CN112399773A

CN112399773A - Heat sink and method for manufacturing heat sink

Info

Publication number: CN112399773A
Application number: CN201910759177.2A
Authority: CN
Inventors: 赵勃
Original assignee: Nokia Shanghai Bell Co Ltd; Nokia Networks Oy
Current assignee: Nokia Shanghai Bell Co Ltd; Nokia Oyj; Nokia Solutions and Networks Oy
Priority date: 2019-08-16
Filing date: 2019-08-16
Publication date: 2021-02-23

Abstract

The present disclosure provides a heat dissipation device and a method of manufacturing the same. The heat dissipation device comprises a plurality of heat dissipation units and a fixing component, wherein each heat dissipation unit comprises a support piece, a support piece and an abutting piece, wherein the support piece and the abutting piece are connected with each other to form a preset angle; and a graphite film arranged to cover surfaces of both the support sheet and the abutment sheet; the fixing member is arranged to be coupled with the plurality of heat dissipating units to attach the plurality of heat dissipating units to the subject to be cooled such that a portion of the graphite film covering the abutting piece directly contacts the heat emitting surface of the subject to be cooled. Through making partly and the surperficial direct contact that generates heat of graphite membrane, the heat that generates heat the surface and distribute can be followed the surperficial extending direction of graphite membrane and transmit the part of the cover backing sheet of graphite membrane fast thereby reach the purpose for taking the object cooling of cooling.

Description

Heat sink and method for manufacturing heat sink

Technical Field

Embodiments of the present disclosure relate to a heat dissipation device and a method of manufacturing the heat dissipation device.

Background

In electrical equipment, a heat sink is a device that can help dissipate heat generated by an electronic component into cooler air or liquid. The process is the transfer of heat from the surface of the thermal component to the surface of the heat sink. The surface of the heat sink is immersed in cold air or liquid, and thus heat is dissipated into the air or liquid by radiation or convection. The heat sink is mainly composed of a plurality of radiating fins and a base bonded with the radiating fins. The susceptor typically contacts the heat generating surface of the thermal component and the fins provide a large contact area with air or liquid. The heat dissipated by the thermal element can thus be dissipated quickly into the air or into the liquid. Generally, the heat sink is made of a metal having high thermal conductivity, such as copper, aluminum, or the like. Better performance of the heat sink depends on higher thermal conductivity of the material and a larger area immersed in air or liquid.

With the continuous development of technology, for example, the continuous improvement of the computing capability of the processor, the performance of the heat dissipation device is required to be higher and higher by the electrical equipment. However, heat dissipation devices made of metal cannot meet the needs of the evolving technologies due to the characteristics of the metal heat conduction material itself. A graphite film has been developed that can be attached to a device such as a battery, screen, etc. to rapidly cool the battery or screen.

Disclosure of Invention

Conventional heat dissipation devices made of metal are gradually failing to meet the demand of the increasingly developed technology, which makes it necessary to limit the operating speed of, for example, a processor or the like to suppress an excessively rapid increase in the temperature of a thermal component, thereby suppressing the development of the technology. In addition, thermal components such as processors are prone to downtime or damage due to the inability to dissipate the generated heat in a timely manner. Although heat dissipation materials such as graphite films have been developed to have excellent heat dissipation properties, the heat dissipation properties of such materials are not sufficiently exhibited in current applications. This is because the heat dissipation property of the graphite film is that the thermal resistance in the surface extension direction is very small, and heat can be quickly conducted in this direction, so that the heat dissipation effect is very good. But the thermal resistance in the thickness direction (perpendicular to the surface extension direction) is relatively large, and heat is conducted slowly in this direction, resulting in relatively poor heat dissipation. At present, one surface of a graphite film is in contact with a heat source, and the other surface of the graphite film is used for heat dissipation, so that heat needs to be conducted along the thickness direction of the graphite film, and the heat dissipation efficiency cannot be effectively improved. Embodiments of the present disclosure provide a heat dissipation device that uses the same surface to directly contact a heat source and dissipate heat, such that the heat is conducted and dissipated in the direction of least thermal resistance, making full use of the heat dissipation characteristics of a graphite film, and solving or at least partially solving the above-mentioned problems and other potential problems of conventional heat dissipation devices.

In a first aspect of the present disclosure, a heat dissipation device is provided. The heat dissipation device comprises a plurality of heat dissipation units and a fixing component, wherein each heat dissipation unit comprises a support piece, a support piece and an abutting piece, wherein the support piece and the abutting piece are connected with each other to form a preset angle; and a graphite film arranged to cover surfaces of both the support sheet and the abutment sheet; the fixing member is arranged to be coupled with the plurality of heat dissipating units to attach the plurality of heat dissipating units to the subject to be cooled such that a portion of the graphite film covering the abutting piece directly contacts the heat emitting surface of the subject to be cooled.

In some embodiments, the support tab and the abutment tab are integrally formed.

In some embodiments, the graphite film is coated on the surfaces of the support sheet and the abutment sheet by means of adhesion, coating or spraying.

In some embodiments, the fixing member includes: a pressing plate arranged to at least partially cover the heat generating surface; and a plurality of slits formed on the pressing plate and each adapted to pass through the corresponding support sheet to which the graphite film is attached to position the pressing sheet between the pressing plate and the heat generating surface such that a portion of the graphite film covering the pressing sheet directly abuts on the heat generating surface.

In some embodiments, the surfaces of the support sheet and the abutment sheet facing away from the graphite film are at least partially bonded to the abutment plate.

In some embodiments, the plurality of slits are arranged such that the plurality of support tabs are parallel to each other or radial.

In some embodiments, the support sheet includes a plurality of through holes.

In some embodiments, the support member is L-shaped, U-shaped, or V-shaped.

In a second aspect of the present disclosure, a method of manufacturing a heat dissipating device is provided. The method includes providing a plurality of heat dissipating units, wherein each heat dissipating unit includes a support including a support piece and an abutment piece connected to each other at a predetermined angle; and a graphite film attached to surfaces of the support sheet and the abutment sheet; and arranging the fixing member to be coupled with the plurality of heat dissipating units to attach the plurality of heat dissipating units to the object to be cooled such that the portion of the graphite film covering the abutting piece directly contacts the heat generating surface of the object to be cooled

In some embodiments, the step of providing a plurality of heat dissipating units comprises: attaching a graphite film to a surface of a support by means of bonding, coating or spraying; and bending the support to form a support sheet and an abutment sheet to which the graphite film is attached.

In some embodiments, the step of arranging the fixing member comprises: inserting a support piece into a plurality of slits formed on a pressing plate of a fixing member; and bonding at least a portion of the bonding surfaces of the support sheet and the abutment sheet facing away from the graphite film to the abutment plate.

It should be understood that this summary is not intended to identify key or essential features of the embodiments of the disclosure, nor is it intended to be used to limit the scope of the disclosure. Other features of the present disclosure will become readily apparent from the following description.

Drawings

The above and other objects, features and advantages of the present disclosure will become more apparent by describing in more detail exemplary embodiments thereof with reference to the attached drawings, in which like reference numerals generally represent like parts throughout the exemplary embodiments of the present disclosure.

Fig. 1 illustrates a perspective view of a heat dissipation device according to an embodiment of the present disclosure;

fig. 2 illustrates a front sectional view of a heat dissipating device according to an embodiment of the present disclosure, in which a part of a heat dissipating unit and a fixing member is enlarged;

FIG. 3 illustrates a front cross-sectional view of a heat dissipation device showing how heat is dissipated, according to an embodiment of the present disclosure;

FIG. 4 illustrates a perspective view of a securing member of a heat dissipating device according to an embodiment of the present disclosure;

FIG. 5 shows a schematic view of an assembly process of a heat sink according to an embodiment of the present disclosure;

fig. 6 shows a flow chart of a method of manufacturing a heat dissipation device according to an embodiment of the present disclosure.

The same or similar reference numbers will be used throughout the drawings to refer to the same or like elements.

Detailed Description

The present disclosure will now be described with reference to several example embodiments. It should be understood that these examples are described only for the purpose of enabling those skilled in the art to better understand and thereby enable the present disclosure, and are not intended to set forth any limitations on the scope of the technical solutions of the present disclosure.

As used herein, the term "include" and its variants are to be read as open-ended terms meaning "including, but not limited to. The term "based on" will be read as "based at least in part on". The terms "one embodiment" and "an embodiment" should be understood as "at least one embodiment". The term "another embodiment" should be understood as "at least one other embodiment". The terms "first," "second," and the like may refer to different or the same object. Other explicit and implicit definitions may be included below. The definitions of the terms are consistent throughout the specification unless the context clearly dictates otherwise.

Heat sinks are essential for electrical components such as processors. The heat dissipation device can transfer heat dissipated by a hot component of the electrical component to cold air or liquid in a radiation or convection mode, so that the purpose of dissipating heat of the hot component is achieved. In this way, the temperature of the electrical components can be kept within a reasonable range, so that normal operation can be maintained without damage due to too high a temperature.

The heat sink is mainly composed of a plurality of radiating fins and a base bonded with the radiating fins. The susceptor typically contacts the heat generating surface of the thermal component and the fins provide a large contact area with air or liquid. The heat dissipated by the thermal element can thus be dissipated quickly into the air or into the liquid. Generally, the heat sink is made of a metal having high thermal conductivity, such as copper, aluminum, or the like. Better performance of the heat sink depends on higher thermal conductivity of the material and a larger area immersed in air or liquid.

With the development of technology, for example, the operation speed of the processor is higher and higher, so that the heat generated by the processor during operation is higher and higher. Heat sinks made solely of metal are increasingly unable to meet the demands of the evolving technology. In this case, the processor has to be rate limited to prevent the processor from being damaged by excessive temperatures, which limits the development of the technology to some extent.

A graphite film with excellent heat dissipation performance has been developed, and people usually arrange the graphite film on a battery or a screen to rapidly cool the battery or the screen. The existing heat dissipation device uses a graphite film, the graphite film is generally in direct contact with a base of the heat dissipation device at most, and the base is in contact with a heat dissipation surface. However, the heat dissipation performance of such materials is not fully realized in current applications. This is because the graphite film has a heat dissipation characteristic that the thermal resistance in the surface extension direction is very small, and the heat can be quickly conducted in this direction, and the heat dissipation effect is very good. But the thermal resistance in the thickness direction (perpendicular to the surface extension direction) is relatively large, and heat is conducted slowly in this direction, resulting in relatively poor heat dissipation. That is, the heat dissipated by the graphite film can be dissipated quickly along the surface extension direction of the graphite film. However, in the current application, one surface of the graphite film contacts a heat source, and the other surface is used for heat dissipation, so that heat needs to be conducted along the thickness direction of the graphite film, and therefore, compared with a heat dissipation device made of a metal material, the arrangement mode improves the heat dissipation performance, but the improvement degree is limited, and the requirement of technical development cannot be completely met.

Embodiments of the present disclosure provide a heat sink 100 that uses the same surface of a graphite film to directly contact a heat source and dissipate heat such that the heat is conducted and dissipated in a direction that minimizes thermal resistance, takes full advantage of the heat dissipation characteristics of the graphite film, and thereby solves, or at least partially solves, the above-mentioned problems and/or other potential problems of conventional heat sinks. Some example embodiments will now be described with reference to fig. 1 to 5.

Fig. 1 shows a perspective view of the heat sink 100 and fig. 2 shows a front sectional view of the heat sink 100. As shown, the heat dissipating device 100 includes a plurality of heat dissipating units 101 and a fixing member 102. To facilitate heat dissipation, the plurality of heat dissipation units 101 may be assembled in the form of fins as shown in fig. 1 and 2.

Unlike the conventional heat dissipation device made of metal, each of the plurality of heat dissipation units 101 includes a support 1011 and a graphite film 1012. The support 1011 includes a support tab 1013 and an abutment tab 1014 connected to each other at a predetermined angle. Support sheet 1013 and abutment sheet 1014 are each used to carry graphite film 1012. A single graphite film 1012 is disposed to cover the surfaces of both the support sheet 1013 and the abutment sheet 1013.

The fixing member 102 can be coupled with the plurality of heat dissipating units 101 to attach the plurality of heat dissipating units 101 to the subject 200 to be cooled such that the portion of the graphite film 1012 covering the abutting sheet 1014 can directly contact the heat generating surface of the subject 200 to be cooled. The present disclosure takes full advantage of the excellent heat transfer properties of the graphite film 1012 in the direction of its surface extension. By directly contacting a portion of the graphite film 1012 with the heat generating surface, the heat emitted from the heat generating surface can be quickly transferred to the portion of the graphite film 1012 covering the support sheet 1013 along the surface extending direction H of the graphite film 1012, thereby achieving the purpose of efficiently cooling, as shown in fig. 3.

Furthermore, since the support sheet 1013 and the abutment sheet 1014 are arranged at an angle, the portion of the graphite film 1012 covering the support sheet 1013, that is, the portion far from the heat generating surface, can quickly radiate heat into the surrounding cold air or liquid to thereby play a role of further quickly cooling the subject 200 to be cooled.

For ease of manufacturing, in some embodiments, support sheet 1013 and abutment sheet 1014 may be integrally formed as shown in figure 3. For example, in some embodiments, support 1011 may be a sheet metal material, and support sheet 1013 and abutment sheet 1014 may be formed by bending support 1011. This way the manufacturing and assembly costs of the support 1011 can be reduced.

Of course, it should be understood that the above-described embodiments in which the support sheet 1013 and the abutment sheet 1014 are integrally formed by bending are merely exemplary and are not intended to limit the scope of the present disclosure. Any other suitable manner of manufacture and assembly is also possible. For example, in some embodiments, support sheet 1013 and abutment sheet 1014 may also be separately manufactured and assembled by welding or the like into support 1011. In some alternative embodiments, the support 1011 may also be formed from a plastic material by a molding process.

In some embodiments, the supporting sheet 1013 and the abutting sheet 1014 can also be made of a material with a good thermal conductivity, such as copper or aluminum, so as to further improve the heat dissipation performance of the heat dissipation device 100.

In some embodiments, support sheet 1013 may include a plurality of through-holes 1015, as shown in fig. 5. The through holes 1015 can reduce the weight of the support plate 1013, so that the heat dissipation device 100 is light-weighted, thereby satisfying the requirement of light-weighting the heat dissipation device 100 and the component to which the heat dissipation device 100 is attached. On the other hand, the through hole 1015 can reduce the use of materials, thereby reducing the material cost.

The vias 1015 may take a variety of forms. For example, in some embodiments, as shown in fig. 5, the through-holes 1015 may be square holes that are evenly arranged on the support sheet 1013. Of course, it should be understood that the form of the through-hole 1015 shown in the figures is exemplary only and is not intended to limit the scope of the present disclosure. Any other suitable shape or configuration is possible. For example, in some embodiments, the through hole 1015 may also be in the form of a circular hole, an elliptical hole, a polygonal hole, an irregular hole, and the like.

Further, as for the size of the through-hole 1015, in addition to the through-hole 1015 having a larger size shown in fig. 5, the size of the through-hole 1015 may also be smaller than that in fig. 5, thereby enabling more through-holes 1015 to be arranged on the support sheet 1013. Such smaller through-holes 1015 can facilitate more attachment of the graphite film 1012 to the support sheet 1013. Through-hole 1015 may be formed in support sheet 1013 by stamping or the like in some embodiments. Of course, in some alternative embodiments, the through hole 1015 may be integrally formed with the support 100 by molding or the like.

The graphite film 1012 may be coated on the surfaces of the support sheet 1013 and the abutment sheet 1014 in any suitable manner. For example, in some embodiments, graphite film 1012 may be disposed on support sheet 1013 and abutment sheet 1014 by bonding. The bonding may be performed using an adhesive having good thermal conductivity so that heat can be easily transferred to the support sheet 1013 and the support sheet 1013 can also assist in heat dissipation. The arrangement of the graphite film 1012 on the support sheet 1013 and the abutment sheet 1014 by bonding enables the heat sink 100 to be manufactured in a cost-effective manner.

Of course, the above-described arrangement of the graphite film 1012 on the support sheet 1013 or the abutment sheet 1014 by bonding is merely exemplary and is not intended to limit the scope of the present disclosure. Any other suitable manner is also possible. For example, in some alternative embodiments, the graphite film 1012 may also be attached to the support sheet 1013 and the abutment sheet 1014 by coating or spraying, etc. This allows for better adhesion of graphite film 1012 to support sheet 1013 and abutment sheet 1014.

For ease of manufacturing, in some embodiments, graphite film 1012 may be attached to support 1011 before support 1011 is bent to form support sheet 1013 and abutment sheet 1014. The support 1011 may in turn be bent to form a support sheet 1013 with a graphite film 1012 attached and an abutment sheet 1014. Of course, in some alternative embodiments, the graphite film 1012 may also be attached to the support sheet 1013 and the abutment sheet 1014 after the support 1011 is bent. This makes the graphite film 1012 less prone to cracking and the thickness can be kept uniform, thereby improving the heat dissipation performance of the graphite film 1012.

In some embodiments, in order to facilitate the support 1011 to be attached to the object 200 to be cooled such that the portion of the graphite film 1012 covering the abutting sheet 1014 directly contacts the heat generating surface, the fixing part 102 may include a pressing plate 1021 and a plurality of slits 1022 arranged on the pressing plate 1021 corresponding to the number of heat dissipating units 101, as shown in fig. 4. The pressing plate 1021 is arranged on the object 200 to be cooled or in the vicinity of the object 200 to be cooled by suitable means, such that the pressing plate 1021 is able to at least partially cover the heat generating surface.

Each slit 1022 is formed to be able to pass through the support sheet 1013 to which the graphite film 1012 is attached, as shown in fig. 5. After the support sheet 1013 to which the graphite film 1012 is attached passes through the slit 1022 in the illustrated direction, the pressing plate 1021 is arranged on the subject to be cooled 200 or in the vicinity of the subject to be cooled 200 so that the pressing plate 1014 can be positioned between the pressing plate 1021 and the heat generating surface. In this way, the portion of the graphite film 1012 covering the abutment tab 1014 can directly contact or abut the heat generating surface. By using the fixing member 102 shown in fig. 4, a plurality of heat radiating units 101 can be arranged on a heat generating surface in a simple manner, thereby reducing assembly costs.

This arrangement also enables each of the plurality of heat dissipating units 101 to be independently replaced or serviced. For example, after the graphite film 1012 on the individual heat dissipation unit 101 is damaged, only the corresponding support 1011 needs to be replaced, and the entire heat dissipation device 100 does not need to be replaced, which further reduces the maintenance cost.

In some embodiments, in order to ensure the stability of the support 1011 on the pressure plate 1021 before being inserted into the slot 1022, an adhesive is applied on the support sheet 1013 and the abutment sheet 1014 at the position of the surface facing away from the graphite film 1012 to be in contact with the pressure plate 1021, so that the support 1011 can be adhered to the pressure plate 1021 with the adhesive after the support 1011 is inserted into the slot 1022 in place.

Of course, it should be understood that the above-described embodiments are exemplary and are not intended to limit the scope of the present disclosure. Any other suitable combination is possible. For example, in some alternative embodiments, the support sheet 1013 and the abutment sheet 1014 may also be arranged on the pressing plate 1021 by welding or riveting, etc.

The pressing plate 1021 may also be arranged in any suitable way at the object 200 to be cooled or in the vicinity of the object 200 to be cooled. For example, in some embodiments, as shown in fig. 4, the pressing plate 1021 may include a through hole 1023 for passing a screw therethrough. The pressing plate 1021 is arranged on the subject 200 to be cooled by means of screws. Of course, in some alternative embodiments, the pressing plate 1021 may also be arranged on the object 200 to be cooled or near the object 200 to be cooled by means of bonding or snap connection. This can further facilitate maintenance of the heat-radiating member 100.

The position of the abutment sheet 1014 of the support 1011 inserted into position in the slit 1022 can be appropriately adjusted according to the shape of the heat generating surface of the subject 200 to be cooled. For example, in some embodiments, where the heat generating surface is planar, the plurality of abutment tabs 1014 may be coplanar, as shown in fig. 3. In some alternative embodiments, where the heat generating surface has a smaller step surface or undulated surface, the position of the abutment tab 1014 may also follow the shape of the heat generating surface to ensure that the graphite film 1012 is able to directly contact the heat generating surface.

In some embodiments, the slots 1022 may be arranged such that a plurality of support tabs 1013 can be parallel or radial to one another therein to further facilitate heat dissipation. The embodiment shown in fig. 3 and 5 is an example in which a plurality of support pieces 1013 are kept parallel after being inserted into the slit 1022. Such an embodiment is similar to the fins of a conventional heat sink. The spacing between the support pieces 1013 may be appropriately adjusted to further facilitate heat dissipation.

Of course, it should be understood that this is exemplary only, and is not intended to limit the scope of the present disclosure, as any other suitable manner or structure that can improve heat dissipation area and heat dissipation efficiency is possible. For example, in some embodiments, support sheet 1013 may also be in a radial pattern when viewed in the view shown in figure 3. That is, each two adjacent support pieces 1013 form a predetermined angle therebetween so that the plurality of support pieces 1013 are in a divergent state and thus heat dissipation can be more facilitated.

In fig. 3 and 5, an embodiment is shown in which the support 101 is L-shaped, i.e. the support piece 1013 is a vertical branch of the L-shaped support 101 and the abutment piece 1014 is a horizontal branch. Such a shape of the support 101 can be easier to assemble. Of course, it should be understood that this is exemplary only, and is not intended to limit the scope of the present disclosure. Any other suitable shape or configuration is possible. For example, in some embodiments, the supporting member 101 may also be U-shaped or V-shaped. For example, in the embodiment of U-shaped support 101, support tab 1013 may serve as a vertical leg of U-shaped support 101 while abutment tab 1014 serves as a horizontal leg. Such an arrangement can be more advantageous for heat dissipation.

Another aspect of the present disclosure also provides a method of manufacturing the heat dissipating device 100. Fig. 6 shows a flow chart of a method of manufacturing the heat sink 100 according to an embodiment of the present disclosure. As shown in fig. 6, at 610, a plurality of heat dissipating units are provided, wherein each heat dissipating unit 101 comprises a support 1011 and a graphite film 1012. At 620, the fixing member 102 is arranged to be coupled with the plurality of heat dissipation units 101 to attach the plurality of heat dissipation units 101 to the subject 200 to be cooled such that the portion of the graphite film 1012 covering the abutment sheet 1014 directly contacts the heat emitting surface of the subject 200 to be cooled.

In some embodiments, the step of providing a plurality of heat dissipation units 101 may include covering the surface of the support 1011 with a graphite film 1012 by means of adhesion, coating, or spraying; and bending the support 1011 to form the support sheet 1013 and the abutment sheet 1014 to which the graphite film 1012 is attached.

In some embodiments, the step of arranging the fixing member 102 may include inserting the support piece 1013 into a plurality of slits 1022 formed on the pressing plate 1021 of the fixing member 102; and bonding at least a portion of the surfaces of the support sheet 1013 and the abutment sheet 1014 facing away from the graphite film 1012 to the abutment plate 1021.

In the heat-dissipating component 100 manufactured by the manufacturing method, a part of the graphite film 1012 is in direct contact with the heat-generating surface, so that heat generated by the heat-generating surface can be quickly transferred to the part of the graphite film 1012 covering the support sheet 1013 along the surface extending direction H of the graphite film 1012, thereby achieving the purpose of cooling the object 200 with the cooled temperature.

It is to be understood that the above detailed embodiments of the disclosure are merely illustrative of or explaining the principles of the disclosure and are not limiting of the disclosure. Therefore, any modification, equivalent replacement, and improvement made within the spirit and principle of the present disclosure should be included in the protection scope of the present disclosure. Also, it is intended that the appended claims cover all such changes and modifications that fall within the true scope and range of equivalents of the claims.

Claims

1. A heat dissipation device (100), comprising:

a plurality of heat dissipating units (101), each heat dissipating unit (101) comprising:

a support (1011) comprising a support sheet (1013) and an abutment sheet (1014) connected to each other at a predetermined angle; and

a graphite film (1012) arranged to cover surfaces of both the support sheet (1013) and the abutment sheet (1014); and

a fixation component (102) arranged to couple with the plurality of heat dissipation units to attach the plurality of heat dissipation units (101) to an object (200) to be cooled such that a portion of the graphite film (1012) covering the abutment tab (1014) directly contacts a heat emitting surface of the object (200) to be cooled.

2. The heat dissipation device (100) of claim 1, wherein the support sheet (1013) and the abutment sheet (1014) are integrally formed.

3. The heat sink (100) according to claim 1, wherein the graphite film (1012) is coated on the surfaces of the support sheet (1013) and the abutment sheet (1014) by means of bonding, coating or spraying.

4. The heat dissipating device (100) of claim 1, wherein the securing member (102) comprises:

a pressing plate (1021) arranged to at least partially cover the heat generating surface; and

a plurality of slits (1022) formed on the pressing plate (1021), and each of the slits (1022) is adapted to pass through a corresponding support piece (1013) to which the graphite film (1012) is attached to position the abutting piece (1014) between the pressing plate (1021) and the heat generating surface so that a portion of the graphite film (1012) covering the abutting piece (1014) abuts directly on the heat generating surface.

5. The heat dissipation device (100) of claim 4, a surface of the support sheet (1013) and the abutment sheet (1014) facing away from the graphite film (1012) being at least partially bonded to the abutment plate (1021).

6. The heat dissipating device (100) of claim 4, the plurality of slots (1022) being arranged such that the plurality of support tabs (1013) are parallel to each other or radial.

7. The heat dissipation device (100) of claim 1, wherein the support sheet (1013) comprises a plurality of through-holes (1015).

8. The heat sink (100) according to claim 1, wherein the support (101) is L-shaped, U-shaped or V-shaped.

9. A method of manufacturing a heat dissipation device (100), comprising:

providing a plurality of heat dissipating units (101), wherein each heat dissipating unit (101) comprises:

arranging a fixing member (102) to be coupled with the plurality of heat dissipating units (101) to attach the plurality of heat dissipating units (101) to the object (200) to be cooled such that a portion of the graphite film (1012) covering the abutting piece (1014) directly contacts a heat generating surface of the object (200) to be cooled.

10. The method of claim 9, wherein the step of providing a plurality of heat dissipating units (101) comprises:

covering the graphite film (1012) on the surface of the support (1011) by means of bonding, coating or spraying; and

bending the support (1011) to form the support sheet (1013) and the abutment sheet (1014) with the graphite film (1012) attached.

11. The method of claim 9, wherein the step of arranging the fixation component (102) comprises:

inserting the support piece (1013) into a plurality of slits (1022) formed on a pressing plate (1021) of the fixing member (102); and

bonding at least a portion of surfaces of the support sheet (1013) and the abutment sheet (1014) facing away from the graphite film (1012) to the abutment plate (1021).