CN112413447A - 一种在一条灯丝上做出两段亮灯效果的方法 - Google Patents

一种在一条灯丝上做出两段亮灯效果的方法 Download PDF

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CN112413447A
CN112413447A CN202011185709.5A CN202011185709A CN112413447A CN 112413447 A CN112413447 A CN 112413447A CN 202011185709 A CN202011185709 A CN 202011185709A CN 112413447 A CN112413447 A CN 112413447A
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filament
led chips
fluorescent glue
lighting effect
chip support
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曾学仁
许谦
曾学义
孔振中
李家伟
唐荣区
唐晓峰
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Zhejiang Twinsel Electronic Technology Co Ltd
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Zhejiang Twinsel Electronic Technology Co Ltd
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Priority to US17/147,276 priority patent/US20220154894A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F21Y2113/17—Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

一种在一条灯丝上做出两段亮灯效果的方法，包括对接安装的第一荧光胶和第二荧光胶以及设置在第一荧光胶和第二荧光胶之间的芯片撑底，芯片撑底上均匀设置有若干个的LED芯片，LED芯片之间通过导线丝正反并联，芯片撑底两端装设有金属线耳。与现有技术相比，该方法能够适用于一些特殊的应用场景，如不采用驱动亮灯等。在同一条发光灯丝上通过设置正负反向并联的LED芯片，实现一条灯丝上两段或两段以上发光或间隔发光，从而实现灯丝无极性发光。

Description

一种在一条灯丝上做出两段亮灯效果的方法
技术领域
本发明涉及LED灯丝技术领域，特别涉及一种在一条灯丝上做出两段亮灯效果的方法。
背景技术
LED光源是一种节能的绿色环保照明光源，此种光源具有环保、光效高、无辐射、低功耗等优点，可连续使用数万个小时，在照明领域中越来越受到消费者欢迎。近年出现的LED灯丝灯光源，即同时具有LED的光源高光效，也具有钨丝灯的形态，推出后深受市场欢迎。目前市面上的灯丝灯芯片采用的串并方式大多为全串或全并联接，用于适用不同的电压，但采用全串或者全并联联接的灯丝无法适用于一些特殊的应用场景，如不采用驱动亮灯，又或者灯串类中要求一条灯丝分段闪烁，实现间隔发光和无极性发光等。
发明内容
本发明所要解决的技术问题是针对现有技术存在的问题提供一种在一条灯丝上做出两段亮灯效果的方法。
本发明解决上述技术问题所采用的技术方案为：
一种在一条灯丝上做出两段亮灯效果的方法，所述方法包括以下步骤：
步骤1：将第一荧光胶和第二荧光胶对接安装，将芯片撑底设置在第一荧光胶和第二荧光胶之间；
步骤2：在芯片撑底上均匀设置有若干个的LED芯片，并且LED芯片沿芯片撑底水平均匀排布，且LED芯片之间通过导线丝正反并联；
步骤3：在芯片撑底两端装设有金属线耳。
优选为，所述步骤2中的LED芯片分段正反并联设置于芯片撑底。
优选为，所述步骤2中的LED芯片间隔正反并联设置于芯片撑底。
与现有技术相比，本发明在一条灯丝上做出两段亮灯效果的方法的有益效果：能够适用于一些特殊的应用场景，如不采用驱动亮灯等。在同一条发光灯丝上通过设置正负反向并联的LED芯片，实现一条灯丝上两段或两段以上发光或间隔发光，从而实现灯丝无极性发光。
附图说明
图1为本发明在一条灯丝上做出两段亮灯效果的方法的灯丝结构分解图。
图2为本发明在一条灯丝上做出两段亮灯效果的方法芯片撑底结构示意图(LED芯片分段正反并联状态)。
图3为本发明在一条灯丝上做出两段亮灯效果的方法中图2的A处局部放大图。
图4为本发明在一条灯丝上做出两段亮灯效果的方法的芯片撑底结构示意图(LED芯片间隔正反并联状态)。
图5为本发明在一条灯丝上做出两段亮灯效果的方法中图4的B处局部放大图。
附图标号：1、第一荧光胶；2、第二荧光胶；3、芯片撑底；31、金属线耳；4、LED芯片；5、导线丝。
具体实施方式
以下结合附图实施例对本发明作进一步详细描述。
如图1所示，一种在一条灯丝上做出两段亮灯效果的方法，包括以下步骤：
将第一荧光胶1和第二荧光胶2对接安装，将芯片撑底3设置在第一荧光胶1和第二荧光胶2之间；
在芯片撑底3上均匀设置有若干个的LED芯片4，并且LED芯片4沿芯片撑底3水平均匀排布，且LED芯片4之间通过导线丝5正反并联；
在芯片撑底3两端装设有金属线耳31。
实施例一
如图2至图3所示，本实施例中，LED芯片4分段正反并联设置于芯片撑底3，即芯片撑底3左侧排布的LED芯片4正极在上、负极在下，右侧排布的LED芯片4负极在上、正极在下，且左侧LED芯片4的正极与右侧LED芯片4的负极依次相连，左侧LED芯片4的负极与右侧LED芯片4的正极依次相连。
实施例二
如图4至图5所示，与实施例1的区别在于，本实施例中，LED芯片4间隔正反并联设置于芯片撑底3，即的LED芯片4极性呈一正一反间隔均匀排布，相邻设置的LED芯片4的正极与另一LED芯片4的负极相连，其他依次设置。
与其他需要直流电压并且有固定极性的普通LED芯片相比，通过LED芯片4正负反向并联可实现一条灯丝上两段或两段以上发光或间隔发光，从而实现无极性发光。
本发明提供一种在一条灯丝上做出两段亮灯效果的方法，与现有技术相比，该方法能够适用于一些特殊的应用场景，如不采用驱动亮灯等。同时在同一条发光灯丝上通过设置正负反向并联的LED芯片，实现一条灯丝上两段或两段以上发光或间隔发光，从而实现灯丝无极性发光。
最后应说明的是：以上实施例仅说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (3)

1.一种在一条灯丝上做出两段亮灯效果的方法，其特征在于，所述方法包括以下步骤：
步骤1：将第一荧光胶(1)和第二荧光胶(2)对接安装，将芯片撑底(3)设置在第一荧光胶(1)和第二荧光胶(2)之间；
步骤2：在芯片撑底(3)上均匀设置有若干个的LED芯片(4)，并且LED芯片(4)沿芯片撑底(3)水平均匀排布，且LED芯片(4)之间通过导线丝(5)正反并联；
步骤3：在芯片撑底(3)两端装设有金属线耳(31)。
2.根据权利要求1所述的在一条灯丝上做出两段亮灯效果的方法，其特征在于，所述步骤2中的LED芯片(4)分段正反并联设置于芯片撑底(3)。
3.根据权利要求1所述的在一条灯丝上做出两段亮灯效果的方法，其特征在于，所述步骤2中的LED芯片(4)间隔正反并联设置于芯片撑底(3)。
CN202011185709.5A 2020-10-30 2020-10-30 一种在一条灯丝上做出两段亮灯效果的方法 Pending CN112413447A (zh)

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US17/147,276 US20220154894A1 (en) 2020-10-30 2021-01-12 Method for creating lighting effect by two segments on one filament

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103956357A (zh) * 2014-05-06 2014-07-30 佛山市国星光电股份有限公司 一种led灯丝的制造方法
CN105491730A (zh) * 2016-01-25 2016-04-13 嘉善三英灯饰有限公司 一种usb接口led灯串控制系统
CN205754934U (zh) * 2016-01-25 2016-11-30 嘉善三英灯饰有限公司 一种usb接口led灯串控制系统
CN210014220U (zh) * 2019-07-31 2020-02-04 中山市聚明星电子有限公司 一种双色无极性led发光管

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103956357A (zh) * 2014-05-06 2014-07-30 佛山市国星光电股份有限公司 一种led灯丝的制造方法
CN105491730A (zh) * 2016-01-25 2016-04-13 嘉善三英灯饰有限公司 一种usb接口led灯串控制系统
CN205754934U (zh) * 2016-01-25 2016-11-30 嘉善三英灯饰有限公司 一种usb接口led灯串控制系统
CN210014220U (zh) * 2019-07-31 2020-02-04 中山市聚明星电子有限公司 一种双色无极性led发光管

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Application publication date: 20210226