CN112420616A - Ultrasonic biological identification module, preparation method thereof and electronic equipment - Google Patents

Ultrasonic biological identification module, preparation method thereof and electronic equipment Download PDF

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Publication number
CN112420616A
CN112420616A CN201910783514.1A CN201910783514A CN112420616A CN 112420616 A CN112420616 A CN 112420616A CN 201910783514 A CN201910783514 A CN 201910783514A CN 112420616 A CN112420616 A CN 112420616A
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layer
ink layer
ink
mounting surface
ultrasonic
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李萍
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Nanchang OFilm Biometric Identification Technology Co Ltd
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Nanchang OFilm Biometric Identification Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs

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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

The invention relates to an ultrasonic biological identification module, a preparation method thereof and electronic equipment. The preparation method of the ultrasonic biological identification module comprises the following steps: providing a thin film transistor array substrate, wherein the thin film transistor array substrate is provided with a mounting surface, and the mounting surface is provided with a mounting area and a binding area which are spaced; arranging an ink layer on the mounting surface, completely shielding the binding area, exposing the mounting area, forming a piezoelectric layer in the mounting area of the mounting surface, wherein the ink layer is made of water-soluble ink; removing the ink layer; forming a conductive layer on the side of the piezoelectric layer far away from the mounting surface; and forming an acoustic matching layer on one side of the conductive layer, which is far away from the piezoelectric layer, so as to obtain the ultrasonic biological identification module. The ultrasonic biological identification module with high yield can be obtained by the preparation method.

Description

Ultrasonic biological identification module, preparation method thereof and electronic equipment
Technical Field
The invention relates to the technical field of biological identification, in particular to an ultrasonic biological identification module, a preparation method thereof and electronic equipment.
Background
The ultrasonic biometric identification technology is a technology capable of scanning and analyzing an organism by ultrasonic waves. In general, an ultrasonic biometric module is obtained by forming a piezoelectric layer, a conductive layer, and an acoustic matching layer, which are sequentially stacked, on a TFT (Thin Film Transistor) substrate. However, the yield of the ultrasonic biological identification module prepared by the existing process is low, and the actual requirement cannot be met.
Disclosure of Invention
Accordingly, it is desirable to provide an ultrasound biometric module with high yield and a method for manufacturing the same.
In addition, an electronic device is also provided.
A preparation method of an ultrasonic biological identification module comprises the following steps:
providing a thin film transistor array substrate, wherein the thin film transistor array substrate is provided with a mounting surface, and the mounting surface is provided with a mounting area and a binding area which are spaced;
arranging an ink layer on the mounting surface, wherein the ink layer completely shields the binding region and exposes the mounting region, and a piezoelectric layer is formed in the mounting region of the mounting surface, wherein the ink layer is made of water-soluble ink;
removing the ink layer;
forming a conductive layer on one side of the piezoelectric layer far away from the mounting surface; and
and forming an acoustic matching layer on one side of the conductive layer, which is far away from the piezoelectric layer, so as to obtain the ultrasonic biological identification module.
Since the distance between the area on the TFT substrate where the piezoelectric layer is formed and the Bonding area is small (generally 170 μm), the piezoelectric layer is prone to overflow glue to the Bonding area, so that the Bonding area has an insulating substance to affect the Bonding effect, thereby affecting the yield of the ultrasonic biometric module. In the preparation method of the ultrasonic biological identification module, the ink layer is arranged on the mounting surface of the thin film transistor array substrate, the material of the ink layer is water-soluble ink, the ink layer completely shields the binding region and exposes the mounting region, the piezoelectric layer is formed in the mounting region of the mounting surface, the ink layer is removed, the ink layer can be removed in a washing mode and the like, the overflow glue of the piezoelectric layer in the binding region is removed together, basically, the overflow glue cannot be remained on the thin film transistor array substrate, the binding effect can be prevented from being influenced by the overflow glue of the piezoelectric layer (namely, the overflow of the material of the piezoelectric layer) to the binding region, the binding yield is improved, and the ultrasonic biological identification module with.
In one embodiment, the thickness of the ink layer is 10 μm to 15 μm. By the arrangement, the overflow glue of the piezoelectric layer in the binding area can be removed along with the ink layer, the ink layer can be easily removed, and the yield of the ultrasonic biological identification module is improved.
In one embodiment, the mounting area and the binding area have a gap therebetween, and the ink layer at least partially covers the gap. The setting can better protect the binding area so as to improve the yield of the ultrasonic biological identification module.
In one embodiment, the distance between the mounting area and the binding area is defined as D1, the distance between the edge of the ink layer close to the side of the mounting area and the edge of the binding area close to the side of the mounting area is defined as D2, and the ratio of D2 to D1 is 0-1: 3. This kind of setting can protect the bonding region better, and avoids the printing ink layer to spill over to the installation region and influence the setting of piezoelectric layer.
In one embodiment, the step of disposing an ink layer on the mounting surface comprises: and screen printing the water-soluble ink on the mounting surface, and curing at 90-130 ℃ to obtain the ink layer. The arrangement is favorable for quick curing of the water-soluble printing ink, and the adhesive force of the printing ink layer is improved, so that the separation in the process of forming the piezoelectric layer is avoided.
In one embodiment, the curing time is 5min to 10 min. The arrangement enables the water-soluble ink to be cured to obtain the ink layer with high adhesive force.
In one embodiment, in the step of screen printing the water-soluble ink on the mounting surface, the temperature of the water-soluble ink is 5 ℃ to 50 ℃. The arrangement is favorable for ensuring the physical and chemical properties of the water-soluble ink so that the formed ink layer is more uniform.
In one embodiment, in the step of removing the ink layer, the manner of removing the ink layer is water washing. The ink layer can be well removed through water washing, and the influences of chemical reagents on corrosion of the TFT and the piezoelectric layer and the like can be avoided.
In one embodiment, after the step of removing the ink layer, a step of drying the thin film transistor array substrate from which the ink layer is removed is further included. This kind of setting avoids remaining water to influence the performance of ultrasonic wave biological identification module, improves the yield of ultrasonic wave biological identification module.
An ultrasonic biological identification module is prepared by the preparation method of the ultrasonic biological identification module. The ultrasonic biological identification module is excellent in performance and high in yield.
An electronic device comprises the ultrasonic biological identification module. The electronic equipment with the arrangement has excellent performance and better biological identification performance.
Drawings
FIG. 1 is a schematic structural diagram of an ultrasound biometric identification module according to an embodiment;
FIG. 2 is a schematic structural diagram of a thin film transistor array substrate of the ultrasound biometric identification module shown in FIG. 1;
FIG. 3 is a schematic structural diagram of the TFT array substrate and the ink layer shown in FIG. 2;
FIG. 4 is a cross-sectional view of the ultrasound biometric identification module shown in FIG. 1 taken along line V-V.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As shown in fig. 1, the method for manufacturing the ultrasonic biometric module 100 according to one embodiment can manufacture the ultrasonic biometric module 100 with a high yield. Wherein, the ultrasonic biometric identification module 100 can be used for fingerprint identification. Specifically, the method for manufacturing the ultrasonic biometric identification module 100 includes the following steps S110 to S150:
referring to fig. 2, S110, a thin film transistor array substrate 110 is provided, in which the thin film transistor array substrate 110 has a mounting surface 112, and the mounting surface 112 has spaced mounting regions 112a and bonding regions 112 c.
The thin film transistor array substrate 110 is provided with a circuit capable of converting an electrical signal into an image signal, that is, a Thin Film Transistor (TFT) array for detecting an electrical signal at each position of the piezoelectric layer is provided on the thin film transistor array substrate 110. The bonding region 112c is used to connect the circuit board so that bonding, i.e., electrical connection between the tft array substrate 110 and the circuit board can be achieved through bonding. The mounting area 112a and the binding area 112c are defined to be spaced apart by a distance D1. In one embodiment, D1 is 150 μm to 1050 μm. Further, D1 was 170 μm. It should be noted that D1 is not limited to the above-mentioned range, and may be set as needed.
Referring to fig. 3 to 4, in S120, the ink layer 114 is disposed on the mounting surface 112, the ink layer 114 completely covers the bonding area 112c, the mounting area 112a is exposed, the piezoelectric layer 120 is formed in the mounting area 112a of the mounting surface 112, and the material of the ink layer 114 is water-soluble ink.
By arranging the ink layer 114 on the mounting surface 112 to enable the binding area 112c to be covered by the ink layer, in the subsequent process of forming the piezoelectric layer 120 in the mounting area 112a of the mounting surface 112, even if the piezoelectric layer material overflows into the binding area 112c, the binding area 112c is covered by the ink layer, so that the overflowing piezoelectric material is attached to the ink layer, and meanwhile, the water-soluble ink is used as the material of the ink layer 114, so that the subsequent ink layer 114 can be removed in a washing mode and the like, the piezoelectric material attached to the binding area 112c is removed together, finally, the piezoelectric material cannot remain in the binding area 112c, the binding effect can be prevented from being influenced by the fact that the piezoelectric layer 120 overflows to the binding area 112c (namely, the material forming the piezoelectric layer overflows), and the binding yield is improved. Specifically, the step of disposing the ink layer 114 on a partial region of the mounting surface 112, wherein the ink layer 114 completely covers the bonding region 112c, and the step of exposing the mounting region 112a includes: the ink layer 114 is disposed on a partial region of the mounting surface 112, and the ink layer 114 completely covers the bonding region 112c, and the ink layer 114 is not disposed on the mounting region 112a of the mounting surface 112.
In one embodiment, in the step of disposing the ink layer 114 on a partial region of the mounting surface 112, the thickness of the ink layer 114 is 10 μm to 15 μm. In some of these embodiments, the thickness of the ink layer 114 is 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, or 15 μm. The ink with such thickness can not only make the overflowing glue of the piezoelectric layer 120 in the binding region 112c not easily penetrate through the ink layer 114 and enter the binding region 112c, but also make the ink layer 114 not too thick and easy to remove, and the ink thickness range can improve the binding yield of the binding region 112c, so as to obtain the ultrasonic biological identification module 100 with higher yield.
In one embodiment, the ink layer 114 at least partially masks the gap between the mounting area 112a and the bonding area 112 c. This arrangement can better protect the bonding region 112c from the overflow of the piezoelectric layer 120, so as to improve the yield of the ultrasound biometric identification module 100. The distance between the edge of the ink layer 114 on the side close to the mounting area 112a and the edge of the bonding area 112c on the side close to the mounting area 112a is defined as D2, i.e., D2 represents the distance that the ink layer 114 overflows the edge of the bonding area 112 c. D2 is 50-350 μm.
In one embodiment, the ratio of D2 to D1 (i.e., the distance separating the mounting region 112a and the binding region 112 c) ranges from 0 to 1: 3. this arrangement can better protect the bonding region 112c and prevent the ink layer 114 from overflowing to the mounting region 112a to affect the arrangement of the piezoelectric layer 120.
The ink layer 114 is not limited to at least partially covering the gap between the mounting region 112a and the bonding region 112c, and the ink layer 114 may completely cover the bonding region 112c and expose the gap between the mounting region 112a, and the bonding region 112 c.
In one embodiment, the step of disposing the ink layer 114 on the partial region of the mounting surface 112 includes: and (3) screen-printing water-soluble ink on a partial area of the mounting surface 112, and curing at 90-130 ℃ to obtain the ink layer 114. This arrangement facilitates rapid curing of the water-soluble ink and improves the adhesion of the ink layer 114 to prevent the piezoelectric layer 120 from falling off during formation. Further, the curing time is 5min to 10 min. This arrangement can cure the water-soluble ink to obtain the ink layer 114 having high adhesion. Specifically, the adhesion of the ink layer 114 is not less than 4B.
In one embodiment, the step of screen printing the water-soluble ink on the mounting surface 112 includes a step of printing the water-soluble ink at a temperature of 5 to 50 ℃. This arrangement is advantageous in ensuring the physicochemical properties of the water-soluble ink so that the ink layer 114 is formed more uniformly. Further, the temperature of the water-soluble ink is 20 ℃ to 26 ℃.
Further, in the step of screen-printing the water-soluble ink on the partial area of the mounting surface 112, the ambient temperature is 5 to 50 ℃. Further, the relative humidity of the ambient temperature is below 90%. This arrangement ensures the printing effect. Specifically, in the screen printing process, in the step of screen printing the water-soluble ink in the partial region of the mounting surface 112, the ambient temperature is 5 to 50 ℃ in the step of screen printing the water-soluble ink in the partial region of the mounting surface 112. More specifically, the relative humidity of the ambient temperature is 40% to 70%.
Water-soluble inks are inks that are soluble in an aqueous environment (e.g., water). Further, the water-soluble ink also has a hydrophilic group. The hydrophilic group may be, for example, a hydroxyl group, a carboxyl group, an amino group, an aldehyde group, or the like. Specifically, the water-soluble ink was an electric-2050 water-washing type ink. The water-soluble ink is not limited to the electric-2050 water-washing type ink, and may be other ink that can be dissolved in a water-washing environment in a conventional manner.
The piezoelectric layer 120 is capable of emitting an ultrasonic wave and receiving a reflected wave of the ultrasonic wave, and converts the reflected wave into an electrical signal. Note that the piezoelectric layer 120 is formed on the mounting area 112a of the mounting surface 112 by a conventional process for preparing a piezoelectric layer. For example, it may be: the piezoelectric material is applied to the mounting area 112a of the mounting surface 112, and drying, crystallization, and polarization are sequentially performed to obtain the piezoelectric layer 120.
Further, piezoelectric materials are materials commonly used in the art to form piezoelectric layers. The piezoelectric material may comprise, for example, a ferroelectric polymer. Further, the ferroelectric polymer may be, for example, P (VDF-TrFE) (a copolymer of polyvinylidene chloride and trifluoroethylene). The ferroelectric polymer is not limited to the above-mentioned ones, and may be a homopolymer of polyvinylidene chloride, a copolymer of polyvinylidene chloride, a homopolymer of polytetrafluoroethylene, a copolymer of polytetrafluoroethylene, diisopropylamine bromide (DTPAB), polyvinylidene fluoride, or the like. It should be noted that the piezoelectric material is not limited to include the ferroelectric polymer, and may include a solvent. Examples of the solvent include methyl ethyl ketone, dimethylacetamide, and propylene glycol methyl ether acetate.
Specifically, the way of applying the piezoelectric material to the mounting region 112a of the mounting surface 112 is coating. The method of applying the piezoelectric material to the mounting region 112a of the mounting surface 112 is not limited to coating, and may be screen printing, spray coating, or the like.
The purpose of drying is to allow the piezoelectric material to form a piezoelectric green body layer to facilitate the formation of a denser piezoelectric layer 120 during subsequent crystallization. The drying process is a drying process that is conventional in the art, and may be, for example: drying for 0.5-2 h at 60-80 ℃.
The purpose of crystallization is to enable the piezoelectric green layer to form a dense piezoelectric layer 120, so as to obtain a piezoelectric layer 120 with better piezoelectric performance. The crystallization treatment is performed by a crystallization process that is conventional in the art, and may be, for example: preserving the heat for 3 to 6 hours at the temperature of between 135 and 145 ℃.
It is noted that the polarization treatment is performed by a polarization process which is conventional in the art, and may be, for example, corona discharge.
S130, removing the ink layer 114.
In one embodiment, the removal of the ink layer 114 is water washing. The ink layer 114 can be well removed through water washing, the influence of corrosion and the like of chemical reagents on the TFT and the piezoelectric layer 120 can be avoided, the cost can be reduced, and the toxic effect is avoided. Further, washing with water was performed at normal temperature. This arrangement allows the ink layer 114 to be dissolved more quickly, allowing the ink layer 114 to be removed more quickly and more thoroughly.
Specifically, the step of removing the ink layer 114 includes: ink layer 114 is wiped with a water-containing wiper to remove ink layer 114. The ink layer 114 is removed by wiping to avoid direct water spraying or soaking, which requires a long time for drying the tft array substrate 110 with the ink layer 114 removed. The wiping member may be, for example, a dust-free cloth or gauze. It should be noted that the ink layer 114 is not limited to be removed by wiping the ink layer 114 with a wiper containing water, and the ink layer 114 may be removed by washing the thin film transistor array substrate 110 on which the ink layer 114 is formed with water with an automatic washing machine.
In one embodiment, after the step of removing the ink layer 114, a step of drying the tft array substrate 110 with the ink layer 114 removed is further included. This arrangement prevents the residual water from affecting the performance of the ultrasonic biometric identification module 100, and improves the yield of the ultrasonic biometric identification module 100. Further, the drying mode is as follows: the surface of the tft array substrate 110 and the surface of the piezoelectric layer 120 are wiped by a dry and clean wiper. The wiping member may be, for example, a dust-free cloth or gauze.
S140, forming the conductive layer 130 on a side of the piezoelectric layer 120 away from the mounting surface 112.
It is noted that the conductive layer 130 is formed on a side of the piezoelectric layer 120 remote from the mounting surface 112 using conductive layer forming processes conventional in the art.
In one specific example, the conductive layer 130 is two layers. Two conductive layers 130 are sequentially stacked on the piezoelectric layer 120. The two conductive layers 130 are arranged to make the conductive performance more uniform, which is beneficial to the conduction of electric charges. Further, the material of the two conductive layers 130 is silver. The two conductive layers 130 are obtained by screen printing silver paste and sintering. The conductive layer 130 is not limited to two layers, and may be one layer or more than two layers.
S150, forming an acoustic matching layer 140 on the side of the conductive layer 130 away from the piezoelectric layer 120, thereby obtaining the ultrasonic biometric module 100.
The acoustic matching layer 140 can protect the conductive layer 130 and can reflect an ultrasonic signal. Further, the step of forming the acoustic matching layers 140 on the side of the conductive layer 130 away from the piezoelectric layer 120 includes: the acoustic matching layers 140 are attached to the side of the conductive layer 130 remote from the piezoelectric layer 120. Wherein the acoustic matching layer 140 is made of an acoustic matching material conventional in the art, and the acoustic matching layer 140 may be, for example, a solid adhesive film. It should be noted that the acoustic matching layer 140 is not limited to be a solid adhesive film, and may also be other films, for example, a Die Attach Film (DAF).
In the illustrated embodiment, the acoustic matching layers 140 are located on the conductive layer 130 remote from the piezoelectric layer 120.
The steps of S130, S140, and S150 are not limited, and S130, S140, and S150 may be performed in sequence, or S140, S150, and S130 may be performed in sequence, or S140, S130, and S150 may be performed in sequence. Can be set as required.
In one embodiment, after the step of forming the acoustic matching layers 140 on the side of the conductive layer 130 away from the piezoelectric layer 120, the method further comprises the steps of: a circuit board (not shown) is provided to electrically connect the thin film transistor array substrate 110 and the conductive layer 130. Further, the circuit board is bonded to the bonding region 112c of the thin film transistor array substrate 110 and to the conductive layer 130 near the piezoelectric layer 120. More specifically, the circuit board is a flexible circuit board.
Since the distance between the area on the TFT substrate where the piezoelectric layer is formed and the Bonding area is small (generally 170 μm), the piezoelectric layer is prone to overflow glue to the Bonding area, so that the Bonding area has an insulating substance to affect the Bonding effect, thereby affecting the yield of the ultrasonic biometric module. In the preparation method of the ultrasonic biological recognition module 100 according to the above embodiment, the ink layer 114 is disposed in a partial area of the mounting surface 112 of the thin film transistor array substrate 110, the material of the ink layer 114 is water-soluble ink, the ink layer 114 completely covers the bonding area 112c and exposes the mounting area 112a, the piezoelectric layer 120 is formed in the mounting area 112a of the mounting surface 112, and the ink layer 114 is removed, so that the ink layer 114 can be removed by water washing and the like, thereby removing the overflow glue of the piezoelectric layer 120 in the bonding area 112c, basically not remaining on the thin film transistor array substrate 110, avoiding the influence on the bonding effect caused by the overflow glue of the piezoelectric layer 120 to the bonding area 112c, improving the bonding yield of the bonding area 112c, and obtaining the ultrasonic biological recognition module 100 with a high bonding yield.
In the method for manufacturing the ultrasonic biological recognition module 100 according to the above embodiment, the ink layer 114 completely covers the bonding region 112c and exposes the mounting region 112a, so that the ink layer 114 does not affect the formation of the piezoelectric layer 120, for example, does not affect the drying, crystallization and polarization of the piezoelectric material. Further, the material of the ink layer 114 is water-soluble ink, so that the ink layer 114 can be removed by washing with water after the polarization treatment, no residue is left on the TFT, and the yield of the ultrasonic biometric identification module 100 is ensured. Moreover, the requirement on the screen printing precision of the water-soluble ink is low, and the screen printing precision and the coating precision of a screen printing machine can meet the coating requirement of the water-soluble ink.
In order to avoid the influence of the overflow glue of the piezoelectric layer to the bonding area on the yield of the bonded ultrasonic biological identification module, the coating precision of the conductive layer needs to be enhanced. The precision of the existing coating equipment is unstable and cannot meet the actual requirement. In the method for manufacturing the ultrasonic biological recognition module 100 according to the above embodiment, the ink layer 114 is disposed to prevent the bonding effect from being affected by the overflow of the piezoelectric layer 120 to the bonding region 112c, so that the requirement on the coating precision of the conductive layer 130 can be reduced, and the coating efficiency can be improved.
An electronic device according to an embodiment, such as a mobile phone or a computer, includes the ultrasonic biometric module 100 prepared by the method for preparing the ultrasonic biometric module 100 according to the above-described embodiment. The electronic equipment with the arrangement has excellent performance and better biological identification performance.
The following are specific examples.
In the following examples, the water-soluble ink was an electric-2050 water-washable ink unless otherwise specified.
Example 1
20 ultrasound biometric modules were prepared as follows. Specifically, the preparation process of the ultrasonic biological identification module is as follows:
and providing a thin film transistor array substrate, wherein the thin film transistor array substrate is provided with a mounting surface, the mounting surface is provided with a mounting area and a binding area which are spaced, and the spacing between the mounting area and the binding area is 150 mu m.
And (3) screen-printing water-soluble ink on the mounting surface at the temperature of 5 ℃ and the relative humidity of 40%, and curing for 5min at the temperature of 90 ℃ to obtain an ink layer, wherein the ink layer completely shields the binding area and exposes the mounting area. The distance between the edge of the ink layer on the side close to the mounting area and the edge of the binding area on the side close to the mounting area is 50 μm. The thickness of the ink layer was 10 μm. And then coating a piezoelectric material on the mounting area of the mounting surface, and sequentially drying, crystallizing and polarizing to obtain the piezoelectric layer.
Wiping with water-soaked dust-free cloth at normal temperature to remove the ink layer, and wiping with dry clean dust-free cloth.
A conductive layer is formed on a side of the piezoelectric layer remote from the mounting surface.
And forming an acoustic matching layer on one side of the conductive layer, which is far away from the piezoelectric layer, so as to obtain the ultrasonic biological identification module.
Example 2
20 ultrasound biometric modules were prepared as follows. Specifically, the preparation process of the ultrasonic biological identification module is as follows:
a thin film transistor array substrate is provided, the thin film transistor array substrate is provided with a mounting surface, the mounting surface is provided with a mounting area and a binding area which are spaced, and the spacing between the mounting area and the binding area is 1050 mu m.
And (3) screen-printing water-soluble ink on the mounting surface at 50 ℃ and relative humidity of 70%, and curing for 10min at 130 ℃ to obtain an ink layer, wherein the ink layer completely shields the binding area and exposes the mounting area. The distance between the edge of the ink layer on the side close to the mounting area and the edge of the binding area on the side close to the mounting area is 350 μm. The thickness of the ink layer was 15 μm. And then coating a piezoelectric material on the mounting area of the mounting surface, and sequentially drying, crystallizing and polarizing to obtain the piezoelectric layer.
Wiping with water-soaked dust-free cloth at normal temperature to remove the ink layer, and wiping with dry clean dust-free cloth.
A conductive layer is formed on a side of the piezoelectric layer remote from the mounting surface.
And forming an acoustic matching layer on one side of the conductive layer, which is far away from the piezoelectric layer, so as to obtain the ultrasonic biological identification module.
Example 3
20 ultrasound biometric modules were prepared as follows. Specifically, the preparation process of the ultrasonic biological identification module is as follows:
and providing a thin film transistor array substrate, wherein the thin film transistor array substrate is provided with a mounting surface, the mounting surface is provided with a mounting area and a binding area which are spaced, and the spacing between the mounting area and the binding area is 170 mu m.
And (3) screen-printing water-soluble ink on the mounting surface at the temperature of 25 ℃ and the relative humidity of 55%, and curing for 7min at the temperature of 110 ℃ to obtain an ink layer, wherein the ink layer completely shields the binding area and exposes the mounting area. The distance between the edge of the ink layer on the side close to the mounting area and the edge of the binding area on the side close to the mounting area is 200 μm. The thickness of the ink layer was 12 μm. And then coating a piezoelectric material on the mounting area of the mounting surface, and sequentially drying, crystallizing and polarizing to obtain the piezoelectric layer.
Wiping with water-soaked dust-free cloth at normal temperature to remove the ink layer, and wiping with dry clean dust-free cloth to obtain the piezoelectric layer.
A conductive layer is formed on a side of the piezoelectric layer remote from the mounting surface.
And forming an acoustic matching layer on one side of the conductive layer, which is far away from the piezoelectric layer, so as to obtain the ultrasonic biological identification module.
Example 4
20 ultrasound biometric modules were prepared as follows. Specifically, the preparation process of the ultrasonic biological identification module is as follows:
and providing a thin film transistor array substrate, wherein the thin film transistor array substrate is provided with a mounting surface, the mounting surface is provided with a mounting area and a binding area which are spaced, and the spacing between the mounting area and the binding area is 170 mu m.
At 25 ℃ and a relative humidity of 55%, a commercially available peelable glue is coated on the mounting surface to obtain a glue layer, and the glue layer completely shields the binding area and exposes the mounting area. The distance between the edge of the glue layer close to the mounting area and the edge of the binding area close to the mounting area is 200 μm. The thickness of the glue layer was 12 μm. And then coating a piezoelectric material on the mounting area of the mounting surface, and sequentially drying, crystallizing and polarizing to obtain the piezoelectric layer.
And stripping off the adhesive layer.
A conductive layer is formed on a side of the piezoelectric layer remote from the mounting surface.
And forming an acoustic matching layer on one side of the conductive layer, which is far away from the piezoelectric layer, so as to obtain the ultrasonic biological identification module.
Example 5
20 ultrasound biometric modules were prepared as follows. Specifically, the preparation process of the ultrasonic biological identification module is as follows:
and providing a thin film transistor array substrate, wherein the thin film transistor array substrate is provided with a mounting surface, the mounting surface is provided with a mounting area and a binding area which are spaced, and the spacing between the mounting area and the binding area is 170 mu m.
And coating a piezoelectric material on the mounting area of the mounting surface, and sequentially drying, crystallizing and polarizing to obtain the piezoelectric layer.
A conductive layer is formed on a side of the piezoelectric layer remote from the mounting surface.
And forming an acoustic matching layer on one side of the conductive layer, which is far away from the piezoelectric layer, so as to obtain the ultrasonic biological identification module.
And (3) testing:
the binding yield of the ultrasonic biometric identification modules of examples 1 to 5 in the binding region, and the adhesion of the ink layer and the adhesive layer of example 4 in the preparation process of examples 1 to 3 were measured. The results are shown in Table 1. Table 1 shows the binding yield of the ultrasonic biometric identification modules of examples 1 to 5 in the binding region, and the adhesion of the ink layer and the adhesive layer of example 4 in the preparation processes of examples 1 to 3. In Table 1, "- -" indicates that no detection was performed. The binding yield of the ultrasonic biological identification module in the binding area is measured by adopting the conventional method or device; adhesion was determined using the hundred grid test.
TABLE 1
Binding yield (%) Adhesion force
Example 1 99.5 4B
Example 2 99.6 4B
Example 3 99.9 5B
Example 4 97.3 4B
Example 5 95.1 --
As can be seen from table 1, the binding yield of the ultrasonic biometric modules of examples 1 to 3 in the binding region is more than 99.5%, which is better than that of examples 4 to 5, and it is shown that the preparation method of the above embodiment can improve the yield of the binding region, and obtain the ultrasonic biometric module with higher yield. In addition, the adhesion force of the ink layer in the preparation process of the ultrasonic biometric identification modules in examples 1 to 3 is 4B to 5B, which shows that the ink layer in the preparation method of the above embodiment has high adhesion force and is not easy to fall off in the process of preparing the piezoelectric layer.
In summary, in the above method for manufacturing the ultrasonic biological identification module, the binding yield of the binding region can be improved by setting the ink layer, and the ultrasonic biological identification module with a higher yield is obtained for manufacturing an electronic product with excellent performance.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (11)

1. A preparation method of an ultrasonic biological identification module is characterized by comprising the following steps:
providing a thin film transistor array substrate, wherein the thin film transistor array substrate is provided with a mounting surface, and the mounting surface is provided with a mounting area and a binding area which are spaced;
arranging an ink layer on the mounting surface, wherein the ink layer completely shields the binding region and exposes the mounting region, and a piezoelectric layer is formed in the mounting region of the mounting surface, wherein the ink layer is made of water-soluble ink;
removing the ink layer;
forming a conductive layer on one side of the piezoelectric layer far away from the mounting surface; and
and forming an acoustic matching layer on one side of the conductive layer, which is far away from the piezoelectric layer, so as to obtain the ultrasonic biological identification module.
2. The method for preparing an ultrasonic biological recognition module according to claim 1, wherein the thickness of the ink layer is 10 μm to 15 μm.
3. The method for manufacturing an ultrasonic biometric module according to claim 1, wherein a gap is formed between the mounting region and the binding region, and the ink layer at least partially covers the gap.
4. The method for preparing an ultrasonic biological recognition module set according to claim 1, wherein a distance between the mounting region and the binding region is defined as D1, a distance between an edge of the ink layer close to the mounting region and an edge of the binding region close to the mounting region is defined as D2, and a ratio of D2 to D1 is in a range of 0-1: 3.
5. The method for preparing the ultrasonic biological recognition module according to claim 1, wherein the step of providing the ink layer on the mounting surface comprises: and screen printing the water-soluble ink on the mounting surface, and curing at 90-130 ℃ to obtain the ink layer.
6. The method for preparing an ultrasonic biological recognition module according to claim 5, wherein the curing time is 5min to 10 min.
7. The method for preparing an ultrasonic biometric module according to claim 5, wherein the water-soluble ink is printed on the screen at a temperature of 5 ℃ to 50 ℃.
8. The method for preparing an ultrasonic biological recognition module according to claim 1, wherein the ink layer is removed by washing.
9. The method for manufacturing an ultrasonic biometric module according to claim 8, further comprising a step of drying the thin film transistor array substrate after the step of removing the ink layer.
10. An ultrasonic biometric module prepared by the method for preparing an ultrasonic biometric module according to any one of claims 1 to 9.
11. An electronic device comprising the ultrasound biometric module of claim 10.
CN201910783514.1A 2019-08-23 2019-08-23 Ultrasonic biological identification module, preparation method thereof and electronic equipment Pending CN112420616A (en)

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