CN112423474A - Preparation method of circuit board and circuit board - Google Patents
Preparation method of circuit board and circuit board Download PDFInfo
- Publication number
- CN112423474A CN112423474A CN201910787713.XA CN201910787713A CN112423474A CN 112423474 A CN112423474 A CN 112423474A CN 201910787713 A CN201910787713 A CN 201910787713A CN 112423474 A CN112423474 A CN 112423474A
- Authority
- CN
- China
- Prior art keywords
- substrate
- circuit board
- hole
- ground
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title abstract description 5
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 6
- 238000005553 drilling Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A circuit board is applied to the technical field of electronic circuits and comprises: the circuit board comprises a substrate and circuits arranged on two sides of the substrate, wherein through holes are formed in the substrate, and the resonance frequency of the substrate is improved. The invention also discloses a preparation method of the circuit board, the circuits on the two sides of the substrate are connected through the through holes, specifically, the circuits on the two sides of the substrate can be connected through the through holes, the circuit board is connected with the signal lines of the chip by using the conducting wires, the circuit board can also pass through the through holes, the chip is connected with the ground of the circuit board by using the conducting wires, when the other side of the hole is made of a material communicated with the ground, the ground of the circuit on the substrate and the ground on the other side of the through hole can be connected by using the conducting wires, and therefore, the grounding of the circuit is improved.
Description
Technical Field
The invention relates to the technical field of electronic circuits, in particular to a preparation method of a circuit board and the circuit board.
Background
In the field of electronic circuits, in particular superconducting quantum circuits, there are high demands on the high-frequency properties of the circuits. The main point is that the low frequency interference frequency needs to be reduced, and the good grounding is needed for all the lines. In the manufacture of the conventional superconducting quantum processor chip, as the number of bits increases, the circuit becomes more complex, and the required chip size becomes larger. This brings about two problems, one is that an increase in the size of the substrate lowers the resonance frequency of the substrate; secondly, the complexity of the line is increased, so that the ground plane is divided more finely, the frequency spectrum noise of the line is increased, and the better connectivity of the ground line is needed; meanwhile, the number of electrodes is increased, the number of pins is also increased, and the connection of the pins of the circuit needs to be optimally designed. How to reduce these noises and improve the connectivity of the line. Is an urgent problem to be solved in the design of superconducting quantum processors.
Disclosure of Invention
The invention mainly aims to provide a preparation method of a circuit board and the circuit board, which can improve the resonance frequency of a substrate, improve the grounding of a circuit and effectively improve the performance of a device.
In order to achieve the above object, a first aspect of embodiments of the present invention provides a method for manufacturing a circuit board, including:
further, the number of the through holes is at least one.
Further, the positions of the through holes are reserved when the circuit on the substrate is designed.
Further, on the base plate, it includes to carry out the through-hole from the side that coats the protection glue and set up:
and (3) drilling by using laser, and forming a through hole on the substrate from the side coated with the protective adhesive.
Further, the material of the substrate is silicon or sapphire.
Further, the air conditioner is provided with a fan,
a second aspect of the embodiments of the present invention provides a circuit board, including a substrate and circuits disposed on two sides of the substrate, where a through hole is formed in the substrate, and the circuits on two sides of the substrate are connected through the through hole.
Further, the number of the through holes is at least one.
According to the circuit board and the manufacturing method thereof, the through hole is formed in the substrate, so that the resonance frequency of the substrate is improved, and the circuits on the two sides of the substrate are connected through the through hole. Specifically, the connection of the circuit on the two sides of the substrate through the through hole can be realized by connecting the signal lines of the circuit board and the chip through the through hole by using a wire, and can also pass through the through hole, connecting the chip with the ground of the circuit board by using the wire, and connecting the ground of the circuit on the substrate with the ground on the other side of the through hole through the wire when the other side of the hole is a material communicated with the ground, so that the grounding of the circuit is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a circuit board according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a circuit board according to another embodiment of the present invention.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic flow chart of a method for manufacturing a circuit board according to an embodiment of the present invention, the method mainly includes the following steps:
s101, coating protective glue on a circuit on a substrate;
further, the material of the substrate is silicon or sapphire.
The line may operate below 20 millikelvin degrees.
S102, opening a through hole on the substrate from one side coated with the protective adhesive;
the laser drilling technology can be utilized, the through hole is formed in one side coated with the protective glue, and the laser tracks are all the same round line in the laser drilling process so as to ensure that the drilling can be successful.
S103, removing the protective glue on the circuit.
The signal lines of the circuit board and the chip can be connected by the through holes by using the wires, the chip can be connected with the ground of the circuit board by using the wires to penetrate through the through holes, and when the other side of the hole is made of a material communicated with the ground, the ground of the circuit on the substrate and the ground of the other side of the hole can be connected by using the wires, so that the grounding of the circuit is improved.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a circuit board according to another embodiment of the present invention, the circuit board includes a substrate 1 and circuits (not shown) disposed on two sides of the substrate 1, and is characterized in that a through hole 2 is formed on the substrate 1, and the circuits on two sides of the substrate 1 are connected through the through hole 2.
Specifically, the circuits on the two sides of the substrate 1 are connected through a through hole, as shown in fig. 2, the circuit board and the signal line of the chip are connected through the through hole by using a wire 3; the chip can be connected with the ground of the circuit board by a lead wire through the through hole; when the other side of the hole is a material communicating with the ground, the ground of the line on the substrate and the ground of the other side of the through hole can be connected by a wire, thereby improving the grounding of the line.
Further, the number of the through holes is at least one.
Further, the positions of the through holes are reserved when the circuit on the substrate is designed.
In the embodiment of the invention, the through hole is formed on the substrate to improve the resonance frequency of the substrate, and the circuits on two sides of the substrate are connected through the through hole. Specifically, the connection of the circuit on the two sides of the substrate through the through hole can be realized by connecting the signal lines of the circuit board and the chip through the through hole by using a wire, and can also pass through the through hole, connecting the chip with the ground of the circuit board by using the wire, and connecting the ground of the circuit on the substrate with the ground on the other side of the through hole through the wire when the other side of the hole is a material communicated with the ground, so that the grounding of the circuit is improved.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the above description, for a person skilled in the art, there are variations on the specific implementation and application scope according to the ideas of the embodiments of the present invention, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (7)
1. A method for manufacturing a circuit board, comprising:
coating protective glue on the circuit on the substrate;
forming a through hole on the substrate from one side coated with the protective adhesive;
and removing the protective glue on the circuit.
2. The method of manufacturing a circuit board according to claim 1, wherein the number of the through holes is at least one.
3. The method of manufacturing a circuit board according to claim 1, wherein a position of the through hole is reserved in designing a wiring on the substrate.
4. The method for manufacturing a circuit board according to claim 1, wherein the forming of the through hole on the substrate from the side coated with the protective paste includes:
and (3) drilling by using laser, and forming a through hole on the substrate from the side coated with the protective adhesive.
5. The method for manufacturing a circuit board according to claim 1, wherein the substrate is made of silicon or sapphire.
6. The circuit board comprises a substrate and circuits arranged on two sides of the substrate, and is characterized in that a through hole is formed in the substrate, and the circuits on two sides of the substrate are connected through the through hole.
7. The circuit board of claim 1, wherein the number of vias is at least one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910787713.XA CN112423474A (en) | 2019-08-23 | 2019-08-23 | Preparation method of circuit board and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910787713.XA CN112423474A (en) | 2019-08-23 | 2019-08-23 | Preparation method of circuit board and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112423474A true CN112423474A (en) | 2021-02-26 |
Family
ID=74779077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910787713.XA Pending CN112423474A (en) | 2019-08-23 | 2019-08-23 | Preparation method of circuit board and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112423474A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6635400B2 (en) * | 2000-04-17 | 2003-10-21 | Shin-Etsu Chemical Co., Ltd. | Resist composition and patterning process |
| US6881677B1 (en) * | 2004-03-17 | 2005-04-19 | Lexmark International, Inc. | Method for making a micro-fluid ejection device |
| WO2011043537A2 (en) * | 2009-10-08 | 2011-04-14 | Lg Innotek Co., Ltd. | Printed circuit board and manufacturing method thereof |
| CN104219871A (en) * | 2013-06-05 | 2014-12-17 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN205566796U (en) * | 2016-04-01 | 2016-09-07 | 房晓鹏 | Printed circuit board convenient to patch element wiring |
| CN105957832A (en) * | 2016-05-12 | 2016-09-21 | 中国科学院物理研究所 | Wiring method of superconducting quantum bit system for surface coding scheme and wiring board |
-
2019
- 2019-08-23 CN CN201910787713.XA patent/CN112423474A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6635400B2 (en) * | 2000-04-17 | 2003-10-21 | Shin-Etsu Chemical Co., Ltd. | Resist composition and patterning process |
| US6881677B1 (en) * | 2004-03-17 | 2005-04-19 | Lexmark International, Inc. | Method for making a micro-fluid ejection device |
| WO2011043537A2 (en) * | 2009-10-08 | 2011-04-14 | Lg Innotek Co., Ltd. | Printed circuit board and manufacturing method thereof |
| CN104219871A (en) * | 2013-06-05 | 2014-12-17 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN205566796U (en) * | 2016-04-01 | 2016-09-07 | 房晓鹏 | Printed circuit board convenient to patch element wiring |
| CN105957832A (en) * | 2016-05-12 | 2016-09-21 | 中国科学院物理研究所 | Wiring method of superconducting quantum bit system for surface coding scheme and wiring board |
Non-Patent Citations (1)
| Title |
|---|
| 雷仕湛 等: "《激光智能制造技术》", 30 June 2018 * |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210226 |