may include: a pair of parallel

linear channels

217 and 219; and a return passage 218 for connecting the pair of

linear passages

217 and 219. The diode

cooling flow paths

217, 218, 219 may be flow paths of the cooling flow path 210 that are located below the plurality of diodes 120, and may be flow paths including a pair of

straight flow paths

217, 219 and a return flow path 218.

A distance L7 (hereinafter referred to as a first distance) between the pair of linear channels constituting the

IGBT cooling channels

213, 214, and 215 may be larger than a distance L8 (hereinafter referred to as a second distance) between the pair of

linear channels

217 and 219 constituting the

diode cooling channels

217, 218, and 219.

The IGBT110 and the diode 120 may be different in size, and the IGBT110 may be larger than the diode 120. As described above, in the case where the first distance L7 is greater than the second distance L8, the heat sink 200 can dissipate heat of the IGBTs 110 and the diodes 120, respectively, which are different in size, with high reliability.

On the other hand, the coolant inlet 300 and the coolant outlet 400 may be connected to the outer

circumferential surfaces

203, 204, 205, 206 of the radiator 200. The coolant inlet 300 and the coolant outlet 400 may be connected to any one of the plurality of outer

circumferential surfaces

203, 204, 205, 206 of the radiator 200, i.e., the same one of the outer circumferential surfaces 203.

The heights of the plurality of outer

peripheral surfaces

203, 204, 205, 206 of the heat sink 200 may be lower than the height of the IGBT110 and the height of the diode 120, and the coolant inlet 300 and the coolant outlet 400 may be joined to any one of the plurality of outer

peripheral surfaces

203, 204, 205, 206, that is, the same one outer peripheral surface 203, by welding or the like.

In the present embodiment, even if leakage of coolant occurs in the coolant inlet 300 and the coolant outlet 400, since the heights of the coolant inlet 300 and the coolant outlet 400 are lower than the height of the IGBT110 and the height of the diode 120, the leaked coolant does not drip or flow into the IGBT110 and the diode 120.

Further, condensed water may be generated on the surfaces of the coolant inlet 300 and the coolant outlet 400 and may drip, but since the heights of the coolant inlet 300 and the coolant outlet 400 are lower than the heights of the IGBT110 and the diode 120, the condensed water falling to the surfaces of the coolant inlet 300 or the coolant outlet 400 does not drip to the IGBT110 and the diode 120.

The heat sink 200 may include: a single cooling plate 207 formed with a cooling flow path 210.

The outer surface of the cooling plate 207 may be formed by the joining of the top surface 201, the bottom surface 202 and the outer

peripheral surfaces

203, 204, 205, 206. Cooling channels 210 may be formed between top surface 201 and bottom surface 202 of cooling plate 207.

The cooling channel 210 may be spaced apart from the top surface 201 and the bottom surface 202 of the cooling plate 207 in the up-down direction, respectively, and heat transferred via the top surface 201 of the cooling plate 207 may be transferred to the cooling channel 210 and the coolant via a portion between the top surface of the cooling plate 207 and the cooling channel 210.

The cooling plate 207 may be formed with: a plurality of linear openings for forming the cooling flow path 210.

In one example of the cooling plate 207, all of the plurality of linear openings may be grooves (grooves) including: one end PS located on the outer peripheral surface of the cooling plate 207 and opened; and the other end PE located inside the cooling plate 207 and blocked.

In another example of the cooling plate 207, a part of the plurality of linear openings may be grooves (grooves) including: one end PS located on the outer peripheral surface of the cooling plate 207 and opened; and the other end PE located inside the cooling plate 207 and blocked, and the remaining part of the plurality of linear opening portions may be a hole (hole) that intersects an adjacent pair of linear opening portions and includes a pair of one ends PS located on the outer circumferential surface of the cooling plate 207 and opened.

The coolant inlet 300 may be connected to one end PS of any one of the plurality of linear openings, and the linear opening connected to the coolant inlet 300 of the plurality of linear openings may be the inlet 211 of the cooling flow path 210. Among the plurality of linear openings, the linear opening connected to the coolant outlet 400 may become the outlet 212 of the cooling flow path 210.

The heat sink 200 may further comprise a plurality of caps 208, said plurality of caps 208 being adapted to plug: one end PS of the other plurality of linear openings, which are not connected to the coolant inlet 300 and the coolant outlet 400, among the plurality of linear openings, is open.

The heat sink 200 may have a double-plate structure in which an upper cooling plate and a lower cooling plate are joined to each other. However, with such a radiator of a double plate structure, there is a high possibility that the coolant leaks through the gap between the upper cooling plate and the lower cooling plate, and it is necessary to perform a process for joining the upper cooling plate and the lower cooling plate with high accuracy.

In contrast, as described above, if the heat sink 200 and the cooling flow path 210 are configured by the single cooling plate 207 and the plurality of covers 208, it is possible to minimize the possibility that the coolant passing through the cooling flow path 210 leaks during the passage through the heat sink 200, and to improve the reliability of the heat sink 200.

On the other hand, the assembly of the radiator 200, the coolant inlet 300, and the coolant outlet 400 configured as described above has two joint portions, so that the number of welded portions can be minimized, and the possibility of leakage of the coolant can be minimized as compared with a case where a plurality of cooling pipes are connected in sequence and a part of the plurality of cooling pipes is bent.

On the other hand, as shown in fig. 4, the refrigerator, particularly the inverter 7, may further include: a base 500; and at least one heat radiating fan 600 installed at the base 500. At least one heat dissipation fan 600 may be disposed at the base 500 in a manner to face the IGBT 100.

The heat sink 200 may be placed on the base 500 and may be supported by the base 500. An avoidance groove portion 209 may be formed at a portion of the outer circumference of the heat sink 200, and the avoidance groove portion 209 serves to define avoidance of the heat dissipation fan 600.

A part of the heat dissipation fan 600 may be disposed so as to be accommodated in the avoidance groove 209. The heat radiation fan 600 may face the avoidance groove portion 209 and the IGBT100, respectively. A portion of the lower portion of the heat dissipation fan 600 may face the heat sink 200, particularly the avoidance groove portion 209, in the horizontal direction.

The heat dissipation fan 600 may be a box-shaped fan having an overall shape of a hexahedron, and the heat dissipation fan 600 may include a fan housing 604 formed with a hollow 602. The heat dissipation fan 600 may include: a fan blade (not shown) rotatably provided in the hollow portion 602; and a motor (not shown) attached to the fan housing 604 and connected to the fan.

A part of the lower portion of the fan housing 604 may face the avoidance groove portion 209 of the heat dissipation fan 600 in the horizontal direction, and all or most of the hollow portion 602 may face the IGBT 110.

As described above, if a part of the heat dissipation fan 600 is located in the avoidance groove 209, the entire inverter module 100 can be made more compact as compared with the case where the avoidance groove 209 is not formed in the heat sink 200 and the heat dissipation fan 600 is disposed in the heat sink 200.

On the other hand, condensed water may be generated on the surface of the heat sink 200, but since the height of the IGBT110 and the diode 120 is higher than the height of the heat sink 200, it is possible to minimize electric leakage or electric shock that may occur when the condensed water generated on the surface of the heat sink 200 drops to the IGBT110 and the diode 120.

The above description is only for illustrating the technical idea of the present invention by way of example, and various modifications and variations can be made by those skilled in the art to which the present invention pertains within a scope not departing from the essential characteristics of the present invention.

Therefore, the embodiments disclosed in the present invention are not intended to limit the technical ideas of the present invention, but to describe the technical ideas of the present invention, and the scope of the technical ideas of the present invention is not limited by the embodiments.

The scope of the invention should be construed by claims, and all technical ideas within the range equivalent to the claims should be construed to be included in the scope of the invention.

Claims

1. A freezer, comprising:

a compressor for compressing a refrigerant; and

an inverter module for controlling the compressor,

the frequency converter module includes:

a radiator formed with a cooling flow path through which a coolant passes;

a coolant inlet connected to the radiator so as to communicate with an inlet of the cooling flow path;

a coolant outlet connected to the radiator so as to communicate with an outlet of the cooling flow path;

at least one IGBT configured on the top surface of the radiator; and

at least one diode disposed on a top surface of the heat sink in a manner spaced apart from the IGBT,

the cooling flow path includes:

an IGBT cooling flow path closer to the coolant inlet among the coolant inlet and the coolant outlet; and

a diode cooling flow path closer to the coolant outlet among the coolant inlet and the coolant outlet,

the diode cooling flow path is located after the IGBT cooling flow path in a flow direction of the coolant.

2. The freezer according to claim 1,

the cooling flow path further includes a connection flow path that connects the IGBT cooling flow path and the diode cooling flow path.

3. The freezer according to claim 1,

the entire length of the IGBT cooling flow path is longer than the entire length of the diode cooling flow path.

4. The freezer according to claim 1,

the IGBT cooling flow path and the diode cooling flow path respectively include: a pair of parallel linear flow paths; and a return flow path connecting the pair of straight flow paths,

the distance between the pair of straight flow paths of the IGBT cooling flow path is greater than the distance between the pair of straight flow paths of the diode cooling flow path.

5. The freezer according to claim 1,

the coolant inlet and the coolant outlet each have a height that is lower than the height of each of the at least one IGBT and the at least one diode.

6. The freezer according to claim 1,

the coolant inlet and the coolant outlet are connected to an outer circumferential surface of the radiator.

7. The freezer according to claim 1,

the IGBT and the diode are respectively provided with a plurality of,

the top surface of the heat sink includes:

a first region in which the plurality of IGBTs are arranged;

a second region, wherein the plurality of diodes are configured in the second region; and

a third region between the first region and the second region, the IGBT and the diode not being disposed in the third region.

8. The freezer according to claim 7,

the first area is larger than the second area.

9. The freezer according to claim 1,

the radiator includes a single cooling plate having an outer peripheral surface connecting top and bottom surfaces of the cooling plate with a cooling flow path formed therebetween,

the cooling flow path is formed by a plurality of linear opening portions that are sequentially communicated in a flow direction of the coolant.

10. The freezer according to claim 9,

a part of the plurality of linear openings includes: one end located on the outer peripheral surface of the cooling plate; and the other end located inside the cooling plate,

the remaining linear openings of the plurality of linear openings intersect the pair of linear openings and have two ends located on the outer peripheral surface of the cooling plate.

11. The freezer according to claim 10,

the coolant inlet is connected to one end of one of the plurality of linear openings,

the coolant outlet is connected to one end of another of the plurality of linear opening portions,

the radiator further includes a plurality of covers for blocking one end of other linear opening portions of the plurality of linear opening portions, which are not connected to the coolant inlet and the coolant outlet.

12. The freezer according to claim 1, further comprising:

a base, on which the heat sink is placed; and

a heat dissipation fan disposed on the base in such a manner as to face the IGBT,

an avoidance groove portion for avoiding the heat radiation fan is formed in a part of the outer periphery of the heat radiator.

13. The freezer according to claim 12,

a part of the heat dissipation fan is positioned in the avoidance groove part,

the heat radiation fan faces the avoidance groove portion and the IGBT, respectively.

14. The freezer according to claim 13,

the heat dissipation fan includes a fan housing formed with a hollow,

the hollow portion faces the IGBT.

15. The freezer according to claim 14,

the lower portion of the fan housing faces the avoidance groove portion in the horizontal direction.