CN112424513B

CN112424513B - Multi-node multipurpose O-ring and method for making seal

Info

Publication number: CN112424513B
Application number: CN201980047438.6A
Authority: CN
Inventors: S·P·马赫什瓦里; 耀鸿·杨; 李王辉; 于安伟文; 阿尼鲁达·帕尔; 汤姆·K·乔; 廖建民
Original assignee: Applied Materials Inc
Current assignee: Applied Materials Inc
Priority date: 2018-07-19
Filing date: 2019-06-19
Publication date: 2023-05-23
Anticipated expiration: 2039-06-19
Also published as: CN112424513A; JP2021531653A; WO2020018226A1; JP7456993B2; TWI834688B; TW202007885A; US20200025292A1; KR20210024190A; US11359722B2

Abstract

A sealing member is provided that includes a plurality of nodes and a plurality of antinodes. Each sealing member may be rotated to expose undamaged leaves for sealing and prevent the sealing member from falling out of the leaf-like groove. A chamber is provided that includes a groove in which a sealing member is disposed. There is provided a method of rotating and positioning a sealing member, the method comprising the steps of: rotated to expose an undamaged portion of the sealing member.

Description

Multi-node multipurpose O-ring and method for making seal

Technical Field

Embodiments of the present invention relate to devices and methods, and more particularly, to multi-node, multi-purpose O-rings and methods for making seals.

Background

Integrated circuits have evolved into complex devices that include millions of transistors, capacitors, and resistors on a single chip. The development of chip designs continues to require faster circuitry and greater circuit density. As the demand for integrated circuits continues to grow, chip manufacturing demands have increased wafer throughput and greater throughput of semiconductor processing systems. To meet this throughput increase, systems are being developed to process larger diameter wafers, such as wafers having diameters of 300mm and greater.

A processing chamber, which is typically capable of processing a wafer, typically includes a semiconductor wafer support assembly including a puck (e.g., an electrostatic chuck (ESC)), a temperature-controlled base having a cooling plate and a heating electrode, and a support pedestal. Various other components (e.g., gas lines, wires, backside gas-guides, etc.) are also provided in the semiconductor wafer support assembly. During the manufacture of such semiconductor wafer support assemblies, many O-rings need to be disposed between the process chamber and the components in the support assembly to maintain a vacuum tight seal between the interior chamber environment and the external environment. The O-ring also prevents the deleterious plasma or chemical environment present in the chamber during processing from penetrating and corroding the wafer support assembly.

One disadvantage of conventional O-rings is that they undergo degradation and outgassing after repeated processing cycles in the chamber. Constant thermal cycling and/or chamber pressure cycling erodes the elastic properties of the O-ring. After prolonged use, the particles eventually begin to flake off the O-ring. Such flaking creates undesirable contaminants as they may drift onto the wafer during processing. These contaminants may then create shorts or voids in devices formed in the processed wafer, thereby degrading the quality of the wafer. While replacement of the O-ring is an essential part of the function of these semiconductor processing chambers, the harsh plasma and chemical environment to which the O-ring is exposed necessitates replacement of the O-ring, which creates significant costs to the consumer.

Thus, a durable and reusable O-ring is needed.

Disclosure of Invention

In one embodiment, a sealing apparatus for forming a seal between at least two separable components is provided that includes a closed loop body, a plurality of sealing nodes, and a plurality of sealing antinode (antinode). Each sealing antinode is positioned diametrically opposite a sealing node in a cross-section of the closed-loop body.

In another embodiment, a process chamber is provided that includes a first separable process chamber component having a sealing surface, a second separable process chamber component having a component surface, wherein the second separable process chamber component includes a channel formed in the component surface. The sealing apparatus includes a body, a plurality of sealing nodes, and a plurality of sealing antinodes. A portion of each of the sealing nodes has a surface configured to form a seal with at least one surface of each of the two separable processing chamber components.

In another embodiment, a method of forming a seal between a first separable component and a second separable component is provided, the method comprising the steps of: compressing a sealing device between the first separable component and the second separable component; separating the first separable component and the second separable component; and reorienting the sealing apparatus relative to the first separable component and then compressing the sealing apparatus. The sealing apparatus includes a body, a plurality of sealing nodes, and a plurality of sealing antinodes. A portion of at least one of the sealing node and the sealing antinode has a surface configured to form a seal with at least one surface of each of the two separable components when the sealing apparatus is compressed. The step of compressing the sealing apparatus causes the first node to form a first seal between the first sealing node and the surface of the first separable component and a second seal between the first sealing antinode and the surface of the second separable component. The step of compressing the sealing device after reorienting the sealing device causes the second sealing node to form a third seal between the second sealing node and the surface of the first separable component and a fourth seal between the second sealing antinode and the surface of the second separable component.

The O-ring described herein includes a plurality of sealing members, allowing the O-ring to seal in a plurality of positions. The O-ring has multiple portions that resist damage while protecting other portions of the O-ring. The O-ring is rotatable and reusable.

Drawings

A more particular description of the disclosure briefly summarized above, as well as the manner in which the above-described features of the disclosure may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of its scope, for other equivalent embodiments may admit to other equally effective embodiments.

FIG. 1A is a side cross-sectional view of a substrate processing chamber according to one embodiment.

FIG. 1B is a top view of a sealing apparatus and a groove disposed within a process chamber component according to one embodiment.

Fig. 2A is a side cross-sectional view of a sealing device in a groove according to one embodiment.

Fig. 2B is a side cross-sectional view of a sealing device in a trench after a processing plasma has been run, according to one embodiment.

Fig. 2C is a side cross-sectional view of the sealing device in the trench after the processing plasma has been run and the sealing device has been rotated, according to one embodiment.

Figure 2D is an isometric cross-sectional view of a groove according to one embodiment.

Fig. 2E is a side cross-sectional view of a sealing device in a groove with an exhaust according to one embodiment.

Fig. 3 is an isometric cross-sectional view of a sealing apparatus in a groove, showing different seal coloring areas, according to one embodiment.

Fig. 4A is a side cross-sectional view of a three seal node sealing apparatus in a groove according to one embodiment.

Fig. 4B is a side cross-sectional view of a five seal node sealing apparatus in a groove according to one embodiment.

Fig. 4C is a side cross-sectional view of a seven-seal node seal apparatus in a groove according to one embodiment.

FIG. 5 depicts a flow chart of a method of rotating a sealing device according to one embodiment.

Detailed Description

Embodiments of the present disclosure generally relate to sealing devices (e.g., O-rings) used to form seals between components of a process chamber. In some configurations, the sealing apparatus is disposed in a groove or recess (i.e., channel 105 in fig. 1) in at least one of the chamber components of the process chamber. Embodiments of the present disclosure will also generally include methods of reusing a sealing device that has reached its useful life at a first level relative to a groove or recess formed in the at least one chamber component. In some embodiments, the step of reusing the sealing device comprises the steps of: the sealing device is redirected relative to a groove or recess formed in the chamber component, such as by rotating the sealing device in the groove. Embodiments of the present disclosure are generally applicable to, but not limited to, multi-node O-rings that can be rotated and reused.

Fig. 1A is a side view of a process chamber 150 according to one embodiment. The process chamber 150 is disposed within the ambient environment 126. The substrate 50 is positioned on the base 135 and is exposed to a processing plasma 147 disposed in the processing region 125 of the processing chamber 150. The plasma 147 will include ions, neutrals, and radicals of the process gas disposed within the process region 125. Typical process gases may include inert gases or reactive gases (e.g., precursors, halogen-containing gases, ammonia-containing gases) used to perform a process on the substrate 50 or on one or more of the chamber components located in the process chamber 150. A vacuum pump 140 and a Radio Frequency (RF) power source 145 are connected to the process chamber 150. The exterior of the process chamber 150 includes at least two separable components that can be separated between plasma 147 generation cycles so that the O-ring 103 can be rotated or replaced. These separable components are generally referred to herein as a lower chamber component 101 and an upper chamber component 100. The channel 105 is formed in the lower chamber component 101, which is depicted in fig. 2 and discussed further below.

Fig. 1B is a top view of a sealing device disposed in a channel 105 formed in a surface 111 of the lower chamber component 101, according to one embodiment. For simplicity of the following description, the sealing device will be referred to as an O-ring 103. However, the use of the following term "O-ring" is not intended to limit the structural configuration of the sealing device that may be used within one or more of the embodiments of the disclosure provided herein, as the sealing device (e.g., O-ring) may have a cross-sectional shape that is non-circular in geometry (e.g., three leaf shapes as depicted in fig. 4A). According to some embodiments, the sealing device has a continuous body shape (e.g., collar shape) without a tip. The continuous body shape may be a closed loop shape, such as a circular loop, a triangular loop, or a rectangular loop. In some special cases, the sealing device has a discontinuous body shape (e.g. a linear strip with two ends). According to some embodiments, the O-ring 103 is typically made of an elastomeric or elastomeric polymeric material, such as natural or synthetic rubber, butyl rubber, perfluoroelastomer polymer, nitrile, silicone, teflon ^TM Polytetrafluoroethylene (PTFE), elastomers, or conductive polymers.

FIG. 5 illustrates a flow chart of a method 500 of extending the life of or reusing an O-ring 103, according to one embodiment. Although the method 500 operates in conjunction with fig. 2A-D and 5, one skilled in the art will appreciate that any system configured to perform the method steps in any order is within the scope of the embodiments described herein. The method 500 begins at operation 502, where the O-ring 103 is installed in a desired location. The O-ring 103 is compressed between the first separable component and the second separable component such that the first node of the O-ring forms a first seal between the first sealing node 201A and the surface of the first separable component and a second seal between the first sealing antinode 202B and the surface of the second separable component. For example, the first separable component may be the upper chamber component 100, the second separable component may be the lower chamber component 101, and the O-ring 103 may be installed in the channel 105 such that the sealing node 201A forms a seal with the upper chamber component 100 and the sealing antinode 202B forms a seal with the lower chamber component 101.

Fig. 2A is a side cross-sectional view of the O-ring 103 positioned within the channel 105 formed in the component surface 101A of the lower chamber component 101 of the process chamber 150 as described above in operation 502. The O-ring 103 generally includes a solid circular body 103A, a plurality of sealing nodes 201 (e.g., 201A, 201B, 201C) that form a leaf-like arrangement around the body 103A, and a plurality of sealing antinodes 202 (e.g., 202A, 202B, 202C). According to some embodiments, the number of sealing nodes 201 is an odd number and the number of sealing antinodes 202 is an odd number. The O-ring may also include one or more separation lines 204 disposed between one or more of the sealing nodes 201 and the sealing antinode 202. The sealing node 201 generally has a rounded and convex shape. The sealing antinode 202 generally has a rounded and concave shape and is formed at the three-way intersection of two separate sealing nodes 201 with the body 103A. The O-ring 103 is configured such that each sealing antinode 202 is located diametrically opposite to the sealing node 201, for example, sealing node 201A is diametrically opposite to sealing antinode 202B in fig. 2A. Each seal antinode 202 and seal node 201 extends along the entire length of O-ring 103 (not shown in fig. 2B).

Fig. 2D is an isometric cross-sectional view of a portion of the channel 105 formed in the lower chamber component 101, the portion including two indentations 205 and a nub 203, in accordance with one embodiment of the present disclosure.

As discussed above, the channel 105 is formed within the lower chamber component 101 and generally includes side walls 130 positioned near the surface 101A, at least two indentations 205, each indentation positioned near one of the side walls, which generally has a concave recess in the lower chamber component 101 deep enough that the sealing

nodes

201B, 201C may touch the bottom of the indentations 205 and so that the sealing node 201A may form a seal with the upper chamber component 100. The channel 105 also generally includes at least one sealing nub 203 having a sealing surface 203A that separates at least two indentations 205.

In one embodiment, the surface of the seal nub 203 is configured to form a seal with a seal antinode 202 of the O-ring 103, which is positioned opposite the seal node 201, the seal node 201 also forming a seal with the component surface 100A of the upper chamber component 100 during use. In some embodiments, a portion of two or more sealing nodes 201 are positioned on opposite sides of the O-ring relative to sealing nodes 201 forming a seal against surface 100A and each form a seal with surface 205A of channel 105. In most conventional O-ring arrangements (not shown), the O-ring forms a seal only with the opposite surface of the chamber; however, as described above, in some embodiments, the O-ring 103 is capable of forming a seal with not only the surface 100A of the upper chamber component 100 and the sealing surface 203A of the seal nub 203, but also the surface 205A of the channel 105 via

adjacent nodes

201B, 201C. The O-ring 103 forms a seal when it contacts different parts of the sealing device at the same time; some of these embodiments are listed above. The sealing node 201 of the O-ring 103 also helps prevent the O-ring 103 from falling out of the groove 230. Furthermore, the sealing node 201 allows an additional degree of freedom for the O-ring 103, thereby allowing the O-ring to withstand higher pressures without permanently deforming the O-ring than conventional O-rings without sealing nodes.

Due to the generally aggressive nature of the processing environment in the processing region 125 during normal operation, the processing chemistry excited by the plasma 147 will reach and erode the exposed face of the O-ring 103 as well as the exposed sealing face region 220A of the O-ring 103. The plasma 147 generally erodes and/or erodes the material of the O-ring 103, altering the mechanical properties of the O-ring material and reducing its sealing ability. Over time, the exposed sealing surfaces of the O-ring 103 erode to such an extent that the quality (e.g., vacuum level, contamination, particles) of the processing environment maintained in the processing region 125 deteriorates to such an extent that the O-ring is no longer able to maintain the desired processing environment parameters (e.g., pressure, leak rate, contamination, particles) to continue processing in the processing region 125. In most conventional O-ring arrangements (not shown), the only remedy is to replace the seal when the O-ring has reached the point where it forms a poor seal with the mating chamber component. However, as noted above, the O-ring 103 of the present disclosure that has reached its useful life in a first orientation relative to the channel 105 and the surface 100A may be reused after the O-ring has been reoriented relative to the channel 105 and the surface 100A.

Moreover, due to the configuration of the O-ring 103 and the groove 230 disclosed herein, the processing plasma 147 will erode only one of the sealing nodes 201A and possibly one of the sealing antinode 202A. The remaining

sealing nodes

201B, 201C and sealing

antinodes

202B, 202C are protected by their location within the channel 105. In configurations that include an odd number of sealing nodes 201, the sealing nodes 201 will form a seal against an opposing chamber component (e.g., upper chamber component 100), and the sealing antinode 202 will form a seal with the nub 203 directly across from the corresponding sealing node 201. A sealing member with an even number of nodes may trap indoor pressurized air in the area confined between the adjacent node and the surface 100A that may leak into the channel 105 when a high vacuum is achieved during chamber use, disrupting the high vacuum necessary for successful chamber operation and film growth. The O-ring 103 having an odd number of sealing nodes 201 as described herein does not have a region that is confined between adjacent nodes and the surface 100A, as only one of the sealing nodes forms a seal with the surface 100A.

At operation 504, a plasma 147 is generated that undesirably etches the O-ring 103 such that the O-ring no longer maintains the desired processing environment. Fig. 2B depicts the exposed sealing surface area 220A of the O-ring 103 after one or more of the processing regions 125 of the processing chamber as described above in operation 504. As shown in fig. 2A, the exposed sealing surface region 220A has become damaged due to the composition of the plasma 147 being exposed to for an extended period of time such that the O-ring 103 is no longer able to maintain the desired processing environment. In general, the damaged portion of the sealing surface region 220A will include physical changes (e.g., forming pits or holes in the surface of the O-ring 103) and/or changes in material properties within the material of the O-ring 103 (e.g., mechanical properties of the material such as hardness, percent elongation, compression set, crystallinity, monomer chain length). At this time, it may be necessary to remove and dispose of the conventional sealing member from the chamber due to damage of the sealing member by the plasma 147. However, due to the configuration of the O-ring 103 and groove 230 disclosed herein, the O-ring 103 may be rotated such that a new exposed sealing surface area 220B may be exposed and the plasma 147 may again run with the same O-ring 103. The reusability of the O-ring 103 disclosed herein reduces the cost to the customer and reduces the time spent replacing and disposing of the sealing members present in the prior art. The O-ring 103 may be used a number of times up to the number of sealing nodes 201 and may thus be rotated and placed a smaller number of times than the number of sealing nodes 201.

At operation 505, the first process chamber component and the second process chamber component are separated. This allows access and manipulation of the O-ring 103 during the operation being performed. For example, the upper chamber component 100 is separated from the lower chamber component 101 such that the O-ring 103 is accessible.

At operation 506, the O-ring 103 is raised out of the previous position. For example, the O-ring 103 may be lifted out of the channel 105.

At operation 508, the O-ring 103 is redirected to position the intact sealing node 201B for reinsertion into that location. For example, the O-ring 103 may be rotated. In the case of an O-ring 103 comprising three sealing nodes 201 and three anti-nodes 202, the O-ring 103 will rotate 120 ° from the first orientation to the second orientation in this operation. Generally, for an O-ring 103 that includes a number of sealing nodes 201 and sealing antinodes 202, the O-ring 103 will be rotated 360 ° from the first orientation to the second orientation in this operation divided by the number N (e.g., 360 °/N) of sealing nodes 201 and sealing antinodes 202.

At operation 510, after the O-ring has been redirected in operation 508, the O-ring 103 is reinstalled in the desired position. The O-ring 103 is compressed between the first separable component and the second separable component such that the first node of the O-ring forms a first seal between the second sealing node 201B and the surface of the first separable component and a second seal between the second sealing antinode 202C and the surface of the second separable component. For example, the first separable component may be the upper chamber component 100, the second separable component may be the lower chamber component 101, and the O-ring 103 may be installed in the channel 105 such that the sealing node 201B forms a seal with the upper chamber component 100 and the sealing antinode 202C forms a seal with the lower chamber component 101.

Fig. 2C depicts the O-ring 103 after removal in operation 506, rotation in operation 508, and installation in operation 510 such that the exposed sealing surface region 220A is disposed within the groove 230 as described above. The new exposed sealing surface 220B has not been exposed to the plasma 147 and thus the O-ring 103 is available for further processing in the processing region 125. In this configuration, the quality of the processing environment in the processing region 125 will be reestablished due to the original nature of the portions of the new exposed sealing surfaces 220B and 202C of the node 201B that are in contact with the sealing module 203.

The process operations seen in method 500 may then be repeated multiple times until the O-ring 103 reaches its lifetime. In some embodiments, the method 500 is repeated until all exposed sealing portions of all sealing nodes 201 have been at least oriented and positioned to form a seal with the upper chamber component 100. In one embodiment, operations 502-510 are repeated continuously less than the number of sealing nodes 201 and/or sealing antinodes 202.

Fig. 2E is a side cross-sectional view of an O-ring 103 in a groove 230 with an exhaust 250 according to one embodiment. In this embodiment, there is no sealing nub 203 and an exhaust 250 is provided between two of the sealing

nodes

201B, 201C. The venting device 250 allows for a reduction of the pressure in the area between the sealing

nodes

201B, 201C (the pressure indicated by P in fig. 2E). In order to form a strong seal with the groove 230, the O-ring 103 must be pushed against the sides of the groove. Reducing the pressure P between the sealing

nodes

201B, 201C reduces the contact pressure on the O-ring 103, thus allowing the O-ring to seal to a higher pressure differential.

Figure 3 is an isometric cross-sectional view of one embodiment of an O-ring 103 disposed in a channel 105. In some embodiments, as depicted in fig. 3, the O-ring 103 includes multiple regions each provided with a color. In some cases, each of the plurality of regions may be defined as a non-overlapping region disposed between tips of adjacent sealing nodes 201. In one configuration of the O-ring 103, the color of the region 300 spanning from the top of one sealing node 201A to the next adjacent sealing node 201B and surrounding the entire sealing antinode 202A is different from the other similarly defined

regions

301, 302 of the O-ring 103. In one embodiment, the region 301 including the surface of the O-ring 103 disposed between the top of one sealing node 201B to the next adjacent sealing node 201C and the sealing antinode 202B includes a different color than that seen in the region 300 of the O-ring 103.

In another embodiment, the area 302 including the surface of the O-ring 103 and the seal antinode 202C disposed between the top of one seal node 201C to the next adjacent seal node 201A includes a different color than the color seen in the area 300 and the area 301 of the O-ring 103. The differently colored

areas

300, 301, 302 make it easy to determine: 1) The orientation of the O-ring 103 in the channel 105; 2) Whether the O-ring 103 is twisted within the channel 105; and 3) the life of the O-ring 103, and how many times the O-ring can be rotated without replacement. When the plasma 147 damages the region 300, the O-ring 103 may be lifted out of the channel 105, rotated, and positioned such that the undamaged region 301 is in a position where the region 300 was in the channel 105, as described in the method 500. When region 300 experiences sufficient damage from plasma 147 such that O-ring 103 is no longer able to maintain the desired processing environment, O-ring 103 may be designed such that the damage created in the material will cause the color to change due to the change in molecular structure of the O-ring 103 material. In this case, the change in color of the damaged area of the O-ring 103 can be compared with the non-corroded portion of the O-ring 103, which has the original basic color of the O-ring 103. This is another indication to the user that: the orientation of the O-ring 103 will need to be rotated and a new undamaged zone 301 will need to be exposed to maintain the desired processing environment.

In some sealing device forming processes, the color of each of the surfaces of the O-ring 103 is created by adding one or more pigments to a portion of a resin or precursor formulation used to form the material forming the O-ring 103. In another forming process, an organic solvent having a colored pigment dispersed therein is delivered to the

areas

300, 301, 302 to be colored to form a colored coating. In some configurations, a pigment-containing solvent is used to modify the

regions

300, 301, 302 that are to contain the desired color. In some configurations, the body 103A of the O-ring 103 includes a polymeric material, and at least a portion of the polymeric material disposed on a surface of the body includes a pigment added to the polymeric material to alter the color of the uncolored material.

Fig. 4A is a cross-sectional view of an O-ring 103 having three sealing nodes 201 and three sealing antinodes 202 disposed in a channel 105 according to one embodiment. The channel 105 has a nub 203 and two impressions 205. During use within the process chamber 150, the sealing node 201A forms a seal against the surface 100A of the upper chamber component 100. The surface 203A of the seal nub 203 is configured to form a seal with a seal antinode 202A of the O-ring 103, which is positioned opposite the seal node 201A, the seal node 201A forming a seal with the surface 100A of the upper chamber component 100. A portion of the other two sealing

nodes

201B, 201C that is positioned on opposite sides of the O-ring 103 relative to the sealing node 201A that forms a seal against the surface 100A is positioned to each also form a seal with the

surfaces

205A, 205B of the channel 105. According to one embodiment, a portion of at least one of the sealing nodes 201 has a surface configured to form a seal with at least one surface of one of the two separable components when the O-ring 103 is disposed within the channel 105, and the two separable components are positioned to simultaneously contact different portions of the O-ring.

Fig. 4B is a cross-sectional view of an O-ring 400 having five sealing nodes 401 and five sealing antinodes 402, positioned within the channel 105, according to one embodiment. The nub 203 is sealed with a sealing antinode 402 and the upper chamber component 100 is sealed with a sealing node 401. In one example, the sealing node 401A forms a seal against the surface 100A of the upper chamber component 100 during use within the process chamber. The surface 203A of the seal nub 203 is configured to form a seal with a seal antinode 402A of the O-ring 400, which is positioned opposite the seal node 401A, the seal node 401A forming a seal with the surface 100A of the upper chamber component 100. A portion of the other two sealing

nodes

401B, 401C that is positioned on the opposite side of the O-ring 400 from the sealing node 401A that forms a seal against the surface 100A forms a seal with the

surfaces

205A, 205B of the channel 105.

Fig. 4C is a cross-sectional view of an O-ring 404 having seven sealing nodes 411 and seven sealing antinodes 412, positioned in channel 105, according to one embodiment. The nub 203 is sealed with a sealing antinode 412 and the upper chamber component 100 is sealed with a sealing node 411. During use within the process chamber, the sealing node 411A forms a seal against the surface 100A of the upper chamber component 100. The surface 203A of the seal nub 203 is configured to form a seal with a seal antinode 412A of the O-ring 404, which is positioned opposite the seal node 401A, the seal node 401A forming a seal with the surface 100A of the upper chamber component 100. A portion of the other two sealing

nodes

411B, 411C that is positioned on the opposite side of the O-ring from the sealing node 411A that forms the seal against the surface 100A forms a seal with the

surfaces

205A, 205B of the channel 105.

As shown above, O-ring 103 includes a plurality of nodes 201 and a plurality of antinodes 220. The O-ring 103 is sealed at the upper chamber part 100 via at least the node 201 and at the lower chamber part 101 via at least the antinode 220. During use of the process chamber 150, a portion of the O-ring 103 may be damaged and thus the O-ring is rotated such that the undamaged portion of the O-ring is further exposed to the processing environment.

The O-ring 103 is reusable, thereby reducing the cost to the user. Furthermore, the O-ring 103 may have a colored portion, so that it is easy to see if the O-ring has been properly seated in the channel 105, and also whether the O-ring is undamaged or if it is necessary to rotate the O-ring.

While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A processing chamber, comprising:

a first separable processing chamber component having a sealing surface;

a second separable processing chamber component having a component surface, wherein the second separable processing chamber component comprises a channel formed in the component surface, wherein the channel comprises a seal nub separating at least two indentations; and

a sealing apparatus comprising:

a main body;

a plurality of sealing nodes; and

a plurality of sealing antinodes, wherein a portion of each of the sealing nodes has a surface configured to form a seal with at least one surface of each of the first and second separable processing chamber components.

2. The processing chamber of claim 1, wherein the sealing device comprises an elastomeric material.

3. The process chamber of claim 1, wherein the body is formed with a collar shape.

4. The process chamber of claim 1, wherein the body comprises a polymeric material and at least a portion of the polymeric material disposed on a surface of the sealing device comprises a pigment added to alter a color of uncolored material used to form the body.

5. The processing chamber of claim 1, wherein a portion of at least one of the sealing nodes has a surface configured to form a seal with at least one surface of one of the first and second separable components when the sealing device is disposed within the channel, and the first and second separable components are positioned to simultaneously contact different portions of the sealing device.

6. The processing chamber of claim 1, wherein a portion of a surface of a first seal node of the plurality of seal nodes and a portion of a surface of a first seal antinode of the plurality of seal antinodes each comprise a first color, wherein the first color is different from a second color seen on a portion of a surface of a second seal node of the plurality of seal nodes and a portion of a surface of a second seal antinode of the plurality of seal antinodes.

7. The processing chamber of claim 1, wherein a number of seal nodes in the plurality of seal nodes is an odd number and a number of seal antinodes in the plurality of seal antinodes is an odd number.

8. The processing chamber of claim 7, wherein there are three sealing nodes and three sealing antinodes.

9. The process chamber of claim 7, wherein the body is a closed loop body, wherein each sealing antinode is positioned diametrically opposite a sealing node in a cross section of the closed loop body.

10. The processing chamber of claim 1, wherein a surface of the sealing nub of the channel is configured to form a seal with a surface of the plurality of sealing antinodes.

11. The processing chamber of claim 1, wherein surfaces of at least two indentations of the channel are configured to form a seal with surfaces of the plurality of sealing nodes.

12. A method of forming a seal between a first separable component and a second separable component, the method comprising the steps of:

compressing a sealing device between the first separable component and the second separable component, wherein

The sealing apparatus includes a body, a plurality of sealing nodes, and a plurality of sealing antinodes, and a portion of at least one of the sealing nodes and sealing antinodes has a surface configured to form a seal with at least one surface of each of the first and second separable components when the sealing apparatus is compressed, an

Compressing the sealing apparatus such that the first node forms a first seal between the first sealing node and a surface of the first separable component and a second seal between the first sealing antinode and a surface of the second separable component;

separating the first separable component and the second separable component; and

reorienting the sealing apparatus relative to the first separable component and then compressing the sealing apparatus, wherein the step of compressing the sealing apparatus after reorienting the sealing apparatus causes a second sealing node to form a third seal between the second sealing node and the surface of the first separable component and a fourth seal between a second sealing antinode and the surface of the second separable component.

13. The method of claim 12, wherein the body is formed with a collar shape and a first portion of an outer surface of the sealing device comprises a first color that is different from a second color seen on a second portion of the outer surface of the sealing device.

14. The method of claim 12, wherein the body has an odd number of sealing nodes and sealing antinodes.

15. The method of claim 14, wherein the body has three sealing nodes and three sealing antinodes.